JP3468676B2 - Manufacturing method of chip body - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD OF THE INVENTION The present invention relates to a method for producing a micro article (hereinafter referred to as a "chip body") such as a small electronic component and an optical component, and a pressure-sensitive adhesive sheet suitably used in the method.

[0002]

BACKGROUND OF THE INVENTION Semiconductor wafers such as silicon and gallium arsenide are manufactured in a large diameter state, and the wafers are cut and separated (diced) into small pieces of elements and then transferred to a mounting step which is the next step. . At this time, the semiconductor wafer is preliminarily adhered to the adhesive sheet, and each step of dicing, washing, and drying is performed, and then each step of picking up and mounting is performed. The adhesive sheet used in the processes from the dicing process to the pickup process of such a semiconductor wafer has sufficient adhesive force to the wafer chip from the dicing process to the drying process, and adheres to the wafer chip at the time of pickup. It is desired that the adhesive has an adhesive strength such that the agent does not adhere thereto. Examples of such pressure-sensitive adhesive sheets include JP-A-60-196,956 and JP-A-60-22.
Although various proposals have been made in Japanese Patent No. 3,139, etc., it is practically impossible to completely eliminate the adhesive force (vertical peeling force) at the time of pickup, and even if the vertical peeling force at the time of pickup is reduced. The limit was about 100 to 300 g / 10 mm □. Therefore, in the actual process, the chip is picked up by the suction collet at the same time as the chip is pushed up from the back surface of the adhesive sheet by the push-up pin to separate the adhesive sheet from the chip.

By the way, recently, various electronic parts (chips) have been incorporated into an ID card, a memory card, a credit card, a cash card, etc. to prevent plagiarism and forgery. The electronic components incorporated in such a card are required to be very thin, have a large area and have a high capacity compared to the thickness.

However, when picking up such a thin and large area chip, the use of the push-up pin as described above causes a problem that the chip is damaged and the yield of the chip is remarkably reduced.

[0005]

SUMMARY OF THE INVENTION The present invention is intended to solve the problems associated with the prior art as described above, and a method of manufacturing a chip body which can easily pick up a thin and large-area chip, and the manufacturing method thereof. It is an object of the present invention to provide a pressure-sensitive adhesive sheet that is preferably used in. That is, it is an object of the present invention to provide a method of manufacturing a chip body that can pick up a chip without using a push-up pin when picking up the chip, and an adhesive sheet that is preferably used in the manufacturing method.

[0006]

SUMMARY OF THE INVENTION A method of manufacturing a chip body according to the present invention comprises a step of attaching an object to be cut to an adhesive sheet comprising at least one layer of a shrinkable film and an adhesive layer, and dicing the object to be cut. And a step of shrinking the shrinkable film to reduce the contact area between the chip body and the pressure-sensitive adhesive.

In the present invention, the pressure-sensitive adhesive layer preferably comprises an ultraviolet-curable pressure-sensitive adhesive, and in this case, it may include a step of irradiating the pressure-sensitive adhesive layer with ultraviolet light before or after the shrinkage of the shrinkable film. More preferable.

The pressure-sensitive adhesive sheet according to the present invention is used in the method for manufacturing a chip body as described above, and is characterized by comprising at least one shrinkable film and a pressure-sensitive adhesive layer. In particular, it is preferable that the non-shrinkable support film, the shrinkable film, and the pressure-sensitive adhesive layer are laminated in this order.

[0009]

DETAILED DESCRIPTION OF THE INVENTION In the method for manufacturing a chip body according to the present invention, a pressure-sensitive adhesive sheet comprising a substrate composed of at least one shrinkable film and a pressure-sensitive adhesive layer formed thereon, that is, a book The pressure-sensitive adhesive sheet according to the invention is used.

The shrinkable film is not particularly limited, but a heat shrinkable film is mainly used. The shrinkage rate of the shrinkable film used in the present invention is 10
˜90% is preferred, and more preferably 20-80%. Here, the shrinkage ratio is calculated from the dimension before shrinkage and the dimension after shrinkage based on the following mathematical formula.

