JP3442240B2 - Thermosetting resin composition and prepreg and laminate using the same - Google Patents

Description

Detailed Description of the Invention

[0001]

The present invention relates to heat resistance, low hygroscopicity,
The present invention relates to a resin composition excellent in adhesiveness, workability, toughness, and solder heat resistance after moisture absorption, a prepreg, and a laminated board.
That is, it relates to a resin composition for improving solder heat resistance after absorbing moisture, such as an electronic / electrical component, an insulating material for the semiconductor field, a resin encapsulating material, and a laminated board material, and particularly a printed wiring that is required to have heat resistance. TECHNICAL FIELD The present invention relates to a resin composition useful for a laminate for plates, a prepreg and a laminate using the same.

[0002]

2. Description of the Related Art With regard to printed wiring boards widely used in electric / electronic devices, communication devices, computing devices, etc., the wiring density has become more sophisticated and highly integrated.
There is an increasing demand for improved reliability by improving the heat resistance of laminated wiring boards. In addition, COB, PGA, BGA, MC
Applications for directly mounting a semiconductor chip on a substrate such as an M substrate are increasing, and in such a mounting process,
High temperature is required, and the mounting substrate is required to have heat resistance. BACKGROUND ART Conventionally, epoxy resins, unsaturated polyester resins, polyimide resins, phenol resins, etc. have been used as resin materials for forming laminated boards for printed wiring boards. Of these resins, epoxy resins and bismaleimides have been used. The polyamino bismaleimide resin obtained by reacting a diamine with an aromatic diamine is widely used for high-density packaging and high-multilayer laminates.

[0003]

However, although the epoxy resin has relatively good heat resistance, it meets the recent demand for higher heat resistance due to high density mounting of printed wiring boards and high multilayer structure. Inevitably, there is a limit to the increase in heat resistance. A polyamino bismaleimide resin or the like has been proposed as a laminate material for improving heat resistance (French Patent No. 1455514, Japanese Patent Publication No. 46-23250, JP-A-61-200149).
Issue). In the case of this polyamino bismaleimide,
Although it has excellent heat resistance, it has high hygroscopicity,
There is a problem in adhesiveness, and there is a problem that the cost becomes high because a high temperature and a long time are required when laminating as compared with the epoxy resin. Further, in order to make up for the drawbacks of the polyamino bismaleimide resin, there is an imide-modified epoxy resin (Japanese Patent Publication No. 47-42160) in which an epoxy resin is added to a polyamino bismaleimide resin, but the heat resistance is much higher than that of the polyamino bismaleimide resin. However, there was a problem that the heat resistance was insufficient.

For this reason, it is possible to cope with the future progress of high-density mounting and multi-layering, and it is also applicable to the application of semiconductor chips directly. It has excellent heat resistance, low moisture absorption, and solder heat resistance after moisture absorption. There has been a strong demand for a resin material for laminated boards which is excellent in mechanical properties, has good mechanical properties such as adhesiveness and toughness, and is inexpensive, and which has a low cost. The present invention has been made in view of such circumstances, eliminates the drawbacks of conventional epoxy resin, polyimide resin, heat resistance, especially a new resin material for laminates excellent in solder heat resistance after moisture absorption It is intended to be provided.

[0005]

Means for Solving the Problems The inventors of the present invention have conducted extensive studies in order to solve the above-mentioned problems, and as a result, polymaleimide compounds and 2- (4-hydroxyphenyl) -2-
(4-maleimidophenyl) propane, phenolic resin, epoxy resin, and at least one activity in the molecule
By using the compound having hydrogen, the heat resistance of the polymaleimide resin, the adhesiveness of the epoxy resin, and the workability are effectively utilized, and the heat resistance, mechanical properties, and solder heat resistance are successfully improved. Came to complete.

That is, the present invention provides 1) (a) a polymaleimide compound represented by the general formula (1)

[0007]

[Chemical 3] (In the formula, R ₁ is an m-valent organic group, Xa and Xb are hydrogen atoms,
The same or different monovalent atoms or groups selected from halogen atoms and organic groups, m is an integer of 2 or more), and (b)
Formula (2) [Chemical formula 4]

[0008]

[Chemical 4] Represented by 2- (4-hydroxyphenyl) -2-
(4-maleimidophenyl) propane, (c) phenol resin, (d) epoxy resin having at least two epoxy groups in the molecule, and (e) small amount in the molecule.
At least with a compound having one active hydrogen
Thermosetting resin set containing the resulting modified imide resin
A product.

