JP3602300B2 - Manufacturing method of ceramic member - Google Patents

Description

にて算出される。
【００２７】
焼成時におけるクラックの発生を防止するためには、薄肉板用グリーンシートと剛性板用グリーンシートの焼成収縮カーブが近似していることが望ましく、両グリーンシートの焼結途上温度Ｔ_５０の差の絶対値が５０℃以下、焼成収縮率Ｆの差の絶対値が１．５％以下であることが必要とされ、それぞれ、２０℃以下、１．０％以下であることがより好ましい。
【００２８】
焼結途上温度Ｔ_５０の差の絶対値が５０℃を超えるか、又は焼成収縮率Ｆの差の絶対値が１．５％を超える場合は、焼成時の応力により、微細貫通孔間にクラックが発生しやすくなり、又、薄肉板にしわやへこみが生じやすくなる。
【００２９】
微細貫通孔は薄肉板用グリーンシートを剛性板用グリーンシートに積層する前に形成してもよく、一体積層物とした後に形成してもよいが、一体積層物とした後に形成する方が、作業がしやすく、又、薄肉板用グリーンシートにしわが生じるおそれがなく、さらに微細貫通孔の位置寸法精度が同上するため好ましい。
【００３０】
パンチングによる微細貫通孔の形成は焼成基板加工とは異なり、粒内を切断することができないのはもちろんのこと、グリーンシートの凝集粒子間を切断することも困難である。従って、粉末粒子径が大きいと、加工面を精度良く形成できず、加工面の平滑度が悪くなり、バリが生じる等の問題が発生する。
従って、本発明のセラミック部材の製造方法において、薄肉板用グリーンシートを構成するセラミック粉末の粒子径Ｄ_Ｌ は０．１μｍ以上、１．２μｍ以下であることが好ましく、セラミック粉末のＢＥＴ比表面積から算出した球相当径Ｄ_ＢＥＴ は０．０２μｍ以上、０．５μｍ以下であることが好ましい。粉末粒子径を上記の値とすることで、微細貫通孔加工等の取扱時におけるグリーンシートの伸びを効果的に小さくすることができるという利点もある。
【００３１】
粉末平均粒子径は、例えば、グリーンシート成形前のスラリーを、スラリーに用いた溶剤にて希釈した後、ホリバ製レーザ回折式粒度測定装置ＬＡ−７００を使用してその平均粒子径を測定する。
【００３２】
球相当径Ｄ_ＢＥＴ （μｍ）は、ＢＥＴ比表面積値の測定値より、式、Ｄ_ＢＥＴ ＝６／ρＳ（なお、ρは粉末理論密度（ｇ／ｃｍ^３ ）、Ｓは粉末ＢＥＴ比表面積値（ｍ^２ ／ｇ）を表す。）より算出される。又、ＢＥＴ比表面積値は、薄肉板用グリーンシート中のバインダ、可塑剤、分散剤等の有機物成分を除去するために、５００℃、２時間の熱処理を行った試料を用いて測定される。
【００３３】
粉末粒子径Ｄ_Ｌ が０．１μｍ未満、又は球相当径Ｄ_ＢＥＴ が０．０２μｍ未満の場合は、均質なスラリーの作製が困難となり、グリーンシート内にクラックが生じる結果、グリーンシートの強度が低下する。一方、粉末粒子径Ｄ_Ｌ が１．２μｍを超えるか、又は球相当径Ｄ_ＢＥＴ が０．５μｍを超える場合は、微細貫通孔の内壁に凸凹が生じ、貫通孔の形状が不揃いになるとともに、気体、液体、微粒子固体等の通過抵抗が大きくなる。又、微細貫通孔の内壁周辺にクラックが生じやすくなる。
【００３４】
又、薄肉板用グリーンシートのセラミック粉末占有率Ａを４０％以上、５５％以下とし、セラミック粉末占有率Ａと有機成分占有率Ｂとの和を８０％以上、９８％以下とすることが、微細貫通孔の加工精度向上、加工面の平滑度改善、ボロ発生の低減、グリーンシートの伸びの低減を図る観点より好ましい。
【００３５】
セラミック粉末占有率Ａは、式、ＧＤ×［ａ／（ａ＋ｂ）］×１／ρ_ｃｅにより算出されるが、式中、ａはグリーンシート中のセラミック粉末重量部、ｂはグリーンシート中の有機物成分重量部（ｂ＝Σｂ_ｉ ）、ＧＤはグリーンシートの生密度（ｇ／ｃｍ^３ ）、ρ_ｃｅはセラミック粉末理論密度（ｇ／ｃｍ^３ ）をそれぞれ表す。
【００３６】
又、有機物成分とは、バインダ、可塑剤、分散剤等をいい、有機成分占有率Ｂは、式、ＧＤ×Σ｛［ｂ_ｉ ／（ａ＋ｂ）］×１／ρ_ｉ ｝により算出されるが、式中、ｂ_ｉ はグリーンシート中の各有機成分重量部、ρ_ｉ は各有機物成分の理論密度（ｇ／ｃｍ^３ ）をそれぞれ表す。
【００３７】
セラミック粉末占有率Ａが４０％未満の場合は、薄肉板用グリーンシートの焼成収縮率Ｆのばらつきが大きくなる結果、寸法精度が低下するとともに、焼成後の薄肉板の強度が低下するという不都合がある。セラミック粉末占有率Ａが５５％を超える場合は、薄肉板用グリーンシート内の粉末粒子間距離が接近するため、微細貫通孔の形成（パンチング）が困難になったり、焼成時の脱バインダ性が悪化したりして、微細孔間にクラックや欠陥が発生する場合がある。
【００３８】
一方、セラミック粉末占有率Ａと有機成分占有率Ｂとの和が８０％未満の場合は、薄肉板用グリーンシートの伸び率が大きくなるとともに、引っ張り強度が低下する。又、９８％を超える場合も、薄肉板用グリーンシートの伸び率が大きくなる他、剛性板用グリーンシートとの積層性が悪化し、一体化が困難となる。この結果、９８％を超える場合及び８０％未満の場合、微細貫通孔の形状が不揃いになったり、微細貫通孔の周辺にクラックが生じる場合がある。
【００３９】
本発明において、薄肉板にはアルミナ、ジルコニア等を用いることができるが、薄肉板に強度、靱性及び耐磨耗性を付与するとともに、焼成時の応力により微細貫通孔間にクラックが発生するのを防止する観点より、部分安定化ジルコニアを主成分とすることが好ましい。又、部分安定化ジルコニアは熱膨張係数が金属に較べて小さいため、高温環境下での孔位置精度の向上を図ることができる。さらに、部分安定化ジルコニアは耐腐食性、耐摩耗性、耐熱性に優れているため、温度、媒体の適用可能範囲を広くすることができる。
【００４０】
なお、部分安定化ジルコニアの結晶粒子径は薄肉板の表面平滑性向上及び強度向上などの点で２μｍ以下であることが好ましく、１μｍ以下であることがより好ましい。
【００４１】
さらに、部分安定化ジルコニアは、２〜６ｍｏｌ％、好ましくは２．５〜４．０ｍｏｌ％の酸化イットリウムで部分安定化されたものであることが好ましい。これは、薄肉板の強度、耐摩耗性を向上させるためである。
【００４２】
又、薄肉板に用いる部分安定化ジルコニアの結晶相は、主として正方晶、もしくは主として立方晶、正方晶、単斜晶の内、少なくとも２種以上の結晶相からなる混晶とすることで部分安定化されたジルコニアを主成分とする材料が好ましく使用される。中でも、正方晶のみ、又は正方晶と立方晶の混晶が最も望ましい。これは、強度と靱性とが優れているためである。又、助剤としてアルミナ１０重量％以下を含有するものも、強度改善のため好ましく採用される。又、アルミナ含有量を制御することで、薄肉板用グリーンシートと剛性板用グリーンシートの焼結進行状態を自由にコントロールすることが可能である。
【００４３】
さらに、本発明においては、図８に示すように、両側において剛性板９にて支持された、微細貫通孔１を形成した薄肉板７の部分３０の短手方向の幅の最大値ｗ（ｍｍ）と微細貫通孔１の間隔ｄ（μｍ）とが、下式（イ）、
（イ） ｗ≧１０／ｄ
で表される関係を有することが好ましいが、ｗ≧２５／ｄであることがより好ましく、ｗ≧５０／ｄであることがさらに好ましい。Ｗ＜１０／ｄの場合、焼成時に発生する応力によって微細貫通孔間やその周辺部にクラックを生じやすくなる。短手方向の幅の最大値ｗが１０ｍｍを超える場合には、生積層体の取扱性の低下、薄肉板の強度及び平坦性の低下等の問題が発生するので好ましくない。
【００４４】
本発明の方法によって製造されるセラミック部材において、剛性板の合計厚さは５０μｍ以上であることが好ましく、８０μｍ以上であることがより好ましい。５０μｍより薄いと、セラミック部材としての剛性が不足するため好ましくない。
また、剛性板は本セラミック部材にある程度の剛性を持たせるために用いるだけでなく、機能を有していてもよい。例えば、剛性板上に電極を形成する、剛性板内にスルーホール配線等を設け立体配線を形成する、剛性板内に液体、微粒子固体等をためるチャンバーを形成する等である。さらに、剛性板は単一層であっても、複数層であってもよい。複数層の場合、全ての層が同一形状である必要はなく、また、それぞれの層が別々の機能を持っていてもよい。
【００４５】
さらに、剛性板の厚さ（合計厚さ）は薄肉板の厚さ（合計厚さ）より大きいことが好ましい。剛性板が薄肉板より薄いと、焼成後のセラミック部材の寸法安定性が低下するからである。一方、剛性板の合計厚さが薄肉板の合計厚さの１０倍を超えると、焼成時に薄肉板に対して発生する応力が大きくなり、微細孔間やその周辺部にクラックが発生しやすくなったり、薄肉板にしわやヘコミが生じやすくなる。従って、剛性板の合計厚さは薄肉板の合計厚さより厚く、薄肉板の合計厚さの５倍未満であることがより好ましい。
【００４６】
薄肉板（複数層の場合はその合計厚さ）の焼成後の厚さは、一般には１００μｍ以下、好ましくは５０μｍ以下、より好ましくは３０μｍ以下である。薄くすることにより、金型／ＮＣパンチングの打ち抜きの際に、グリーンシートカス抜け性向上により孔づまりを防止するほか、ピン折れ及び打ち抜き面のバリ発生を防止することができ、さらには、打ち抜き孔の形状精度を向上（シートの表／裏の孔径ばらつきの低減）させることができる。又、薄くすることで微細貫通孔に粉体、液体、微粒子固体等を通過させる場合、その通過抵抗を小さくすることができる。一方、薄肉板の厚さが１００μｍより厚いと、微細貫通孔の形成性が悪化したり、上記の通過抵抗が大きくなるので好ましくない。なお、薄肉板も単一層であっても、複数層からなっていてもよい。
