JP3381598B2 - Manufacturing method of molded substrate - Google Patents
Manufacturing method of molded substrateInfo
- Publication number
- JP3381598B2 JP3381598B2 JP779298A JP779298A JP3381598B2 JP 3381598 B2 JP3381598 B2 JP 3381598B2 JP 779298 A JP779298 A JP 779298A JP 779298 A JP779298 A JP 779298A JP 3381598 B2 JP3381598 B2 JP 3381598B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- super engineering
- molded
- lead
- engineering plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000011347 resin Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 22
- 229920006351 engineering plastic Polymers 0.000 claims description 15
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 14
- 239000000088 plastic resin Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 5
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 5
- 239000003112 inhibitor Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 13
- 238000007747 plating Methods 0.000 description 12
- 238000000465 moulding Methods 0.000 description 10
- 230000003449 preventive effect Effects 0.000 description 8
- 239000011247 coating layer Substances 0.000 description 7
- 230000020169 heat generation Effects 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Description
【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明はリードフレームを成
形樹脂体によって所定のパターンで被覆して成る成形基
板の製造方法に関し、特に、発熱を抑えながら小型・軽
量化を図り、且つ、コストダウン及び電気的な信頼性の
向上を図った成形基板の製造方法に関する。
【０００２】
【従来の技術】従来の成形基板として、例えば、プレス
金型による打抜きによって形成され、電気部品が半田付
けされる半田付け部，及び外部回路に接続されるリード
を有したリードフレームを、半田付け部，及びリードを
露出しながら成形樹脂体によって被覆して構成されるも
のがある。
【０００３】リードフレームは、打抜き時の加工性を考
慮して、リン青銅，黄銅等の銅合金によって構成され、
表面に錫めっき層，或いは半田めっき層が形成されてい
る。
【０００４】成形樹脂体は、半田付け部への電気部品の
半田付け時の耐熱性を有したスーパーエンヂニアリング
プラスチック樹脂、例えば、ポリフェニレンサルファイ
ド樹脂（ＰＰＳ）によって構成されている。
【０００５】以上の構成を有する成形基板は、プレス金
型で所定のパターンに打抜きされたリードフレームを、
モールド金型内にリードを残して挿入した後、モールド
金型内にスーパーエンヂニアリングプラスチック樹脂を
注入し、これを固化させて成形樹脂体を形成し、更に成
形樹脂体に１５０〜１８０℃で数時間、熱処理を施し、
成形樹脂体の歪取りを行うことにより製造される。
【０００６】
【発明が解決しようとする課題】しかし、従来の成形基
板によると、リードフレームがリン青銅，黄銅等の銅合
金から構成されているため、導電率が低く、比較的大き
い電流を流すと発熱する。このため、リードフレームの
断面積を大きくして対策しているが、大型化，及び重量
の増加を招くという問題がある。
【０００７】また、従来の成形基板の製造方法による
と、リードフレームの表面に錫めっき層，或いは半田め
っき層を設けるため、コストアップを招くと共に、成形
樹脂体のモールド成形時にスーパーエンヂニアリングプ
ラスチック樹脂と一緒にめっき層が一部溶け、フレーム
間の成形樹脂体の中に金属異物として混入する恐れがあ
る。後者の問題はスーパーエンヂニアリングプラスチッ
ク樹脂のモールド成形時の温度が２５０℃以上と高温で
あるのに対し、めっき層の融点が錫めっき層で２３２
℃、半田めっき層で２１３℃とスーパーエンヂニアリン
グプラスチック樹脂の成形温度より低いことに起因す
る。このような現象が生じると、フレーム間の絶縁強度
が低下して短絡する等の不具合が発生する。めっき層を
省略してコストダウンを図ると共に成形樹脂体の中への
