JP3436998B2 - Sintered laminate - Google Patents
Sintered laminateInfo
- Publication number
- JP3436998B2 JP3436998B2 JP32506094A JP32506094A JP3436998B2 JP 3436998 B2 JP3436998 B2 JP 3436998B2 JP 32506094 A JP32506094 A JP 32506094A JP 32506094 A JP32506094 A JP 32506094A JP 3436998 B2 JP3436998 B2 JP 3436998B2
- Authority
- JP
- Japan
- Prior art keywords
- ethylene
- copolymer
- sintered compact
- vinyl acetate
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920001577 copolymer Polymers 0.000 claims description 35
- 229920000098 polyolefin Polymers 0.000 claims description 30
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 24
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 24
- 229920000092 linear low density polyethylene Polymers 0.000 claims description 14
- 239000004707 linear low-density polyethylene Substances 0.000 claims description 12
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 10
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 6
- 239000005977 Ethylene Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 43
- 239000000843 powder Substances 0.000 description 18
- 238000010438 heat treatment Methods 0.000 description 16
- 229920000298 Cellophane Polymers 0.000 description 11
- 239000002184 metal Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 229920001038 ethylene copolymer Polymers 0.000 description 6
- 229920001903 high density polyethylene Polymers 0.000 description 6
- 239000004700 high-density polyethylene Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 229920001684 low density polyethylene Polymers 0.000 description 4
- 239000004702 low-density polyethylene Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003242 anti bacterial agent Substances 0.000 description 3
- 229940121375 antifungal agent Drugs 0.000 description 3
- 239000003429 antifungal agent Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 239000012760 heat stabilizer Substances 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 239000004611 light stabiliser Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- WXCZUWHSJWOTRV-UHFFFAOYSA-N but-1-ene;ethene Chemical compound C=C.CCC=C WXCZUWHSJWOTRV-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000012748 slip agent Substances 0.000 description 2
- PZWQOGNTADJZGH-SNAWJCMRSA-N (2e)-2-methylpenta-2,4-dienoic acid Chemical compound OC(=O)C(/C)=C/C=C PZWQOGNTADJZGH-SNAWJCMRSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 229920001213 Polysorbate 20 Polymers 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 description 1
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006277 sulfonation reaction Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 235000013311 vegetables Nutrition 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はポリオレフィン多孔質焼
結成形体の積層体に関する。FIELD OF THE INVENTION The present invention relates to a laminate of polyolefin porous sintered compacts.
【０００２】[0002]
【従来の技術】ポリオレフィン多孔質焼結成形体は、そ
の連続気孔を利用して誘導芯、各種フィルター、濾過板
などに使用されている。また、特に親水化されたポリオ
レフィン多孔質焼結成形体はその親水性を利用して冷蔵
庫の野菜室やチルド室などの結露水吸収材及び庫内加湿
体、エアコンの加湿エレメントなどに使用されている。
親水性ポリオレフィン多孔質焼結成形体を例えば冷蔵庫
内の結露水吸収材及び庫内加湿体として用いる場合、食
品から出た水蒸気を出来るだけ冷蔵庫内にとどめる為に
部分的にポリエステルフィルムなどを貼って通気量を制
御している。2. Description of the Related Art Polyolefin porous sintered compacts are used for induction cores, various filters, filter plates, etc. by utilizing their continuous pores. Further, the hydrophilic porous polyolefin sintered compact is particularly used for the dew condensation water absorbing material such as the vegetable compartment and the chilled compartment of the refrigerator and the humidifier in the refrigerator, the humidifying element of the air conditioner, etc. by utilizing its hydrophilicity. .
When using a hydrophilic polyolefin porous sintered compact as, for example, a dew condensation water absorber in a refrigerator and a humidifier in a refrigerator, a polyester film or the like is partially aerated in order to keep water vapor generated from foods in the refrigerator as much as possible. Controlling the amount.
【０００３】また、親水性ポリオレフィン多孔質焼結成
形体を例えばコースターとして使用する場合には吸収し
た結露水は連続気孔を通って机上まで達し、机上を汚す
ことになる。この時、片面にフィルムが貼ってあれば吸
収された結露水は机上に達することなく焼結成形体に止
まっており、机上を汚す事もない。上記親水性ポリオレ
フィン多孔質焼結成形体にフィルムを貼る場合は従来は
粘着剤を塗布したポリエステルフィルムを貼っていた。
したがって、貼る作業が繁雑であり、貼る際に焼結成形
体にストレスがかかり変形を引き起こす等の問題があっ
た。Further, when the hydrophilic polyolefin porous sintered compact is used as, for example, a coaster, the absorbed dew condensation water reaches the desk through continuous pores and stains the desk. At this time, if the film is stuck on one surface, the condensed water absorbed will stay on the sintered compact without reaching the desk, and the desk will not be contaminated. When a film is attached to the above-mentioned hydrophilic polyolefin porous sintered compact, a polyester film coated with an adhesive is conventionally attached.
Therefore, the sticking work is complicated, and there is a problem that stress is applied to the sintered compact during sticking to cause deformation.
