JP3351372B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component obtained by punching a film carrier on a substrate such as a display panel.

[0002]

2. Description of the Related Art A substrate such as a liquid crystal panel or a plasma panel, which is often used as a display panel of electronic equipment, is bonded to a transparent plate such as a glass plate, and electronic components are attached to electrodes formed on the edge of the transparent plate. Mounted and assembled. As electronic components, TAB (Tape Automated
Electronic components manufactured by the Bonding method are frequently used. The TAB method is a method in which leads and chips are bonded to the surface of a film carrier made of a synthetic resin film, and the film carrier is punched by a punching device to obtain an electronic component.

FIGS. 7 (a), 7 (b) and 7 (c) are cross-sectional views of a main part of a punching apparatus for explaining a conventional step of punching a film carrier. In FIG. 7 (a), reference numeral 1 denotes a tape-shaped film carrier, on the surface of which a chip 2 and leads (not shown) are bonded. An upper die 3 has a punch 4 on its lower surface. Reference numeral 5 denotes a lower die, in which a knockout pin 6 is provided. The film carrier 1 is wound around a supply reel (not shown), and is fed between the upper die 3 and the lower die 5 at a pitch.

Next, the operation will be described. With the chip 2 stopped between the upper mold 3 and the lower mold 5 as shown in FIG.
As shown in FIG. 7B, the upper die 3 descends, and the film carrier 1 is punched. Next, as shown in FIG. 7 (c), the upper mold 3 is raised, and the knockout pin 6 is also raised. On the upper surface of the knockout pin 6, an electronic component 7 obtained by punching the film carrier 1 is mounted. Next, the transfer head 8 enters between the upper mold 3 and the lower mold 5, and the electronic component 7 on the knockout pin 6 is vacuum-sucked to the nozzle 9 to be picked up and transferred to a display panel (not shown). .

[0005]

Next, the problems of the above-mentioned conventional device will be described with reference to FIG. FIG. 8 shows FIG.
It is a principal part expanded sectional view of the state shown to (c). The punch 4 descends and the film carrier 1 is moved by the punch 4 and the lower mold 5.
, Burrs E1 and E2 are generated at the edge of the film carrier 1. The flash E1 of the film carrier 1 on the remaining side is sharpened downward, and the flash E2 of the film carrier 1 on the knockout pin 6 is sharpened upward. For this reason, when the knockout pin 6 rises from the lowered position shown in FIG. 7B to the raised position shown in FIG. 7C, the burrs E1 and E2 are caught on each other, and the electronic component 7 is placed on the knockout pin 6. As shown by a chain line in FIG. 8, the nozzle 9 is displaced as a result. As a result, the electronic component 7 cannot be picked up by vacuum suction of the electronic component 7 in a correct posture, and there is a problem that a pickup error is likely to occur.

Further, as shown in FIG. 7C, the transfer head 8 enters between the upper die 3 and the lower die 5 and
Since the upper electronic component 7 is picked up, in order to secure this entry space, the vertical stroke S of the upper die 3 must be increased so that the upper die 3 can retreat to a high position. However, when the up-and-down stroke S of the upper mold 3 is increased, the impact when the upper mold 3 descends and punches the film carrier 1 increases accordingly, and due to the vibration accompanying the impact, the upper mold 3 and the lower mold 5 are moved. Not only does the entire electronic component mounting apparatus vibrate, causing rattling of the apparatus, but also when the transfer head 8 mounts the electronic component 7 on a display panel (not shown), the mounting position is increased. There was a problem that would cause a mess. Further, since the time required for the vertical movement of the upper mold 3 is long, and the time required for the transfer head 8 to move in and out between the upper mold 3 and the lower mold 5 is also required, the tact time is increased, and the mounting efficiency is not reduced. There was a problem.

Accordingly, the present invention solves the above-mentioned problems of the prior art, and provides an electronic component mounting apparatus and an electronic component capable of mounting an electronic component obtained by punching a film carrier on a substrate such as a display panel with high precision and efficiency. The purpose is to provide an implementation method.