[0011]

[Equation 1]

In the case of a heat-shrinkable film, the shrinkage ratio is
It is calculated based on the dimensions before and after heating the film to 120 ° C. As the shrinkable film as described above, various ones are conventionally known, but in the present invention,
Generally, any material can be used as long as it does not adversely affect the material to be cut such as ion contamination. Specific examples thereof include biaxially stretched films of polyethylene terephthalate, polyethylene, polystyrene, polypropylene, nylon, urethane, polyvinylidene chloride, polyvinyl chloride, and the like.

The thickness of the shrinkable film as described above is usually 5 to 300 μm, preferably 10 to 200 μm.
Is. As the shrinkable film, it is particularly preferable to use a film of heat shrinkable polyethylene, polypropylene, polyethylene terephthalate or the like.

The base material of the pressure-sensitive adhesive sheet used in the production method of the present invention may be a single layer of the above-mentioned shrinkable film, but is preferably a base material of a multi-layer plastic film. That is, it may be a combination of one type or two or more types of shrinkable films, or may be a combination of a shrinkable film and a non-shrinkable film.

The non-shrinkable film is not particularly limited, but one having excellent water resistance and heat resistance is suitable, and a synthetic resin film is particularly suitable. Specific examples of such non-shrinkable film include polyolefin films such as polyethylene film, polypropylene film, polybutene film, and polymethylpentene film; polyvinyl chloride film, polyethylene terephthalate film, polybutylene terephthalate film, polybutadiene film, Polyurethane film, ethylene vinyl acetate film, etc. are used. It is also possible to use a polymer film containing a compound having a carboxyl group as a polymer constituent unit or a laminate of the polymer film and a general-purpose polymer film.

The thickness of the non-shrinkable film as described above is
Usually 5 to 300 μm, preferably 10 to 200 μm
m. The non-shrinkable film that can be used in the present invention is
Usually, the film has a shrinkage rate of less than 10%.

The difference between the shrinkable film and the non-shrinkable film used in the present invention is that the shrinkage ratio is different. For example, when a polyethylene film is manufactured, it is possible to manufacture two kinds of polyethylene films having different shrinkage rates by appropriately setting the manufacturing conditions and the like.

When the base material of the pressure-sensitive adhesive sheet according to the present invention is composed of two or more constituent layers, the shrinkable film as described above and the film as described above are preferably laminated with an adhesive or the like. It is performed by joining through. The order of stacking these layers is not particularly limited, and various combinations can be adopted.

Preferred combinations of the base material consisting of two or more constituent layers and the pressure-sensitive adhesive layer include (1) pressure-sensitive adhesive layer / shrinkable film / adhesive layer / non-shrinkable film; (2) pressure-sensitive adhesive. Layer / shrinkable film / non-shrinkable film; (3) adhesive layer / shrinkable film / adhesive layer / shrinkable film; (4) adhesive layer / shrinkable film / shrinkable film; it can.

The surface of the shrinkable film on the pressure-sensitive adhesive layer side may be corona-treated or provided with another layer such as a primer in order to improve the adhesion to the pressure-sensitive adhesive. In the above, the adhesive used for bonding the film is not particularly limited, and a general-purpose adhesive conventionally used, an acrylic-based, rubber-based, silicone-based pressure-sensitive adhesive,
Polyester type, polyamide type, ethylene copolymer type,
Examples of the adhesive include thermoplastic or thermosetting adhesives such as epoxy type and urethane type. In particular, when a pressure-sensitive adhesive or a thermoplastic adhesive having an elastic modulus at the temperature of shrinking the shrinkable film of 10 ⁹ dyn / cm ² or less is used as the adhesive layer, even when the shrinkable film is thin, non-shrinkage The shrinkage is less likely to be restricted by the flexible film, which is preferable.

In the present invention, among the above, the pressure-sensitive adhesive sheet having the constitution (1) is preferably used. In the present invention, as described below, the pressure-sensitive adhesive layer may be irradiated with ultraviolet rays before or after the shrinkage of the film, but in this case, the film constituting the substrate needs to be transparent.

The pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet can be formed by various conventionally known pressure-sensitive pressure-sensitive adhesives. The pressure-sensitive adhesive is not particularly limited, but rubber-based, acrylic-based, silicone-based, polyvinyl ether, and other pressure-sensitive adhesives are used. Further, a radiation-curable or heat-foaming type adhesive can also be used.

The thickness of the adhesive layer depends on its material,
Usually, it is about 3 to 100 μm, preferably 10 to 5
It is about 0 μm. As the pressure-sensitive adhesive as described above, various pressure-sensitive adhesives can be used without particular limitation. As the radiation-curable (photo-curable, ultraviolet-curable, electron-beam curable) type pressure-sensitive adhesive, for example, those described in Japanese Patent Publication No. 1-56112 and Japanese Patent Application Laid-Open No. 7-135189 are preferably used, but are not limited thereto. It will not be done. However, in the present invention, it is particularly preferable to use an ultraviolet curable adhesive.

The method for manufacturing a chip body according to the present invention will be described in more detail below with reference to the above-mentioned preferred embodiments with reference to the drawings. As shown in FIG. 1, in a preferred embodiment of the present invention, a pressure-sensitive adhesive sheet 10 obtained by laminating a pressure-sensitive adhesive layer 1, a shrinkable film 2, an adhesive layer 3, and a non-shrinkable film 4 in this order. Used. For the pressure-sensitive adhesive layer 1, as described above, the ultraviolet curable pressure-sensitive adhesive is preferably used. As the shrinkable film 2, a UV permeable polyethylene terephthalate film having a heat shrinkage rate of 20 to 80% is particularly preferably used. Adhesive layer 3
Has a function of joining the shrinkable film 2 and the non-shrinkable film 4, and particularly preferably, an acrylic adhesive or a urethane thermoplastic adhesive is used. As the non-shrinkable film 4, a polyolefin such as polyethylene having ultraviolet transparency or polyethylene terephthalate is particularly preferably used.

In the chip body manufacturing method of the present invention,
The object 5 to be cut is attached onto the pressure-sensitive adhesive layer 1 of the pressure-sensitive adhesive sheet 10 as described above, and this is cut (diced) to form the chip 6.

Here, as the object to be cut 5, for example,
Semiconductor wafers having a large number of circuits formed on the surface, specifically, Si wafers, Ge wafers, GaAs wafers; ceramic plates such as alumina, zirconia, silicon nitride, and silicon carbide, insulating substrates, various electronic elements; optical elements Used glass plates, quartz, etc .; printed circuit boards and other wiring boards; iron-based, copper-based lead frames; TAB (Tape Automated Bonding; Tape Automated B)
onding); various resin moldings; and composites of these,
Specific examples thereof include a semiconductor mounted on a lead frame, a resin-sealed product thereof, and a resin-sealed product of a semiconductor mounted on a TAB tape.

It is preferable that the cutting depth during dicing is such that the shrinkable film 2 is completely cut and the non-shrinkable film 4 is halfway (FIG. 2). By completely cutting the shrinkable film 2, the action of restraining the shrinkage is reduced, so that the contact area between the chip 6 and the pressure-sensitive adhesive layer 1 can be sufficiently reduced.

Next, the shrinkable film 2 is shrunk by required means. When using a heat-shrinkable film,
The laminated body of the chip 6 and the adhesive sheet 10 is 80 to 150 ° C.
The shrinkage film 2 is shrunk by heating the shrinkable film 2.

When the film 2 is shrunk in this manner, the pressure-sensitive adhesive layer 1 formed on the film 2 is also deformed accompanying the shrinkage of the film 2, so that the adhesion area between the chip 6 and the pressure-sensitive adhesive layer 1 is reduced. Decrease (Fig. 3). As a result, the adhesive force (vertical peeling force) between the chip 6 and the adhesive layer 1 is reduced, and the chip can be easily picked up only by the suction collet without using the push-up pin.

