JP3447089B2 - Chip-type electronic component mounting device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type electronic component mounting apparatus for mounting a chip-type electronic component on a substrate in an electronic circuit board assembly process. 2. Description of the Related Art In recent years, many high-speed automatic mounting apparatuses have been used for efficient production in the process of assembling electronic component substrates. On the other hand, since the shapes of electronic components have become complicated and diversified, a mounting device that can adapt to this has been demanded. A conventional automatic mounting apparatus is configured as shown in FIGS. Numeral 1 schematically shows a rotary head, and nozzle units A as shown in FIG. 6 are attached at equal angles. The rotary head 1 is driven to rotate at high speed in the direction of arrow 2 by mounting an index. ing. Reference numeral 3 denotes a first component supply tape on which a rectangular chip (such as a resistor or a capacitor) is mounted, and reference numeral 4 denotes a second component supply tape on which a modified chip (such as a QFP-shaped IC or connector) is mounted. (A)
As shown in (b), in this example, an IC chip 6 having a QFP appearance is mounted as a rectangular chip 5 and a modified chip 4 in a tape package. [0004] Reference numeral 7 denotes a component take-out station provided in the moving path of the rotary head 1. The nozzle unit A arriving at the station 7 converts the first component supply tape 3 or the second component supply tape 4 into a square shape. Chip 5
Alternatively, the IC chips 6 are sucked and taken out one by one. Reference numeral 8 denotes a station for determining a component mounting angle. The nozzle unit A arriving at the station 8 is operated to rotate the component held by suction. Reference numeral 9 denotes a component recognition station which operates the nozzle unit A arriving at the station 9 to recognize the attitude of the component held by suction by an external camera. Reference numeral 10 denotes a station for performing component rotation correction based on the recognition in the component recognition station 9, which operates the nozzle unit A arriving at the station 10 to correct the rotation direction of the component posture being suction-held. 1
Reference numeral 1 denotes a component mounting station which operates the nozzle unit A arriving at the station 11 and mounts components held by suction on the printed circuit board 12. The rotary head 1 is rotated at a high speed so that the square chip 5 and the odd-shaped chip 4 as chip-type electronic parts are rotated.
The IC chip 6 is mounted on the printed circuit board 12 at high speed. [0006] However, in such a conventional configuration, the supply form of electronic components is limited to a tape state. For this reason, an expensive dedicated tape having a complicated shape as shown in FIG. 5B is required for mounting an odd-shaped chip 4 such as an IC chip such as a QFP or a connector. [0007] In addition, the tape package may cause bending of the leads of the IC chip 6, which poses a problem from the viewpoint of mounting quality. The present invention provides a chip-type electronic component mounting apparatus that can mount a rectangular chip 5 supplied in a tape package, and can mount the deformed chip 4 without deforming the component without forming the tape package. The purpose is to. [0008] A chip-type electronic component mounting apparatus according to the present invention comprises a rotary head driven intermittently.
Supplied to the parts removal station provided in the movement path.
In a component mounting device that mounts electronic components to be mounted on a board , the square chip electronic components move as tape
First station supplied to the product removal station
And other odd-shaped chip electronic components
A second station supplied to the delivery station;
Parts provided below the other parts removal station
A supply stage and a moving stage provided on the component supply stage.
And the electronic components on the tray
A transfer head for transferring to the product supply stage, and the transfer head.
And an XY table for moving the transfer head.
The odd-shaped chip electronic component from the tray
Transfer to slide block and slide block to other parts
The rotary head is moved to a position below the unloading station, and the rotary head is provided at the first and second stations.
It characterized the Turkey be mounted to the mounting position take out an electronic component. According to this configuration, by providing a plurality of (two) component take-out stations, tray supply of odd-shaped chips becomes possible, and mounting with high productivity and high quality can be performed. An embodiment of the present invention will be described below with reference to FIGS. It is to be noted that components having the same functions as those of the conventional example are denoted by the same reference numerals and described. In FIG. 1, a rectangular chip 5 is supplied in a package of a first component supply tape 3 to a component pick-up station 7 as a first station, and an IC chip 6 is in a tray package arranged on a tray 22. Is supplied to a component take-out station 13 as a second station different from the component take-out station 7. A component supply stage 14 is provided below the component removal station 13. A slide shaft 15 is attached to the stage 14, as shown in FIG. 3, and a slide block 16 is movably supported by the slide shaft 15. The slide block 16 can be driven by a cylinder 17 to move linearly. An XY table 18 for moving the head 21 is provided between the tray 22 and the stage 14. As shown in FIG. 2, Y of the X direction robot 19 and the Y direction
