JP3441349B2 - Piezoelectric resonator with built-in capacitance - Google Patents

Description

Description: BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a surface-mounted piezoelectric resonator with a built-in capacitor. 2. Description of the Related Art Conventionally, microcomputers and the like have been frequently used for communication equipment and electronic equipment, and a clock oscillation circuit and the like have been connected to such microcomputers. In this oscillation circuit, as shown in an equivalent circuit diagram of FIG. 5, input and output capacitance components C ₁ and C ₂ are connected between both ends of a piezoelectric resonance element R and a ground potential. The feedback resistance component r and the inverter I were connected between both ends. In order to easily achieve this oscillation circuit, the above-mentioned two capacitance components C ₁ and C ₂ are constituted by one capacitor element as shown by a dotted line in the figure, and this capacitor element and piezoelectric element are shown by a dashed line in FIG. The resonance element R and one electronic component are a built-in capacitance type piezoelectric resonator. [0004] The built-in capacitance type piezoelectric resonator has mainly been constituted by a piezoelectric resonance element having vibration electrodes formed on at least both main surfaces of a piezoelectric substrate and a capacitor element having two capacitance components. The following three structures are known as conventional exterior structures for protecting the piezoelectric resonance element and the capacitor element. A first structure is a piezoelectric resonance element in which vibration electrodes formed on both main surfaces are formed at the tips of two lead terminals, a split electrode is formed on one main surface, and the split electrode is opposed to the split electrode on the other main surface. A capacitor element having a ground electrode formed thereon is connected to each other, a third lead terminal connected to the ground electrode is further connected, and the outer peripheral resin is covered with an outer resin so as to form a vibration space. . The second structure is a structure in which a piezoelectric resonance element and a capacitor element are accommodated in an upper and lower two-part case.
Specifically, as disclosed in Japanese Patent Application Laid-Open No. 2-44706, a capacitor element is housed in one housing-like case, a piezoelectric resonance element is housed in the other housing-like case, and both cases are made of conductive paste. Were joined to each other. Further, as disclosed in Japanese Utility Model Application Laid-Open No. 62-70453, one case is formed as a flat dielectric substrate, and two capacitor components are formed on the dielectric substrate.
A piezoelectric resonance element was bonded to this dielectric substrate, and then the other housing-like case was bonded to one flat dielectric substrate so as to cover the piezoelectric resonance element. The third structure is such that both ends are open and two
A piezoelectric resonance element is arranged in a cylindrical dielectric case having a capacitance electrode forming two capacitance components, and both ends are sealed with a conductive cap body. In the first structure, it is difficult to surface mount on a printed wiring board. Further, in the second structure, the number of parts constituting the case increases, and a housing-like cover on the side for covering the piezoelectric resonance element to form a vibration space around the piezoelectric resonance element. It was necessary to make the shape of the case relatively large, and it was difficult to achieve a miniaturized piezoelectric resonator with a built-in capacitor. Further, in Japanese Patent Application Laid-Open No. 2-44706, it is necessary that a lead terminal led out to an external circuit has a conductive cap attached to both ends of the joined case or wound around the outer periphery of the case. It was very difficult to handle the terminals. In Japanese Utility Model Application Laid-Open No. 62-70453, 2
The external electrodes of the composite element in which the piezoelectric resonance element is connected to the dielectric substrate having two capacitor components must be led out from the joint surface between the dielectric substrate and the housing case.
This joining portion is a peripheral surface of the opening of the housing-like case having a relatively small joining area, and furthermore, the external electrodes must be led out, so that the joining reliability is reduced. In the third structure, when inserting the piezoelectric resonance element into the cylindrical case, the space on both main surfaces of the piezoelectric resonance element can be easily secured.
As in No. 06, it was necessary to cover the conductive caps at both ends of the cylindrical case, and it was very difficult to treat the lead terminals. Therefore, the applicant of the present application has previously described a laminate in which a capacitor element formed of a strip-shaped dielectric substrate having two capacitance components and a strip-shaped piezoelectric resonance element are overlapped via a conductive adhesive. A built-in capacitor type piezoelectric resonator having a structure arranged in a housing-like case having at least one side open is proposed. More specifically, as shown in the vertical cross-sectional view of FIG. 6, a housing-like case 1 having one open side and a laminated body 4 in which a strip-shaped piezoelectric resonance element 2 and a capacitor element 3 are joined. Sealing member 5 for sealing the opening 11 of the housing case 1
It is composed of In addition, lead terminals 16 to 18 are integrally fixed to the bottom surface 12 of the housing-like case 1 and three through holes 13 to 15 for connecting lead terminals are formed. The strip-shaped piezoelectric resonance element 2 has vibration electrodes 22 and 23 formed on both main surfaces of a piezoelectric substrate 21.