【０００４】[0004]
【発明が解決しようとする問題点】本発明は、上記のよ
うな問題点に鑑みて検討されたものであり、その目的と
するところは、簡単に積層でき、焼結成形体に余計なス
トレスを掛けずに、変形等の少ない積層体を提供するこ
とにある。DISCLOSURE OF THE INVENTION The present invention has been studied in view of the above-mentioned problems, and the purpose thereof is to easily laminate and to apply extra stress to the sintered compact. The object is to provide a laminated body with less deformation without being hung.
【０００５】[0005]
【課題を解決する為の手段】すなわち、本発明はポリオ
レフィン焼結成形体において、少なくとも片面にエチレ
ン系共重合体層を介して直鎖状低密度ポリエチレン層が
熱により融着されてなる事を特徴とする焼結積層体を提
供する。本発明においてポリオレフィン焼結成形体と
は、ポリエチレン、ポリプロピレン、エチレン−プロピ
レン共重合体、エチレン−ブテン−１共重合体、エチレ
ン−ヘキセン−１共重合体、エチレン−ペンテン−１共
重合体、エチレン−オクテン−１共重合体、エチレン−
４−メチルペンテン−１共重合体、エチレン−酢酸ビニ
ル共重合体、エチレン−（メタ）アクリル酸共重合体、
エチレン−（メタ）アクリル酸エステル共重合体などの
ポリオレフィン粉末を、焼結成形したものが用いられ
る。これらの粉末は単独で使用しても良いし、２種以上
の混合物で使用しても良い。中でも低密度ポリエチレ
ン、高密度ポリエチレン、直鎖状低密度ポリエチレン等
のポリエチレンが好適に用いられる。Means for Solving the Problems That is, the present invention is characterized in that, in a polyolefin sintered compact, a linear low-density polyethylene layer is heat-fused on at least one side through an ethylene copolymer layer. The present invention provides a sintered laminate. In the present invention, the polyolefin sintered compact is polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-butene-1 copolymer, ethylene-hexene-1 copolymer, ethylene-pentene-1 copolymer, ethylene- Octene-1 copolymer, ethylene-
4-methylpentene-1 copolymer, ethylene-vinyl acetate copolymer, ethylene- (meth) acrylic acid copolymer,
A polyolefin powder such as an ethylene- (meth) acrylic acid ester copolymer obtained by sintering is used. These powders may be used alone or as a mixture of two or more kinds. Among them, polyethylene such as low density polyethylene, high density polyethylene and linear low density polyethylene is preferably used.
【０００６】ポリオレフィン焼結成形体は、任意の形状
の金型に上記ポリオレフィン粉末を充填して、金型ごと
加熱し冷却する事で得られる。或いは予めポリオレフィ
ン粉末を圧縮等の手段により任意の形に賦形したものを
加熱し焼結体を得る事も可能である。更には、金属製な
どの無端ベルトに上記ポリオレフィン粉末を散布し加熱
・冷却する方法でも良い。The polyolefin sintered compact can be obtained by filling a mold of any shape with the above-mentioned polyolefin powder, and heating and cooling the mold together. Alternatively, it is also possible to obtain a sintered body by heating a polyolefin powder which has been previously shaped into an arbitrary shape by means such as compression. Further, a method of spraying the above-mentioned polyolefin powder on an endless belt made of metal or the like and heating and cooling may be used.
【０００７】また、該ポリオレフィン焼結成形体の気孔
率は任意の値をとることが可能であるが、気孔率が極端
に低くなると結露水吸収材などとして使用する際に吸水
能力が低くなるので好ましくない。また、気孔率が大き
すぎると実用的な強度が得られなくなり好ましくない。
好ましい気孔率の範囲は２０〜６０％の範囲である。
尚、気孔率は次式により算出する。
気孔率（％）＝［（ρ0 −ρ1 ）／ρ0 ］×１００
但し、上式において
ρ0 ＝該焼結成形体を構成するポリオレフィンの真の密
度（g/cm3 ）
ρ1 ＝該焼結成形体の見掛け密度（g/cm3 ）
見掛け密度 ρ1 （g/cm3 ）＝Ｗ／Ｖ
Ｗ ＝該焼結成形体の重量（ｇ）
Ｖ ＝該焼結成形体の体積（cm3 ）である。The porosity of the polyolefin sintered compact can take any value, but if the porosity is extremely low, the water absorption capacity will be low when it is used as a dew condensation water absorbent, etc. Absent. If the porosity is too large, practical strength cannot be obtained, which is not preferable.
The preferred porosity range is 20-60%.
The porosity is calculated by the following formula. Porosity (%) = [(ρ 0 −ρ 1 ) / ρ 0 ] × 100 However, in the above equation, ρ 0 = the true density (g / cm 3 ) of the polyolefin constituting the sintered compact ρ 1 = the Apparent density of sintered compact (g / cm 3 ) Apparent density ρ 1 (g / cm 3 ) = W / V W = Weight of the sintered compact (g) V = Volume (cm 3 ) of the sintered compact is there.