混入を防ぐようにすると、成形樹脂体の歪取りの熱処理
においてリードフレームの露出部が酸化するため、その
部分が変色する。
【０００８】従って、本発明の目的は発熱を抑えながら
小型・軽量化を図り、且つ、コストダウン及び電気的な
信頼性の向上を図ることができる成形基板の製造方法を
提供することである。
【０００９】
【課題を解決するための手段】本発明は上記の目的を達
成するため、所定の導電率を有した硬銅板を打抜いて複
数の半田付け部、及び複数のリードを有したリードフレ
ームを製造し、前記リードフレームの表面に防錆剤塗膜
層を形成し、前記リードフレームの前記半田付け部、及
び前記リードを露出して前記リードフレームを被覆する
ようにスーパーエンヂニアリングプラスチック樹脂をモ
ールド成形し、窒素ガス雰囲気にある熱処理用加熱槽内
で前記スーパーエンヂニアリングプラスチック樹脂に熱
処理を施して、前記スーパーエンヂニアリングプラスチ
ック樹脂の歪取りを行う成形基板の製造方法を提供する
ものである。
【００１０】
【００１１】
【００１２】
【００１３】
【００１４】
【００１５】
【発明の実施の形態】以下、本発明の成形基板の製造方
法を添付図面を参照しながら詳細に説明する。
【００１６】図１は本発明の第１の実施の形態の成形基
板を示す。この成形基板は、プレス金型による打抜きに
よって形成され、電気部品が半田付けされる複数の半田
付け部１Ａ，及び外部回路に接続される複数のリード１
Ｂを有したリードフレーム１と、リードフレーム１の表
面に形成された防錆剤塗膜層（後述）と、リードフレー
ム１の複数の半田付け部１Ａ，及び複数のリード１Ｂを
露出しながらリードフレーム１を被覆する成形樹脂体２
より構成されている。
【００１７】成形樹脂体２は、半田付け部１Ａへの電気
部品の半田付け時の耐熱性を有したスーパーエンヂニア
リングプラスチック樹脂、例えば、ポリフェニレンサル
ファイド樹脂（ＰＰＳ）によって構成されている。
【００１８】図２は成形樹脂体２によって被覆されるリ
ードフレーム１を示す。リードフレーム１は、比較的大
きい電流を流した時に発熱を抑えられる所定の導電率
（例えば、導電率９７％以上）を有した硬銅から構成さ
れ、プレス金型で打抜きされることにより前述した複数
の半田付け部１Ａ，及び複数のリード１Ｂが形成されて
いる。ここで、特に限定しないが、硬銅は酸素含有量１
０ｐｐｍ以下の無酸素銅である。
【００１９】図３は図２のリードフレーム１のＡ−Ａ線
断面の一部を示し、硬銅よりなるリードフレーム１の表
面に防錆剤塗膜層３が所定の厚さｔで形成されている。
防錆剤塗膜層３は、例えば、リードフレーム１を防錆剤
中に浸漬してリードフレーム１の表面に防錆剤を塗布す
ることにより形成され、厚さｔとして０．１〜０．８μ
ｍが設定される。防錆剤は、リードフレーム１の表面に
撥水性の有機膜を化学的に形成するものが好ましい。そ
のような防錆剤としては、ベンゾトリアゾール（川口製
薬社商品名「ドーガード」）等があるが、特にこれに限
定されるものではない。
【００２０】以下、本発明の第１の実施の形態の成形基
板の製造方法を説明する。
【００２１】まず、硬銅板をプレス金型で打抜くことに
より、図２に示す複数の半田付け部１Ａ，及び複数のリ
ード１Ｂを有したリードフレーム１を製造する。次に、
このリードフレーム１を防錆剤中に浸漬して、リードフ
レーム１の表面に防錆剤塗膜層３を所定の厚さｔで形成
する。この後、リードフレーム１をモールド金型（図示
せず）内にリード１Ｂを残して型入れした後、モールド
金型内にスーパーエンヂニアリングプラスチック樹脂を
注入し、これを固化させて成形樹脂体２を形成する。最
後に、窒素ガス雰囲気にある熱処理用加熱槽（図示せ
ず）内で成形樹脂体２に１５０〜１８０℃×数時間の熱
処理を施し、成形樹脂体２の歪取りを行って成形基板を
製造する。
【００２２】以上説明した成形基板及びその製造方法に
よると、リードフレーム１が所定の導電率（例えば、導
電率９７％以上）の硬銅によって構成されているため、
断面積を大きくしなくても比較的大きい電流を流した時
の発熱を抑えることができる。このため、小型・軽量化
を図ることができる。また、硬銅であるため打抜き時の
加工性を低下させることもない。また、リードフレーム
１の表面にめっき層が設けられていないため、コストダ
ウンを図れると共に、めっき層の混入がなくなるのでフ
レーム間の短絡が防げ、電気的な信頼性を向上させるこ
とができる。更に、リードフレーム１の表面に防錆剤塗
膜層３が形成されていると共に、製造時に成形樹脂体２
の歪取りの熱処理を窒素ガス雰囲気中で行って空気との
接触を避けるようにしたため、リードフレーム１にめっ
き層が設けられていなくても、リードフレーム１の露出
部の酸化・変色を防ぐことができる。
【００２３】
【発明の効果】以上説明した通り、本発明の成形基板の
製造方法によると、所定の導電率を有した硬銅によって
構成され、表面に防錆剤塗膜層が形成されたリードフレ
ームをスーパーエンヂニアリングプラスチック樹脂で被
覆し、スーパーエンヂニアリングプラスチック樹脂の歪
取りの熱処理を窒素ガス雰囲気中で行って構成したた
め、発熱を抑えながら小型・軽量化を図れ、且つ、コス
トダウン及び電気的な信頼性の向上を図ることができ
る。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding base formed by covering a lead frame with a molding resin body in a predetermined pattern.
