JP3460484B2 - Transparent conductive film - Google Patents
Transparent conductive filmInfo
- Publication number
- JP3460484B2 JP3460484B2 JP34577996A JP34577996A JP3460484B2 JP 3460484 B2 JP3460484 B2 JP 3460484B2 JP 34577996 A JP34577996 A JP 34577996A JP 34577996 A JP34577996 A JP 34577996A JP 3460484 B2 JP3460484 B2 JP 3460484B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- transparent conductive
- metal powder
- conductive film
- lower layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000843 powder Substances 0.000 claims description 97
- 229910001111 Fine metal Inorganic materials 0.000 claims description 60
- 239000002245 particle Substances 0.000 claims description 37
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 239000002904 solvent Substances 0.000 claims description 24
- 239000011163 secondary particle Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 21
- 239000006185 dispersion Substances 0.000 claims description 17
- 239000011164 primary particle Substances 0.000 claims description 17
- 238000009826 distribution Methods 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 14
- 239000011159 matrix material Substances 0.000 claims description 13
- 238000002310 reflectometry Methods 0.000 claims description 12
- 230000001186 cumulative effect Effects 0.000 claims description 10
- 239000002270 dispersing agent Substances 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 150000002739 metals Chemical class 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052745 lead Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 110
- 239000011248 coating agent Substances 0.000 description 55
- 238000000576 coating method Methods 0.000 description 55
- 239000000463 material Substances 0.000 description 32
- 238000000034 method Methods 0.000 description 23
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 17
- 239000003973 paint Substances 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 230000000694 effects Effects 0.000 description 13
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 238000001228 spectrum Methods 0.000 description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 206010052128 Glare Diseases 0.000 description 5
- 230000004313 glare Effects 0.000 description 5
- 238000004528 spin coating Methods 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- 238000000411 transmission spectrum Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 238000009125 cardiac resynchronization therapy Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000010419 fine particle Substances 0.000 description 4
- 230000007062 hydrolysis Effects 0.000 description 4
- 238000006460 hydrolysis reaction Methods 0.000 description 4
- -1 silane compound Chemical class 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- VBIIFPGSPJYLRR-UHFFFAOYSA-M Stearyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C VBIIFPGSPJYLRR-UHFFFAOYSA-M 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000000985 reflectance spectrum Methods 0.000 description 2
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- IEKHISJGRIEHRE-UHFFFAOYSA-N 16-methylheptadecanoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O IEKHISJGRIEHRE-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910017980 Ag—Sn Inorganic materials 0.000 description 1
- 229910017770 Cu—Ag Inorganic materials 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 241000282320 Panthera leo Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000005211 alkyl trimethyl ammonium group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- CBVJWBYNOWIOFJ-UHFFFAOYSA-N chloro(trimethoxy)silane Chemical compound CO[Si](Cl)(OC)OC CBVJWBYNOWIOFJ-UHFFFAOYSA-N 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- XMQYIPNJVLNWOE-UHFFFAOYSA-N dioctyl hydrogen phosphite Chemical compound CCCCCCCCOP(O)OCCCCCCCC XMQYIPNJVLNWOE-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- VTIXMGZYGRZMAW-UHFFFAOYSA-N ditridecyl hydrogen phosphite Chemical compound CCCCCCCCCCCCCOP(O)OCCCCCCCCCCCCC VTIXMGZYGRZMAW-UHFFFAOYSA-N 0.000 description 1
- XHWQYYPUYFYELO-UHFFFAOYSA-N ditridecyl phosphite Chemical compound CCCCCCCCCCCCCOP([O-])OCCCCCCCCCCCCC XHWQYYPUYFYELO-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920006316 polyvinylpyrrolidine Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- KSVSZLXDULFGDQ-UHFFFAOYSA-M sodium;4-aminobenzenesulfonate Chemical compound [Na+].NC1=CC=C(S([O-])(=O)=O)C=C1 KSVSZLXDULFGDQ-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Surface Treatment Of Optical Elements (AREA)
- Surface Treatment Of Glass (AREA)
- Paints Or Removers (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明は、ブラウン管などの
透明基体に帯電防止、電磁波シールド、映り込みの防止
などの機能を付与するのに適した、低反射性で低抵抗の
透明導電膜に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transparent conductive film having low reflectivity and low resistance, which is suitable for imparting functions such as antistatic, electromagnetic wave shield, and reflection prevention to a transparent substrate such as a cathode ray tube.
【0002】[0002]
【従来の技術】TVや各種ディスプレイ用CRTを含む
ブラウン管の画像表示部であるフロントパネルガラスの
表面には、静電気によりほこりが付着し易く、また表面
が高反射性であるため、スクリーンへの外部の光の反射
や外部映像の映り込みにより画像が不明瞭になるといっ
た問題点がある。また、最近ではブラウン管から出る電
磁波の人体に対する影響が懸念されるようになり、低周
波の漏洩電磁波に対する規格も各国で制定されるように
なってきた。2. Description of the Related Art The surface of a front panel glass, which is an image display portion of a cathode ray tube including a TV and a CRT for various displays, is easily dusted by static electricity and the surface is highly reflective. There is a problem that the image becomes unclear due to the reflection of light and the reflection of an external image. Recently, there has been concern about the influence of electromagnetic waves emitted from the cathode ray tube on the human body, and standards for low-frequency leakage electromagnetic waves have been established in each country.
【0003】ほこりの付着防止や電磁波の漏洩防止に
は、帯電防止効果や電磁波シールド効果のある透明導電
膜をスクリーン外面に形成する手段が一般に採用されて
いる。映り込みの防止対策としては、スクリーンのガラ
ス表面をフッ酸等を用いて微細凹凸処理して光を散乱さ
せるノングレアー処理が一般に行われてきた。しかし、
ノングレアー処理は画像の解像度を悪化させ、視認性が
低下するという問題がある。To prevent dust from adhering and electromagnetic waves from leaking, a means for forming a transparent conductive film having an antistatic effect and an electromagnetic wave shielding effect on the outer surface of the screen is generally adopted. As a measure for preventing glare, a non-glare treatment has been generally performed in which the glass surface of the screen is subjected to fine unevenness treatment using hydrofluoric acid or the like to scatter light. But,
The non-glare processing deteriorates the resolution of the image and reduces the visibility.
【0004】そのため、最近では高屈折率の透明導電膜
の上に低屈折率の透明オーバーコート膜を形成した2層
膜によって、帯電防止(ほこり付着防止)と映り込み防
止の両方の機能を付与することが試みられている。この
ような2層膜では、高屈折率膜と低屈折率膜の屈折率差
が大きければ、上層の低屈折率膜表面からの反射光が下
層の高屈折率膜との界面からの反射光の干渉によって打
ち消され、結果として映り込みが防止される。この透明
導電膜の導電性が高い場合には、電磁波シールド効果も
同時に付与される。Therefore, recently, a two-layer film in which a transparent overcoat film having a low refractive index is formed on a transparent conductive film having a high refractive index, imparts both functions of antistatic (prevention of dust adhesion) and reflection of glare. Is being attempted. In such a two-layer film, if the refractive index difference between the high refractive index film and the low refractive index film is large, the reflected light from the surface of the upper low refractive index film is reflected from the interface with the lower high refractive index film. Are canceled by the interference of, and as a result, glare is prevented. When the conductivity of this transparent conductive film is high, an electromagnetic wave shielding effect is also provided.
【0005】例えば、特開平5−290634号公報には、Sb
ドープ酸化錫 (ATO) 微粉末を界面活性剤を用いて分
散させたアルコール分散液をガラス基体に塗布し、乾燥
して、高屈折率の導電膜を形成し、その上にフッ化マグ
ネシウムを含有していてもよいアルコキシシランから形
成されたシリカの低屈折率膜を形成することによって、
反射率を0.7 %まで低減させた2層膜が提案されてい
る。For example, Japanese Patent Laid-Open No. 5-290634 discloses Sb.
Dope tin oxide (ATO) fine powder dispersed with a surfactant is applied to an alcohol dispersion liquid, which is then dried to form a conductive film having a high refractive index and magnesium fluoride contained thereon. By forming a low refractive index film of silica formed from optionally alkoxysilane,
A two-layer film having a reflectance reduced to 0.7% has been proposed.
【0006】特開平6−12920 号公報には、基体上に形
成した高屈折率層−低屈折率層の光学的膜厚nd (n:
膜厚、d:屈折率)をそれぞれ 1/2λ−1/4λ (λ=入
射光の波長) とした場合に低反射性となることが記載さ
れている。この公報によれば、高屈折率層はATOまた
はSnドープ酸化インジウム (ITO) 微粉末を含有する
シリカ質の膜であり、低屈折率層はシリカ膜である。In JP-A-6-12920, the optical thickness nd (n: n of high refractive index layer-low refractive index layer) formed on a substrate is described.
It is described that when the film thickness and d: refractive index) are respectively set to 1 / 2λ-1 / 4λ (λ = wavelength of incident light), low reflectivity is achieved. According to this publication, the high refractive index layer is a siliceous film containing ATO or Sn-doped indium oxide (ITO) fine powder, and the low refractive index layer is a silica film.
【0007】特開平6−234552号公報にもITO含有シ
リケート高屈折率導電膜−シリケートガラス低屈折率膜
からなる2層膜が開示されている。特開平5−107403号
公報には、導電性微粉末とTi塩を含有する液を塗布して
形成した高屈折率導電膜と低屈折率膜との2層膜が記載
されている。Japanese Unexamined Patent Publication (Kokai) No. 6-234552 also discloses a two-layer film composed of an ITO-containing silicate high refractive index conductive film-silicate glass low refractive index film. Japanese Unexamined Patent Publication No. 5-107403 describes a two-layer film including a high refractive index conductive film and a low refractive index film formed by applying a liquid containing conductive fine powder and a Ti salt.
【0008】特開平6−344489号公報には、ATO微粉
末と黒色導電性微粉末 (好ましくはカーボンブラック微
粉末) とからなる、固形分が密に充填された高屈折率の
第1層膜と、その上に形成したシリカ質の低屈折率膜と
からなる、黒色味を帯びた2層膜が開示されている。Japanese Unexamined Patent Publication (Kokai) No. 6-344489 discloses a first layer film of ATO fine powder and black electroconductive fine powder (preferably carbon black fine powder) which is densely packed with solid content and has a high refractive index. And a blackish two-layer film composed of a siliceous low-refractive index film formed thereon.
