JP3314076B2 - Crystal oscillator - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a crystal oscillator having high stable performance, and more particularly to a crystal oscillator and a semiconductor chip necessary for making a crystal oscillator thinner, smaller and lighter. The present invention relates to a configuration for arranging passive components compactly as necessary.

[0002]

2. Description of the Related Art The configuration of a crystal oscillator according to the prior art is
This will be described with reference to FIGS. FIG. 5 is a cross-sectional view showing a crystal oscillator composed of a terminal member 1 made of a ceramic material and a container of a case 35 made of a metal, and FIG. 6 is a graph showing a change over time of the frequency in the crystal oscillator.

[0005] As shown in FIG. 5, a semiconductor chip 5 and a passive component 11 such as a capacitor are joined to a terminal member 1 by a bonding material 15.
The semiconductor chip 5 is electrically connected to the terminal member 1 by the metal wire 19.

[0004] The semiconductor chip 5 and the metal wire 19 are
The resin 21 is molded for the purpose of ensuring reliability. Further, a quartz oscillator 37 housed in a metal container is installed on the upper surface of the resin 21. Conventionally, the crystal oscillator having this structure has a height exceeding 4 mm in most cases because the crystal oscillator 37 is thick.

On the other hand, with respect to the performance of the crystal oscillator, as shown in FIG. 6, the time-dependent change in the frequency of the crystal oscillator must be suppressed to ± 1 ppm or less per year as shown by a curve A. For this reason, the frequency change with time of the crystal vibrator 37 used for them is ± 1 pp annually.
m and a highly stable one of less than m.

[0006]

In recent years, portable telephones and automobile telephones have become lighter and thinner and smaller, and with this, crystal oscillators used in these telephones have not only improved performance but also made thinner and thinner. There is a strong demand for surface mounting and weight reduction.

However, in contrast to the aforementioned thinning, in the structure of the crystal oscillator as shown in FIG. 5, the crystal oscillator 37 used is housed in a metal container and is thick, and the flange required for hermetically sealing is used. Since 39 takes up space in the height direction, it is difficult to reduce the thickness of the crystal oscillator.

Further, in the structure of the crystal oscillator shown in FIG. 5, it is difficult to reduce the thickness of the airtight terminal and the case used for the crystal oscillator 37, so that the entire crystal oscillator 37 cannot be thinned. Also, the lead 4 of the quartz oscillator 37
1 is provided in the longitudinal direction of the crystal unit 37,
There is a disadvantage that the bottom area of the crystal oscillator becomes large.
Further, since the hermetic terminal and the case constituting the crystal unit 37 are made of metal, there is a disadvantage that the crystal oscillator becomes heavy.

On the other hand, there is a crystal oscillator using a bare crystal piece that is not housed in a metal container. In such a crystal oscillator, the gas generated from the bonding material 15 used on the terminal member 1 is bare. 6 causes a temporal change of the frequency, and as a result, the temporal change of the frequency becomes large as shown by a curve B in FIG. 6, and there is a disadvantage that a crystal oscillator having high stable characteristics cannot be obtained. .

[0010] An object of the present invention is to solve the above-mentioned problems, to have a small bottom area, and to be thin and light.
It is another object of the present invention to provide a structure of a crystal oscillator in which the frequency does not change with time.

Another object of the present invention is to provide a structure of a crystal oscillator in which a test during an assembling process of the crystal oscillator and a replacement of parts of the crystal oscillator can be easily performed.

[0012]

To achieve the above object, according to an aspect of a crystal oscillator according to the invention, substantially consists of a crystal oscillator and the terminal member of the quadrilateral, the terminal member is concave and said mounting the semiconductor chip A wiring conductor for connecting the crystal unit, and the crystal unit has a crystal piece fixed inside.
And a conductive lid for hermetically sealing the crystal blank.
And the lid is connected to the ground of the terminal member.
In order to make an electrical connection with the wiring conductor,
Of an electrode pad, that the quartz oscillator is integrated electrically bonded to the electrode pads of the semiconductor chip and the wiring conductor sterically arranged to the terminal member and the crystal oscillator Features.

