JP3450636B2 - Metal terminal strip taping device, metal terminal strip taped by this taping device, and method of mounting this metal terminal strip - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for taping a metal terminal piece mounted on a substrate body that constitutes a desired electronic circuit or an electric circuit, and mounting the tapped metal terminal piece on the substrate body. On how to do.

[0002]

2. Description of the Related Art Conventionally, a circuit board 1 as shown in FIG.
There is a substrate 1 on which thin plate-shaped metal terminal pieces 11 and 12 are mounted. This type of substrate 1 is provided with the metal terminal pieces 11, 1 described above.
2, or the ends of conductor pieces (not shown) connected to the terminal pieces 11 and 12 are bent, for example, to contact the electrodes of a rechargeable battery used as a power source of a mobile phone or the like to charge the battery. It is used as a battery protection circuit.

The substrate 1 is manufactured through the following steps. First, a predetermined wiring pattern and a terminal pad electrically connected to this wiring pattern are formed on each unit board 20 of the aggregate substrate 2 in which a plurality of unit boards 20 as shown in FIG. 8 are arranged. Next, solder paste is applied to the terminal pad, and various electronic components 13 and 14 and the metal terminal pieces 11 and 12 are placed in correspondence with the application area of the solder paste. Further, the solder paste is heated and then solidified to form various electronic components 13 and 14 on the unit substrate 20.
And the metal terminal pieces 11 and 12 described above are mounted. Finally, by separating the unit boards 20 on which the electronic components 13 and 14 are mounted, the desired circuit board 1 as shown in FIG. 7 is obtained.

The step of mounting the various electronic components 13 and 14 and the metal terminal pieces 11 and 12 on the unit boards 20 is automatically performed by using a mounting device, and various electronic components 13 and 14 mounting step and the metal terminal piece 11,
The 12 mounting steps are performed on the same manufacturing line. That is, the time required to mount each of the components 11, 12, 13, and 14 on one aggregate substrate 2 is equal to that of each component 1.
It is preferable that the mounting steps of 1, 12, 13, and 14 are substantially the same in consideration of the productivity of the manufacturing line.

[0005]

However, the various electronic components 13 and 14 are supplied to the position close to the mount device while being held on the long strip tape 25 as shown in FIG. The metal terminal pieces 11 and 12 are supplied using a parts feeder called a bowl feeder. In this bowl feeder, a container in which a spiral transfer path is formed is supported by a leaf spring, and the metal terminal piece housed in the container is conveyed in a spiral shape by the vibration of the container accompanying the vibration of the leaf spring. It is configured to move gradually along the road. That is, in this bowl feeder, since the metal terminal piece gradually moves in the transport path,
The supply speed of the metal terminal piece to the mounting device becomes extremely slow.

From the above, in the mounting process of the electronic components 13 and 14, the feeding speed of the tape 25 is adjusted so as to supply the electronic components 13 and 14 at a speed corresponding to the processing speed of the mounting device. It is possible to speed up the placement process. On the other hand, in the mounting step of the metal terminal pieces 11 and 12, the metal terminal pieces 11 and 12 by the bowl feeder are
Of the metal terminal piece 11,
The supply speed of 12 is 1/10 or less of the supply speed of the electronic components 13 and 14, and the mounting process of the metal terminal pieces 11 and 12 cannot be speeded up. Therefore, the step of placing the metal terminal pieces 11 and 12 becomes a bottleneck,
The productivity of the above-mentioned production line will deteriorate.

Therefore, by disposing a plurality of bowl feeders adjacent to each other and simultaneously supplying the metal terminal pieces 11 and 12 from these bowl feeders, the metal terminal pieces 11 and 1 are fed.
It is also conceivable to increase the supply rate of 2. However, even if a plurality of bowl feeders are arranged, it is clear that the difference in the supply speed between the metal terminal pieces 11 and 12 and the electronic components 13 and 14 is still large. Further, since the bowl feeders are relatively large, if a plurality of bowl feeders are arranged adjacently to each other, there arises an adverse effect such that the movement path of the head of the mounting device becomes long. Therefore, using the bowl feeder, the metal terminal piece 1
1 and 12 were supplied, the metal terminal pieces 11 and
It is not possible to speed up the mounting step of No. 12.