When a pressure-sensitive adhesive layer 1 made of a UV-curable pressure-sensitive adhesive is used, the pressure-sensitive adhesive layer is cured by irradiating it with ultraviolet rays before or after the above-mentioned shrinkage to reduce the pressure-sensitive adhesive strength. It is particularly preferable to keep. By curing the adhesive layer, the vertical peeling force can be further reduced, the chip 6 can be easily picked up, and damage to the chip can be prevented.

Although not particularly limited, the vertical peeling force of the pressure-sensitive adhesive layer 1 before the shrinking of the shrinkable film 2 is usually 100 to 800 g / 10 mm □, preferably 100 to 5
00 g / 10 mm □, particularly preferably 100-300 g / 10
mm □ is desirable. The vertical peeling force of the re-peelable pressure-sensitive adhesive after shrinking the shrink film 2 is usually 20.
It is preferably 0 g / 10 mm □ or less, and the shrinkage of the radiation-curable pressure-sensitive adhesive and the vertical peel force after radiation curing are
Usually 80g / 10mm □ or less, preferably 50g / 10mm □
Below, it is particularly preferable that the amount is 20 g / 10 mm □ or less.

The pressure-sensitive adhesive sheet according to the present invention is used in the above-described method for manufacturing a chip body of the present invention, has the same structure as the above-mentioned pressure-sensitive adhesive sheet, and its preferred embodiments are also as described above. . The shape of the adhesive sheet of the present invention is
It can have any shape such as tape or label. Before use, a release film may be attached to the surface of the pressure-sensitive adhesive layer in order to protect the pressure-sensitive adhesive layer.

The pressure-sensitive adhesive sheet of the present invention is preferably used for surface protection, temporary fixing of electronic device products, and the like, in addition to the above-described method for manufacturing a chip body.

[0034]

As described above, according to the present invention, since the vertical peeling force between the adhesive layer and the chip is remarkably reduced by utilizing the shrinkability of the film, the push-up pin is used. You can pick up chips without having to.
Therefore, it is possible to prevent damage to the chip during pickup,
The yield of chips can be improved.

[0035]

EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples.

In the following examples and comparative examples, the vertical peeling force was measured as follows. [Vertical Peeling Force] To the pressure-sensitive adhesive sheets manufactured in Examples and Comparative Examples, a silicon wafer of 8 inches and a thickness of 200 μm was attached and adhered to a flat frame, and dicing into chips of 10 mm × 10 mm with a diamond blade having a thickness of 35 μm. . The dicing depth of the dicing is
In each of the comparative examples, full-cut dicing was performed in which the film was cut by 80 μm.

Next, after irradiating with ultraviolet rays (when using an ultraviolet-curable adhesive) to shrink the shrinkable film, a hook is attached to the upper part of each chip with an epoxy adhesive, and a universal tensile tester is used. Is used to measure the peel strength.

[0038]

Example 1 1- [Production of Adhesive Composition 1] 100 parts by weight of acrylic adhesive (copolymer of n-butyl acrylate and acrylic acid) and 200 parts by weight of urethane acrylate oligomer having a molecular weight of 7,000 And 10 parts by weight of a cross-linking agent (isocyanate-based) and 10 parts by weight of an ultraviolet curable reaction initiator (benzophenone-based) were prepared to prepare a pressure-sensitive adhesive composition. 1- [Lamination of pressure-sensitive adhesive layer 1 and shrinkable film 2] The pressure-sensitive adhesive composition obtained in 1- above is applied to a release-treated polyethylene terephthalate film having a thickness of 25 μm to a thickness of 10 μm. And heated at 100 ° C. for 1 minute. Next, a heat-shrinkable polyethylene terephthalate film (thickness: 30 μm, shrinkage ratio at 120 ° C .: 5
0%) was bonded to the pressure-sensitive adhesive layer side on the polyethylene terephthalate film to prepare a shrinkable pressure-sensitive adhesive film. 1- [Production of Adhesive 3 for Adhesion of Base Material] 100 parts by weight of an acrylic adhesive (copolymer of n-butyl acrylate and acrylic acid) for adhering a base material and a cross-linking agent (isocyanate) System) 2 parts by weight to prepare a pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition prepared in 1- [Production of pressure-sensitive adhesive sheet] was applied on a non-shrinkable polyethylene terephthalate film (thickness 100 μm, shrinkage at 120 ° C. 0.1%) to a thickness of 25 μm. Then, it was heated at 100 ° C. for 1 minute to prepare a non-shrinkable adhesive film. Next, the pressure-sensitive adhesive layer of the non-shrinkable pressure-sensitive adhesive film was attached to the shrinkable film base material side of the shrinkable pressure-sensitive adhesive film prepared in 1- to prepare an ultraviolet-curable pressure-sensitive adhesive sheet 10.