剛性板は単に剛性が高ければ高いほどよいというわけではなく、セラミック部材に適度な剛性を与える必要がある。すなわち、例えばセラミック部材の薄肉板にドラム等を接触させて使用する場合においては、密着性を向上させるために剛性板と薄肉板に適度な剛性力の差を持たせることも重要である。
【００４７】
薄肉板に設けた微細貫通孔の間隔の最小値（焼成後）は、高密度化への対応という見地より、１５０μｍ以下が必要であり、１００μｍ以下であることが好ましく、さらに７０μｍ以下がより望ましい。本発明の製造方法を採用することにより、薄肉板にクラックを生じさせることなく、微細貫通孔の間隔を上記の値とすることができる。
【００４８】
また、微細貫通孔径の最小値（焼成後）は、高密度化、高精度化に応えるため、１５０μｍ以下とすることが必要であり、１００μｍ以下とすることが好ましく、７０μｍ以下とすることがより好ましい。
薄肉板の厚みｔ（ｍｍ）と、薄肉板の部分に形成した複数の微細貫通孔の孔径の最小値ｈ（μｍ）と間隔ｄ（ｍｍ）との関係（焼成後寸法）は、下式（ロ）の関係を満足することが好ましい。
【００４９】
【数１】

【００５０】
なお、薄肉板の厚みｔ（ｍｍ）と、薄肉板の部分に形成した複数の微細貫通孔の孔径の最小値ｈ（μｍ）と間隔ｄ（ｍｍ）との関係（焼成後寸法）は、下式（ハ）関係を満足することがさらに好ましい。
【００５１】
【数２】

【００５２】
式（ロ）を満足しない場合には、パンチングによる微細貫通孔の形成及び焼成の工程において、孔間クラックが発生しやすくなる。
【００５３】
また、図１、２に示すように、複数の微細貫通孔を一直線上に形成するよりも、図３、４、９、１１、１２に示すように、複数の直線上に形成する方が、上記式（ロ）の左辺の値を大きくとり、孔間クラックを防止することができるとともに、本出願の目的である高密度化を達成できる点で好ましい形態である。
【００５４】
また、薄肉板の厚みｔ（μｍ）と、薄肉板の部分に形成した複数の微細貫通孔の孔径の最小値ｈ（μｍ）との関係（焼成後寸法）は、下式（ニ）
（二） ｔ／ｈ≦１０．０
を満足することが望ましいが、下式（ホ）
（ホ） ｔ／ｈ≦４．０
を満足することがより望ましい。
式（ニ）を満足しないときには、微細貫通孔に粒子、液体等を通過させるときの抵抗が大きくなり、該セラミック部材の機能を十分発揮できなくなる。
【００５５】
また、パンチングにより微細貫通孔を形成する際の孔形成性の点では、ｔ／ｈ≦３．０であることが好ましく、ｔ／ｈ≦１．０であることがより好ましい。ｔ／ｈ＞３．０のときには、パンチングの際に微細貫通孔の内部又はその周辺にパンチングカスが残ったり、さらには孔周りや孔間にクラックを生じやすくなり、パンチングピンが破損しやすい点で好ましくない。
一方、微細貫通孔に気体、液体、微粒子固体等を通過させる場合において、これらの通過物に方向性を持たせるためには、ｔ／ｈ≧０．１が好ましく、ｔ／ｈ≧０．４がより好ましい。
【００５６】
両側において剛性板にて支持された、該微細貫通孔を形成した該薄肉板の部分の短手方向の幅の最大値ｗ（ｍｍ）と、該薄肉板の厚みｔ（μｍ）との関係は、下式（ヘ）を満足することが望ましく、下式（ト）を満足することがより好ましい。
（ヘ） ｔ／ｗ≧５．０
（ト） ｔ／ｗ≧８．０
ｔ／ｗ＜５．０の場合には、生積層体の取扱性のほか、薄肉板の強度、薄肉板の平坦性、微細貫通孔の位置精度等が低下し、好ましくない。
【００５７】
本発明において、薄肉板用グリーンシート及び剛性板用グリーンシートの作製は、具体的には、以下のように行われる。
グリーンシート作製用スラリーまたはペーストは、従来と同様に、セラミック粉末に適当なバインダー、可塑剤、分散剤、焼結助剤、有機溶媒などを配合して調製される。上記のスラリーやペーストは、ドクターブレード法、カレンダー法、印刷法、リバースロールコータ法等の従来から公知の手法に従って、所定の厚みを有するグリーンシートに成形される。このようにして得られたグリーンシートは、必要に応じて、切断、切削、打ち抜き、微細貫通孔の形成等の加工を施し、又は複数枚のグリーンシートが積層され、熱圧着等によって、一体的な積層物とされ、所定形状及び厚さの成形物とされる。なお、微細貫通孔は金型／ＮＣパンチングにより形成される。また、微細貫通孔の形成は、グリーンシート単体の状態で行っても、積層後行ってもよい。
【００５８】
薄肉板の材質に、部分安定化ジルコニアを主成分とするものを使用する場合には、部分安定化ジルコニア粉末に対して３０重量％以下の助剤、例えば、アルミナ、シリカ、遷移金属酸化物、粘土、ムライト、コージェライト、スピネル、チタニア等及びこれらの混合物を添加してもよい。
【００５９】
かかる成形物に対して焼成操作が実施され、これにより、該積層物を一体的な焼結体とする。この時の焼成温度は、一般に、１２００〜１７００℃程度、好ましくは１３００〜１６００℃程度の温度が採用されることになる。また、高精度電界シャッター、スケール等の用途においては、該セラミック部材の微細貫通孔を形成した薄肉板に、例えば紙、ドラムなどを接触させて用いる場合に、該接触物と薄肉板とを密着させることが、位置ズレ防止、気体、液体・微粒子固体等の吐出性向上、それに伴う記録の質向上等の点で有利に用いられる。
【００６０】
このような理由のため、該セラミック部材全体を単に平坦化するだけでなく、薄肉板を平坦、平滑化することをも目的とする、次に述べる反り修正工程も有利に採用されうる。
反り修正工程とは、焼結後の前記積層物に反りがある場合に、平滑なセラミック製の重し等を載せて、焼成温度近傍の温度で再焼成し、反りを修正することである。
【００６１】
同様の理由により、薄肉板の微小うねり除去及び平坦化、薄肉板や剛性板の表面突起物や付着物（同材質、異材質含む）の除去や表面粗さＲａの低減（中心線平均粗さ０．５μｍ以下、好ましくは０．２μｍ以下）及び平滑性の向上、該セラミック部材の形状修正等の目的で、焼成後若しくは反り修正後に該セラミック部材の薄肉板及び剛性板の表面を、エッチング、研磨、研削等の処理、加工を施すことも好ましく用いられる。
また、微細貫通孔の内壁及び孔まわりの前記突起物、付着物除去の目的により、微細貫通孔を形成した薄肉グリーンシートや薄肉板にレーザーやエッチング等で処理、加工することも好ましく用いられる。
【００６２】
さらに、部分安定化ジルコニア材料で形成された該セラミック部材の薄肉板、剛性板の表面に研磨・研削等の加工を施し、さらにその後必要に応じて熱処理を加えることで該表面の結晶構造を意図的に一部変化させたり、該セラミック部材の形状を修正したり、曲げたりすることも可能であり、好ましく用いられる。
【００６３】
グリーンシート間に接着補助層を設けることも有利に採用される。接着補助層を設けることにより、積層圧力を低減させることができる。積層圧力は１００Ｋｇ／ｃｍ^２ 以下が好ましく、４０Ｋｇ／ｃｍ^２ 以下がより好ましい。積層圧力が大きいと微細貫通孔間の間隔が狭いため、孔間やその周辺部にクラックが生じやすくなる。また、一体積層物が変形し、所定の形状のものが得られなかったり、微細貫通孔の位置精度が低下したりすることがある。
接着補助層の材料としては、グリーンシート作製用スラリー、ペースト、バインダー、可塑剤、溶剤、又はこれらの混合物等が用いられる。接着補助層は、塗布、印刷、噴霧等により形成することが好ましい。
【００６４】
図９に本発明の方法により製造したセラミック部材の薄肉板上面に金電極１３を形成した電界シャッターの一例を示す。
【００６５】
また、図１０に示すように、このようにして作製されたセラミック部材の上面に電界シャッター用電極１５（金電極、厚さ０．３μｍ）を形成したものと、誘電体薄板２１の表裏にライン電極１１とフィンガー電極１２を設けたイオン発生源と、誘電体ドラム１９とを組み合わせることにより、イオン流制御ヘッド１０を構成することができる。
【００６６】
なお当然ながら、本発明は、イオン流制御ヘッドに限るものではなく、薄肉部に微細貫通孔を有する部材が要求される他の適当なものでも構わない。例えば、本発明によって得られるセラミック部材をフィルター、スクリーン（篩い）、濾過部材などに好ましく使用することができる。
本発明によって得られるセラミック部材をフィルター、スクリーン（篩い）、濾過部材に適用した場合の利点を以下に示す。
（１）この部材はセラミックからなるため、耐磨耗性に優れる。
（２）微細貫通孔が形成された薄肉板の厚さを１００μｍ以下と薄くしているため、濾過抵抗を小さくすることができる。
（３）剛性板によって薄肉板を支持する構造であるため、破損し難い。
（４）開口部（微細貫通孔）の密度を大きくすることができるため、濾過面積効率を高くすることができる。
【００６７】
【実施例】
以下、本発明を実施例に基づいてさらに詳細に説明するが、本発明はこれらの実施例に限定されるものではない。
（実施例１） 本発明の方法にてセラミック部材を製造し、パンチングによる微細貫通孔形成の際、及び焼成過程におけるクラックの発生について調べた。
【００６８】
まず、薄肉板用グリーンシートを次のようにして作製した。