The present invention has been devised under the circumstances described above, in which the metal terminal piece is held by a long strip tape, and the step of placing the metal terminal piece on the substrate body. The task is to speed up the process.

[0009]

DISCLOSURE OF THE INVENTION In order to solve the above problems, the present invention takes the following technical means.

That is, according to the first aspect of the present invention, there is provided a device for sequentially holding a plurality of metal terminal pieces on a long strip-shaped tape while transferring the tape on a predetermined transfer path. A tape supply device for supplying the tape, a metal hoop material supply device for supplying a long strip-shaped metal hoop material, and a metal terminal piece by continuously cutting the metal hoop material to a predetermined length. a metal hoop material cutting device for the upper <br/> Symbol metal terminal pieces present in the metal hoop material cutting device, from the metal hoop material cutting device for placing at regular intervals on the tape A mounting device,
A tape winding device for winding the tape holding the metal terminal piece is provided, and a taping device for the metal terminal piece is provided.

In the apparatus having the above-mentioned structure, the metal terminal pieces cut into individual pieces are automatically placed on the long strip-shaped tape which has been transferred through the predetermined transfer path. It is an apparatus for providing the held tape in a roll form. That is, the device has one surface in which the tip of the metal hoop material supplied in the form of a long strip from the metal hoop material supply device is cut to a predetermined length and automatically held on the tape. is doing. Therefore, in order to hold the metal terminal piece on the tape, the metal hoop material is cut into a predetermined size by a cutting device prepared in another place and placed on the tape using a mounter device. Therefore, the metal terminal pieces can be held on the tape without rearranging them on a tray or the like.

Further, in the metal terminal piece held by the tape in the roll shape provided by the above-mentioned device,
Similar to various electronic components mounted on the substrate, the metal terminal piece can be transferred while being held by the tape, and the metal terminal piece can be supplied to the moving path of the mounter device. Therefore, it is possible to supply the metal terminal piece at a speed according to the processing speed of the mounter device as in the electronic component mounting step, and it is possible to speed up the metal terminal piece mounting step. Therefore, the step of placing the metal terminal piece as a bottleneck is not hindered from improving the productivity of the manufacturing line including the placing step.

[0013] Preferably, the metal hoop material cutting device is provided with a vertically movable blade, and the metal hoop material is cut by pressing the metal hoop material with the blade. Alternatively, a fixing mechanism for positioning the tip of the supplied metal hoop material and fixing the tip of the metal hoop material to cope with the load at the time of cutting may be adopted. In addition, preferably, as the fixing mechanism, a mechanism configured to fix the tip end portion of the metal hoop material by a vacuum suction force is adopted.

In the above apparatus, since the metal hoop material is fixed at the time of cutting, the cutting portion is bent by the pressure applied by the blade body, the metal terminal piece is moved to an undesired position, or is blown. The metal hoop material can be satisfactorily cut without being damaged. Also,
Even after the cutting, the metal terminal piece is still positioned at the predetermined position, and the mounting apparatus can favorably hold the metal terminal piece on the tape.

Preferably, further, the tape is
A tape having a predetermined adhesiveness on one side is used, and the metal terminal piece is configured to be held on the adhesive side of this tape. Further, as the tape, it is also possible to use a tape having through holes formed at regular intervals,
The metal terminal piece may be held at a position corresponding to the through hole of the tape.

Usually, a mounting device is used when the metal terminal piece held on the tape is placed on the substrate, and the metal terminal piece is adsorbed by the adsorption head provided in the mounting device, and the metal terminal piece is adsorbed by the adsorption head. The substrate is moved to a predetermined position and placed. Therefore, when the tape having a predetermined adhesiveness on one surface is used as the tape, when the metal terminal piece is placed on the tape, the metal head is pressed downward by the suction head. By
The metal terminal piece can be easily held on the tape. That is, it is not necessary to take any new means to hold the metal terminal piece on the tape.