Using the pressure-sensitive adhesive sheet thus obtained, the vertical peel force was measured as described above. The shrinkable film was shrunk by leaving it for 1 minute in an atmosphere of 120 ° C. The results are shown in Table 1.

[0040]

Example 2 A shrinkable film was a heat-shrinkable polyethylene film (thickness: 30 μm, shrinkage ratio at 120 ° C .: 30).
%) Was used to prepare an ultraviolet-curable pressure-sensitive adhesive sheet in the same manner as in Example 1.

The results are shown in Table 1.

[0042]

Example 3 100 parts by weight of a releasable acrylic pressure-sensitive adhesive (copolymer of n-butyl acrylate and 2-hydroxyethyl acrylate) of a pressure-sensitive adhesive composition on a shrinkable film and a cross-linking agent ( A re-peelable pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that 10 parts by weight of (isocyanate-based) was mixed.

The results are shown in Table 1.

[0044]

[Comparative Example 1] In Example 1, the thickness of the base material was 100.
The same operation as in Example 1 was performed, except that a substrate made of a non-shrinkable polyethylene terephthalate film having a shrinkage factor of 0.1% at 120 ° C. and μm was used.

The results are shown in Table 1.

[0046]

[Comparative Example 2] In Example 3, as the base material, a thickness of 100 was used.
The same operation as in Example 3 was performed, except that a substrate made of only a non-shrinkable polyethylene terephthalate film having a shrinkage of 0.1% at 120 ° C. and μm was used.

The results are shown in Table 1.

[0048]

[Table 1]

[Brief description of drawings]

FIG. 1 shows a part of steps of a method for manufacturing a chip body according to the present invention.

FIG. 2 shows a part of steps of a method for manufacturing a chip body according to the present invention.

FIG. 3 shows a part of the steps of the method for manufacturing a chip body according to the present invention.

[Explanation of symbols]

1 ... Adhesive layer 2 ... Shrinkable film 3 ... Adhesive layer 4 ... Non-shrinkable film 5 ... Object to be cut 6 ... Chip 10 ... Adhesive sheet

Continuation of the front page (56) Reference JP-A-8-316177 (JP, A) JP-A-3-37286 (JP, A) JP-A-5-283450 (JP, A) JP-A-63-205924 (JP , A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/301 C09J 7/02

Claims (3)

(57) [Claims] 1. A non-shrinkable support film having a shrinkage of 10
A step of attaching an object to be cut to a pressure-sensitive adhesive sheet obtained by laminating a shrinkable film of 90% and an adhesive layer in this order, and cutting the object to be cut so that the shrinkable film is completely cut. A method of manufacturing a chip body, comprising: a step of dicing into a chip body; and a step of shrinking the shrinkable film to reduce a contact area between the chip body and an adhesive. 2. The method for manufacturing a chip body according to claim 1, wherein the pressure-sensitive adhesive layer is made of an ultraviolet curable pressure-sensitive adhesive. 3. Before or after the shrinking of the shrinkable film,
The method for manufacturing a chip body according to claim 2, further comprising the step of irradiating the pressure-sensitive adhesive layer with ultraviolet rays.