JP3666977B2 - Electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to that electronic component mounting method to transfer mounted on a substrate an electronic component-mix to chuck the nozzle of the transfer head.
[0002]
[Prior art]
There are many types of electronic components mounted on the board, and the required mounting accuracy differs depending on the type. Specifically, the required accuracy of mounting for resistor chips and chip-type capacitors is relatively low, whereas in the case of electronic components with leads and electronic components with bumps, the leads and bumps are connected to minute electrodes on the board. Therefore, the required mounting accuracy is high. In addition, an electronic component with a lead must be mounted on a board after accurately determining not only the positional deviation in the horizontal direction (XYθ direction) but also the floating of the lead.
[0003]
As described above, electronic components are subjected to various misalignment measurements depending on the product type. For this reason, the electronic component mounting apparatus includes various measuring instruments such as a camera, a line sensor, and a laser unit. It is done.
[0004]
[Problems to be solved by the invention]
However, in the conventional electronic component mounting apparatus, since measuring instruments such as cameras, line sensors, and laser units are arranged apart from each other, it is difficult to recognize various positions of various types of electronic components with high workability and high accuracy. As a result, there was a problem that the mounting speed was not increased.
[0005]
Accordingly, the present invention includes a purpose of the position recognition of the electronic component and the electronic component having bumps with lead performed in workability precision, to provide a Ru electronic component mounting method be transported mounted on the substrate at a high speed To do.
[0007]
[Means for Solving the Problems]
According to the first aspect of the present invention, a transfer head that moves horizontally in the X direction and the Y direction by the X table and the Y table chucks and picks up an electronic component with a lead provided in the parts feeder with a nozzle, and then a line While moving above the first recognizing unit provided with the sensor toward the second recognizing unit composed of a laser unit arranged at a downstream position in the moving direction of the transfer head, the first recognizing unit moves the electronic component. The entire image is captured to detect a rough positional shift in the XYθ direction, and then the transfer head is moved to the downstream laser unit as it is and the X-axis motor, Y-axis motor, and θ motor are driven. By correcting the positional deviation of the electronic component in the XYθ direction so that the laser spot light emitted from the laser unit hits the lead, the electronic component Wherein is located above the laser unit, where it is irradiated with laser spot beam to recognize the accurate positional deviation and the lead floating the transfer head to the lead projecting from the electronic component while moving in the XY direction, the following And mounting the electronic component on the substrate by moving the transfer head above the substrate positioned by the positioning unit based on the recognition result of the laser unit.
[0008]
According to the present invention of claim 2, the transfer head that moves horizontally in the X direction and the Y direction by the X table and the Y table chucks and picks up an electronic component with a bump provided in the parts feeder with a nozzle, The electronic component is moved by the first recognizing unit while moving the upper part of the first recognizing unit including the line sensor toward the second recognizing unit composed of an area camera arranged at a downstream position in the moving direction of the transfer head. The entire image is taken and the positional deviation in the XYθ direction is detected, and then the transfer head is moved as it is toward the downstream area camera and the recognition mark on the lower surface of the electronic component is within the field of view of the area camera. by adjusting the position of the electronic component is positioned above the area camera while moving the transfer head to the XY directions so as to be located, where the Eriaka The position of the electronic component is precisely detected by observing the recognition mark with a laser, and then the transfer head is moved above the substrate positioned by the positioning unit and detected by the area camera. After correcting the misalignment, an electronic component mounting method was configured from the step of mounting the electronic component on the substrate.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
According to the above configuration, the positional deviation and floating of the lead in the XYθ direction of the electronic component with lead and the positional deviation of the electronic component with bump are measured with high workability and high accuracy, and mounted on the substrate at high speed. Can do.
[0010]
Next, an embodiment of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the electronic component mounting apparatus, and FIG. 3 is a diagram illustrating a transfer head and a measurement system provided in the electronic component mounting apparatus. FIG. 4 is an explanatory diagram of a method for detecting the positional deviation of the electronic component with the lead, and FIG. 5 is an explanatory diagram of a method for detecting the positional deviation of the electronic component with the bump.
