JP3538471B2 - Room temperature curing type epoxy resin composition and prepreg and curing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a room temperature-curable epoxy resin composition and a prepreg excellent in storage stability and a method for curing the same, and particularly to the troublesome work conventionally performed by hand lay-up. The present invention relates to a room-temperature-curable prepreg and a method for curing the same, which can be used in a wide range of fields such as sports and leisure, civil engineering, and the like, as well as conventional methods.

[0002]

2. Description of the Related Art The epoxy resin composition used in conventional prepregs has a considerably high curing temperature of 120 ° C. or higher, and it is impossible to integrally mold a prepreg using a foam material such as urethane or acrylic as a core material. Was. However, recently, in consideration of energy saving and productivity in general prepreg molding, many low-temperature curing prepregs have been proposed. It is a method using a latent curing agent that does not cure at room temperature or is in a B-stage state (semi-cured state), but cures at a temperature of 80 ° C. or higher. For example,
JP-A-3-115331, JP-A-5-31089
No. 2, JP-A-5-262903 and the like use an amine adduct-type curing agent. Alternatively, JP-A-4-31420, JP-A-4-325518, JP-A-5-262903, and the like use a microcapsule-type curing agent. However, all of these require heat curing at 80 ° C. or higher to cure.

On the other hand, a conventional method for producing FRP tanks and towers or a lining method for industrial use, sewerage, and the like involves hand lay-up of a cold-setting epoxy resin or an unsaturated polyester resin on short fibers or long fibers. The method of applying is adopted. Recently, in the field of civil engineering and construction, a method of applying a cold-setting epoxy resin to a long-fiber sheet by a hand lay-up method to repair or reinforce a civil construction structure has been disclosed in Japanese Patent Laid-Open No. Hei 3-2249.
No. 01 is proposed. However, in each case, the base resin and the curing agent are mixed on site to adjust the epoxy resin, and since the pot life is short, it must be applied by hand lay-up method within a limited time so that no air remains on the fiber. And has the disadvantage of being unfavorable in terms of safety and health.

On the other hand, JP-A-3-224966 discloses a method using a long fiber prepreg in which fibers are impregnated with an epoxy resin which can be cured at 70 ° C. or higher. The use of a long-fiber prepreg impregnated with an epoxy resin containing no curing agent has been proposed. However, in order to cure the prepreg at room temperature, a room temperature curing type epoxy dissolved in thinner or MEK is applied to the surface of the prepreg. A resin solution or a room temperature curing type curing agent solution is applied, and it does not solve the inconvenience and safety and health problems of the hand lay-up method, and also has a disadvantage that curing failure is likely to occur. On the other hand, in JP-A-1-197532,
A method using a long-fiber prepreg that does not require hand lay-up has been proposed. However, it is necessary to heat the resin to a high temperature of 50 ° C. or more by an infrared lamp, an electric heater, or the like after sticking on site, and to cure the resin. According to this method, since no solvent is used, there is no problem in terms of safety and health, but work for heating and curing is still necessary, and it is still unsatisfactory in terms of inconvenience.

[0005]

SUMMARY OF THE INVENTION In view of the above-mentioned situation, the present invention has been developed in comparison with the conventional low temperature curing type prepreg.
In consideration of energy saving, productivity improvement, etc., it is possible to cure at lower temperature, that is, at room temperature, and at room temperature, which can solve problems of safety and hygiene and troublesomeness compared to the conventional hand lay-up system It is an object of the present invention to provide a curable epoxy resin composition, a prepreg, and a method for curing the same.

[0006]

Means for Solving the Problems As a result of intensive studies to solve the above-mentioned problems, the present inventor tried to encapsulate a room temperature curing type curing agent such as an amine into a pressure curing type. However, since it is very difficult, instead of directly encapsulating a room temperature curing type curing agent such as an amine, the room temperature curing type curing agent is adsorbed by the clathrate compound, and the adsorbing ability is higher than that of the room temperature curing type curing agent. The present invention was completed by encapsulating an alcohol or the like having a high content.

That is, according to the present invention, there is provided a cold-setting epoxy resin composition for a prepreg, comprising the following components A, B and C as essential components. A: an epoxy compound having at least two or more glycidyl groups in one molecule B: an inclusion compound C that adsorbs an amine compound having active hydrogen; an inclusion compound of an amine compound A powder obtained by microencapsulating a compound that can serve as an expelling agent. The present invention is a cold-setting prepreg characterized by impregnating a reinforcing fiber with the epoxy resin composition described above. Further, the present invention is a room-temperature curing method for a prepreg, which comprises using the prepreg described above and breaking the C-component microcapsules by applying pressure during molding of the prepreg to cure the prepreg.

