JP3493143B2 - Component mounting method and equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method and an apparatus therefor, for example, for mounting an electronic circuit board by temporarily mounting or mounting various electronic components on a circuit board as a mounting target. Applied in case.

[0002]

2. Description of the Related Art A typical example of a conventional electronic component mounting apparatus is shown in FIG.

This is suitable for handling various kinds of electronic parts f at high speed, and is equipped with a plurality of suction nozzles c as a parts handling tool in the circumferential direction of the mounting head b in which the parts handling mechanism a rotates. The first portion disposed around the center d ((b) of FIG. 7) corresponding to the rotation axis of the mounting head b.
~ The stations 1 to 16 for performing the sixteenth various operations are sequentially and repeatedly moved in a direction indicated by an arrow in FIGS. 7A and 7B along a fixed circular orbit, and each suction nozzle c is connected to each station. Whenever the number reaches 1 to 16, the rotation is temporarily stopped. In each of the stations 1 to 16, work to be performed on the electronic component f held by the suction nozzle c stopped is assigned as necessary.

As shown in FIGS. 7A and 7B, the eighth
The station 8 corresponds to the component supply unit e, and the predetermined electronic component f supplied by the component supply unit e is sucked, held and picked up by the corresponding suction nozzle c. The electronic component f picked up by the suction nozzle c is first
When I brought it to station 0 of 0 and stopped it,
A rotation operation of θ1 is performed to adjust the orientation of the electronic component f to perform necessary inspections such as the posture, defects, and thickness.

When the twelfth station 12 is reached and is temporarily stopped, the suction position of the electronic component f is image-recognized by the recognition unit j having a recognition camera. When it reaches the fourteenth station 14 and is temporarily stopped, the rotation of θ2 is performed so that the electronic component f becomes a predetermined suction posture based on the recognition result of the suction posture. In addition, the inspection unit k performs a two-dimensional inspection such as the thickness of the electronic component f. When the suction nozzle c reaches the 16th station 16 and is temporarily stopped, the circuit board h to be mounted is orthogonal to the corresponding suction nozzle c only moving along a constant locus between the stations 1 to 16. By moving the table i that moves in the XY2 directions, the position where the electronic component f of the circuit board h is to be mounted next is moved to a position that coincides with the axis of the suction nozzle c stopped at the sixteenth station 16. The electronic component f, which is held by the suction nozzle c and determined to be non-defective in the inspection, is mounted at a predetermined position on the circuit board h by lowering the suction nozzle c and releasing the suction.

The electronic component f judged to be defective is the second
2nd station 2
When it is reached and is temporarily stopped, it is randomly discharged into the component discard box m by the suction release so as to be discarded. At the same time, the suction nozzle c is returned to the original position by the rotation of θ1 and θ2, and the rotation of the suction nozzle c is performed to prepare for the next suction of the electronic component f. Utilizing the fact that the third station 3 to the fifth station 5 are reached and temporarily stopped, the size S, L, M of the suction nozzle c and the switching of the type correspond to the type information of the electronic component f to be sucked next. Is done. When it reaches the sixth station 6 and is temporarily stopped, the size and type of the reached suction nozzle c are confirmed. Next, when it reaches the eighth station 8 and is temporarily stopped, the supplied electronic component f is sucked and held by the suction nozzle c of the type and size corresponding thereto, and picked up. After that, the above operation is repeated to sequentially mount various electronic components f on the circuit board h temporarily or in a mounted state to manufacture the electronic circuit board.

On the other hand, the electronic components f mounted on the circuit board h are steadily increasing in variety, and along with the miniaturization of components, the number of pins and the size thereof are increasing, such as QFP (Quad Flat Package). There is. This includes
In addition to enlarging or providing a plurality of component supply parts e to selectively use various component supply mechanisms corresponding to the various types of electronic components described above, a large number of suction nozzles c for handling electronic components f are provided. Then, the type and size are selected and used. As a result, even an electronic circuit board that requires various types of electronic components can be manufactured by one or a small number of component mounting devices.

[0008]

However, in the above-described conventional component mounting apparatus, all electronic components f determined to be defective are randomly discharged into the discard box m and discarded. This did not cause any particular problem while handling the electronic components f to be handled mainly from the small electronic components f called chip components to the fine electronic components f.

