JP3294425B2 - Manufacturing method of package body in package type piezoelectric oscillator - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a packaged piezoelectric resonator odor incorporating a piezoelectric element such as piezoelectric ceramic element
Te is relates to the manufacturing method of the package body.

[0002]

2. Description of the Related Art Conventionally, a package type piezoelectric oscillator of this type has a piezoelectric element mounted on an upper surface of a base substrate made of a dielectric material, as described in, for example, JP-A-59-168713. The piezoelectric element is mounted such that both ends of the piezoelectric element are electrically connected to a first electrode film and a second electrode film formed on the upper surface of the base substrate, and the base substrate is provided with the first electrode film and the second electrode film. By forming a third electrode film at a portion between the electrode film and the base film, the base substrate has two capacitor functions for the piezoelectric element, and the piezoelectric element on the upper surface of the base substrate is moved to the upper surface of the base substrate. It was configured to be packaged with a cover case fixed to the cover case.

However, since the conventional package type piezoelectric oscillator is mounted on a printed board by directly soldering a base board having a capacitor function to the printed board, the capacitance of the capacitor is reduced.
It varies with the structure of the printed circuit board, the density of the printed wiring, the soldering, and the like. As a result, not only does the oscillation characteristic of the piezoelectric oscillator fluctuate, but also the size increases and the manufacturing cost increases considerably. Was.

In view of the above, the present inventor has proposed in a prior patent application (Japanese Patent Application No. Hei 5-2008075) a package body formed of an insulating material such as a synthetic resin into a chip type as shown in FIGS. 1, a piezoelectric ceramic element 3 is formed in a groove-shaped recess 2 formed on the upper surface of the piezoelectric element 1, and electrode films 3a and 3b at both ends of the piezoelectric ceramic element 3 are formed on inner surfaces of both ends of the groove-shaped recess 2. The lower terminal electrode films 7a, 8a formed on the lower surface of the package body 1 are mounted on the left and right ends of the package body 1 while being mounted so as to be electrically connected to the electrode films 4 and 5, respectively. The terminal electrode films 7b and 8b formed on the side surfaces, the upper terminal electrode films 7c and 8c formed on the upper surface of the package body 1, and the electrode films 4 for both elements are formed on the inner wall surface of the groove-shaped recess 2 of the package body 1. To 5 Inner surface terminal electrode film 7d formed so as to continue, a pair of connection terminal electrode films 7 and 8 made of a 8d
Is formed, and a cover plate 6 is formed on the upper surface of the package body 1.
And a package-type piezoelectric oscillator in which the lid plate 6 is fixed so as to hermetically seal the inside of the groove-shaped recess 2 of the package 1.

[0005]

The package-type piezoelectric oscillator according to the invention of the prior application has such advantages that it can be made smaller than the conventional one.

However, on the other hand, in the package type piezoelectric oscillator of the invention of the prior application, the connection terminal electrode films 7, 8 for both ends of the piezoelectric ceramic element 3 housed in the package 1 are formed. The lower surface terminal electrode films 7a and 8a on the lower surface of the package body 1, the side surface terminal electrode films 7b and 8b on the side surface, and the upper surface terminal electrode film 7 on the upper surface.
c, 8c, and inner terminal electrode films 7d, 8d on the inner wall surfaces of the groove-shaped recess 2, respectively.
The element electrode films 4 and 5 must be formed on the inner bottom surface of the substrate, and a great deal of trouble is required to form these electrode films, resulting in a significant increase in cost.

That is, when each of the electrode films is formed by plating a metal on the package body 1 made of synthetic resin, the package body 1 is formed of a liquid crystal polymer (L).
In the case of using a plating grade synthetic resin capable of plating a metal such as CP), metal plating is applied to a region of the surface of the package body 1 where the respective electrode films are not formed prior to the metal plating treatment. After performing a process of preventing adhesion or performing a metal plating process on the entire surface of the package body 1, a plating layer in a portion of the plating layer other than the electrode films is removed by photoetching, laser trimming, or the like. This requires a lot of trouble, and the cost is greatly increased.