【０００８】これらポリオレフィン焼結成形体には熱安
定剤、光安定剤、耐候剤、無機フィラー、防カビ剤、抗
菌剤などを必要に応じて添加しても良い。ポリオレフィ
ン焼結成形体に使用する粉末としては、重合により得ら
れた粉末をそのまま用いることも可能であるし、一度粉
末以外の形状に成形したものを、機械粉砕、冷凍粉砕、
化学粉砕等の公知の方法をもって粉末にしたものを用い
る事も可能である。If necessary, a heat stabilizer, a light stabilizer, a weathering agent, an inorganic filler, an antifungal agent, an antibacterial agent, etc. may be added to these polyolefin sintered compacts. As the powder used for the polyolefin sintered compact, it is possible to use the powder obtained by the polymerization as it is, or once molded into a shape other than the powder, mechanical crushing, freeze crushing,
It is also possible to use a powder obtained by a known method such as chemical pulverization.
【０００９】ポリオレフィン焼結成形体は、スルフォン
化、特定の界面活性剤の添加、親水性モノマーのグラフ
ト、親水性の層を設ける等公知の方法で親水化されてい
ても良い。これら親水化は、粉末の状態で親水化したも
のを焼結成形しても良いし、一度焼結成形したものを親
水化することも可能である。これら焼結成形体の形状
は、シート状、ブロック状、パイプ状、円柱状など特に
限定される事はなく、任意の形状が可能である。The polyolefin sintered compact may be hydrophilized by a known method such as sulfonation, addition of a specific surfactant, graft of a hydrophilic monomer, and provision of a hydrophilic layer. These hydrophilic treatments may be carried out by sinter-molding a powder-hydrophilized product, or by hydrophilizing a sinter-molded product. The shape of these sintered compacts is not particularly limited to a sheet shape, a block shape, a pipe shape, a cylindrical shape, and any shape is possible.
【００１０】ポリオレフィン焼結成形体をシート状で考
えた場合、その厚みは任意の厚みで良いが、強度と吸収
能力等を考慮すると１〜５mm程度の物が好適に使用され
る。本発明に於いてエチレン系共重合体は、エチレン−
酢酸ビニル共重合体、エチレン−アクリル酸共重合体、
エチレン−メタアクリル酸共重合体、エチレン−アクリ
ル酸エステル共重合体、エチレン−メタアクリル酸エス
テル共重合体などがあげられる。中でもエチレン−酢酸
ビニル共重合体が好適に用いられる。When the polyolefin sintered compact is considered as a sheet, its thickness may be any thickness, but in consideration of strength and absorption capacity, a thickness of about 1 to 5 mm is preferably used. In the present invention, the ethylene-based copolymer is ethylene-
Vinyl acetate copolymer, ethylene-acrylic acid copolymer,
Examples thereof include ethylene-methacrylic acid copolymer, ethylene-acrylic acid ester copolymer, and ethylene-methacrylic acid ester copolymer. Among them, ethylene-vinyl acetate copolymer is preferably used.
【００１１】該エチレン−酢酸ビニル共重合体の酢酸ビ
ニル含量は、３wt％以上、３０wt％以下が好ましく、更
に好ましくは５wt％以上、３０wt％以下である。酢酸ビ
ニル含量が３wt％未満ではポリオレフィン焼結成形体と
の十分な接着力が得られない。また、酢酸ビニル含量が
３０wt％以上ではブロッキングが激しくなり扱いが困難
になる。また、該エチレン系共重合体のＭＩ（１９０
℃、２．１６kg）は、０．１g/10分以上、２０g/10分以
下が好ましく、更に好ましくは０．５g/10分以上、１０
g/10分以下である。ＭＩが０．１g/10分未満及び５０g/
10分以上では成形加工性に劣る。これらエチレン系共重
合体には熱安定剤、光安定剤、耐候剤、無機フィラー、
スリップ剤、滑剤、防カビ剤、抗菌剤などを必要に応じ
て添加する事は何等差し支えない。該エチレン系共重合
体層の厚みは任意の厚みで良いが、該エチレン系共重合
体層は接着層として機能する事から、この厚みを無用に
大きくする事は経済的にも好ましくなく、５〜５０μｍ
程度で十分である。The vinyl acetate content of the ethylene-vinyl acetate copolymer is preferably 3 wt% or more and 30 wt% or less, more preferably 5 wt% or more and 30 wt% or less. If the vinyl acetate content is less than 3% by weight, sufficient adhesion with the polyolefin sintered compact cannot be obtained. Further, when the vinyl acetate content is 30 wt% or more, blocking becomes severe and handling becomes difficult. In addition, MI (190
C., 2.16 kg) is preferably 0.1 g / 10 minutes or more and 20 g / 10 minutes or less, more preferably 0.5 g / 10 minutes or more, 10
g / 10 minutes or less. MI less than 0.1g / 10min and 50g /
If it is 10 minutes or more, the moldability is poor. These ethylene-based copolymers include heat stabilizers, light stabilizers, weathering agents, inorganic fillers,
There is no problem in adding a slip agent, a lubricant, an antifungal agent, an antibacterial agent, etc., if necessary. The thickness of the ethylene copolymer layer may be any thickness, but since the ethylene copolymer layer functions as an adhesive layer, it is not economically preferable to increase this thickness unnecessarily. ~ 50 μm
The degree is enough.
