JP3281457B2 - Board component mounting inspection method and inspection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for inspecting a component mounted on a board, and more particularly, to a component mounting inspection of a board on which components are mounted. The present invention relates to a method and an inspection apparatus for correcting and inspecting.

[0002]

2. Description of the Related Art Conventionally, in a component mounting board production line, a board such as a printed board is automatically set at a predetermined position, and a plurality of components are automatically mounted on the board. Next, the inspection device automatically inspects the appearance of the component mounting board, the presence / absence of missing parts, the positional shift, and the like based on the image data, and determines the quality of the component mounting board based on the result of the component mounting inspection. Has become.

[0003] However, the substrate to be inspected is slightly or slightly moved in parallel in the vertical and horizontal directions or rotationally moved by some influence to cause a positional shift with respect to a reference position for inspection. Such board displacements vary from board to board, causing erroneous determination in component mounting inspection.

In order to prevent erroneous determinations in inspection due to such a displacement of the substrate, a reference mark is previously attached to a certain position on the substrate, and the displacement of the substrate is corrected based on the mark. A known mark recognition method is known.

[0005]

However, in order to add a mechanical correction function to an inspection apparatus which does not have a function of mechanically correcting the positional displacement of the substrate to be inspected, the specifications of the mechanical part of the inspection apparatus must be specified. That is, there is a problem that hardware specifications must be changed significantly, which is troublesome and increases costs. In addition, the mark recognition method has a problem in that the dedicated image processing device is required, so that the product cost of the inspection device is increased.

Therefore, in the conventional inspection method, without changing the hardware specifications of the inspection apparatus,
There is a problem to be solved in that inspection is performed by correcting the displacement of the substrate by a simple method without employing the mark recognition method.

[0007]

In order to solve the above-mentioned problems, a board component mounting inspection method according to the present invention includes a predetermined area having reference image data used for inspection and based on X / Y-axis coordinates. An inspection method for performing component mounting inspection based on an inspection window provided with a plurality of components selected from components mounted on a board to be inspected, and the positions of the selected components are referred to as the reference image data. Comparing and calculating the positional deviation amount, calculating the positional deviation amount of the board based on the positional deviation amount, and correcting the position of the inspection window based on the calculated positional deviation amount to inspect the component mounting. In addition, the plurality of selected components are components mounted on the board to be inspected by different processes, respectively; the positional deviation amount of the component is determined by X of the selected plurality of components. / Based on Y coordinate Is that calculated by using the rotation center coordinates and the rotation angle.

[0008] The inspection apparatus is an inspection apparatus for performing component mounting inspection based on an inspection window having a predetermined area having reference image data used for inspection, and includes a plurality of components mounted on a board to be inspected. A displacement calculating means for selecting a component and comparing the position of each of the selected components with the reference image data to calculate a displacement, and calculating a displacement of the substrate based on the displacement; And a board position correction means for correcting the displacement of the inspection window based on the calculated positional deviation amount and inspecting the mounting of the component, and wherein the plurality of selected components are provided on the substrate to be inspected. The components must be mounted by different processes; the displacement of the components is calculated using the rotation center coordinates and the rotation angles based on the X / Y coordinates of each of the selected plurality of components. A.

[0009]

The method and apparatus for inspecting component mounting of a board according to the present invention perform component mounting inspection based on reference image data of a preset inspection window and image data obtained from the surface of the board on which components are mounted. And, from among the components mounted on the board, appropriately select a plurality of components, calculate the amount of positional shift of the board based on the amount of positional shift of each component,
Inspection is performed simply and accurately by offsetting the reference image data of all the components by the amount of displacement of the board, thereby correcting the displacement of the board in a pseudo manner. be able to.

[0010] Further, by performing the component mounting inspection using the image data of the inspection window shifted corresponding to the positional shift of the substrate to be inspected, the positional shift of the image data is substantially corrected by correcting the positional shift of the image data. Can be corrected.

In the above-described board position shift correction, by selecting, as a plurality of components to be selected, components mounted on the board by different processes and having an appropriate interval, a calculated value of the board position shift amount is obtained. Will not be biased.

Further, the component displacement amount is calculated using the coordinates of the center of rotation and the rotation angle based on the X / Y coordinates of each of the plurality of selected components, that is, the substrate is calculated using a so-called predetermined arithmetic method. The position shift amount can be calculated.