【0009】[0009]
【発明が解決しようとする課題】しかし、ATOやIT
Oといった半導体性の導電性粉末を使用した透明導電膜
では、電磁波シールド効果を生ずるように低抵抗化する
ことが困難であるか、或いは電磁波シールド効果を生ず
るように低抵抗化できても、それにより透明性が著しく
阻害される。特に最近では、ブラウン管からの漏洩電磁
波に対する規格がより厳しくなり、上述した従来技術で
は電磁波シールド効果が不十分で対応が困難になってお
り、より低抵抗で電磁波シールド効果の大きい透明導電
膜が求められている。[Problems to be Solved by the Invention] However, ATO and IT
In the case of a transparent conductive film using a semiconductor conductive powder such as O, it is difficult to reduce the resistance so as to produce the electromagnetic wave shielding effect, or even if the resistance can be reduced so as to produce the electromagnetic wave shielding effect. This significantly impairs transparency. Particularly in recent years, the standards for leaked electromagnetic waves from cathode ray tubes have become stricter, and the above-mentioned conventional techniques have an insufficient electromagnetic wave shielding effect, which makes it difficult to cope with them. Therefore, a transparent conductive film having a lower resistance and a large electromagnetic wave shielding effect is required. Has been.
【0010】本発明の目的は、高度の電磁波シールド効
果を発揮するように低抵抗化され、しかもブラウン管の
視認性を阻害しない高い透明性と低ヘーズ値を保持し、
ブラウン管に外部映像の映り込み防止機能を付与するこ
とができる低反射性を備え、かつ反射光が無色に近く、
青みや赤みを帯びていない、透明導電膜を提供すること
である。An object of the present invention is to reduce the resistance so as to exhibit a high electromagnetic wave shielding effect, and to maintain high transparency and a low haze value which do not impair the visibility of a cathode ray tube.
Equipped with a low reflectance that can add a function to prevent reflection of external images on the cathode ray tube, and the reflected light is almost colorless,
It is to provide a transparent conductive film which is not bluish or reddish.
【0011】[0011]
【課題を解決するための手段】本発明者らは、ブラウン
管の電磁波シールド性に対する最近の厳しい規格を考慮
すると、透明導電膜に使用する導電性粉末として、AT
OやITOといった半導体性の無機微粉末ではなく、よ
り導電性が高い金属微粉末の使用が望ましいとの結論に
達し、さらに検討を進めた結果、金属微粉末を含有する
下層の透明導電膜にシリカ質の低屈折率の上層皮膜を設
けた2層膜がこの目的に適していることが判明した。In view of the recent severe standards for the electromagnetic wave shielding properties of cathode ray tubes, the present inventors have proposed AT as an electrically conductive powder used for a transparent electrically conductive film.
It was concluded that it is desirable to use metal fine powder having higher conductivity rather than semiconducting inorganic fine powder such as O or ITO, and as a result of further study, it was found that the lower transparent conductive film containing the metal fine powder was used. It has been found that a two-layer film provided with an upper layer film of siliceous low refractive index is suitable for this purpose.
【0012】しかし、この2層膜は、最低反射率は1%
以下と低いものの、最低反射率を示す波長の両側での反
射率の増大が大きく、特に短波長側で反射率が急カーブ
を描いて増大するため、反射光が青みを帯び、映像の色
調を変化させてしまうことが分かった。そこでさらに検
討した結果、塗布に用いる金属微粉末の分散液中におけ
る金属微粉末の二次粒子 (凝集粒子) の粒径分布をばら
つかせることにより、金属微粉末を含有する下層の表面
に凹凸を形成することで、最低反射率を示す波長の両側
での反射率の増大が抑えられ、反射光の青みが大きく低
減することを見出した。However, this two-layer film has a minimum reflectance of 1%.
Although it is as low as or less, the reflectance increases greatly on both sides of the wavelength showing the lowest reflectance, and the reflectance increases in a sharp curve especially on the short wavelength side, so the reflected light is bluish and the color tone of the image is changed. It turned out to change. Therefore, as a result of further study, by varying the particle size distribution of the secondary particles (aggregated particles) of the fine metal powder in the dispersion liquid of the fine metal powder used for coating, unevenness is formed on the surface of the lower layer containing the fine metal powder. It has been found that the formation of the film suppresses an increase in the reflectance on both sides of the wavelength exhibiting the lowest reflectance, and greatly reduces the bluishness of the reflected light.
【0013】ここに、本発明は、透明基体の表面に設け
た、シリカ質マトリックス中に金属微粉末を含有する下
層と、その上に設けたシリカ質の上層とからなる、2層
構造の透明導電膜であって、該下層の表面が凹凸を有
し、下層の凸部での平均膜厚が50〜150 nmであり、凹部
での平均膜厚が凸部での平均膜厚の50〜85%であり、該
凸部の平均ピッチが20〜300 nmであることを特徴とす
る、低反射性で低抵抗の透明導電膜である。The present invention has a two-layered transparent structure comprising a lower layer provided on the surface of a transparent substrate and containing a fine metal powder in a siliceous matrix, and a siliceous upper layer provided thereon. The conductive film, the surface of the lower layer has irregularities, the average film thickness in the convex portion of the lower layer is 50 ~ 150 nm, the average film thickness in the concave portion is 50 ~ of the average film thickness in the convex portion. 85%, and the average pitch of the convex portions is 20 to 300 nm, which is a transparent conductive film having low reflectivity and low resistance.
【0014】この金属微粉末を含む下層は、分散剤を含
有する溶媒に平均一次粒子径が5〜50 nm の金属微粉末
を分散させた分散液から形成することができ、この分散
液中での金属微粉末が、10%積算粒径が60 nm 以下、50
%積算粒径が50〜150 nm、90%積算粒径が80〜500 nmと
いう粒度分布を持つ二次粒子を形成していると、前記の
凹凸表面を持つ下層皮膜を得ることができる。The lower layer containing the fine metal powder can be formed from a dispersion liquid in which fine metal powder having an average primary particle diameter of 5 to 50 nm is dispersed in a solvent containing a dispersant. The fine metal powder of 10% has an integrated particle size of 60 nm or less, 50
When the secondary particles having a particle size distribution with a% cumulative particle size of 50 to 150 nm and a 90% cumulative particle size of 80 to 500 nm are formed, the lower layer coating having the uneven surface can be obtained.
【0015】[0015]
【発明の実施の形態】本発明の透明導電膜を形成する透
明基体は特に制限されず、低反射性と電磁波シールド性
を付与することが望ましい任意の透明基体でよい。代表
的な透明基体はガラスであるが、透明プラスチック等の
基体上に本発明の透明導電膜を形成することもできる。BEST MODE FOR CARRYING OUT THE INVENTION The transparent substrate on which the transparent conductive film of the present invention is formed is not particularly limited and may be any transparent substrate for which it is desired to impart low reflectivity and electromagnetic wave shielding property. A typical transparent substrate is glass, but the transparent conductive film of the present invention can be formed on a substrate such as transparent plastic.
【0016】前述したように、低反射性と電磁波シール
ド性の付与が特に求められている透明基体は、TVやコ
ンピュータ等の表示装置として使用されるブラウン管の
フロントパネルガラスである。本発明の透明導電膜は、
低反射性と電磁波シールド性(低抵抗) に加えて、反射
スペクトルが平坦で、従来のある種の透明導電膜のよう
に青〜紫味または赤〜黄色味を帯びておらず、無色であ
り、視感度がよいという特徴を持つ。従って、この導電
膜をブラウン管の画面表示部の表面に形成すると、健康
に有害でコンピュータの誤動作の原因ともなる電磁波の
漏洩、ほこりの付着、および外部映像の映り込みを防止
ないし低減でき、膜の透明性 (可視光透過率) とヘーズ
が良好で、反射光が無色であるため、映像の視感度が良
好に保持される。As described above, the transparent substrate that is particularly required to have low reflectivity and electromagnetic wave shielding property is a front panel glass of a cathode ray tube used as a display device for TVs, computers and the like. The transparent conductive film of the present invention is
In addition to low reflectivity and electromagnetic wave shielding property (low resistance), it has a flat reflection spectrum, does not have a blue-purple or red-yellowish tint like some conventional transparent conductive films, and is colorless. , Has the characteristic of good visibility. Therefore, when this conductive film is formed on the surface of the screen display part of the cathode ray tube, it is possible to prevent or reduce electromagnetic wave leakage, dust adhesion, and external image reflection that are harmful to health and cause computer malfunction. The transparency (visible light transmittance) and haze are good, and the reflected light is colorless, so the visibility of the image is kept good.
【0017】本発明の透明導電膜は、シリカ質マトリッ
クス中に導電性粉末として金属微粉末を含有する下層
(導電層) と、粉末を含有しないシリカ質の上層とから
なる2層膜である。下層は金属微粉末を密に含有するた
め屈折率が高いのに対し、上層は低屈折率である。この
2層膜構成により、本発明の透明導電膜は、低反射性と
低抵抗という特性を有し、上記の機能を発揮することが
できる。The transparent conductive film of the present invention is a lower layer containing a fine metal powder as a conductive powder in a siliceous matrix.
It is a two-layer film consisting of a (conductive layer) and a silica-based upper layer containing no powder. The lower layer has a high refractive index because it contains the fine metal powder densely, while the upper layer has a low refractive index. With this two-layer film structure, the transparent conductive film of the present invention has characteristics of low reflectivity and low resistance, and can exhibit the above-mentioned functions.
【0018】本発明の透明導電膜において、下層の導電
層のシリカ質マトリックスと、シリカ質の上層は、いず
れもアルコキシシラン (より広義には、加水分解性シラ
ン化合物) から形成することができる。In the transparent conductive film of the present invention, both the siliceous matrix of the lower conductive layer and the siliceous upper layer can be formed of alkoxysilane (in a broader sense, a hydrolyzable silane compound).
【0019】アルコキシシランとしては、少なくとも1
個、好ましくは2個以上、さらに好ましくは3個以上の
アルコキシル基を有する任意の1種または2種以上のシ
ラン化合物が使用できる。加水分解性の基としてハロゲ
ンを含有するハロシラン類も、アルコキシシランと一緒
に、またはアルコキシシランに代えて使用することがで
きる。As the alkoxysilane, at least 1
Any one or two or more silane compounds having one, preferably two or more, and more preferably three or more alkoxyl groups can be used. Halosilanes containing halogens as hydrolyzable groups can also be used with or instead of alkoxysilanes.