The capacitor element 3 has a total of five electrodes formed on both main surfaces of the dielectric substrate 31. For example, capacitance electrodes 32 and 33 are formed at both ends of the upper main surface. Further, connection electrodes 34 and 36 are formed at both ends of the lower surface side main surface, and between the capacitance electrodes 32 and
A central capacitance electrode 35 facing a part of 33 is formed. The laminated body 4 is provided inside the housing case 1.
The stacked body 4 is housed and arranged with the capacitor element 3 of FIG. Thus, the connection through holes 13 to 15 on the bottom surface of the housing-like case 1 are formed by the connection electrode 34, the central capacitance electrode 35, and the connection electrode 3 formed on the lower main surface of the capacitor element 3, respectively.
6, the conductive filling members 62, 63, 64 are filled in the connection through holes 13 to 15, and the lead terminals 16 are filled.
18 and connection electrode 34, central capacitance electrode 35, connection electrode 3
6 is connected. Here, the structure of the laminated body 4 is such that two capacitor electrodes 32 are provided at both ends of the upper main surface of the capacitor element 4.
33 are formed. Further, two connection electrodes 34 and 36 and one central capacitance electrode 35 are formed at both ends of the lower main surface of the capacitor element. On the main surface on the upper surface side of the piezoelectric resonance element 2, a vibrating electrode 22 on the upper surface side extending from the vicinity of the center to one end is provided.
In addition, an independent upper surface side auxiliary electrode 24 is formed at the other end. In addition, on the lower surface side main surface of the piezoelectric resonance element 2, a lower surface side vibrating electrode 23 extending from the vicinity of the center to the other end, and an independent lower surface side auxiliary electrode 25 formed at one end. ing. Then, the two elements are overlapped by the conductive bonding members 41 and 42 interposed at the ends of the bonding surfaces of the two elements to form a laminate 4. Further, conductive attachment members 43 and 44 formed by a thin-film technique or a thick-film technique are formed on the end faces of the laminate 4 respectively. The conductive members 43, 44
The capacitive electrodes 32, 33 on the upper surface of the capacitor element 3 and the connection electrodes 34, 36 formed on the lower surface are electrically connected, and in particular, one end of the piezoelectric resonance element 2 is connected to the conductive attaching member 44. Vibrating electrode 22 on the upper surface side
And one of the capacitor electrodes 33 of the capacitor element 3 (the connection electrode 3
6) are electrically connected. Note that the vibration electrode 23 on the lower surface side of the piezoelectric resonance element 2 is directly connected to the other capacitance electrode 32 on the upper surface side of the capacitor element 3 by the above-described conductive bonding member 41. Further, a gap corresponding to the thickness of the conductive bonding members 41 and 42 is formed between the piezoelectric resonance element 2 and the capacitor element 3 by the conductive bonding members 41 and 42. This gap becomes a vibration space on the lower surface side of the piezoelectric resonance element 2. The laminated body 4 composed of the piezoelectric resonance element 2 and the capacitor element 3 having the above-described structure is simply housed in the housing-like case 1, and the upper surface of the piezoelectric resonance element 2 is It is difficult to stably form a vibration space on the upper surface side of the piezoelectric resonance element 2 between the vibration electrode 22 on the side and the inner upper surface of the housing case 1. Further, there is a problem that the electrical connection between the vibration electrode 22 on the upper surface side of the piezoelectric resonance element 2 and one of the capacitance electrodes 33 of the capacitor element 3 cannot be performed stably. This is because although the electrical connection is achieved by the conductive attaching member 44, in practice, the conductive attaching member 44
This is because the connection is substantially performed by the thickness portion of the vibrating electrode 22 led out to one end on the upper surface side of the piezoelectric resonance element 2. The present invention has been devised in view of the above-described problems, and has as its object the purpose of reliably connecting the vibration electrode on the upper surface side of the piezoelectric resonance element to the capacitance electrode of the capacitor element. An object of the present invention is to provide a piezoelectric resonator with a built-in capacitor that can reliably form a vibration space on the upper surface side of a piezoelectric resonance element. According to the present invention, a lead terminal is attached to a lower surface, and a bottom surface is provided with a through hole filled with a conductive connecting member which is electrically connected to the lead terminal. And electrodes provided on the upper and lower surfaces of a strip-shaped dielectric substrate in a housing-like case having at least one open side surface.
