JP3356256B2 - Electronic component mounting method and mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component to be mounted on a substrate by means of a suction nozzle, in particular, the width and length of a lead are smaller than the height of components such as an air-core coil, and the component is parallel to the substrate surface. For electronic components that not only cause displacement in the X, Y, and θ directions within a simple plane but also cause a vertical displacement that is also inclined in a direction inclined with respect to the substrate surface, the electronic components in the suction state for mounting are imaged. By performing image processing on image data,
Recognizes the dimensions, direction, position, and inclination of electronic components in the suction state, targets only those parts that satisfy the specified conditions, dimensions, and inclinations, and mounts them precisely to the required mounting position based on the recognition result. Method and apparatus.

[0002]

2. Description of the Related Art In order to mount an electronic component such as a flat package at a contact point on a substrate, an image of the electronic component sucked by a suction nozzle is taken, and X, Y, and θ of the electronic component are picked up by an image processing device.
It is well known to detect the amount of displacement in a direction, correct the position, and mount the device.

[0003] As an image processing method, there is Japanese Patent Application Laid-Open No. 62-86789 by the applicant of the present invention. By using this image processing method, the state of the lead of an electronic component can be accurately recognized, and the amount of displacement can be reduced. Can be detected. Further, an improved image processing method disclosed in JP-A-4-225300 is also provided. Japanese Patent Application Laid-Open No. Hei 3-2708 by the assignee of the present invention discloses a mounting apparatus equipped with these image processing apparatuses.
No. 93 publication.

The electronic components mounted on a substrate have misalignments in the X, Y, and θ directions in a plane parallel to the substrate surface, and leads mounted on contacts on the substrate surface are inclined with respect to the substrate surface. Some of them have a vertical deviation having an inclination α called rolling, and a typical example thereof is an air-core coil. Regarding the nozzle that sucks the air-core coil, the vertical deviation caused by the rolling that occurs when the air-core coil is sucked is prevented by the mechanical structure of the nozzle.
199 publication.

[0005]

An electronic component is sucked by a suction nozzle, a state of the sucked electronic component is imaged by a TV camera, and the image data is subjected to image processing to determine a shift amount relating to the position and direction of the electronic component. It is common practice to detect and correct the amount of displacement before mounting on a substrate. The target electronic components here are, as in flat package ICs, the leads extending from the main body are a relatively wide plurality of leads extending in parallel, and the contact between the surface adsorbed by the suction nozzle and the substrate mounting surface of the lead In this case, a measurement line perpendicular to the row of leads is set using the captured image data, and the center position of the component and the angular deviation of the component, that is, the center of the suction nozzle, are set. Position deviations ΔX and ΔY between the position and the center of the component, and deviations in the direction with respect to the reference X or Y axis, that is, the angle deviation Δθ are detected. If these shift amounts are known, the shift amounts can be corrected and mounting can be performed with high accuracy.

In the case of the flat package IC described above, the shift amounts ΔX, ΔY, Δθ in a plane parallel to the substrate
Since the image data obtained by imaging a plurality of leads with a wide width is used for the detection of the lead, it is easy to detect the coordinate value of the edge portion of the lead, and since the leads are plural and extend in parallel from the main body, Also, it is easy to set the lead and the measurement line to be orthogonal using a plurality of lead coordinates, and the deviation amounts ΔX, ΔY, and Δθ can be calculated with high accuracy.

However, in electronic components such as air-core coils,
The width and length of the lead are smaller than the height of the component, and the component is not only displaced in the X, Y, and θ directions in a plane parallel to the board surface, but also inclined in the direction inclined to the board surface. Since vertical displacement occurs, it is difficult to process the image data of the electronic component in the sucked state and accurately recognize the posture and position. Therefore, the electronic component is accurately mounted at the required mounting position based on the recognition result. I couldn't do that.

FIG. 3 shows this situation. For example, the center position (x ₀ , y ₀ ) in the plane parallel to the substrate surface is caused by the displacement caused by the air-core coil sucked by the suction nozzle. Due to the presence or absence of a positional deviation indicating whether or not the object is at the specified position, the direction deviation indicating whether the component direction θ ₀ is oriented in the specified direction, and the unevenness of the air flow for suction. longitudinally displaced forms an inclination alpha ₀ between the substrate surface of the lead by shake called rolling, read narrow with θ direction generated because a round wire of the lead can not be identified with alpha-direction bending or float also legitimate referred Deviation from state θ ₁ and α ₁
And the amount of deviation is determined by processing image data to X, Y,
James be detected and recognized distinguish between θ direction and α direction
Kashiku, the correction amount for this reason also implemented a problem that can not be calculated.

