JP3362007B2 - Semiconductor device, method of manufacturing the same, and tape carrier - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, a method of manufacturing the same, and a tape carrier used for the same, and more particularly to a resin-sealed semiconductor device of a chip size package.

[0002]

2. Description of the Related Art Conventionally, in this type of package, a printed circuit board or a lead frame is used as a base for die-bonding, and the IC is electrically connected to the outside by wire bonding. In general, it was formed by polishing, etc., so as to be closer to the chip size.

[0003]

However, in order to secure a bonding area on the side of the substrate and the lead frame for wire bonding, the package size after completion becomes larger than the size of the IC chip in both XY directions. There was a flaw.

Regarding the package thickness, it is necessary to cover all the IC chips and wires during resin sealing. In addition to this, the thickness of the IC chip alone is about 0.25 mm to 0.35 mm because of the substrate thickness and the like, but there is a problem that it becomes about 1.0 mm in the packaged state.

[0005]

In order to solve the above problems, the present invention seals the main surface of an IC chip on which pads and bumps are formed with a resin layer, and an external connection electrode provided on the resin layer. The pads and bumps are electrically connected by an output pattern.

[0006]

FIG. 1 is a perspective view showing a first embodiment of the present invention. The semiconductor device includes an IC chip 1, a resin layer 2 formed on an upper surface of the IC chip 1, and external connection electrodes provided thereon, for example, balls 3 made of solder.
And an output pattern 4 for establishing electrical continuity between the ball 3 and the pads and bumps formed on the IC chip 1.

FIG. 2 is an enlarged sectional view of the portion A in FIG. I
Pads and bumps 5 obtained by subjecting the electrode pads to bump processing are formed on the main surface of the C chip 1, and the output patterns 4 are bonded to the pads and bumps 5.

The resin layer 2 is formed so as to seal the main surface of the IC chip 1, and the balls 3 attached to the output patterns 4 exposed on the surface are provided on the resin layer 2. ing.

The ball 3, the pad and the bump 5 are made of the resin layer 2
Conduction is established through the output pattern 4.

The external connection electrode described as the ball 3 is not limited to a spherical shape, and may be a projection shape if it is used for external connection.

However, considering the current workability and reflowability, solder balls are most suitable.

3 to 7 are views showing a manufacturing method according to the first embodiment of the present invention, and each step is shown in a sectional view.

FIG. 3 shows a tape carrier, in which a thermocompression bonding pattern 7 is formed on the front surface of the heat resistant tape 6 and an output pattern 4 is formed on the back surface so as to face the thermocompression bonding pattern 7.
And a resin stop pattern 8 is formed so as to surround the output pattern 4.

Further, the heat resistant tape 6 is provided with a resin filling hole 9 for injecting a resin. The resin stop pattern 8 has the function of suppressing an unnecessary flow of resin when the resin is filled.

The tape carrier thus formed is prepared, and the IC chip 1 having the pads and bumps 5 formed on the main surface is prepared.

In FIG. 4, TAB (Tape Autom)
The tape carrier is positioned on the IC chip 1 by the aged bonding technique, and the output pattern 4 and the pads and bumps 5 are bonded by thermocompression bonding with the TAB tool 10.

In FIG. 5, the liquid sealing resin is injected from the nozzle 12 of the dispenser 11 through the resin filling hole 9 of the through hole formed in the heat resisting tape 6 and the heat resisting tape 6 and I.
The space between the main surface of the C chip 1 and the main surface of the IC chip 1 is filled with resin, heat-treated and cured to form a resin layer 2, and the main surface of the IC chip 1 is resin-sealed.

Since the resin stopper pattern 8 is formed when the liquid sealing resin is filled, the resin does not flow over the edge of the IC chip 1.

When the height of the resin stop pattern 8 is increased to the position of the main surface of the IC chip 1, the liquid resin is surely stopped at the edge, which is desirable, but even at the position shown in the figure, Since the liquid resin is sucked up to the heat-resistant tape 6 side by the capillary phenomenon, it does not cross the edge.

Further, when the liquid sealing resin is cured, in the case of a resin containing a solvent component, the resin is deformed by volatilization of the solvent and a volume change occurs after drying.
That is, a sealing resin that does not change in volume is desirable.

