JP3469522B2 - Material processing apparatus and method for thin film magnetic head - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin-film magnetic head material processing apparatus and method for polishing a thin-film magnetic head material in which slider portions each including a thin-film magnetic head element are arranged in a line.

[0002]

2. Description of the Related Art A floating thin film magnetic head used in a magnetic disk device or the like is generally constituted by a slider having a thin film magnetic head element formed at its rear end. The slider generally has a rail portion whose surface is a medium facing surface (air bearing surface), and
A taper portion or a step portion is provided in the vicinity of the end portion on the air inflow side, and the rail portion is slightly floated above the surface of a recording medium such as a magnetic disk due to the airflow flowing from the taper portion or the step portion.

In general, a slider is cut in one direction on a wafer in which portions each of which is a slider including a thin film magnetic head element (hereinafter referred to as slider portions) are arranged in a plurality of rows, and the slider portions are arranged in one row. It is manufactured by forming a material called a bar, which is cut into pieces, and cutting the bar to separate the sliders. The surface of the bar that becomes the medium facing surface (hereinafter, referred to as the medium facing surface for convenience) has
After the bar is formed or before the bar is formed, processing such as lapping and formation of a rail portion is performed.

In the manufacturing process of the slider as described above, the bar opposite to the medium facing surface is lapped after the medium facing surface of the bar is processed, or the medium facing surfaces are opposed to each other. In some cases, the final slider thickness and profile of the medium facing surface are managed by lapping two surfaces of the block-shaped material in which the slider portions are arranged in two rows on the side opposite to the medium facing surface. is there.

Conventionally, as a method of lapping a surface (hereinafter, referred to as a back surface) opposite to the medium facing surface in the above-mentioned material for a thin film magnetic head, the following 2 methods are used.
There were two ways.

The first method is a method of lapping the back surface before lapping the medium facing surface. This method
It is mainly applied when using a block-shaped material in which the slider portions are arranged in two rows so that the medium facing surfaces face each other. When this material is used, both sides of the material are applied using a double-sided wrapping device. I often wrap.

The second method is a method of lapping the medium facing surface and then the back surface. This method
It is applied when a bar formed by cutting a wafer in which the slider portions are arranged in a plurality of rows so as to face the same direction in one direction is used. In this method, the back surface of the bar is bonded to a predetermined jig, the medium facing surface of the bar is lapped, then the bar is removed from the jig, the medium facing surface of the bar is bonded to the jig, and the bar The back side is often wrapped.

In any of the above two methods, it is necessary to control the working (lapping) so that the thickness of the material as the work (work) becomes a desired value. In order to control the thickness of the material in this way, conventionally, for example, the processing time has been controlled. In the processing operation in this case, the worker measures the thickness of the material and sets the processing time corresponding to the thickness in the processing apparatus to process the material. In this processing operation, in order to increase the processing accuracy, the operator stops the processing once or more in the middle to measure the thickness of the material and adjust the processing time.

[0009]

In recent years, in order to realize high density recording, a small flying height and a small slider are desired. The accuracy of the thickness of the thin-film magnetic head material greatly affects not only the accuracy of the slider thickness but also the accuracy of the slider rail formation. Therefore, in order to realize a small slider having a low flying height, it is necessary to accurately control the thickness of the thin-film magnetic head material.

However, in the method of processing the back surface of the material for a thin film magnetic head by controlling the processing time as described above, there are large variations in the state of the surface plate, slurry, etc. and the processing by the operator, and the processing accuracy is low. . Therefore, it is difficult to control the thickness of the thin-film magnetic head material with high accuracy. Further, in order to increase the processing accuracy, it is necessary for an operator to repeatedly measure the thickness of the material and process it repeatedly, which results in an increase in the number of steps and inferior work efficiency.

In particular, when the back surface of the bar is lapped on the medium facing surface, the slider portion is 2
Since the number of lapping steps is larger than the case of lapping both sides of the block-shaped material arranged in rows, the above-mentioned poor working efficiency becomes remarkable. Also, when lapping the back surface after lapping the medium facing surface of the bar,
When the measurement and processing of the material thickness are repeated many times, the medium facing surface after lapping deteriorates and electrostatic discharge (ES
There is a problem that a thin film such as a GMR (giant magnetoresistive) film is destroyed by D).

The present invention has been made in view of the above problems, and a first object thereof is to improve the accuracy and efficiency of the polishing process of the material for a thin film magnetic head. A processing apparatus and method are provided.

A second object of the present invention is, in addition to the above-mentioned first object, that the surface of the thin film magnetic head material opposite to the medium facing surface is polished while the medium facing surface is protected. An object of the present invention is to provide a material processing apparatus and method for a thin-film magnetic head that is made possible.

[0014]

In the thin-film magnetic head material processing apparatus of the present invention, a thin-film magnetic head material having slider portions each including a thin-film magnetic head element arranged in a line is polished. Processing means, first detection means for detecting a reference position, second detection means for detecting a position that changes according to the thickness of the material, reference position detected by the first detection means, and second And a control means for recognizing the thickness of the material based on the position detected by the detection means and controlling the processing means so that the thickness of the material becomes a predetermined value.

In the thin-film magnetic head material processing apparatus of the present invention, the reference position is detected by the first detecting means, and the second position is detected.
The detecting means detects the position that changes according to the thickness of the material, and the control means recognizes the thickness of the material based on each position detected by the two detecting means, and the thickness of the material becomes a predetermined value. Thus, the processing means is controlled.

In the processing apparatus of the present invention, the processing means has a rotating surface plate, and the processing apparatus further includes a processing jig for holding the material such that the surface of the material to be polished is in contact with the surface plate. It is provided.