As a method of processing such image data, there is a recognition method called pattern matching. In this method, image data obtained by capturing an image of a target component;
The image data of the model input in advance is compared with the pixel at the corresponding position to determine the match rate of the two based on the degree of coincidence. In this method, an error (noise) is generated in the reference model. If there is, the accuracy and the match rate of the comparison result are meaningless, so it takes time to specify (set) the model, and further, image data of the model is input and stored in advance. Therefore, the image processing apparatus needs to have not only a sufficient storage capacity but also a long time because of the large number of pixels to be compared.

The present invention solves the above-mentioned problems, and the width and length of a lead are smaller than the height of a component, such as an electronic component typified by an air-core coil, and correspond to a diagonal. Even if a part has a pair of thin leads extending only from the position, the TV camera captures an image of the electronic part that does not need image data of the model and is likely to cause vertical displacement, positional deviation, and direction deviation due to bending of the lead, suction. Utilizing the image data obtained, the dimensions of the target electronic component are determined, the directional deviation is calculated, the inclination with respect to the board surface is determined, and only the electronic component determined to be within the allowable range has the center position. It is an object of the present invention to provide a method and an apparatus capable of calculating and correcting a shift in the X and Y directions and accurately mounting the board at a mounting position of a board. Accordingly, since a component having an incorrect size or a suction state is ejected and a positional shift is corrected and mounted only for a regular component, the mounting operation can be performed efficiently.

[0011]

SUMMARY OF THE INVENTION The present invention relates to a suction nozzle.
Image data obtained by imaging an electronic component in the adsorption state is adsorbed processed by the image processing apparatus, to correct the deviation amount by recognizing the position and direction and inclination of the electronic component, the method of mounting the substrate, images data Of the coordinate values of the distance between two points indicating the maximum coordinate value and the minimum coordinate value in the X-axis direction, and the distance between the two points indicating the maximum coordinate value and the minimum coordinate value in the Y-axis direction.
The distance between any two large points is defined as the maximum distance between the two points, and the distance between the two end positions of the lead at the diagonal position of the electronic component. Comparing the distances of the electronic components and determining the electronic components within the specified range. Then, at least two points obtained by tracing a predetermined distance from the end position on the image data and the end position are included. A process of calculating a deviation angle amount Δθ from a predetermined direction, taking the direction of the straight line as the direction of the electronic component, and four sides of a contour right angle surrounding the electronic component from the straight line and the end position of the lead at a diagonal position A step of forming a shape, and a step of discriminating that an electronic component whose inclination with respect to the substrate surface is within an allowable range is satisfied by comparing the length of each side of the contour right quadrangle with a predetermined range given in advance, Center position (x ₀ , y ₀ ) of outline quadrilateral
Calculating the shift amounts ΔX and ΔY from a predetermined range given as a center position of the electronic component;
Through the process of correcting the θ and the deviation amounts ΔX and ΔY, the purpose of accurately mounting the electronic component at the mounting position of the board can be achieved.

According to a second aspect of the present invention, suction is performed by a suction nozzle.
An image processing apparatus processes image data obtained by capturing an electronic component mounted on the substrate in the sucked state, and among coordinate values on the image data, a point between two points indicating a maximum coordinate value and a minimum coordinate value in the X-axis direction. And the distance between two points indicating the maximum coordinate value and the minimum value coordinate value in the Y-axis direction, whichever is greater, is defined as the maximum distance between two points. A means for recognizing the end position as a distance between two points and a means for comparing a predetermined range given in advance with a maximum distance between two points to determine the size of the electronic component are provided, and are determined to be within the specified range. For the electronic component, the direction of a straight line including at least two points and the end position obtained by tracing a predetermined distance from the end position on the image data as a starting point on the image data is defined as a direction of the electronic component, and a predetermined direction given in advance. Means for calculating the deviation angle amount Δθ of Means for forming a contour quadrilateral surrounding the electronic component from the line and the end position of the lead at a diagonal position, and comparing the length of each side of the contour quadrilateral with a predetermined range given in advance. Means for discriminating the electronic component whose inclination with respect to the substrate surface is within a specified range, and a specified range in which the center position (x ₀ , y ₀ ) of the outline quadrilateral is given in advance as the center position of the electronic component. By using a device having means for calculating the shift amounts ΔX and ΔY, and means for correcting the shift angle amounts Δθ and the shift amounts ΔX and ΔY, it is possible to achieve the object of accurately mounting the electronic component at the mounting position of the board. .