【0020】アルコキシシランの具体例としては、テト
ラエトキシシラン (=エチルシリケート) 、テトラプロ
ポキシシラン、メチルトリエトキシシラン、ジメチルジ
メトキシシラン、フェニルトリエトキシシラン、クロル
トリメトキシシラン、各種のシランカップリング剤
(例、ビニルトリエトキシシラン、γ−アミノプロピル
トリエトキシシラン、γ−クロロプロピルトリメトキシ
シラン、γ−メルカプトプロピルトリメトキシシラン、
γ−グリシドキシプロピルトリメトキシシラン、γ−メ
タクリロキシプロピルトリメトキシシラン、 N−フェニ
ル−γ−アミノプロピルトリメトキシシラン、 N−β−
(アミノエチル) −γ−アミノプロピルトリメトキシシ
ラン、β−(3,4−エポキシシクロヘキシル)エチルトリ
メトキシシラン) などが挙げられる。好ましいのは、最
も安価で容易に加水分解するエチルシリケートである。Specific examples of the alkoxysilane include tetraethoxysilane (= ethyl silicate), tetrapropoxysilane, methyltriethoxysilane, dimethyldimethoxysilane, phenyltriethoxysilane, chlorotrimethoxysilane and various silane coupling agents.
(Example, vinyltriethoxysilane, γ-aminopropyltriethoxysilane, γ-chloropropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane,
γ-glycidoxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, N-β-
(Aminoethyl) -γ-aminopropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane) and the like. Preferred is ethyl silicate, which is the cheapest and easiest to hydrolyze.
【0021】アルコキシシランからなる皮膜は、加水分
解を受けるとアルコールが脱離し、生成したOH基同士
が縮合して、シリカゾルになる。このゾルを加熱して焼
付けると、縮合がさらに進んで最終的に硬質のシリカ
(SiO2) 皮膜になる。従って、アルコキシシランは、無
機皮膜形成剤としてシリカ質皮膜を形成するのに利用で
き、粉末と一緒に皮膜化した場合には、粉末を結合する
無機バインダーとして機能して、皮膜のマトリックスを
構成することになる。なお、ハロシランも加水分解によ
り同様に最終的にシリカ皮膜を形成できるが、以下では
アルコキシシランを使用する場合について説明する。When a coating made of alkoxysilane is hydrolyzed, alcohol is eliminated and the generated OH groups are condensed with each other to form a silica sol. When this sol is heated and baked, condensation proceeds further and finally hard silica
(SiO 2 ) It becomes a film. Therefore, the alkoxysilane can be used as an inorganic film forming agent to form a siliceous film, and when formed into a film together with a powder, it functions as an inorganic binder that binds the powder to form a film matrix. It will be. Similarly, halosilane can be finally formed into a silica film by hydrolysis, but the case of using alkoxysilane will be described below.
【0022】下層導電層
本発明の透明導電膜の下層導電層は、シリカ質マトリッ
クス中に金属微粉末を含有する。シリカ質マトリックス
は、前述したように、アルコキシシランから形成するこ
とができる。 Lower Conductive Layer The lower conductive layer of the transparent conductive film of the present invention contains fine metal powder in a siliceous matrix. The siliceous matrix can be formed from an alkoxysilane, as described above.
【0023】金属微粉末としては、アルコキシシランの
皮膜形成性に悪影響を及ぼさない限り、任意の金属もし
くは合金の粉末、または金属および/もしくは合金粉末
の混合物が使用できる。金属微粉末の材質として好まし
いのは、Fe、Co、Ni、Cr、W、Al、In、Zn、Pb、Sb、B
i、Sn、Ce、Cd、Pd、Cu、Pt、AgおよびAuよりなる群か
ら選ばれた1種もしくは2種以上の金属、ならびに/ま
たはこれらの金属の合金、ならびに/またはこれらの金
属および/もしくは合金の混合物である。これらの中で
特に好ましい金属種は、Ni、W、In、Zn、Sn、Pd、Cu、
Pt、Bi、Ag、およびAuであり、最も好ましいのは低抵抗
のAgである。好ましい合金は、Cu−Ag、Ni−Ag、Ag−P
d、Ag−Sn、Ag−PbなどのAg合金であるが、これに限定
されるものではない。また、Agと他の金属(例、W、P
b、Bi、Cu、In、Sn) との混合物も金属微粉末として好
ましい。As the metal fine powder, powder of any metal or alloy or a mixture of metal and / or alloy powder can be used as long as it does not adversely affect the film-forming property of alkoxysilane. Fe, Co, Ni, Cr, W, Al, In, Zn, Pb, Sb, B are preferable as the material of the metal fine powder.
One or more metals selected from the group consisting of i, Sn, Ce, Cd, Pd, Cu, Pt, Ag and Au, and / or alloys of these metals, and / or these metals and / or Alternatively, it is a mixture of alloys. Among them, particularly preferable metal species are Ni, W, In, Zn, Sn, Pd, Cu,
Pt, Bi, Ag, and Au, most preferably low resistance Ag. Preferred alloys are Cu-Ag, Ni-Ag, Ag-P
It is an Ag alloy such as d, Ag-Sn, and Ag-Pb, but is not limited thereto. Also, Ag and other metals (eg W, P
A mixture with b, Bi, Cu, In, Sn) is also preferable as the fine metal powder.
【0024】金属微粉末には、P、B、C、N、Sなど
の1種もしくは2種以上の非金属、またはNa、Kなどの
アルカリ金属および/もしくはMg、Caなどのアルカリ土
類金属の1種もしくは2種以上が固溶していてもよい。The fine metal powder includes one or more non-metals such as P, B, C, N and S, alkali metals such as Na and K, and / or alkaline earth metals such as Mg and Ca. One or more of the above may be solid-dissolved.
【0025】金属微粉末は、平均一次粒子径が5〜50 n
m の範囲内の微粒子状のものを使用することが好まし
い。平均一次粒子径が5nmより小さいと、本発明の特徴
である比較的深い表面凹凸を持った下層の導電層を形成
することが困難となる。平均一次粒子径が50 nm より大
きいと、下層の導電層に表面凹凸を形成することはでき
るが、その凹凸のピッチが大きくなりすぎる。平均一次
粒子径はより好ましくは8〜35 nm である。このような
微粒子状金属微粉末は、コロイド生成の手法 (例、保護
コロイドの存在下で金属化合物を適当な還元剤により金
属に還元させる)を利用して製造することができる。The fine metal powder has an average primary particle diameter of 5 to 50 n.
It is preferable to use fine particles in the range of m 2. If the average primary particle size is smaller than 5 nm, it becomes difficult to form a lower conductive layer having relatively deep surface irregularities, which is a feature of the present invention. When the average primary particle size is larger than 50 nm, surface irregularities can be formed on the lower conductive layer, but the pitch of the irregularities becomes too large. The average primary particle diameter is more preferably 8 to 35 nm. Such fine particulate metal powder can be produced by utilizing a method of colloid generation (eg, reducing a metal compound to a metal with an appropriate reducing agent in the presence of protective colloid).
【0026】前述したように、本発明の2層構造の透明
導電膜においては、導電性粉末として平均一次粒子径5
〜50 nm の金属微粉末を含有する下層の表面 (即ち、下
層と上層との界面) が、図1に模式的に示すように、凹
凸形状を有している。この金属微粉末のようにサブミク
ロンの微粒子は、一般に一次粒子 (個々の粒子) が凝集
して二次粒子 (凝集粒子) を形成する傾向があるが、本
発明においては、下層の膜厚を金属微粉末の二次粒子の
平均粒径とほぼ同じ厚みにし、この二次粒子の粒度分布
に比較的大きなバラツキを持たせる (即ち、大きな二次
粒子と小さな二次粒子を共存させる) ことにより、下層
の表面に凹凸を生じさせる。それにより、最低反射率を
示す波長の両側での反射率の増大が抑えられ、反射光が
無色に近くなる。As described above, in the transparent conductive film having a two-layer structure of the present invention, the conductive powder has an average primary particle diameter of 5
The surface of the lower layer (that is, the interface between the lower layer and the upper layer) containing the fine metal powder of ˜50 nm has an uneven shape, as schematically shown in FIG. Submicron particles such as this metal fine powder generally have a tendency that primary particles (individual particles) aggregate to form secondary particles (aggregated particles), but in the present invention, the thickness of the lower layer is By making the thickness almost the same as the average particle size of the secondary particles of the fine metal powder, and giving a relatively large variation in the particle size distribution of the secondary particles (that is, allowing the large secondary particles and the small secondary particles to coexist). , Causes unevenness on the surface of the lower layer. This suppresses an increase in the reflectance on both sides of the wavelength showing the lowest reflectance, and the reflected light becomes almost colorless.
【0027】具体的には、凹凸表面を有する下層の膜厚
は、凸部での平均膜厚が50〜150 nmであり、凹部での平
均膜厚が凸部での平均膜厚の50〜85%であり、凸部の平
均ピッチが20〜300 nmの範囲内である。凸部は表面凹凸
における山型の頂部を意味し、凹部は表面凹凸における
谷型の底部を意味する。このような表面凹凸を持つ下層
は、後述する方法により形成することができる。Specifically, the film thickness of the lower layer having an uneven surface is such that the average film thickness at the convex portion is 50 to 150 nm and the average film thickness at the concave portion is 50 to 150 nm of the average film thickness at the convex portion. 85%, and the average pitch of the convex portions is within the range of 20 to 300 nm. The convex portion means the peak-shaped top portion of the surface unevenness, and the concave portion means the valley-shaped bottom portion of the surface unevenness. The lower layer having such surface irregularities can be formed by the method described later.
【0028】凸部での平均膜厚が50 nm より小さいと、
表面凹凸による反射光の無色化の効果が小さくなる。凸
部での平均膜厚が150 nmを超えると、膜の透明性が低下
し、映像の視認性が低下する。凹部での平均膜厚が凸部
での平均膜厚の50%未満になると、凹凸が急激すぎて膜
のヘーズが増大し、映像の視認性が低下し、この値が85
%を超えると、凹凸がゆるやかすぎて、反射光の無色化
の効果がほとんど得られない。凸部の平均ピッチが20 n
m より小さいと、凹凸が小さく、反射光の無色化の効果
が少ない。凸部の平均ピッチが300 nmより大きいと、膜
のヘーズが増大し、反射光の無色化の効果も低下し、映
像の視感度が低下する。When the average film thickness at the convex portion is smaller than 50 nm,
The effect of achromaticity of reflected light due to surface irregularities is reduced. If the average film thickness at the convex portion exceeds 150 nm, the transparency of the film decreases and the visibility of the image decreases. When the average film thickness at the concave portion is less than 50% of the average film thickness at the convex portion, the unevenness is too sharp, the haze of the film increases, and the visibility of the image deteriorates.