On a capacitor element having two capacitance components, a piezoelectric resonance element in which vibration electrodes which are opposed to each other on the upper and lower surfaces of a strip-shaped piezoelectric substrate and are provided at different short side ends is provided via a conductive bonding member. Along with joining, a conductive adherend member is adhered to the short side end surface, and each electrode of the capacitor element and each electrode of the piezoelectric resonance element are connected by the conductive joint member and the conductive adherend member. In the piezoelectric resonator with a built-in capacitance, the stacked body is housed and arranged, the opening of the housing-shaped case is sealed, and the electrode on the lower surface of the capacitor element and the lead terminal are connected via the conductive connection member. A built-in capacitive piezoelectric resonator characterized in that a thick conductive film that is electrically connected to the conductive attaching member is applied to both ends on the upper surface side of the piezoelectric resonance element. According to the present invention, a thick conductive film is superposed and attached to one end of the upper surface of the piezoelectric resonance element from which the vibration electrode is led out. The thickness of the end lead-out portion can be increased. Since the thickness of the conductor is substantially increased at the end face of the vibrating electrode, the connection between the upper vibrating electrode of the piezoelectric resonance element and the capacitive electrode of the capacitor element by the conductive attachment member formed on the end face of the laminate. Can be reliably performed. Further, when the laminated body is housed in the housing-like case, a vibration gap corresponding to the thickness of the thick conductor film is formed at least between the piezoelectric resonance element and the inner upper surface of the housing-like case. become. Therefore, the vibration space on the lower surface side of the piezoelectric resonance element is formed by the conductive bonding member, and the vibration space on the upper surface side of the piezoelectric resonance element is formed by the thick conductive film. Thus, a stable operation of the piezoelectric resonance element can be secured. The thick conductor film is formed not only at one end on the upper surface side of the piezoelectric resonance element but also at the other end of the piezoelectric resonance element and both ends on the lower surface side of the capacitor element. Not only the connection between the piezoelectric resonance element and the capacitor element by the conductive attachment member attached to the end face, but also the electrical connection between the upper electrode of the capacitor element and the connection electrode can be reliably performed. The preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is an external perspective view of a built-in capacitor type piezoelectric resonator of the present invention, FIG. 2 is a longitudinal sectional view thereof, and FIG. 3 is a perspective view of a laminated body. The built-in capacity type piezoelectric resonator has a housing-like case 1,
It mainly includes a laminate 4 in which a piezoelectric resonance element 2 and a capacitor element 3 are laminated, and a sealing member 5. The housing-like case 1 is made of a resin such as a liquid crystal polymer, and has, for example, an opening 11 on one short side surface. In the bottom surface 12 of the case, a connection through-hole 13,
14 and 15 are formed. Further, three lead terminals 16, 17, 18 are fixed to the side surface on the long side of the case, and some of the lead terminals 16, 17, 18 are partially connected to through holes 13, 14, 15 on the bottom surface. It is fixed to the inner wall of. The piezoelectric resonance element 2 includes a rectangular piezoelectric substrate 21.