The tape having through holes is used as the tape for the convenience of mounting the metal terminal piece on the substrate. That is, when the metal terminal piece is held on the adhesive surface of the adhesive tape, it is possible that the metal terminal piece cannot be peeled off from the adhesive tape only by the suction force of the suction head. , A predetermined jig or the like is used from below the through hole, and the metal terminal piece is sandwiched between the jig and the suction head so that the metal terminal piece can be easily peeled off from the adhesive tape. Has been devised.

Preferably, a protective tape supply device for supplying a protective tape wound by the tape winding device together with the tape is provided so as to cover the metal terminal piece held by the tape.

When the protective tape is wound up together with the tape so as to cover the metal terminal piece to form a roll, for example, when a tape made of paper is used, it is held on the tape. This is because it is conceivable that a hole may be formed in the tape due to the corner of the metal terminal piece that is cut. If a hole or the like is opened in the tape, the tension applied to the tape at the time of transfer when the metal terminal piece is transferred with the metal terminal piece held on the tape to be placed on the substrate. This may cause a situation in which the above tape is cut. Therefore, it is intended to avoid such a situation by winding the protective tape together with the tape.

As the tape, a tape which is recessed downward and has an emboss corresponding to the size of the metal terminal piece may be used. When using this tape, a sealing tape supply device for supplying a sealing tape for sealing the upper opening of the embossing, and the sealing tape in the state where the metal terminal piece is held in the embossing A crimping device for crimping is required. As the pressure bonding device, one having a heat generating member capable of heating the sealing tape may be adopted.

[0021]

[0022]

According to the second aspect of the present invention, the metal terminal strip taping device according to the first aspect is used.
Te, characterized in that it is held on the tape that is the B Lumpur shape, taped metal terminal pieces are provided.

According to a third aspect of the present invention, there is provided a method for mounting the taped metal terminal piece according to the above-mentioned second aspect on each unit board of an assembly board on which a plurality of unit boards are arranged. There is a step of applying a solder paste to a predetermined position of each of the unit boards, and a metal terminal piece held on the tape at a position adjacent to the aggregate substrate in a state where the metal terminal piece is held on the tape. Supplying step, a step of placing the metal terminal piece on each of the unit substrates corresponding to the application area of the solder paste, a step of heating and melting the solder paste and then solidifying the solder paste, There is provided a method for mounting a metal terminal piece, comprising:

In the mounting method according to this aspect, the metal terminal piece held by the tape is continuously supplied to a position adjacent to the aggregate substrate while the metal terminal piece is held by the tape, and the metal terminal piece is held by the tape. Since the piece is configured to be placed on each of the unit substrates, it goes without saying that the time required for the step of placing the metal terminal piece is significantly reduced as compared with the conventional placing step.

Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be specifically described below with reference to the drawings.

FIG. 1 is an overall front view showing an example of a taping device 5 for a metal terminal piece 94 according to the present invention, and FIG. 2 is a mounting device 7, a metal hoop material cutting device 8 and a metal hoop material for the taping device 5. FIG. 3 is a plan view of the supply device 90, and FIG. 3 is a sectional view taken along line III-III of FIG.

The taping device 5 according to the present invention cuts the metal hoop material 9 to a predetermined length, and holds the obtained metal terminal piece 94 on the tape 6 transferred along a predetermined transfer path. This is an apparatus for providing the tape 6 holding the metal terminal pieces 94 in a roll form.

As shown in FIGS. 1 to 3, the taping device 5 includes a tape supply device 50 for supplying the tape 6 transferred along a predetermined transfer path, and a long strip-shaped metal hoop material 9. For supplying metal hoop material, a metal hoop material cutting device 8 for continuously cutting the metal hoop material 9 into a predetermined length to form a metal terminal piece 94, and the metal terminal piece 94. Is mounted on the tape 6 at regular intervals, and a tape winding device 51 for winding the tape 6 on which the metal terminal pieces 94 are held. .

As shown in FIG. 1, the tape supply device 5
0, a long strip tape 6 is rotatably mounted as a tape roll 62 in the form of a roll. In the tape supply device 50 and the tape winding device 51, rotatable transfer rollers R, r are provided respectively.
That is, the tape 6 pulled out from the tape supply device 50 is configured to be transported along the transport path defined by the transport rollers R and r and wound by the tape winding device 51.