【００１２】本発明において直鎖状低密度ポリエチレン
は、エチレン−ブテン−１共重合体、エチレン−ヘキセ
ン−１共重合体、エチレン−ペンテン−１共重合体、エ
チレン−オクテン−１共重合体、エチレン−４−メチル
ペンテン−１共重合体などがあげられ、これらは単独で
使用されても良いし２種以上の混合物を用いても良い。
これら直鎖状低密度ポリエチレンには、熱安定剤、光安
定剤、耐候剤、無機フィラー、スリップ剤、滑剤、防カ
ビ剤、防菌剤などを必要に応じて添加しても良い。In the present invention, the linear low-density polyethylene is an ethylene-butene-1 copolymer, an ethylene-hexene-1 copolymer, an ethylene-pentene-1 copolymer, an ethylene-octene-1 copolymer, Examples thereof include ethylene-4-methylpentene-1 copolymers, which may be used alone or as a mixture of two or more kinds.
A heat stabilizer, a light stabilizer, a weathering agent, an inorganic filler, a slip agent, a lubricant, an antifungal agent, an antibacterial agent and the like may be added to these linear low-density polyethylenes, if necessary.
【００１３】これら直鎖状低密度ポリエチレンの密度は
０．９０g/cm3 以上、０．９４g/cm 3 以下が好ましく、
更に好ましくは０．９１g/cm3 以上、０．９３g/cm3 以
下である。密度が同程度の高圧法低密度ポリエチレンで
はその融点が低いために熱融着の際、フィルムが伸びて
しまい好ましくない。また、密度が０．９４g/cm3 以上
の中密度ないしは高密度ポリエチレンでは熱融着の際そ
の収縮力でフィルムが皺になり好ましくない。該直鎖状
低密度ポリエチレンのＭＩ（１９０℃、２．１６kg）は
０．１g/10分以上、２０g/10分以下が好ましく、更に好
ましくは０．５g/10分以上、１０g/10分以下である。該
直鎖状低密度ポリエチレンの厚みは１０〜５０μｍ程度
が好適に用いられる。即ち、１０μｍ以下では十分な強
度が得られず、５０μｍ以上では熱融着の際熱の伝導が
低くなって十分な接着強度が得られなかったり、熱融着
時に収縮力が大となって皺が発生するので好ましくな
い。The density of these linear low-density polyethylenes is
0.90 g / cm3Above, 0.94g / cm 3The following is preferable,
More preferably 0.91 g / cm3Above, 0.93g / cm3Since
Below. High-pressure low-density polyethylene with the same density
Since its melting point is low, the film stretches during heat fusion.
It is not desirable. Also, the density is 0.94 g / cm3that's all
For medium density or high density polyethylene
The shrinkage force causes wrinkling of the film, which is not preferable. The straight chain
MI of low density polyethylene (190 ℃, 2.16kg)
0.1g / 10 minutes or more, 20g / 10 minutes or less is preferable, and more preferable
It is preferably 0.5 g / 10 minutes or more and 10 g / 10 minutes or less. The
The thickness of linear low-density polyethylene is about 10 to 50 μm
Is preferably used. That is, if it is 10 μm or less, it is sufficiently strong.
Is not obtained, and if 50 μm or more, heat conduction during heat fusion
It becomes too low to obtain sufficient adhesive strength, or heat fusion
Sometimes the contraction force becomes large and wrinkles occur, which is not preferable.
Yes.
【００１４】これらを積層させるには、予めエチレン系
共重合体と直鎖状低密度ポリエチレンとを各々フィルム
状にしたものをポリオレフィン焼結成形体に熱融着させ
ても良いが、エチレン系共重合体と直鎖状低密度ポリエ
チレンとを共押出し等の公知の手段を用いて一体に成形
したものをポリオレフィン焼結成形体に熱融着させるの
が作業効率からみても好ましい。但し、ポリオレフィン
焼結体はその多孔性を最大の特徴の一つとしていること
から、フィルムを貼る時に過大な応力がかかるとその多
孔性が失われてしまう恐れがあるので、多孔性を損なわ
ず且つ必要な接着力が得られるような条件を選択するこ
とが必要である。また、積層体の構成は焼結成形体の片
面にエチレン系共重合体を介して直鎖状低密度ポリエチ
レンを貼った構成でも良いし、焼結成形体の両面にエチ
レン系共重合体を介して直鎖状低密度ポリエチレンを貼
った構成でも良く、更には２枚以上の焼結成形体の間に
エチレン系共重合体を介して直鎖状低密度ポリエチレン
を貼った構成でも良い。In order to laminate these, an ethylene-based copolymer and a linear low-density polyethylene, which are each formed into a film in advance, may be heat-bonded to the polyolefin sintered compact. From the viewpoint of work efficiency, it is preferable from the viewpoint of work efficiency that a product obtained by integrally molding the united product and linear low-density polyethylene using a known means such as coextrusion is heat-bonded to the polyolefin sintered product. However, since the polyolefin sintered body has its porosity as one of its greatest features, it may lose its porosity if excessive stress is applied when the film is attached, so it does not impair the porosity. In addition, it is necessary to select the conditions such that the required adhesive strength can be obtained. Further, the structure of the laminate may be a structure in which linear low-density polyethylene is stuck on one side of the sintered compact through an ethylene copolymer, or may be directly laminated on both sides of the sintered compact through the ethylene copolymer. A structure in which chain low-density polyethylene is stuck may be used, or a structure in which linear low-density polyethylene is stuck between two or more sintered compacts via an ethylene-based copolymer.