It relates to a method of manufacturing a plate, in particular, while suppressing heat generation reducing size and weight, and to a method for producing a molded board with improved cost and electrical reliability. 2. Description of the Related Art As a conventional molded substrate, for example, a lead frame formed by punching with a press die and having a soldered portion to which an electric component is soldered and a lead connected to an external circuit is used. , A soldered portion and a lead are exposed and covered with a molded resin body. The lead frame is made of a copper alloy such as phosphor bronze or brass in consideration of workability at the time of punching.
A tin plating layer or a solder plating layer is formed on the surface. [0004] The molding resin body is made of a super engineering plastic resin, for example, polyphenylene sulfide resin (PPS) having heat resistance when soldering the electric component to the soldering portion. [0005] The molded substrate having the above structure is obtained by forming a lead frame punched into a predetermined pattern by a press die,
After inserting the lead into the molding die, super engineering plastic resin is injected into the molding die, and solidified to form a molding resin body. , Heat treated,
It is manufactured by performing a strain relief on a molded resin body. However, according to the conventional molded substrate, since the lead frame is made of a copper alloy such as phosphor bronze or brass, the conductivity is low and a relatively large current flows. It generates heat. For this reason, measures have been taken to increase the cross-sectional area of the lead frame, but there is a problem that the size and weight of the lead frame are increased. Further, according to the conventional method of manufacturing a molded substrate, a tin plating layer or a solder plating layer is provided on the surface of the lead frame, so that the cost is increased and the super engineering plastic resin is used during molding of the molded resin body. At the same time, there is a possibility that the plating layer is partially melted and mixed as metal foreign matter into the molded resin body between the frames. The latter problem is that the temperature during molding of the super engineering plastic resin is as high as 250 ° C. or higher, while the melting point of the plating layer is 232 in the tin plating layer.
° C, 213 ° C in the solder plating layer, which is lower than the molding temperature of the super engineering plastic resin. When such a phenomenon occurs, problems such as a short circuit due to a decrease in insulation strength between frames occur. If the plating layer is omitted to reduce the cost and prevent the resin from being mixed into the molded resin body, the exposed portion of the lead frame is oxidized in the heat treatment for removing the distortion of the molded resin body, and the portion is discolored. It is therefore an object of the present invention is reduced in size and weight while suppressing heat generation, and is to provide a method for producing a molded board which can improve the cost and electrical reliability . According to the present invention, in order to achieve the above object, a hard copper plate having a predetermined electric conductivity is punched out to form a plurality of pieces.
Number of soldering parts and lead frames with multiple leads
A rust inhibitor coating on the surface of the lead frame.
Forming a layer, the soldered portion of the lead frame, and
Exposing the lead and covering the lead frame
To super engineering plastic resin
In a heat treatment tank for heat treatment in a nitrogen gas atmosphere
Heat the super engineering plastic resin
After processing, the Super Engineering Plastics
An object of the present invention is to provide a method of manufacturing a molded substrate for removing a distortion of a resin block . [0010] [0011] [0012] [0013] [0014] DETAILED DESCRIPTION OF THE INVENTION Hereinafter, will be explained in detail with the manufacturing method of the molded board with reference to the accompanying drawings of the present invention. FIG. 1 shows a molded substrate according to a first embodiment of the present invention. The molded substrate is formed by punching with a press die, and includes a plurality of soldering portions 1A to which electric components are soldered and a plurality of leads 1 connected to an external circuit.
