JP3751414B2 - Carrier tape, manufacturing method thereof, manufacturing apparatus thereof and carrier tape body - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a carrier tape for storing and transporting electronic components, a manufacturing method thereof, a manufacturing apparatus thereof, and a carrier tape body including an electronic component and a carrier.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a carrier tape for storing and transporting electronic components is known in which a recess is formed in a plastic substrate and the electronic component is stored in the recess.
[0003]
Another carrier tape is known in which a through hole is formed in a base made of cardboard, and lids are attached to both sides of the base in a state where an electronic component is accommodated in the through hole.
[0004]
[Problems to be solved by the invention]
As described above, a carrier tape made from a cardboard substrate is known. In this case, the lid material is attached to both surfaces of the base material, but it is complicated to attach the lid material to both surfaces of the base material.
[0005]
The present invention has been made in consideration of such points, and an object of the present invention is to provide a carrier tape, a manufacturing method thereof, a manufacturing apparatus thereof, and a carrier tape having a simple structure for attaching a cover material to only one side of a base material. To do.
[0006]
[Means for Solving the Problems]
The present invention comprises one mold and the other mold for compressing and holding the cardboard base material between the one mold, and the cardboard base is formed by reducing the thickness of the cardboard base material in one mold. A state in which a punch for forming a recess in the material is provided so as to be able to advance and retreat with respect to the mold, and one surface of the cardboard substrate is maintained flat by the other mold, and one surface of the cardboard substrate is maintained flat by the other mold In the carrier tape manufacturing apparatus, the punch is advanced to form a recess in the cardboard substrate by the other die and the punch.
The present invention includes a step of holding a cardboard substrate between one mold and the other mold, and a punch is advanced from one mold to reduce the thickness of the cardboard substrate so that a recess is formed in the cardboard substrate. And a step of maintaining one surface of the cardboard substrate flat with the other mold, and the punch is advanced while maintaining the one surface of the cardboard substrate flat with the other mold. A carrier tape manufacturing method is characterized in that a concave portion is formed in a cardboard substrate by a mold and a punch.
[0007]
According to the present invention, a base material in which a concave portion is formed on the other surface whose one surface is kept flat is produced, and the contents are stored in the concave portion of the base material. Next, a lid member that covers the recess opening is provided on the other surface of the substrate. In this way, a carrier tape body is obtained.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 are views showing an embodiment of the present invention.
[0009]
First, the entire carrier tape body will be described with reference to FIGS. As shown in FIG. 2 and FIG. 3, the carrier tape body 20 includes a carrier tape 10 made of a cardboard base material 10 a and formed with a recess 14, an electronic component 15 accommodated in the recess 14, and an opening of the recess 14. And a cover 21 for covering.
[0010]
Of these, the carrier tape 10 is made of a cardboard substrate 10a having a thickness of 0.43 mm, for example. Further, the carrier tape 10 has one surface 16 of the base material 10a kept flat, and the recess 14 is formed on the other surface 17 of the base material 10a so as to reach from the other surface 17 to the inside of the base material 10a.
[0011]
Further, in the recess 14 of the carrier tape 10, a fine electronic component 15, for example, a surface mount component is accommodated.
[0012]
Further, the lid member 21 is attached to the other surface 17 side of the base material 10a, and covers the opening of the recess 14 in which the electronic component 15 is accommodated. The lid member 21 is made of, for example, plastic or paper, and is attached to the other surface 17 of the base material 10a by a method such as thermocompression bonding.
[0013]
In FIG. 2, an opening 22 for conveyance is provided in a portion other than the recess 14 in the base material 10 a of the carrier tape 10.
[0014]
Next, a carrier tape manufacturing apparatus will be described with reference to FIG.
[0015]
As shown in FIG. 1, the carrier tape manufacturing apparatus includes an upper mold 11 and a lower mold 12 that holds the cardboard substrate 10 a between the upper mold 11. Among these, the upper die 11 is provided with a punch 13 that compresses the base material 10a and forms a recess 14 in the base material 10a so as to be movable forward and backward.
[0016]
In FIG. 1, the base material 10a is first placed on the lower mold 12, and the upper mold 11 is pressed against the base material 10a. In this way, the base material 10 a is held between the upper mold 11 and the lower mold 12. Thereafter, the punch 13 provided on the upper die 11 is lowered, and the punch 10 compresses the base material 10a to about 0.06 mm, thereby forming the concave portion 14 having the bottom portion 14a. In this way, the carrier tape 10 having the recesses 14 is produced.
[0017]
Next, the electronic component 15 is accommodated in the recess 14 of the carrier tape 10, and the lid member 21 is attached to the other surface 17 of the base material 10 a of the carrier tape 10. In this way, as shown in FIG. 3, the carrier tape body 20 is obtained from the carrier tape 10 containing the electronic component 15 and the lid member 21.
[0018]
As described above, according to the embodiment of the present invention, since the concave portion 14 has the bottom portion 14a, the lid member 21 may be attached only to the other surface 17 of the base material 10a. For this reason, it is not necessary to stick the cover material 21 on both surfaces 16 and 17 of the base material 10a, and the carrier tape body 20 can be manufactured easily and easily.
[0019]
Next, another embodiment will be described with reference to FIGS.
[0020]
As shown in FIGS. 4 and 5, the recess 14 of the base material 10a may have an inverted trapezoidal shape whose cross section expands toward the opening side (FIG. 4).
[0021]
Moreover, as for the recessed part 14 of the base material 10a, the opening periphery may be chamfered (FIG. 5).
[0022]
【The invention's effect】
As described above, according to the present invention, the carrier tape body can be easily obtained by providing the lid material that houses the contents in the recess and covers the opening of the recess on the other surface of the substrate. In this case, since the concave portion has a bottom portion, it is not necessary to provide a lid on the other surface of the base material. For this reason, a carrier tape body can be manufactured easily.
[Brief description of the drawings]
FIG. 1 shows a carrier tape manufacturing apparatus according to the present invention.
FIG. 2 is a plan view showing a carrier tape body according to the present invention.
FIG. 3 is a side sectional view showing a carrier tape body according to the present invention.
FIG. 4 is a view showing another embodiment of a carrier tape body according to the present invention.
FIG. 5 is a view showing another embodiment of a carrier tape body according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Carrier tape 10a Base material 11 Upper mold | type 12 Lower mold | type 13 Punch 14 Recessed part 15 Electronic component 16 One side 17 Other side 20 Carrier tape body

Claims (2)

One mold and
The other mold for compressing and holding the cardboard substrate with one mold,
One die is provided with a punch for reducing the thickness of the cardboard base material and forming a recess in the cardboard base material so that the punch can be moved forward and backward with respect to the die. A carrier tape manufacturing apparatus characterized in that a punch is advanced in a state where one surface of the cardboard substrate is maintained flat with the other mold and a recess is formed in the cardboard substrate with the other mold and the punch. . Holding the cardboard substrate between one mold and the other;
A step of proceeding with punching from one mold to reduce the thickness of the cardboard substrate to form a recess in the cardboard substrate, and maintaining one surface of the cardboard substrate flat with the other mold;
A method for producing a carrier tape comprising: forming a recess in a cardboard substrate by using the other mold and the punch while the punch is advanced in a state where one surface of the cardboard substrate is maintained flat with the other mold .

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