According to the crystal oscillator of the present invention, since the crystal oscillator is arranged three-dimensionally with members such as a semiconductor chip and a passive component, the bottom surface of the crystal oscillator can be made small and the height direction can be reduced. Since it can be used effectively, a thin and lightweight crystal oscillator can be obtained.

In a configuration in which members such as a semiconductor chip and a passive component are arranged in a terminal member, a concave portion is formed in the terminal member, and these members are mounted in the concave portion. The shape of the external shape of the concave portion is a design item that can be appropriately designed, but a quadrangular shape is preferable because the external shape of the crystal unit is substantially rectangular.

The depth of the recess is set in consideration of the size of members such as a semiconductor chip and passive components mounted in the recess, but within a range that does not impair the strength of the bottom surface of the terminal member. It is preferable to form the cavity deeply. In this case, a cavity having a partially concave shape may be further formed on the bottom surface of the concave portion, and the semiconductor chip or the passive component may be dropped into the concave portion.

In the configuration in which the crystal unit is three-dimensionally arranged on a member such as a semiconductor chip or a passive component, the wiring conductor of the terminal member and the electrode pad of the crystal unit are electrically joined and integrated. For example, a configuration in which a step portion is provided in a concave portion of a terminal member on which members such as a semiconductor chip and a passive component are mounted, and a crystal resonator is mounted on the step portion can be considered.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of a crystal oscillator according to an embodiment of the present invention will be described below with reference to the drawings. A structure of a crystal oscillator according to an embodiment of the present invention will be described with reference to FIGS. 1, 2, 3, and 4. FIG.

FIG. 1 is a perspective view showing a structure of a crystal oscillator according to an embodiment of the present invention, and FIG. 2 is a sectional view showing a structure of the crystal oscillator according to the embodiment of the present invention. FIG. 3 is a cross-sectional view showing a structure of a crystal oscillator according to the embodiment of the present invention, and FIG. 4 is a cross-sectional view showing a crystal resonator used in the embodiment of the present invention.

First, as shown in FIG. 1, a terminal member 1 made of an insulator such as ceramics, glass ceramics, glass, or glass epoxy resin has a substantially square shape except for corner portions. Has a recess in the thickness direction. The corner may be chamfered.

In the recess, at least one step 16 is provided from the upper surface 12 to the bottom surface 14 of the terminal member 1. The step portion 16 may be an integral structure with the terminal member 1 or a separate structure. And this step part 1
6 is provided with a first wiring conductor 7.

The second wiring conductor 9 provided on the bottom surface 14 of the terminal member 1 is electrically connected to the passive component 11 such as a chip capacitor or a varicap diode or the semiconductor chip 5 by using a bonding material 15 (see FIG. 2). Make a static connection.

The semiconductor chip 5 is provided in a region near the center of the bottom surface 14 of the concave portion, and is connected to the second wiring conductor 9 by wire bonding using a metal wire 19.
In the wire bonding, the semiconductor chip 5 and the second wiring are formed by using a gold (Au) wire or an aluminum (Al) wire having a diameter of several tens of microns for the metal wire 19 and using a nozzle called a capillary (not shown) as a guide. And the conductor 9 for connection. The tip of the capillary from which the metal wire 19 emerges has a tapered shape.

Therefore, by providing the semiconductor chip 5 near the center of the bottom surface 14 of the concave portion, it is possible to avoid collision between the wall of the concave portion of the terminal member 1 and the capillary.
In particular, when the height of the tapered tapered portion of the capillary is higher than the height of the wall of the concave portion of the terminal member 1, the area of the concave portion of the terminal member 1 can be minimized, and the bottom area of the oscillator is minimized. It is an arrangement that can be done.

The semiconductor chip 5 may be mounted by flip-chip mounting, other than wire bonding, in which a protruding electrode is provided on the semiconductor chip 5 and the protruding electrode is mounted face-down on the second wiring conductor 9. . Further, if the semiconductor chip 5 has contents that cause reliability problems such as deterioration due to humidity and adhesion of dust, the semiconductor chip 5 and the second wiring conductor 9 are connected to the resin 21 as shown in FIG.
And mold it.