[0008]

An electronic component mounting apparatus according to the present invention includes a punching device provided in an electronic component mounting apparatus, and a lower die having a through-hole penetrating in a vertical direction. A punch that punches a film carrier by moving up and down, and vacuum-adsorbs and receives electronic components obtained by punching under this through-hole, from below, to the transfer nozzle. A transfer nozzle to be transferred, a nozzle holding member that rotatably holds the transfer nozzle around its axis, a nozzle moving unit that moves the transfer nozzle, and a transfer nozzle that moves the transfer nozzle around its axis. The nozzle rotation means for rotating the nozzle is provided.

Further, according to the electronic component mounting method of the present invention, there is provided a step of positioning a film carrier to which a chip is bonded on a lower die having a through hole, and a step of moving a punch from above the film carrier into the through hole. Lowering and punching the film carrier, receiving the electronic component punched from the film carrier by a transfer nozzle from below, and rotating the transfer nozzle about its axis to move the electronic component in the horizontal direction. Adjusting the orientation of the electronic component, transferring the electronic component held by the transfer nozzle to a transfer nozzle, and mounting the electronic component held by the transfer nozzle on the lead and table. And positioning the electrodes of the placed substrate in alignment with each other.

In the above arrangement, the punch descends and punches the film carrier. Then, the electronic component obtained by punching is vacuum-adsorbed to the transfer nozzle as it is and is received from below. After adjusting the direction of the electronic component by rotating means, the electronic component is transferred from the transfer nozzle to the transfer nozzle and transferred to the transfer nozzle. Mounted on Accordingly, unnecessary displacement of the electronic component does not occur, and the electronic component can be mounted on the substrate with high accuracy and efficiency.

[0011]

(Embodiment 1) FIG. 1 is a plan view showing the overall configuration of an electronic component mounting apparatus according to Embodiment 1 of the present invention, and FIG. 2 is a side view thereof. In FIG. 1, 11
Is a turntable, in which four arms 12 extend horizontally outward, and a transfer nozzle 13 (see FIG. 2) is provided at the tip of the arm 12 which is a nozzle holding member. In FIG. 2, the turntable 11 is supported on the upper end of an upright shaft 14a of the index drive unit 14, and when the index mechanism unit 14 is driven, the turntable 11 rotates horizontally. Index drive unit 14
Are installed on the X table 15 and the Y table 16. The turntable 11 is provided with a transfer nozzle (described later).
13 serves as a nozzle moving means for moving the nozzle 13 in the horizontal direction. When the motor 17 of the X table 15 is driven, the turntable 11 horizontally moves in the X direction, and the Y table 1
6 is driven, the turntable 11 becomes Y
Direction and its position is adjusted. The position of the turntable 11 is adjusted according to the position of a punching device (described later) for the film carrier. Reference numeral 20 denotes a base.

FIGS. 4 (a), 4 (b) and 4 (c) are side views of the vicinity of a punching device for a film carrier. In FIG. 4A, a nozzle shaft 21 is provided on the upper surface of the distal end of the arm 12.
And a transfer nozzle 13 is mounted on the upper end thereof. The nozzle shaft 21 is connected to a cylinder 22 mounted on the lower surface of the tip of the arm 12. Therefore, when the cylinder 22 operates and the nozzle shaft 21 protrudes, the nozzle 13 rises to the position shown by the broken line in the same figure, and when the nozzle shaft 21 is retracted, it descends to the position shown by the solid line.

In FIG. 4A, a motor 23 is mounted on a lower surface near the tip of the arm 12. Motor 2
The pulley 2 is attached to the rotation shaft 3 and the nozzle shaft 21 respectively.
4 and 25 are attached, and a belt 26 is tuned to the pulleys 24 and 25. Therefore, the motor 23
Is driven, the nozzle shaft 21 rotates around its axis, and adjusts the horizontal direction of an electronic component (described later) vacuum-adsorbed on the upper surface of the nozzle 13. That is, the motor 23, the pulleys 24 and 25, the belt 26, and the like constitute nozzle rotating means for rotating the nozzle 13 about its axis in order to adjust the horizontal direction of the electronic component.

Referring to FIG. 1, film carriers 1A, 1
B and 1C are provided, and the arm 12 is provided from three directions.
Is supplied towards. Each film carrier 1A,
Chips 2A, 2B, 2 are provided on the surfaces of 1B, 1C, respectively.
C and leads (not shown) are bonded. In the figure, A is a punching line, and an electronic component can be obtained by punching the film carriers 1A, 1B, 1C by a punching device (described later) along this line. The types of the three film carriers 3A, 3B, and 3C may be different types or the same type, and are arbitrarily determined.