As the tape 6, the tape shown in FIG.
A plurality of locking holes 60 are formed at both end portions in the longitudinal direction at regular intervals, as shown in FIG. 3, and the pawls (not shown) provided on the transfer rollers R and r are The tape 6 is configured to be transported by being locked in the locking hole 60. The transfer of the tape 6 by the transfer rollers R and r may be continuous or intermittent, but it is intermittent in view of holding the metal terminal piece 94 on the tape 6. Preferably.

As shown in FIGS. 2 and 3, the metal hoop material supplying device 90 is a device for drawing out the rolled metal hoop material 9 and supplying it to the metal hoop material cutting device 8. A leveler 9 having a guide 92 for properly guiding the metal hoop material 9 to the metal hoop material cutting device 8 and upper and lower rollers 91a and 91b facing each other.
1 and 1. A plurality of upper rollers 91a,
The lower roller 91b is configured to rotate in the same direction, and the upper roller 91a and the lower roller 91b are configured to rotate in mutually opposite directions so that the metal hoop material 9 passes between the upper and lower rollers 91a and 91b. ing. That is, in the leveler 91 having the above-described configuration, the bending and distortion of the metal hoop material 9 that has passed between the upper and lower rollers 91a and 91b is corrected.

As shown in FIG. 3, the metal hoop material cutting device 8 has an upper die 80 having a blade 81 and movable up and down, and a lower hole 83 formed with a through hole 83 corresponding to the blade 81. And a die 82. The lower mold 82 is further formed with a suction hole 84 for suction-fixing the tip of the fed metal hoop material 9. In the metal hoop material cutting device 8 configured as described above, the upper die 80 is held in a state where the tip of the metal hoop material 9 is fixed.
Is moved downward, the metal hoop material 9 is cut by the blade 81 to form a metal terminal piece 94.

By fixing the tip of the metal hoop material 9 during cutting, the cutting portion may be bent by the pressure applied by the blade 81, the metal terminal piece 94 may move to an undesired position, or The metal hoop material 9 can be satisfactorily cut without flying.

As shown in FIGS. 2 and 3, the mounting device 7 basically has the same structure as the existing mounting device, and the suction head moves the metal terminal piece 94 by vacuum suction or the like. 71 is provided. The suction head 71 is integrally connected to a slide member 70 that is movable in the directions of arrows A and B in FIG.
The suction head 71 can also move integrally in the moving direction of the slide member 70.

As shown in FIG. 4, the upper die 80 moves downward to cut the metal hoop material 9 when the suction head 71 mounts the metal terminal pieces 94, and
As shown in FIG.
In the state of picking up the pickup 4, it is configured to move up and down so as not to interfere with the suction head 71.

As shown in FIG. 1, the mounting device 7 and the metal hoop material cutting device 8 are provided with a protective tape supplying device 6.
It is arranged on the 8th. This protective tape feeder 68
Is a device for supplying a protective tape which is wound simultaneously with the tape 6 so as to cover the metal terminal piece 94 when the tape 6 is wound by the tape winding device 51.

Next, taping of the metal terminal piece 94 by the taping device 5 configured as described above will be described.
For convenience of description, the tape 6 used will be briefly described.

The tape 6 is an adhesive tape having adhesiveness on one surface, and is made of synthetic resin such as polyimide. As shown in FIG. 5 or FIG. 6, locking holes 60 are formed at both ends of the tape 6 in the longitudinal direction at regular intervals, and the central portion in the longitudinal direction penetrates at regular intervals. A hole 61 is formed. Claws (not shown) provided on the transfer rollers R and r included in the tape supply device 50 and the tape winding device 51 are locked into the locking holes 60, and the rotation of the transfer rollers R and r causes a predetermined movement. Transferred along the transfer path.

On the other hand, in the metal hoop material cutting device 8, as shown in FIGS. 3 and 4, the upper die 80 moves downward and the blade 81 causes the tip of the metal hoop material 9 to have a predetermined length. The metal terminal piece 94 is cut at the part. When the metal hoop material 9 is cut, the lower die 8
The tip portion of the metal hoop material 9 is fixed by the suction force of the suction hole 84 formed in 2.