Ｙ_２ Ｏ_３ ３ｍｏｌ％、Ａｌ_２ Ｏ_３ ０．１ｍｏｌ％含有部分安定化ジルコニア粉末１００重量部、ポリビニルブチラール樹脂（ＰＶＢ）（積水化学株式会社製、ＢＭ−２）（バインダー）１２．３重量部、ＤＯＰ（可塑剤）１２．３重量部、キシレン（溶剤）５０重量部、１−ブタノール（溶剤）５０重量部をボールミルにて３０時間混合し、グリーンシート成形用スラリーを調製した。このスラリーに真空脱泡処理を施すことにより、粘度を４０００ｃｐｓに調整した後、ドクターブレード装置によって焼成後の厚さが３０μｍとなるように薄肉板用グリーンシートを形成した。
【００６９】
ＮＣパンチングマシンを用いて、上記の薄肉板用グリーンシートに、直径４０μｍの微細貫通孔を孔間隔３６．７μｍにて形成し、２３０×２０ｍｍの寸法に外形切断を行った。微細貫通孔は４列形成し、その個数は１列当たり７０８個、計２８３２個とした。
【００７０】
次に、剛性板用グリーンシートを次のようにして作製した。
グリーンシート成形用スラリーは、薄肉板用グリーンシートの場合と同様に調製したが、剛性板用グリーンシートの焼結途上温度Ｔ_５０及び焼成収縮率Ｆを調整するため、部分安定化ジルコニア粉末の粉末粒子径及びＡｌ_２ Ｏ_３ 含有率、ボールミルでの混合時間、有機分組成等を変えた。
【００７１】
上記のスラリーを用い、ドクターブレード装置によって焼成後の厚さが１００μｍとなるように剛性板用グリーンシートを形成した。
【００７２】
次に、剛性板用グリーンシート上への接着補助層の形成を次の通り行った。Ｙ_２ Ｏ_３ ３ｍｏｌ％、Ａｌ_２ Ｏ_３ ０．１ｍｏｌ％含有部分安定化ジルコニア粉末１００重量部、ＰＶＢ（積水化学株式会社製、ＢＭ−２）（バインダー）１３重量部、ＤＯＰ（可塑剤）５重量部、２−エチルヘキサノール（溶剤）適量をトリロールミルにて混練し、粘度２００００ｃｐｓの接着補助層用ペーストを調製した。このペーストをスクリーン印刷装置を用いて、剛性板用のグリーンシート上に印刷し、乾燥後の厚さが６μｍである接着補助層を形成した。
【００７３】
このようにして得られた接着補助層付き剛性板用グリーンシートに切断及び打ち抜きをし、２０１×３．０ｍｍの窓部を形成するとともに、外形切断により２３０×２０ｍｍの寸法とした。
【００７４】
次に、前記薄肉板用グリーンシートの微細孔形成部が、前記接着補助層付き剛性板用グリーンシートの前記窓部の中央部に配置されるように重ね合わせ、３０Ｋｇ／ｃｍ^２ 、８０℃、１分の条件下で熱圧着し、一体積層物とした。この一体積層物を１５００℃、３時間にて焼成し、更に、この焼成物を２ｍｍ厚の多孔質のアルミナ平板で挟み込み、１５００℃、５時間にて再焼成して反りを修正した。
【００７５】
表１に、薄肉板用グリーンシートのセラミック粉末粒子径（Ｄ_Ｌ ）、球相当径（Ｄ_ＢＥＴ ）、セラミック粉末占有率（Ａ）、セラミック粉末占有率と有機成分占有率（Ｂ）との和（Ａ＋Ｂ）、焼結途上温度（Ｔ_５０）、焼成収縮率（Ｆ）、引っ張り強度（σ）、破断時の伸び率（Δｌ・Ｓ／Ｔ）及び剛性板用グリーンシートの焼結途上温度（Ｔ_５０）、焼成収縮率（Ｆ）の測定値あるいは算出値を示す。又、薄肉板用グリーンシートと剛性板用グリーンシートの焼結途上温度の差の絶対値｜Ｔ｜、焼成収縮率の差の絶対値｜Ｆ｜も併記する。なお、セラミック粉末占有率及び有機成分占有率の算出において、ジルコニア粉末の理論密度は６．１ｇ／ｃｍ^３ 、有機物成分の理論密度は１．１ｇ／ｃｍ^３ とした。又、パンチングの際及び焼成後のクラック発生状況を示す。
【００７６】
【表１】

【００７７】
（実施例２〜１１） セラミック粉末粒子径（Ｄ_Ｌ ）、球相当径（Ｄ_ＢＥＴ ）、バインダーの添加量、ＤＯＰの添加量を変え、又、場合によっては分散剤としてソルビタン脂肪酸エステルを添加した以外は、実施例１と同様にしてセラミック部材を製造し、パンチングによる微細貫通孔形成の際、及び焼成過程におけるクラックの発生について調べた。なお、実施例１１においては、バインダーとして、三井東圧株式会社製のＳＡ−５４１（固形分）とＯＸＳＡ−２７２（固形分）を１２．０：１．０の重量比で混合したアクリル系樹脂を用いた。各種特性値及びクラック発生状況を表１に示す。
【００７８】
（比較例１〜９） セラミック粉末粒子径（Ｄ_Ｌ ）、球相当径（Ｄ_ＢＥＴ ）、バインダーの添加量、ＤＯＰの添加量を変え、又、場合によっては分散剤としてソルビタン脂肪酸エステルを添加した以外は、実施例１と同様にして薄肉板用グリーンシートを作製した。なお、比較例８においては、バインダーとして、新中村化学株式会社製のアクリル系樹脂、ＤＲ−１００１を用いた。
パンチングによる微細貫通孔形成の際にクラックを生じなかったものについては、実施例１と同様にしてセラミック部材を製造し、焼成過程におけるクラックの発生について調べた。なお、比較例１、２、５は薄肉板用グリーンシートと剛性板用グリーンシートの焼結途上温度の差の絶対値が５０℃を超え、比較例３及び４は両者の焼成収縮率差の絶対値が１．５％を超える。又、比較例６及び８は引っ張り強度σが１０ｋｇｆ／ｃｍ^２ 未満であり、比較例７、８及び９は伸び率Δｌ・Ｓ／Ｔが０．５ｍｍ^３ ／ｋｇｆ未満あるいは２５．０ｍｍ^３ ／ｋｇｆを超える。各種特性値及びクラック発生状況を表２に示す。
【００７９】
【表２】

【００８０】
比較例１〜５においては、パンチングにより微細貫通孔を形成する際の微細貫通孔間におけるクラックの発生は無かったものの、焼成過程において薄肉板の微細貫通孔間及び微細貫通孔の周辺にクラックが生じた。又、比較例６〜９においては、パンチングにより微細貫通孔を形成する際に微細貫通孔間にクラックが発生した。
【００８１】
一方、実施例においては、微細貫通孔の形成の際にも、焼成過程においてもクラックの発生は無かった。
【００８２】
又、上記の実施例及び比較例においては、薄肉板用グリーンシートに微細貫通孔を設けてから剛性板用グリーンシートに積層し、焼成を施しているが、実施例１〜１１及び比較例１〜９と同様に薄肉板用グリーンシート及び剛性板用グリーンシートを作製した後、一体積層物とした後にパンチングにより微細貫通孔を形成し、焼成した場合には、実施例１〜１１に相当するものにおいては、クラックの発生はなかったが、比較例１〜９に相当するものにおいてはクラックが発生した。
【００８３】
【発明の効果】
本発明においては、薄肉板用グリーンシートの引っ張り強度及び伸び率、並びに薄肉板用グリーンシートと剛性板用グリーンシートの焼結途上温度の差の絶対値及び焼成収縮率の差の絶対値を所定の値に制御してセラミック部材を製造する。これにより、薄肉板をより薄く形成してなおかつ、微細貫通孔の孔径及び孔間隔をより小さくしても、パンチングによる打ち抜きの際に微細貫通孔間及び微細貫通孔の周辺にクラックが発生することがない。又、焼成過程における剛性板用グリーンシートと薄肉板用グリーンシートの収縮特性を制御しているため、焼成過程における微細貫通孔間クラックの発生を防止できる。さらに、パンチングや一体積層品の取扱いの際に薄肉板グリーンシートに伸びや変形が生じず、さらには焼成の際の薄肉板のうねりを減少できるので、該セラミック部材の高密度化において微細貫通孔の位置精度の向上を図ることができる。
【図面の簡単な説明】
【図１】本発明の方法により製造されるセラミック部材の一例を示す（ａ）平面図、（ｂ）Ａ−Ａ断面図である。
【図２】本発明の方法により製造されるセラミック部材の他の例を示す（ａ）平面図、（ｂ）Ａ−Ａ断面図、（ｃ）Ｂ−Ｂ断面図である。
【図３】本発明の方法により製造されるセラミック部材のさらに他の例を示す（ａ）平面図、（ｂ）Ａ−Ａ断面図、（ｃ）Ｂ−Ｂ断面図である。
【図４】本発明の方法により製造されるセラミック部材のさらに他の例を示す（ａ）平面図、（ｂ）Ａ−Ａ断面図、（ｃ）Ｂ−Ｂ断面図である。
【図５】薄肉板用グリーンシートの破断時の伸び量及び破断時のテンションを測定する際のサンプルの一例を示す模式図である。
【図６】従来の製造方法により製造された薄肉板用グリーンシートにパンチングにより微細貫通孔を形成する際の薄肉板用グリーンシートの状態を示す模式図である。
【図７】薄肉板用グリーンシート又は剛性板用グリーンシートの焼成収縮カーブを示すグラフである。
【図８】微細貫通孔間隔ｄの説明図である。
【図９】本発明の方法により製造したセラミック部材を用いた電界シャッターの一例を示す（ａ）平面図、（ｂ）Ａ−Ａ断面図、（ｃ）Ｂ−Ｂ断面図である。
【図１０】本発明の方法により製造したセラミック部材を用いたイオン流制御ヘッドの一例を示す断面図である。
【図１１】本発明の方法により製造されるセラミック部材のさらに別の例を示す（ａ）平面図、（ｂ）Ａ−Ａ断面図、（ｃ）Ｂ−Ｂ断面図である。
【図１２】本発明の方法により製造されるセラミック部材のさらに別の例を示す（ａ）平面図、（ｂ）Ａ−Ａ断面図、（ｃ）Ｂ−Ｂ断面図である。
【図１３】微細貫通孔をチドリ配置した場合の微細貫通孔間隔ｄの説明図である。
【符号の説明】
１…微細貫通孔、２…セラミック部材、３…窓部、７…薄肉板、９…剛性板、１０…イオン流制御ヘッド、１１…ライン電極、１２…フィンガー電極、１３…金電極、１５…電界シャッター用電極、１９…誘電体ドラム、２１…誘電体薄板、３０…微細貫通孔を有する部分、３１…切り欠き部、３２…サンプル、３３…２つの切り欠き部の最短距離。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a ceramic member having a plurality of fine through holes.