Hereinafter, the present invention will be described in detail. First, the epoxy compound used as the component A in the present invention is not particularly limited as long as it has at least two or more glycidyl groups in one molecule, and any epoxy compound can be used. If specifically exemplified, bisphenol A
1 which is appropriately selected from a type epoxy resin, a cresol novolak type epoxy resin, a phenol novolak type epoxy resin, a bisphenol F type epoxy resin, other alicyclic epoxy resins, a bisphenol S type epoxy resin, and the like.
Species or a mixture of two or more species can be used.

Bisphenol A type epoxy resins include espoxy SA-115 and espoxy SA-13.
4. Espoxy SA-011, Espoxy SA-01
9. Espoxy SA-7020 (Nippon Steel Chemical Co., Ltd.
Epicoat 828, Epicoat 834, Epicoat 1001, Epicoat 1004 (all manufactured by Yuka Shell Epoxy Co., Ltd.), Araldite GY-250, Araldite GY-260, Araldite 6071 (all manufactured by Nippon Ciba Geigy) Can be used. Cresol novolak type epoxy resins include Espoxy SCN-701P and Espoxy SCN-
702P, Espoxy SCN-703P, Espoxy S
CN-704P (all manufactured by Nippon Steel Chemical Co., Ltd.), Araldite ECN-1273, Araldite ECN-1280
Commercially available products such as the above (manufactured by Nippon Ciba Geigy Co., Ltd.) or ESCN-220 series manufactured by Sumitomo Chemical Co., Ltd. can be used.

As the phenol novolak type epoxy resin, Espoxy SPN-638 (Nippon Steel Chemical Co., Ltd.)
Commercially available products such as Epicoat 152 and Epicoat 154 (all manufactured by Yuka Shell Epoxy Co., Ltd.). Commercially available bisphenol F type epoxy resins such as Epicron 830 (manufactured by Dainippon Ink and Chemicals, Inc.) can be used.

Next, in the clathrate compound which adsorbs the amine compound having active hydrogen of the component B, the amine compound used is an amine compound having active hydrogen which can react with an epoxy compound at room temperature. Further, any substance that can be adsorbed in the pores of the clathrate compound, that is, one in which the molecular diameter of the amine compound is smaller than the pore diameter of the clathrate compound, may be used. For example, primary amines such as ethylamine, n-propylamine, isopropylamine, n-butylamine, and isobutylamine, diethylamine,
n-propylamine, diisopropylamine, di-n-
Secondary amines such as butylamine, and ethylenediamine, diethylenetriamine, triethylenetetramine,
Modification of polyamines such as tetraethylenepentamine, dipropylenediamine, diethylaminopropylamine, tetramethylenebutanediamine, hexamethylenediamine, N-aminoethylpiperazine, meta-xylenediamine, aminoethylethanolamine, and also polyamide polyamine and amine adduct Amines and the like.

The clathrate compound used for the component B is not particularly limited as long as it is a porous powder capable of adsorbing the amine compound. For example, zeolite, montmorillonite, diatomaceous earth, kaolin, mica, activated carbon, etc. Inorganic substances and organic substances such as porous polystyrene. Among them, zeolite having a uniform pore size, that is, molecular sieves, is particularly preferable. And the method of adsorbing the amine compound to the clathrate compound is not particularly limited,
For example, a method in which the clathrate compound is subjected to heat treatment or the like to make it in an activated state, and the amine compound is directly adsorbed, or a method in which the amine compound is gradually added in a solvent that is less adsorbable than the amine compound, is generally used. . In the latter case, if the reflux is used together, the adsorption can be performed more quantitatively.

Next, the amount of the amine compound in the clathrate compound adsorbing the amine compound as the component B is preferably 5 to 40% by weight. If it is less than 5%, the effect as a curing agent is small, and the uncured state or curing tends to be extremely slow.
Since the amine compound reacts almost quantitatively with the epoxy compound, a certain amount is required for the epoxy compound. Therefore, if it is less than 5%, it is not desirable because the amount of the clathrate compound which is unnecessary for the reaction and adversely affects the physical properties of the cured product is relatively increased. On the other hand, the upper limit is preferably an amount that is quantitatively adsorbed in the pores of the clathrate compound. However, depending on the case, it may be adsorbed not only on the pores but also on the surface of the clathrate. In that case, the reaction with the epoxy compound proceeds immediately, and a problem occurs in storage stability. Therefore, the adsorption amount of the amine compound is 40% by weight.
It is better not to exceed. The average particle size of the clathrate compound is preferably 0.1 to 20 μm. When the thickness is less than 0.1 μm, the clathrate compound is hard to coagulate and disperse, and conversely, poor curing and poor surface are likely to occur. On the other hand, if it exceeds 20 μm, it may not be evenly dispersed among the fibers, resulting in poor curing.