2) curing accelerator, flame retardant, filler and / or
Or (1) a thermosetting resin composition containing an additive, 3) a prepreg characterized in that a base material is impregnated with the resin material of (1) or (2), and 4) above. 3 ) A thermosetting resin laminated plate characterized by being formed by laminating one or a plurality of prepregs according to 3 ), and 5) The above ( 4 ) formed by laminating and integrally molding the outermost metal foil.
It is a thermosetting resin laminated board of.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION As the (a) polymaleimide compound used in the present invention, any compound having two or more maleimide groups in one molecule can be used. As such a polymaleimide compound, for example, N, N'-
Ethylene bismaleimide, N, N'-hexamethylene bismaleimide, N, N '-(1,3-phenylene) bismaleimide, N,
N '-[1,3- (2-methylphenylene)] bismaleimide, N, N'
-(1,4-phenylene) bismaleimide, bis (4-maleimidophenyl) methane, bis (3-methyl-4-maleimidophenyl) methane, bis (4-maleimidophenyl) ether, bis (4-maleimidophenyl) sulfone , Bis (4-
Maleimidophenyl) sulfide, bis (4-maleimidophenyl) ketone, bis (4-maleimidocyclohexyl) methane, 1,4-bis (4-maleimidophenyl) cyclohexane, 1,4-bis (maleimidomethyl) cyclohexane, 1,4 -Bis (maleimidomethyl) benzene, 1,3-bis
(4-maleimidophenoxy) benzene, 1,3-bis (3-maleimidophenoxy) benzene, bis [4- (3-maleimidophenoxy) phenyl] methane, bis [4- (4-maleimidophenoxy) phenyl] methane, 1 , 1-Bis [4- (3-maleimidophenoxy) phenyl] ethane, 1,1-Bis [4- (4-maleimidophenoxy) phenyl] ethane, 1,2-bis [4-
(3-maleimidophenoxy) phenyl] ethane, 1,2-bis [4- (4-maleimidophenoxy) phenyl] ethane, 2,
2-bis [4- (3-maleimidophenoxy) phenyl] propane, 2,2-bis [4- (4-maleimidophenoxy) phenyl]
Propane, 2,2-bis [4- (3-maleimidophenoxy) phenyl] butane, 2,2-bis [4- (4-maleimidophenoxy)
Phenyl] butane, 2,2-bis [4- (3-maleimidophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane,
2,2-bis [4- (4-maleimidophenoxy) phenyl] -1,1,
1,3,3,3-hexafluoropropane, 4,4'-bis (3-maleimidophenoxy) biphenyl, 4,4'-bis (4-maleimidophenoxy) biphenyl, bis [4- (3-maleimidophenoxy) Phenyl] ketone, bis [4- (4-maleimidophenoxy) phenyl] ketone, bis [4- (3-maleimidophenoxy) phenyl] sulfide, bis [4- (4-maleimidophenoxy) phenyl] sulfide, bis [4- (3-maleimidophenoxy) phenyl] sulfoxide, bis [4-
(4-maleimidophenoxy) phenyl] sulfoxide,
Bis [4- (3-maleimidophenoxy) phenyl] sulfone, Bis [4- (4-maleimidophenoxy) phenyl] sulfone, Bis [4- (3-maleimidophenoxy) phenyl] ether, Bis [4- (4-maleimide) Phenoxy) phenyl]
Ether, 1,4-bis [4- (4-maleimidophenoxy) -α,
α-Dimethylbenzyl] benzene, 1,3-bis [4- (4-maleimidophenoxy) -α, α-dimethylbenzyl] benzene, 1,4-bis [4- (3-maleimidophenoxy) -α, α- Dimethylbenzyl] benzene, 1,3-bis [4- (3-maleimidophenoxy) -α, α-dimethylbenzyl] benzene, 1,
4-bis [4- (4-maleimidophenoxy) -3,5-dimethyl-
α, α-Dimethylbenzyl] benzene, 1,3-bis [4- (4-
Maleimidophenoxy) -3,5-dimethyl-α, α-dimethylbenzyl] benzene, 1,4-bis [4- (3-maleimidophenoxy) -3,5-dimethyl-α, α-dimethylbenzyl] benzene, 1 , 3-Bis [4- (3-maleimidophenoxy) -3,5-dimethyl-α, α-dimethylbenzyl] benzene, general formula (3) [Chemical Formula 5];

[0011]

[Chemical 5] (In the formula, n is 0 to 10 as an average value), and a polymaleimide compound represented by the general formula (4) [Chemical Formula 6];

[0012]

[Chemical 6] (In the formula, m is an average value of 0 to 10) and the like. These polymaleimide compounds may be used alone or in combination of two or more.