[0002]
[Prior art]
A member formed by supporting a thin plate having a plurality of fine through holes with a rigid plate is used as a component such as an ion flow control head, a high-precision electric field shutter, an encoder, and a scale. By controlling the discharge of fine solid particles, light, and the like, position detection, recording, and the like are performed.
[0003]
Conventionally, as a material of such a member, a metal, a synthetic resin, or the like has been used. However, in recent years, ceramics are becoming mainstream due to demands for higher density, higher precision, and higher reliability. .
[0004]
In the above-mentioned ceramic member, the thin plate is supported by the rigid plate, as shown in FIG. 1, may be supported by different rigid plates 9 on both sides of the portion 30 having the fine through-holes 1 of the thin plate 7, As shown in FIGS. 2 and 3, the rigid plate 9 is provided with a window 3 and the thin plate 7 is fixed to the rigid plate 9 so that the portion 3 having the fine through holes 1 of the thin plate 7 covers the window 3. 9, the thin plate 7 may be supported from the periphery of the portion 3 having the fine through-holes 1. FIG. 4 shows a ceramic member 2 in which three layers of rigid plates 9 having different shapes of the window portions 3 are laminated and integrated with a thin plate 7 having fine through holes 1.
[0005]
The reason why the thin plate is supported by the rigid plate is to increase the rigidity of the ceramic member so that the thin plate becomes practical in manufacturing and use.
[0006]
A ceramic member formed by supporting a thin plate having a plurality of fine through-holes with a rigid plate is intended to improve the dimensional stability after firing after forming a green sheet for the thin plate and a green sheet for the rigid plate. It is manufactured by laminating a green sheet for a thin plate on a green sheet for a rigid plate to form an integrated laminate and firing. That is, since the thin plate has a plurality of fine through-holes, when it is fired alone, distortion is likely to occur due to shrinkage during firing. The fine through-holes are formed by punching before firing, but may be formed before laminating the green sheet for a thin plate to the green sheet for a rigid plate, or may be formed after forming an integrated laminate.
[0007]
For such ceramic members, in recent years, from the viewpoint of improving the passage resistance of gas, particulate solid, liquid, etc., and improving the uniformity of the electric field, the thinner plate has to be made thinner, and the fineness has been reduced from the viewpoint of higher density. There is a demand for making the hole diameters and intervals of the through holes smaller. Specifically, it is desired that the thickness of the thin plate after firing is 100 μm or less, preferably 50 μm or less, and the minimum value of the diameter and the minimum interval of the fine through holes after firing are both 150 μm or less. .
[0008]
[Problems to be solved by the invention]
However, in general, the strength of a ceramic green sheet decreases when it is made thin. Therefore, when a thin plate is made thinner, cracks or cracks are generated between the fine through holes when forming a fine through hole in a green sheet for a thin plate by punching. There is a problem that a defect that induces the generation occurs. Also, the step of laminating a green sheet for a thin plate to a green sheet for a rigid plate, and even during stress during firing, cracks are likely to occur, and furthermore, the above-mentioned defects may also develop into cracks during use. In many cases, there has been a problem that the reliability of the product is impaired. Further, when such cracks and defects occur, the inner wall of the fine through-hole becomes rough, and the passage resistance of gas, liquid and the like increases. Even if the distance between the fine through holes is made smaller, cracks and defects similar to those described above are likely to occur.
[0009]
On the other hand, in general, green sheets also have the property of being easily stretched when they are made thin.Thus, if the thin sheet is made thinner, the thin sheet green sheet elongates at the time of punching, handling, etc., and the positional accuracy of the fine through holes decreases. There was also a problem to do. As a result, there is a problem that defects such as cracks are easily generated between the fine holes.
[0010]
The present invention has been made in view of such circumstances, and an object of the present invention is to form a thin plate and make the formation interval of the fine through-holes smaller, so that the generation of cracks and the fine through-holes can be achieved. An object of the present invention is to provide a method of manufacturing a ceramic member which does not cause a decrease in positional accuracy of the ceramic member.
[0011]
[Means for Solving the Problems]
That is, according to the present invention, a thin plate having a plurality of fine through holes is supported on at least both sides of a portion where the fine through holes are formed by a rigid plate formed by integral firing, and the minimum value of the hole diameter is achieved. Is 150 μm or less, the thickness of the thin plate is 100 μm or less, and the minimum value of the hole interval is 150 μm or less, wherein the tensile strength σ of the thin sheet green sheet is 10 kgf / cm. ² Above, 200kgf / cm ² The elongation at break Δl (mm), the tension T at break (kgf), and the cross-sectional area S (mm) of the thin sheet green sheet ² ), The elongation percentage represented by Δl · S / T is 0.5 mm ³ / Kgf or more, 25.0 mm ³ / Kgf or less, and the sintering temperature T of the thin sheet green sheet and the rigid sheet green sheet ₅₀ The absolute value of the difference of 50 ° C. or less and the absolute value of the difference of the firing shrinkage F is 1.5% or less, and the thin sheet green sheet having a plurality of fine through holes formed by punching is replaced with a rigid sheet green sheet. And a method for producing a ceramic member which is laminated on a sheet and fired.
[0012]
According to the present invention, a thin plate having a plurality of fine through holes is supported by a rigid plate formed by integral firing on at least both sides of a portion where the fine through holes are formed, and has a minimum value of the hole diameter. Is 150 μm or less, the thickness of the thin plate is 100 μm or less, and the minimum value of the hole interval is 150 μm or less, wherein the tensile strength σ of the thin sheet green sheet is 10 kgf / cm. ² Above, 200kgf / cm ² The elongation at break Δl (mm), the tension T at break (kgf), and the cross-sectional area S (mm) of the thin sheet green sheet ² ), The elongation percentage represented by Δl · S / T is 0.5 mm ³ / Kgf or more, 25.0 mm ³ / Kgf or less, and the sintering temperature T of the thin sheet green sheet and the rigid sheet green sheet ₅₀ The absolute value of the difference in the firing shrinkage F is 1.5% or less, and the green sheet for a thin plate is laminated on the green sheet for a rigid plate to form an integrated laminate. A method of manufacturing a ceramic member is provided in which a plurality of fine through holes are formed in a green sheet for a thin plate by punching and then fired.
In the method for manufacturing a ceramic member, the thickness of the thin plate is desirably 50 μm or less.
[0013]
In the above-described method for manufacturing a ceramic member, the sintering temperature T of the green sheet for a thin plate and the green sheet for a rigid plate is determined. ₅₀ Is preferably 20 ° C. or less.
[0014]
In the above method for producing a ceramic member, the particle diameter D of the ceramic powder constituting the thin sheet green sheet _L Is not less than 0.1 μm and not more than 1.2 μm, and the equivalent sphere diameter D calculated from the BET specific surface area of the ceramic powder is _BET Is 0.02 μm or more and 0.5 μm or less, and the ceramic powder occupancy A of the thin sheet green sheet is 40% or more and 55% or less. The sum is preferably 80% or more and 98% or less.