Next, the compound which can serve as an agent for displacing the amine compound as the component C varies depending on the type of the clathrate compound, but is generally a compound having an OH group or an SH group. , Alcohols, water, and thiols. However, among the above-mentioned compounds, alcohols or water are preferable because thiols have a bad smell and are difficult to be microencapsulated. As alcohols, ethyl alcohol, propyl alcohol, butyl alcohol, ethylene glycol, propylene glycol, butanediol, polyethylene glycol,
There are glycerin, maltitol, sorbitol, etc.,
It is not limited to this.

The cold curing mechanism of the present invention is based on the fact that these compounds act as a displacing agent for the amine compounds adsorbed in the clathrate compound during the molding of the prepreg, and the displaced amine compounds react with the epoxy compound of the A component. It reacts and cures at room temperature. Therefore, in order to be able to serve as an expelling agent, it is necessary that the clathrate has a higher adsorption capacity than the amine compound and is smaller than the pore size of the clathrate. Further, in the case of a prepreg having a resin composition in which the above-described dispensing agent is coexisted with the A component and the B component as it is, since the curing reaction gradually progresses and storage stability deteriorates, until immediately before molding the prepreg. However, it is necessary to suppress the function as a dispensing agent. Therefore, in the present invention, the microcapsules are formed by using an expelling agent as a core material in order to have good storage stability and to cure at room temperature. Methods for breaking microcapsules include compression breaking of the shell and melting by heating. In the present invention, the shell is compressed at room temperature. Therefore, the compression breaking type of the shell is convenient. However, it is preferable that the material can withstand the shearing, but is easily broken by the shear compression.

Here, the shell material is not necessarily limited to the material as long as the above conditions are satisfied. However, specifically, a monomer having a polymerizable unsaturated bond such as acrylic acid, methacrylic acid, etc. There are polymers such as acrylic acid ester (methyl ester, ethyl ester, etc.), methacrylic acid ester (methyl ester, ethyl ester, etc.), vinyl acetate, vinyl chloride, vinylidene chloride, ethylene, styrene, divinylbenzene, ethylene glycol dimethacrylate, etc. . The method for producing a compression-rupture type microcapsule in the present invention is not limited.For example, the above-mentioned monomer having a polymerizable unsaturated bond such as acrylic acid or styrene is mixed with a core component and a polymerization initiator to be encapsulated. In general, a method of dispersing the monomers in a medium containing an appropriate emulsifying dispersant or the like so as to form oil droplets having an intended particle diameter and polymerizing the monomers is used. In this case, the adjustment of the target particle diameter, the included amount, and the compressive strength is performed by selecting the type of the monomer component, the ratio between the monomer component and the included component, the amount and type of the emulsifying dispersant, and the dispersion conditions.

If the component C is described in more detail, the average particle size of the microcapsules is 1 to 20 μm.
Is preferred. When the thickness is less than 1 μm, the number of shell materials unnecessary for curing is likely to be increased as compared with a core material necessary for curing, that is, a compound which can serve as a displacer of an amine compound. The core material is taken into the clathrate compound by replacing the amine compound, but the shell material remains as it is. This is because the shell material does not react with the epoxy resin and acts as an impurity that has an adverse effect on the strength of the cured composite material. Therefore, the amount thereof is preferably as small as possible. On the other hand, when the thickness exceeds 20 μm, the resin impregnation into the reinforcing fiber sheet is not uniform, and poor curing is likely to occur.