In FIG. 6, the tape carrier and the IC chip 1 are separated. At this time, the output pattern 4 formed on the heat resistant tape 6 is transferred to the IC chip 1 side while being bonded to the pads and bumps 5.

After that, a plating process is performed on the upper portion of the output pattern 4 transferred in FIG. 7, that is, the ball attaching portion exposed on the resin layer 2, and the balls 3 are attached to obtain a semiconductor device of a chip size package. To be

As described above, according to the first embodiment,
It is possible to make a chip-size package which is smaller in outer size and thinner than a conventional package and suitable for surface mounting, and it is possible to obtain an effect of increasing the mounting density during surface mounting.

FIG. 8 is a perspective view showing a second embodiment of the present invention. In the first embodiment, the position changing pattern 13 of the ball 3 is added to the output pattern 4 so that a part of the ball is formed. The only difference is that the mounting position of 3 is changed.

9 and 10 are views showing a manufacturing method according to the second embodiment of the present invention, and each step is shown in a sectional view.

FIG. 9 shows a tape carrier, which is added to the output pattern 4 formed on the surface of the heat-resistant tape 6 to change the position of the ball 3.
A pattern 13 for changing the position of the ball 3 is formed. Others are the same as those in the first embodiment.

Using this tape carrier, as in the first embodiment, the tape carrier and the IC chip 1 are thermocompression-bonded to each other, and the output pattern 4, pads and bumps 5 are formed.
Are bonded, the resin is filled and cured, the main surface of the IC chip 1 is resin-sealed, the tape carrier is peeled off, and the output pattern 4 and the position changing pattern 13 are transferred to the IC chip 1 side, As shown in FIG. 10, the position changing pattern 13 is plated and the balls 3 are attached.

As described above, according to the second embodiment,
In addition to the effect of the first embodiment, the position changing pattern 1
Since 3 is formed, the position of the ball 3 of the electrode for external connection can be easily changed.

FIG. 11 is a perspective view showing a third embodiment of the present invention, and FIG. 12 is an enlarged sectional view of a B part in FIG. This is largely different from the first embodiment in that the heat resistant tape 14 remains.

Pads and bumps 5 are formed on the main surface of the IC chip 1, and an output pattern 4 is bonded to the pads and bumps 5.

The resin layer 2 includes the heat resistant tape 14 and the IC chip 1.
The heat-resistant tape 14 remains on the upper surface of the resin layer 2 without being peeled off.

A thermocompression bonding pattern 7 is formed on the surface of the heat resistant tape 14, and balls 3 of external connection electrodes are attached to the upper surface thereof.

On the back surface of the heat-resistant tape 14, an output pattern 4 and a resin stop pattern 8 are formed so as to surround the output pattern 4. In the example shown in the figure, the resin stop pattern 8 is left.

The thermocompression bonding pattern 7 and the output pattern 4 are provided with through holes 15 formed in the heat resistant tape 14.
Has been conducted by.

13 to 17 are views showing a manufacturing method according to the third embodiment of the present invention, and each step is shown in a sectional view.

FIG. 13 shows a tape carrier,
The tape carrier of the first embodiment is the same as the tape carrier of the first embodiment except that a through hole 15 for establishing electrical connection between the thermocompression bonding pattern 7 and the output pattern 4 is provided.

As in the first embodiment, in FIG.
Thermocompression bonding is performed using a tool 10 to bond the output pattern 4 to the pads and bumps 5. In FIG. 15, the liquid sealing resin is injected from the nozzle 12 of the dispenser 11 through the resin filling hole 9, and the heat resistant tape 14 is used. Between the IC chip 1 and the IC chip 1 is filled, heat-treated and cured to form the resin layer 2,
The main surface of the IC chip 1 is resin-sealed.

In FIG. 16, the punch carrier 16 is used to separate the tape carrier, that is, the heat-resistant tape 14 in accordance with the outer shape of a predetermined package.

In the illustrated example, the outer shape of the package has the resin stop pattern 8 left. However, the resin stop pattern 8 may not be left and the individual pieces may be cut into the same size as the IC chip 1. Of course.

In FIG. 17, after the individual pieces are cut out, the thermocompression bonding pattern 7 is plated and the balls 3 are attached to complete the process.