[0015]
Further, in the above-described method for manufacturing a ceramic member, the thin plate preferably contains partially stabilized zirconia as a main component, and its crystal particle diameter is preferably 2 μm or less. The partially stabilized zirconia is preferably partially stabilized with 2 to 6 mol% of yttrium oxide.
[0016]
Further, in the above-described method for manufacturing a ceramic member, the maximum width w (mm) of the width of the portion of the thin plate formed with the fine through-holes, which is supported by the rigid plates on both sides, and the distance between the fine through-holes. d (μm) is given by the following equation (a),
(B) w ≧ 10 / d
It is preferable to have a relationship represented by
[0017]
Here, the hole diameter of the fine through-hole refers to the diameter when the shape of the fine through-hole is a circle, the long side when the shape is a rectangle, the long diameter when the shape is an ellipse, and the longest diagonal length when the shape is a polygon. As the shape of the fine through-hole, the above-described shapes and shapes obtained by combining them are adopted. The diameter of the fine through-hole is an average of the measured value on the front surface and the measured value on the back surface of the thin ceramic plate.
Further, the hole interval d between the fine through holes is the thickness of the shortest wall between the adjacent fine through holes as shown in FIG. 8 or FIG.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
In the present invention, by controlling various characteristic values of the green sheet used in the production of the ceramic member, a thin plate is formed thinner, and cracks do not occur even if the formation interval of the fine through holes is made smaller. Further, it is possible to manufacture a ceramic member in which the positional accuracy of the fine through-hole is high and the smoothness of the inner wall portion of the hole is improved.
[0019]
In the method for manufacturing a ceramic member of the present invention, the minimum value of the hole diameter of the fine through hole is 150 μm or less, the thickness of the thin plate is 100 μm or less, and the minimum value of the space between the fine through holes is 150 μm or less. I have.
By setting the minimum value of the diameter of the fine through-holes to 150 μm or less and the minimum value of the hole interval of the fine through-holes to 150 μm or less, it is possible to respond to high density and high precision. Further, by setting the thickness of the thin plate to 100 μm or less, it is possible to prevent hole clogging and burrs at the time of punching and punching, and to further reduce resistance when powder or the like is passed through the fine through-hole.
In the method for producing a ceramic member according to the present invention, the tensile strength σ of the thin sheet green sheet is 10 kgf / cm. ² Above, 200kgf / cm ² The elongation at break Δl (mm), the tension T at break (kgf), and the cross-sectional area S (mm) of the thin sheet green sheet ² ), The value of elongation expressed by Δl · S / T is 0.5 mm ³ / Kgf or more, 25.0 mm ³ / Kgf or less. The sintering temperature T of the green sheet for the thin plate and the green sheet for the rigid plate ₅₀ The absolute value of the difference in firing shrinkage F is 1.5% or less.
[0020]
The elongation Δl (mm) at break and the tension T (kgf) at break of the thin sheet green sheet are measured with a rheometer at a pulling speed of 2 cm / min. As shown in FIG. 5, a sample 32 in which a rectangular thin sheet having a width of 19 mm and a length of 30 mm and a notch 31 on a semicircle of 4 mmR is provided at the center of two long sides, as shown in FIG. It is done. Also, the cross-sectional area S (mm ² )), The cross-sectional area of the portion where the width of the sample is minimized by forming the notch 31 is used, and the product of the shortest distance 33 between the two notches 31 and the thickness (mm) of the thin sheet green sheet is used. Is represented by Tensile strength σ (kgf / cm ² ) Is the cross-sectional area S (mm) of the thin sheet green sheet. ² ) And the value of the tension T (kgf) at the time of breaking are calculated by the formula (T / S) × 100.
[0021]
The value of the tensile strength σ is 10 kgf / cm ² Above, 200kgf / cm ² The following is 10 kgf / cm ² If it is less than 1, cracks may occur between the fine through holes when a plurality of fine through holes are formed by punching, and more preferably σ ≧ 20 (kgf / cm ² ), More preferably σ ≧ 50 (kgf / cm ² ). 200kgf / cm ² In the case where the value exceeds the above, the mold pin may be damaged during punching, and the surface condition of the inner wall portion of the hole may become rough or a defect that induces a crack may easily occur. More preferably, σ ≦ 100 kgf / cm ² It is.
[0022]
Further, the value of the elongation percentage of the green sheet for a thin plate represented by Δl · S / T is 0.5 mm ³ / Kgf or more, 25.0 mm ³ / Kgf or less is 0.5 mm ³ If it is less than / kgf, cracks are likely to occur around the fine through holes or between the holes during punching. Also, 25.0mm ³ / Kgf, the thin sheet green sheet 32 bends in the direction of punching indicated by the arrow at the time of punching, as shown in FIG. Unevenness occurs around the hole. Further, since the thin sheet green sheet is likely to shake during punching, cracks may be generated between the fine through holes or defects may be generated around the fine through holes or on the inner wall, and cracks may occur during the firing process. In addition, there is also a disadvantage that the positional accuracy of the fine through-hole is reduced.
[0023]
The above elongation is 13.0 mm. ³ / Kgf or less, more preferably 5.0 mm ³ / Kgf or less, 1.0mm ³ / Kgf or more.
[0024]
Further, the firing shrinkage rate F refers to the shrinkage rate of the length in the plane direction when firing the green sheet for a thin plate or the green sheet for a rigid plate alone at the same temperature as when firing them integrally. %) And the sintering temperature T ₅₀ The term “the temperature at which the firing shrinkage rate F reaches 50% in the firing process” is a measure of the sintering rate (the state of shrinkage progressing during sintering).
[0025]
The firing shrinkage F is, for example, that a sample of 10.0 × 10.0 mm (square) is fired not in the thickness direction but in the main surface direction of the green sheet with a firing profile similar to that of the present ceramic member, before and after firing. Is calculated from the average of the lengths of the four sides of the green sheet of {circle around (1)}, {(length before firing−length after firing) / length before firing} × 100 (%). The shrinkage ratio data in the thickness direction of the green sheet is ignored.
[0026]
The sintering temperature T ₅₀ For example, a sample of 10.0 × 10.0 mm is considered to be located on both sides of the sintering temperature in the firing shrinkage curve shown in FIG. And firing at Y, shrinkage rate F at each temperature _X And F _Y After calculating the following approximate expression,

Is calculated.
[0027]
In order to prevent the occurrence of cracks during firing, it is preferable that the firing shrinkage curves of the thin sheet green sheet and the rigid sheet green sheet are close to each other. ₅₀ It is required that the absolute value of the difference between the two is 50 ° C. or less and the absolute value of the difference in the firing shrinkage F is 1.5% or less, and more preferably 20 ° C. or less and 1.0% or less, respectively. .
[0028]
Sintering temperature T ₅₀ When the absolute value of the difference of the difference exceeds 50 ° C. or the absolute value of the difference of the firing shrinkage ratio F exceeds 1.5%, cracks are easily generated between the fine through holes due to the stress during firing, In addition, wrinkles and dents are likely to occur in the thin plate.
[0029]
The fine through-hole may be formed before laminating the green sheet for the thin plate to the green sheet for the rigid plate, or may be formed after forming an integrated laminate, but it is better to form after forming the integrated laminate, It is preferable because the work is easy, the green sheet for a thin plate does not wrinkle, and the positional and dimensional accuracy of the fine through-holes is the same.
[0030]
Unlike the processing of a fired substrate, the formation of fine through-holes by punching not only cannot cut the inside of the grains, but also it is difficult to cut between the aggregated particles of the green sheet. Therefore, when the particle diameter of the powder is large, the processed surface cannot be formed with high accuracy, the smoothness of the processed surface is deteriorated, and problems such as generation of burrs occur.
Therefore, in the method for manufacturing a ceramic member of the present invention, the particle diameter D of the ceramic powder constituting the green sheet for a thin plate _L Is preferably 0.1 μm or more and 1.2 μm or less, and the equivalent sphere diameter D calculated from the BET specific surface area of the ceramic powder _BET Is preferably 0.02 μm or more and 0.5 μm or less. By setting the powder particle size to the above value, there is also an advantage that the elongation of the green sheet during handling such as processing of a fine through-hole can be effectively reduced.
[0031]
The average particle diameter of the powder is measured, for example, by diluting the slurry before green sheet molding with the solvent used for the slurry, and then using a laser diffraction particle size analyzer LA-700 manufactured by Horiba.
[0032]
Ball equivalent diameter D _BET (Μm) is obtained from the measured value of the BET specific surface area, _BET = 6 / ρS (where ρ is the theoretical powder density (g / cm ³ ), S is the powder BET specific surface area value (m ² / G). ). Further, the BET specific surface area value is measured using a sample that has been subjected to a heat treatment at 500 ° C. for 2 hours in order to remove organic components such as a binder, a plasticizer, and a dispersant in a green sheet for a thin plate.
[0033]
Powder particle size D _L Is less than 0.1 μm, or equivalent spherical diameter D _BET Is less than 0.02 μm, it is difficult to produce a homogeneous slurry, and cracks occur in the green sheet, resulting in a decrease in the strength of the green sheet. On the other hand, the powder particle size D _L Exceeds 1.2 μm, or the sphere equivalent diameter D _BET Exceeds 0.5 μm, the inner walls of the fine through-holes have irregularities, the shapes of the through-holes become irregular, and the passage resistance of gas, liquid, fine solid particles and the like increases. In addition, cracks are likely to occur around the inner wall of the fine through hole.
[0034]
Further, the ceramic powder occupancy A of the thin sheet green sheet is set to 40% or more and 55% or less, and the sum of the ceramic powder occupancy A and the organic component occupancy B is set to 80% or more and 98% or less. This is preferable from the viewpoint of improving the processing accuracy of the fine through-hole, improving the smoothness of the processed surface, reducing the occurrence of rags, and reducing the elongation of the green sheet.