Next, regarding the compounding amounts of the components A, B and C, 10 parts of the component B are added to 100 parts by weight of the total amount of the component A.
It is preferable to mix 0.5 to 30 parts by weight of Ｃ100 parts by weight with the component C. If the amount of the component B is less than 10 parts by weight, the amount of the amine compound as a curing agent is insufficient, and the curing is likely to be insufficient. If the amount exceeds 100 parts by weight, the inclusion compound in a powder state becomes so large that dispersion becomes difficult and the weight of the composite material increases, which is not preferable. If the amount of the component C is less than 0.5 part by weight, the effect of the amine compound as a displacing agent is small and uncured or the curing speed becomes extremely slow, which is not preferable. On the other hand, when the amount exceeds 30 parts by weight, components unnecessary for curing increase, which deteriorates the physical properties of the composite material, which is also not preferable.

The method for producing a fiber-reinforced prepreg using the cold-setting epoxy resin composition may be a general method such as a hot melt method or a solvent method. However, it is particularly important to note that the B
The purpose is not to desorb the amine compound of the component from the clathrate compound and to destroy the microcapsule of the component C. Another object is to uniformly disperse the B component and the C component, particularly the B component, in the fiber-reinforced prepreg. These can be attained by appropriately considering the temperature and pressure at the time of resin impregnation or the type of solvent when a solvent is used.
Here, if there is a possibility that the microcapsules of the component C may be broken during the production of the prepreg, the fiber reinforced prepreg containing the components A and B is first produced, and then the component C is adhered to the surface of the prepreg. It is also possible to take the method of causing. In addition, as the reinforcing fibers used in the present invention, for example, glass fibers, carbon fibers, aramid fibers, those arranged uniaxially or biaxially reinforcing fibers such as polyethylene fibers, knitted, woven or randomly Examples thereof include woven fabrics and nonwoven fabrics having a thickness of about 0.1 to 2 mm which are arranged, but are not particularly limited.

Next, a method of curing the fiber reinforced prepreg at room temperature will be described. In general prepreg molding,
First, it is necessary to adhere to the surface to be bonded to the prepreg and pressurize it so that no air is trapped. Then, in the present invention, in order to cure, the microcapsules of the component C must be broken to release the core material. Methods for breaking the microcapsules include pressurization, heating, and irradiation with electromagnetic waves. Heating or electromagnetic wave irradiation is not preferable in terms of workability, energy saving, and danger. However, according to the invention, affixing to the surface to be glued,
There is an advantage that the microcapsules can be broken and cured at the same time as the pressurization. The method of pressurization is not particularly limited as long as the microcapsules can be broken, but it is convenient and convenient to use a device such as a roller or a vibrator capable of shearing and compressing.
Further, when using a prepreg formed by adhering the C component on the surface of the fiber-reinforced prepreg containing the A component and the B component first, in order to further ensure uniform dispersion of the C component, It is desirable to pressurize using a heater such as a dryer and a heating roller in combination. However, even in this case, low-temperature curing by maintaining the temperature at 40 to 80 ° C. for several minutes is sufficient.

[0021]

Next, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples. In addition, the evaluation method in the Example of this invention and a comparative example is as follows. Evaluation method and storage stability: Tactile evaluation of the tackiness of the prepreg after leaving it at 15 ° C. for one month ○: good (no change) △: somewhat good (slightly hardening, but no problem in use) × ・ ・ ・ Defective (cannot be used due to curing) ・ Applying workability; Workability and safety and hygiene when applying prepreg or sheet to cement surface treated with epoxy primer; When applying work Odor and curing characteristics: Affixed prepreg or sheet, left at room temperature (25 ° C.) for 1 week, then dipped in acetone to evaluate the cured state. Poor: Surface is swollen or (partially) dissolved and curing is poor. Surface condition after curing; Surface condition when visually observed after curing. ... Poor

Example 1 An epoxy resin composition in which the following components A, B and C were blended and adjusted in the following proportions was prepared in a unidirectional PA.
N-based carbon fiber (strength 350 kg / mm ² , tensile modulus 2
4 t / mm ² ), carbon fiber weight 150 g / m ² ,
A prepreg sandwiched between a polyethylene film and release paper on both sides with a resin content of about 50 wt% was produced.
As shown in Table 1, this prepreg had good storage stability. Next, the polyethylene film was peeled off, the prepreg was adhered to the cement surface treated with the epoxy-based primer, and pressure was applied from above the release paper using a trowel and a vibrator while removing air. This attaching work
It is very simple, has little odor, has almost no problem in terms of safety and hygiene.
It was cured after a week, and the surface condition after curing was good. A component: Epoxy compound (7: 3 mixture of Epikote 828 and Epikote 1001: oiled shell epoxy)
100 parts by weight, component B; powdered molecular sieves 5A adsorbing ethylenediamine by 15% by weight (average particle size: 4 μm)
m, pore size 5Å: 36 parts by weight, manufactured by Union Showa Co., Ltd. C component: 3 parts by weight of microcapsules (average particle diameter 5 μm) containing 70% by weight of ethylene glycol and using polyacrylic resin as a shell material