As a quartz oscillator required for use as a quartz oscillator, a thin quartz oscillator 3 housed in a surface mount type container as shown in FIG. 1 is used. FIG. 4 is a cross-sectional view showing the crystal resonator 3, in which an electrode pad 25 made of a metal conductor film is provided on an insulating terminal 23 made of glass, glass ceramic, or a ceramic plate. Then, the crystal blank 31 is fixed to the fixing material 3.
3 joins to the electrode pad 25. Also, the lid 29
Is made of glass, ceramics, or metal. Then, in a vacuum atmosphere or an inert gas atmosphere, the insulation terminal 2
The inside of the crystal unit 3 is hermetically sealed with a sealing material 27.

The quartz resonator 3 used in the present invention is characterized in that it is of a surface mounting type. If there is a structure other than the crystal resonator having the above-described structure, if it is a surface mounting type, the present invention is applicable. It can be mounted on crystal oscillators.

According to the embodiment of the present invention shown in FIGS. 1 and 2, the above-described quartz oscillator 3 is installed on the step 16 provided on the terminal member 1, and the first wiring conductor 7 and the quartz By electrically connecting and integrating the electrode pad 25 provided on the lower surface of the vibrator 3 with the bonding material 15, the crystal vibrator 9 is three-dimensionally arranged above the semiconductor chip 5 and the passive component 11. I have.

As described above, the step portion 16 is provided so as to hold both ends of the crystal unit 3 formed of a surface mount type container,
The semiconductor chip 5 is provided on the bottom surface 14 of the concave portion between the step portions 16.
By disposing the passive component 11 and arranging the crystal resonator 3 three-dimensionally in the thickness direction, the bottom area of the crystal oscillator can be reduced.

When the area of the crystal resonator 3 is small, either the semiconductor chip 5 or the passive component 11 is arranged on the bottom surface 14 of the concave portion between the step portions 16 and the crystal is formed in the thickness direction. It may be arranged three-dimensionally with the vibrator 3. That is, it is not necessary to arrange all the semiconductor chips 5 and the passive components 11 on the bottom surface 14 of the concave portion between the step portions 16, and all the semiconductor chips 5 and the passive components 11 are arranged three-dimensionally with the crystal unit 3. You don't have to.

As the joining material 15 for joining the first wiring conductor 7 and the electrode pad 25 provided on the lower surface of the crystal unit 3, solder or a conductive adhesive can be used. As the bonding material 15, a soft conductive adhesive is preferable.

Further, as the bonding material 15, an anisotropic conductive adhesive can be used. This anisotropic conductive adhesive is used when the wiring conductor having a certain pitch dimension and the electrode pad 25 are surface-bonded, sandwiched between them, and heated and pressed to be hardened and bonded. The wiring conductors and the electrode pads 25 do not show conductivity, but show conductivity only in the direction sandwiched by the conductors in the pressing direction.

In particular, this anisotropic conductive adhesive is effective for fine pitch connection, which is difficult to connect with conductive adhesive or solder. Note that an anisotropic conductive adhesive in which a conductive filler is dispersed in an electrically insulating resin is known, and is a viscous liquid before curing.

In the embodiment shown in FIG. 4, the electrode pads 25 of the crystal unit 3 are provided at both ends of the crystal unit 3.
The number of connection points is two, but may be more.

In the crystal oscillator provided with the crystal unit 3, a metal case 13 is joined to the upper surface 12 of the terminal member 1 as a measure against external noise. Here, a metal frame 45 such as Kovar is brazed to the upper surface 12, and the case 13 made of a metal such as Kovar is joined to the metal frame 45.

In this connection, as shown in FIG. 2, a metal frame 45 and a case 13 made of metal are formed by parallel seam welding.
Is hermetically sealed using a welding electrode 17 in a vacuum or in an inert gas. Alternatively, the metal frame 45 and the case 13 made of metal may be hermetically sealed in a vacuum or in an inert gas with solder. Thus, by joining the metal frame 45 and the case 13 made of metal by seam welding or soldering, airtight sealing can be easily and surely performed.

When a conductive adhesive is used as the bonding material 15, if moisture enters the recess, the conductive adhesive deteriorates,
A connection failure occurs between the first wiring conductor 7 and the quartz oscillator 3 and between the second wiring conductor 9 and the passive component 11. Further, among the passive components 11, there are also passive components 11 whose characteristics change due to the influence of humidity, such as a capacitor, cause problems.