[0035]
The ceramic powder occupancy A is given by the formula: GD × [a / (a + b)] × 1 / ρ _ce Where a is part by weight of the ceramic powder in the green sheet, b is part by weight of the organic component in the green sheet (b = Σb _i ), GD is the green density of the green sheet (g / cm ³ ), Ρ _ce Is the theoretical density of the ceramic powder (g / cm ³ ) Respectively.
[0036]
The organic component refers to a binder, a plasticizer, a dispersant, and the like, and the organic component occupancy B is represented by the formula: GD × Σ ｛[b _i / (A + b)] × 1 / ρ _i ｝, Where b _i Is the parts by weight of each organic component in the green sheet, ρ _i Is the theoretical density of each organic component (g / cm ³ ) Respectively.
[0037]
When the ceramic powder occupation ratio A is less than 40%, the variance of the firing shrinkage F of the thin sheet green sheet becomes large, resulting in a decrease in dimensional accuracy and a decrease in strength of the fired thin sheet. is there. When the ceramic powder occupation ratio A exceeds 55%, the distance between the powder particles in the thin sheet green sheet is short, so that it is difficult to form a fine through hole (punching) or the binder removal property during firing is low. In some cases, cracks or defects may occur between the fine holes due to deterioration.
[0038]
On the other hand, when the sum of the ceramic powder occupancy A and the organic component occupancy B is less than 80%, the elongation of the thin sheet green sheet increases and the tensile strength decreases. Also, when it exceeds 98%, the elongation percentage of the thin sheet green sheet is increased, and the lamination property with the rigid sheet green sheet is deteriorated, and integration becomes difficult. As a result, when the content exceeds 98% or less than 80%, the shapes of the fine through holes may be irregular, or cracks may be generated around the fine through holes.
[0039]
In the present invention, alumina, zirconia, etc. can be used for the thin plate, but the strength, toughness and abrasion resistance are imparted to the thin plate, and cracks occur between the fine through holes due to the stress during firing. From the viewpoint of preventing the above, it is preferable that partially stabilized zirconia is used as a main component. Further, since the partially stabilized zirconia has a smaller coefficient of thermal expansion than metal, it is possible to improve the hole position accuracy under a high temperature environment. Furthermore, since partially stabilized zirconia is excellent in corrosion resistance, abrasion resistance, and heat resistance, the applicable range of temperature and medium can be widened.
[0040]
The crystal grain size of the partially stabilized zirconia is preferably 2 μm or less, more preferably 1 μm or less, from the viewpoint of improving the surface smoothness and the strength of the thin plate.
[0041]
Further, the partially stabilized zirconia is preferably partially stabilized with 2 to 6 mol%, preferably 2.5 to 4.0 mol% of yttrium oxide. This is to improve the strength and wear resistance of the thin plate.
[0042]
The crystal phase of partially stabilized zirconia used for thin plates is mainly tetragonal, or a mixed crystal consisting of at least two or more crystal phases of cubic, tetragonal and monoclinic. A material containing zirconia as a main component is preferably used. Among them, only a tetragonal crystal or a mixed crystal of a tetragonal crystal and a cubic crystal is most desirable. This is because strength and toughness are excellent. Also, those containing 10% by weight or less of alumina as an auxiliary agent are preferably employed for improving strength. Further, by controlling the alumina content, it is possible to freely control the progress of sintering of the green sheet for a thin plate and the green sheet for a rigid plate.
[0043]
Further, in the present invention, as shown in FIG. 8, the maximum value w (mm) of the width in the lateral direction of the portion 30 of the thin plate 7 in which the fine through-holes 1 are formed, supported by the rigid plates 9 on both sides. ) And the distance d (μm) between the fine through-holes 1 are given by the following equation (A):
(B) w ≧ 10 / d
It is preferable to have a relationship represented by the following formula, but it is more preferable that w ≧ 25 / d, and it is even more preferable that w ≧ 50 / d. In the case of W <10 / d, cracks are likely to be generated between the fine through holes and the periphery thereof due to the stress generated during firing. If the maximum value w of the width in the lateral direction exceeds 10 mm, problems such as a decrease in the handleability of the green laminate and a decrease in the strength and flatness of the thin plate are unpreferable.
[0044]
In the ceramic member manufactured by the method of the present invention, the total thickness of the rigid plate is preferably 50 μm or more, more preferably 80 μm or more. If the thickness is less than 50 μm, the rigidity of the ceramic member is insufficient, which is not preferable.
Further, the rigid plate may be used not only to give the ceramic member a certain rigidity but also to have a function. For example, an electrode is formed on a rigid plate, a through-hole wiring or the like is provided in the rigid plate to form a three-dimensional wiring, and a chamber for storing liquid, solid fine particles, and the like is formed in the rigid plate. Further, the rigid plate may have a single layer or a plurality of layers. In the case of a plurality of layers, not all layers need to have the same shape, and each layer may have a different function.
[0045]
Further, the thickness (total thickness) of the rigid plate is preferably larger than the thickness (total thickness) of the thin plate. If the rigid plate is thinner than the thin plate, the dimensional stability of the fired ceramic member is reduced. On the other hand, when the total thickness of the rigid plate exceeds 10 times the total thickness of the thin plate, the stress generated on the thin plate at the time of firing becomes large, and cracks are easily generated between the fine holes and the periphery thereof. And wrinkles and dents are likely to occur on thin plates. Therefore, the total thickness of the rigid plate is larger than the total thickness of the thin plate, and more preferably less than 5 times the total thickness of the thin plate.
[0046]
The fired thickness of the thin plate (in the case of a plurality of layers, the total thickness thereof) is generally 100 μm or less, preferably 50 μm or less, more preferably 30 μm or less. By making it thinner, it is possible to prevent hole clogging by improving the removability of green sheet scraps during punching of the die / NC punching, to prevent pin breakage and to prevent burrs on the punching surface. Shape accuracy can be improved (variation in hole diameter on the front and back of the sheet can be reduced). In addition, when powder, liquid, fine particle solid, and the like are allowed to pass through the fine through-holes by making them thin, the passage resistance can be reduced. On the other hand, if the thickness of the thin plate is greater than 100 μm, the formability of the fine through-holes deteriorates and the above-mentioned passage resistance increases, which is not preferable. In addition, the thin plate may have a single layer or a plurality of layers.
The rigidity of the rigid plate is not merely higher as the rigidity is higher, but it is necessary to give the ceramic member an appropriate rigidity. That is, for example, when a drum or the like is used in contact with a thin plate made of a ceramic member, it is important that the rigid plate and the thin plate have an appropriate difference in rigidity in order to improve adhesion.
[0047]
The minimum value (after firing) of the interval between the fine through holes provided in the thin plate is required to be 150 μm or less, preferably 100 μm or less, and more preferably 70 μm or less from the viewpoint of coping with high density. . By employing the manufacturing method of the present invention, the distance between the fine through holes can be set to the above value without causing cracks in the thin plate.
[0048]
Further, the minimum value of the diameter of the fine through-hole (after firing) needs to be 150 μm or less, preferably 100 μm or less, and more preferably 70 μm or less in order to respond to high density and high precision. preferable.
The relationship (dimension after firing) between the thickness t (mm) of the thin plate, the minimum value h (μm) of the plurality of fine through holes formed in the portion of the thin plate, and the interval d (mm) is expressed by the following formula ( It is preferable to satisfy the relationship of b).
[0049]
(Equation 1)

[0050]
The relationship (dimension after firing) between the thickness t (mm) of the thin plate, the minimum value h (μm) of the plurality of fine through holes formed in the thin plate portion, and the interval d (mm) is as follows. It is more preferable to satisfy the relationship of formula (c).
[0051]
(Equation 2)

[0052]
If the formula (b) is not satisfied, cracks between holes are likely to occur in the process of forming fine through holes by punching and firing.
[0053]
Also, as shown in FIGS. 1 and 2, forming a plurality of fine through holes on a plurality of straight lines as shown in FIGS. 3, 4, 9, 11, and 12 than forming them on a straight line, This is a preferred embodiment in that the value on the left side of the above formula (b) is set to be large, cracks between holes can be prevented, and high densification as the object of the present application can be achieved.
[0054]
The relationship (dimension after firing) between the thickness t (μm) of the thin plate and the minimum value h (μm) of the plurality of fine through holes formed in the thin plate portion is expressed by the following formula (d).
(2) t / h ≦ 10.0
It is desirable to satisfy
(E) t / h ≦ 4.0
It is more desirable to satisfy the following.
If the formula (d) is not satisfied, the resistance when passing particles, liquids, and the like through the fine through-holes increases, and the function of the ceramic member cannot be sufficiently exhibited.
[0055]
Further, from the viewpoint of hole forming properties when forming fine through holes by punching, it is preferable that t / h ≦ 3.0, and more preferable that t / h ≦ 1.0. When t / h> 3.0, punching residue remains inside or around the fine through-hole at the time of punching, cracks are easily generated around and between the holes, and the punching pin is easily damaged. Is not preferred.
On the other hand, in the case where gas, liquid, fine solid particles, and the like are allowed to pass through the fine through-holes, t / h ≧ 0.1 is preferable, and t / h ≧ 0.4 in order to make these passing objects have directionality. Is more preferred.
[0056]
The relationship between the maximum value w (mm) of the width in the short direction of the portion of the thin plate having the fine through-holes supported by the rigid plate on both sides and the thickness t (μm) of the thin plate is It is preferable that the following formula (f) is satisfied, and it is more preferable that the following formula (g) is satisfied.