As in the second embodiment, the ball 3
The position changing pattern 13 can be formed as required.

As described above, according to the third embodiment, in addition to the effect of the first embodiment, since the heat-resistant tape 14 is used as it is in the package, it has excellent impact resistance,
A highly reliable semiconductor device can be obtained.

FIG. 18 is a sectional view showing the tape carrier of the present invention, and FIG. 19 is a plan view of the same.

A thermocompression bonding pattern 7 is formed on the front surface of the heat-resistant tape 6, and an output pattern 4 is formed on the back surface so as to face the thermocompression bonding pattern 7 so that the output pattern 4 is surrounded. A resin stopper pattern 8 is formed in a frame shape, and a resin filling hole 9 for injecting resin is formed in the central portion.

The heat-resistant tape 6 is made of heat-resistant synthetic resin,
On the front and back surfaces, a thermosetting adhesive 17 for fixing the metal foil which is the base material of each pattern is provided.

The output pattern 4 plays a role of establishing electrical continuity with the outside in place of the inner lead and the outer lead in a semiconductor device having a lead frame.

The output pattern 4 is an IC
It has a stand-off function of forming a gap for resin filling when the chip and the tape carrier are joined.

The thermocompression bonding pattern 7 is used to bond the output pattern 4 and the pads and bumps 5 (FIG. 2 etc.) of the IC chip by thermocompression bonding with a TAB tool.

The thermocompression bonding pattern 7 in the case of the third embodiment functions as it is as an output pattern during ball mounting.

The resin stopper pattern 8 serves as a stopper so as not to protrude from the edge of the IC chip when the liquid sealing resin is injected and filled, and its height is at the position shown in the figure or at the IC chip. To the edge, that is, the height of the output pattern 4 or higher.

The tape feed holes 18 provided on both sides of the heat resistant tape 6 are for carrying the tape carrier.

To prepare the tape carrier, first, the heat-resistant tape 6 is coated with the adhesive 17 for fixing the metal foil, and the resin filling hole 9 and the tape feed hole 18 are punched out.

On the front and back surfaces of the heat-resistant tape 6, a metal foil which is a base material of each pattern is laminated, and then a thermocompression bonding pattern 7, an output pattern 4 and a resin stopping pattern 8 are formed by an etching technique.

At this time, in order to ensure that the height of the output pattern 4 is high enough to be filled with the resin, the metal for the output pattern 4 on the rear surface is more than the metal foil on the front surface for the thermocompression bonding pattern 7. Use thick foil.

Each pattern may be formed by screen printing using a conductive paste or the like instead of etching the metal foil.

In addition, for the third embodiment, it goes without saying that it is necessary to form the through hole 15 for connecting the thermocompression bonding pattern 7 and the output pattern 4 by a known technique before pattern formation. Yes.

The first to third embodiments described above can be realized by using the tape carrier formed as described above.

[0058]

As described above, according to the present invention, the main surface of the IC chip is resin-sealed, and the electrodes for external connection on the resin layer and the pads and bumps of the IC chip are electrically connected by an output pattern or the like. Since this is done, it is possible to realize a chip size package having a small outer shape and suitable for thin surface mounting.

[Brief description of drawings]

FIG. 1 is a perspective view showing a first embodiment of the present invention.

FIG. 2 is an enlarged sectional view of part A of FIG.

FIG. 3 is a view showing the manufacturing method according to the first embodiment (No. 1).

FIG. 4 is a diagram showing the manufacturing method according to the first embodiment (No. 2).

FIG. 5 is a view showing the manufacturing method according to the first embodiment (No. 3).

FIG. 6 is a view showing the manufacturing method according to the first embodiment (No. 4).

FIG. 7 is a view showing the manufacturing method according to the first embodiment (No. 5).

FIG. 8 is a perspective view showing a second embodiment of the present invention.

FIG. 9 is a view showing the manufacturing method according to the second embodiment (No. 1).

FIG. 10 is a view showing the manufacturing method according to the second embodiment (No. 2).

FIG. 11 is a perspective view showing a third embodiment of the present invention.

FIG. 12 is an enlarged sectional view of part B in FIG.