And a vibration electrode 22 formed on the upper main surface and a vibration electrode 23 formed on the lower main surface. The piezoelectric substrate 21 is made of a piezoelectric ceramic material such as lead titanate (PT) or lead zirconate titanate (PZT), or a single crystal material such as quartz, lithium tantalate, lithium niobate, or lithium tetratrate. The vibrating electrodes 22 and 23 are formed so as to face each other near the center of both main surfaces of the piezoelectric substrate 21. The vibration electrode 22 extends from near the center of the upper surface of the piezoelectric substrate 21 to one end. An auxiliary electrode 24 is formed on the other end of the upper surface of the piezoelectric substrate 21. The vibrating electrode 23 extends from near the center of the lower surface of the piezoelectric substrate 21 to the other end. Piezoelectric substrate 2
Auxiliary electrode 25 is formed on one end of the lower surface of 1. The vibrating electrodes 22 and 23 and the auxiliary electrodes 24 and 25
Is formed of, for example, a thin-film conductor film mainly composed of an Ag-based material. On the upper principal surface of the piezoelectric resonance element 2, thick conductor films 51 and 52 are formed in the width direction at both ends. The thick conductive film 51 is attached near the end of the vibrating electrode 22, and the thick conductive film 52 is attached on the upper surface of the auxiliary electrode 24. The thick conductor films 51 and 52 are formed by printing a conductive resin paste containing silver as a main component and drying the paste. The capacitor element 3 is made of lead titanate (P
T), a strip-shaped dielectric substrate 31 made of a dielectric ceramic material such as lead zirconate titanate (PZT) or barium titanate (BT) and having the same planar shape as the piezoelectric substrate 21 described above; It comprises capacitance electrodes 32 and 33 formed on the upper main surface of the substrate 31, connection electrodes 34 and 36 formed on the lower main surface of the dielectric substrate 31, and a central capacitance electrode 35. The capacitance electrodes 32 and 33 are part of the central capacitance electrode 35 via the dielectric substrate 31 and are respectively led to different ends. For example, the capacitance electrode 32 is
Are drawn out from the vicinity of the center to the other end (the left end in the figure), and the capacitor electrode 33 is drawn out from the vicinity of the center to the one end (the right end in the figure). This allows
Between the capacitance electrode 32 and the central capacitance electrode 35;
Capacitance components are formed between 3 and the central capacitance electrode 35, respectively. The connection electrode 34, the central capacitance electrode 35, and the connection electrode 36 on the bottom main surface of the dielectric substrate 31 are connected to the connection through holes 13, 1, 1
They are formed at positions corresponding to 4 and 15. Further, an end portion of the dielectric substrate 31 on the lower surface of the capacitor element 3, that is, on the connection electrodes 34 and 36,
Thick conductor films 53 and 54 are formed. The piezoelectric resonance element 2 and the capacitor element 3 are joined via conductive joining members 41 and 42, and constitute a multilayer body 4 as a whole. The conductive bonding member 41 is provided on the vibration electrode 23 on the lower main surface of the piezoelectric resonance element 2.
And the capacitance electrode 32 of the capacitor element 3. The conductive bonding member 42 is disposed between the auxiliary electrode 25 on the lower main surface of the piezoelectric resonance element 2 and the capacitance electrode 33 of the capacitor element 3. Further, a pair of end faces of the laminated body 4, that is, a pair of short side end faces of the piezoelectric resonance element 2 and the capacitor element 3
Are provided on the pair of short side end surfaces.
Is attached. These conductive adhered members 43 and 44
A thick film technique, that is, coating and curing of a conductive resin paste, and a thin film technique, that is, a metal material such as silver or copper are applied by vapor deposition or sputtering. The upper surface side vibrating electrode 22 of the piezoelectric resonance element 2, the capacitance electrode 33 (the conductive bonding member 42) of the capacitor element 3, and the connection electrode are formed by the conductive member 44 formed on one end face of the laminate 4. 36 is electrically connected. Further, the conductive adhered member 4 formed on the other end face of the laminate 4
3, the lower vibrating electrode 23 of the piezoelectric resonance element 1 and the capacitance electrode 32 of the capacitor element 3 (the conductive bonding member 4
1) The connection electrode 34 is electrically connected. The laminated body 4 in which the piezoelectric resonance element 2 and the capacitor element 3 are integrally joined as described above is housed and arranged inside the housing case 11 through the opening 11 of the housing case 1. . Thus, from the connection through holes 13, 14, 15 formed in the bottom surface 12 of the housing-like case 1, the connection electrode 34, the central capacitance electrode 35, and the connection electrode 36 formed on the lower main surface of the capacitor element are respectively provided. It will be exposed. The connection through holes 13, 14, 1
By arranging the conductive connecting members 61, 62, 62 in 5, the connecting electrode 34 formed on the bottom surface of the capacitor element 3 is connected to the lead terminal 16, the center capacitor electrode 35 is connected to the lead terminal 17, and the connecting electrode 36 is connected to Each of the laminates 4 is connected to the lead terminal 18, and the laminate 4 is fixed inside the casing 1. Thereafter, the sealing member 5 such as an insulating resin is applied and supplied to the opening 11 of the housing-like case 1 and cured. Thereby, the inside of the housing case 11 is hermetically sealed, and the laminate is fixed to the housing case 1. In the above-described structure, the thick-film conductor film 51 is formed at least at the end of the vibration electrode 22 on the main surface on the upper surface side of the piezoelectric resonance element 2 over the entire width of the piezoelectric substrate 21. Accordingly, the thickness of the vibrating electrode 22 is substantially increased, so that when the conductive electrode 44 is electrically connected to the conductive attaching member 44 attached to the one end surface of the multilayer body 4, the end of the piezoelectric substrate 31 There is no step breakage at the ridge portion, and a reliable electrical connection can be achieved. Preferably, thick conductor films 51 and 52 are formed at both ends on the upper surface side of the piezoelectric resonance element 2. Thereby, at least the thick conductive film 5 is provided between the inner upper surface of the housing-like case 1 and the vibration electrode 22 on the upper surface of the piezoelectric resonance element 2.