[0013]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a board component mounting inspection method and an inspection apparatus according to the present invention. In the present invention, an inspection apparatus capable of realizing the method for inspecting the component mounting of a board is a conventional inspection apparatus, for example, Poin.
The so-called t350 software scans (moves) a 2048-bit line sensor while
It has a function to capture the line image and obtain 2048 × 2048 pixels for inspection.
It is provided with a board position shift correction function.

An outline of the inspection apparatus 1 according to the present embodiment is shown in FIG.
As shown in the block diagram, a plurality of components are selected from the image data input unit 2 and the components mounted on the board to be inspected, and the position of each of the selected components is compared with the reference image data so as to be misaligned. A board position correcting unit 3 having a position shift amount calculating means for calculating an amount, calculating a position shift amount of the substrate based on the position shift amount, and correcting the inspection window based on the calculated position shift amount. The image processing unit 4 includes a board position correcting unit that inspects the mounting of components and a pass / fail determination unit 5.

The image data input unit 2 has a function of taking in image data of the surface of the board on which components are mounted.
As is well known, a 2048-bit line sensor constituted by a CCD, and a servomotor for moving the line sensor at a predetermined pitch in a direction perpendicular to its longitudinal direction (hereinafter referred to as CCD direction) (hereinafter referred to as scan direction). And a ball screw driven by the motor for setting the moving pitch.

The line sensor outputs pixel data of one line composed of 2048 pixels (pixels: PIX) in parallel. Then, the line sensor moves on the substrate surface at a predetermined pitch in the scanning direction and scans at 2048 lines. That is, one image is composed of 2048 × 2048 pixels.

The servo motor is driven by a pulse supplied from a drive circuit, makes one revolution at 1000 pulses,
The line sensor is moved in the X direction or the Y direction. The ball screw is for converting the rotation of the servomotor into the moving speed of the line sensor, and in this embodiment, the moving amount is set to 0.005 mm / pulse.

In the inspection apparatus of this embodiment, for example, P
Since the Oint350 software is used as it is, the mechanically driven part can be mechanically corrected in units of 0.005 mm in the two-axis (X, Y) direction similarly to the conventional inspection apparatus. However, because of the two-axis control, it is not possible to mechanically correct the rotational deviation of the substrate to be inspected itself. Note that the correction in 0.005 mm units is 0.
This corresponds to a ball screw set to 005 mm / pulse, and the setting can be changed as appropriate.

The board position correcting unit 3 selects a plurality of components mounted on the board by processes as different as possible, and detects a displacement of these components. Then, based on the displacement of each component, the board displacement is calculated and estimated statistically.

The image processing section 4 performs image processing by offsetting the reference image data by the board position shift amount obtained by the board position correction section 3 or its estimated value. Specifically, as will be described later, an inspection window for extracting the reference image data is shifted by the amount of the substrate position shift or the estimated value in a software manner, so that the inspection in which the substrate position shift is corrected in a pseudo manner. A new window is formed, and inspection data is extracted by the inspection window.

As is well known, the pass / fail judgment unit 5 inspects a part for missing parts or the like based on the test data obtained through the test window, and judges pass / fail.

As described above, the inspection apparatus 1 according to the present invention
Since both the displacement correction and the board inspection are performed by software using the reference image data for inspection, there is no need to change the mechanical operation, and the change in the tact time is based on the window position. The calculation time for correction and the time for transferring the corrected window position data to the image processing unit 4 (within 60 seconds) need only be added to the conventional tact time.

Here, the resolution of an image will be described in order to verify that it is possible to correct a substrate displacement using, for example, image data of Point 350 software.

The output of the line sensor is displayed as an image on a monitor screen. The resolution (accuracy) of the displayed image is determined as follows according to the size and pitch of the image. It is assumed that the length of the line sensor is adjusted to a field of view of approximately +10 mm in both the CCD direction and the scanning direction.

Images are classified into X images and Y images.
For example, an X image has a length in the scanning direction of 50 to 330 m.
m, the length in the CCD direction is 250 mm or 160 mm
And the length of the Y image in the scanning direction is 50 to 250.
mm, length in the CCD direction is 330mm or 200m
m.

A standard image and an enlarged image can be used for both the X image and the Y image. As shown in FIG. 2, for example, the maximum image of the standard X image has a length of 330 + 10 [mm] and a resolution of 0.16601562 in the scanning direction.
5 [mm / PIX] and the length in the CCD direction is 250
+10 [mm] and resolution of 0.126953125 [m
m / PIX]. The pitch is 33 [pulses / pitch] and 0.005 [mm / pulse].

By rotating the standard X image, the upper left end and the lower right end are, for example, 0.5 m in opposite directions from the horizontal position.
m, the rotational misalignment angle in this case is arc
tan (1/330) = 0.173623042 °.