Next, a supply mechanism of the film carriers 1A, 1B, 1C will be described with reference to FIGS.
In FIG. 2, reference numeral 31A denotes a first support wall, and 31B denotes a second support wall.
3. Guide roller 34, punched film carrier 1
A winding roller 35 for winding A, 1B, and 1C is attached. One supply reel 32 has a film carrier 1
A is wound, and the other supply reel 32 is wound with the film carrier 1B. The take-up reel 33 is
The separate tape 36 wound around the supply reel 32 is wound on the film carriers 1A, 1B, 1C. FIG.
FIG. 9 is a rear view of the film carrier supply mechanism, and FIG.
A supply reel 32, a take-up reel 33, a roller 34, a take-up roller 35, etc. of the film carrier 1C are provided on the support wall 31C. 37 is a film carrier 1A, 1
A pair of sprockets for positioning B and 1C with respect to a punching device 40 described later. The supply reel 32, the take-up reel 33, the take-up roller 35, and the sprocket 35 are driven by driving means (not shown) to rotate. Therefore, when the driving means is driven, the film carriers 1A, 1
B and 1C are led out from the supply reel 32 and
, And the separate tape 36 is attached to the take-up reel 33 and to the punched film carrier 1.
A, 1B, and 1C are wound by winding rollers 35, respectively.

In FIG. 1, reference numeral 40 denotes a film carrier 1.
This is a punching device for A, 1B and 1C, and three punching devices are provided according to three film carriers 1A, 1B and 1C. As shown in FIGS. 2 and 3, the film carriers 1A, 1B, and 1C fed from the supply reel 32 are connected to a punching device 40.
, And the sheet is punched by this, and then wound up by a winding roller 35. Next, a detailed structure of the punching device 40 will be described with reference to FIG.

Reference numeral 42 denotes a lower die, in which a through hole 43 penetrating vertically is formed at the center. Reference numeral 44 denotes a support frame for the lower mold 42. As described above, the transfer nozzle 13 can freely move up into the through hole 43. A guide rod 46 is provided upright at the upper surface corner of the lower mold 42, and a base plate 45 is mounted on the upper part of the guide rod 46. A cylinder 47 is installed on the base plate 45, and an upper die 49 is connected to a rod 48 of the cylinder 47. A punch 50 is mounted on the lower surface of the upper die 49. The guide rod 46 penetrates the upper die 49 and guides the upper die 49 to move up and down. Therefore, when the rod 48 of the cylinder 47 projects, the punch 50 descends, and the punch 50 and the lower mold 42 cause the film carrier 1 to move downward.
Punch A. When the rod 48 of the cylinder 47 is retracted, the punch 50 retreats upward.

In FIG. 1, reference numeral 51 denotes a rotary table, which has four arms 52 extending horizontally outward. As shown in FIG. 2, the turntable 51 is supported by an upright shaft 53a of an index mechanism 53,
When the index driving unit 53 is driven, the turntable 51
Rotates the pitch in the horizontal direction. A transfer nozzle 54 is provided at the tip of the arm 52. The rotation trajectory of the transfer nozzle 13 and the rotation trajectory of the transfer nozzle 54 intersect, and at this intersection, the transfer nozzle 54
The electronic component 7 is delivered from the transfer nozzle 13 to the transfer nozzle 54 in a state where is located right above the transfer nozzle 13. In FIG. 1, an observation device 55 is provided below the rotation trajectory of the nozzle 54. This observation device 55
Is provided with an optical system such as a camera, and detects the position of the electronic component 7 vacuum-adsorbed to the nozzle 54.

In FIGS. 1 and 2, reference numeral 60 denotes a display panel. The display panel 60 is mounted on the movable table 61. The movable table 61 includes an X table 62, a Y table
It comprises a table 63 and a θ table 64. X
The motor 65 of the table 62 and the motor 6 of the Y table 63
When the display 6 is driven, the display panel 60 is horizontally moved in the X direction or the Y direction, and when the θ table 64 is driven, the display panel 60 is horizontally rotated. As shown in FIG. 2, a bonding head 70 is provided above the display panel 60. Bonding head 7
Numeral 0 is provided with a thermocompressor 71 for pressing the leads of the electronic component 7 against the electrodes formed on the edges of the long side and the short side of the display panel 60 for thermocompression.