However, large electronic parts f such as QFP
If special electronic parts f are handled, or if they are judged to be defective based on the same criteria as those of the small electronic parts f and are discarded, they will be discarded even when repair is required, which is expensive. The use efficiency of the electronic component f is significantly reduced, which greatly affects the product cost. It is also becoming a problem in terms of resource saving.

It is an object of the present invention to provide a component mounting method and apparatus in which various components can be mounted only for non-defective products and defective products can be discarded and collected depending on the necessity of collecting them.

[0011]

In order to achieve the above-mentioned object, the component mounting method of the present invention uses the components to be supplied.
The process of sucking with the suction nozzle and the quality of the sucked parts
Inspection process to determine whether or not, and the process of mounting non-defective products to the target
And collect defective products depending on the necessity of collecting defective products
Process to discharge so that it can be used for
And moving the moving table.
By doing so, if the adsorbed component is a non-defective product,
The position of the item to be delivered is defective if it is a defective product that needs to be collected.
In case of defective products that do not need to be collected,
Align the waste part with the suction nozzle at the component mounting position.
Install the parts, provide the defective products for collection, or
One of the features is to dispose of .

[0012] Thus, it picks up a component to be subjected feeding nozzle
Adsorbed by Le, the components that are determined to be non-defective by the inspection in the inspection unit is attached to the mounting object, defect and the determined parts while not or turned the other baffle may be mounted out discharge, good only While gradually mounted to the mounting target, for defective for discharging defective discharge unit changes the handle in response to the necessity of recovering, when defective products are those requiring recovery, defective products and defective is discharged to the collecting unit and subjected to recovery, defective products need not recovered is discharged to the defective disposal section
Since subjected to disposal Te, it can be to be reused and subjected to recovery without discarding the large-sized or special and expensive electronic components, such as the environment that may occur in event by discarding other Can be prevented.

In addition, a defective product collecting section and a defective product discarding section are provided.
Since the selection used in accordance with the necessity of recovering the defective, in one work station component handling tool is paused, achieving handling two types for the recovery and disposal of discharged parts without mutual influence You can Especially defective products
Two defective product collection parts and defective product disposal parts, which are discharge parts,
Adjacent to the product mounting section, the quality of parts and the collection of defective products
Depending on the necessity of, the installation of good products and the defective product collection unit of defective products
The defective product to the defective product disposal department.
The quality of the parts handled and the collection of defective products
The above three types of processing corresponding to the necessity of
You can Therefore, the required number of work stations
It is possible to reduce the size of the device. Moreover, this is a must
There is no need to say that the required movements will increase and there will be time loss.
There is no such thing.

[0014] The above methods, such as is, and the component supply unit, before
Adsorption nozzle that adsorbs the components supplied by the component supply unit
And an inspection unit that determines the quality of the adsorbed component, and mounting
The component mounting part that provides the target with good parts and the defective parts
Depending on the necessity of collection, it may not be necessary to discharge defective products for collection.
Non-defective product collection unit and defective product disposal that discharges defective products for disposal
The abandonment part and the suction nozzle to inspect the quality of the part,
Mounting of non-defective products at the component mounting part, defective product number of defective products
Used to discharge to the collection section and to the defective product disposal section for the defective products.
To be repeated sequentially with a constant movement trajectory
The parts handling mechanism, the defective product collection unit, and the defective product disposal
Aside from the abandoned part and the component mounting part, on the component mounting part
The installation target, the defective product collection unit, and the defective product disposal unit
Move to the position of the suction nozzle at the product mounting position
In the component mounting apparatus provided with the moving mechanism, the respective parts , the component handling mechanism and the moving mechanism are associated with each other in accordance with a predetermined program, and are automatically and stably achieved.

[0015]

In the defective product collecting section, a plurality of defective products are collected.
It may be received and held individually in the product holding section.
To this end, the defective product collecting unit has a plurality of component holding units that individually receive the defective products, and if the defective products that need to be collected are individually received and held by the plurality of component holding units.
Often , when dealing with defective products that need to be collected and discharged, it is possible to prevent mutual interference and damage due to them, which is advantageous for reuse, and defective products held individually in each component holder are individually handled. It can be handled without any confusion and used for collection. Further, by keeping the positional relationship of each component holding unit constant, the position where the defective product requiring recovery is held is specified, which is convenient for performing the recovery operation by an automatic mechanism.