When it exceeds%, the unevenness is too gentle, and the effect of making the reflected light colorless is hardly obtained. The average pitch of the convex parts is 20 n
When it is smaller than m, the unevenness is small and the effect of achromaticity of reflected light is small. When the average pitch of the convex portions is larger than 300 nm, the haze of the film increases, the effect of colorlessness of reflected light also decreases, and the visibility of the image decreases.
【0029】導電性粉末として、金属微粉末に加えて、
ITOやATOなどの無機酸化物系の透明導電性微粉末
(平均一次粒子径が0.2 μm以下、好ましくは0.1 μm
以下のもの) を併用することもできる。その場合でも、
導電性粉末の50重量%以上が金属微粉末となるようにす
ることが好ましく、より好ましくは導電性微粉末の60重
量%以上が金属微粉末からなる。As a conductive powder, in addition to the fine metal powder,
Inorganic oxide-based transparent conductive fine powder such as ITO and ATO
(Average primary particle size is 0.2 μm or less, preferably 0.1 μm
The following) can also be used together. Even then,
It is preferable that 50% by weight or more of the electrically conductive powder is fine metal powder, and more preferably 60% by weight or more of the electrically conductive fine powder is fine metal powder.
【0030】下層の導電層におけるシリカ質マトリック
スの量は、金属微粉末を結合するのに十分な量であれば
よい。この導電層はシリカ質の上層で被覆されるので、
特に高い膜強度や硬度を必要としない。好ましくは、シ
リカ質マトリックスの量は5〜30重量%である。The amount of the siliceous matrix in the lower conductive layer may be an amount sufficient to bind the fine metal powder. Since this conductive layer is covered with a siliceous top layer,
It does not require particularly high film strength or hardness. Preferably, the amount of siliceous matrix is 5 to 30% by weight.
【0031】透明導電膜の形成方法
本発明の2層構造の透明導電膜の形成方法は、下層に前
述した表面凹凸が形成されうる限り特に制限されるもの
ではないが、例えば、以下に説明する方法を採用するこ
とができる。 Method for Forming Transparent Conductive Film The method for forming the transparent conductive film having a two-layer structure of the present invention is not particularly limited as long as the above-mentioned surface irregularities can be formed in the lower layer. For example, it will be described below. The method can be adopted.
【0032】まず、透明基体の上に、下層形成用の塗料
を塗布して、金属微粉末の二次粒子が前述した凹凸状に
分布した膜を形成する。この下層形成用の塗料は、分散
剤を含有する溶媒中に、平均一次粒子径が5〜50 nm の
金属微粒子を分散させた分散液から構成することが好ま
しい。この塗料には、焼付け後にシリカ質マトリックス
となるアルコキシシランを含有させない方が好ましい。First, a coating material for forming a lower layer is applied on a transparent substrate to form a film in which secondary particles of fine metal powder are distributed in the above-mentioned uneven shape. The lower layer-forming coating material is preferably composed of a dispersion liquid in which metal fine particles having an average primary particle diameter of 5 to 50 nm are dispersed in a solvent containing a dispersant. It is preferable that the coating does not contain an alkoxysilane that becomes a siliceous matrix after baking.
【0033】下層形成用の塗料がバインダーとなるアル
コキシシランを含有していないと、この塗料を塗布し、
乾燥して溶媒を蒸発させた時に、実質的に金属微粉末の
みからなる皮膜が基体表面に形成される。金属微粉末が
サブミクロンの微粒子からなり、凝集性が強いため、バ
インダーが存在しなくても皮膜化できる。その後、上層
形成用のアルコキシシランの溶液からなる塗料を塗布す
ると、塗布した溶液の一部は下層の金属微粉末の粒子間
の空隙に浸透し、金属微粉末を結合するバインダーとし
て機能する。この上層形成用の塗料の塗布は、下層皮膜
中に浸透しきれなかった塗料が下層皮膜の上に残るよう
に行う。If the lower layer-forming coating material does not contain an alkoxysilane serving as a binder, this coating material is applied,
When dried and the solvent is evaporated, a film consisting essentially of fine metal powder is formed on the surface of the substrate. The fine metal powder is composed of submicron fine particles and has strong cohesiveness, so that a film can be formed without the presence of a binder. After that, when a coating material containing an alkoxysilane solution for forming the upper layer is applied, a part of the applied solution penetrates into the voids between the particles of the lower layer metal fine powder and functions as a binder for binding the metal fine powder. The coating material for forming the upper layer is applied so that the coating material that has not completely penetrated into the lower layer film remains on the lower layer film.
【0034】次いで加熱して皮膜を焼付けると、アルコ
キシシランはシリカ質皮膜に変化し、下層の粒子間に浸
透したアルコキシシランは、粒子間の空隙や空孔を埋め
るシリカ質マトリックスとなり、浸透しきれなかったア
ルコキシシランは上層のシリカ質皮膜を形成し、本発明
の2層構造の透明導電膜が得られる。Next, when the coating is heated and baked, the alkoxysilane changes to a siliceous coating, and the alkoxysilane that has penetrated between the particles in the lower layer becomes a siliceous matrix that fills the voids and pores between the particles and penetrates. The alkoxysilane that cannot be formed forms an upper siliceous film, and the transparent conductive film having a two-layer structure of the present invention can be obtained.
【0035】この方法では、時間とエネルギーコストの
かかる焼付け工程が1回で済み、製造工程が単純化され
る。即ち、この方法では、塗料の塗布は2回行うが、ス
ピンコート法で塗布すれば、1台のスピンコーター上で
順に下層用塗料と上層用塗料を滴下することにより連続
的に塗布を実施でき、その後に一度に焼付けを行うた
め、実質的には1回の塗布と同様の単純な作業工程で2
層膜を形成することができる。また、最初に金属微粉末
を皮膜化した時にバインダーが存在していないので、金
属微粉末が直接接触した皮膜となり、この状態がバイン
ダーのアルコキシシランを含浸させた後も保持されるの
で、より低抵抗の皮膜が得られる点でも有利である。This method requires only one baking process, which requires time and energy cost, and simplifies the manufacturing process. That is, in this method, the coating material is applied twice, but if it is applied by the spin coating method, the coating material for the lower layer and the coating material for the upper layer can be successively applied on one spin coater to continuously perform the coating. However, since baking is performed at a time after that, it is possible to carry out the same simple working process as that of one application in two steps.
Layer films can be formed. In addition, since the binder does not exist when the fine metal powder is first formed into a film, the fine metal powder comes into direct contact with the film, and this state is maintained even after impregnating the binder with alkoxysilane. It is also advantageous in that a resistance film can be obtained.
【0036】下層形成用の塗料がアルコキシシランを含
有する場合には、この塗料を透明基体に塗布した後、塗
膜を焼付けてアルコキシシランをシリカ質マトリックス
に転化させ、下層の導電層を形成する。その後、アルコ
キシシラン溶液からなる上層用塗料を塗布し、再び焼付
ける。従って、2回の焼付け工程が必要である。When the coating material for forming the lower layer contains an alkoxysilane, the coating material is applied to a transparent substrate and then the coating film is baked to convert the alkoxysilane into a siliceous matrix to form a lower conductive layer. . After that, an upper layer coating material composed of an alkoxysilane solution is applied and baked again. Therefore, two baking steps are required.
【0037】いずれの場合でも、下層形成用の塗料 (金
属微粉末の分散液) は、この分散液中で金属微粉末の二
次粒子が特定の粒度分布を持つように調整する。具体的
には、この分散液中で平均一次粒子径5〜50 nm の金属
微粉末が凝集して、10%積算粒径が60 nm 以下、50%積
算粒径が50〜150 nm、90%積算粒径が80〜500 nmという
粒度分布を持つ二次粒子を形成するようにする。In any case, the coating material for forming the lower layer (dispersion liquid of fine metal powder) is adjusted so that the secondary particles of the fine metal powder have a specific particle size distribution in this dispersion liquid. Specifically, in this dispersion, fine metal powder having an average primary particle size of 5 to 50 nm is aggregated, and the 10% cumulative particle size is 60 nm or less, the 50% cumulative particle size is 50 to 150 nm, 90%. Try to form secondary particles having a particle size distribution with an integrated particle size of 80 to 500 nm.
【0038】分散液中の金属微粉末の凝集状態 (即ち、
二次粒子の粒度分布) は、金属微粉末の平均一次粒子
径、溶媒の表面張力、粉末分散時の攪拌条件、分散液の
粘度、分散剤等の添加剤といった因子に依存する。従っ
て、溶媒種、金属微粉末の平均一次粒子径、金属微粉末
の濃度、攪拌速度および時間、添加剤の種類と添加量な
どのパラメータを、金属微粉末の二次粒子の粒度分布が
上記の範囲内になるように選択すればよく、これは当業
者であれば実験により可能である。The state of aggregation of the fine metal powder in the dispersion (ie,
The particle size distribution of the secondary particles) depends on factors such as the average primary particle size of the fine metal powder, the surface tension of the solvent, the stirring conditions at the time of powder dispersion, the viscosity of the dispersion liquid, and additives such as a dispersant. Therefore, parameters such as solvent type, average primary particle diameter of fine metal powder, concentration of fine metal powder, stirring speed and time, type and amount of additive, and particle size distribution of secondary particles of fine metal powder are as described above. It may be selected so as to fall within the range, and this can be experimentally performed by those skilled in the art.
【0039】金属微粉末をこのように分散させるのに適
した溶媒としては、水および/または低級アルコール
(メタノール、エタノール、イソプロパノール等) に30
重量%以下、特に25重量%以下のセロソルブ系溶媒
(例、メチルセロソルブ、ブチルセロソルブ等) を混合
した混合溶媒が好ましい。但し、溶媒はこれに限定され
るものではなく、使用した金属微粉末を上記の粒度分布
を持つ二次粒子を形成するような凝集状態で分散させる
ことができれば、任意の溶媒を用いて分散液を調製する
ことができる。使用しうる他の溶媒としては、アセト
ン、メチルエチルケトン、メチルイソブチルケトン、シ
クロヘキサノン、イソホロン等のケトン類;トルエン、
キシレン、ヘキサン、シクロヘキサン等の炭化水素類;
N,N-ジメチルホルムアミド、N,N-ジメチルアセトアミド
などのアミド類;ジメチルスルホキシドなどのスルホキ
シド類などが挙げられる。Suitable solvents for dispersing the fine metal powder in this way include water and / or lower alcohols.