The above will be described with reference to FIG. When image data obtained by imaging the air-core coil (21), which is an electronic component, is displayed on a screen, the shape is as shown in FIG. In addition, in imaging the air-core coil in the attracted state, a pair of leads extending from a diagonal in comparison with the height dimension of the object is thin, and it is difficult to image with reflected light that has been conventionally used well.
In the present invention, image data of a shadow (silhouette) of transmitted light using the EL element shown in the imaging example of FIG. 4 is used.

First, among the coordinate values obtained from the image data, the maximum coordinate in the X-axis direction is obtained from the coordinates of the four points (a, b + 1, c, d + 1) of the maximum value and the minimum value in the X-axis direction and the Y-axis direction. The point (c) indicating the value and the minimum coordinate value (a)
The point-to-point distance (ac) and two points, a point (d + 1) indicating the maximum coordinate value and a point (b + 1) indicating the minimum coordinate value in the Y-axis direction.
The point-to-point distances (d + 1 · b + 1) are obtained and compared,
The two points (a and c) forming the longer distance between two points (ac in this figure) are the end positions of the leads at the diagonal positions of the electronic component, and the distances ac between two points and The specified range of the distance AC between two points is called out from the data of the air-core coil to be handled, which is stored in advance in the image processing apparatus, and compared by calling the discriminating means to obtain the diagonal position of the imaged electronic component. It is possible to determine the distance between the end positions of the leads and the suction state.

Next, with respect to the electronic component determined to be within the specified range, the outline of the component is determined on the basis of the image data from the point a of two points (a and c) which are the end positions of the leads. Track within an interval. For example, the point a is followed by the point a + 1 and then the point a + 2, and the next traced point is on a straight line, that is, the points on 180 ° are traced one after another, and the electron directed to the direction of this straight line is targeted. The direction of the component is set to θ ₀ , which is compared with the direction of the data called at the time of determining the distance between the two points to calculate a deviation angle Δθ in the direction of the target electronic component.

Subsequently, the two points (a and c) obtained above are obtained.
Was as diagonal points A and C, and form a right quadrilateral you the direction of one side and theta _0, the quadrilateral is a contour quadrilateral ABCD surrounding the electronic component of interest.

If the above-described diagonal points A and C and the outline right quadrangle can be obtained, it is compared with data stored in advance to determine a vertical deviation and calculate a normal part within a specified range. The corrected positional deviation amount can be corrected, and the mounting can be performed with high accuracy.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method and an apparatus for mounting an electronic component according to the present invention will be described. FIG. 1 shows a mounting apparatus 1 to which the present invention is applied. In the present embodiment, a case where an air-core coil is used as a target component will be described. The air core coil 2 is supplied to a supply table 3 and is attached to a mounting head 4 of the mounting apparatus 1 so as to be capable of moving up and down and rotating.
The substrate 6 is conveyed to a predetermined mounting position 7 of the substrate 6 carried into the mounting apparatus 1 and mounted. The control unit 8 is provided in the mounting apparatus 1, and the mounting head 4 necessary for mounting is provided.
It not only controls operations such as loading, fixing, and unloading of the suction nozzle 5 and the substrate 6, but also exchanges signals with upstream and downstream devices.

The data input unit 9 also inputs various information necessary for production management, in addition to information necessary for mounting on the mounting apparatus 1, and the monitor 10 receives and transmits the input information and the control unit 8. Information about the signal to be performed can also be displayed.

