JP3716541B2 - Wafer adhesive remover - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wafer adhesive removing device, and more particularly to a wafer adhesive removing device that removes an adhesive remaining on a wafer from which a slice base has been peeled off.
[0002]
[Prior art]
When the ingot is cut, the slice base is bonded to the ingot and cut in order to prevent the end portion from being lost. The slice base is peeled off from the wafer after cutting, and there are various stripping methods such as a hot water method, a heating method, and a dry method.
[0003]
However, in any case, there is a problem that the adhesive used when the slice base is bonded remains on the wafer after peeling.
For this reason, conventionally, after the slice base is peeled from the wafer, the operator removes the adhesive by rubbing the portion of the wafer where the slice base is bonded with a brush.
[0004]
[Problems to be solved by the invention]
However, as described above, the method in which the operator manually removes the adhesive one by one has a problem that the processing takes time and the production efficiency is extremely poor.
The present invention has been made in view of such circumstances, and an object of the present invention is to provide a wafer adhesive removing device capable of automatically removing the adhesive remaining on the wafer after detaching the slice base.
[0005]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a wafer adhesive removing apparatus for removing an adhesive remaining in a slice base peeling portion of a wafer from which a slice base has been peeled. The cassette is stored in a fixed direction, the brush is disposed at a position facing the slice base peeling portion of the wafer stored in the cassette, the rotation driving means for rotating the brush, and the brush in the cassette. An advancing / retreating means for moving the brush forward and backward with respect to the slice base peeling portion of the stored wafer; and a moving means for moving the brush along the slice base peeling portion of the wafer stored in the cassette. Contact the slice base peeling portion of the wafer and rotate the brush while rotating the wafer. By sliding along the Isubesu stripping section, and removing the adhesive agent remaining in the slice base peeling portion of the wafer.
[0006]
According to the present invention, the adhesive remaining on the slice base peeling portion of the wafer is removed from the wafer by being scraped by the brush sliding along the slice base peeling portion while rotating.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of a wafer adhesive removing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a front view showing a configuration of an embodiment of a wafer adhesive removing apparatus according to the present invention, and FIG. 2 is a side view thereof.
[0008]
As shown in FIG.1 and FIG.2, the cassette installation stand 12 is provided in the hot water tank 10 in which the hot water was stored. A cassette 14 for storing the wafer W is detachably installed on the cassette installation table 12. The rectangular wafer W is stored in the cassette 14 with the slice base peeling portion (the portion to which the slice base is bonded) facing upward (see FIG. 3).
[0009]
In the vicinity of the hot water tank 10, a support column 16 is erected vertically. A pair of guide rails 18, 18 are disposed on the support column 16, and a lifting table 22 is supported on the guide rails 18, 18 via sliders 20, 20 so as to be lifted and lowered.
An elevating hydraulic cylinder 24 is installed in the vicinity of the upper end of the column 16 along the direction in which the guide rails 18 and 18 are arranged. The rod of the lifting hydraulic cylinder 24 is connected to the lifting table 22. The elevating table 22 moves up and down along the guide rails 18 and 18 by driving the elevating hydraulic cylinder 24.
[0010]
A pair of guide rails 26 are provided on the lower surface of the lifting table 22 along the Y direction in the figure. A slide frame 30 is slidably supported on the guide rails 26 and 26 via sliders 28 and 28.
On the other hand, a slide hydraulic cylinder 32 is arranged on the upper surface of the elevating table 22 along the guide rails 26, 26. The rod of the slide hydraulic cylinder 32 is connected to the slide frame 30 via a connecting member 34. The slide frame 30 slides in the Y direction in the figure along the guide rails 26 and 26 by driving the slide hydraulic cylinder 32.
[0011]
The slide frame 30 is formed in a gate shape, and a brush 36 is rotatably supported at a lower portion thereof. An output shaft of a gear box 38 provided on the slide frame 30 is connected to the shaft center 36 a of the brush 36, and a motor 40 is connected to the input shaft of the gear box 38. The brush 36 rotates by driving the motor 40.