Next, the upper die 80 moves upward, and the suction head 71 of the mount device 7 moves into the space between the upper die 80 and the lower die 82. That is, the suction head moves in the direction shown by the arrow B in FIG. 2 and becomes the state shown in FIG. Then, when it reaches a portion corresponding to the metal terminal piece 94, the metal terminal piece 94 moves downward to move to the metal terminal piece 94.
To pick up. At this time, the suction fixing by the suction hole 84 of the lower mold 82 is released.

The suction head 71 picking up the metal terminal piece 94 slides in the direction indicated by the arrow A in FIG. 2 and is positioned on the transfer path of the tape 6.
Further, while the suction head 71 is moving downward to release the suction force, the metal terminal piece 94 is placed at a position corresponding to the through hole 61 formed in the tape 6, and the metal is pressed by a predetermined pressing force. The terminal piece 94 is pressed and held on the tape 6.

At this time, in the metal hoop material cutting device 8, the upper die 80 is moved downward and the tip portion of the metal hoop material 9 is cut again to obtain the metal terminal piece 94. On the other hand, the tape 6 is pitch fed so that the metal terminal piece 94 can be held at a position corresponding to the next through hole 61. Thereafter, such an operation is sequentially repeated, and the metal terminal pieces 94 are held on the tape 6 one after another.

In the tape winding device 51, the tape 6 holding the metal terminal pieces 94 is wound into a roll. At this time, the protective tape 69 is also wound so as to cover the metal terminal piece 94 at the same time.

A tape 65 as shown in FIG. 6 can be used as the tape for holding the metal terminal piece 94. The tape 65 has locking holes 64 formed at both ends in the longitudinal direction, and an emboss 66 which is recessed downward at the center in the longitudinal direction.
That is, like the tape 6, it is configured to be transported by the transport rollers R and r, and the metal terminal piece 94 is held in the emboss 66.

When such a tape 65 is used, since it is necessary to seal the upper opening of the emboss 66, it is necessary to supply a sealing tape that seals this opening. A crimping device for crimping is also required. When the sealing tape is pressure-bonded by means such as thermocompression bonding, a pressure-bonding device having a heat-generating member is used.

Next, a method of mounting the metal terminal pieces 94 held on the tape 6 by the taping device 5 on the substrate will be briefly described. As the substrate, a collective substrate 2 having a plurality of unit substrates 20 as shown in FIG. 8 is adopted. As the tape 6, a tape having adhesiveness on one surface and having a through hole 61 as shown in FIG. 4 or 5 is used.

The unit substrate 20 is formed of glass epoxy resin or the like, a copper coating is formed on the surface thereof, and a wiring pattern is formed by performing pattern etching on the copper coating. . Also,
Conductor pads are preferably exposed and formed so as to be electrically connected to this wiring pattern and are plated with nickel and gold. The areas other than the exposed conductor pads thus formed are covered with an insulating resin film usually called a green resist.

First, a solder paste is applied to a predetermined position of each unit board 20, that is, the surface of the conductor pad.
This step is performed by a printing method using a screen mask. Note that this step is performed at the same time as the step of applying the solder paste to the conductor pads for mounting other electronic components.

Next, the metal terminal pieces 94, which are pitch-fed while being held by the tape 6 in the vicinity of the transfer path of the collective board 2, are soldered to the unit boards 20 of the collective board 2 by using an existing chip mounter. Place it in correspondence with the paste application area. That is, the metal terminal piece 94 in the present embodiment can be supplied with the metal terminal piece 94 in a state of being held on the tape like other electronic components. Therefore, it becomes possible to supply the metal terminal piece 94 at a speed according to the processing speed of the chip mounter as in the mounting step of other electronic parts, and to speed up the mounting step of the metal terminal piece 94. be able to. Therefore, the step of placing the metal terminal piece 94 does not become a bottleneck and hinders improvement in productivity of the manufacturing line including the above-mentioned placing step.
Further, as the tape 6, a tape having a through hole 61 formed at the central portion in the longitudinal direction is adopted.
The metal terminal piece 94 is held at a position straddling 1.
Therefore, when picking up the supplied metal terminal piece 94, if it is difficult to peel the metal terminal piece 94 from the tape 6 only by the suction force of the suction head of the chip mounter, a predetermined amount from below the through hole 61 is set. By using a jig or the like, the metal terminal piece 94 can be sandwiched between the jig and the suction head to pick up.