(Methanol, ethanol, isopropanol, etc.) to 30
% Or less, especially 25% or less by weight of cellosolve solvent
A mixed solvent obtained by mixing (eg, methyl cellosolve, butyl cellosolve, etc.) is preferable. However, the solvent is not limited to this, and if the used fine metal powder can be dispersed in an agglomerated state so as to form secondary particles having the above particle size distribution, a dispersion liquid using any solvent Can be prepared. Other solvents that can be used include ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone and isophorone; toluene,
Hydrocarbons such as xylene, hexane and cyclohexane;
Examples thereof include amides such as N, N-dimethylformamide and N, N-dimethylacetamide; sulfoxides such as dimethyl sulfoxide.
【0040】下層形成用の塗料 (分散液) は、チタネー
ト系もしくはアルミニウム系カップリング剤、高分子分
散剤、および界面活性剤の1種もしくは2種以上を含有
することが好ましい。チタネート系もしくはアルミニウ
ム系カップリング剤の例としては、イソプロピルトリイ
ソステアロイルチタネート、イソプロピルトリデシルベ
ンゼンスルホニルチタネート、イソプロピルトリス (ジ
オクチルパイロホスフェート) チタネート、テトライソ
プロピルビス (ジオクチルホスファイト) チタネート、
テトラオクチルビス (ジトリデシルホスファイト) チタ
ネート、テトラ(2,2−ジアリルオキシメチル−1−ブチ
ル) ビス (ジ−トリデシル) ホスファイトチタネート、
ビス (ジオクチルパイロホスフェート) オキシアセテー
トチタネート、トリス (ジオクチルパイロホスフェー
ト) エチレンチタネート、アセトアルコキシアルミニウ
ムジイソプロピレートなどが挙げられる。高分子分散剤
の例は、ポリビニルピロリドン、ポリビニルアルコー
ル、ポリエチレングリコール−モノ−p−ノニルフェニ
ルエーテル等である。界面活性剤はノニオン系、カチオ
ン系、アニオン系のいずれでもよく、その例としては、
p−アミノベンゼンスルホン酸ナトリウム、ドデシルベ
ンゼンスルホン酸ナトリウム、長鎖アルキルトリメチル
アンモニウム塩 (例、ステアリルトリメチルアンモニウ
ムクロリド) などがある。これらの添加剤の添加量は、
例えば、分散液 (塗料) の 0.001〜0.200重量%の範囲
内の少量でよい。The coating material (dispersion liquid) for forming the lower layer preferably contains one or more of titanate-based or aluminum-based coupling agents, polymer dispersants, and surfactants. Examples of titanate-based or aluminum-based coupling agents include isopropyl triisostearoyl titanate, isopropyl tridecylbenzenesulfonyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, tetraisopropyl bis (dioctyl phosphite) titanate,
Tetraoctylbis (ditridecylphosphite) titanate, tetra (2,2-diallyloxymethyl-1-butyl) bis (di-tridecyl) phosphite titanate,
Examples thereof include bis (dioctyl pyrophosphate) oxyacetate titanate, tris (dioctyl pyrophosphate) ethylene titanate, and acetoalkoxyaluminum diisopropylate. Examples of polymer dispersants are polyvinylpyrrolidone, polyvinyl alcohol, polyethylene glycol-mono-p-nonylphenyl ether and the like. The surfactant may be nonionic, cationic, or anionic, and examples thereof include:
Examples include sodium p-aminobenzenesulfonate, sodium dodecylbenzenesulfonate, long-chain alkyltrimethylammonium salt (eg, stearyltrimethylammonium chloride) and the like. The amount of these additives added is
For example, a small amount within the range of 0.001 to 0.200% by weight of the dispersion liquid (paint) is sufficient.
【0041】下層形成用の塗料の粘度は好ましくは 0.8
〜10 cps、より好ましくは 0.9〜5cpsである。塗料中
の金属微粉末の量は、塗料の 0.1〜15重量%の範囲内が
適当である。アルコキシシランを含有する場合には、ア
ルコキシシランの量 (SiO2に換算した量) は、金属微粉
末との合計量に対して 1.0〜18重量%の範囲内が好まし
い。The viscosity of the coating material for forming the lower layer is preferably 0.8.
-10 cps, more preferably 0.9-5 cps. The amount of fine metal powder in the paint is suitably within the range of 0.1 to 15% by weight of the paint. When the alkoxysilane is contained, the amount of the alkoxysilane (the amount converted to SiO 2 ) is preferably in the range of 1.0 to 18% by weight with respect to the total amount of the fine metal powder.
【0042】アルコキシシランは予め加水分解させて、
塗料に使用することもできる。それにより、塗布後の焼
付けを短時間で完了させることができる。この場合の加
水分解は、反応を促進させるため、酸触媒 (例、塩酸な
どの無機酸、またはp−トルエンスルホン酸などの有機
酸) と水の存在下で行うことが好ましい。アルコキシシ
ランの加水分解は、室温ないし加熱下で行うことがで
き、好ましい反応温度は20〜80℃の範囲内である。The alkoxysilane is hydrolyzed in advance,
It can also be used in paints. Thereby, baking after application can be completed in a short time. In this case, the hydrolysis is preferably carried out in the presence of an acid catalyst (eg, an inorganic acid such as hydrochloric acid or an organic acid such as p-toluenesulfonic acid) and water in order to accelerate the reaction. The hydrolysis of the alkoxysilane can be carried out at room temperature or under heating, and the preferred reaction temperature is within the range of 20 to 80 ° C.
【0043】下層形成用の塗料の塗布は、スプレー法、
スピンコート法、浸漬法などによって行うことができる
が、成膜精度の点からスピンコート法が好ましい。塗布
は、乾燥後に、表面凹凸の凸部の平均膜厚が50〜150 nm
となるように行う。この膜厚は、金属微粉末の二次粒子
の50%積算粒径と同じ範囲であるので、塗膜はほぼ二次
粒子の単層からなり、二次粒子の粒度分布がそのまま表
面凹凸して塗膜表面に現れる。従って、金属微粉末の二
次粒子が前述した粒度分布を有していれば、乾燥して溶
媒を除去した後に、前述した表面凹凸を持つ金属微粉末
の塗膜を得ることができる。The coating for forming the lower layer is carried out by a spray method,
It can be performed by a spin coating method, a dipping method, or the like, but the spin coating method is preferable from the viewpoint of film formation accuracy. After drying, the average film thickness of the convex parts of the surface irregularities is 50 to 150 nm after drying.
To do so. Since this film thickness is in the same range as the 50% cumulative particle size of the secondary particles of the fine metal powder, the coating film is almost a single layer of the secondary particles, and the particle size distribution of the secondary particles is uneven as it is. Appears on the surface of the coating film. Therefore, if the secondary particles of the fine metal powder have the above-mentioned particle size distribution, it is possible to obtain the coating film of the fine metal powder having the above-mentioned surface irregularities after drying and removing the solvent.
【0044】下層形成用の塗料がアルコキシシランを含
有していても、金属微粉末はアルコキシシラン溶液に比
べて密度が非常に高いので、塗膜内で金属微粉末の二次
粒子は沈降する。この場合、形成された塗膜の表面は平
滑であるが、金属微粉末を含有する部分には、二次粒子
の粒度のバラツキに応じて凹凸を生じる。この凹凸の凹
部の上に溜まったアルコキシシラン溶液の部分は、焼付
け後に金属微粉末を含まないシリカ質の皮膜となり、最
終的に上層のシリカ質皮膜と一体化して、上層皮膜の一
部となる。即ち、下層用塗料から形成された塗膜のう
ち、金属微粉末を含有する部分だけが下層となり、この
部分は凹凸を持っているので、下層は表面凹凸を有する
ことになる。Even if the coating material for forming the lower layer contains the alkoxysilane, since the fine metal powder has a much higher density than the alkoxysilane solution, the secondary particles of the fine metal powder settle in the coating film. In this case, the surface of the formed coating film is smooth, but the portion containing the fine metal powder has irregularities depending on the variation in the particle size of the secondary particles. The portion of the alkoxysilane solution accumulated on the concave and convex portions becomes a siliceous film containing no fine metal powder after baking, and finally integrated with the upper siliceous film to become a part of the upper layer film. . That is, of the coating film formed from the lower layer coating material, only the portion containing the fine metal powder is the lower layer, and since this portion has unevenness, the lower layer has surface unevenness.
【0045】金属微粉末の分散液 (下層形成用の塗料)
がアルコキシシランを含有しない場合には、塗膜から適
宜手段で溶媒を蒸発させ、実質的に金属微粉末のみから
なる表面が凹凸の皮膜を基体上に形成する。この溶媒の
蒸発は、使用した溶媒の沸点に応じて、無加熱または加
熱により実施することができる。例えば、塗布をスピン
コート法で行う場合には、溶媒の種類にもよるが、回転
時間を十分にとれば、加熱せずに回転中に溶媒を蒸発さ
せることができる。なお、溶媒の蒸発は完全に行う必要
はなく、溶媒が一部残っていてもよい。Dispersion of fine metal powder (paint for forming lower layer)
When does not contain an alkoxysilane, the solvent is evaporated from the coating film by an appropriate means to form a film having an uneven surface substantially consisting of the fine metal powder on the substrate. This evaporation of the solvent can be carried out without heating or with heating, depending on the boiling point of the solvent used. For example, when the coating is performed by the spin coating method, depending on the type of the solvent, if the rotation time is sufficient, the solvent can be evaporated during the rotation without heating. It is not necessary to completely evaporate the solvent, and the solvent may partially remain.
【0046】分散液がアルコキシシランを含有している
場合には、塗布後に焼付けを行って、アルコキシシラン
をシリカに転化させる。この焼付けは、上層の焼付けと
同様に行うことができる。When the dispersion liquid contains an alkoxysilane, baking is performed after coating to convert the alkoxysilane into silica. This baking can be performed similarly to the baking of the upper layer.
【0047】こうして形成された下層皮膜の上に、上層
形成用のアルコキシシラン溶液からなる塗料を塗布し、
焼付けてシリカ質皮膜を形成する。この塗料中のアルコ
キシシランは、塗布後のアルコキシシランの加水分解を
促進させるため、予め加水分解した、シリカゾルと呼ば
れるものでもよい。シリカゾルは、アルコキシシランを
酸触媒 (好ましくは塩酸または硝酸) の存在下で室温ま
たは加熱下に加水分解させることにより調製することが
できる。On the lower layer film thus formed, a coating material comprising an alkoxysilane solution for forming the upper layer is applied,
Bake to form a siliceous film. The alkoxysilane in this paint may be a so-called silica sol that has been previously hydrolyzed in order to accelerate the hydrolysis of the alkoxysilane after coating. Silica sol can be prepared by hydrolyzing an alkoxysilane in the presence of an acid catalyst (preferably hydrochloric acid or nitric acid) at room temperature or under heating.