[0017]

[0018]

Further, if the suction nozzle is defective,
When discharging to the collection section or the defective product disposal section,
Switching the chewing from suction to blowing
When attaching the suction nozzle to the attachment target,
Higher blow pressure than when switching to low
The defective product may be blown away,
In the component handling mechanism , the component handling mechanism includes a suction nozzle as a component handling tool, and the blow pressure is switched in two stages in a connection line between a switching valve that switches and connects the suction nozzle to a suction source and a blow source and a connection source of the suction nozzle to the blow source. It is only necessary to provide a switching valve, so that the suction nozzle can be switched from suction to blow when discharging to a defective product discarding unit or defective product collecting unit for suction holding and carrying and handling of components supplied by the suction nozzle. , The defective product is blown away with a blow pressure that is higher than the blow pressure when switching the suction nozzle from suction to blow when a good product is attached to the mounting target. The suction state where the parts were held until then was released, that is, the vacuum was broken, and the held parts were not displaced from the predetermined position of the mounting target. The blow pressure when ejecting a defective product is higher than that, so that the defective product can be reliably blown away, which may result in defective ejection. It is possible to prevent the parts from falling out of the parts collection part and becoming uncollectible, or falling into a problem area.

Further objects and features of the invention will be apparent from the following detailed description and the accompanying drawings. Each feature of the present invention can be used alone or in combination in various combinations as far as possible.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, one representative embodiment of the present invention will be described together with its examples with reference to FIGS. 1 to 6 to provide an understanding of the present invention.

In the present embodiment, as shown in FIGS. 1 and 2, an example of manufacturing an electronic circuit board by mounting various electronic components 1 on a circuit board 2 to be mounted, for example, in a temporary mounting or mounting state Is. If it is a temporary mounting, post-processing such as reflow processing is required to set it in the mounted state. The present invention is not limited to these, and can be similarly applied to various cases in which various parts are handled variously and mounted on a mounting object to manufacture various products, or finishing or assembling.

The component mounting method of the present embodiment will be described with reference to the component mounting apparatus shown in FIGS. 1 and 2. As in the conventional case, various component supply mechanisms corresponding to the type of electronic component 1 to be handled. The various electronic components 1 supplied by the various component supply units 11 equipped with are picked up by the component handling tool 12 and carried, the inspection by the inspection unit 13 and the circuit board 2 by the component mounting unit 14 of the non-defective product 1a. And the handling for providing the defective product 1b in the defective product discharge portion 15 are repeatedly performed on a fixed movement locus 16,
Only the good product 1a is mounted on the circuit board 2. At this time, depending on whether it is necessary to collect the defective product 1b discharged to the defective product discharging unit 15, the defective product collecting unit 17 and the defective product discarding unit 18 distribute the defective product 1b to the defective product discarding unit 18, and the defective product discarding unit 18 discharges the defective product 1b. Good product 1
The defective product 1b is discarded, and the defective product 1b is collected by discharging to the defective product collecting unit 17.

In this way, the electronic component 1 determined to be defective
The defective product 1b is discharged by the defective product discharge unit 15 so that it is not mounted on the circuit board 2 or other obstacles, and only the good product 1a is mounted on the circuit board 2. Defective product 1 to be discharged by the good product discharging unit 15
Regarding b, the handling is changed according to the necessity of collection,
When the defective product 1b needs to be collected, the defective product 1b discharged from the component handling tool 12 is received and provided for collection by the defective product collecting unit 17, so that the component handling tool 12 that moves along a predetermined movement path 16 is used. In addition to receiving the defective product 1b to be discharged by the defective product discarding unit 18 for disposal without special operation, the large-sized or special expensive electronic component 1 or the like is used for collection without being discarded. It can be reused. Therefore,
It is possible to improve the use efficiency of the expensive electronic component 1 to reduce the product cost, and it is also preferable in terms of resource saving. In addition, it is possible to prevent the influence on the environment or the like which may occur due to disposal.

The defective product collecting unit 17 and the defective product discarding unit 18 are the same defective product discharging unit 15 as shown in FIG. 2, and the side corresponding to the necessity of collecting the defective product 1b is the part handling tool 12 Discharge position from parts, that is, parts handling tool 1
The defective product discharging unit 15 is switched to a position corresponding to the temporary stop position in the defective product discharging unit 15 to receive the defective product 1b for selective use, and is used for discarding and collecting the defective product 1b. As a result, in one work station in which the component handling tool 12 is temporarily stopped, two types of handling for discarding and collecting the discharged defective product 1b can be performed without mutual influence of the defective product collecting unit 17 and the defective product discarding unit 18. Can be achieved.

