JP3415731B2 - Optical-related element bonding structure - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for joining optical elements such as LCD and CCD in a liquid crystal video projector, CCD camera and the like.

[0002]

2. Description of the Related Art In a liquid crystal video projector or CCD camera, it is important to accurately arrange a color synthesizing prism and an LCD or a color separating prism and a CCD in a predetermined positional relationship in order to improve the image quality. For this reason, conventionally, the bracket to which the prism is attached and the LC
An optical-related element bonding structure in which a D- or CCD-mounted plate is bonded by soldering is often used.

FIG. 5 shows the structure for joining the above optical related elements.
As shown in FIG. 2, the joint surface portion 2a of the bracket 2 and the joint surface portion 4a of the plate 4 are arranged so as to face each other with a minute gap, and solder S is supplied to both joint surface portions from both sides of the xenon lamp. It is known that the above soldering is performed by irradiating a light beam to melt the solder S. As the type of light source for irradiating the light beam, it is preferable to use a xenon lamp that can obtain a large heat capacity as compared with a laser or the like.

[0004]

However, in the conventional optical-element-joining structure, even when a xenon lamp is used, one of the two joining surface portions is mostly shaded by the other, so that it is sufficient. Since it is not heated, there is a problem that the solder between both joint surface parts cannot be melted in a short time. For example, in the optical element bonding structure shown in FIG. 5, the bonding surface portion 2a of the bracket 2 is
Most of it is behind the joint surface portion 4a of the plate 4, so that it is not sufficiently heated.

The present invention has been made in view of the above circumstances, and an object thereof is to provide an optical-related element joining structure capable of melting solder supplied between joining surfaces of a bracket and a plate in a short time. It is what

[0006]

An optical-related element bonding structure of the present invention comprises a bracket to which a prism is attached and a plate to which a display element or an image pickup element is attached.
An optical-related element bonding structure for bonding by soldering, wherein a bonding surface portion of the bracket is formed at a position that protrudes outward from a prism mounting surface portion of the bracket and is offset from the prism mounting surface portion to the plate side. The joint surface portion of the plate is formed at a position projecting outward from the element mounting surface portion of the plate, and the joint surface portion of the bracket and the joint surface portion of the plate are arranged to face each other with a minute gap. Along with the fact that solder is supplied between the both joint surfaces, the solder is applied by irradiating the joint surfaces with a light beam from a xenon lamp to melt the solder. In the element junction structure,
Of the joint surface portion of the bracket and the joint surface portion of the plate, the joint surface portion located on the upstream side in the irradiation direction of the light beam is set to a smaller value in the projection area in the irradiation direction than the other joint surface portion. It is characterized by that.

The term "upstream" means a portion located on the light incident side with respect to the joint surface. The material of the bracket and the plate is not particularly limited, but it is preferable to configure them with permalloy for the following reasons. That is, the material of the bracket is preferably Permalloy, which is close to the coefficient of thermal expansion of the prism to which it is bonded, but if the material of the bracket is Permalloy, the thermal conductivity of the bracket and the plate is low and equal. As a result, the thermal efficiency at the time of soldering both joint surface portions can be improved.
Also, if the joint surface portion of the bracket and the joint surface portion of the plate are plated with solder, both joint surface portions can be easily soldered.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing a schematic configuration of a liquid crystal video projector provided with an optical-related element bonding structure according to an embodiment of the present invention.

As shown, a liquid crystal video projector 1
0 is the dichroic mirror 14 for the light from the light source 12,
RGB through 16 and reflecting mirrors 20, 22, 28
After being separated into three colors, they are made incident on the three LCDs 30, 32 and 34, respectively, and the light transmitted through these three LCDs 30, 32 and 34 is combined by the dichroic prism 36 and is irradiated forward from the projection lens 38. However, the optical-related element bonding structure according to the present embodiment is provided between the dichroic prism 36 and each of the three LCDs 30, 32, and 34.

Since the optical-related element bonding structure at these three locations has the same structure, the optical-related element bonding structure between the dichroic prism 36 and the LCD 34 will be described below.