【0048】シリカゾルを使用する場合、上層形成用の
塗料中のシリカゾル濃度は、SiO2換算で 0.5〜2.5 重量
%の範囲内が好ましい。この塗料の粘度は好ましくは
0.8〜10 cps、より好ましくは 1.0〜4.0cpsである。シ
リカゾル濃度が低すぎると、下層の粉末の結合や上層の
膜厚が不十分となり、高すぎると成膜精度が低下し、上
層の膜厚の制御が困難となる。また、この塗料の粘度が
高すぎると、シリカゾルが下層の粉末粒子間の間隙に十
分に含浸しなくなり、導電性が低下する上、成膜精度が
低下して、上層の膜厚の制御も困難となる。When silica sol is used, the silica sol concentration in the coating material for forming the upper layer is preferably within the range of 0.5 to 2.5% by weight in terms of SiO 2 . The viscosity of this paint is preferably
It is 0.8 to 10 cps, more preferably 1.0 to 4.0 cps. If the silica sol concentration is too low, the bonding of the powder in the lower layer and the film thickness of the upper layer will be insufficient, and if it is too high, the film forming accuracy will be reduced and it will be difficult to control the film thickness of the upper layer. If the viscosity of this paint is too high, the silica sol will not be sufficiently impregnated into the gaps between the powder particles in the lower layer, which will lower the conductivity and the film forming accuracy, making it difficult to control the film thickness of the upper layer. Becomes
【0049】この塗料の塗布後の焼付けは、特に透明基
体がブラウン管である場合には、ブラウン管の寸法精
度、蛍光体の脱落防止のため、250 ℃以下、好ましくは
200 ℃、さらに好ましくは180 ℃以下に加熱することに
より行う。透明基体がブラウン管以外のものである場合
には、その基体材質に許される範囲内でこれより高い乾
燥温度を採用してもよい。The baking after the coating of this coating is carried out at 250 ° C. or lower, preferably in order to prevent the dimensional accuracy of the CRT and the fall of the phosphor, especially when the transparent substrate is a CRT.
It is performed by heating to 200 ° C, more preferably 180 ° C or less. When the transparent substrate is other than a cathode ray tube, a drying temperature higher than this may be adopted within the range allowed by the substrate material.
【0050】下層皮膜をアルコキシシランを含まない塗
料から形成した場合には、前述したように、上層塗料の
塗布により、この塗料中のアルコキシシラン (またはそ
の加水分解物、特にシリカゾル) が、金属微粉末の粒子
間の空隙に浸透して、これらの空隙を充填し、焼付け後
にシリカ質マトリックスを形成する。一方、浸透しきれ
なかった塗料は、焼付け後にシリカ質の上層を形成す
る。この場合、浸透性の調整のための界面活性剤などの
添加剤を、塗料に添加してもよい。When the lower layer coating is formed from a coating material containing no alkoxysilane, the coating of the upper coating material causes the alkoxysilane (or its hydrolyzate, especially silica sol) in the coating material to be coated with a metal fine particle as described above. Penetrate the voids between the particles of the powder to fill these voids and form a siliceous matrix after baking. On the other hand, the paint that has not completely penetrated forms a siliceous upper layer after baking. In this case, an additive such as a surfactant for adjusting the permeability may be added to the paint.
【0051】金属微粉末を含有しないシリカ質の上層
は、金属微粉末を含有する下層に比べて屈折率が低く、
それにより従来の導電性2層膜と同様に、低反射性の2
層膜が得られる。この機能にとって好ましい上層皮膜の
膜厚 (下層表面の凸部からの平均膜厚) は、20〜150 n
m、より好ましくは50〜120 nm、最も好ましくは60〜100
nmである。上層形成用塗料の塗布方法は、下層の場合と
同様でよいが、膜厚制御の容易なスピンコート法が好ま
しい。The siliceous upper layer containing no fine metal powder has a lower refractive index than the lower layer containing fine metal powder,
As a result, as with the conventional conductive double-layer film,
A layer film is obtained. The film thickness of the upper layer (average film thickness from the protrusions on the lower layer surface) preferable for this function is 20 to 150 n.
m, more preferably 50-120 nm, most preferably 60-100
nm. The method for applying the coating material for forming the upper layer may be the same as in the case of the lower layer, but the spin coating method is preferable because the thickness can be easily controlled.
【0052】本発明の2層構造の透明導電膜は、金属微
粉末を含有する高屈折率の下層とシリカのみからなる低
屈折率の上層との界面が適度の凹凸を持っているため、
低反射性である上、反射光が青みや赤みを帯びずに無色
に近く、しかも透明性が高く、低ヘーズであるという光
学的特徴を持つ。具体的には、可視光透過率が55%以
上、好ましくは60%以上と高く、ヘーズは1%以下と低
い。可視光反射率は、最低反射率が1%と低い上、反射
スペクトルが平坦であり、従来の2層導電膜の反射光の
青みの原因であった短波長側 (例、400 nm) での反射率
の増大が、長波長側(例、800 nm) とほぼ同レベルに抑
えられている。そのため、反射光は青みがなく、実質的
に無色であり、映像の視感度が著しく改善される。ま
た、この透明導電膜は表面抵抗で 102Ω/□台という低
抵抗を示し、電磁波シールド機能を十分に果たすことが
できる。In the two-layered transparent conductive film of the present invention, since the interface between the lower layer having a high refractive index containing fine metal powder and the upper layer having a low refractive index consisting of silica has an appropriate unevenness,
In addition to having low reflectivity, the reflected light is almost colorless without bluish or reddish color, has high transparency, and has low haze. Specifically, the visible light transmittance is 55% or higher, preferably 60% or higher, and the haze is 1% or lower. As for the visible light reflectance, the minimum reflectance is as low as 1%, and the reflection spectrum is flat. On the short wavelength side (eg 400 nm), which was the cause of the bluish reflected light of the conventional two-layer conductive film. The increase in reflectance is suppressed to almost the same level as the long wavelength side (eg, 800 nm). Therefore, the reflected light has substantially no bluish color and is substantially colorless, and the visual sensitivity of the image is significantly improved. In addition, this transparent conductive film exhibits a low surface resistance of the order of 10 2 Ω / □, and can sufficiently fulfill the electromagnetic wave shielding function.
【0053】[0053]
【実施例】下層形成用の塗料
添加剤として界面活性剤または高分子分散剤を含有する
溶媒中に金属微粉末を加え、直径0.3 mmのジルコニアビ
ーズを用いてペイントシェーカーで混合することにより
金属微粉末を溶媒中に分散させて、アルコキシシランを
含有しない下層形成用の塗料を調製した。使用した金属
微粉末、分散剤および溶媒の種類と塗料中のそれぞれの
量 (%は重量%) は表1に示す通りであった。Example: A metal fine powder was added to a solvent containing a surfactant or a polymer dispersant as a coating additive for forming a lower layer , and mixed with a paint shaker using zirconia beads having a diameter of 0.3 mm. The powder was dispersed in a solvent to prepare a coating material for forming a lower layer containing no alkoxysilane. The types of metal fine powder, dispersant and solvent used and their amounts (% by weight) in the paint were as shown in Table 1.
【0054】使用した金属微粉末は、コロイド的手法
(保護コロイドの存在下で金属化合物を還元剤と反応さ
せて還元する) により調製したものであり、その平均一
次粒子径 [TEM (透過式電子顕微鏡) により測定] お
よび塗料 (分散液) 中における二次粒子の粒度分布 [10
%、50%および90%の積算粒径、UPA粒度分析計 (日
機装製) により測定] も表1に一緒に示す。The fine metal powder used is a colloidal method.
(Reducing by reacting a metal compound with a reducing agent in the presence of a protective colloid), and its average primary particle size [measured by TEM (transmission electron microscope)] and in a paint (dispersion liquid). Secondary particle size distribution [10
%, 50% and 90% cumulative particle diameters, measured by UPA particle size analyzer (manufactured by Nikkiso Co., Ltd.) are also shown in Table 1.
【0055】表1に示した分散剤および溶媒 (かっこ内
は重量比) の記号の意味は次の通りである。
添加剤:
A=ステアリルトリメチルアンモニウムクロライド
B=ドデシルベンゼンスルホン酸ナトリウム
C=ポリビニルピロリドン (関東化学製K-30)。The symbols of the dispersant and the solvent (the weight ratio in parentheses) shown in Table 1 have the following meanings. Additive: A = stearyltrimethylammonium chloride B = sodium dodecylbenzenesulfonate C = polyvinylpyrrolidone (K-30 manufactured by Kanto Kagaku).
【0056】溶媒:
エタノール/メチルセロソルブ (85/15) 、
メタノール/メチルセロソルブ (80/20) 、
水/ブチルセロソルブ (90/10) 、
エタノール/メタノール/ブチルセロソルブ (80/10
/10) 、
エタノール (100)
水/エタノール/ブチルセロソルブ (80/10/10) 。Solvents: ethanol / methyl cellosolve (85/15), methanol / methyl cellosolve (80/20), water / butyl cellosolve (90/10), ethanol / methanol / butyl cellosolve (80/10)
/ 10), ethanol (100) water / ethanol / butyl cellosolve (80/10/10).
【0057】上層形成用塗料
エトキシシラン (エチルシリケート) を、少量の塩酸と
水を含有するエタノール中で60℃に1時間加熱して加水
分解させ、シリカゾルを合成した。得られたシリカゾル
溶液を、エタノール/イソプロパノール/ブタノールの
重量比5:8:1の混合溶媒で希釈して、SiO2換算濃度
が 0.7重量%、粘度が1.65 cpsの塗料を調製した。 Coating material for forming upper layer Ethoxysilane (ethyl silicate) was hydrolyzed by heating at 60 ° C. for 1 hour in ethanol containing a small amount of hydrochloric acid and water to synthesize silica sol. The obtained silica sol solution was diluted with a mixed solvent of ethanol / isopropanol / butanol at a weight ratio of 5: 8: 1 to prepare a coating material having a SiO 2 conversion concentration of 0.7% by weight and a viscosity of 1.65 cps.