The component (b) is 2- (4-hydroxyphenyl) -2- (4-maleimidophenyl) propane represented by the formula (2).

Examples of the phenol resin as the component (c) include phenols such as phenol, cresol, resorcinol, dihydroxybiphenyl and phenylphenol, naphthols such as 1-naphthol, 2-naphthol and dihydroxynaphthalene, and formaldehyde, acetaldehyde and benzaldehyde. Novolak resins, which are reaction products of aldehydes such as hydroxybenzaldehyde, gluoxal, and alkanedials, and aralkyl resins, which are reaction products of the above phenols or naphthols with aralkyl alcohol derivatives or aralkyl halide derivatives. One or a mixture of two or more of these phenolic resins is used.

As the epoxy resin which is the component (c),
All epoxy compounds having two or more epoxy groups in the molecule can be used. Examples of such epoxy compounds include phenols such as phenol, cresol, resorcinol, and naphthol, or halogenated phenols thereof, and aldehydes such as formaldehyde, acetaldehyde, benzaldehyde, tolualdehyde, glyoxal, and alkanedial. An epoxy resin obtained by reacting a reaction product obtained by the condensation reaction with epichlorohydrin. An epoxy resin obtained by reacting the above phenol with a reaction product of an aralkyl alcohol derivative or an aralkyl halide derivative.
Furthermore, the following epoxy resins derived from compounds having two or more active hydrogens in one molecule, for example, bisphenol A, bisphenol F, resorcin, bishydroxydiphenyl ether, bishydroxybiphenyl, bishydroxynaphthalene, trihydroxy. Polyphenols such as phenylmethane, ethylene glycol,
Polyhydric alcohols such as neopentyl glycol, glycerin, trimethylolpropane, pentaerythritol, diethylene glycol and polypropylene glycol;
Examples thereof include amines such as ethylenediamine, aniline, and bis (4-aminophenyl) methane; epoxy resins obtained by reacting epichlorohydrin with polyvalent carboxylic acids such as adipic acid, phthalic acid, and isophthalic acid. These epoxy resins may be used alone or as a mixture of two or more. Further, various halogenated epoxy resins such as brominated phenol novolac resin and brominated bisphenol A type epoxy resin can be used.

In the composition of the present invention, the component (a), a polymaleimide compound represented by the general formula (1), and the component (b) are used.
The compounding ratio of the component 2- (4-hydroxyphenyl) -2- (4-maleimidophenyl) propane is (a) component 1
1 to 50 parts by weight, preferably 2 to 100 parts by weight
To 40 parts by weight. The compounding amounts of the (c) phenol resin and the (d) component epoxy resin are (a) component 10
The total amount of the components (b) and (c) is 10 to 500 parts by weight, preferably 25 to 300 parts by weight, based on 0 parts by weight, and the component (c) is based on the phenol resin of the component (b). The epoxy resin is in an equivalent ratio of 0.1 to 10, preferably 0.5 to 2.0. The resin composition of the present invention includes polyhydric phenols such as trihydroxyphenylmethane, tetrahydroxyphenylmethane, and tetrakisphenol, amines represented by diaminodiphenylmethane, diaminodiphenylsulfone, dicyandiamide, phthalic anhydride, and pyromellitic anhydride. An acid anhydride such as an acid can also be used in combination.

As the component (e) used in producing the modified imide resin, any compound having at least one active hydrogen in the molecule can be used. Examples of compounds having at least one active hydrogen in the molecule include phenols such as phenol, bisphenol A, bisphenol F, cresol, resorcinol, naphthol and dihydroxynaphthol, aniline, aminophenol,
Phenylenediamine, ethylenediamine, amines such as bis (4-aminophenyl) methane, glycidol, glycerin diglycidyl ether, ethylene glycol monoglycidyl ether, resorcinol monoglycidyl ether, naphthresorcinol monoglycidyl ether, etc., one alcohol per molecule Compounds containing a polar or phenolic OH group and one or more epoxy groups,
Examples thereof include compounds having an OH group and an acetylene group such as propargyl alcohol.