Vibration spaces corresponding to the thicknesses 1 and 52 are formed. Further, the laminate 4 is disposed in the housing-like case 1, and the connection through-holes 13,
The conductors are filled in 14 and 15. That is, the laminate 4 is fixed in the housing case 1 with the upper surface of the laminate 4 being in contact with the upper surface of the case 1 via the thick conductive films 51 and 52. Therefore, when the laminated body 4 is observed from the opening 11 of the housing-like case 1, the upper surface of the housing-like case 1 and the thick film conductor film 51 come into contact with each other. The sealing member 5 does not flow into the vibration space on the upper surface side of the piezoelectric resonance element 2, and the stable operation of the piezoelectric resonance element 2 can be maintained. Further, it is desirable to form thick conductor films 53 and 54 also at both ends on the lower surface side of the capacitor element 3. As a result, the thickness at the ends of the connection electrodes 34 and 36 is substantially increased, and the conductive attachment members 43 and 44
This is because electrical connection between the capacitance electrodes 32 and 33 (conductive bonding members 41 and 42) on the upper main surface of the dielectric substrate 31 and the connection electrodes 34 and 36 is ensured. The thickness of such thick conductor films 51 to 54 is, for example, 10 to 50 μm, and has a length of about 0.3 to 0.5 mm from the end to the center.
And the entire width of the lower surface of the dielectric substrate 31. Next, a specific method for manufacturing a laminate will be described with reference to the side view of the laminate 4 shown in FIG. First, a large-sized piezoelectric substrate 20 from which a plurality of strip-shaped piezoelectric substrates 21 can be extracted is prepared, and a vibrating electrode 22 and an auxiliary electrode 24 are formed on the main surface on the upper surface side of each region. The vibration electrode 23 and the auxiliary electrode 25 are respectively formed on the main surface. Next, a large-sized dielectric substrate 30 from which a plurality of strip-shaped dielectric substrates 31 can be extracted is prepared. Capacitance electrodes 32 and 33 are formed on the upper main surface of each region, and the lower surface of each region is formed. The connection electrodes 34 and 36 and the central capacitance electrode 35 are formed on the side main surface. In this state, the vibrating electrode 22 is formed integrally with the auxiliary electrode 24 in a region adjacent to and beyond the boundary of the element region. Similarly, the vibration electrode 23
It is formed integrally with the auxiliary electrode 25 in the adjacent region, is formed integrally with the capacitor electrode 33 in the element region adjacent to the capacitor electrode 32, and is formed integrally with the capacitor electrode 32 in the element region adjacent to the capacitor electrode 33. And formed integrally with the capacitor electrode 36 in the element region adjacent to the connection electrode 34.
Are formed integrally with the capacitor electrode 34 in the element region adjacent to the element region. Next, the large piezoelectric substrate 20 and the large dielectric substrate 30 are joined. For this bonding, for example, a conductive resin adhesive made of silver powder and epoxy resin is used. That is, the conductive bonding members 41 and 42 are attached to the ends of the upper surface main surface of the capacitor element 3 on the capacitance electrodes 32 and 33, respectively.
About 10 to 5 using a conductive resin adhesive.
Screen printing is performed to a thickness of 0 μm, and then the large piezoelectric substrate 20 is positioned and mounted on the large dielectric substrate 30, and the adhesive layer is cured at 180 ° C. for 30 minutes. As described above, the conductor films to be the thick conductor films 51 to 54 are formed by printing and curing using the conductive resin member on the laminate in which the two large substrates 20 and 30 are joined. For example, on the upper surface side main surface (the upper surface of the large piezoelectric substrate 20) of the laminated body, the thick film conductor film 51 straddling a cutting line dividing the element region near the end of the vibrating electrode 22 (in the adjacent element region, Thick film conductor film 52), and at the same time, the thick film conductor 52 straddling a cutting line defining an element region near the other end.
(Thick conductor film 51 in the adjacent element region) is printed.