The processing jig holds a material having a belt-shaped protective member attached to the surface opposite to the surface to be polished, and allows the material to pass through at the lower end to prevent the protective member from passing therethrough. It has a 1st member in which a hole was formed, and a 2nd member which pinches a protection member between the 1st member and is combined with the 1st member .

The second detecting means changes according to the thickness of the material.
The position of the upper surface of the second member is detected as the position to be converted.
It

Even if a plurality of holes are formed in the first member,
Good. Also, as the first member, the length and arrangement of holes are small.
At least one has a plurality of different first members
Good. In addition, in the plurality of types of first members,
The positions of the outer circumference may be unified.

In the processing apparatus of the present invention, the first detecting means and the second detecting means may be attached to the same arm.

In the processing apparatus of the present invention, the first detecting means and the second detecting means may intermittently perform the detecting operation.

Further, in the processing apparatus of the present invention, the control means may recognize the thickness of the material based on a plurality of detection results of the first detection means and the second detection means.

The thin film magnetic head material processing method of the present invention comprises a processing means for polishing the thin film magnetic head material in which the slider portions each including the thin film magnetic head element are arranged in a row, and a reference position. A method for processing a material for a thin-film magnetic head using a processing device including a first detection means for detecting the position and a second detection means for detecting a position that changes according to the thickness of the material, A procedure for detecting the reference position by the first detection means and a position that changes according to the thickness of the material by the second detection means, a reference position detected by the first detection means, and a second position
The procedure for recognizing the thickness of the material based on the position detected by the detection means and the procedure for controlling the processing means so that the thickness of the material becomes a predetermined value based on the recognized thickness. It includes and.

In the processing method of the present invention, the processing means has a rotating surface plate, and the processing apparatus further comprises a material polishing process.
Holds the material so that the surface to be contacted contacts the surface plate
Equipped with a processing jig.

Further, in the processing method of the present invention, the processing jig, the polishing the surface to be one that retains the material pasted belt-shaped protective member on the opposite side, the lower end portion In, there is provided a first member having a hole through which the material is passed and a protection member is not passed, and a second member which holds the protection member between the first member and is coupled to the first member. It is a thing.

In the detecting procedure, the second detecting means
Is the position that changes according to the thickness of the material
Detect the position of the top surface of the material.

Even if the first member has a plurality of holes,
Good. Further, in the processing method of the present invention, the first member and
Multiple types with different hole lengths and / or arrangements
A first member of the class may be provided. Also, multiple types of
In 1 member, you may unify the position of the outermost periphery of the hole.
Yes.

In the processing method of the present invention, the first detecting means and the second detecting means may be attached to the same arm.

In the processing method of the present invention, the position may be detected intermittently as the detecting procedure.

Further, in the processing method of the present invention, the recognizing procedure may recognize the thickness of the material based on a plurality of detection results of the first detecting means and the second detecting means.

[0031]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a front view showing the overall configuration of a thin-film magnetic head material processing apparatus (hereinafter simply referred to as a processing apparatus) according to an embodiment of the present invention. 2 and 3 are front views showing a main part of the processing apparatus according to the embodiment of the present invention. 2 shows the state during the adjusting operation, and FIG. 3 shows the state during the processing operation.

The processing apparatus according to this embodiment comprises an apparatus body 1 for polishing a work material, and a control panel 2 for inputting information about the work material, processing conditions, and various displays. I have it. In the present embodiment, the work material is a thin film magnetic head material (hereinafter referred to as a bar) in which portions each of which serves as a slider including a thin film magnetic head element are arranged in a line. Further, in the present embodiment, the polishing process is lapping. The device body 1 includes three surface plates 3 and two vertical shafts 4 provided for each surface plate 3.
And an arm 5 provided for each vertical axis 4. The arm 5 is connected to the vertical shaft 4 so as to be movable in the vertical direction and the horizontal direction (front-back direction).

A spline shaft 6 is attached to the arm 5 so as to be vertically movable. A keeper 7 for holding a work piece is attached to the lower end of the spline shaft 6. A weight 8 is attached near the upper end of the spline shaft 6.

The arm 5 has a reference position sensor 11 as a first detecting means for detecting a reference position, and a second detecting means for detecting a position corresponding to the thickness of the workpiece changed by machining. And the work material thickness sensor 12 of FIG. The reference position sensor 11 is arranged at a position outside the outer peripheral portion of the surface plate 3. The workpiece thickness sensor 12 is arranged at a position above the keeper 7.
Below the reference position sensor 11, a block-shaped reference base 13 for indicating the reference position is provided. The reference position sensor 11 detects the position of the upper surface of the reference base 13 as the reference position. The work material thickness sensor 12 detects the position of the upper surface of the keeper 7 as a position corresponding to the thickness of the work material that changes due to processing.

Reference position sensor 11 and workpiece thickness sensor 1
2 may be a contact sensor or a non-contact sensor. As a contact type sensor, "T" manufactured by TESA
ESA Module " (trademark) or the like can be used. As the non-contact type sensor," Microsense " (trademark) or the like manufactured by ADE can be used. Since the temperature in the vicinity may change, it is preferable to use those having good temperature characteristics as the sensors 11 and 12. As a sensor having good temperature characteristics, for example, a glass scale type sensor (for example, Union Tool Co.) is used. is there.

FIG. 4 is a block diagram showing the circuit configuration of the processing apparatus according to this embodiment. Note that FIG. 4 shows only a portion corresponding to one arm 5. As shown in FIG. 4, the processing apparatus includes a drive unit 15 that drives the surface plate 3 and the arm 5, and a control unit 16 that controls the drive unit 15. The control panel 2, the reference position sensor 11, and the workpiece thickness sensor 12 are connected to the control unit 16. The control unit 16 controls the drive unit 15 according to the information of the work material input from the control panel 2, the processing conditions, and the like, and the reference position and the work material thickness sensor 12 detected by the reference position sensor 11. Recognize the thickness of the work piece based on the position detected by
The drive unit 15 is controlled so that the thickness of the work material becomes a predetermined value. The control unit 16 also causes the control panel 2 to display information such as the recognized thickness of the work material. Control unit 16
Is configured by a computer, for example. The control unit 16 corresponds to the control means in the present invention.