The minimum image of the standard X image has a length of 50 + 10 [m] in the scanning direction, for example, as shown in FIG.
m] and the resolution is 0.029296875 [mm / PI
X], and the length in the CCD direction is 250 + 10 [m
m] and the resolution is 0.126953125 [mm / PI
X]. And the pitch is 6 [pulses / pitch]
It is.

Assuming that the above standard X image is rotated and the upper left end and the lower right end are displaced by 0.5 mm in opposite directions from the horizontal position, the rotation deviation angle in this case is arctan
(1/50) = 1.909152433 °.

The largest image of the enlarged X image has a length of 330 + 10 [m] in the scanning direction, for example, as shown in FIG.
m] and the resolution is 0.166015625 [mm / PI
X], and the CCD direction has a length of 160 + 10 [m
m] and the resolution is 0.083007812 [mm / PI
X]. The pitch is 33 [pulses / pitch] and 0.005 [mm / pulse].

Assuming that the above enlarged X image is rotated and the upper left end and the lower right end are displaced by 0.5 mm in opposite directions from the horizontal position, the rotation deviation angle in this case is arctan
(1/50) = 1.909152433 °.

The minimum image of the enlarged X image has a length of 50 + 10 [m] in the scanning direction, for example, as shown in FIG.
m] and the resolution is 0.029296875 [mm / PI
X], and the CCD direction has a length of 160 + 10 [m
m] and the resolution is 0.083007812 [mm / PI
X]. And the pitch is 6 [pulses / pitch]
It is.

When the enlarged X image is rotated and the upper left end and the lower right end are displaced by 0.5 mm in opposite directions from the horizontal position, the rotational deviation angle in this case is arctan
(1/50) = 1.909152433 °.

The maximum image of the standard Y image has a length of 250 + 10 [m] in the scanning direction, for example, as shown in FIG.
m] and the resolution is 0.126953125 [mm / PI
X], the CCD direction is 330 + 10 [mm], and the resolution is 0.166015625 [mm / PIX].
The pitch is 26 [pulses / pitch] and 0.0
05 [mm / pulse].

Assuming that the standard Y image is rotated and the upper left end and the lower right end are displaced by 0.5 mm from the horizontal position in opposite directions, the rotation deviation angle in this case is arctan
(1/330) = 0.173623042 °.

As shown in FIG. 7, for example, the minimum image of the standard Y image has a scanning direction of 50 + 10 [mm] and a resolution of 0.029296875 [mm / PIX], and the CCD direction has a length of 330 + 10 [mm]. mm] and the resolution is 0.166015625 [mm / PIX]. The pitch is 6 [pulses / pitch].

The minimum standard Y image is rotated so that the upper left end and the lower right end are 0.5 mm in opposite directions from the horizontal position, respectively.
If it is deviated, the rotational deviation angle in this case is arct
an (1/330) = 0.173623042 °.

The largest image of the enlarged Y image has a length of 250 + 10 [m] in the scanning direction as shown in FIG.
m] and the resolution is 0.126953125 [mm / PI
X], and the CCD direction has a length of 200 + 10 [m
m] and the resolution is 0.09765625 [mm / PIX]
It is. And the pitch is 26 [pulses / pitch]
And 0.005 [mm / pulse].

By rotating the maximum magnified Y image, the upper left end and the lower right end are 0.5 mm in opposite directions from the horizontal position, respectively.
If it is deviated, the rotational deviation angle in this case is arct
an (1/200) = 0.28474651 °.

The minimum image of the enlarged Y image has a length of 50 + 10 [m] in the scanning direction, for example, as shown in FIG.
m] and the resolution is 0.029296875 [mm / PI
X], and the CCD direction has a length of 200 + 10 [m
m] and the resolution is 0.09765625 [mm / PIX]
It is. And the pitch is 6 [pulses / pitch],
0.005 [mm / pulse].

The minimum enlarged Y image is rotated so that the upper left end and the lower right end are 0.5 mm in opposite directions from the horizontal position, respectively.
If it is deviated, the rotational deviation angle in this case is arct
an (1/200) = 0.28474651 °.

From the above, the resolution of all types of images in this embodiment is 0.0293 to 0.1660.
[Mm / PIX], of which the lowest resolution is the standard X image, and the highest resolution is
It is an enlarged X image.

The minimum size of a chip component to be inspected in this embodiment is 10 mm × commonly referred to as 1005.
The size is 5 mm. And, for example, 1 mm × 0.5
A part of about mm is displayed as a 6 × 4 [PIX] image.