In such a case, the crystal oscillator of the present invention hermetically seals the joint between the case 13 and the terminal member 1,
By preventing humidity from entering the concave portion from the outside of the oscillator, it is possible to prevent a problem due to humidity of the bonding material 15 and the passive component 11.

In the case where a solder or the like whose characteristics are hardly changed with respect to humidity is used as the joining material 15, or when the passive component 11 and the joining material 15 are coated with a resin or the like, the case 13 The terminal member 1 may be joined to the terminal member 1 by spot welding or partial joining by soldering. That is, the crystal oscillator of the present invention does not need to be hermetically sealed.

The case 13 may be made of conductive ceramics or resin. The conductivity in this case is the case 1
For example, a ceramic or resin may be mixed with a conductive powder to form it, a metal film may be applied to the case 13 after molding, or a conductive paint may be applied to the case 13 after molding. Form. Further, an adhesive may be used for joining the case 13 and the terminal member 1 irrespective of whether or not airtight sealing is performed.

The metal frame 45 is not limited to the shape of a metal plate having a certain thickness or more.
May be provided on the upper surface 12. The metal frame 45 may be made of conductive resin or ceramic.

In the case where there is no problem of noise or the need for an airtight seal, the case 13 and the metal frame 45 can be omitted. The case 13 may be made of ceramics or resin. Further, if the lid 29 of the crystal resonator 3 is made of metal and is grounded to the terminal member 1, it is possible to double as the case 13 of the crystal oscillator.

When the surface mount type crystal resonator 3 as shown in FIG. 4 is used, the container for accommodating the crystal blank 31 is made of glass or ceramics. The oscillator becomes lighter.

Further, since the crystal unit 3 is a surface mount type, it can be as thin as 0.5 mm in thickness. Further, since the quartz piece 31 is housed in a container made of glass or ceramics, the change over time of the oscillation frequency can be extremely reduced.

Further, a crystal oscillator used in a portable telephone is required to have a height of 3.5 mm or less. FIG.
As shown in the figure, the sum of the thicknesses of the bottom surface 14 of the terminal member 1, the semiconductor chip 5, and the mold of the resin 21 is approximately 1.5.
mm, the requirement can be met even when the quartz oscillator 3 having a thickness of 1.5 mm is used.

As the external terminal structure of the completed crystal oscillator, an external terminal conductor 43 is provided on the side surface of the terminal member 1 as shown in FIG. 1 to form a surface mounted crystal oscillator.

Next, a structure of a crystal oscillator according to another embodiment different from the above structure will be described with reference to FIGS. 7, 8 and 9. FIG. FIG. 7 is a perspective view illustrating a crystal oscillator according to another embodiment of the present invention, and FIG. 8 is a cross-sectional view illustrating a crystal oscillator according to another embodiment of the present invention. FIG.
FIG. 11 is a perspective view showing a crystal oscillator according to still another embodiment of the present invention.

In another embodiment shown in FIGS. 7 and 8, a plurality of cavities 18 having a concave shape are further provided at the bottom of the concave portion of the terminal member 1 described with reference to FIG. A second wiring conductor 9 is provided at the bottom of the cavity 18, and the passive component 11 such as a chip capacitor or a varicap diode is electrically connected to the semiconductor chip 5 using a bonding material 15 (see FIG. 8). I do.

To reduce the thickness of the crystal oscillator, the terminal member 1
It is indispensable to reduce the thickness dimension of the bottom of the concave portion.
However, if the thickness of the bottom of the concave portion of the terminal member 1 is reduced as a whole, the strength of the terminal member 1 becomes insufficient and the problem of warpage occurs.

Therefore, in another embodiment described with reference to FIGS. 7 and 8, a cavity 18 is provided by partially reducing the thickness of the bottom of the concave portion of the terminal member 1, and the height shape is reduced. The semiconductor chip 5 and the passive component 11 are dropped and arranged. This solves the problem of insufficient strength and warpage of the terminal member 1, and at the same time, further facilitates further reduction in thickness and weight of the crystal oscillator.