[0012]
In addition, the brush 36 used here uses the nonwoven fabric surface treatment material conventionally used as a raw material of a brush. This non-woven fabric surface treatment material is formed by intertwining a large number of nylon fibers, each of which has an abrasive grain attached to each of the fibers with an adhesive, and the brush 36 is made of this non-woven fabric surface treatment material. Is formed in a roller shape. This nonwoven fabric surface treatment material has the property that it has elasticity and is well adapted to the shape of the non-polished material.
[0013]
The operation of the embodiment of the wafer adhesive removing apparatus according to the present invention configured as described above is as follows.
First, a predetermined number of wafers W are stored in the cassette 14 with the slice base peeling portion facing upward. Then, the cassette 14 in which the wafer W is stored is installed on the cassette installation table 12 in the hot water tank 10.
[0014]
At this time, the lifting table 22 is kept waiting at a standby position set above the hot water tank 10 so as not to interfere with the installation work of the cassette 14.
As described above, when the cassette 14 is installed in the hot water tank 10, the wafer W stored in the cassette 14 is immersed in the hot water, and the slice base peeling portion is in the Y direction in the figure. Arranged along. Thereafter, the wafer adhesive removing device is operated.
[0015]
First, the lifting hydraulic cylinder 24 is driven, and the lifting table 22 is lowered toward the hot water tank 10.
The driving of the lifting hydraulic cylinder 24 is stopped when the rod is extended by a predetermined amount. As a result, the brush 36 supported on the lower part of the lifting table 22 is placed on the upper part of the wafer W installed in the hot water tank 10, That is, it contacts the slice base peeling portion.
[0016]
Since the brush 36 that contacts the wafer W has an elastic force as described above, the brush 36 contacts the wafer W with an appropriate pressing force.
When the drive of the lifting hydraulic cylinder 24 is stopped, the motor 40 connected to the brush 36 is then driven, and as a result, the brush 36 starts rotating.
As the motor 40 starts to be driven, the slide hydraulic cylinder 32 connected to the slide frame 30 is driven. As a result, the brush 36 starts to slide along the Y direction in the figure.
[0017]
As a result, the brush 36 slides along the slice base peeling portion of the wafer W while rotating as shown in FIG. The adhesive B remaining on the slice base peeling portion of the wafer W is scraped off by the brush 36 that slides while rotating, and is removed from the wafer W.
The adhesive B adhering to the wafer W is thermally softened by immersing the wafer W in hot water. Peel off. Therefore, most of the adhesive B can be removed by passing the brush 36 once, but the brush 36 is reciprocated about 2 to 4 times for the sake of completeness.
[0018]
The reciprocating operation of the brush 36 can be performed by expanding and contracting the rod of the sliding hydraulic cylinder 32, and after the brush 36 reciprocates a predetermined number of times, the removing operation is completed. That is, after the drive of the motor 40 and the slide hydraulic cylinder 32 is stopped, the lift hydraulic cylinder 24 is driven to raise the lift table 22 to the standby position. Then, the cassette 14 is taken out from the hot water tank 10.
[0019]
As described above, according to the wafer adhesive removing apparatus of the present embodiment, the adhesive can be automatically removed and a large number of wafers W can be processed at a time. Therefore, a series of processing operations after being cut from the ingot can be performed very efficiently. As a result, wafer production efficiency is improved.
Note that the adhesive removal apparatus of the present embodiment enables more efficient wafer processing when performed in combination with a slice-based peeling operation. That is, the slice base is peeled off and the adhesive is removed using the above-described adhesive removing apparatus according to the following procedure.
[0020]
As shown in FIGS. 4 and 5, first, the cassette 14 for storing the wafer W is set in advance on the cassette mounting table 12 in the hot water tank 10.
Next, the wafer W cut into a comb blade shape by a wire saw or the like is supported by an arm 42 located above the hot water tank 10 (the arm 42 will be described later) and immersed in the hot water tank 10. At this time, the wafer W is immersed in the hot water so as to be accommodated in the cassette 14 set in the hot water tank 10.
[0021]
By immersing the wafer W bonded to the slice base in hot water, the adhesive softens and peels from the wafer W naturally. The peeled wafer W falls in hot water and is accommodated in the cassette 14.