FIG. 13 is a view showing the manufacturing method according to the third embodiment (No. 1).

FIG. 14 is a view showing the manufacturing method according to the third embodiment (No. 2).

FIG. 15 is a view showing the manufacturing method according to the third embodiment (No. 3).

FIG. 16 is a view showing the manufacturing method according to the third embodiment (No. 4).

FIG. 17 is a view showing the manufacturing method according to the third embodiment (No. 5).

FIG. 18 is a sectional view showing a tape carrier of the present invention.

FIG. 19 is a plan view showing a tape carrier of the present invention.

[Explanation of symbols]

1 IC chip 2 resin layers Three balls 4 Output patterns 5 Pads and bumps 6,14 Heat resistant tape 7 Thermocompression bonding pattern 8 resin stop pattern 9 Resin filling hole 13 Position change pattern 15 through holes 17 Adhesive

Claims (8)

(57) [Claims] 1. An IC having pads and bumps formed on its main surface
Step of preparing the chip, forming a thermocompression bonding pattern on the surface of the heat resistant tape, forming an output pattern facing the thermocompression bonding pattern on the surface, and resin-fixing so as to surround the output pattern Forming a pattern and preparing a tape carrier having a resin filling hole for injecting a resin; heating the output pattern and the pads and bumps of the IC chip by using the thermocompression bonding pattern; A step of press-bonding and joining, a step of injecting a resin between the tape carrier and the IC chip through the resin filling hole and curing the resin to seal the main surface of the IC chip with a resin, A step of peeling the IC chip and transferring the output pattern to the IC chip side; and The method of manufacturing a semiconductor device characterized by comprising a step of providing a part connecting electrode. 2. An IC having a pad and a pump formed on its main surface.
The process of preparing the chip and forming the thermocompression bonding pattern on the surface of the heat resistant tape,
Output putter facing the thermocompression bonding pattern
And the position change added to the output pattern
And the output pattern and the output pattern and
And a resin stop pattern to surround the position change pattern.
Formed and formed a resin filling hole for injecting resin
The process of preparing a tape carrier and the output pattern using the thermocompression bonding pattern
The turn and the pads and bumps of the IC chip are thermocompression bonded
And joining the tape carrier and the IC carrier through the resin filling hole.
Resin is injected between the IC chip and
The step of sealing the main surface of the resin with a resin, and the tape carrier and the IC chip are peeled off.
The output pattern and the position changing pattern are the IC
The step of transferring to the chip side, and the external connection electrode on the transferred position changing pattern
And a step of providing the semiconductor device. 3. An IC having a pad and a pump formed on its main surface.
Step of preparing the chip, forming a thermocompression bonding pattern on the surface of the heat-resistant tape, forming an output pattern on the back surface facing the thermocompression bonding pattern, and then forming the thermocompression bonding pattern and the output pattern Forming a through hole for electrical continuity with, forming a resin stop pattern so as to surround the output pattern, and preparing a tape carrier having a resin filling hole for injecting resin, Thermocompression-bonding the output pattern to the pads and bumps of the IC chip using a crimping pattern, and injecting resin between the tape carrier and the IC chip through the resin filling hole , A step of curing and encapsulating the main surface of the IC chip with a resin, and a step of separating the tape carrier into pieces according to the outer shape of the package And a step of providing an electrode for external connection on the thermocompression bonding pattern, the method for manufacturing a semiconductor device. 4. A heat resistant tape, a thermocompression bonding pattern formed on the surface of the heat resistant tape, an output pattern formed on the back surface of the heat resistant tape so as to face the thermocompression bonding pattern, and the output. A tape carrier, comprising: a resin stopper pattern formed so as to surround the pattern for use with a resin, and a resin filling hole provided in the heat resistant tape. 5. The height of the output pattern is
The tape carrier according to claim 4 , wherein the tape carrier is formed to have a height higher than that of the thermocompression bonding pattern. 6. The method of claim 4 or 5, wherein the tape carrier is characterized in that the formation of the through-holes obtain conductivity between the output pattern and the heat crimping pattern. 7. The manufacturing method according to claim 1.
A semiconductor device manufactured by the method. 8. The tape according to any one of claims 4 to 6.
Semiconductor device characterized by being manufactured using a carrier
Place