When the bottom of the concave portion of the terminal member 1 is a multilayer circuit board having a plurality of wiring conductors,
In some cases, a portion where the wiring conductor does not exist may occur. In that case, a cavity 18 is provided in a portion where the wiring conductor does not exist, and the semiconductor chip 5 having a height shape and the passive component 11 are dropped and arranged. As a result, the thickness of the crystal oscillator can be easily reduced.

In FIG. 7, for three cavities 18,
One semiconductor chip 5 and two passive components 11
The embodiment in which the components are dropped and arranged one by one has been described. However, depending on the application, a plurality of passive components 11 may be arranged for one cavity 18 as shown in FIG.

Similarly, for one cavity 18,
A plurality of semiconductor chips 5 may be arranged. Similarly, the semiconductor chip 5 is provided for one cavity 18.
And the passive component 11 may be mixed and arranged.

Further, depending on the use of the crystal oscillator of the present invention, the passive component 11 or the semiconductor chip 5 having a small height dimension may be
It may be arranged on the bottom surface 14 of the concave portion of the terminal member 1, and the passive component 11 or the semiconductor chip 5 having a large height may be dropped into the cavity 18.

As described above, the semiconductor chip 5 and the passive component 11 which are three-dimensionally arranged with the quartz oscillator 3 in the thickness direction are provided in the cavity 18 provided in the bottom surface 14 of the concave portion between the step portions 16.
By dropping and arranging the crystal oscillator, the bottom area of the crystal oscillator can be reduced, and the thickness of the crystal oscillator can be easily reduced. Of course, the height is thin and the cavity 1
8, the semiconductor chip 5 and the passive component 1 which do not need to be dropped
1 may be dropped into the cavity 18 and arranged.

As described above, the crystal unit 3 is connected to the step 16 via the bonding material 15,
Are three-dimensionally arranged with respect to the semiconductor chip 5 and the passive component 11.

As shown in FIG. 7, the step portion 16 is partially deleted, and the bottom of the concave portion of the space formed by the deletion is provided.
Passive components 11 can also be arranged. In this case, as compared with the embodiment shown in FIG. 1, a space where the semiconductor chip 5 and the passive component 11 can be arranged and the bottom surface 14 can be secured even in a portion formed by removing the step portion 16.

Conversely, if the number of semiconductor chips 5 and passive components 11 is the same as the structure shown in FIG.
Is removed, the semiconductor chip 5 and the passive component 11 can be arranged in the space created by the deletion, so that the area occupied by the crystal oscillator can be reduced as compared with the case where the step portion is arranged without deleting the step 16.

In some applications, the step 16 may be partially deleted at a plurality of locations. Further, the semiconductor chip 5 may be disposed in a space formed by removing the step portion 16, and the semiconductor chip 5 and the passive component 11 may be disposed in a space in which the step portion 16 is removed.

In another embodiment described with reference to FIGS. 7 and 8, a cavity 18 having a concave shape is further provided at the bottom of a concave portion formed by removing the step portion 16 and the cavity The passive component 11 is arranged at the bottom of the component 18. Thus, by disposing the passive component 11 and the semiconductor chip 5 in the space formed by removing the step portion 16, the bottom area of the oscillator can be reduced and the weight can be reduced.

Further, the thickness of the crystal oscillator can be reduced by arranging the semiconductor chip 5 and the passive component 11 arranged three-dimensionally with the crystal resonator 3 in the thickness direction in the cavity 18.

In the other embodiment shown in FIG. 8, the upper surface 12 of the terminal member 1 is electrically connected to the ground terminal of the terminal member 1 as in FIG. An embodiment having a metal frame 45 for joining the case 13 made of metal is shown.

Further, the inside of the metal frame 45 and the lid 29 made of metal necessary for noise suppression of the crystal unit 3 made of a surface mount type container are electrically connected with the joining material 15 made of a conductive adhesive or solder. The structure of the typical connection is shown.

With this structure, it is not necessary to provide a wiring for noise suppression in the container of the crystal unit 3, so that the manufacture becomes easy. In addition, since the electrode pad 25 for noise suppression of the crystal unit 3 is not required, the connection between the first wiring conductor 7 of the step 16 and the crystal unit 3 is facilitated.