(F) t / w ≧ 5.0
(G) t / w ≧ 8.0
In the case of t / w <5.0, the handleability of the green laminate, the strength of the thin plate, the flatness of the thin plate, the positional accuracy of the fine through-holes, etc. decrease, which is not preferable.
[0057]
In the present invention, the production of the green sheet for the thin plate and the green sheet for the rigid plate is specifically performed as follows.
The slurry or paste for preparing a green sheet is prepared by blending an appropriate binder, a plasticizer, a dispersant, a sintering aid, an organic solvent, and the like with the ceramic powder, as in the related art. The above slurry or paste is formed into a green sheet having a predetermined thickness according to a conventionally known method such as a doctor blade method, a calendar method, a printing method, a reverse roll coater method, and the like. The green sheet thus obtained is subjected to processing such as cutting, cutting, punching, formation of fine through-holes or the like, or a plurality of green sheets are laminated as necessary, and integrally formed by thermocompression bonding or the like. And a molded product having a predetermined shape and thickness. The fine through-hole is formed by die / NC punching. The formation of the fine through-holes may be performed in the state of the green sheet alone or after the lamination.
[0058]
In the case of using a material mainly composed of partially stabilized zirconia as the material of the thin plate, an auxiliary agent of 30% by weight or less based on the partially stabilized zirconia powder, for example, alumina, silica, transition metal oxide, Clay, mullite, cordierite, spinel, titania and the like and mixtures thereof may be added.
[0059]
A firing operation is performed on such a molded product, whereby the laminate is formed into an integrated sintered body. The firing temperature at this time is generally about 1200 to 1700 ° C., preferably about 1300 to 1600 ° C. In applications such as high-precision electric field shutters and scales, when a thin plate having fine through holes formed in the ceramic member is used, for example, when a paper, a drum, or the like is brought into contact with the thin plate, the contact object is brought into close contact with the thin plate. This is advantageously used in terms of preventing misalignment, improving dischargeability of gas, liquid, solid fine particles, and the like, and improving the quality of recording associated therewith.
[0060]
For this reason, the following warp correction step, which aims not only to flatten the entire ceramic member but also to flatten and smooth the thin plate, can be advantageously employed.
The warp correcting step is to correct the warp by placing a smooth ceramic weight or the like and refiring at a temperature near the firing temperature when the sintered laminate is warped.
[0061]
For the same reason, fine undulation and thinning of thin plates, removal of surface projections and deposits (including the same and different materials) on thin plates and rigid plates, and reduction of surface roughness Ra (center line average roughness) 0.5 μm or less, preferably 0.2 μm or less) and for the purpose of improving smoothness, correcting the shape of the ceramic member, etc., after sintering or warpage correction, etching the surface of the thin plate and rigid plate of the ceramic member by etching, Processing and processing such as polishing and grinding are also preferably used.
Further, for the purpose of removing the protrusions and attached matter on the inner wall of the fine through-hole and around the hole, it is also preferable to use a thin green sheet or a thin plate in which the fine through-hole is formed by processing or processing by laser or etching.
[0062]
Further, the surface of the thin plate and the rigid plate of the ceramic member formed of the partially stabilized zirconia material is subjected to processing such as polishing and grinding, and then, if necessary, heat treatment is applied to thereby intend the crystal structure of the surface. It is also possible to partially change the shape, modify the shape of the ceramic member, or bend it, and it is preferably used.
[0063]
Providing an adhesion auxiliary layer between the green sheets is also advantageously employed. By providing the adhesion auxiliary layer, the lamination pressure can be reduced. Lamination pressure is 100Kg / cm ² The following is preferable, and 40 kg / cm ² The following is more preferred. When the laminating pressure is large, the gap between the fine through holes is narrow, so that cracks are easily generated between the holes and the peripheral portion thereof. In addition, the integrated laminate may be deformed and a predetermined shape may not be obtained, or the positional accuracy of the fine through-hole may be reduced.
As a material for the adhesion auxiliary layer, a slurry, a paste, a binder, a plasticizer, a solvent, a mixture thereof, or the like for forming a green sheet is used. The adhesion auxiliary layer is preferably formed by coating, printing, spraying or the like.
[0064]
FIG. 9 shows an example of an electric field shutter in which a gold electrode 13 is formed on the upper surface of a thin plate of a ceramic member manufactured by the method of the present invention.
[0065]
Also, as shown in FIG. 10, an electric field shutter electrode 15 (gold electrode, 0.3 μm in thickness) is formed on the upper surface of the ceramic member manufactured in this manner, and a line is formed on the front and back of the dielectric thin plate 21. The ion flow control head 10 can be configured by combining the ion generating source provided with the electrodes 11 and the finger electrodes 12 and the dielectric drum 19.
[0066]
Needless to say, the present invention is not limited to the ion flow control head, but may be any other appropriate member requiring a member having a fine through hole in a thin portion. For example, the ceramic member obtained by the present invention can be preferably used for a filter, a screen (sieving), a filtering member and the like.
Advantages when the ceramic member obtained by the present invention is applied to a filter, a screen (sieving), and a filtering member will be described below.
(1) Since this member is made of ceramic, it has excellent wear resistance.
(2) Since the thickness of the thin plate on which the fine through holes are formed is reduced to 100 μm or less, the filtration resistance can be reduced.
(3) Since the structure is such that the thin plate is supported by the rigid plate, it is hardly damaged.
(4) Since the density of the openings (fine through holes) can be increased, the filtration area efficiency can be increased.
[0067]
【Example】
Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples.
(Example 1) A ceramic member was manufactured by the method of the present invention, and the occurrence of cracks in forming a fine through-hole by punching and in the firing process was examined.
[0068]
First, a green sheet for a thin plate was produced as follows.
Y ₂ O ₃ 3 mol%, Al ₂ O ₃ 100 parts by weight of partially stabilized zirconia powder containing 0.1 mol%, 12.3 parts by weight of polyvinyl butyral resin (PVB) (BM-2, manufactured by Sekisui Chemical Co., Ltd.) (binder), 12.3 parts by weight of DOP (plasticizer) , Xylene (solvent) and 50 parts by weight of 1-butanol (solvent) were mixed in a ball mill for 30 hours to prepare a green sheet molding slurry. The slurry was subjected to a vacuum defoaming treatment to adjust the viscosity to 4000 cps, and then a green sheet for a thin plate was formed by a doctor blade device so that the thickness after firing was 30 μm.
[0069]
Using a NC punching machine, fine through-holes having a diameter of 40 μm were formed in the green sheet for a thin plate at a hole interval of 36.7 μm, and the outer shape was cut to a size of 230 × 20 mm. The fine through holes were formed in four rows, and the number thereof was 708 per row, that is, 2832 in total.
[0070]
Next, a green sheet for a rigid plate was produced as follows.
The slurry for forming the green sheet was prepared in the same manner as in the case of the green sheet for the thin plate. ₅₀ In order to adjust the firing shrinkage F, the particle diameter of the partially stabilized zirconia powder and Al ₂ O ₃ The content, the mixing time in a ball mill, the organic composition, etc. were changed.
[0071]
Using the above slurry, a green sheet for a rigid plate was formed so that the thickness after firing was 100 μm by a doctor blade device.
[0072]
Next, the formation of the adhesion auxiliary layer on the green sheet for the rigid plate was performed as follows. Y ₂ O ₃ 3 mol%, Al ₂ O ₃ 100 parts by weight of partially stabilized zirconia powder containing 0.1 mol%, 13 parts by weight of PVB (BM-2, manufactured by Sekisui Chemical Co., Ltd.) (binder), 5 parts by weight of DOP (plasticizer), and appropriate amount of 2-ethylhexanol (solvent) Was kneaded with a triroll mill to prepare a paste for an adhesion auxiliary layer having a viscosity of 20,000 cps. This paste was printed on a green sheet for a rigid plate by using a screen printing apparatus to form an adhesion auxiliary layer having a thickness of 6 μm after drying.
[0073]
The green sheet for a rigid plate with an adhesion auxiliary layer obtained in this manner was cut and punched to form a window of 201 × 3.0 mm, and was cut to an external dimensions of 230 × 20 mm.
[0074]
Next, the thin sheet green sheet is overlapped so that the fine hole forming portion of the thin sheet green sheet is disposed at the center of the window of the rigid sheet green sheet with the adhesion auxiliary layer, and 30 kg / cm. ² At 80 ° C. for 1 minute to form an integrated laminate. This integrated laminate was fired at 1500 ° C. for 3 hours, and the fired product was sandwiched between porous alumina flat plates having a thickness of 2 mm and fired again at 1500 ° C. for 5 hours to correct the warpage.
[0075]
Table 1 shows the ceramic powder particle size (D) of the green sheet for thin plates. _L ), Ball equivalent diameter (D _BET ), Ceramic powder occupancy (A), sum of ceramic powder occupancy and organic component occupancy (B) (A + B), sintering temperature (T ₅₀ ), Firing shrinkage (F), tensile strength (σ), elongation at break (Δl · S / T), and sintering temperature (T) of the green sheet for rigid plate ₅₀ ) And the measured or calculated values of the firing shrinkage (F). The absolute value | T | of the difference between the sintering temperatures of the green sheet for the thin plate and the green sheet for the rigid plate and the absolute value | F | of the difference in the firing shrinkage are also shown. In calculating the ceramic powder occupancy and the organic component occupancy, the theoretical density of the zirconia powder was 6.1 g / cm. ³ The theoretical density of the organic component is 1.1 g / cm ³ And Also, the occurrence of cracks during punching and after firing is shown.