Similarly, the lower surface side main surface of the laminate (large dielectric substrate 30)
A thick film conductor 53 (thick film conductor film 54 in an adjacent element region) is printed on the lower surface of the connection electrode 34 in the vicinity of an end of the connection electrode 34 so as to straddle a cutting line dividing the element region, and at the same time, the other end Thick film conductor 54 straddling a cutting line defining an element region near the portion
(Thick conductor film 53 in the adjacent element region) is printed.
Thereafter, the applied film is cured by heating (this state is shown in FIG. 4). Next, this laminate is cut at the dotted line portion shown in FIG. Next, the conductive adhered members 43 and 44 are applied to the end faces of the cut laminate by using a thick film technique or a thin film technique.
Is formed. Lastly, each element region is cut along the long side to form a laminate 4 in which the piezoelectric resonance element 2 and the capacitor element 3 are joined. In the above embodiment, the housing case 1
Although one side has an opening 11, for example, a roughly cylindrical case 1 in which a pair of opposing side surfaces are each opened.
May be used. According to the present invention, a thick conductor film is superimposed on the leading end of the vibrating electrode formed on the upper main surface of the piezoelectric resonance element constituting the laminate. For this reason, when the conductive adherend is adhered to the end face of the laminate, the thickness of the end face portion is increased and the vibration electrode on the upper surface side main surface of the piezoelectric resonance element and the capacitance electrode of the capacitor element, and the stable connection of the connection electrode. Connection is achieved. Further, since the vibration space between the inner upper surface of the case and the piezoelectric resonance element can be ensured by the thick conductor film, the operation can be stably performed. Further, when the laminated body is placed in the housing-shaped case, the thick-film conductor film comes into contact with the upper surface of the inside of the case, so that the sealing member for sealing the opening does not go around the upper surface of the piezoelectric substrate. Therefore, very stable hermetic sealing can be maintained.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an external perspective view of a built-in capacitor type piezoelectric resonator of the present invention. FIG. 2 is a longitudinal sectional view of a built-in capacitance type piezoelectric resonator of the present invention. FIG. 3 is a perspective view of a laminate of the present invention. FIG. 4 is a side view in one step for describing a method for manufacturing a laminate of the present invention. FIG. 5 shows an equivalent circuit diagram of a built-in capacitance type piezoelectric resonator. FIG. 6 is a cross-sectional view of a conventional built-in capacitance type piezoelectric resonator. [Description of Signs] 1 ··· Housing case 11 ··· Opening 12 ··· Bottom 13, 14, 15 ··· Connection through-hole 2 ······ Piezoelectric resonance element 21 ··· ······ Piezoelectric substrates 22 and 23 ·················································· Dielectric substrate 32, 33 ········ Capacitance electrodes 34, 36 ······· Connection electrodes 35 Central capacitance electrode 4 Laminated bodies 41, 42 Conductive bonding members 43, 44 Conductive adhered members 51 to 54 Thick conductor film

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-373303 (JP, A) JP-A-8-107328 (JP, A) JP-A-5-83074 (JP, A) JP-A-60-1985 JP-A-60-256201 (JP, A) JP-A-2-44706 (JP, A) JP-A-10-303686 (JP, A) JP-A-10-335969 (JP, A) Japanese Utility Model Application No. 4-103722 (JP, U) Japanese Utility Model Application No. 4-94720 (JP, U) Japanese Utility Model Application No. Sho 62-70453 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H03H 9/00-9/24

Claims (1)

(57) [Claim 1] A lead terminal is attached to a lower surface, and a bottom surface has a through hole filled with a conductive connection member which is electrically connected to the lead terminal, and at least Opposite to the upper and lower sides of the strip-shaped piezoelectric substrate, on the capacitor element having two capacitance components provided with electrodes on the upper and lower sides of the strip-shaped dielectric substrate, in a housing-like case with one side open A piezoelectric resonance element provided with a vibrating electrode led out to a different short side end portion is joined via a conductive joining member, and a conductive attachment member is attached to the short side end surface. The laminated body formed by connecting each electrode of the capacitor element and each electrode of the piezoelectric resonance element with the conductive bonding member and the conductive attaching member is housed and arranged, and the opening of the housing case is sealed, Under the capacitor element via the connecting member In the electrode and the lead terminal formed by connecting a capacitor built-in piezoelectric resonator, both ends of the upper surface of the piezoelectric resonator element, the conductive deposition
A built-in capacitor type piezoelectric resonator characterized in that a thick conductive film that is conductive with a mounting member is applied .