In FIG. 2, a cylinder 72 is provided on the upper surface of the Y table 63. The lower receiving plate 73 is connected to the rod of the cylinder 72. The lower support plate 73 is located below the thermocompression bonding element 71, and when the thermocompression bonding element 71 descends to press the lead of the electronic component 7 against the edge of the display panel 60, the lower edge of the display panel 60 is pressed. Support from below. A rod 74 is provided upright on the upper surface of the base 20.
A lower receiving plate 75 is connected to the upper end of the rod 74. The rod 74 moves up and down by means not shown,
The electronic component 7 vacuum-sucked on the nozzle 54 is supported from below. A camera 76 is provided below the bonding position. Reference numeral 77 denotes a lens barrel of the camera 76. This camera 76 detects the positions of the leads of the electronic component 7 and the electrodes of the display panel 60.

The electronic component mounting apparatus for a display panel is configured as described above. Next, the overall operation will be described.
The supply reel 3 is driven by driving a driving unit (not shown).
2. The film carrier 1A is fed out from
Is positioned between the lower die 42 and the punch 50.

Next, the punching step will be described with reference to FIG. FIG. 4A shows a state before punching. At this time, the transfer nozzle 13 is on standby just below the through-hole 43. As shown in FIG. 4B, when the nozzle shaft 21 projects upward, the nozzle 13 moves up into the through hole 43. At this time, the rod 48 of the cylinder 47 also projects downward and the punch 50 descends,
A is punched. The electronic component 7 obtained by punching the film carrier 1A is vacuum-adsorbed to the nozzle 13. That is, the nozzle 13 is provided with the electronic component 7 punched by the punching device 40.
Also serves as a receiving means for receiving from below.

Next, as shown in FIG. 4C, the nozzle shaft 21 is retracted downward, and the nozzle 13 escapes downward through the through hole 43. Further, the rod 48 of the cylinder 47 is pulled upward, and the punch 50 rises. Thereafter, the punched film carrier 1 located between the lower mold 42 and the punch 50
A is taken up by a take-up roller 35 (FIG. 2).

As described above, the nozzle 13 is connected to the electronic component 7.
When the turntable 11 is received, the turntable 11 is rotated by 180 ° horizontally, and the transfer nozzle 13 is placed immediately below the transfer nozzle 54 provided at the tip of the arm 52 of the turntable 51 as shown in FIG. Move. At this time, as is clear from FIG. 1, the transfer nozzle 13 rotates 90 ° clockwise by driving the motor 23 when it is moved directly below the transfer nozzle 54. 1
The horizontal direction of the electronic component 7 vacuum-adsorbed to the panel 3 is adjusted to the direction to be mounted on the display panel 60. And
The electronic component 7 is delivered from the nozzle 13 to the nozzle 54 by releasing the vacuum suction state of the one nozzle 13 and performing vacuum suction by the other nozzle 54 in this state.

Next, in FIG.
By horizontally rotating in the counterclockwise direction, the nozzle 54 moves directly above the observation device 55, and the electronic device 7 vacuum-adsorbed to the nozzle 54 is observed by the observation device 55, and its position is roughly detected. Next, when the turntable 51 is rotated by 90 °, the electronic component 7 is transferred to a position immediately above the edge of the display panel 60.

Next, a process of mounting the electronic component 7 on the display panel 60 will be described with reference to FIG. X table 6
The display panel 60 is waiting at a predetermined position in advance by driving the second and Y tables 63. In this case, the position of the display panel 60 is adjusted based on the observation result of the observation device 55 so that the predetermined electrode on the long side of the display panel 60 is located below the lead of the electronic component 7.

When the electronic component 7 vacuum-adsorbed to the nozzle 54 arrives above the camera 76, a lead attached to the film carrier 1A of the electronic component 7 by the camera 76 and
The displacement of the electrodes formed on the edge of the display panel 60 in the XYθ directions is accurately detected. The displacement in the X direction and the Y direction is corrected by driving the X table 62 and the Y table 63 to move the display panel 60 in the X direction and the Y direction.
Is driven to rotate the display panel 60 horizontally to make a correction. Of course, this correction method is not limited to the present embodiment. For example, the position shift in the θ direction may be corrected by rotating the nozzle 54.