【００１５】また、エチレン系共重合体層と直鎖状低密
度ポリエチレン層は必要に応じて打抜き、熱溶融など公
知の手段を用いて開口部を設けることも可能である。そ
の際、開口部１個当たりの面積や開口率は各々の用途に
応じたもので良く特に限定されるものではないが、開口
加工の容易さ・フィルムの強度などを勘案すると開口部
１個当たりの面積は１０μｍ2 から１００mm2 程度、開
口率は０．１〜５０％程度が好適に用いられる。尚、開
口率はフィルム面積中に占める開口部の面積比率であ
る。開口部の形状は特に限定されることはなく、丸型、
三角形、正方形、長方形、多角形、星型など任意の形状
が可能である。Further, the ethylene copolymer layer and the linear low-density polyethylene layer may be provided with openings by using known means such as punching and heat melting, if necessary. At that time, the area per opening and the opening ratio are not particularly limited as they may be suitable for each application, but considering the ease of processing the opening, the strength of the film, etc. The area of 10 μm 2 to 100 mm 2 and the aperture ratio of 0.1 to 50% are preferably used. The opening ratio is the area ratio of the openings in the film area. The shape of the opening is not particularly limited, and is round,
Any shape such as a triangle, a square, a rectangle, a polygon, or a star can be used.
【００１６】[0016]
【実施例】以下、実施例により本発明を具体的に説明す
る。EXAMPLES The present invention will be specifically described below with reference to examples.
【００１７】[0017]
【実施例１】高密度ポリエチレン粉末、サンファインＳ
Ｈ−８００（旭化成工業株式会社製）を金属製無端ベル
トに散布し、加熱炉中を通して加熱焼結させ、厚み２mm
の焼結成形体を得た。この焼結成形体の気孔率は３５％
であった。この焼結成形体に、酢酸ビニル含量が１５
％、ＭＩが１．０g/10分のエチレン−酢酸ビニル共重合
体と、密度が０．９２０g/cm3 、ＭＩが２．０g/10分の
エチレン−ブテン−１共重合体とを共押出しにより得ら
れた積層フィルムを、エチレン−酢酸ビニル共重合体層
が焼結成形体に接するように熱により融着させた。尚、
積層フィルムの各層の厚みはエチレン−酢酸ビニル共重
合体層が２０μｍ、エチレン−ブテン−１共重合体層が
３０μｍであった。該積層体のエチレン−ブテン−１共
重合体層にセロハンテープを貼り、セロハンテープを引
きはがすと、セロハンテープとエチレン−ブテン−１共
重合体層の間で剥離が生じた。また、該積層体は反り等
の変形は認められなかった。Example 1 High-density polyethylene powder, Sunfine S
H-800 (manufactured by Asahi Kasei Co., Ltd.) is sprinkled on a metal endless belt and heated and sintered in a heating furnace to have a thickness of 2 mm.
A sintered compact of was obtained. The porosity of this sintered compact is 35%
Met. This sintered compact has a vinyl acetate content of 15
%, MI 1.0 g / 10 min of ethylene-vinyl acetate copolymer and density of 0.920 g / cm 3 and MI of 2.0 g / 10 min of ethylene-butene-1 copolymer are coextruded. The laminated film thus obtained was fused by heat so that the ethylene-vinyl acetate copolymer layer was in contact with the sintered compact. still,
The thickness of each layer of the laminated film was 20 μm for the ethylene-vinyl acetate copolymer layer and 30 μm for the ethylene-butene-1 copolymer layer. When a cellophane tape was attached to the ethylene-butene-1 copolymer layer of the laminate and the cellophane tape was peeled off, peeling occurred between the cellophane tape and the ethylene-butene-1 copolymer layer. No deformation such as warpage was observed in the laminate.