[0011]
1 and 2, a guide rail 3 as a positioning portion for the substrate 2 is provided on the upper surface of the base 1. The board | substrate 2 is conveyed along the guide rail 3, and is clamped and positioned in a predetermined position. Many parts feeders 4 are arranged in parallel on both sides of the guide rail 3. Each parts feeder 4 includes various types of electronic components. In general, electronic components with leads and electronic components with bumps are provided in a tray-type parts feeder. However, in this embodiment, since the drawing becomes complicated, all electronic components are provided in a cassette-type parts feeder 4. Suppose that
[0012]
Between the guide rail 3 and the parts feeder 4, a first image pickup unit 5 incorporating a line sensor, a second image pickup unit 6 comprising an area camera, and a height measuring device 7 comprising a laser unit are disposed. In FIG. 3, the first imaging unit 5 includes a line sensor 52 built in a case 51, and a light source 53 that irradiates illumination light upward on both sides of the case 51. A laterally long slit 54 is opened in the longitudinal direction (Y direction) of the line sensor 52 on the upper surface of the case 51.
[0013]
The electronic component 9 is transferred in a direction (X direction) orthogonal to the longitudinal direction (Y direction) of the line sensor 52. Since the line sensor 52 has a wide field of view and can capture an entire image of the large electronic component 9, the line sensor 52 has a merit that it can correspond widely from a minute rectangular electronic component called 1005 (Ichimarugo) to an electronic component 9 with leads. ing. In the present embodiment, the first imaging unit 5 constitutes a first recognition unit.
[0014]
Further, the height measuring device 7 is provided with a laser light emitting portion 72 and a laser light receiving portion 73 in the recessed portion of the main body 71. The laser light emitting unit 72 measures the height (floating) of the lead L by irradiating the lower surface of the lead L of the upper electronic component 9 with a laser spot light and receiving the reflected light by the laser light receiving unit 73. Further, the position of the lead in the horizontal direction can be accurately detected from the intensity waveform of the reflected light obtained by the laser light receiving unit 73, and an accurate positional deviation of the electronic component 9 can be obtained based on this. The second imaging unit 6 includes a high-magnification area camera, and can detect the position more accurately than the line sensor 52 by partially enlarging and imaging the characteristic part of the electronic component. Therefore, it is possible to accurately detect the positional deviation of the electronic component and mount it on the substrate 2 with high accuracy. Note that the above-described characteristic part of the electronic component refers to an identification mark, an outline shape of the electronic component, a lead, a bump, a wiring pattern, or the like that can accurately specify the position of the electronic component. Therefore, the height measuring device 7 and the second imaging unit 6 constitute a second recognition unit that detects a characteristic part of the electronic component.
[0015]
1 and 2, Y tables 11 are installed on both sides of the base 1. Inside the Y table 11, a feed screw 12 and a rail 13 in the Y direction are provided. Reference numeral 14 denotes a Y-axis motor that rotates the feed screw 12. An X table 15 is installed on the Y table 11. Inside the X table 15, a feed screw 16 and a rail 17 in the X direction are provided. Reference numeral 18 denotes an X-axis motor that rotates the feed screw 16.
[0016]
A transfer head 20 is held on the X table 15. When the Y-axis motor 14 is driven, the X table 15 moves along the feed screw 12 in the Y direction. When the X-axis motor 18 is driven, the transfer head 20 moves in the X direction along the feed screw 16. Thereby, the transfer head 20 moves horizontally in the X direction and the Y direction.
[0017]
In FIG. 3, the transfer head 20 has a nozzle 21. A back plate 22 is attached to the nozzle 21. The back plate 22 serves as a light diffusing plate when the first imaging unit 5 or the second imaging unit 6 observes the electronic component 9 chucked by vacuum suction on the lower end portion of the nozzle 21. Reference numeral 23 denotes a U-shaped bracket on which a Z-axis motor 24 is mounted. A vertical feed screw 25 is driven by the Z-axis motor 24 and has a nut 26 attached thereto. A nozzle shaft 27 integral with the nozzle 21 is coupled to a nut 26. Accordingly, when the Z-axis motor 24 is driven and the feed screw 25 rotates, the nut 26 moves up and down along the feed screw 25 and the nozzle 21 also moves up and down.
[0018]
Reference numeral 28 denotes a θ motor, and a belt 30 is tuned to a pulley 29 attached to the output shaft and the nozzle shaft 27. Therefore, when the θ motor 28 is driven, the nozzle 21 rotates about its axis, thereby correcting the angle in the rotation direction of the electronic component 9 vacuum-sucked at the lower end of the nozzle 21.