As a method for producing the modified imide resin,
(A) component polymaleimide resin, (b) component,
Generally, all or part of the components (c), (d) and (e) are heated and mixed at 80 to 200 ° C. for 0.1 to 10 hours, and further heated in an organic solvent. You may mix. When heating and mixing in an organic solvent, it is generally 50 to 20 depending on the boiling point of the organic solvent used.
It is 0.1 to 20 hours at 0 degreeC. Although the content of the modified imide resin is not clear, it is mainly considered to be oligomerization of the polymaleimide resin. Upon modification, the polymaleimide resin (a) component (b), (c) and / or
Alternatively, it is difficult to produce a stable modified imide resin with only the component (d) or only the component (e).

The component (e) is preferably used in an amount of 5 to 100 parts by weight with respect to 100 parts by weight of the polymaleimide resin, but 10 to 30 is used particularly for the purpose of maintaining heat resistance.
It is preferable to use parts by weight. The amount of the phenolic resin as the component (c) and the epoxy resin as the component (d) is 10 to 500 parts by weight, preferably the total amount of the components (b) and (c) with respect to 100 parts by weight of the component (a). Is 25 to 300 parts by weight, and (c) with respect to the phenol resin of the component (b).
The epoxy resin as a component has an equivalent ratio of 0.1 to 10, preferably 0.5 to 2.0.

In the present invention, when curing the resin composition, it is desirable to include a curing accelerator,
As such a curing accelerator, 2-methylimidazole,
Imidazoles such as 2-methyl-4-ethylimidazole and 2-heptadecylimidazole; amines such as triethanolamine, triethylenediamine and N-methylmorpholine; organic phosphines such as tributylphosphine, triphenylphosphine and tritolylphosphine ;
Tetraphenylphosphonium tetraphenylborate,
And tetraphenylboron salts such as triethylammonium tetraphenylborate; 1,8-diaza-bicyclo (5,4,0) undecene-7 and its derivatives. These curing accelerators may be used alone or in combination of two or more, and if necessary, an organic peroxide or an azo compound may be used in combination. The content of these curing accelerators is 0.005 to 10 relative to 100 parts by weight of the resin.
Used in the range of parts by weight.

In addition to the above-mentioned various components, the resin material of the present invention may be used for imide resins such as diallyl phthalate, triallyl isocyanurate, o, o'-diallyl bisphenol A, bisphenol A diallyl ether and bisphenol A dicyanate, if necessary. Commonly used reactive diluents; various silicone oils; flame retardants such as bromine compounds, antimony and phosphorus; fillers such as silica, talc, alumina and aluminum nitride, polyether sulfones, polyphenylene ethers, aromatic polyesters , Polysulfone, polyphenylene sulfide, polyether ether ketone, polyimide, polyether imide, polyamide imide, polyparabanic acid and other linear polymers, and other appropriate additives may be added.

To produce a prepreg using the resin composition of the present invention as described above, the resin resin composition (a) component, (b) component, (c) component, (d) component,
A resin varnish is prepared by dissolving a curing accelerator and other additives in a solvent. Alternatively, the component (a), the component (b), the component (c),
A modified imide resin comprising the component (d) and the component (e), a curing accelerator and other additives are dissolved in a solvent to form a resin varnish. The polymaleimide compound as the component (a) is added to the component (b).
Component, component (c), component (d) or component (b) and component (c) and component (d) or some or all of the other additives are dissolved in advance, or they are reacted. After forming the prepolymer, it may be dissolved in a solvent to form a resin varnish. Further, the polymaleimide compound (a) is added to a component (b), a component (c), a component (d) or a part or all of the component (b), the component (c) and the component (d), and an additive in a solvent. In addition to the above, a resin varnish obtained by reacting in a solvent may be used.

The concentration of the thermosetting resin composition in the varnish is 4
The range of 0 to 70% by weight is desirable. As the solvent used at this time, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, ethylene glycol monobutyl ether, N, N-dimethylformamide, N, N-dimethylacetamide, dioxane, acetone, N-methyl-2- Pyrrolidone, dimethyl sulfoxide, methyl ethyl ketone, methyl isobutyl ketone, cyclohexane, 2-heptanone and the like can be used.

As the base material, all known base materials such as glass cloth, carbon fiber, organic fiber cloth, glass non-woven cloth and paper can be used. After coating and impregnating the base material with the varnish, a prepreg is manufactured through a drying step, but the coating method, impregnation method, and drying method are not particularly limited. The drying conditions are appropriately determined depending on the boiling point of the solvent used, but not too high a temperature, and the amount of the residual solvent in the prepreg is preferably 1% by weight or less.