Next, with reference to FIG. 5 to FIG. 7, a processing jig in the present embodiment for holding the work material so that the surface to be polished of the work material contacts the surface plate 3 will be described. To do. 5 is a cross-sectional view showing a state in which the work material is fixed to the processing jig, FIG. 6 is a perspective view showing the work material, and FIG. 7 is a plan view showing a carrier of the processing jig.

As shown in FIG. 6, the work piece 20, that is, the bar has an elongated plate shape. The workpiece 20 has a surface (hereinafter referred to as a back surface) opposite to a surface serving as a medium facing surface (hereinafter, referred to as a medium facing surface for convenience) (hereinafter, referred to as a back surface) according to the present embodiment. It is designed to be polished by. At the time of this polishing process, the workpiece 20 is a jig for processing in a state where the belt-shaped protection member 21 is attached to the surface of the workpiece 20 opposite to the surface to be polished, that is, the medium facing surface. To be held by. The width of the protection member 21 is larger than the width of the work piece 20.

The protective member 21 has an appropriate elasticity.
The thickness of the protective member 21 is preferably about 90 to 150 μm. As the protective member 21, for example, a member in which a pressure-sensitive adhesive layer is laminated on a base material can be used. As a material forming the base material, for example, an organic material such as polyvinyl chloride (PVC), polyethylene terephthalate (PET), or polyolefin can be used. As the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer, for example, an organic pressure-sensitive adhesive such as a general acrylic pressure-sensitive adhesive can be used.

Further, as the protective member 21, an ultraviolet curable tape whose adhesive layer is made of an ultraviolet (UV) curable material may be used. An example of such an ultraviolet curable tape is the UV curable dicing tape "D series" (trade name) manufactured by Lintec Corporation. With such a UV curable tape, when it is exposed to UV light,
The adhesive strength of the adhesive layer is reduced. Therefore, when such a UV-curable tape is used as the protective member 21, when the protective member 21 is peeled from the work piece 20, the protective member 21 is irradiated with ultraviolet rays so that the adhesive does not remain. The protective member 21 can be easily peeled off from the work piece 20.

As the protective member 21, a heat-peelable tape whose adhesive layer is made of a heat-peelable material may be used. As such a heat-peelable tape, for example,
"Sky Sheet" (trade name) manufactured by Nika Seiko Co., Ltd.,
There is "Riva Alpha" (trade name) manufactured by Nitto Denko Corporation. With such a heat-peelable tape, when heated,
The adhesive strength of the adhesive layer is reduced. Therefore, by using such a heat-peelable tape as the protective member 21, by heating the protective member 21 when the protective member 21 is peeled from the work piece 20, there is no adhesive residue and the adhesive can be easily removed. In addition, the protection member 21 can be separated from the work piece 20.

As the protective member 21, an antistatic tape having a base material containing a conductive substance and having an antistatic function may be used. Such an antistatic tape is manufactured by Toyo Chemical Co., Ltd. ELEGRIP "E series" (trademark)
Name) . As such a protection member 21, such an antistatic tape is used, and the tape is used to protect the medium facing surface of the slider to electrostatically destroy the slider in the bar, and in particular, a thin film in the bar due to human handling or the like. It is possible to prevent electrostatic breakdown of the magnetic head element.

Further, as the protective member 21, a dry film resist used in photolithography may be used. As such a dry film resist,
For example, "Banks Dry Film Photoresist U-120" (trade name) manufactured by Fuji Film Orin Co., Ltd.
There is. When such a dry film resist is used as the protective member 21, the dry film resist can be used as a photoresist used when forming a rail portion described later.

As shown in FIGS. 5 and 7, the processing jig has a carrier 30 and a keeper 7. The carrier 30 has a thick cylindrical portion 30a and a disc-shaped disc portion 30b formed so as to close the lower end portion of the cylindrical portion 30a. A plurality of holes 30c having a size that allows the workpiece 20 to pass through and the protection member 21 not to pass through are formed in the disc portion 30b. The thickness of the disk portion 30b is smaller than the desired thickness of the workpiece 20 after processing. The workpiece 20 is inserted into the hole 30c of the disk portion 30b, and the lower end surface thereof, that is, the surface to be polished is the disk portion 3
It projects downward from 0b and contacts the surface plate 3. The protection member 21 is locked by the peripheral portion of the hole 30c in the disc portion 30b.

The keeper 7 has a cylindrical portion 30 of the carrier 30.
It has a cylindrical shape having an outer shape slightly smaller than the inner diameter of a. The keeper 7 is a cylindrical portion 3 of the carrier 30.
0a, the lower end surface and the disk portion 3 of the carrier 30.
The protective member 21 is sandwiched between the protective member 21 and the workpiece 0b, and the protective member 21 and the workpiece 20 are held.

A plurality of hook-shaped engaging portions 30d extending downward from the upper end portion and further extending in the horizontal direction are provided on the inner peripheral portion of the cylindrical portion 30a of the carrier 30. on the other hand,
The outer periphery of the keeper 7 has an engaging portion 30d of the carrier 30.
Is provided with a pin 7a. The keeper 7 and the carrier 30 are coupled to each other by engaging the pin 7a and the engaging portion 30d.