FIG. 2 is a side view showing the above-mentioned optical-related element bonding structure in detail, and FIG. 3 is a view in the direction of the arrow III. As shown in FIG. 2, this optical-related element bonding structure is
The permalloy bracket 40 to which the dichroic prism 36 is adhered and the permalloy plate 60 to which the LCD 34 is attached are joined by soldering.

FIG. 4 is a perspective view showing the bracket 40 and the plate 60 before being joined as a single piece. As shown in the figure, the bracket 40 includes a pair of upper leg portions 44 extending upward from an upper end portion of a prism-bonding surface portion 42 formed in a rectangular frame, and a pair of upper leg portions 44 extending downward from a lower end portion of the prism bonding surface portion 42. A pair of lower leg portions 46 is formed.

Each of the upper leg portions 44 is formed so as to extend upward from the upper end portion of the prism bonding surface portion 42, extend to the plate 60 side in the vertical plane, and further extend horizontally outward. On the other hand, the lower leg portions 46 are
It is formed so as to extend downward from the lower end of the prism adhesion surface portion 42, then extend to the plate 60 side in the horizontal plane, and further extend downward. The tip ends of the upper leg portions 44 and the lower leg portions 46 are plated with solder, thereby forming the joint surface portions 48 and 50 for soldering.

On the other hand, also on the plate 60, a pair of upper leg portions 64 extending upward from the upper end portion of the LCD mounting surface portion 62 formed in a rectangular frame shape, and a pair of upper leg portions 64 extending downward from the lower end portion of the LCD mounting surface portion 62. A pair of lower leg portions 66 is formed.

Each of the upper leg portions 64 has an LCD mounting surface portion 6
It is formed so as to extend upward from the upper end portion of 2 and then extend outward in the horizontal direction. On the other hand, the lower leg portions 66
Is formed so as to extend downward from the lower end of the LCD mounting surface portion 62. The tip ends of the upper leg portions 64 and the lower leg portions 66 are plated with solder, whereby the joint surface portion 6 for soldering is formed.
8 and 70 are configured. These joint surfaces 68, 70
Is set at a position facing the joint surface portions 48, 50 of the bracket 60, but as shown in FIG. 3, the joint surface portions 68, 70 of the plate 60 are arranged at the joint surface portions 48 of the bracket 40. , 50, the area is set smaller.

As shown in FIG. 2, the soldering of the bracket 40 and the plate 60 is performed by joining the joining surface portions 48, 50 of the bracket 40 and the joining surface portions 68, 7 of the plate 60.
0 and 0 are arranged vertically with a minute gap therebetween, and a solder (cream solder) S is supplied between the joint surfaces, and each joint surface is irradiated with a light beam from a xenon lamp (not shown). It is performed by melting the solder S. The light beam from the xenon lamp is emitted as focused light from obliquely outside on the plate 60 side.
Is the joint surface portion 4 of the bracket 40 that faces this.
The projected area in the irradiation direction is smaller than those of Nos. 8 and 50.

As described above in detail, in the optical element bonding structure of the present embodiment, the bonding surface portions 68, 70 of the plate 60 are more than the bonding surface portions 48, 50 of the bracket 40 facing the bonding surface portions 68, 70. Since the projected area in the irradiation direction of the xenon lamp is small, the light beam can be evenly applied to the joint surface portions 48, 50 of the bracket 40 and the joint surface portions 68, 70 of the plate 60 opposed thereto.
Therefore, the respective joint surface portions 48/68, 50/70 can be sufficiently heated, whereby the respective joint surface portions 48/6
The solder S between 8 and 50/70 can be melted in a short time.

Further, since the material of the bracket 40 is made of permalloy having a coefficient of thermal expansion close to that of the dichroic prism 36, sufficient adhesion to the dichroic prism 36 can be secured, but the plate 60 is used. Also, since the material thereof is composed of permalloy, the thermal conductivity of the bracket 40 and the plate 60 can be made low and equal, and thereby the thermal efficiency at the time of soldering the respective joint surface portions can be improved.