In addition, the left and right inner wall surfaces of the groove-shaped recess 2 must be formed with a large outwardly inclined surface in order to perform the photoetching or laser trimming on the both inner wall surfaces. Therefore, the width of the package body 1 increases accordingly, which leads to an increase in the size of the package type piezoelectric oscillator.

Although the present invention follows the idea of the prior application, it can solve the above-mentioned problem of the prior invention.
It is an object of the present invention to provide a manufacturing method .

[0010]

In order to achieve this technical object, claim 1 of the present invention is directed to a method for accommodating a piezoelectric element.
The package body with the groove recess for
The electrode film for each element and each contact with the piezoelectric element in the body
The plurality of second portions where the connection terminal electrode film is not formed are
Non-plating grade synthetic resin that can not be
The two parts are integrally connected by a connecting member and molded.
Primary molding step, and each of the elements of the package body
Forming a plurality of first electrodes for forming the connection electrode film and each connection terminal electrode film.
Plating grade synthetic resin that can be plated with metal
Molding by the secondary molding process, and then
The entire package is plated with metal.
You . It is characterized by.

[0011] Further, claim 2 of the present invention relates to "a piezoelectric element
The package body having the groove-shaped recess for accommodating
Electrodes for each element of the package for the piezoelectric element
A plurality of first portions forming a film and each connection terminal electrode film;
Use a plating grade synthetic resin capable of plating metal.
The first parts are integrally connected to each other by a connecting member.
A primary molding step of forming, and each of the package bodies
A second method in which the element electrode film and the connection terminal electrode films are not formed;
Non-plated grade synthetic tree that cannot be metal plated
Molding by the secondary molding process of molding with grease,
Then, metal plating is applied to the entire package body.
Apply . It is characterized by.

[0012]

[Operation] As described above, in the package made of synthetic resin, the electrode film for each element and the terminal electrode film for connection are formed.
The first portion is made of a plating-grade synthetic resin, while the second portion of the package body, on which the element electrode films and the connection terminal electrode films are not formed, is made of a non-plating-grade synthetic resin. By plating the entire package with metal, the respective element electrode films and the respective connection terminals are formed only on the plating-grade synthetic resin portion except for the non-plating-grade synthetic resin portion of the package. An electrode film can be formed.

[0013]

Therefore, according to the present invention, the piezoelectric element can be accommodated.
The electrode film for each element and the terminal electrode film for each connection can be formed on the package made of synthetic resin by a very simple process, so that the cost required for forming these electrode films is greatly increased. Can be reduced to

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

In this figure, reference numeral 11 denotes a package made of a synthetic resin in the form of a rectangular chip. On the upper surface of the package 11, a groove 12 is formed. Element electrode films 14 and 15 are formed on inner surfaces of both right and left ends of the device electrode 12.

The package body 11 is formed with three connection terminal electrode films 17, 18, and 19, and the two connection terminal electrode films 17, 18, 19 at both ends of the three connection terminal electrode films 17, 18, 19 are formed. The terminal electrode films 17 and 18 are
1, the lower surface terminal electrode films 17a, 18 formed on the lower surface
a, the side surface terminal electrode films 17b and 18b formed on the side surface of the package body 11, the upper surface terminal electrode films 17c and 18c formed on the upper surface of the package body 11, and the inner wall surface of the groove-shaped recess 12 of the package body 11; The inner terminal electrode films 17 d and 18 d formed so as to be continuous with the connection electrode films 14 and 15, and the connection terminal electrode film 19 located at the center is a lower surface terminal electrode film formed on the lower surface of the package 11. 19a, a side surface electrode film 19b formed on the side surface of the package body 11, and an upper surface terminal electrode film 19c formed on the upper surface of the package body 11.