Since all of the wafers W accommodated in the cassette 14 have their slice base peeling portions facing upward, after all the wafers W have been naturally peeled off, the adhesive removal operation may be performed according to the procedure described above. .
[0022]
As a result, the adhesive removing operation can be performed simultaneously with the detachment of the slice base S, which is extremely efficient.
The arm 42 for supporting the wafer W is provided so as to be movable up and down with respect to the hot water tank 10 by a lifting means (not shown), and can be moved back and forth from above the hot water tank 10 so as not to contact the lifting table 22. Is provided. Therefore, after the detachment operation of the slice base S is completed, if the evacuation is performed from above the hot water tank 10, the movement of the lifting table 22 or the like will not be an obstacle during the adhesive removal operation.
[0023]
Further, since the slice base S bonded to the wafer W is further bonded to the mounting block M, both ends of the mounting block M are held when the wafer W is supported by the arm 42.
Next, a second embodiment of the wafer adhesive removing apparatus according to the present invention will be described.
[0024]
FIG. 6 is a front view showing the configuration of the second embodiment of the wafer adhesive removing apparatus according to the present invention, and FIG. 7 is a side view thereof.
As shown in FIG.6 and FIG.7, the cassette installation base 52 is provided in the hot water tank 50 in which the hot water was stored. On the cassette mounting table 52, a cassette 54 for storing wafers W is installed in a vertically placed state. The square-shaped wafers W are stored in a state where a large number of wafers are stacked in the cassette 54, and the slice base peeling portions are all directed in one direction (left direction in FIG. 7).
[0025]
In the vicinity of the hot water tank 50, a support column 56 is erected vertically. A pair of guide rails 58, 58 is disposed on the support column 56, and an elevating table 62 is supported on the guide rails 58, 58 via sliders 60, 60 so as to be movable up and down.
In the vicinity of the upper end of the column 56, a lifting hydraulic cylinder 64 is installed along the direction in which the guide rails 58, 58 are arranged. The rod of the lifting hydraulic cylinder 64 is connected to the lifting table 62. The elevating table 62 moves up and down along the guide rails 58 and 58 by driving the elevating hydraulic cylinder 64.
[0026]
A pair of guide rails 66 are arranged on the lower surface of the lifting table 62 along the Y direction in the figure. An advancing / retreating slide frame 70 is slidably supported on the guide rails 66, 66 via sliders 68, 68.
On the other hand, an advancing / retracting hydraulic cylinder 72 is disposed along the guide rails 66 on the upper surface of the elevating table 62. The rod of the forward / backward slide hydraulic cylinder 72 is connected to the forward / backward slide frame 70 via a connecting member 74 formed in an L shape. The forward / backward slide frame 70 slides in the Y direction in the drawing along the guide rails 66 and 66 by driving the forward / backward slide hydraulic cylinder 72.
[0027]
The forward / backward slide frame 70 is formed in an inverted L shape, and a guide rail 76 is disposed along the X direction in the figure on the front surface portion 70A. A slide base 80 is slidably supported on the guide rail 76 via a slider 78.
A slide hydraulic cylinder 82 is disposed along the guide rail 76 on the front surface 70 </ b> A of the forward / backward slide frame 70. The rod of the slide hydraulic cylinder 82 is connected to the slide base 80. The slide base 80 slides in the X direction in the figure along the guide rail 76 by driving the slide hydraulic cylinder 82.
[0028]
A motor 84 is installed on the slide base 80 with its spindle 84a facing vertically downward. The shaft 84a of the brush 86 is connected to the spindle 84a of the motor 84, and the brush 86 rotates by driving the motor 84.
The configuration of the brush 86 is the same as the configuration of the brush 36 of the first embodiment.
[0029]
The operation of the second embodiment of the wafer adhesive removing apparatus according to the present invention configured as described above is as follows.
First, a predetermined number of wafers W are stacked and stored in the cassette 54 so that the direction of the slice base peeling portion is constant. Then, the cassette 54 in which the wafer W is stored is installed on the cassette installation table 52 in the hot water tank 50.