【0058】成膜方法
100 mm×100 mm×厚さ3mmの寸法のソーダライムガラス
(青板ガラス) からなる基体の片面に、スピンコーター
を用いて、下層形成用塗料と上層形成用塗料を順に滴下
して成膜した。各塗料とも、滴下量は5〜10g、回転数
は 140〜180rpm、回転時間は60〜150 秒の範囲内であっ
た。その後、基体を大気中において170℃に30分間加熱
して塗膜を焼付け、ガラス基体上に透明導電膜を形成し
た。得られた膜の特性を次のようにして評価し、それら
の結果を表1に一緒に示した。 Film forming method Soda lime glass with dimensions of 100 mm × 100 mm × thickness 3 mm
A lower layer-forming coating material and an upper layer-forming coating material were sequentially dropped onto a single surface of a (blue plate glass) substrate using a spin coater to form a film. For each paint, the dripping amount was 5 to 10 g, the rotation speed was 140 to 180 rpm, and the rotation time was 60 to 150 seconds. Then, the substrate was heated in air at 170 ° C. for 30 minutes to bake the coating film, thereby forming a transparent conductive film on the glass substrate. The characteristics of the obtained film were evaluated as follows, and the results are shown together in Table 1.
【0059】膜特性の評価
下層 (金属微粉末含有層) の表面凹凸の凸部および凹部
の平均膜厚および平均ピッチ、ならびに上層の膜厚 (下
層凸部からの平均膜厚) :TEM断面写真上で測定し
た。 Evaluation of film characteristics Average film thickness and average pitch of convex and concave portions of surface irregularities of lower layer (layer containing fine metal powder), and film thickness of upper layer (average film thickness from lower convex portion): TEM cross-sectional photograph Measured above.
【0060】密着性:ライオン社製の消しゴムER-20Rを
用い、荷重1kgf/cm2 、ストローク幅5cm、往復50回後
のキズの状態を目視で観察した。○はキズなし、×はキ
ズ認められる、を意味する。Adhesion: Using an eraser ER-20R manufactured by Lion Corporation, the state of scratches after a load of 1 kgf / cm 2 , a stroke width of 5 cm, and reciprocating 50 times was visually observed. ○ means that there is no scratch, and × means that scratches are recognized.
【0061】表面抵抗:四探針法 (ロレスタAP:三菱油
化製) により測定した。
光透過率 (全可視光線透過率) :自記分光光度計 (U-40
00型:日立製作所製)により測定した。
ヘーズ:ヘーズメーター (HGM-3D:スガ試験機製) によ
り測定した。Surface resistance: Measured by the four-probe method (Loresta AP: manufactured by Mitsubishi Yuka). Light transmittance (total visible light transmittance): Self-recording spectrophotometer (U-40
Type 00: manufactured by Hitachi, Ltd.). Haze: Measured with a haze meter (HGM-3D: manufactured by Suga Test Instruments Co., Ltd.).
【0062】可視光反射率:ガラス基体の背面に、黒色
ビニールテープ (No.21:日東電工)を貼り、50℃で30分
保温してブラックマスクを形成した後、自記分光光度計
によって12°の正反射による可視域波長の反射スペクト
ルを測定した。この反射スペクトルから反射率の最小値
(最低反射率) と400 nmおよび800 nmでの反射率とを求
め、最低反射率となった波長と一緒に表1に示した。Visible light reflectance: A black vinyl tape (No. 21: Nitto Denko) was attached to the back surface of the glass substrate, the temperature was kept at 50 ° C. for 30 minutes to form a black mask, and then 12 ° was measured by a spectrophotometer. The reflection spectrum in the visible wavelength range due to the regular reflection was measured. The minimum value of reflectance from this reflection spectrum
The (minimum reflectance) and the reflectance at 400 nm and 800 nm were determined and shown in Table 1 together with the wavelength at which the minimum reflectance was obtained.
【0063】また、試験No. 4の本発明例の透明導電膜
の透過スペクトルおよび反射スペクトルを図2(a) およ
び(b) に、試験No.11 の比較例の透明導電膜の透過スペ
クトルおよび反射スペクトルを図3(a) および(b) に示
す。The transmission spectra and reflection spectra of the transparent conductive film of the invention of Test No. 4 are shown in FIGS. 2 (a) and 2 (b), and the transmission spectra and the reflection spectra of the transparent conductive film of Comparative example of Test No. 11 are shown. The reflection spectra are shown in FIGS. 3 (a) and 3 (b).
【0064】[0064]
【表1】 [Table 1]
【0065】表1からわかるように、本発明例では、平
均一次粒子径が5〜50 nm の金属微粉末を、比較的粒度
分布のバラツキの大きい二次粒子を生ずるような凝集状
態で、分散剤を含有する溶媒中に分散させた塗料を用い
た結果、下層の導電層において、例えば図1に模式的に
示すように、金属微粉末を含む下層を、これを含まない
上層との界面 (即ち、下層の表面) にかなり大きな凹凸
を生じていた。As can be seen from Table 1, in the present invention, fine metal powder having an average primary particle diameter of 5 to 50 nm is dispersed in an agglomerated state so as to produce secondary particles having a relatively large variation in particle size distribution. As a result of using the coating material dispersed in the solvent containing the agent, in the lower conductive layer, for example, as shown schematically in FIG. 1, the lower layer containing the fine metal powder and the interface with the upper layer not containing it ( That is, the surface of the lower layer) had considerably large irregularities.
【0066】但し、本発明の透明導電膜の形成方法は、
実施例に示した方法に限定されるものではなく、同じよ
うな下層の表面凹凸が生成するのであれば、どのような
方法で2層膜を形成してもよい。また、金属微粉末が比
較的大きな二次粒子を形成しているにもかかわらず、膜
の密着性は良好であった。However, the method of forming the transparent conductive film of the present invention is
The method is not limited to the method shown in the embodiment, and the two-layer film may be formed by any method as long as similar surface unevenness of the lower layer is generated. Further, the adhesion of the film was good even though the fine metal powder formed relatively large secondary particles.
【0067】これに対して、比較例の試験No. 11では、
積算粒度分布が不適切 (50%径小)であったため、下層
膜の凹部での平均膜厚が凸部での平均膜厚の89.1%とな
り、表面抵抗は低いものの、可視400 nmの反射率は著し
く高く青〜紫色を帯びた。逆に試験No. 14では、50%積
算粒径が大きすぎたため、可視光透過率が著しく低下
し、実用に耐える密着性が得られなかった。試験No. 12
では、金属微粉末の平均一次粒子径が大きすぎ、下層の
表面凹凸は十分に形成されていたものの、そのピッチが
大きすぎた。これらでは、いずれの膜の密着性が著しく
低下し、実用に耐える密着性が得られなかった。また、
試験No. 13では、金属微粉末の平均一次粒子径が小さす
ぎたため、下層の表面凹凸が浅く (小さく) なった。On the other hand, in the test No. 11 of the comparative example,
Since the integrated particle size distribution was improper (smaller by 50%), the average film thickness at the concave portion of the lower layer film was 89.1% of the average film thickness at the convex portion, and although the surface resistance was low, the reflectance at visible 400 nm Was extremely high and tinged with blue to purple. On the other hand, in Test No. 14, the 50% cumulative particle size was too large, so the visible light transmittance was remarkably reduced, and the adhesiveness for practical use was not obtained. Test No. 12
Then, although the average primary particle diameter of the fine metal powder was too large and the surface irregularities of the lower layer were sufficiently formed, the pitch thereof was too large. With these, the adhesiveness of any of the films was significantly reduced, and the adhesiveness that could be practically used was not obtained. Also,
In Test No. 13, the average primary particle size of the metal fine powder was too small, and therefore the surface irregularities of the lower layer became shallow (small).
【0068】本発明例の透明導電膜は、いずれも1%以
下の可視光最低反射率、1%以下のヘーズ、55%以上
(1例を除いて60%以上) の全可視光線透過率を示し、
画像の映り込みを防止することができる低反射性で、か
つ映像の視認性を妨害しない十分な透明性を有している
ことがわかる。The transparent conductive films of Examples of the present invention are all 1% or less in minimum visible light reflectance, 1% or less in haze, and 55% or more.
Shows the total visible light transmittance (60% or more except for one example),
It can be seen that it has low reflectivity capable of preventing the reflection of an image and sufficient transparency that does not interfere with the visibility of the image.
【0069】また、400 nmおよび800 nmでの反射率を比
較すると、両者の反射率の値は全く或いはほぼ同レベル
であり、図2(b) に示すように、反射スペクトルは、最
低反射率の両側でほぼ同じカーブを描いて増大し、かつ
その増大の程度も比較的小さかった。その結果、低反射
性である上に、反射光が実質的に無色で、映像の視感度
に優れていることがわかる。さらに、図2(a) に示すよ
うに、透過スペクトルも非常に平坦であり、膜自体も無
色である。When the reflectances at 400 nm and 800 nm are compared, the reflectance values of both are at the same or almost the same level, and as shown in FIG. 2 (b), the reflectance spectrum shows the lowest reflectance. Both sides of the curve increased in the same curve, and the increase was relatively small. As a result, it can be seen that, in addition to having low reflectivity, the reflected light is substantially colorless and the visibility of the image is excellent. Further, as shown in FIG. 2 (a), the transmission spectrum is also very flat and the film itself is colorless.
【0070】これに対し、比較例では、最低反射率は低
いものの、図3(b) に示すように特に短波長側における
反射スペクトルの増大が大きく、400 nmでの反射率が80
0 nmでの反射率の倍以上に高くなった。そのため、反射
光は青みを帯び、映像の視感度に悪影響が出る。On the other hand, in the comparative example, although the minimum reflectance is low, as shown in FIG. 3 (b), the increase of the reflectance spectrum is particularly large on the short wavelength side, and the reflectance at 400 nm is 80%.
It was more than double the reflectance at 0 nm. Therefore, the reflected light is bluish and adversely affects the visibility of the image.
【0071】導電性を見ると、いずれの透明導電膜も、
下層に金属微粉末を含有するため、102 Ω/□台の低抵
抗を示し、電磁波シールド性を十分に付与することがで
きる水準である。In terms of conductivity, any transparent conductive film
Since the lower layer contains fine metal powder, it exhibits a low resistance on the order of 10 2 Ω / □, which is a level capable of sufficiently imparting electromagnetic wave shielding properties.
【0072】[0072]
【発明の効果】本発明の2層構造の透明導電膜は、表面
抵抗が102 Ω/□台と低抵抗であるので、特にパソコン
用CRTおよび大型TV用ブラウン管で問題となってい
る電磁波の漏洩を防止できる電磁波シールド性をブラウ
ン管に付与できる。The two-layer transparent conductive film of the present invention has a low surface resistance of the order of 10 2 Ω / □, so that the electromagnetic wave which is a problem particularly in CRTs for personal computers and cathode ray tubes for large-sized TVs. The cathode ray tube can be provided with electromagnetic wave shielding properties that can prevent leakage.