In this case, the package 11
A first portion 11a, 11b, 11c for forming the two-element electrode films 14, 15 and the connection terminal electrode films 17, 18, 19 on the package body 11; , 15 and each connection terminal electrode film 17,
Second portions 11d, 11e, 11 not forming 18, 19
f, 11g, and each of the first portions 11a, 11b, 11c forming the electrode film is made of, for example, a liquid crystal polymer (L
By mixing an appropriate amount of a metal catalyst such as palladium or gold with a synthetic resin such as CP), polyethersulfone (PES), or polyphenylene sulphite (PPS), a metal-plated synthetic resin is obtained. On the other hand, each second portion 11d, on which the electrode film is not formed,
11e, 11f, and 11g are made of a non-plating grade that cannot be metal-plated such as a synthetic resin such as liquid crystal polymer (LCP), polyethersulfone (PES), or polyphenylene sulfide (PPS) that does not contain a metal catalyst. The package 11 is made of synthetic resin, and the entire package body 11 is subjected to electroless plating or electroplating of metal, so that the parts 11a, 11b, and 11c made of the plating grade synthetic resin are applied to the two elements. The electrode films 14, 15 and the connection terminal electrode films 17, 18, 19 are formed.

Reference numeral 13 denotes a piezoelectric ceramic element. The piezoelectric ceramic element 13 is formed on a rod-shaped ceramic piece 13a and on the lower surface of the ceramic piece 13a so as to extend from one end to the other end. The piezoelectric ceramic element 13 includes a lower electrode film 13b and an upper electrode film 13c formed on the upper surface of the ceramic piece 13a so as to extend from the other end toward one end. Mold recess 12
One end of the lower electrode film 13b is fixed to one of the element electrode films 14 in the groove-shaped recess 12 with a conductive adhesive 20.
The other end of 3c is fixed to the other element electrode film 15 in the groove-shaped recess 12 by a conductive adhesive 21.

Further, reference numeral 16 denotes a cover plate made of a dielectric material such as barium titanate ceramic, and the lower surface of the cover plate 16 is provided with two capacitor functions for the cover body 16. , A capacitor first electrode film 16a, a capacitor second electrode film 16b, and a capacitor third electrode film 16c are formed.

The cover plate 16 is mounted on the upper surface of the package body 11 so as to cover the groove-shaped recess 12 in the package body 11, and then fixed with an appropriate adhesive 22. At this time, each of the capacitor first electrode film 16 a, the capacitor second electrode film 16 b, and the capacitor third electrode film 16 c on the lower surface of the lid 16 is connected to each upper surface terminal formed on the upper surface of the package 11. The electrode films 17c, 18c, and 19c are configured to be in electrical contact with each other by being in contact therewith.

Then, the package body 11 is divided into the first portions 11a, 11b, 11c for forming an electrode film.
Made of plating grade synthetic resin, no electrode film is formed
When the second parts 11d, 11e, 11f and 11g are made of non-plated grade synthetic resin and molded, the following method is adopted .

That is, first, as shown in FIGS. 7 to 9, the various electrode films of the package 11 are formed.
Each second part 11d, 11e, 11f, 11g which is not
Connecting members 11h, 11i, 11 connecting the second portions to each other;
j and integrally molded with a non-plated grade synthetic resin, and then the package 1
1, each of the first portions 11a for forming the various electrode films ,
As shown in FIGS. 10 to 12, the package body 11 is formed by secondarily molding 11b and 11c with a plating grade synthetic resin.

[0023] In this case, as another example, previously Dzu, as shown in FIG. 13, the out of the package body 11 each
Each first portion 11a, 11b, 11c for forming a seed electrode film
And said first portion of connecting the mutual member 11k, and the state of being connected integrally at 11m, molded primary by plating grade synthetic resin, then the package body 11
Each of the second portions 11d, 11 on which the various electrode films are not formed
e, 11f, and 11g are secondarily molded with a non-plated grade synthetic resin to form the package body 11 as shown in FIG.

The package body 11 molded through the primary molding step and the secondary molding step as described above is subjected to a metal electroless plating treatment or an electrolytic plating treatment. The parts 11d, 11e, 11d, 11e,
Except for 11f and 11g, the two-element electrode films 14, 15 and the connection terminal electrode films 17, 18, 19 can be reliably formed only on the portions 11a, 11b, 11c made of plating grade synthetic resin. It is.