Example 2 An epoxy resin composition prepared by mixing the components A and B used in Example 1 and the following component C at the following ratios was prepared.
g / mm ² , tensile modulus of 40 t / mm ² ) to produce a prepreg sandwiched between a polyethylene film and release paper on both sides with a carbon fiber weight of 100 g / m ² and a resin content of about 50 wt%. When this prepreg was evaluated in the same manner as in Example 1, the storage stability was good as shown in Table 1, and the workability of sticking, safety and sanitation, curing characteristics, and surface condition after curing were good. Component A: 100 parts by weight Component B: 36 parts by weight Component C: 60 parts by weight of water, microcapsules containing polyacrylic resin as a shell material (average particle diameter 7 μm) parts by weight

Example 3 An epoxy resin composition in which the following components A, B and C were blended and adjusted at the following ratios was mixed with a glass fiber (strength 150 kg /
mm ² , impregnated in a plain woven fabric having a tensile elasticity of 7 t / mm ² ), a glass fiber weight of 110 g / m ² , and a resin content of about 40 wt.
%, A prepreg sandwiched on both sides with a polyethylene film and release paper was produced. When this prepreg was evaluated in the same manner as in Example 1, the storage stability was good as shown in Table 1, and the workability of sticking, safety and sanitation, curing characteristics, and surface condition after curing were good. A component: 100 parts by weight of an epoxy compound (8 to 2 mixture of Epikote 828 and Epikote 1001) B component: Powdery diatomaceous earth (Chrisvar PW-20: average particle diameter) adsorbing 20% by weight of triethylenetetramine Approximately 6 μm, pore diameter 30 to 200 mm: Nippon Steel Mining Co., Ltd.
50 parts by weight, C component; 70% by weight of glycerin, microcapsules containing polyacrylic resin as a shell material (average particle size: 1)
5 μm) 3 parts by weight

Example 4 100 parts by weight of the component A and 50 of the component B used in Example 3
The epoxy resin composition blended and adjusted in parts by weight was mixed with glass fiber (strength 150 kg / mm ² , tensile modulus 7t /
mm ² ), and then the same C component as used in Example 3 was applied to both sides by about 1.5 parts by weight to obtain a glass fiber weight of 110 g / m ² and a resin content of about 40 wt%. ,
A prepreg sandwiched on both sides with a polyethylene film and release paper was produced. Example 1
As shown in Table 1, the storage stability was good, and the sticking workability, safety and sanitation, curing characteristics, and the surface condition after curing were good.

Comparative Example 1 A PAN-based carbon fiber obtained by blending the epoxy resin composition prepared in A and B used in Example 1 in one direction with the epoxy resin composition prepared in the following ratio ( Strength 3
50 kg / mm ² , tensile modulus of elasticity 24 t / mm ² ), carbon fiber weight 150 g / m ² , resin content 48 wt
%, A prepreg sandwiched on both sides with a polyethylene film and release paper was produced. As shown in Table 1, this prepreg had good storage stability. When the prepreg was evaluated in the same manner as in Example 1, the prepreg did not cure at room temperature even after 3 weeks. A component: 100 parts by weight B component: 36 parts by weight

COMPARATIVE EXAMPLE 2 An epoxy resin composition prepared and mixed in the following proportions with the following components A, B and C used in Example 1 was mixed with a PAN-based carbon fiber (strength: 350 kg / mm).
^2. A prepreg impregnated with a tensile elasticity of 24 t / mm ² ), having a carbon fiber weight of 150 g / m ² , a resin content of 48 wt%, and sandwiched on both sides by a polyethylene film and release paper was produced. This prepreg, as shown in Table 1,
The storage stability was very poor and after one week the prepreg had already hardened and could not be applied to cement. A component: 100 parts by weight B component: 36 parts by weight C component: 3 parts by weight of ethylene glycol

Comparative Example 3 An epoxy resin composition prepared by blending the components A, C and B used in Example 2 in the following proportions was mixed with a pitch-based carbon fiber (strength 370 kg / mm) in one direction.
^2. A prepreg impregnated with a tensile elastic modulus of 40 t / mm ² ), having a carbon fiber weight of 100 g / m ² , a resin content of 45 wt%, and sandwiched on both sides by a polyethylene film and release paper was produced. This prepreg, as shown in Table 1,
The storage stability was very poor, and after one week, it was completely cured and could not be applied to cement. A component: 100 parts by weight B component: ethylenediamine 5 parts by weight C component: 2 parts by weight