【００１８】[0018]
【比較例１】実施例１において使用した焼結成形体の上
に、密度が０．９２０g/cm3 、ＭＩが２．０g/10分のエ
チレン−ブテン−１共重合体の５０μｍのフィルムを熱
により融着させた。実施例１と同様の方法でセロハンテ
ープでの剥離試験を行ったところ、焼結成形体層とエチ
レン−ブテン−１共重合体層間で剥離が生じた。また、
該積層体は反り等の変形は認められなかった。Comparative Example 1 A 50 μm film of an ethylene-butene-1 copolymer having a density of 0.920 g / cm 3 and an MI of 2.0 g / 10 was heat-treated on the sintered compact used in Example 1. Fused. When a peeling test was performed using a cellophane tape in the same manner as in Example 1, peeling occurred between the sintered compact layer and the ethylene-butene-1 copolymer layer. Also,
No deformation such as warpage was observed in the laminate.
【００１９】[0019]
【実施例２】高密度ポリエチレン粉末、サンファインＳ
Ｈ−８００（旭化成工業株式会社製）にポリオキシエチ
レンソルビタンモノラウレートを高速ミキサーにて混合
し、親水性粉体を得た。該親水性粉体を金属製無端ベル
トに散布し、加熱炉中を通して加熱焼結させ、加熱炉の
出口で実施例１で使用した積層フィルムを、エチレン−
酢酸ビニル共重合体層が焼結成形体に接するように熱に
より融着させ、全体の厚みが約２mmの積層体を得た。こ
の積層体の焼結成形体部分のの気孔率は３５％であっ
た。実施例１と同様の方法でセロハンテープでの剥離試
験を行ったところ、セロハンテープとエチレン−ブテン
−１共重合体層間で剥離が生じた。また、該積層体は反
り等の変形は認められなかった。[Example 2] High-density polyethylene powder, Sunfine S
Polyoxyethylene sorbitan monolaurate was mixed with H-800 (manufactured by Asahi Kasei Co., Ltd.) with a high speed mixer to obtain a hydrophilic powder. The hydrophilic powder was sprinkled on a metal endless belt, heat-sintered through a heating furnace, and the laminated film used in Example 1 at the outlet of the heating furnace was mixed with ethylene-
The vinyl acetate copolymer layer was fused by heat so as to be in contact with the sintered compact to obtain a laminate having a total thickness of about 2 mm. The porosity of the sintered compact portion of this laminate was 35%. When a peeling test was performed using a cellophane tape in the same manner as in Example 1, peeling occurred between the cellophane tape and the ethylene-butene-1 copolymer layer. No deformation such as warpage was observed in the laminate.
【００２０】[0020]
【実施例３】酢酸ビニル含量が１５％、ＭＩが１．０g/
10分のエチレン−酢酸ビニル共重合体と、密度が０．９
２０g/cm3 、ＭＩが２．０g/10分のエチレン−ブテン−
１共重合体とを共押出しにより得られた積層フィルム
を、加熱した針で約５mmのピッチで約１mmの孔を連続し
て開けた。該積層フィルムの厚みは５０μｍであり、各
層の厚みはエチレン−酢酸ビニル共重合体層が２０μ
ｍ、エチレン−ブテン−１共重合体層が３０μｍであっ
た。次いで、実施例２で使用した親水性ポリオレフィン
粉体を金属製無端ベルトに散布し、加熱炉中を通して加
熱焼結させ、加熱炉の出口で上記孔開きフィルムをエチ
レン−酢酸ビニル共重合体層が焼結成形体に接するよう
に熱により融着させ、全体の厚みが約２mmの積層体を得
た。この積層体の焼結成形体部分の気孔率は３５％であ
った。実施例１と同様の方法でセロハンテープでの剥離
試験を行ったところ、セロハンテープとエチレン−ブテ
ン−１共重合体層間で剥離が生じた。また、該積層体は
反り等の変形は認められなかった。Example 3 Vinyl acetate content 15%, MI 1.0 g /
10 minutes ethylene-vinyl acetate copolymer with a density of 0.9
20g / cm 3 , MI 2.0g / 10min ethylene-butene
The laminated film obtained by coextrusion with 1 copolymer was continuously punched with about 1 mm holes at a pitch of about 5 mm with a heated needle. The thickness of the laminated film was 50 μm, and the thickness of each layer was 20 μm for the ethylene-vinyl acetate copolymer layer.
m, and the ethylene-butene-1 copolymer layer had a thickness of 30 μm. Then, the hydrophilic polyolefin powder used in Example 2 was sprinkled on a metal endless belt and heat-sintered through a heating furnace, and the perforated film was converted into an ethylene-vinyl acetate copolymer layer at the exit of the heating furnace. The sintered compact was fused by heat so as to be in contact with the sintered compact to obtain a laminate having a total thickness of about 2 mm. The porosity of the sintered compact portion of this laminate was 35%. When a peeling test was performed using a cellophane tape in the same manner as in Example 1, peeling occurred between the cellophane tape and the ethylene-butene-1 copolymer layer. No deformation such as warpage was observed in the laminate.