The lid 29 of the crystal unit 3 may be made of conductive ceramics or resin. In this case, the conductivity may be determined by mixing a conductive powder with ceramics or resin when molding the lid 29, applying a metal film to the surface of the molded lid 29, or forming a conductive film on the molded lid 29. It is provided by applying a hydrophilic paint on the surface.

In another embodiment shown in FIG. 9, a first wiring for electrically connecting to the electrode pad 25 of the crystal unit 3 is provided on the upper surface of the step 16 of the terminal member 1 described with reference to FIG. Conductor 7 and a first component for making an electrical connection with the passive component 11.
The crystal resonator 3 and the passive component 11 are joined to each other via the joining material 15.

The crystal resonator 3 and the passive component 11 joined to the upper surface of the step 16 are three-dimensionally arranged with respect to the semiconductor chip 5 and the passive component 11 arranged on the bottom surface 14 of the recess. . The passive component 11 bonded to the upper surface of the step 16 is a sheet-shaped capacitor, a component in which the semiconductor chip 5 such as a diode is packaged with resin or ceramic, or a semiconductor chip 5 not packaged. The structure shown in FIG. 9 is effective when the mounting area of the semiconductor chip 5 and the passive component 11 is larger than the plane area of the crystal unit 3.

As described above, the step 16 is provided so as to hold both ends of the crystal unit 3 and the passive component 11.
Between the semiconductor chip 5 and the passive component 1
1 and the quartz oscillator 3 and the passive component 11 are three-dimensionally arranged in the thickness direction. As a result, the semiconductor chip 5
Even when the mounting area of the passive components 11 and the like is large, the area occupied by the crystal oscillator can be reduced.

Depending on the use of the crystal oscillator, the step 16
Either the semiconductor chip 5 or the passive component 11 may be arranged on the bottom surface 14 of the concave portion between them, and may be arranged three-dimensionally with the crystal resonator 3 in the thickness direction.

That is, the bottom surface 1 of the concave portion between the step portions 16
It is not necessary to dispose all the semiconductor chips 5 and the passive components 11 on the bottom 4, and all the semiconductor chips 5 and the passive components 11 disposed on the bottom surface 14 of the recess are connected to the quartz crystal resonator 3 that is joined to the step portion 16. It does not have to be arranged three-dimensionally with the component 11.

In another embodiment shown in FIG. 9, similarly to FIG. 7, a cavity 18 having a concave shape is further provided at the bottom of the concave portion of the space formed by removing the step portion 16.
The passive component 11 is arranged at the bottom of the cavity 18.
The description of the arrangement of the semiconductor chip 5 and the passive component 11 in the space formed by removing the step 16 is as described above.

Further, the description of providing the cavity 18 and disposing the passive component 11 and the semiconductor chip 5 at the bottom of the cavity 18 is as described above.

The bonding material 15 for electrically connecting the first wiring conductor 7 and the passive component 11 may be the anisotropic conductive adhesive described with reference to FIG.

Further, a bonding material 15 between the first wiring conductor 7 and the electrode pad 25 of the crystal unit 3 and a bonding material 15 between the first wiring conductor 7 and the passive component 11 are formed. And an anisotropic conductive adhesive. With this configuration, the first wiring conductor 7 and the crystal unit 3 on the upper surface of the step 16 are formed.
And the passive component 11 can be easily and simultaneously connected at a fine pitch.

[0074]

As described above, the crystal oscillator according to the present invention uses a surface-mounted crystal oscillator in which a crystal piece is hermetically sealed in a glass or ceramic container. Obtained easily.

Further, since the crystal unit is a surface-mounted type crystal unit in which a crystal unit is hermetically sealed, a non-defective product can be incorporated into a crystal oscillator after the characteristics of the crystal unit are independently evaluated. Therefore, the defect rate as a crystal oscillator can be reduced.

Further, in the crystal oscillator according to the present invention, the crystal oscillator and the semiconductor chip and passive components are not arranged in parallel on the same plane, but the semiconductor chip and the passive device as necessary are provided in the space below the crystal oscillator. Since the components and the components are arranged, the size and thickness of the crystal oscillator can be easily reduced.