The laminated plate is manufactured by heating and pressing one or a plurality of the above-mentioned prepregs and integrating them. At this time, a metal foil or a metal plate is laminated on one or both outermost layers. be able to. 1 as the heating temperature
0 to 300 ° C., pressurizing pressure is 5 to 100 kg /
cm ² is desirable. Copper, aluminum, iron, stainless steel or the like can be used as the metal foil or metal plate. Alternatively, the inner layer core material may be used to form a laminated board for a multilayer printed wiring board.

[0026]

EXAMPLES The present invention will be specifically described below with reference to examples. The test method of the performance in the examples is as follows.・ Glass transition temperature: Dynamic viscoelastic method ・ Copper foil peel test: JIS C-6481 ・ Water absorption: JIS C-6481 ・ Bending strength: JIS C-6481 ・ Solder heat resistance: Test according to JIS C-6481 The piece was subjected to water absorption treatment at 120 ° C. and 100% RH for 3 hours, and then floated in a solder bath at 300 ° C. for 120 seconds to examine whether or not the laminate had any abnormality.

The raw materials used in Examples and Comparative Examples were as follows.・ Polymaleimide compound; bis (4-maleimidophenyl) methane (manufactured by Mitsui Toatsu Chemicals, Inc.) ・ Phenol resin (1); naphthol / phenol novolac resin (Kayahard NHN, manufactured by Nippon Kayaku Co., Ltd.) ・ phenolic resin (2); Phenol aralkyl resin (Mirex XL-225, manufactured by Mitsui Toatsu Chemicals, Inc.)-Phenol resin (3); Phenol novolac resin (P
N-80, manufactured by Nippon Kayaku Co., Ltd. ・ Epoxy resin; bisphenol A type epoxy resin (Epicoat 1001, manufactured by Yuka Shell Epoxy Co., Ltd.) ・ Glycidol; Epiol OH (manufactured by NOF Corporation) ・ 1, 6 Dihydroxynaphthalene (manufactured by Kanto Chemical Co., Inc.) ・ Curing accelerator; 2 ethyl 4 methyl imidazole (2E4MZ
, Shikoku Kasei Co., Ltd. ・ Polyamino bismaleimide resin; Kelimide 601A (Rhone Poulenc Company)

Synthesis Example 2- (4-hydroxyphenyl) -2- (4-maleimidophenyl) propane was synthesized as follows. In a reaction vessel equipped with a stirrer, thermometer and azeotropic distillation trap, maleic anhydride 60 g (0.61 mol), toluene 4
Insert 80 g and 2.6 g of 95% sulfuric acid, heat to reflux temperature under stirring, and add 160 g of N, N-dimethylacetamide to 2- (4-hydroxyphenyl) -2-
A solution in which 114 g (0.5 mol) of (4-hydroxyphenyl) -2- (4-aminophenyl) propane was dissolved was added dropwise with a dropping funnel in 4 to 5 hours, and the reaction was carried out at the same temperature for 5 hours. Water produced by the reaction is removed azeotropically. After completion of the reaction, the reaction solution was cooled to 80 to 90 ° C., the solvent was immediately distilled off under reduced pressure, 100 ml of isopropyl alcohol was inserted into the obtained organic layer, and water was added to 300 times.
ml was added, and the mixture was stirred for 0.5 to 1 hour to precipitate crystals, which were then filtered and dried to give 2- (4-hydroxyphenyl) -2- (4-maleimidophenyl) propane (1) as yellow crystals.
47 g (yield 96%) was obtained. The melting point of the obtained product was 168 to 171 ° C., and the purity analysis result by gel permeation chromatography (GPC) was 99%.

Production Example of Modified Imido Resin (1) 90 parts by weight of polymaleimide resin and 2- (4-hydroxyphenyl) -2 (4-maleimidophenyl) were placed in a reaction vessel equipped with a stirrer, a thermometer and a cooler. Propane 10
1 part by weight, 30 parts by weight of phenol resin (1), 50 parts by weight of epoxy resin, 20 parts by weight of glycidol are inserted.
Reaction was carried out at 30 ° C. for 30 minutes to obtain modified imide resin (1).