B, the lead frame 1, a rust preventive coating layer (described later) formed on the surface of the lead frame 1, a plurality of soldered portions 1 </ b> A of the lead frame 1, and a plurality of leads 1 </ b> B while exposing the leads 1 </ b> B. Molded resin body 2 covering frame 1
It is composed of The molding resin body 2 is made of a super engineering plastic resin, for example, polyphenylene sulfide resin (PPS) having heat resistance when soldering the electric component to the soldering portion 1A. FIG. 2 shows a lead frame 1 covered with a molded resin body 2. The lead frame 1 is made of hard copper having a predetermined conductivity (for example, a conductivity of 97% or more) capable of suppressing heat generation when a relatively large current flows, and is described above by being punched by a press die. A plurality of solder portions 1A and a plurality of leads 1B are formed. Here, although not particularly limited, the hard copper has an oxygen content of 1
Oxygen-free copper of 0 ppm or less. FIG. 3 shows a part of a cross section taken along the line AA of the lead frame 1 shown in FIG. 2, and a rust preventive agent coating layer 3 having a predetermined thickness t is formed on the surface of the lead frame 1 made of hard copper. ing.
The rust preventive coating layer 3 is formed, for example, by immersing the lead frame 1 in the rust preventive and applying the rust preventive to the surface of the lead frame 1. 8μ
m is set. It is preferable that the rust inhibitor chemically forms a water-repellent organic film on the surface of the lead frame 1. Examples of such a rust preventive include benzotriazole (trade name of “Dogard” by Kawaguchi Pharmaceutical Co., Ltd.) and the like, but are not particularly limited thereto. Hereinafter, a method of manufacturing a molded substrate according to the first embodiment of the present invention will be described. First, a lead frame 1 having a plurality of soldering portions 1A and a plurality of leads 1B shown in FIG. 2 is manufactured by punching a hard copper plate with a press die. next,
The lead frame 1 is immersed in a rust inhibitor to form a rust inhibitor coating layer 3 on the surface of the lead frame 1 with a predetermined thickness t. Thereafter, the lead frame 1 is put into a mold (not shown) while leaving the leads 1B, and then a super engineering plastic resin is injected into the mold and solidified to form the molded resin body 2. Form. Finally, the molded resin body 2 is subjected to a heat treatment at 150 to 180 ° C. for several hours in a heat treatment heating tank (not shown) in a nitrogen gas atmosphere, and the molded resin body 2 is distorted to produce a molded substrate. I do. According to the molded substrate and the method of manufacturing the same described above, since the lead frame 1 is made of hard copper having a predetermined conductivity (for example, a conductivity of 97% or more),
Heat generation when a relatively large current flows can be suppressed without increasing the cross-sectional area. For this reason, the size and weight can be reduced. Further, since it is hard copper, the workability at the time of punching is not reduced. Further, since the plating layer is not provided on the surface of the lead frame 1, the cost can be reduced, and the mixing of the plating layer can be prevented, so that the short circuit between the frames can be prevented, and the electrical reliability can be improved. Further, a rust preventive coating layer 3 is formed on the surface of the lead frame 1 and the molded resin body 2
To prevent oxidation and discoloration of the exposed portion of the lead frame 1 even if the lead frame 1 is not provided with a plating layer because the heat treatment for removing the strain is performed in a nitrogen gas atmosphere to avoid contact with air. Can be. [0023] As described in the foregoing, according to the <br/> method of manufacturing a molded board of the present invention is constituted by the hard copper having a predetermined conductivity, rust preventive coating layer on the surface The lead frame on which is formed is coated with super engineering plastic resin, and the heat treatment for removing the distortion of the super engineering plastic resin is performed in a nitrogen gas atmosphere, so that it is possible to reduce the size and weight while suppressing heat generation and reduce costs. In addition, the electrical reliability can be improved.