Further, the terminal member is provided with a concave portion for mounting a semiconductor chip, and the crystal oscillator is three-dimensionally arranged on the semiconductor chip to electrically connect the wiring conductor of the terminal member and the electrode pad of the crystal oscillator. In this configuration, the bottom surface of the terminal member can be reduced, and the size, thickness, and weight of the crystal oscillator can be easily reduced.

Further, in the crystal oscillator of the present invention, a cavity having a concave shape is further provided at the bottom of the concave portion of the terminal member, and the passive component and the semiconductor chip are arranged at the bottom of the cavity. The semiconductor chip and the passive components can be efficiently arranged in the lower space, and the size, thickness, and weight of the crystal oscillator can be further easily reduced.

As described above, according to the present invention, the demand for a crystal oscillator required from a portable telephone or the like can be easily satisfied.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a crystal oscillator according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a crystal oscillator according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating a crystal oscillator according to an embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a crystal resonator used in the crystal oscillator according to the embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a conventional crystal oscillator.

FIG. 6 is a graph showing a change over time of a frequency of a crystal oscillator.

FIG. 7 is a perspective view showing a crystal oscillator according to another embodiment of the present invention.

FIG. 8 is a sectional view showing a crystal oscillator according to another embodiment of the present invention.

FIG. 9 is a perspective view showing a crystal oscillator according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Terminal member 3 Crystal oscillator 5 Semiconductor chip 7, 9 Wiring conductor 16 Step 25 Electrode pad 31 Quartz piece

Continuation of front page (56) References JP-A-3-280606 (JP, A) JP-A-4-3609 (JP, A) JP-A-3-19406 (JP, A) JP-A-5-243850 (JP) JP-A-6-350340 (JP, A) JP-A-3-272207 (JP, A) JP-A-10-70414 (JP, A) JP-A-5-88012 (JP, U) (58) Field surveyed (Int.Cl. ⁷ , DB name) H03B 5/32

Claims (12)

(57) [Claims] 1. A quartz resonator comprising a substantially rectangular crystal resonator and a terminal member, the terminal member including a recess in which a semiconductor chip is mounted and a wiring conductor for connecting the crystal resonator. Is an insulated terminal with a quartz piece fixed inside,
A conductive lid for hermetically sealing the quartz piece;
And the insulating terminal is connected to the ground of the
Provide electrode pads for electrical connection with wiring conductors
A quartz crystal, wherein the crystal resonator is three-dimensionally arranged with the semiconductor chip, and a wiring conductor of the terminal member and an electrode pad of the crystal resonator are electrically joined to be integrated. Oscillator. 2. The crystal oscillator according to claim 1, wherein a metal case having an electrical connection to a ground terminal of said terminal member is provided on an upper surface of said crystal resonator. 3. The crystal resonator and the terminal member, respectively.
Confirm that the interconnection electrodes have been formed at the corresponding positions.
The crystal oscillator according to claim 1 or 2, wherein 4. An external terminal conductor is provided on the bottom side of the terminal member.
Crystal oscillator according to any one of claims 1 to 3, characterized in that provided. 5. The external terminal conductor is provided on a bottom surface of the terminal member.
5. The device according to claim 4, wherein the device is provided from the side to the side.
The described crystal oscillator. 6. The terminal member is made of ceramics, glass, or the like.
2. The insulator according to claim 1, wherein
The crystal oscillator according to claim 2 . 7. The crystal oscillator according to claim 1, wherein said terminal member is made of glass epoxy resin . 8. The crystal oscillator according to claim 1, wherein said terminal member has a multilayer circuit board configuration . 9. A semiconductor chip in a recess of the terminal member.
3. The crystal oscillator according to claim 1, wherein a passive component is mounted . 10. A concave portion is further provided at a bottom of the concave portion of the terminal member.
A cavity having a shape is provided, and at the bottom of the cavity,
3. The crystal oscillator according to claim 1 , wherein a passive component and a semiconductor chip are mounted. 11. The crystal unit is mounted on the terminal member.
To cover all of the semiconductor chip and passive components
Claim 9 or claim 10 crystal oscillator according to characterized in that it is. 12. A step portion is formed on the inner surface of the concave portion of the terminal member.
Formed, and a crystal unit is bonded to the stepped portion.
The crystal oscillator according to claim 1, wherein