A chip component now called 1005 moves in the scanning direction of the line sensor by, for example, 0.5
mm, a displacement of 3 [P
IX], and a 0.5 mm component displacement of the line sensor in the CCD direction appears as a 4 [PIX] displacement on the image.

When such misalignment of parts occurs,
Inspection criteria indicating the degree of tolerance vary depending on the board manufacturer.
The position deviation of 0% is the boundary of the pass / fail judgment.

According to this criterion, for example, 6 × 4
If the component displayed as an image in [PIX] is shifted by 0.5 mm, it is shifted by 50% or more of the component area, and is determined to be defective. However, in this case, if the displacement of the substrate itself occurs within the range of 0 to 50% of the component area, it may be determined to be defective even when there is no component displacement, and even if there is a component displacement, a non-defective product May be determined.

Therefore, in the present embodiment, the correction amount of the displacement of the substrate is set to 0.5 mm as a standard. Then, the size of one pixel of the minimum unit that can be corrected is 17 to the component size.
Since it is 25%, it can be seen that the correction of the substrate position shift is sufficiently effective even with the resolution of the conventional inspection apparatus.

Regarding the rotational displacement of the substrate, the upper and lower corners of the image are each 0.5 m in the opposite direction to the horizontal position.
When the window position can be corrected, for example, the Point 350
It is within a range that hardly causes a problem in terms of software detection ability. By the way, the ability of the inspection device Point 350 software to detect the rotational deviation only decreases the measured value by 5 to 10% in the case of rotation by 30 degrees.

Hereinafter, a method of correcting a substrate position shift by the substrate position correction unit 3 will be described. Initially, two or more reference windows are selected from the debugged inspection program. Next, using these reference windows, the displacement of the substrate on the image is detected by the window position correction function.

If the displacement of the substrate is a parallel movement in the X or Y direction, all windows are uniformly corrected by offsetting in the X or Y direction by the displacement amount. Then, the corrected coordinates of all windows are transferred to the image processing unit 4.

If the positional displacement of the substrate is a rotational displacement, a center point of rotation is obtained as described below, and the coordinates of all windows are corrected by applying a rotational offset about this center point. Then, the corrected coordinates of all windows are transferred to the image processing unit 4.

As shown in FIG. 10, the coordinates of the rotation center of the substrate are obtained as follows. Now, arbitrary two components A and B are selected, and coordinate data (X10, Y10) and (X20, Y20) of positions P10 and P20 of the components A and B on a reference board (substrate serving as a reference for inspection) are obtained. Determined from image data.

The positions P of the components A and B on the board to be inspected
11, P21 coordinate data (X11, Y11), (X2
1, Y21) is obtained from the image data.

These points P10, P20, P11, P2
Based on the coordinate data of No. 1, the coordinates (Xc, Yc) of the rotation center Pc of the substrate to be inspected are obtained as follows.

First, straight lines parallel to the X axis passing through the points P10, P20, and Pc are respectively represented by x0, x1, and x.
c, and a straight line parallel to the Y axis passing through the point P11 is represented by y.
It shall be represented by 1.

The angle C0 between the straight line x connecting the point P10 and the point P20 and the straight line x0, and the angle C1 between the straight line b connecting the point P11 and the point P21 and the straight line x1 are as follows. expressed. C0 = arctan @ (Y20-Y10) / (X20-
X10)｝ C1 = arctan ｛(Y21-Y11) / (X21-
X11)｝

The difference angle C of the inclination between the straight line a and the straight line b is expressed as follows. C = C1-C0

A straight line d connecting point P10 and point P11
Is d = √ ｛(Y11−Y10) ² + (X11−X1
0) ² ｝.

The angle C2 between the straight line d and the straight line x0 is: C2 = arctanａｒ (Y11−Y10) / (X11−
X10)｝.

Length L of straight line e connecting point P11 and point Pc
Is represented by L = d / {2 × sin (C / 2)}.

The angle C3 between the straight line e and the straight line y1 is expressed as follows. That is, if C> 0, C3 = C2 + (π + C) / 2 If C <0, then C3 = C2− (π + C) / 2.

Using the length L and the angle C3 of the straight line e obtained as described above, the coordinates Xc and Yc of the point Pc are obtained as follows. Xc = X11 + LsinC3 Yc = Y11 + LcosC3

Next, the coordinate data (X
The inspection window is corrected as follows using (c, Yc).