[0076]
[Table 1]

[0077]
(Examples 2 to 11) Ceramic powder particle diameter (D _L ), Ball equivalent diameter (D _BET ), The amount of the binder, the amount of the DOP were changed, and in some cases, the sorbitan fatty acid ester was added as a dispersant. The occurrence of cracks during and during the firing process was examined. In Example 11, as a binder, an acrylic resin in which SA-541 (solid content) and OXSA-272 (solid content) manufactured by Mitsui Toatsu Co., Ltd. were mixed at a weight ratio of 12.0: 1.0. Was used. Table 1 shows various characteristic values and crack occurrence states.
[0078]
(Comparative Examples 1 to 9) Ceramic powder particle diameter (D _L ), Ball equivalent diameter (D _BET ), The amount of the binder and the amount of the DOP were changed, and in some cases, a sorbitan fatty acid ester was added as a dispersant. In Comparative Example 8, an acrylic resin manufactured by Shin-Nakamura Chemical Co., Ltd., DR-1001, was used as a binder.
In the case where no crack was generated during the formation of the fine through hole by punching, a ceramic member was manufactured in the same manner as in Example 1, and the occurrence of cracks in the firing process was examined. In Comparative Examples 1, 2, and 5, the absolute value of the difference in the sintering temperature between the thin sheet green sheet and the rigid sheet green sheet exceeded 50 ° C., and Comparative Examples 3 and 4 showed the difference in firing shrinkage rate between the two. Absolute value exceeds 1.5%. In Comparative Examples 6 and 8, the tensile strength σ was 10 kgf / cm. ² Comparative Examples 7, 8 and 9 have an elongation Δl · S / T of 0.5 mm ³ / Kgf or 25.0 mm ³ / Kgf. Table 2 shows various characteristic values and the state of occurrence of cracks.
[0079]
[Table 2]

[0080]
In Comparative Examples 1 to 5, cracks were not generated between the fine through holes when forming the fine through holes by punching, but cracks were generated between the fine through holes of the thin plate and around the fine through holes in the firing process. occured. In Comparative Examples 6 to 9, cracks occurred between the fine through holes when forming the fine through holes by punching.
[0081]
On the other hand, in the examples, no cracks were generated during the formation of the fine through-holes and during the firing process.
[0082]
Further, in the above Examples and Comparative Examples, the thin sheet green sheet is provided with fine through holes, then laminated on the rigid plate green sheet, and baked. However, Examples 1 to 11 and Comparative Example 1 When the green sheet for a thin plate and the green sheet for a rigid plate were prepared in the same manner as in Examples 9 to 9, an integrated laminate was formed, and then fine through-holes were formed by punching, followed by firing. No cracks occurred in the samples, but cracks occurred in the samples corresponding to Comparative Examples 1 to 9.
[0083]
【The invention's effect】
In the present invention, the tensile strength and elongation of the thin sheet green sheet, the absolute value of the difference between the sintering temperature of the thin sheet green sheet and the rigid sheet green sheet, and the absolute value of the difference in firing shrinkage are determined. To produce a ceramic member. Thereby, even if the thin plate is formed thinner and the hole diameter and the hole interval of the fine through-holes are made smaller, cracks are generated between the fine through-holes and around the fine through-holes at the time of punching by punching. There is no. Further, since the shrinkage characteristics of the green sheet for the rigid plate and the green sheet for the thin plate in the firing process are controlled, it is possible to prevent the occurrence of cracks between fine through holes in the firing process. In addition, the thin sheet green sheet does not expand or deform during punching or handling of an integrated laminated product, and furthermore, the swell of the thin sheet during firing can be reduced. Can be improved in position accuracy.
[Brief description of the drawings]
FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along the line AA, showing an example of a ceramic member manufactured by the method of the present invention.
2A is a plan view, FIG. 2B is a cross-sectional view along AA, and FIG. 2C is a cross-sectional view along BB, showing another example of a ceramic member manufactured by the method of the present invention.
3A is a plan view, FIG. 3B is a cross-sectional view taken along line AA, and FIG. 3C is a cross-sectional view taken along line BB, showing still another example of a ceramic member manufactured by the method of the present invention.
4A is a plan view, FIG. 4B is a cross-sectional view along AA, and FIG. 4C is a cross-sectional view along BB, showing still another example of a ceramic member manufactured by the method of the present invention.
FIG. 5 is a schematic diagram showing an example of a sample when measuring the elongation at break and the tension at break of a thin sheet green sheet.
FIG. 6 is a schematic diagram showing a state of a thin sheet green sheet when fine through holes are formed by punching in a thin sheet green sheet manufactured by a conventional manufacturing method.
FIG. 7 is a graph showing a firing shrinkage curve of a green sheet for a thin plate or a green sheet for a rigid plate.
FIG. 8 is an explanatory diagram of a fine through hole interval d.
9A is a plan view, FIG. 9B is a cross-sectional view taken along line AA, and FIG. 9C is a cross-sectional view taken along line BB showing an example of an electric field shutter using a ceramic member manufactured by the method of the present invention.
FIG. 10 is a sectional view showing an example of an ion flow control head using a ceramic member manufactured by the method of the present invention.
11A is a plan view, FIG. 11B is a cross-sectional view taken along line AA, and FIG. 11C is a cross-sectional view taken along line BB, showing still another example of a ceramic member manufactured by the method of the present invention.
12A is a plan view, FIG. 12B is a cross-sectional view taken along line AA, and FIG. 12C is a cross-sectional view taken along line BB, showing still another example of a ceramic member manufactured by the method of the present invention.
FIG. 13 is an explanatory diagram of a fine through-hole interval d when the fine through-holes are arranged in a staggered manner.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Fine through-hole, 2 ... Ceramic member, 3 ... Window part, 7 ... Thin plate, 9 ... Rigid plate, 10 ... Ion flow control head, 11 ... Line electrode, 12 ... Finger electrode, 13 ... Gold electrode, 15 ... Electrode for electric field shutter, 19: dielectric drum, 21: dielectric thin plate, 30: portion having fine through hole, 31: notch, 32: sample, 33: shortest distance between two notches.

Claims (9)

A thin plate having a plurality of fine through holes is supported by a rigid plate formed by integral firing on at least both sides of a portion where the fine through holes are formed, and the minimum value of the hole diameter is 150 μm or less, A method for producing a ceramic member having a thickness of 100 μm or less and a minimum value of a hole interval of 150 μm or less,
The tensile strength of the green sheet for the thin plate σ is 10 kgf / cm ² or more and 200 kgf / cm ² or less,
From the elongation amount Δl (mm) at break of the thin sheet green sheet, the tension T (kgf) at break, and the cross-sectional area S (mm ² ), the elongation percentage represented by Δl · S / T is 0. .5mm ³ / kgf or more, or less 25.0 mm ³ / kgf, and,
The absolute value of the difference between the sintering developing temperature T ₅₀ of the green sheet for thin walled plate green sheet and the rigid plate 50 ° C. or less, the absolute value of the difference between the firing shrinkage rate F is 1.5% or less,
A method for manufacturing a ceramic member, comprising: laminating a green sheet for a thin plate having a plurality of fine through holes formed by punching on a green sheet for a rigid plate, forming an integrated laminate, and firing. A thin plate having a plurality of fine through holes is supported by a rigid plate formed by integral firing on at least both sides of a portion where the fine through holes are formed, and the minimum value of the hole diameter is 150 μm or less, A method for producing a ceramic member having a thickness of 100 μm or less and a minimum value of a hole interval of 150 μm or less,
The tensile strength of the green sheet for the thin plate σ is 10 kgf / cm ² or more and 200 kgf / cm ² or less,
From the elongation amount Δl (mm) at break of the thin sheet green sheet, the tension T (kgf) at break, and the cross-sectional area S (mm ² ), the elongation percentage represented by Δl · S / T is 0. .5mm ³ / kgf or more, or less 25.0 mm ³ / kgf, and,
The absolute value of the difference between the sintering developing temperature T ₅₀ of the green sheet for thin walled plate green sheet and the rigid plate 50 ° C. or less, the absolute value of the difference between the firing shrinkage rate F is 1.5% or less,
The thin sheet green sheet is laminated on the rigid sheet green sheet to form an integrated laminate, and a plurality of fine through holes are formed in the thin sheet green sheet by punching, followed by firing. Of manufacturing a ceramic member. The method for manufacturing a ceramic member according to claim 1, wherein the thickness of the thin plate is 50 μm or less. Method for producing a ceramic member according to any one of claims 1 to 3 absolute value of the difference between said thin plate green sheet and the rigid plate green sheet sintering developing temperature T ₅₀ is 20 ° C. or less. Particle diameter _{D L} of the ceramic powder constituting the green sheet for thin walled plate 0.1μm or more and 1.2μm or less,
The sphere equivalent diameter D _BET calculated from the BET specific surface area of the ceramic powder is 0.02 μm or more and 0.5 μm or less, and
The ceramic sheet occupancy A of the thin sheet green sheet is 40% or more and 55% or less;
The method for manufacturing a ceramic member according to any one of claims 1 to 4, wherein the sum of the ceramic powder occupancy A and the organic component occupancy B is 80% or more and 98% or less. The method for producing a ceramic member according to any one of claims 1 to 5, wherein the thin plate contains partially stabilized zirconia as a main component. The method for producing a ceramic member according to claim 6, wherein the crystal grain size of the partially stabilized zirconia is 2 µm or less. The method according to claim 7, wherein the partially stabilized zirconia is partially stabilized with 2 to 6 mol% of yttrium oxide. The maximum value w (mm) of the width in the lateral direction of the portion of the thin plate formed with the fine through-holes, which is supported by the rigid plate on both sides, and the distance d (μm) between the fine through-holes are as follows: (I),
(B) w ≧ 10 / d
The method for producing a ceramic member according to claim 1, wherein the method has a relationship represented by:

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