At the center of the upper end of the keeper 7, an attachment 7b that engages with the lower end of the spline shaft 6 is provided. A plurality of hook-shaped engaging portions 7c extending downward from the upper end portion and further extending in the horizontal direction are provided on the outer peripheral portion of the attachment 7b. Although not shown, the attachment 7 is attached to the lower end of the spline shaft 6.
A cylindrical portion into which b is inserted is provided, and a pin that engages with the engaging portion 7c of the attachment 7b is provided on the inner peripheral portion of this cylindrical portion. The lower end of the spline shaft 6 and the attachment 7b are coupled to each other by the engagement of the pin of the spline shaft 6 and the engaging portion 7c. In addition, the keeper 7 has a spline shaft 6
The weight of the weight 8 is applied via the.

The carrier 30 corresponds to the first member of the present invention, and the keeper 7 corresponds to the second member of the present invention. Further, the hole 30c of the carrier 30 is formed in the work piece 20.
Is a position defining portion for arranging at a predetermined position .

The processing jig composed of the carrier 30 and the keeper 7 described above is adapted to be rotated with the rotation of the surface plate 3 or forcibly.

In the processing apparatus according to this embodiment, the holes 30
A plurality of types of carriers 30 having different lengths and arrangements of c are provided. Also, multiple types of carriers 3
At 0, the outermost positions of the holes 30c are unified.

FIGS. 8 to 18 are plan views showing examples of a plurality of types of carriers 30. In these figures, the chain double-dashed line represents the position of the outermost periphery of the unified hole 30c. In the present embodiment, the lengths of the holes 30c are D ₁ in order of increasing length so that the workpieces 20 having four types of lengths can be accommodated.
D _2, D _3, are four ready for D _4.

In the carrier 30 shown in FIG. 8, the length D ₁
6 holes 30c are arranged in parallel. In the carrier 30 shown in FIG. 9, eight holes 30c having a length D ₂ are arranged in parallel. In the carrier 30 shown in FIG. 10,
Eight holes 30c of length D ₃ are arranged in parallel. In the carrier 30 shown in FIG. 11, eight holes 3 having a length D ₄ are provided.
0c are arranged in parallel.

In the carrier 30 shown in FIG. 12, the length D
₁The holes 30c of 2 are set as one set, and the three sets of holes 30c are
Are arranged at an angle of 60 °. Shown in FIG.
For carrier 30, length D₂2 holes 30c as a set
Are arranged so that the three sets of holes 30c form 60 ° with each other.
Has been. In the carrier 30 shown in FIG. 14, the length D ₃
The holes 30c of 2 are set as one set, and the three sets of holes 30c are mutually
It is arranged to form an angle of 60 °. The key shown in FIG.
For carrier 30, length D_Four2 holes 30c as a set
Are arranged so that the three sets of holes 30c form 60 ° with each other.
Has been.

In the carrier 30 shown in FIG. 16, the center line is
On one side, length D₁~ D_FourNo 4 types of holes 30c
Are placed in parallel with each other, and are also point-symmetrical to them
Similarly, four holes 30c are arranged. Shown in Figure 17
In the carrier 30, the length D is provided on one side of the center line.₂of
One hole 30c and length D₃2 holes 30c and length D_Fourof
One hole 30c is arranged parallel to each other,
Similarly, four holes 30c are arranged at positions symmetrical with respect to
It In the carrier 30 shown in FIG. 18, the length D ₁One of
Hole 30c and length D₂And one hole 30c of
Are arranged so that the three sets of holes 30c form 60 ° with each other.
Has been.

Next, the operation of the processing apparatus according to the present embodiment and the method for processing a thin film magnetic head material according to the present embodiment (hereinafter, simply referred to as a processing method) will be described.
The processing apparatus according to the present embodiment performs the following adjustment operation before processing the work material. In this adjusting operation, as shown in FIG. 2, at the lower end of the spline shaft 6,
A keeper 7 having a known standard thickness is attached, and the keeper 7 is brought into contact with the upper surface of the surface plate 3. Next, by the reference position sensor 11, the reference base 13 is set as the reference position.
Of the workpiece material thickness sensor 12 while detecting the position of the upper surface of the workpiece.
The position of the upper surface of the keeper 7 is detected by. The control unit 16 recognizes and stores the relative positional relationship between the reference position and the position of the upper surface of the keeper 7, based on the information on the positions detected by the sensors 11 and 12. The adjusting operation may be performed by stopping the surface plate 3 or rotating the surface plate 3, but it is preferable to rotate the surface plate 3 for the reason described below. Further, the adjustment need not be performed every time before the machining operation, and may be performed at an appropriate frequency.

At the time of processing the work piece, as shown in FIG. 3, the work piece 20 held by the keeper 7 is placed on the surface plate 3
The workpiece 20 is abraded by the contact of the surface plate 3 and the surface plate 3 rotating. During the processing operation, the reference position sensor 11 detects the reference position, and the workpiece thickness sensor 12 detects the position of the upper surface of the keeper 7. Control unit 16
Recognizes the relative positional relationship between the reference position and the position of the upper surface of the keeper 7, based on the information on the positions detected by the sensors 11 and 12. And this positional relationship
The thickness of the work piece 20 is recognized by comparing with the positional relationship which is recognized and stored by the adjusting operation.

Next, referring to the flow chart of FIG. 19 and FIG.
The procedure of processing work will be described. In this processing work,
First, the work piece 20 is fixed to the keeper 7 (step S
101). The thickness of the keeper 7 used here is
It is the same as the keeper 7 used at the time of adjustment and is known. Next, as shown in FIG. 3, the keeper 7 is fixed to the processing device (step S102). Next, the control panel 2 is used to input information about the workpiece 20 such as the length and number of the workpiece 20 and processing conditions. The input of the processing conditions includes setting the desired thickness of the workpiece 20 after processing. Next, the work 20 is processed and the thickness recognition operation is performed (step S103). In the processing operation, the work piece 20 held by the keeper 7 contacts the surface plate 3 and the surface plate 3 rotates to polish the work material 20. During processing operation,
The control unit 16 controls the drive unit 1 according to the input information and conditions.
5 is controlled, and the thickness of the workpiece 20 is recognized based on the reference position detected by the reference position sensor 11 and the position detected by the workpiece thickness sensor 12. Next, the control unit 16 determines whether or not to finish the processing by determining whether or not the thickness of the work material 20 has reached the set thickness (step S104), and finishes the processing. If not (N), step S103 is continued.
When the thickness of the work material 20 reaches the set thickness and the processing is ended (step S104; Y), the processing by the processing device is ended. Finally, the thickness of the workpiece is measured and evaluated (step S105), and the working operation is completed.