[0019]
This electronic component mounting apparatus has the above-described configuration. Next, an operation for transferring and mounting the electronic component provided in the parts feeder 4 on the substrate 2 will be described. First, a method of mounting the electronic component 9 with leads will be described. 1 and 2, the transfer head 20 moves above the parts feeder 4 by driving the X-axis motor 18 and the Y-axis motor 14. Accordingly, when the Z-axis motor 24 is driven, the nozzle 21 moves down and rises, and the electronic component 9 provided in the parts feeder 4 is vacuum-sucked and picked up.
[0020]
Next, the transfer head 20 moves above the first imaging unit 5 and moves linearly in the X direction as shown in FIG. 3, and the entire image of the electronic component 9 is obtained by the line sensor 52. At this time, the transfer head 20 performs the first imaging from a position (point (A) in FIG. 2) opposite to the side where the second imaging unit 6 and the height measuring device 7 are located when viewed from the first imaging unit 5. It moves linearly toward the part 5. That is, the second imaging unit 6 and the height measuring device 7 are arranged at a position downstream of the first imaging unit 5 in the moving direction of the transfer head 20 when the first imaging unit 5 detects the positional deviation of the electronic component. Thus, the transfer head 20 can be moved to the second image pickup unit 6 or the height measuring device 7 side while the first image pickup unit 5 detects the displacement of the electronic component transferred by the transfer head 20. Therefore, the time for the transfer head 20 to move from the first imaging unit 5 to the second imaging unit 6 and the height measuring device 7 can be greatly shortened, and the mounting speed of electronic components can be increased.
[0021]
4, an electronic component 9 indicated by a solid line indicates an image obtained by the line sensor 52, and a chain line indicates the electronic component 9 having no rotation error Δθ or the electronic component 9 after correcting the rotation error Δθ. Yes.
[0022]
As shown in the drawing, the nozzle 21 of the transfer head 20 vacuum-sucks a position considerably deviated from the center of the electronic component 9, and for this reason, the lead L of the electronic component 9 is considerably large in the X direction and the Y direction. There is misalignment. The electronic component 9 rotates in the horizontal direction and has a rotation error Δθ. The lead L of the electronic component 9 with a lead must be landed and mounted on the electrode of the substrate 2, and therefore the floating and accurate positional deviation of the lead L are measured by the height measuring device 7. However, if the electronic component 9 is greatly displaced as shown by the solid line in FIG. 4, the laser spot light emitted from the laser light emitting unit 72 in the height measuring device 7 cannot hit the lead L.
[0023]
Therefore, first, as shown in FIG. 4, the rough position of the electronic component 9 is recognized by the first imaging unit 5, the electronic component 9 is moved above the height measuring device 7 based on the recognition result, and the laser spot light is detected. The electronic component 9 is moved in the X direction and the Y direction so that the lead L hits the lead L, and the floating of the lead L and the accurate positional deviation are measured. In FIG. 4, arrows Q and Q ′ indicate the scanning direction of the laser spot light. As shown in the figure, the laser spot light is scanned in a direction across the tip of the lead L. In this case, the X-axis motor 18 and the Y-axis motor 14 in FIG. 4 are driven without correcting the positional deviation of the electronic component 9, and the electronic component 9 is moved horizontally so as to scan the laser spot light in the arrow Q direction. The lift of the lead L may be measured, or after correcting the positional deviation of the electronic component 9 as indicated by the chain line in FIG. 4, the laser is moved in the direction of the arrow Q ′ so as to cross the tip of the lead L. The floating of the lead L may be measured by scanning spot light. The positional deviation of the electronic component 9 in the X direction and the Y direction is corrected by driving the X axis motor 18 and the Y axis motor 14 to move the electronic component in the X direction and the Y direction. The rotation error Δθ) is corrected by driving the θ motor 28 and horizontally rotating the electronic component 9.
[0024]
When the positional deviation and the floating of the lead L of the electronic component 9 are measured as described above, the transfer head 20 is moved above the substrate 2 and the nozzle 21 is moved up and down there, whereby the electronic component 9 is moved. The lead L is mounted on the electrode at a predetermined coordinate position on the substrate 2 with high accuracy. If the lead L floats above the allowable value, the lead L cannot be landed on the electrode, and the mounting of the electronic component 9 on the substrate 2 is stopped. ).