The mounting head 4 will be described with reference to FIGS. The mounting head 4 is mounted on a rail 4 in a plane parallel to the substrate 6.
a and the driving unit 4b can move in the X direction, and the rail 4c can move in the Y direction. The mounting head 4 is provided with a turning device 5a that supports the suction nozzle 5 and rotates the nozzle shaft, and a lifting device 5b that moves up and down. Suction nozzle 5
When the air core coil 2 is attracted by the supply table 3 and starts moving toward the mounting position 7 while rising to the commanded height, the movable mirror 11a of the optical system 11 is moved by the movable cylinder 11b. , An optical path for imaging by the camera 11d via the fixed mirror 11c is formed. For imaging, LED of illumination system 12
The scattered light is radiated from the illumination 12a via the diffusion plate 12b to the target air-core coil 2, and transmitted light is imaged by the camera 11d to obtain a silhouette of the air-core coil 2.
The obtained image data of the silhouette is processed by the image processing device 13, and data necessary for mounting the sucked air-core coil 2 is input to the control unit 8.

The air core coil 2 determined to be inappropriate for mounting by image data processing is discharged to a discharge tray 14.

Next, the air-core coil 2 will be described with reference to FIGS. The air-core coil 2 has a shape as shown in FIG. 3A, has two leads ab and cd, and its silhouette can be surrounded by a right-angled rectangle having a length m and a width n. . However, the position where the air-core coil 2 is adsorbed is the coil portion 2a, which has an uneven winding pitch of the wire and a bent center line of the coil. The air flow is also affected by the position of the line, so that a portion off the center of the coil is often attracted, and the center (x ₀ , y ₀ ) of the air-core coil 2 and the center of the attracting nozzle 5 ( x ₁ , y ₁ ).
Causes a deviation Δθ between the lead direction and the specified direction due to the cause of coil bending, and also causes a vertical deviation of inclination α _{0 from} the substrate surface due to rolling caused by air flow during suction. There is also.

Further, the lead is made of a thin material having a circular cross section. During the handling, the lead bends in a direction θ ₁ in a plane parallel to the substrate surface and a vertical deviation α ₁ in a direction inclined to the substrate surface ( 3 (dashed line in FIG. 3) is also a component that easily occurs.

As described above, the image data of the air core coil 2 includes the positional deviations ΔX, ΔY, Δθ and the vertical deviation α ₁ at the time of adsorption.
In addition, the deviations due to coil bends θ ₁ and α ₁ are included, so it is difficult to determine the amount of deviation required for mounting and the amount of deviation due to coil bends from image data.
Ku, therefore, the correction of the deviation amount is also difficult.

The present invention solves the above-mentioned problem and enables highly accurate mounting, and will be described below with reference to FIGS.

The control section 8 controls the operation of the mounting apparatus 1, exchanges signals with upstream and downstream apparatuses, and outputs information input from the data input section 9, the image processing apparatus 1, and the like.
A function of storing and retrieving various information necessary for production management including information from the third information processing apparatus, and comparing information from the image processing apparatus 13 with already input data, processing the data, and implementing In order to correctly mount an appropriate air-core coil 2 on the input device, the input data editing unit 15 and the shift amount detection unit 1
6, an inspection unit 17, and a mounting data unit 18.

First, the input data editing unit 15 processes data relating to the data input unit 9, the air-core coil 2, the board 6, the mounting order, and the recognition of parts, which have entered from the upstream device and the downstream device, and creates a program. Then, the shift amount detecting unit 16 calculates the information provided from the input data editing unit 15 and the information from the image processing device 13 and compares the calculated information with the specified range of the distance between the lead diagonal positions of the air-core coil 2. , Air core coil 2
The calculation of the amount of shift angle between the direction in which the air is attracted and the prescribed direction, the formation of a rectangular quadrangle, and the calculation and storage of data on the position shift of the air-core coil 2 are performed.
Then, the request data for mounting obtained from the input data editing unit 15 and the shift amount detecting unit 16 and the component data based on the image data are compared, and the air-core coil 2 that is inappropriate for mounting is compared.
Is issued to the mounting head 4 and the mounting data section 18 corrects only the air core coil 2 suitable for mounting from the displacement calculated by the displacement detecting section 16 and the correction amount and operation to be corrected at the time of mounting. The mounting head 4 is instructed.

Next, the flow of mounting by the mounting apparatus 1 will be described with reference to FIG. On the basis of information from the image processing device 13, in step S1, four points of a maximum coordinate value and a minimum coordinate value are obtained for each of the X-axis and Y-axis directions.

[0029] Then, the distance between two points of the respective maximum coordinate value of the X-axis and Y-axis direction and the minimum coordinate value calculated in step S2, one of the larger maximum two points the distance between two points The distance between them. In this case, in an IC electronic component called QFP, when the distance between the two points is calculated as described above, the distance between the two lead diagonal positions is equal, but the distance between any two points is the maximum distance between the two points. And it is sufficient.