Moreover, the joint surface portion 4 of the bracket 40 is
Since the joint surface portions 68 and 70 of the plates 8 and 50 and the plate 60 are plated with solder, each joint surface portion 48/6
Soldering of 8, 50/70 can be easily performed. The above-mentioned effect is obtained by dichroic prism 36 and L
The optical-related element bonding structure between the dichroic prism 36 and the LCD 30 and between the dichroic prism 36 and the LCD 32, which has the same structure as the optical-related element bonding structure with the CD 34, can be obtained.

In this embodiment, the dichroic prism 36 in the liquid crystal video projector 10 is used.
Although the optical-related element bonding structure between the LCD and each of the three LCDs 30, 32, and 34 has been described, the optical-related element bonding structure between the dichroic prism and the CCD in the CCD camera has the same configuration as this embodiment. By adopting, it is possible to obtain the same effect as this embodiment.

Further, in the present embodiment, as a concrete structure for reducing the projected area of the joining surface portion of the plate with respect to the joining surface portion of the bracket in the irradiation direction of the xenon lamp, the joining surface portions 48 and 50 of the bracket 40 are Although the outer shape of the joint surface portions 68, 70 of the plate 60 is made smaller, it is possible to reduce the projected area of the xenon lamp irradiation direction by forming a plurality of small holes in the joint surface portions 68, 70 of the plate 60. Is.

[0022]

According to the optical element joining structure of the present invention, the joining surface portion of the bracket to which the prism is attached and the joining surface portion of the plate to which the display element or the image pickup element is attached are arranged to face each other with a minute gap. It is configured to radiate a light beam from a xenon lamp to both joint surface portions for soldering.Both the joint surface portion of the bracket and the joint surface portion of the plate, which are located on the upstream side in the light beam irradiation direction. Since the surface area is set to a value that has a smaller projected area in the irradiation direction than the other bonding surface area, the light beam should be applied evenly to each bonding surface area of the bracket and the opposing bonding surface area of the plate. Therefore, both joint surface portions can be sufficiently heated, and thereby the solder between both joint surface portions can be melted in a short time.

[Brief description of drawings]

FIG. 1 is a plan view showing a schematic configuration of a liquid crystal video projector in which an optical-related element bonding structure according to an embodiment of the present invention is provided at three locations.

FIG. 2 is a side view showing in detail one of the optical-related element bonding structures shown in FIG.

FIG. 3 is a view in the direction of arrow III in FIG.

FIG. 4 is a perspective view showing a bracket and a plate constituting the optical-related element bonding structure of FIG. 1 as a single piece.

FIG. 5 is a view similar to FIG. 2 showing a conventional example.

[Explanation of symbols] 10 LCD video projector 30, 32, 34 LCD 36 Dichroic prism 40 bracket 42 Prism bonding surface 44 Upper leg 46 Lower leg 48, 50 Joint surface part 60 plates 62 LCD mounting surface (element mounting surface) 64 Upper leg 66 Lower leg 68, 70 Joint surface part S solder (cream solder)

Front page continued (58) Fields surveyed (Int.Cl. ⁷ , DB name) G02B 7/00 G02F 1/1333

Claims (3)

(57) [Claims] 1. An optical-related element joining structure for joining a bracket to which a prism is attached and a plate to which a display element or an image pickup element is attached by soldering, wherein a joint surface portion of the bracket is formed in the bracket. It is formed at a position projecting outward from the prism mounting surface part and offset to the plate side from the prism mounting surface part, and the joint surface part of the plate is located at a position projecting outward from the element mounting surface part of the plate. When the bonding surface of the bracket and the bonding surface of the plate are arranged to face each other with a minute gap and solder is supplied between the bonding surfaces, the light from the xenon lamp is formed on both bonding surfaces. The soldering is performed by irradiating a beam to melt the solder. In the optical-related element joining structure, the joining surface portion of the joining surface portion of the bracket and the joining surface portion of the plate, which is located on the upstream side in the irradiation direction of the light beam, has the irradiation direction more than the other joining surface portion. The optical-related element bonding structure is characterized in that the projected area of is set to a small value. 2. The optical-related element bonding structure according to claim 1, wherein the material of the bracket and the plate is permalloy. 3. The optical-related element bonding structure according to claim 2, wherein the bonding surface of the bracket and the bonding surface of the plate are plated with solder.