When the correction is completed, the nozzle 54 is projected downward to land the lead of the electronic component 7 on the electrode of the display panel 60, and then the thermocompression contactor 71 of the bonding head 70 is lowered to connect the lead to the electrode. And thermocompression bonded. Next, when the nozzle 54 and the thermocompression contactor 71 are raised, a series of operations is completed. By repeating the above operation, the electronic component 7 is positioned at the long edge of the display panel 60.
Will be installed one after another.

In FIG. 1, when the electronic component 7 is mounted on the short side of the display panel 60, the θ table 64 is driven to rotate the display panel 60 horizontally by 90 °, and the short side is positioned below the bonding head 70. Then, the same operation as described above is performed. Here, when the types of the electronic components 7 mounted on the long side and the short side of the display panel 60 are different, another film carrier 1B or 1C is punched in accordance therewith to obtain the desired electronic component 7, What is necessary is just to mount this electronic component 7. That is,
In FIG. 1, three film carriers 1A, 1B, and 1C are provided in the present embodiment. However, these film carriers 1A, 1B, and 1C may be of the same type or different types. It is. If a plurality of film carriers 1A, 1B, and 1C and the punching device 40 are provided as described above, various types of electronic components 7 can be mounted on the display panel 60. Also, film carriers 1A, 1B,
Since the equipment capacity of 1C is large, the film carriers 1A, 1
The frequency of replacement of the supply reel 32 due to the out-of-stock items B and 1C can be reduced. In addition, three film carriers 1A, 1
If any one of B and 1C is out of stock, the operation can be continued with another film carrier, and the out-of-stock film carrier can be replenished during that time, so that there is no need to stop the operation of the apparatus. A reduction in work efficiency due to the replenishment of the film carrier can be eliminated.

(Embodiment 2) FIG. 5 is a plan view of an electronic component mounting apparatus according to Embodiment 2 of the present invention. In this embodiment, the X table 15 of the first embodiment shown in FIG. 2 is removed, and the turntable 11 is set on the Y table 16 and moves only in the Y direction. 16a is a guide rail for guiding the movement of the turntable 11.

A total of four punching devices 40 are provided on each side of the Y table 16, and four film carriers 11A, 11B, 11C and 11D are supplied from the lateral direction. The turntable 11 has two arms 12.
Are provided orthogonal to each other. Therefore, when the turntable 11 moves on the Y table 16,
The film carriers 1A to 1D to which the transfer nozzle 13 at the tip of the arm 12 is vacuum-sucked are selected. In addition, as the turntable 11 reciprocates in the horizontal direction by 90 °, the electronic component 7 to which the transfer nozzle 13 is vacuum-sucked is transferred to the transfer nozzle 54. Other operations are the same as those in the first embodiment, and a description thereof will be omitted.

(Embodiment 3) FIG. 6 is a plan view of an electronic component mounting apparatus according to Embodiment 3 of the present invention. This device has two punching devices 40 on both sides of the turntable 11.
The film carriers 1A, 1
B is supplied. The turntable 11 has an arm 1
2 are provided orthogonal to each other. Therefore, when the turntable 11 reciprocates in the horizontal direction by 90 °, the electronic components 7 to which the transfer nozzles 13 are vacuum-sucked.
Is transferred to the transfer nozzle 54. Other operations are the same as those in the first embodiment, and a description thereof will be omitted. As described above, the present invention can be modified in various ways. In any case, a plurality of film carriers are provided, each of which is punched by the punching device 40 and received by the transfer nozzle 13. As a result, work efficiency can be significantly improved. In each of the above embodiments, the display panel has been described as an example of the substrate, but the substrate may be a printed circuit board or the like in addition to the display panel.