Production Example of Modified Imido Resin (2) In a reaction vessel equipped with a stirrer, a thermometer, and a cooler, 90 parts by weight of polymaleimide resin and 2- (4-hydroxyphenyl) -2 (4-maleimidophenyl) were added. Propane 10
Parts by weight, 30 parts by weight of phenol resin (2), 60 parts by weight of epoxy resin, 10 parts by weight of 1,6 dihydroxynaphthalene, 90 parts by weight of methyl ethyl ketone, 10 parts by weight of dimethylformamide, and let them react at 80 ° C. for 5 hours,
A modified imide resin (2) was obtained.

Examples 1 and 2 and Comparative Examples 1 to 4 The compositions (parts by weight) shown in Table 1 were dissolved in a flask to obtain a thermosetting resin varnish. The thermosetting resin varnish thus obtained was impregnated with 104 g / m ² of glass cloth and dried at 140 ° C. for 5 minutes to give about 190
A prepreg of g / m ² was obtained. 16 pieces of this prepreg were overlapped, 18 μm copper foil was further arranged on the upper and lower outermost layers, and the pressure was 40 kg / cm ² at 180 to 200 ° C.
Molding was carried out under heating conditions for 20 minutes to obtain a copper-clad laminate having a thickness of 1.6 mm. Table 1 shows the test results of the obtained laminates.
For comparison, a composition having the same composition as in the example but not using 2- (4-hydroxyphenyl) -2- (4-maleimidophenyl) propane, and a polyaminobismaleimide resin, were prepared using a prepreg and a laminated plate. It was manufactured and its resin properties were similarly evaluated. In the case of the polyamino bismaleimide resin of Comparative Example 3, 200 to 220 is used.
Molded under heating conditions of 120 ° C. and 120 minutes.

[0032] Compared to Examples 1 and 2 of the present invention, 2-(4
When -hydroxyphenyl) -2- (4-maleimidophenyl) propane is not used, Tg measured by viscoelasticity is divided into a low temperature (about 150 ° C) and a high temperature (about 300 ° C), resulting in poor solder heat resistance. In the case of polyamino bismaleimide resin, the water absorption is high and the solder heat resistance is poor. When no polymaleimide resin is contained, the Tg is low and the solder heat resistance is poor. As described above, the mechanical properties, the hygroscopicity, the adhesiveness, and the solder heat resistance were not at a level satisfying all of those of the present example.

[0033]

[Table 1]

[0034]

As described in Examples and Comparative Examples, the thermosetting resin composition according to the present invention has a high Tg, a low hygroscopicity, a good adhesiveness, and a solder heat resistance after moisture absorption. It is an excellent thermosetting resin composition and is effective as a resin material for laminated plates.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI C08L 71/10 C08L 71/10 // C08G 65/38 C08G 65/38 (56) Reference JP-A-3-724 (JP, JP, A) JP-A-57-74328 (JP, A) JP-A-57-74327 (JP, A) JP-A-8-259668 (JP, A) JP-A-8-225668 (JP, A) JP-A-6 -263844 (JP, A) JP-A-3-725 (JP, A) JP-A-6-263843 (JP, A) JP-A-3-723 (JP, A) JP-A-58-65718 (JP, A) ) JP-A-56-109219 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) C08G 59/00-59/72 B32B 27/38 C08J 5/24 C08L 63/00-63 / 10 C08L 71/10-71/12 C08G 65/38-65/44

Claims (5)

(57) [Claims] 1. A (a) general formula (1) [Chemical 1] polymaleimide compound embedded image represented by (In the formula, R ₁ is an m-valent organic group, Xa and Xb are hydrogen atoms,
The same or different monovalent atoms or groups selected from halogen atoms and organic groups, m is an integer of 2 or more), and (b)
Formula (2) [Chemical Formula 2] Represented by 2- (4-hydroxyphenyl) -2-
(4-maleimidophenyl) propane, (c) phenol resin, (d) epoxy resin having at least two epoxy groups in the molecule, and (e) small amount in the molecule.
At least with a compound having one active hydrogen
Thermosetting resin set containing the resulting modified imide resin
A product. 2. A curing accelerator, a flame retardant, fillers and / or additives by blending the claims 1 thermosetting resin composition. 3. A prepreg obtained by impregnating a base material with the resin material according to claim 1. 4. A thermosetting resin laminate comprising one or a plurality of the prepregs according to claim 3 laminated. 5. The thermosetting resin laminate according to claim 4, which is integrally formed with the outermost metal foil.