[0030]
At this time, the elevating table 62 is kept in a standby position set above the hot water tank 50 so as not to interfere with the installation work of the cassette 54.
As described above, when the cassette 54 is installed in the hot water tank 50, the wafer W stored in the cassette 54 is immersed in the hot water, and the slice base peeling portion is in the X direction in the figure. It is arranged along. Thereafter, the wafer adhesive removing device is operated.
[0031]
First, the lifting hydraulic cylinder 64 is driven, and the lifting table 62 is lowered toward the hot water tank 50.
The driving of the elevating hydraulic cylinder 64 is stopped when the rod extends a predetermined amount, and as a result, the brush 86 is predetermined on the front surface of the wafer W installed in the hot water tank 50, that is, on the front surface of the slice base peeling portion. It is located with the interval of.
[0032]
When the driving of the elevating hydraulic cylinder 64 is stopped, the forward / backward slide hydraulic cylinder 72 is then driven, and the forward / backward slide frame 70 slides in the Y direction (rightward in FIG. 7).
The driving of the forward / backward slide hydraulic cylinder 72 is stopped when the rod extends a predetermined amount, and as a result, the brush 86 comes into contact with the slice base peeling portion.
[0033]
When the drive of the forward / backward slide hydraulic cylinder 72 is stopped, the motor 84 connected to the brush 86 is then driven, and as a result, the brush 86 starts rotating.
When the motor 84 starts to be driven, the slide hydraulic cylinder 82 connected to the slide base 80 is driven. As a result, the brush 86 starts to slide along the X direction in the figure.
[0034]
As a result, the brush 86 slides along the slice base peeling portion of the wafer W while rotating. Then, the adhesive remaining on the slice base peeling portion of the wafer W is scraped off by the brush 86 which slides while rotating, and is removed from the wafer W.
The removal operation ends when the brush 86 reciprocates about 2 to 4 times. When the removal operation is completed, first, the drive of the motor 84 and the slide hydraulic cylinder 82 is stopped, and then the forward / backward slide hydraulic cylinder 72 is driven to retract the brush 86 from the wafer W. Then, the lifting hydraulic cylinder 64 is driven and the lifting table 62 is raised to the standby position.
[0035]
The adhesive removal operation is completed by the above series of operations, and the removed wafer W is taken out from the hot water tank 50 together with the cassette 54.
As described above, according to the wafer adhesive removing apparatus of the present embodiment, the adhesive can be automatically removed and a large number of wafers W can be processed at a time as in the first embodiment. Therefore, the wafer processing operation can proceed efficiently. As a result, wafer production efficiency is improved.
[0036]
In the present embodiment, the brushes 36 and 86 are made of a non-woven surface treatment material formed in a roller shape. However, the present invention is not limited to this, and a wire brush or a cylindrical grinding wheel formed in a cylindrical shape is used. Etc. may be used.
Moreover, in this Embodiment, although the removal operation | work of the adhesive agent is performed in the state which immersed the wafer W in hot water, this is because an adhesive agent is heat-softened by being immersed in hot water. It is because it becomes easy to remove. Therefore, if the number of reciprocations of the brushes 36 and 86 is increased, the adhesive can be similarly removed even in the air.
[0037]
In the present embodiment, the case where the adhesive adhered to the square wafer W is removed has been described. However, the present invention can also be applied to a round wafer W. In this case, since the wafer W rotates when the adhesive is removed by the brush 36, it is necessary to prevent this.
In the adhesive removing apparatus of the type in which the wafer W is placed horizontally as described in the first embodiment, as shown in FIG. 8, one end of the wafers W, W,. Are pressed by a pad 90 formed of an elastic body such as a wafer, and the wafers W, W,. As a result, the wafers W, W,... Accommodated in the cassette 14 are fixed and prevented from rotating.
[0038]
As shown in the figure, the pad 90 is driven by a hydraulic cylinder 92 connected to the pad 90, and the pad 90 moves forward and backward toward the end face of the wafer W by driving the hydraulic cylinder 92. To do.