【００２１】[0021]
【実施例４】酢酸ビニル含量が５％、ＭＩが２．０g/10
分のエチレン−酢酸ビニル共重合体と、密度が０．９２
０g/cm3 、ＭＩが２．０g/10分のエチレン−ブテン−１
共重合体とを共押出しにより積層フィルム得た。該積層
フィルムの厚みは５０μｍであり、各層の厚みはエチレ
ン−酢酸ビニル共重合体層が２０μｍ、エチレン−ブテ
ン−１共重合体層が３０μｍであった。Example 4 Vinyl acetate content 5%, MI 2.0 g / 10
Min ethylene-vinyl acetate copolymer with a density of 0.92
Ethylene-butene-1 with 0 g / cm 3 and MI of 2.0 g / 10 min
A laminated film was obtained by coextrusion with the copolymer. The thickness of the laminated film was 50 μm, and the thickness of each layer was 20 μm for the ethylene-vinyl acetate copolymer layer and 30 μm for the ethylene-butene-1 copolymer layer.
【００２２】次いで、実施例２で使用した親水性ポリオ
レフィン粉体を金属製無端ベルトに散布し、加熱炉中を
通して加熱焼結させ、加熱炉の出口で上記孔開きフィル
ムをエチレン−酢酸ビニル共重合体層が焼結成形体に接
するように熱により融着させ、全体の厚みが約２mmの積
層体を得た。この積層体の焼結成形体部分の気孔率は３
５％であった。実施例１と同様の方法でセロハンテープ
での剥離試験を行ったところ、セロハンテープとエチレ
ン−ブテン−１共重合体層間で剥離が生じた。また、該
積層体は反り等の変形は認められなかった。Next, the hydrophilic polyolefin powder used in Example 2 was sprinkled on a metal endless belt and heat-sintered through a heating furnace. At the outlet of the heating furnace, the perforated film was mixed with ethylene-vinyl acetate copolymer. The coalesced layer was fused by heat so that the coalesced layer was in contact with the sintered compact to obtain a laminate having a total thickness of about 2 mm. The porosity of the sintered compact part of this laminate is 3
It was 5%. When a peeling test was performed using a cellophane tape in the same manner as in Example 1, peeling occurred between the cellophane tape and the ethylene-butene-1 copolymer layer. No deformation such as warpage was observed in the laminate.
【００２３】[0023]
【比較例２】酢酸ビニル含量が１５％、ＭＩが１．０g/
10分のエチレン−酢酸ビニル共重合体と、密度が０．９
２０g/cm3 、ＭＩが２．０g/10分のエチレン−ブテン−
１共重合体とを共押出しにより積層フィルムを得た。該
積層フィルムの厚みは１００μｍであり、各層の厚みは
エチレン−酢酸ビニル共重合体層が２０μｍ、エチレン
−ブテン−１共重合体層が８０μｍであった。実施例２
で使用した親水性ポリオレフィン粉末を金属製無端ベル
トに散布し、加熱炉中を通して焼結成形体を得た。加熱
炉の出口で、前記積層フィルムのエチレン−酢酸ビニル
共重合体層が焼結成形体に接するように熱により融着さ
せたところ、フィルムが熱によって収縮し全体に皺が発
生した。Comparative Example 2 Vinyl acetate content is 15%, MI is 1.0 g /
10 minutes ethylene-vinyl acetate copolymer with a density of 0.9
20g / cm 3 , MI 2.0g / 10min ethylene-butene
A laminated film was obtained by coextrusion with 1 copolymer. The thickness of the laminated film was 100 μm, and the thickness of each layer was 20 μm for the ethylene-vinyl acetate copolymer layer and 80 μm for the ethylene-butene-1 copolymer layer. Example 2
The hydrophilic polyolefin powder used in 1. was sprinkled on a metal endless belt and passed through a heating furnace to obtain a sintered compact. At the exit of the heating furnace, when the ethylene-vinyl acetate copolymer layer of the laminated film was fused by heat so as to be in contact with the sintered compact, the film contracted by heat and wrinkles were generated on the whole.
【００２４】[0024]
【比較例３】酢酸ビニル含量が１５％、ＭＩが１．０g/
10分のエチレン−酢酸ビニル共重合体と、密度が０．９
６２g/cm3 、ＭＩが０．８g/10分の高密度ポリエチレン
とを共押出しにより積層フィルムを得た。該積層フィル
ムの厚みは５０μｍであり、各層の厚みはエチレン−酢
酸ビニル共重合体層が２０μｍ、高密度ポリエチレン層
が３０μｍであった。実施例２で使用した親水性ポリオ
レフィン粉末を金属製無端ベルトに散布し、加熱炉中を
通して焼結成形体を得た。加熱炉の出口で、前記積層フ
ィルムのエチレン−酢酸ビニル共重合体層が焼結成形体
に接するように熱により融着させたところ、フィルムが
熱によって収縮し全体に皺が発生した。Comparative Example 3 Vinyl acetate content is 15%, MI is 1.0 g /
10 minutes ethylene-vinyl acetate copolymer with a density of 0.9
A laminated film was obtained by co-extrusion with high-density polyethylene of 62 g / cm 3 and MI of 0.8 g / 10 min. The thickness of the laminated film was 50 μm, and the thickness of each layer was 20 μm for the ethylene-vinyl acetate copolymer layer and 30 μm for the high-density polyethylene layer. The hydrophilic polyolefin powder used in Example 2 was sprinkled on a metal endless belt and passed through a heating furnace to obtain a sintered compact. At the exit of the heating furnace, when the ethylene-vinyl acetate copolymer layer of the laminated film was fused by heat so as to be in contact with the sintered compact, the film contracted by heat and wrinkles were generated on the whole.