In addition, the defective product discharging section 15 is provided along with the component mounting section 14 as shown in FIGS. 1 and 2, and the non-defective product is dealt with depending on the quality of the electronic component 1 and the necessity of collecting the defective product 1b. 1
A is mounted, the defective product 1b is discharged to the defective product collecting unit 17, and the defective product 1b is discharged to the defective product discarding unit 18. As a result, the three types of processing corresponding to the quality of the electronic component 1 to be handled and the necessity of collecting the defective product 1b can be performed in one work station. Therefore, the number of required work stations is reduced and the device can be downsized. In addition, this does not necessarily increase the required operation and does not cause time loss.

The defective products 1b that do not need to be collected may be randomly received by the box-shaped defective product discarding unit 18, but the defective products 1b that need to be collected and discharged to the defective product collecting unit 17 are shown in FIGS. 2 and 4, for example. A plurality of component holders 1 as shown in (a)
7a to 17e etc. are individually received and held. Accordingly, when handling the defective product 1b that needs to be collected and discharged, it is possible to prevent mutual interference and damage due to it, which is advantageous for reuse, and each of the component holding units 17a to 17 is provided.
The defective product 1b individually held in e can be individually handled without any confusion and provided for recovery or the like. In this case, the position where the defective product 1b that needs to be collected is held is specified by making the positional relationship among the component holders 17a to 17e constant by, for example, attaching it to the board 17f, so that the collecting operation is automatically performed. There is also an advantage that can be achieved by the mechanism.

The defective product 1b received by the component holders 17a to 17e is sucked and held as shown in FIG. 5 (b), so that the defective product 1b held as shown in FIG. 5 (c). Since it can be kept in a predetermined posture and position until it is carried for collection and carried, it can be surely achieved even when the collection is automatically performed.

The parts handling tool 12 shown in FIGS.
The suction nozzle 21 as shown in FIG. 2 is used to suck and hold the supplied electronic component 1 for carrying, mounting, and discharging defective products in various ways, such as mounting the good product 1a on the circuit board 2 and the defective product 1b. Defective product collection unit 17 and defective product disposal unit 18
When the electronic component 1 is sucked and held, the suction nozzle 21 is switched to the blow state by switching the suction nozzle 21 by electromagnetic operation or cam operation of the switching valve 22. Blow source 2
The blow pressure in the connection line 24 with the switch 3 is switched in two steps by switching the switch valve 25 by electromagnetic operation or the like.

For example, when the non-defective product 1a is mounted on the circuit board 2, the blow shown in FIG. 3B is higher than the blow pressure V1 shown in FIG. 3A when the suction nozzle 21 is switched from suction to blow. The defective product 1b is discharged at a pressure V2. The blow pressure V1 at the time of mounting the electronic component 1 is such that the suction state of the suction nozzle 21 holding the electronic component 1 up to that time is released, that is, vacuum breaking is performed, and the held electronic component 1 moves to the circuit board 2. The suction nozzle 21 is separated from the suction nozzle 21 with such a strength as not to be displaced to a predetermined position. However, since the blow pressure V2 when discharging a defective product is larger than that, the defective product 1b can be more reliably blown away. In addition, it is possible to prevent a defective discharge from occurring, which makes it impossible to recover the component by removing it from the component recovery unit or dropping the defective part.

In order to achieve the above-mentioned method, the component mounting apparatus of the present embodiment, as shown in FIGS. 1 and 2,
The component supply unit 11 described above, the inspection unit 13 that inspects the quality of the electronic component 1, the component mounting unit 14 that holds the circuit board 2 that is the mounting target of the electronic component 1 and that is used for mounting the non-defective product 1a, and the defective product 1b are discharged. The electronic component 1 supplied by the defective product discharge unit 15 and the component supply unit 11 is picked up by the suction nozzle 21 which is the component handling tool 12 and carried, and the inspection by the inspection unit 13 and the non-defective product by the component mounting unit 14 are performed. 1a
It is equipped with a component handling mechanism 26 that sequentially repeats the mounting and discharging of the defective product 1b in the defective product discharge unit 15 with a constant movement trajectory 16. The movement locus 16 of the present embodiment is a circular orbit resulting from the rotation of the mounting head 31 equipped with a large number of suction nozzles 21. However, the invention is not limited to this, and in principle, linearly reciprocating movement may be possible. In addition to the suction nozzle 21, the component handling tool 12 may be of another type such as a chuck type (not shown) that holds the electronic component 1 therebetween.