Comparative Example 4 An epoxy resin composition prepared by mixing the components A, C and B used in Example 3 in the following proportions was mixed with a glass fiber (strength 150 kg / mm ² , Impregnated to a tensile modulus of 7 t / mm ² , with a glass fiber weight of 200
g / m ² , a resin content of 40 wt%, and a prepreg sandwiched on both sides with a polyethylene film and release paper. As shown in Table 1, this prepreg had good storage stability, sticking workability, and safety and hygiene, but had poor curing characteristics and poor surface condition after curing. A component: 100 parts by weight B component: powdery diatomaceous earth (Chrisvar PW-150: 20% by weight of triethylenetetramine adsorbed)
Average particle size about 60 µm, pore size 30-200 mm: Nippon Steel Mining
50 parts by weight, C component; 3 parts by weight

Comparative Example 5 An epoxy resin composition prepared by blending the following components A and B at the following ratios was mixed with a PAN-based carbon fiber (strength: 350 kg / mm ² , tensile modulus: 24 t) in one direction.
/ Mm ² ) to prepare a prepreg sandwiched between a polyethylene film and release paper on both sides with a carbon fiber weight of 150 g / m ² , a resin content of 48 wt%, and both sides. As shown in Table 1, this prepreg had good storage stability. When the prepreg was evaluated in the same manner as in Example 1, the prepreg had good workability for bonding and good safety and health.
Even after three weeks, it was not cured at room temperature at all. A component: 100 parts by weight of an epoxy compound (a mixture of 3 to 7 of Epicoat 828 and Epicoat 1001) B component: 30 parts by weight of a latent microcapsule type low-temperature curing agent (Novacure HX3722: Asahi Kasei Corporation)

Comparative Example 6 PAN-based carbon fibers (strength 35) aligned in one direction
0 kg / mm ² , tensile modulus of elasticity 24 t / mm ² ) (with a carbon fiber weight of 150 g / m ² ) and the following A and B
The epoxy resin solution prepared by blending the components in the following ratio was adhered to the cement surface treated with the epoxy primer by a hand lay-up method. This sticking operation, including the operation of uniformly impregnating the sheet with the epoxy resin solution in addition to the operation of removing air, was very troublesome as shown in Table 1. Moreover, the odor was intense and was not good for safety and health. This sheet was completely cured after one week, but some voids were found on the fiber surface and inside. A component: epoxy compound (Epicoat 828) 100
Parts by weight, component B: 7 parts by weight of ethylenediamine

[0032]

[Table 1]

[0033]

As is apparent from the above detailed description, the present invention is a room temperature-curable prepreg epoxy resin composition which is excellent in storage stability and can be cured at room temperature. Compared to curable prepreg resin, it is extremely superior in terms of energy saving and productivity. Also,
In the present invention, the inconvenience is greatly improved even when compared with a method in which two liquids are mixed at the site and the work is performed by a hand lay-up method, and furthermore, it is possible to solve safety and health problems such as odors. It is a room temperature curing method, which is very useful in industry.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-59-113036 (JP, A) JP-A-7-330871 (JP, A) JP-A-63-77923 (JP, A) JP-A-63-77923 161018 (JP, A) JP-A-6-73162 (JP, A) JP-A-5-39673 (JP, A) JP-A-4-325518 (JP, A) JP-B-36-17478 (JP, B1) JP-B-43-17654 (JP, B1) (58) Fields investigated (Int. Cl. ⁷ , DB name) C08G 59/40 C08G 59/50 C08J 5/24 CFC

Claims (3)

(57) [Claims] A cold-setting epoxy resin composition for prepreg, comprising the following components A, B and C as essential components. A: an epoxy compound having at least two or more glycidyl groups in one molecule B: an inclusion compound C that adsorbs an amine compound having active hydrogen; an inclusion compound of an amine compound Powder with microencapsulated compound that can be an expelling agent 2. A cold-setting prepreg, wherein a reinforcing fiber is impregnated with the epoxy resin composition according to claim 1. 3. Use of the prepreg according to claim 2,
A room temperature curing method for a prepreg, which comprises applying pressure to break and cure the microcapsules of component C during molding of the prepreg.