A transfer head 21 is attached to the directional robot 20. With such a configuration, the first nozzle unit A arriving at the component pick-up station 7 allows the first
The square chips 5 are sucked and taken out one by one from the component supply tape 3 of the above, and the picked-up square chips 5 are suction-held by operating the nozzle unit A when the nozzle unit A arrives at the station 8. Part is rotated to the proper mounting angle and the station 10
Then, the angle of the component is corrected based on the recognition in step (1), and the square chip 5 sucked and held in the component mounting station 11 is mounted on the printed circuit board 12. When mounting the IC chip 6, the XY table 18 is operated to suck the IC chip 6 placed on the tray 22, and the front end side of the slide block 16 at the retracted position as shown in FIG. The IC chip 6 is previously pushed to a position below the component take-out station 13 by moving the slide block 16 forward by moving the stem D of the cylinder 17 forward in advance at the predetermined position of the concave portion C. The IC chip 6 set at a position below the component take-out station 13 of the component supply stage 14 in this manner is sucked and taken out by the nozzle unit A arriving at the component take-out station 13, and the taken-out IC chip 6 is When the nozzle unit A arrives at the station 8, the nozzle unit A is operated to rotate the suction-held component to an appropriate mounting angle at an appropriate mounting angle, and the station 10 changes the component angle based on the recognition at the station 9. After the correction, the IC chip 6 sucked and held at the component mounting station 11 is
Attach to 2. As described above, the irregularly shaped chip 4 such as the IC chip 6 can be mounted on the printed circuit board 12 simply by supplying it in the form of a tray placed on the tray 22, thereby improving the productivity and quality of circuit board formation. be able to. As described above, according to the present invention, the intermittent rotation
Parts provided in the moving path of the driven rotary head
In a component mounting apparatus that mounts electronic components supplied to a take-out station on a substrate , a square chip electronic component is used.
Move to tape pick-up station and move to parts pick-up station
First station to be supplied and odd-shaped chip electronic components
Supplied to other parts pick-up station in tray
A second station to be removed;
A component supply stage provided below the
A movable slide block provided on the supply stage,
Transferring the electronic components on the tray to a component supply stage
Transfer head and XY table for moving the transfer head
And an electronic part having a deformed chip by the transfer head.
Goods from the tray to the slide block
Id block under the other parts removal station
And the rotary head is moved to the first position.
Since the electronic components prepared in the second station are configured to be taken out and mounted at the mounting position, the square chip electronic components supplied in a tape package and the different electronic components supplied in a tray package are provided.
It can cope with the shape chip electronic parts at the same time. Further, since the irregular shaped chips can be supplied in the form of a tray without being supplied in the form of a tape, there is no deformation of the irregular shaped chips, and high productivity and high quality mounting can be expected.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of one embodiment of a chip-type electronic component mounting apparatus according to the present invention. FIG. 2 is a partially cutaway side view of the XY table of the embodiment and its periphery. FIG. 3 is a longitudinal sectional view of the slide block of the embodiment and the periphery thereof. FIG. 4 is a plan view of a conventional chip-type electronic component mounting apparatus. FIG. 5 is a perspective view of a supply state of a square chip component and a supply state of an odd-shaped chip in the conventional example. FIG. 6 is a perspective view of a nozzle unit. [Description of Signs] 1 Rotary head 3 First component supply tape 5 Square chip 6 IC chip 7 Component removal station [First station] 8 Component rotation station 9 Component recognition station 10 Component rotation correction station 11 Mounting station 12 Print Substrate 13 Unloading station [second station] 14 Component supply stage 15 Slide shaft 16 Slide block 17 Cylinder 18 XY table 21 Transfer head 22 Tray

Continuation of the front page (72) Inventor Hironori Konno 1006 Kazuma Kadoma, Kazuma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-3-70199 (JP, A) JP-A-3-238896 (JP) , A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 13/00-13/04 B23P 21/00

Claims (1)

(57) [Claims 1] A rotary head driven intermittently
Supplied to the parts removal station provided in the movement path.
In a component mounting device that mounts electronic components to be mounted on a board , the square chip
First station supplied to the delivery station
And the odd-shaped chip electronic component is in the tray
A second station to be supplied to the station and a component provided below the other component removal station
A supply stage, and a movable slide block provided on the component supply stage.
And transfer the electronic components on the tray to a component supply stage.
A transfer head; and an XY table for moving the transfer head.
From above to the slide block and slide block
Moved to a position below the other parts removal station.
So, the rotary head is the first, second station
Ruchi be mounted to the mounting position removed prepared electronic components <br/>-up electronic component mounting apparatus.