Subsequently, in step S3, from the various data for mounting input to the data input unit 9, a specified range relating to the corresponding air-core coil 2 is called and compared, and if the data is out of the specified range. Gives a command to discharge to the mounting head 4 and proceeds to the next step if it is within the specified range.

The above-mentioned steps from S1 to S3 are the first stage, and the air-core coils 2 that have been adsorbed so far have defective dimensions and lead bending defects.
Those having a vertical deviation failure with a slope α _{0 in} the suction state can be excluded as being unsuitable for mounting, and in the next second step, the defective ones are excluded and handled, thus saving time. be able to. In addition, the determination of a good product and a defective product is simply a comparison with a specified range. However, it is easy to determine a product having an excessively large size and a product having a small size. If the distance becomes shorter and there is a vertical deviation of the inclination α ₀ , the length m of the silhouette becomes shorter as m (cos α ₀ ), so that it can be easily determined whether the specified range is satisfied or not. Furthermore,
In this method, the data in the specified range of the determination is data corresponding to the distance between the diagonal positions, and the data as a pattern is unnecessary. Therefore, the amount of data can be reduced, and the capacity of the storage portion can be reduced. it can.

Next, in step S4, with respect to the image data of the air-core coil 2 which is within the specified range in step 3, any one of the two lead end positions which is the maximum distance between two points, in this embodiment, With the point a as the starting point, the pixels a + 1 and a + 2 on the image data are tracked, and if a + 2 is on the straight line between a and a + 1, that is, 180 °, it is determined whether a + 3 is on the straight line between a and a + 2. When the inspection is repeated, b is obtained next to b-1, and when b + 1 is further inspected, it is not on a straight line. Therefore, a and b are leads and the direction of the straight line is set to the direction θ ₀ of the air-core coil 2, and step S3 is performed. in calculating the deviation angle amount Δθ between the direction theta ₁ provisions have already been called.

[0033] Subsequently, in step S5, the two points a and c, which is to exhibit maximum distance between two points a diagonal point in Step 1, with the direction of the line segment orientation theta ₀ obtained in step 4 to one side Under the condition of a right-angled quadrilateral, a rectangular right-angled outline surrounding the air-core coil 2 can be formed, and a quadrilateral ABCD can be obtained in which a is replaced with A and c is replaced with A among four vertices of the quadrilateral. . As long as this outline right-angled quadrilateral ABCD is obtained, in the following steps, the amount of deviation can be calculated by various methods. Hereinafter, the case of the present embodiment will be described.

Subsequently, in step S6, the outline rectangular quadrangle A
The length of each side of the BCD is obtained, the side AB is compared with m, and the side AD is compared with n. If it is within the specified range already called in step S3, it is sent to the next step.

Subsequently, in step S7, the outline rectangle AB
The center point of the CD is obtained, the shift amount with respect to the specified range that has already been called out is calculated, and the shift amount is corrected in step 8, so that the air-core coil 2 can be mounted at the specified position on the substrate 6. .

The data table of the image data is shown in FIG.
Shown in

[0037]

According to the present invention, it is possible to use image data even for an electronic component in which the width and length of the lead are smaller than the height of an air-core coil, the lead is easily bent, and the slip is likely to occur even when attracted. This enables the detection and elimination of component failure and suction failure, making it possible to mount only good products with high dimensional accuracy.

[Brief description of the drawings]

FIG. 1 is an external perspective view of a mounting apparatus to which the present invention is applied.

FIG. 2 is an enlarged external perspective view of a mounting head of the mounting apparatus of FIG. 1;

FIG. 3 is an explanatory diagram of a displacement caused by an air core coil sucked by a suction nozzle.

FIG. 4 is a diagram showing an imaging example of an air-core coil according to the present invention.

FIG. 5 is a configuration diagram of a control unit of the mounting apparatus of FIG. 1;

FIG. 6 is an operation flowchart of the control unit in FIG. 5;

FIG. 7 is a diagram showing an example of a data table processed by a control unit.