When the sensors 11 and 12 are non-contact type sensors, the position detection by the sensors 11 and 12 during the machining operation may be performed continuously or intermittently. When the sensors 11 and 12 are contact type sensors,
In order to suppress the wear of the sensors 11 and 12, it is preferable to intermittently detect the positions of the sensors 11 and 12 during the machining operation. When the position detection by the sensors 11 and 12 is performed intermittently, as shown in FIG. 3, the arm 5 is moved in the vertical direction, and the sensors 11 and 12 are respectively used as the reference only when the position is detected. The base 13 and the keeper 7 are brought into contact with each other.

Further, the sensors 11, 1 during the machining operation
When the position detection by 2 is performed intermittently, the work piece 2
The detection cycle may be shortened stepwise as the thickness of 0 approaches the set value.

When the thickness of the work piece 20 is measured based on the detection values of the sensors 11 and 12, the position detection by the sensors 11 and 12 is performed a plurality of times for each measurement, and the measurement is performed based on the plurality of detection values. The thickness of the work piece 20 may be obtained by performing a calculation using a statistical method by the control unit 16. This makes it possible to more accurately recognize the absolute thickness of the work piece 20.

For example, when the surface plate 3 is rotated, the surface plate 3 and the keeper 7 may be undulated at the position of the upper surface of the keeper 7. Therefore, the sensors 11, 12
In order to prevent the thickness of the work piece 20 that is recognized based on the detected value from fluctuating due to undulations, the thickness of the work piece 20 may be recognized as follows.
First, the adjusting operation is performed while rotating the surface plate 3. At this time, by generating a signal indicating the rotational position of the surface plate 3 and determining the detection timing of the sensors 11 and 12 based on this signal, the positions of the sensors 11 and 12 at the plurality of rotational positions of the surface plate 3 are determined. Detect. This allows
The absolute position of the upper surface of the keeper 7 including the undulation, that is, the correspondence between the rotational position of the surface plate 3 and the absolute position of the upper surface of the keeper 7 is recognized. This correspondence is, for example,
It is represented by a sine curve when the horizontal axis represents the rotational position of the surface plate 3 and the vertical axis represents the absolute position of the upper surface of the keeper 7. Similarly, during the machining operation, the positions of the surface plate 3 are detected by the sensors 11 and 12 at a plurality of rotational positions, and the absolute position of the upper surface of the keeper 7 including the undulation, that is, the surface plate 3 is detected.
Recognize the correspondence between the rotational position of and the absolute position of the upper surface of the keeper 7. This correspondence relationship is also represented by, for example, a sine curve. Then, by comparing the correspondence relationship recognized during the adjusting operation with the correspondence relationship recognized during the processing operation, it is possible to accurately recognize the absolute thickness of the work material 20 from which the swell component has been removed. it can. When comparing the correspondence relationship recognized during the adjusting operation and the correspondence relationship recognized during the machining operation, the portions corresponding to each other are obtained by, for example, obtaining the correlation between the two correspondence relationships (for example, two sine curves). May be accurately obtained and compared.

Next, with reference to FIGS. 20 to 26, steps from the wafer through the bar which is the workpiece 20 in the present embodiment to the manufacture of the slider will be described.

In this step, first, a plurality of types of blocks having different widths are cut out from a disk-shaped wafer in which slider portions including thin film magnetic head elements are arranged in a plurality of rows. FIG. 20 shows an example of how to cut out this block. In this example, three types of blocks 111A, 111B, and 111C are cut out from the wafer 101. In FIG. 20, a row of slider portions extends in the left-right direction, and a plurality of rows of the slider portions are arranged in the vertical direction. Further, the widths of the blocks 111A, 111B, and 111C refer to the blocks 111A, 111B, and 1 in FIG.
11C is the length in the left-right direction. Block 111A, 1
Among 11B and 111C, the width of the block 111A is the largest, the width of the block 111B is the next largest, and the width of the block 111C is the smallest. Each block 1
Each of 11A, 111B, and 111C has a constant width including the slider portions arranged in a plurality of rows.

Next, as shown in FIG. 21, block 1
11 (representing 111A, 111B, and 111C), the end face opposite to the end face 131 on which the surface serving as the medium facing surface appears is joined to the processing jig 132.

Next, as shown in FIG. 22, the jig 132
The end surface 131 of the block 111 joined to the substrate, that is, the surface which becomes the medium facing surface is subjected to grinding (grinding) using a grinding device, polishing (lapping) using a polishing device 133, etc. Precisely specify the height. The MR height is the length (height) from the end of the MR (magnetoresistive) element on the medium facing surface side to the end on the opposite side. The throat height means the length (height) from the end of the magnetic pole portion of the inductive magnetic conversion element on the medium facing surface side to the end on the opposite side.

Next, as shown in FIG. 23, a protection member 134 is attached to the end surface 131 so that the polished end surface 131 is not damaged or corroded.

Next, as shown in FIG. 24, the end surface 131
With the protective member 134 covered,
The block 111 is cut so that the slider portion for one row including the end face 131 is separated from the remaining block 111. The slider portion for one row separated from the block 111 is a bar 14 made up of the slider portion for one row after processing.
It becomes 1. As long as there is the rest of the block 111, processing and cutting of the surface which becomes the medium facing surface is repeatedly executed.