[0025]
Next, a method for mounting electronic components with bumps on a substrate will be described. In FIG. 1, the transfer head 20 picks up an electronic component with a bump provided in the parts feeder 4, moves it above the first imaging unit 5, and obtains an image thereof. In FIG. 5, the electronic component 10 indicated by a solid line is an image thereof, B is a large number of bumps protruding from the lower surface of the electronic component 10, and K is a recognition mark formed at a corner of the lower surface. In FIG. 5, the electronic component 10 indicated by a chain line indicates a correct position without positional deviation. E is a field of view of the second imaging unit 6.
[0026]
Next, the transfer head 20 moves above the second imaging unit 6 and measures the position of the recognition mark K. However, as shown by the solid line in FIG. Therefore, the recognition mark K cannot be captured in the field of view E of the second imaging unit 6. Therefore, the position of the electronic component 10 is adjusted so that the recognition mark K is located in the field of view E according to the recognition result by the first imaging unit 5 (see the electronic component 10 indicated by a chain line), and the position of the electronic component 10 in the XYθ direction. Measure the deviation accurately. Next, the transfer head 20 moves above the substrate 2, corrects the positional shift measured by the second imaging unit 6, and then mounts the bump B on the electrode of the substrate 2.
[0027]
The present invention is not limited to the above-described embodiment. For example, the height measuring device 7 moves the lead L in a direction crossing a plurality of light beams, and measures the timing at which the light beams are blocked by the lead. You may use what detects the position shift and floating of L. Further, when electronic components are mounted on the substrate 2 with rough mounting accuracy, the second imaging unit 6 and the height measuring device 7 do not necessarily have to be recognized. Only one of them may be the second recognition unit.
[0028]
【The invention's effect】
According to the present invention, the positional deviation and floating of the lead in the XYθ direction of the electronic component with lead and the positional deviation of the electronic component with bump are measured with high workability and high accuracy, and mounted on the substrate at high speed. Can do.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4 is a perspective view of a transfer head and a measurement system provided in the electronic component mounting apparatus. FIG. 4 is an explanatory diagram of a method for detecting a positional deviation of electronic components with leads in the electronic component mounting apparatus according to an embodiment of the present invention. FIG. 10 is an explanatory diagram of a method for detecting a displacement of an electronic component with bumps in an electronic component mounting apparatus according to an embodiment of the present invention.
2 Substrate 3 Guide rail 4 Parts feeder 5 First imaging unit 6 Second imaging unit 7 Height measuring device 9 Electronic component with lead 10 Electronic component with bump 20 Transfer head 21 Nozzle B Bump K Recognition mark L Lead

Claims (2)

A transfer head that moves horizontally in the X and Y directions by the X table and the Y table picks up an electronic component with a lead provided in the parts feeder with a nozzle, and then a first recognition unit having a line sensor The whole image of the electronic component is picked up by the first recognition unit while moving toward the second recognition unit comprising a laser unit arranged at a downstream position in the moving direction of the transfer head, and the XYθ A rough displacement in the direction is detected, and then the transfer head is moved toward the downstream laser unit as it is, and the X-axis motor, Y-axis motor, and θ motor are driven to irradiate from the laser unit. The electronic component by correcting the positional deviation of the electronic component in the XYθ direction so that the laser spot light hit the lead It is positioned above, where it is irradiated with laser spot beam to recognize the accurate positional deviation and the lead floating the transfer head to the lead projecting from the electronic component while moving in the XY direction, and then the laser unit And mounting the electronic component on the substrate by moving the transfer head above the substrate positioned by the positioning unit based on the recognition result. A transfer head that horizontally moves in the X and Y directions by the X table and the Y table picks up an electronic component with a bump provided on the parts feeder with a nozzle, and then a first recognition unit having a line sensor The first recognizing unit captures an entire image of the electronic component while moving the image to the second recognizing unit composed of an area camera arranged at a downstream position in the moving direction of the transfer head. Detecting the positional deviation in the direction, and then moving the transfer head as it is toward the downstream area camera and moving the transfer head so that the recognition mark on the lower surface of the electronic component is located in the field of view of the area camera. The position of the electronic component is adjusted while being moved in the XY direction so as to be positioned above the area camera. Observing and accurately detecting the positional deviation of the electronic component in the XYθ direction, and then moving the transfer head above the substrate positioned by the positioning unit and correcting the positional deviation detected by the area camera The electronic component mounting method is characterized in that the electronic component is mounted on the substrate.

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