【0073】また、この透明導電膜は、金属微粉末を含
有するにもかかわらず、可視光最低反射率が1%以下、
ヘーズが1%以下、全可視光線透過率が55%以上、好ま
しくは60%以上という、低反射性と十分な透明性を備え
ている。その上、この透明導電膜は、従来より問題にな
っていた紫〜青味または赤〜黄色味の反射光が少なく、
反射光が実質的に無色である。In addition, this transparent conductive film has a minimum visible light reflectance of 1% or less, although it contains fine metal powder.
It has low reflectivity and sufficient transparency with a haze of 1% or less and a total visible light transmittance of 55% or more, preferably 60% or more. Moreover, this transparent conductive film has less purple-bluish or red-yellowish reflected light, which has been a problem in the past.
The reflected light is substantially colorless.
【0074】従って、本発明の透明導電膜をブラウン管
の画像表示部に形成した場合、反射による外部映像の映
り込みが防止できると同時に、映像の色調を変化させる
ことがないので、画像の視認性が大きく向上する。従っ
て、本発明の透明導電膜は、映像を見やすくする上、電
磁波の漏洩による人体への悪影響やコンピュター誤動作
の防止にも役立つ。Therefore, when the transparent conductive film of the present invention is formed in the image display portion of a cathode ray tube, the reflection of an external image due to reflection can be prevented, and at the same time, the color tone of the image is not changed, so that the image visibility is improved. Is greatly improved. Therefore, the transparent conductive film of the present invention makes it easy to see an image, and also helps prevent adverse effects on the human body due to leakage of electromagnetic waves and malfunction of a computer.
【図1】本発明の2層構造の透明導電膜の断面構造を示
す説明図である。FIG. 1 is an explanatory view showing a cross-sectional structure of a transparent conductive film having a two-layer structure of the present invention.
【図2】図2(a) は実施例で作製した本発明の透明導電
膜の透過スペクトル、図2(b)は同じく反射スペクトル
を示す。FIG. 2 (a) shows a transmission spectrum of the transparent conductive film of the present invention produced in an example, and FIG. 2 (b) shows a reflection spectrum thereof.
【図3】図3(a) は実施例で作製した比較例の透明導電
膜の透過スペクトル、図3(b)は同じく反射スペクトル
を示す。FIG. 3 (a) shows a transmission spectrum of a transparent conductive film of a comparative example prepared in an example, and FIG. 3 (b) shows a reflection spectrum thereof.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI H05K 9/00 H05K 9/00 V // G02B 1/10 G02B 1/10 Z (56)参考文献 特開 昭61−288314(JP,A) 特開 平7−272646(JP,A) 特開 平8−77832(JP,A) 特開 平8−102227(JP,A) 特開 平8−165147(JP,A) 特開 平10−182190(JP,A) 特開 平10−182191(JP,A) (58)調査した分野(Int.Cl.7,DB名) H01B 5/14 H01B 1/22 C03C 17/34 C09D 5/24 H01J 29/88 H05K 9/00 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI H05K 9/00 H05K 9/00 V // G02B 1/10 G02B 1/10 Z (56) Reference JP-A-61-288314 ( JP, A) JP 7-272646 (JP, A) JP 8-77832 (JP, A) JP 8-102227 (JP, A) JP 8-165147 (JP, A) JP HEI 10-182190 (JP, A) JP HEI 10-182191 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H01B 5/14 H01B 1/22 C03C 17/34 C09D 5 / 24 H01J 29/88 H05K 9/00
Claims (4)
リックス中に金属微粉末を含有する下層と、その上に設
けたシリカ質の上層とからなる、2層構造の透明導電膜
であって、該下層の表面が凹凸を有し、下層の凸部での
平均膜厚が50〜150 nmであり、凹部での平均膜厚が凸部
での平均膜厚の50〜85%であり、該凸部の平均ピッチが
20〜300 nmであることを特徴とする、低反射性で低抵抗
の透明導電膜。1. A transparent conductive film having a two-layer structure, comprising a lower layer provided on the surface of a transparent substrate and containing a fine metal powder in a siliceous matrix, and a siliceous upper layer provided thereon. The surface of the lower layer has irregularities, the average film thickness at the convex portion of the lower layer is 50 to 150 nm, the average film thickness at the concave portion is 50 to 85% of the average film thickness at the convex portion, The average pitch of the protrusions is
A transparent conductive film with low reflectivity and low resistance, which is characterized by having a thickness of 20 to 300 nm.
In、Zn、Pb、Sb、Bi、Sn、Ce、Cd、Pd、Cu、Pt、Agおよ
びAuよりなる群から選ばれた1種もしくは2種以上の金
属、ならびに/またはこれらの金属の合金、ならびに/
またはこれらの金属および/もしくは合金の混合物から
なる、請求項1記載の透明導電膜。2. The fine metal powder is Fe, Co, Ni, Cr, W, Al,
One or more metals selected from the group consisting of In, Zn, Pb, Sb, Bi, Sn, Ce, Cd, Pd, Cu, Pt, Ag and Au, and / or alloys of these metals, And /
The transparent conductive film according to claim 1, which is composed of a mixture of these metals and / or alloys.
る請求項1または2記載の透明導電膜。3. The transparent conductive film according to claim 1, wherein the transparent substrate is an image display part of a cathode ray tube.
一次粒子径が5〜50nm の金属微粉末を分散させた分散
液から形成されたものであり、この分散液中において該
金属微粉末が、10%積算粒径が60 nm 以下、50%積算粒
径が50〜150nm、90%積算粒径が80〜500 nmという粒度
分布を持つ二次粒子を形成していたことを特徴とする、
請求項1ないし3のいずれか1項に記載の透明導電膜。4. The lower layer is formed from a dispersion liquid in which a fine metal powder having an average primary particle diameter of 5 to 50 nm is dispersed in a solvent containing a dispersant. The powder was characterized by forming secondary particles having a particle size distribution with a 10% cumulative particle size of 60 nm or less, a 50% cumulative particle size of 50 to 150 nm, and a 90% cumulative particle size of 80 to 500 nm. To do
The transparent conductive film according to claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34577996A JP3460484B2 (en) | 1996-12-25 | 1996-12-25 | Transparent conductive film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34577996A JP3460484B2 (en) | 1996-12-25 | 1996-12-25 | Transparent conductive film |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH10188680A JPH10188680A (en) | 1998-07-21 |
JP3460484B2 true JP3460484B2 (en) | 2003-10-27 |
Family
ID=18378924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP34577996A Expired - Lifetime JP3460484B2 (en) | 1996-12-25 | 1996-12-25 | Transparent conductive film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3460484B2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6416818B1 (en) * | 1998-08-17 | 2002-07-09 | Nanophase Technologies Corporation | Compositions for forming transparent conductive nanoparticle coatings and process of preparation therefor |
JP2002287906A (en) * | 2001-03-23 | 2002-10-04 | Mitsubishi Chemicals Corp | Touch panel |
JP2004317734A (en) * | 2003-04-15 | 2004-11-11 | Fuji Photo Film Co Ltd | Antireflection coating, its manufacturing method, antireflection film, and image display device |
JP2007332235A (en) * | 2006-06-14 | 2007-12-27 | Ube Nitto Kasei Co Ltd | Coating agent, coating film for X-ray shielding and method for producing coating agent |
EP1987960B1 (en) | 2007-05-03 | 2013-10-23 | Teknologian tutkimuskeskus VTT | Conductive ink and conductor |
JP4894649B2 (en) * | 2007-06-19 | 2012-03-14 | 大日本印刷株式会社 | Electromagnetic wave shielding member and manufacturing method thereof |
JP5818283B2 (en) * | 2014-01-07 | 2015-11-18 | 三菱樹脂株式会社 | Laminated polyester film |
-
1996
- 1996-12-25 JP JP34577996A patent/JP3460484B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH10188680A (en) | 1998-07-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100236154B1 (en) | Coating liquid for transparent conductive film formation, transparent conductive film using this, and its formation method | |
US7135223B2 (en) | Transparent conductive layered structure and method of producing the same, and transparent coat layer forming coating liquid used in the method of producing the same, and display device to which transparent conductive layered structure is applied | |
US6808654B2 (en) | Transparent conductive film and composition for forming same | |
KR19990036350A (en) | Transparent conductive film, low reflection transparent conductive film and display device | |
JP3399270B2 (en) | Transparent conductive film and composition for forming the same | |
EP1079413B1 (en) | Transparent conductive layered structure and method of producing the same, coating liquid useful therefor, and display that uses transparent conductive layered structure | |
JP3266323B2 (en) | Composite functional materials | |
JP3460484B2 (en) | Transparent conductive film | |
JP2000275409A (en) | Low-transmission transparent base material, its manufacture, and display device employing the same | |
JP3399268B2 (en) | Transparent black conductive film | |
JP3367241B2 (en) | Low reflective / electromagnetic shielding transparent conductive film and paint for its formation | |
JP3002327B2 (en) | Paint for forming conductive / high refractive index film and transparent material laminate with conductive / high refractive index film | |
JP3266066B2 (en) | Composition for forming conductive film containing fine metal particles with excellent storage stability | |
JP3451808B2 (en) | Low reflective transparent conductive film and method for forming the same | |
JP3501942B2 (en) | Paint for forming transparent conductive film, transparent conductive film, and display device | |
JP3266065B2 (en) | Transparent conductive film composed of metal fine particles and composition for forming the same | |
JP2892250B2 (en) | Paint for forming antistatic / high refractive index film, transparent laminate with antistatic / antireflective film and display device | |
US7132169B2 (en) | Composition for forming coating layer and flat monitor panel for display device having coating layer prepared from the same | |
JP2002071911A (en) | Transparent base material with low transmittance, method of manufacturing the same, and display device adapting transparent base material with low transmittance | |
JP3323563B2 (en) | Transparent material laminate with conductive and low reflectance coating film | |
JPH1045427A (en) | Coating liquid for forming dark color transparent conductive film and dark color transparent conductive film formed by using the same | |
JPH0978008A (en) | Transparent electroconductive film of low reflection | |
JP3466089B2 (en) | Conductive anti-reflection film and cathode ray tube | |
JP2000294041A (en) | Low-transmittance transparent conductive base material, its manufacture, and a display device incorporating base material | |
JP2000204282A (en) | Coating liquid for forming low-transmittance transparent layer |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20030715 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080815 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080815 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090815 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090815 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100815 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100815 Year of fee payment: 7 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100815 Year of fee payment: 7 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100815 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110815 Year of fee payment: 8 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120815 Year of fee payment: 9 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120815 Year of fee payment: 9 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130815 Year of fee payment: 10 |
|
EXPY | Cancellation because of completion of term |