In addition, the defective product discharging unit 15 is the defective product collecting unit 1.
7 and a defective product discarding unit 18, the entire defective product discharging unit 15 is provided side by side with the component mounting unit 14, and a moving table 27 for holding the circuit board 2 of the component mounting unit 14 and moving it to various component mounting positions. It is held together with the circuit board 2 on top. The moving table 27 moves in the XY2 directions orthogonal to each other. However, a moving mechanism other than this may be adopted. The moving table 27 includes the circuit board 2 and the defective product collecting unit 17.
In addition, the entire defective product discarding unit 18 is integrally moved. If the electronic component 1 held by the suction nozzle 21 that reaches the station of the component mounting unit 14 and is stopped is a good product 1a, the circuit board 2 If the corresponding component mounting position moves to a position that coincides with the axis of the suction nozzle 21 and is a defective product 1b requiring recovery, the component holding unit 17 of the defective product recovery unit 17
If a predetermined one of a to 17e moves to a position that coincides with the axis of the suction nozzle 21 and is a defective product 1b that does not need to be collected, the defective product discarding unit 18 moves to a position that coincides with the axis of the suction nozzle 21. Moving.

Further, in the embodiment shown in the drawing, the inspection unit 13 is, as shown in FIGS. 1A and 1B, a suction posture of the electronic component 1 in the image recognition unit 13a having a recognition camera and a pin position. The presence or absence of defects such as bending is detected, and the thickness of the electronic component 1 is detected by the thickness inspection unit 13b by a line sensor or the like. Depending on the thickness detection, the mounting height of the electronic component 1 or
It is determined that the suction direction is incorrect and cannot be corrected. However, the present invention is not limited to this, and the types of inspections, the number of inspections, the number of work stations that perform inspections, and the like can be freely set according to the type of inspection and the number of inspection devices required for it. In FIG. 1B, a work example assigned to each work station is shown in a simplified manner, but it is needless to say that various necessary works can be performed including a conventional case.

The mounting head 31 has the switching valve 2
A switching unit 32, which has 2 and 25, switches the suction and blow of the suction nozzle 21 and switches the blow pressure,
It is also equipped with two pressure regulating circuits 24a and 24b that are branched to obtain two-stage blow pressures V1 and V2. As shown in FIGS. 4A and 4B, the component holders 17a to 17e are
An individual connection line between the suction source 34 and automatic valves 35a to 35e that are individually connected to one suction source 34 and that open the suction ports 17a1 to 17e1 in response to receipt of the defective product 1b to adsorb the defective product On-off valves 37a to 37e for opening and closing 36a to 36e are provided. As a result, when the discharged defective product 1b is held as shown in FIGS. 5A to 5B, the automatic valve 35 has the suction ports 17a1-1.
Since the portion projecting from 7e1 is pushed by the electronic component 1 and pushed down against the springs 38a to 38e, the suction ports 17a1 to 17e1 are opened.
Through the suction ports 17a1 to 17e1, the component holders 17a to
The suction source 3 is attached to the mouse portions 17a2 to 17e2 at the upper end of 17e.
As shown in FIG. 5B, the defective product 1b that is sucked from 4 and discharged and blown away from the suction nozzle 21 is suction-held.

It is to be noted that the suction holding is performed so that the electronic part 1 and the mouse parts 17a2 to 17e2 are well compatible with each other and that the electronic part 1 is not damaged due to excessive force. 17e2 is formed by molding a sponge-like rubber material or resin material. But,
It is not limited to this. It can be designed in various ways. Further, in order to use the defective product 1b held in the component holding units 17a to 17e for collection, it is preferable to release the suction so that it can be easily carried. Therefore, the on-off valves 37a-3
7e is a three-way valve, and when the retained defective product 1b is to be collected, the suction ports 17a1 to 17e1 can be disconnected from the suction source 34 and at the same time opened to the atmosphere as shown in FIG. 5C. It is preferable to do so. However, the defective product collecting unit 17 can be independently attached and detached, and can be replaced with an empty one each time it becomes full.