[0033]

As described above, according to the present invention, an electronic component obtained by punching with a punching device can be reliably received by a transfer nozzle and mounted on a substrate. In addition, since the transfer nozzle receives the electronic components from below, the stroke of lifting and lowering the punch may be short. Therefore, the vibration generated by the lifting and lowering of the punch is small, and this vibration is transmitted to the substrate and the transfer nozzle side. Therefore, it is possible to prevent the mounting position accuracy from deteriorating. Furthermore, the need for the conventional knockout pin and its vertical movement mechanism shown in FIG. 7 can be eliminated, so that the configuration of the punching device can be simplified, and the punching up / down stroke can be shortened, so that the punching device can be downsized. it can. Furthermore, since the punching of the film carrier and the work of mounting the electronic components obtained by punching on the substrate can be performed in parallel, the overall tact time can be shortened and the mounting efficiency can be greatly improved.

Also, a plurality of film carriers and punching devices are provided, and electronic components obtained by punching with any of the punching devices can be received by the transfer nozzle and delivered to the transfer nozzle. If one of the film carriers is out of stock, the operation of mounting the electronic components on the board can be continued while the operation of the apparatus is continued by another film carrier, and during this time, the out-of-stock film carrier can be replenished. In addition, it is possible to eliminate a decrease in operation efficiency due to the replenishment of the film carrier.

[Brief description of the drawings]

FIG. 1 is a plan view showing an overall configuration of an electronic component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a side view of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 3 is a rear view of a film carrier supply mechanism of the electronic component mounting apparatus according to the first embodiment of the present invention.

4A is a side view showing a vicinity of a punching device of a film carrier of the electronic component mounting apparatus according to the first embodiment of the present invention. FIG. 4B is a side view of the electronic component mounting apparatus according to the first embodiment of the present invention. Side view near punching device (c) Side view near punching device of film carrier of electronic component mounting device according to Embodiment 1 of the present invention

FIG. 5 is a plan view of an electronic component mounting apparatus according to a second embodiment of the present invention.

FIG. 6 is a plan view of an electronic component mounting apparatus according to a third embodiment of the present invention.

7A is a cross-sectional view of a main part of a conventional film carrier punching device. FIG. 7B is a main part cross-sectional view of a conventional film carrier punching device. FIG. 7C is a main part of a conventional film carrier punching device. Sectional view

FIG. 8 is an enlarged sectional view of a main part of a conventional film carrier punching device.

[Explanation of symbols]

 1A Film Carrier 1B Film Carrier 1C Film Carrier 2 Chip 7 Electronic Component 11 Turntable 12 Arm 13 Transfer Nozzle 23 Motor 24, 25 Pulley 26 Belt 40 Punching Device 42 Lower Die 43 Through Hole 50 Punch 54 Transfer Nozzle 60 Display panel

Claims (3)

(57) [Claims] 1. A punching device for punching a film carrier to which a chip is bonded, a table on which a substrate is mounted, and an electronic component obtained by punching the film carrier by the punching device by vacuum suction. A transfer nozzle mounted on the substrate, and a thermocompressor for thermocompression bonding a lead formed on the film carrier to an electrode formed on an edge of the substrate, wherein the punching device is arranged in a vertical direction. A lower die having a through-hole formed therethrough; and a punch above the lower die and punching the film carrier by moving up and down in the through-hole. A transfer nozzle for receiving an electronic component obtained by punching with the punch by vacuum suction from below, and transferring the electronic component to the transfer nozzle, and a nozzle for holding the transfer nozzle rotatably about its axis. An electronic component mounting apparatus, comprising: a holding member; nozzle moving means for moving the transfer nozzle; and nozzle rotating means for rotating the transfer nozzle about its axis. 2. The thermocompression bonding element is provided on a thermocompression bonding head which is separate from the transfer nozzle and is provided at a bonding position for bonding the electronic component to an edge of the substrate. The electronic component mounting apparatus according to claim 1, wherein: 3. An electronic component mounting method for mounting an electronic component obtained by punching a film carrier to which a chip is bonded on a substrate, wherein the film carrier having the chip bonded on a lower mold having a through hole is provided. Positioning step; punching the film carrier by lowering a punch into the through hole from above the film carrier; and receiving the electronic component punched from the film carrier by a transfer nozzle from below. Rotating the transfer nozzle about its axis to adjust the horizontal orientation of the electronic component; and transferring the electronic component held by the transfer nozzle to a transfer nozzle. Mounting the lead of the electronic component held by the transfer nozzle and the electrode of the substrate placed on the table in alignment Electronic component mounting method which comprises that the step.