Next, the protective member 134 is cut into an appropriate size to form the protective member 21 shown in FIGS. 5 and 6. The bar 141 corresponds to the work piece 20 shown in FIGS. 5 and 6.
Becomes Then, the back surface of the bar 141 (workpiece 20) is lapped by the processing apparatus according to the present embodiment. By this lapping, the final slider thickness and the profile of the medium facing surface are managed.

Next, as shown in FIG. 25, a plurality of bars 141 are arranged side by side, a photoresist pattern for etching is formed on the medium facing surface of the bar 141, and the bar is formed using this photoresist pattern. 141 is etched by dry etching to form a rail portion on the medium facing surface of the bar 141.

Next, as shown in FIG. 26, a plurality of bars 141 having rail portions are arranged side by side and attached to an IC tape, and the bars 141 are cut by a cutting device to form sliders 151.

As described above, according to the processing apparatus or method according to the present embodiment, the absolute thickness of the work material is recognized and the thickness of the work material becomes a predetermined value. Since the processing is automatically performed, it is possible to automatically perform processing on the work material so as to have a desired thickness, and it is possible to perform the work on the work material with high accuracy.

Further, in the present embodiment, the reference position sensor 11 for detecting the reference position and the workpiece thickness sensor 1 for detecting the position corresponding to the thickness of the workpiece changed by working.
2 is provided, and the absolute thickness of the work piece is recognized based on the detection information from both sensors 11 and 12. Therefore, according to the present embodiment, the absolute thickness of the work piece can be easily and accurately recognized by comparing the detection information of the sensors 11 and 12 without increasing the precision of the machine control system more than necessary. As a result, the accuracy of processing can be improved.

Further, when the working time is controlled so that the work piece has a desired thickness, the working process and the measuring / evaluating process are repeated twice or more, resulting in poor work efficiency. On the other hand, according to the present embodiment, since the absolute thickness of the work piece can be accurately recognized, the work piece having a desired thickness can be obtained in one processing step, which improves the efficiency of the working work. Can be made. For example, according to the present embodiment, as compared with the case where the machining time is controlled, the efficiency of the machining work is improved by 1.5 times or more (in other words, the time of the machining work is shortened to 2/3 or less). You can

Further, according to the present embodiment, it is not necessary to measure and set the thickness of the work material before processing, so that an error in measurement and setting by an operator does not occur. Also,
According to the present embodiment, the measurement and evaluation steps in the course of processing are unnecessary, so that it is possible to prevent quality deterioration due to electrostatic discharge (ESD), corrosion, and the like.

Further, according to this embodiment, since the two sensors 11 and 12 are attached to the same arm 5, the two sensors 11 and 12 can be used both when the surface plate 3 is stopped and when it is rotated. The positional relationship of can be kept constant.
As a result, the accuracy of recognizing the absolute thickness of the work piece can be further increased, and the processing accuracy can be further improved.

Further, according to the present embodiment, the protection member 2
Since the back surface of the bar, which is the work piece 20, can be processed while the medium facing surface of the bar is protected by 1, it is possible to prevent the medium facing surface from being damaged or corroded.

Further, according to the present embodiment, the carrier 3
Since the protection member 21 is sandwiched between 0 and the keeper 7, the work piece 20 is fixed to the working jig including the carrier 30 and the keeper 7. Therefore, the work piece 20 is fixed to the working jig. It becomes easier and automation of processing work becomes easier. Further, in the present embodiment, since the keeper 7 is provided with the attachment 7b that engages with the lower end portion of the spline shaft 6, the spline shaft 6 and the keeper 7 are provided.
This facilitates the work of coupling with, which also facilitates the automation of the processing work.

Further, according to the present embodiment, the keeper 7
Between the work piece 20 and the work piece 20 having appropriate elasticity
1, the protective member 21 absorbs the change in the thickness of the work piece 20 even if the work piece 20 has a taper, so that the work piece 20 and the surface plate 3 are brought into smooth contact with each other. be able to. Moreover, since a larger load is applied to the thick portion of the work material 20 through the protective member 21 as compared with the thin portion, the work material 20 is polished during the polishing process. The taper is reduced, and the parallelism of the workpiece 20 can be improved. For the same reason, it is possible to reduce variations in the thickness of the plurality of workpieces 20 fixed to one processing jig.

By the way, the carrier 30 and the keeper 7
Since the processing jig consisting of rotates on the surface plate 3,
The degree of polishing of the workpiece 20 changes depending on the position where the workpiece 20 is fixed to the processing jig. Further, the manner of wear of the surface plate 3 differs depending on the fixing position of the workpiece 20 with respect to the processing jig, and as a result, the degree of wear of the surface plate 3 is deviated depending on the location. This bias deteriorates the profile of the surface to be polished of the workpiece 20, and thus the profile of the medium facing surface, which is the surface opposite to the surface to be polished.

On the other hand, in this embodiment, the hole 30c is formed.
At least one of the length and the arrangement of the holes is different and the hole 30c
A plurality of types of carriers 30 having the same outermost peripheral position are prepared. Therefore, in the present embodiment, the work piece 20
Despite different lengths, the outermost circumference of the work piece 20 draws substantially the same circumferential orbit on the surface plate 3. As a result, according to the present embodiment, it becomes possible to perform polishing processing on a plurality of types of work pieces 20 having different lengths under substantially the same conditions, and at the same time, to determine the extent of wear of the surface plate 3. It is possible to prevent the occurrence of bias due to. As a result, according to the present embodiment, it is possible to perform stable and highly accurate processing over a long period of time, and it is possible to improve the accuracy of the profile of the medium facing surface. Further, the life of the surface plate 3 can be extended to about 1.5 times, for example.