A control unit 39 for controlling the above operation
Are mounted on the base 41. The control unit 39 manages the number of discharged defective products 1b that need to be collected, and determines the condition that the component holding units 17a to 17e of the defective product collection unit 17 have reached the condition of being full, and this determination unit 39a. It is provided with a recovery preparation means 39b for temporarily suspending the mounting operation of the electronic component 1 and / or issuing a warning prompting reuse of the defective product 1b to be recovered according to the judgment of the means 39a. As a result, when the condition that the component holders 17a to 17e become full is picked up and collected, the condition that the component holders 17a to 17e are filled with defective products 1b continues, It is possible to prevent the defective product 1b discharged thereafter from being unable to be dealt with.

However, if such a management of fullness is also performed in the defective product discarding unit 18, it is possible to prevent the defective product discarding unit 18 from overflowing the defective product 1b and affecting the others.

A main operation control example by the control unit 39 will be described with reference to the flowchart shown in FIG. In step 1, the suction nozzle 21 suction-holds and picks up the electronic component 1 supplied by the component supply unit 11. In step 2, the suction nozzle 21 is positioned on the image recognition unit 13a, and the quality of the electronic component 1 held is determined by the image recognition. If it is a non-defective product 1a, the process proceeds to step 3, where the suction nozzle 21 is positioned in the thickness inspection unit 13b, and the inspection is performed based on the detection of the thickness of the held electronic component 1. If the product is a non-defective product 1a, the process proceeds to step 4, where the component mounting portion 14 is positioned, and then in step 5, the blow pressure is switched to a low blow pressure for component mounting. Next, in step 6, the non-defective product 1 held by raising and lowering the suction nozzle 21 and positioning the circuit board 2
The electronic component 1 which is a is mounted on the circuit board 2 and step 1
Return to.

If the defective product 1b is found in steps 2 and 3, the process proceeds to step 7, where after the suction nozzle 21 is positioned in the component mounting portion 14, the electronic component 1 discharged as the defective product 1b in step 8 does not need to be collected. Determine if it is a part or a large part that requires recovery.

If it is a small component, the process proceeds to the left side of step 9 to position the defective product discarding portion 18 at a position corresponding to the suction nozzle 21, and if it is a large component, proceed to the right side of step 9 to remove the defective product collecting portion 17. It is positioned at a position corresponding to the suction nozzle 21.

Then, in step 10, the suction nozzle 21 is switched to a high blow pressure for discharging, and the process proceeds to step 11 in which the defective product 1b held by the suction nozzle 21 is replaced with the defective product discarding portion 18 positioned as described above. Alternatively, the defective product 1b is discharged to the defective product collecting unit 17 and used for disposal and collection depending on the necessity of collecting the defective product 1b.

[0042]

According to the present invention, only non-defective products are attached to the object to be attached, while preventing the components judged to be defective from being ejected by the defective product ejecting unit and not being disturbed. Especially, for defective products, the handling is changed according to the necessity of collection, and the discharged defective products are received by the defective product disposal section for disposal and large-sized or special expensive electronic components are discarded. Instead, it can be provided for recovery without being reused, and it is possible to prevent the influence on the environment or the like that might otherwise occur due to disposal. In addition, the defective product collection unit and the defective product disposal unit are used to collect defective products.
Since it is selected and used according to the necessity of receipt,
One work station where the
The two types of handling for the disposal and collection of
It can be achieved at any time. Especially the defective product discharge part
Two defective product collection parts and defective product disposal parts are combined into the component mounting part.
Installed to support the quality of parts and the necessity of collecting defective products.
Then, attach good products, discharge defective products to the defective product collection section,
And by discharging defective products to the defective product disposal section,
Corresponding to the quality of the parts handled and the necessity of collecting defective products
The above three types of processing can be performed in one work station.
It Therefore, the number of work stations required is reduced and
Can be miniaturized. Moreover, this increases the required operation
There is no time loss.
Yes.

[Brief description of drawings]

1A and 1B show one example of Embodiment 1 of the present invention, in which FIG. 1A is a perspective view showing a schematic configuration of a component supply apparatus, and FIG. 1B is a movement trajectory of a component handling tool and each work. It is explanatory drawing which shows arrangement | positioning of a station.