Then, the aggregate substrate 2 on which the metal terminal pieces 94 and each electronic component are placed is carried into a reflow furnace to be heated to melt the solder paste, and then the solder paste is cooled and solidified. The metal terminal piece 9
The mounting of the unit boards 20 of No. 4 is completed. Finally, by separating each unit board 20, the circuit board 1 as shown in FIG. 7 is obtained.

[Brief description of drawings]

FIG. 1 is an overall front view showing an example of a metal terminal strip taping device according to the present invention.

FIG. 2 is a plan view of a mounting device of the taping device, a metal hoop material cutting device, and a metal hoop material supply device 90.

FIG. 3 is a sectional view taken along line III-III in FIG.

FIG. 4 shows a state in which a long strip-shaped metal hoop material is cut,
It is a figure of the state where the cut metal terminal piece is held on the adhesive tape.

FIG. 5 is a view showing a state where a cut metal terminal piece is picked up.

FIG. 6 is a perspective view of a film tape on which embossing is formed.

FIG. 7 is a plan view of a circuit board on which metal terminal pieces are mounted.

FIG. 8 is a plan view of a collective substrate in which a plurality of unit substrates are arranged adjacent to each other.

FIG. 9 is a perspective view showing a supply state of electronic components held on an adhesive tape.

[Explanation of symbols]

5 Taping device 6 tapes (with adhesiveness) 7 Mount device 8 Metal hoop material cutting device 9 Metal hoop material 50 tape feeder 51 Tape winding device 61 Through hole (formed on tape) 65 tapes (embossed) 66 embossed (formed on tape) 68 Protective tape supply device 69 protective tape 81 Blade (of metal hoop cutting device) 84 Adsorption hole (of fixing mechanism) 90 Metal hoop material feeder 94 Metal terminal strip

─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H05K 13/00-13/04 B65B 15/04

Claims (7)

(57) [Claims] 1. A device for sequentially holding a plurality of metal terminal pieces on a long strip-shaped tape while transferring the tape in a predetermined transfer path, and a tape supply device for supplying the tape. a metal hoop material supply device for supplying a long length of metal hoop material, and the metal hoop material cutting device for the metal terminal pieces to continuously cut the metal hoop material into a predetermined length, the A mounting device for placing the metal terminal piece present in the metal hoop material cutting device on the tape at regular intervals from the metal hoop material cutting device, and winding the tape holding the metal terminal piece. A tape take-up device for a metal terminal strip. 2. The metal hoop material cutting device includes a vertically movable blade body, and the metal hoop material is configured to be cut by pressing the metal hoop material with the blade body. The taping device for a metal terminal piece according to claim 1, wherein: 3. The metal hoop material cutting device has a fixing mechanism for positioning the tip end portion of the supplied metal hoop material and fixing the tip end portion of the metal hoop material to cope with a load at the time of cutting. It has, Claim 1 or 2
The taping device for metal terminal pieces as described in 1. 4. The taping device for a metal terminal piece according to claim 3, wherein the fixing mechanism is configured to fix the tip end portion of the metal hoop material by a vacuum suction force. 5. A tape having a predetermined adhesiveness on one surface is used as the tape, and the tape is configured such that the metal terminal piece is held on the adhesive surface of the tape. 5. A taping device for metal terminal piece according to any one of 1 to 4. 6. A metal terminal according to claim 1.
Using a taping device on one side to make a tape in a roll shape
Taped metal edges, characterized by being retained
Child piece. 7. The taped tape according to claim 6.
Each of the collective boards in which a plurality of unit boards are arranged with metal terminal pieces
A method for mounting on a unit board, wherein solder paste is applied to predetermined positions on each unit board.
Process and the above-mentioned assembly base while holding the metal terminal piece on the tape.
Metal terminal piece held on the tape at a position adjacent to the plate
And the metal end corresponding to the solder paste application area.
A step of placing the child pieces on each of the unit substrates, and heating and melting the solder paste to solidify the solder paste.
And a step of mounting the metal terminal piece.