Here, referring to FIGS. 27 to 29,
The change in the thickness distribution of the work material before and after processing by the processing device according to the present embodiment will be described. FIG. 27
FIG. 4 shows an example of distribution of thicknesses of a plurality of workpieces before being processed by the processing apparatus according to the present embodiment. FIG. 28 shows a thickness distribution after the same plural workpieces are processed by the processing apparatus according to the present embodiment. 27 and 28, the vertical axis represents the thickness of the work material, and the horizontal axis represents the number of work materials.
When the processing is performed by the conventional method of controlling the processing time, the thickness distribution of the processed material after processing is about the same as that in FIG.

FIG. 29 is a diagram showing a comparison of the thicknesses of a plurality of workpieces before and after processing by the processing apparatus according to the present embodiment. In FIG. 29, the horizontal axis represents the thickness of the work material, and the horizontal axis represents each work material. In FIG. 29, the upper point represents the thickness before processing,
The lower point represents the thickness after processing. From FIGS. 27 to 29, it can be understood that the processing apparatus according to the present embodiment can accurately process the workpiece so that the thickness of the workpiece becomes a desired value. According to the present embodiment, it is possible to reduce the variation in thickness to about 1/2 as compared with the case where the processing time is controlled so that the workpiece has a desired thickness.

The present invention is not limited to the above embodiment, but various modifications can be made. For example, the first detection means and the second detection means may each have a plurality of sensors, and the position may be obtained by averaging the detection values of the respective sensors.

[0084]

As described above, according to the material processing apparatus for a thin film magnetic head or the material processing method for a thin film magnetic head of the present invention , the reference position is detected by the first detecting means, and the second detecting means is used. A position corresponding to the thickness of the material for the thin film magnetic head is detected, the thickness of the material is recognized based on each position detected by the two detecting means, and the processing means is arranged so that the material thickness has a predetermined value. Since the control is performed, it is possible to improve the precision and efficiency of the polishing process of the thin-film magnetic head material.

According to the material processing apparatus for a thin film magnetic head or the material processing method for a thin film magnetic head of the present invention , a belt-shaped protective member is provided on the surface opposite to the surface to be polished by the processing jig. Since the adhered material is held, the surface opposite to the medium facing surface can be polished while the medium facing surface of the thin film magnetic head material is protected.

Material processing for the thin film magnetic head of the present invention
In the apparatus or the material processing method for the thin film magnetic head,
At the lower end of the work jig, pass the material through and pass through the protective member.
Between the first member having a hole not formed and the first member
The protective member is sandwiched by the first member and is connected to the first member.
2 member, and the 2nd detection means responds to the thickness of the material.
The position of the upper surface of the second member is detected as the position that changes.
Put out. Therefore, according to the present invention, the reference position and the second part
Recognizing the relative positional relationship with the position of the top surface of the material,
Therefore, the thickness of the material can be recognized.

Material processing for the thin film magnetic head of the present invention
In the apparatus or the material processing method for the thin film magnetic head,
As the first member of the work jig, the length and arrangement of holes are small.
Both are different and the position of the outermost periphery of the hole is unified.
If several kinds of first members are prepared, the lengths will differ.
Almost the same conditions for several types of thin film magnetic head materials
Depending on the situation, it is possible to perform polishing processing.
It

[0088] Further, in the thin-film magnetic head material processing device or material processing method for a thin film magnetic head of the present invention, when fitted with a first detector and second detector in the same arm, a first The positional relationship between the detection means and the second detection means can be kept constant, the recognition accuracy of the thickness of the thin-film magnetic head material can be further increased, and the processing accuracy can be further improved. Play.

Further, in the thin-film magnetic head material processing apparatus or thin-film magnetic head material processing method of the present invention, the thin-film magnetic head material is based on a plurality of detection results of the first detecting means and the second detecting means. If the thickness of the thin film magnetic head is recognized, the thickness of the thin-film magnetic head material can be recognized more accurately.

[Brief description of drawings]

FIG. 1 is a front view showing the overall configuration of a processing apparatus according to an embodiment of the present invention.

FIG. 2 is a front view showing a state during an adjusting operation in a main part of the processing apparatus according to the embodiment of the present invention.

FIG. 3 is a front view showing a state during a processing operation in a main part of the processing apparatus according to the embodiment of the present invention.

FIG. 4 is a block diagram showing a circuit configuration of a processing apparatus according to an embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a state in which the work material is fixed to the processing jig in the embodiment of the present invention.

FIG. 6 is a perspective view showing a work material according to one embodiment of the present invention.

FIG. 7 is a plan view showing a carrier of the processing jig according to the embodiment of the present invention.

FIG. 8 is a plan view showing an example of a carrier according to an embodiment of the present invention.

FIG. 9 is a plan view showing an example of a carrier according to an embodiment of the present invention.

FIG. 10 is a plan view showing an example of a carrier according to an embodiment of the present invention.

FIG. 11 is a plan view showing an example of a carrier according to an embodiment of the present invention.

FIG. 12 is a plan view showing an example of a carrier according to an embodiment of the present invention.

FIG. 13 is a plan view showing an example of a carrier according to an embodiment of the present invention.

FIG. 14 is a plan view showing an example of a carrier according to an embodiment of the present invention.

FIG. 15 is a plan view showing an example of a carrier according to an embodiment of the present invention.

FIG. 16 is a plan view showing an example of a carrier according to an embodiment of the present invention.

FIG. 17 is a plan view showing an example of a carrier according to an embodiment of the present invention.

FIG. 18 is a plan view showing an example of a carrier according to an embodiment of the present invention.

FIG. 19 is a flow chart showing a procedure of a machining operation using the machining device according to the embodiment of the present invention.

FIG. 20 is an explanatory diagram showing the manufacturing process of the slider in the present embodiment.