Therefore, both the electrode films 14 and 15 and the terminal electrode films 17 and 1 are connected to the package 11.
8, 19 can be formed extremely easily by electroless plating of metal.

Moreover, even if the left and right inner wall surfaces of the groove-shaped recess 12 are perpendicular or nearly perpendicular to the upper surface of the package body 11, the inner terminal electrodes 17d, 18d Therefore, the width W of the package body 11 can be reduced, and the size and weight of the package-type piezoelectric oscillator can be reduced.

After the piezoelectric ceramic element 13 is loaded into the groove-shaped recess 12 of the package body 11 manufactured as described above, the cover plate 16 is fixed on the upper surface of the package body 11 to obtain the package mold. A piezoelectric oscillator can be manufactured, and after the piezoelectric ceramic element 13 is loaded into the groove-shaped recess 12 of the package body 11 manufactured as described above, a capacitor is previously mounted on the upper surface of the package body 11 and on the lower surface thereof. Electrode films 16a, 16b, 1
By fixing the cover plate 16 formed with 6c, a packaged piezoelectric oscillator having two capacitor functions can be manufactured.

[Brief description of the drawings]

FIG. 1 is a vertical sectional front view of a packaged piezoelectric oscillator according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a sectional view taken along line III-III of FIG.

FIG. 4 is a sectional view taken along line IV-IV of FIG.

FIG. 5 is a plan view taken along line VV of FIG. 1;

FIG. 6 is an exploded perspective view of a package type piezoelectric oscillator according to an embodiment of the present invention.

FIG. 7 is a perspective view showing a state where the package according to the present invention is primarily molded.

8 is a sectional view taken along line VIII-VIII of FIG.

FIG. 9 is a plan view of FIG. 7;

FIG. 10 is a perspective view showing a state where the package according to the present invention is subjected to primary molding and then secondary molding.

FIG. 11 is a sectional view taken along line XI-XI of FIG. 10;

FIG. 12 is a plan view of FIG. 10;

FIG. 13 is a perspective view showing a state where a package body according to the present invention is primarily formed by another embodiment.

FIG. 14 is a perspective view showing a state in which a package body according to the present invention is subjected to primary molding and then secondary molding according to another embodiment.

FIG. 15 is a longitudinal sectional front view of a conventional package type piezoelectric oscillator.

16 is a sectional view taken along the line XVI-XVI in FIG.

17 is a sectional view taken along the line XVII-XVII in FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 11 Package body 12 Groove type recess 13 Piezoelectric ceramic element 14, 15 Element electrode film 16 Cover plate 16a, 16b, 16c Capacitor electrode film 17, 18, 19 Terminal electrode film for connection 11a, 11b, 11c Electrode film is formed. First portions 11d, 11e, 11f, 11g Second portions 11h, 11i, 11j, 11k not forming an electrode film

Claims (2)

(57) [Claims] 1. A groove type recess for accommodating a piezoelectric element is provided.
Of the piezoelectric element of the package
The electrode film for each element and the terminal electrode film for connection
Non-metallic parts cannot be plated
The second parts are connected to each other with a plastic grade synthetic resin.
A primary molding step of integrally connecting and molding with a hook member,
The electrode film for each element and each connection in the package body
Plating of a plurality of first portions forming a terminal electrode film for use with metal
Molding using a plating grade synthetic resin that can be used
And then forming the entire package body.
The body is plated with metal.
A method for manufacturing a package in a cage-type piezoelectric oscillator . And a groove-shaped recess for accommodating the piezoelectric element.
Of the piezoelectric element of the package
The electrode film for each element and the terminal electrode film for connection
A plurality of first parts to be formed can be plated with metal.
Connecting member between the first parts with a synthetic resin
A primary molding step of integrally connecting and molding at
An electrode film for each element and a terminal for connection in the package body
The second portion where the electrode film is not formed cannot be plated with metal.
Secondary molding process of molding with non-plated grade synthetic resin and
And then the entire package body is
And metal plating.
Of manufacturing a package body in a piezoelectric vibrator .