In the adhesive removing apparatus of the type in which the wafer W is placed horizontally as described in the first embodiment, as shown in FIG. 8, one end of the wafers W, W,. Are pressed by a pad 90 formed of an elastic body such as a wafer, and the wafers W, W,. As a result, the wafers W, W,... Accommodated in the cassette 14 are fixed and prevented from rotating.
[0039]
As shown in the figure, the pad 90 is driven by a hydraulic cylinder 92 connected to the pad 90, and the pad 90 moves forward and backward toward the end face of the wafer W by driving the hydraulic cylinder 92. To do.
Further, in the adhesive removing apparatus of the type in which the wafer W described in the second embodiment is placed vertically, as shown in FIG. 9, both side portions of the wafers W, W,. Is sandwiched between a pair of pads 94, 94 formed of an elastic body such as rubber. As a result, the wafers W, W,... Housed in the cassette 54 are fixed and prevented from rotating.
[0040]
The pads 94 and 94 are driven as follows. As shown in FIG. 9, arms 96, 96 are connected to the pads 94, 94, respectively, and the arms 96, 96 are supported by a rack member 100 slidably supported on guide rails 98, 98. , 100. The rack members 100, 100 are engaged with a pinion gear 102, and a motor 104 is connected to the pinion gear 102. The pair of pads 94, 94 move in a direction approaching each other by driving the motor 104, and sandwich the wafers W, W,. This prevents rotation of the wafers W, W,.
[0041]
【The invention's effect】
As described above, according to the present invention, it is possible to automatically remove the adhesive and to process a large number of wafers W at one time. Can do. As a result, wafer production efficiency is improved.
[Brief description of the drawings]
FIG. 1 is a front view of a wafer adhesive removing apparatus according to a first embodiment of the present invention. FIG. 2 is a side view of FIG. 2. FIG. 3 is a diagram for explaining the operation of the wafer adhesive removing apparatus according to the present invention. FIG. 4 is a front view of another embodiment of the wafer adhesive removing apparatus according to the present invention. FIG. 5 is a side view of FIG. 5. FIG. 6 is a second view of the wafer adhesive removing apparatus according to the present invention. FIG. 7 is a side view of FIG. 6. FIG. 8 is a side view of another embodiment of the wafer adhesive removing apparatus according to the present invention. FIG. 9 is a wafer adhesive removing apparatus according to the present invention. Plan view of other embodiments [Explanation of symbols]
DESCRIPTION OF SYMBOLS 10, 50 ... Hot water tank 14, 54 ... Cassette 16, 56 ... Support column 22, 62 ... Lifting table 24, 64 ... Lifting hydraulic cylinder 30 ... Slide frame 32 ... Slide hydraulic cylinder 36, 86 ... Brush 40, 84 ... Motor 70 ... Advancing / retracting slide frame 72 ... Advancing / retracting hydraulic cylinder 80 ... Slide base 82 ... Sliding hydraulic cylinder B ... Adhesive S ... Slice base W ... Wafer

Claims (2)

In the wafer adhesive removing device for removing the adhesive remaining in the slice base peeling portion of the wafer from which the slice base has been peeled,
A cassette for storing a plurality of wafers with the direction of the slice base peeling portion being constant,
A brush disposed at a position facing the slice base peeling portion of the wafer stored in the cassette;
Rotation driving means for rotating the brush;
Forward / backward moving means for moving the brush forward / backward with respect to the slice base peeling portion of the wafer stored in the cassette;
Moving means for moving the brush along the slice base peeling portion of the wafer stored in the cassette;
The brush is brought into contact with the slice base peeling portion of the wafer, and the brush remains on the slice base peeling portion of the wafer by sliding along the slice base peeling portion of the wafer while rotating the brush. A wafer adhesive removing apparatus, wherein the agent is removed. The wafer adhesive removing apparatus has a hot water tank in which hot water is stored, and the wafer bonded to the slice base is immersed in the hot water, and the wafer that is naturally peeled off from the slice base is dropped. 2. The wafer adhesive removing device according to claim 1, wherein the wafer adhesive removing device is stored in the cassette.

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