FIG. 21 is an explanatory diagram showing a manufacturing process of the slider in the present embodiment.

FIG. 22 is an explanatory diagram showing a manufacturing process of the slider in the present embodiment.

FIG. 23 is an explanatory diagram showing a manufacturing process of the slider in the present embodiment.

FIG. 24 is an explanatory diagram showing a manufacturing process of the slider in the present embodiment.

FIG. 25 is an explanatory diagram showing the manufacturing process of the slider in the present embodiment.

FIG. 26 is an explanatory diagram showing the manufacturing process of the slider in the present embodiment.

FIG. 27 is a distribution diagram showing an example of distribution of thicknesses of a plurality of workpieces before processing by the processing device according to the one embodiment of the present invention.

FIG. 28 is a distribution diagram showing an example of a distribution of thicknesses of a plurality of workpieces after processing by the processing device according to the one embodiment of the present invention.

FIG. 29 is an explanatory diagram showing the thicknesses of a plurality of work materials before and after processing by the processing device according to the embodiment of the present invention in comparison.

[Explanation of symbols]

1 ... Device body, 2 ... Control panel, 3 ... Surface plate, 4
... vertical axis, 5 ... arm, 6 ... spline axis, 7 ... keeper, 11 ... reference position sensor, 12 ... workpiece thickness sensor,
13 ... Reference base, 15 ... Driving unit, 16 ... Control unit, 20
... Work material, 21 ... Protective member, 30 ... Carrier.

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-2001-198818 (JP, A) JP-A-63-102872 (JP, A) Actually open 3-366761 (JP, U) Actually open 61-35738 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) B24B 49/04 B24B 37/04 B24B 41/06

Claims (14)

(57) [Claims] 1. A processing means for polishing a material for a thin film magnetic head , which has a rotating surface plate, and in which a plurality of slider parts each including a thin film magnetic head element are arranged in a line, and a reference position is detected. First detecting means, a second detecting means for detecting a position that changes according to the thickness of the material, a reference position detected by the first detecting means, and a reference position detected by the second detecting means. The thickness of the material is recognized on the basis of the position of the material, and the control means for controlling the processing means so that the thickness of the material has a predetermined value, and the surface of the material to be polished is in contact with the surface plate. like
A thin film magnetic head equipped with a processing jig for holding the material.
Material processing device for a workpiece, wherein the processing jig is on a surface opposite to the surface to be polished.
It also holds the material with a band-shaped protective member attached.
And, at the lower end, through the material, the protective portion
A first member having a hole through which the material does not pass, and the first member
The protection member is sandwiched between the member and the first member.
A second member coupled to the member, wherein the second detecting means changes according to the thickness of the material.
A material processing apparatus for a thin-film magnetic head, characterized in that the position of the upper surface of the second member is detected as the position . Wherein said first member the holes that claim 1 thin-film magnetic head material processing apparatus, wherein the formed with a plurality on. As claimed in claim 3, wherein the first member, the material for the claim 1 or 2 thin film magnetic head, wherein the at least one length and arrangement of said holes comprising a first member of a different type Processing equipment. 4. The material processing apparatus for a thin film magnetic head according to claim 3, wherein the outermost positions of the holes are unified in the plurality of types of first members. Wherein the wherein said first detecting means second detection means may thin film magnetic head material processing according to any one of 4 to claims 1, characterized in that attached to the same arm apparatus. Wherein the wherein said first detecting means second detection means intermittently thin-film magnetic head material processing apparatus according to any one of claims 1 and performs the detection operation 5 . 7. The control means recognizes the thickness of the material based on a plurality of detection results of the first detection means and the second detection means. The material processing device for a thin film magnetic head according to any one of 6 to 6 . 8. A processing means for polishing a material for a thin film magnetic head , which has a rotating surface plate, and portions each of which serves as a slider including a thin film magnetic head element are arranged in a line, and a reference position is detected. And a second detecting means for detecting a position that changes according to the thickness of the material, and a surface of the material to be polished is in contact with the surface plate.
A method of processing a material for a thin film magnetic head by using a processing device including a processing jig for holding the material, wherein the reference position is detected by the first detection means and the second position is detected. Based on the procedure of detecting a position that changes according to the thickness of the material by the detection means, and the reference position detected by the first detection means and the position detected by the second detection means, the procedure for recognizing the thickness, based on the recognized thickness, the thickness of the material viewed contains a procedure for processing by controlling the processing means to a predetermined value, the processing jig, On the surface opposite to the surface being polished
It also holds the material with a band-shaped protective member attached.
And, at the lower end, through the material, the protection
A first member having a hole through which the member does not pass;
The protection member is sandwiched between the first protection member and the first protection member.
And a second member coupled to the second member, wherein in the detecting step, the second detecting means is
As the position that changes according to the thickness of the material, the second
A method of processing a material for a thin film magnetic head, which comprises detecting the position of the upper surface of a member . 9. The method of processing a material for a thin film magnetic head according to claim 8, wherein a plurality of the holes are formed in the first member. As claimed in claim 10 wherein said first member, said hole length and placement of at least one of materials for different kinds of first thin-film magnetic head according to claim 8, wherein providing a member Processing method. 11. The plurality of types of first members,
Claim, characterized in that unifying the positions of the outermost periphery of the hole 1
The method for processing a material for a thin film magnetic head according to 0 . Wherein the wherein said first detecting means second detection means, to claims 8, characterized in that attached to the same arm 11 thin-film magnetic head material processing according to any one of Method. 13. Procedure for the detection, thin-film magnetic head for material processing method according to any one of claims 8 to 12, characterized in that the detection of intermittent positions. 14. The recognizing procedure to claims 8 and recognizes the thickness of the material based on the plurality of detection results of said first detecting means and the second detecting means 13 5. A method of processing a material for a thin film magnetic head according to any one of 1.