【００２５】[0025]
【比較例４】酢酸ビニル含量が２％、ＭＩが１．５g/10
分のエチレン−酢酸ビニル共重合体と、密度が０．９２
０g/cm3 、ＭＩが２．０g/10分のエチレン−ブテン−１
共重合体とを共押出しにより積層フィルムを得た。該積
層フィルムの厚みは５０μｍであり、各層の厚みはエチ
レン−酢酸ビニル共重合体層が２０μｍ、エチレン−ブ
テン−１共重合体層が３０μｍであった。実施例２で使
用した親水性ポリオレフィン粉末を金属製無端ベルトに
散布し、加熱炉中を通して焼結成形体を得た。加熱炉の
出口で、前記積層フィルムのエチレン−酢酸ビニル共重
合体層が焼結成形体に接するように熱により融着させ
た。実施例１と同様の方法でセロハンテープでの剥離試
験を行ったところ、焼結成形体層とエチレン−酢酸ビニ
ル共重合体層間で剥離が生じた。Comparative Example 4 Vinyl acetate content 2%, MI 1.5g / 10
Min ethylene-vinyl acetate copolymer with a density of 0.92
Ethylene-butene-1 with 0 g / cm 3 and MI of 2.0 g / 10 min
A laminated film was obtained by coextrusion with the copolymer. The thickness of the laminated film was 50 μm, and the thickness of each layer was 20 μm for the ethylene-vinyl acetate copolymer layer and 30 μm for the ethylene-butene-1 copolymer layer. The hydrophilic polyolefin powder used in Example 2 was sprinkled on a metal endless belt and passed through a heating furnace to obtain a sintered compact. At the outlet of the heating furnace, the laminated film was fused by heat so that the ethylene-vinyl acetate copolymer layer of the laminated film was in contact with the sintered compact. When a peeling test was performed using cellophane tape in the same manner as in Example 1, peeling occurred between the sintered compact layer and the ethylene-vinyl acetate copolymer layer.
【００２６】[0026]
【発明の効果】本発明の構成によれば簡単に積層でき、
焼結成形体に余計なストレスを掛けずに積層できるの
で、変形等の少ない積層体がえられる。According to the structure of the present invention, the layers can be easily laminated,
Since the sintered compact can be laminated without applying extra stress, a laminate with less deformation can be obtained.
Claims (4)
なくとも片面にエチレン系共重合体層を介して直鎖状低
密度ポリエチレン層が熱により融着されてなることを特
徴とする焼結成形積層体。1. A sinter-molded laminate, comprising a polyolefin sinter-molded product obtained by heat-bonding a linear low-density polyethylene layer on at least one side of which an ethylene-based copolymer layer is interposed.
ていることを特徴とする特許請求範囲第１項記載の焼結
成形積層体。2. The sintered molded laminate according to claim 1, wherein the polyolefin sintered molded body is hydrophilized.
wt％以下の酢酸ビニルを含み、ＭＩが０．１g/10分以
上、２０g/10分以下のエチレン−酢酸ビニル共重合体で
あることを特徴とする特許請求範囲第１項記載の焼結成
形積層体。3. The ethylene-based copolymer is 3 wt% or more, 30
The sintering molding according to claim 1, which is an ethylene-vinyl acetate copolymer containing less than wt% of vinyl acetate and having an MI of 0.1 g / 10 min or more and 20 g / 10 min or less. Laminate.
９０g/cm3 以上、０．９４g/cm3 以下であり、該直鎖状
低密度ポリエチレンのＭＩが０．１g/10分以上、２０g/
10分以下であることを特徴とする特許請求範囲第１項記
載の焼結成形積層体。4. The linear low-density polyethylene has a density of 0.
90 g / cm 3 or more and 0.94 g / cm 3 or less, and the MI of the linear low-density polyethylene is 0.1 g / 10 min or more, 20 g / cm 3
It is 10 minutes or less, The sintered compact laminated body of Claim 1 characterized by the above-mentioned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32506094A JP3436998B2 (en) | 1994-12-27 | 1994-12-27 | Sintered laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32506094A JP3436998B2 (en) | 1994-12-27 | 1994-12-27 | Sintered laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08174734A JPH08174734A (en) | 1996-07-09 |
| JP3436998B2 true JP3436998B2 (en) | 2003-08-18 |
Family
ID=18172711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32506094A Expired - Fee Related JP3436998B2 (en) | 1994-12-27 | 1994-12-27 | Sintered laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3436998B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5237569B2 (en) | 2007-02-27 | 2013-07-17 | 東洋アルミニウム株式会社 | Solar cell back surface protection sheet and solar cell module including the same |
-
1994
- 1994-12-27 JP JP32506094A patent/JP3436998B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08174734A (en) | 1996-07-09 |
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