FIG. 2 is a perspective view of the device of FIG. 1 viewed in different directions.

FIG. 3 shows a circuit configuration for switching between suction and blow of a suction nozzle and switching of flow pressure provided in the apparatus of FIG.
The part (a) shows when the component is mounted, and the part (b) shows when the component is discharged.

4 (a) is a perspective view of the whole, and FIG. 4 (b) is a perspective view showing a cross section of one component holder.

5A and 5B show operating states of the component holder of FIG. 4, in which FIG. 5A is a sectional view of a state before suctioning a defective product, FIG. 5B is a sectional view of a suctioned state, and FIG. It is sectional drawing of the defective product lifting state for collection.

6 is a flowchart showing an example of main operation control of a control unit of the apparatus of FIG.

FIG. 7 shows a conventional device, (a) is a perspective view showing a schematic configuration of a component supply device, and (b) is an explanatory diagram showing a movement trajectory of a component handling tool and arrangement of respective work stations.

[Explanation of symbols]

1 electronic components 1a Good product 1b Defective product 2 circuit board 11 Parts supply department 12 Parts handling tools 13 Inspection Department 14 Parts mounting section 15 Defective product discharge section 16 Moving track 17 Defective product collection department 17a to 17e Component holder 17a1 to 17e1 suction port 18 Defective Product Disposal Department 21 Suction nozzle 22, 25 switching valve 34 Suction source 27 Moving table 31 mounting head 35a-35e automatic valve 36a-36e connection line 37a-37e open / close valve

Front page continuation (72) Inventor Hiroshi Ota 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Seiichi Mogi 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. ) Reference JP-A-9-326598 (JP, A) JP-A-10-65392 (JP, A) JP-A-63-128727 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB) Name) H05K 13/04

Claims (6)

(57) [Claims] 1. A a step of adsorbing the suction nozzle a component supplied, the inspection step of determining acceptability of the adsorbed components, a step of mounting the good to the mounting object, a defective that time
Depending on the necessity of collection, discharge defective products so that they can be collected.
And the step of discharging the defective product so that it can be discarded . By moving the moving table, if the picked-up component is the non-defective product, the position of the mounting target needs to be collected.
In the case of defective products, the defective product collection section
In the case of a defective product , align the defective product disposal part with the suction nozzle at the component mounting position, mount the component, and rotate the defective product.
A component mounting method, characterized in that it is used for collecting or for discarding defective products . 2. A defective product collecting unit for collecting defective products by the suction nozzle.
Or use the suction nozzle when discharging to the defective product disposal section.
Switch from suction to blow by mounting the good product
When attaching to the elephant, change the suction nozzle from suction to blow
Perform at a blow pressure higher than the blow pressure when switching
The said defective product is blown away, The claim 1 characterized by the above-mentioned.
Component mounting method. 3. A defective product collecting unit is configured to collect defective products into a plurality of parts.
The component mounting method according to any one of claims 1 and 2, wherein the component is individually received and held by a holding unit . 4. A component supply unit, the component and the suction nozzle for sucking the component supplied by the supply unit, the inspection unit determines the acceptability of the component adsorbed, component mounting portion to provide a mounting target non-defective mounting Depending on whether it is necessary to collect defective products ,
The defective product collection section that discharges good products and collects them
Defective product discarding unit for discharging and discarding, inspection of the suction nozzle for quality of the component, mounting of the good product at the component mounting unit, discharging of the defective product to the defective product collecting unit, the defect
Subjecting the discharge into defective discarding of goods, in the component mounting apparatus and a component handling mechanism for return Ri order Tsugiku with a certain movement trajectory, wherein the defective product disposal unit defective recovery unit And the component mounting part
And the object to be mounted on the component mounting section, the defective product
Recovery unit, said defective disposal unit, the component mounting apparatus characterized by comprising a moving mechanism for moving the position of the suction Nozzle in the component mounting position. 5. The defective product collecting section receives the defective products individually.
The component mounting apparatus according to claim 4, further comprising a plurality of component holders . 6. The suction nozzle is divided into suction and blow.
Changeover valve and blow pressure of the suction nozzle in two stages
6. The component mounting apparatus according to claim 4, further comprising a switching valve that switches .