[Explanation of symbols]

1: mounting device, 2: air-core coil, 3: supply table,
4: mounting head, 5: suction nozzle, 6: substrate, 7: mounting device, 8: control unit, 9: data input unit, 10: monitor,
11: optical system, 12: illumination system, 13: image processing device, 1
4: discharge tray, 15: input data editing unit, 16: shift amount detection unit, 17: inspection unit, 18: mounting data unit,

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hiroaki Imai 5-2-2 Koyodai, Ryugasaki-shi, Ibaraki Hitachi Techno Engineering Co., Ltd. Ryugasaki Plant (72) Inventor Junichi Katsuta 5-2-2 Koyodai, Ryugasaki-shi, Ibaraki Hitachi Techno Engineering Co., Ltd. Ryugasaki Plant (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 13/04 H05K 13/08

Claims (6)

(57) [Claims] An image processing device processes image data of an electronic component that is sucked by a suction nozzle and is in a sucked state, and recognizes a position, a direction, and a tilt of the electronic component, and shifts the electronic component. In the method of correcting the amount and mounting the image data on a substrate, a distance between two points indicating a maximum coordinate value and a minimum coordinate value in the X-axis direction, and a maximum coordinate value and a minimum value in the Y-axis direction among the coordinate values of the image data. There the distance between two points showing the coordinate values
A distance between two points of an end position of the lead with the distance between the large two points Zureka diagonal positions of the electronic components as the distance between the maximum 2 points, 2 of said end positions and defined range that is given in advance
Comparing point distance, the provided the step of determining the electronic components within the prescribed range, the position and orientation relative to the substrate surface of the substrate with prior <br/> Symbol electronic components in the adsorption state within the specified range A mounting method of an electronic component, wherein the electronic component is mounted by recognizing a tilt and an inclination and correcting a shift amount. 2. The method according to claim 1, wherein the recognition of the position, the direction, and the inclination of the electronic component within the specified range and the correction of the deviation amount are performed by tracking a predetermined distance from the end position on the image data. A direction of a straight line including at least two points and the end position obtained as a direction of the electronic component, and calculating a deviation angle amount from a predetermined direction given in advance; Forming a contour quadrilateral surrounding the electronic component from an end position of a lead, and comparing the length of each side of the contour quadrilateral with a predetermined range given in advance to satisfy and a step of determining with those in slope tolerance, the center position of the contour perpendicular quadrilateral the central position of the electronic component to the substrate surface of the electronic component leads, the deviation amount of the position of the specified range that is given in advance Calculating the deviation angle amount Mounting method of the electronic component, characterized in that it is made by a process of correcting the deviation amount. 3. The method according to claim 1, wherein said electronic component is an air-core coil. 4. An image processing apparatus processes image data obtained by capturing an electronic component mounted on a substrate that is suctioned by a suction nozzle and is in a suction state, and recognizes a position, a direction, and an inclination of the electronic component. And correcting the displacement amount and mounting the component on a substrate, wherein, among the coordinate values of the image data, the distance between two points indicating the maximum coordinate value and the minimum coordinate value in the X-axis direction and the maximum coordinate value in the Y-axis direction There the distance between the two points representing the value and the minimum coordinate value
A distance between two points of an end position of the lead with the distance between the large two points Zureka diagonal positions of the electronic components as the distance between the maximum 2 points, 2 of said end positions and defined range that is given in advance
Comparing point distance, and means for determining the electronic component within the specified range, the adsorption state is determined within the above defined range
Mounting apparatus of electronic components, characterized in that it comprises means for correcting the amount of deviation to recognize the position and orientation and inclination with respect to the substrate surface of the substrate with a certain said electronic components. 5. The apparatus according to claim 4, wherein the means for recognizing a position, a direction, and an inclination of the electronic component within the prescribed range and correcting the amount of deviation is within a predetermined distance from the end position on the image data. Means for calculating the amount of deviation between at least two points obtained by tracking the direction of a straight line including the end position and a predetermined direction given as the direction of the electronic component, and the straight line and the diagonal. Means for forming a rectangular quadrangle surrounding the electronic component from the end position of the lead at the position, and satisfying the length of each side of the rectangular quadrangle by comparison with a predetermined range given in advance. Means for judging that the inclination of the electronic component with respect to the substrate surface is within an allowable range, and a deviation amount of a position from a predetermined range which is given in advance as the center position of the quadrilateral of the contour as the center position of the electronic component. Means for calculating Mounting apparatus of electronic components, characterized by comprising means for correcting the amount and the shift amount. 6. An electronic component mounting apparatus according to claim 4, wherein said electronic component is an air-core coil.