【図面の簡単な説明】
【図１】本発明の第１の実施の形態に係る成形基板を示
す説明図。
【図２】第１の実施の形態に係るリードフレームを示す
説明図。
【図３】図２のＡ−Ａ線断面を示す断面図。
【符号の説明】
１ リードフレーム
１Ａ 半田付け部
１Ｂ リード
２ 成形樹脂体
３ 防錆塗膜層BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory view showing a molded substrate according to a first embodiment of the present invention. FIG. 2 is an explanatory view showing a lead frame according to the first embodiment. FIG. 3 is a sectional view showing a section taken along line AA of FIG. 2; [Explanation of Signs] 1 Lead frame 1A Soldering part 1B Lead 2 Molded resin body 3 Rust prevention coating layer
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ Ｂ２９Ｋ 705:10 Ｂ２９Ｋ 705:10 Ｂ２９Ｌ 31:34 Ｂ２９Ｌ 31:34 (72)発明者 仁平 潔 茨城県日立市川尻町４丁目10番１号 日 立電線加工株式会社内 (56)参考文献 特開 平７−329104（ＪＰ，Ａ) 特開 昭56−62966（ＪＰ，Ａ) 特開 平９−39022（ＪＰ，Ａ) 特開 平７−254624（ＪＰ，Ａ) 特開 平９−8177（ＪＰ，Ａ) 特開 平11−195851（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) B29C 45/00 - 45/84 B29C 71/02 H05K 3/00 ────────────────────────────────────────────────── ─── Continued on the front page (51) Int.Cl. 7 Identification code FI B29K 705: 10 B29K 705: 10 B29L 31:34 B29L 31:34 (72) Inventor Kiyoshi Nihei 4-chome, Kawajiri-cho, Hitachi City, Ibaraki Prefecture No. 1 Inside Hitachi Cable Processing Co., Ltd. (56) References JP-A-7-329104 (JP, A) JP-A-56-62966 (JP, A) JP-A-9-39022 (JP, A) JP JP-A-7-254624 (JP, A) JP-A-9-8177 (JP, A) JP-A-11-195851 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) B29C 45 / 00-45/84 B29C 71/02 H05K 3/00
Claims (1)
数の半田付け部、及び複数のリードを有したリードフレ
ームを製造し、前記リードフレームの表面に防錆剤塗膜
層を形成し、前記リードフレームの前記半田付け部、及
び前記リードを露出して前記リードフレームを被覆する
ようにスーパーエンヂニアリングプラスチック樹脂をモ
ールド成形し、窒素ガス雰囲気にある熱処理用加熱槽内
で前記スーパーエンヂニアリングプラスチック樹脂に熱
処理を施して、前記スーパーエンヂニアリングプラスチ
ック樹脂の歪取りを行うことを特徴とする成形基板の製
造方法。 (57) [Claims] [Claim 1] A hard copper plate having a predetermined conductivity is punched and
Number of soldering parts and lead frames with multiple leads
A rust inhibitor coating on the surface of the lead frame.
Forming a layer, the soldered portion of the lead frame, and
Exposing the lead and covering the lead frame
To super engineering plastic resin
In a heat treatment tank for heat treatment in a nitrogen gas atmosphere
Heat the super engineering plastic resin
After processing, the Super Engineering Plastics
Production of molded substrates characterized by removing the distortion of the block resin
Construction method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP779298A JP3381598B2 (en) | 1998-01-19 | 1998-01-19 | Manufacturing method of molded substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP779298A JP3381598B2 (en) | 1998-01-19 | 1998-01-19 | Manufacturing method of molded substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11198176A JPH11198176A (en) | 1999-07-27 |
| JP3381598B2 true JP3381598B2 (en) | 2003-03-04 |
Family
ID=11675514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP779298A Expired - Fee Related JP3381598B2 (en) | 1998-01-19 | 1998-01-19 | Manufacturing method of molded substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3381598B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5388658B2 (en) * | 2009-04-02 | 2014-01-15 | 三菱エンジニアリングプラスチックス株式会社 | Composite molded article and manufacturing method thereof |
| WO2022172544A1 (en) * | 2021-02-09 | 2022-08-18 | ポリプラスチックス株式会社 | Method for producing insert molded article, insert molded article, and method for producing insert molded article with reduced distortion |
-
1998
- 1998-01-19 JP JP779298A patent/JP3381598B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11198176A (en) | 1999-07-27 |
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