In FIG. 11, P10 (X10, Y1
Assuming that 0) is the current inspection window position, the coordinates of a new inspection window position P11 (X11, Y11) rotated by an angle C about the point Pc are as follows. X11 = Xc + (X11−Xc) × cosC + (Y11
−Yc) × cos (C + π / 2) Y11 = Yc + (Y11−Yc) × sin (C + π /
2) + (X11−Xc) × cosC

In order to calculate the coordinates of the center point Pc from the data of the three inspection windows and perform the correction calculation of the 4096 inspection windows, a floating point operation of 2048 steps (1 step = 2 windows) And the required time is about 8 seconds. In this case, the value of the trigonometric function is calculated in advance based on the rotation angle, and the actual calculation is performed only by the four arithmetic operations of the floating point.

Here, 4096 calculated as described above is obtained.
The window correction data is transmitted to the image processing unit 4 by A
It is assumed that data is transferred at 30 bytes per window by an SCII (HEX.) Character string.

In order to correct the window position, step No. , Window No. A command format for transferring window offset data has been newly added.

Since the window offset data changes each time an image is taken, a command for clearing the offset data is also added.

Here, the time required for data transfer from the board position correction unit 3 to the image processing unit 4 will be examined.
If it is necessary to transfer 11 bytes including the response code for one window, the time required for transferring 4096 windows is 4096 [window] × 11 [bytes] × 11 [bits] / 9600 [bits / Second] = 51.6 seconds.

The time required to clear the offset data of 2 bytes × 4096 windows is: 21 [T] × 0.25 [μSEC] × 4096 [bytes] × 2 [XY offset] = 43.0 [mSEC] ].

The time required for adding the offset during image measurement is 146 [T] × 0.25 [μSEC] × 4096 [bytes] × 2 [XY offset] = 299 [mSEC].

Therefore, the inspection time is extended up to about 60 seconds for the calculation of the positional deviation correction. Most of the time is the time required to transfer the offset data, and the number of windows to be inspected is usually six.
It is about 00 to 800, and it is understood that the current communication specifications are sufficient, considering that no transfer is performed when the offset is 0.

Therefore, it is necessary to change commonly used software specifications as follows.

(1) Image Import Parameter File At the end of the conventional file structure, a board position correction flag and a board position correction reference window step No. , Board position correction reference window No. Add a program that handles. Therefore, menus other than printing require at least recompilation. In the file management menu, there is no need to change modules that have fixed numerical values.

(2) Parameter setting menu As shown in FIG. 12, the last page of the conventional setting menu is used as a test operation parameter, a stamp and a board holding parameter are grouped together, and a selection item as to whether or not to perform board position correction. Add. The setting of this item is stored in the parameter file as a board position correction flag.

(3) Edit menu When "substrate position correction reference setting" is selected by a function key, a window as shown in FIG. 13 is displayed, and the setting of a reference window for substrate position correction is started. The content set here is stored in the parameter file.

In the setting of the substrate position correction reference window shown in FIG. 13, when a correction check is instructed, the position of the substrate is detected for the already captured image by the set inspection window.

As a result of the board position correction, when the board is moving in parallel in the X and Y directions, the amounts of movement of the X and Y are displayed. And display the rotation angle.

If the captured image is a reference image and the set inspection window has been debugged, no deviation is theoretically detected.

(4) Test Menu There is no new operation menu added to the test menu. However, when the substrate position correction is selected, a message indicating that the inspection time is extended is displayed. Also, although the substrate position correction is selected, the reference window is set to 2
If one or more are not set, a message indicating that it is impossible to execute the substrate position correction is displayed, and a normal inspection is performed.

The inspection apparatus according to the present embodiment, for example, Poin
The operation for causing the t350 software to execute the substrate position correction is performed as follows. (1) Selection of whether or not to use the substrate position correction function In the parameter setting menu, select “Yes / No” in the “Substrate position correction” item. The selected content is saved in the parameter file.

(2) Setting of the board position correction reference window In the “board position correction reference setting” in the edit menu, the step No. And window No. Set up to four. The set contents are saved in the parameter file.

When the substrate position correction menu is selected and up to four substrate position correction reference windows are set,
The inspection device performs the inspection according to the flowchart shown in FIG.

First, reference image data of a board on which components are mounted is taken into the image processing section 4 (step S1). All the offset values of the inspection window are set to zero (step S2), and the search for the image is executed by the reference window. (Step S3).

Next, when a parallel or rotational displacement of the substrate is detected (step S4), an offset value to be applied to the inspection window is calculated (step S5). Next, component inspection by image measurement is performed using a new inspection window offset by the calculated offset value (step S6).

Finally, a bad mark check is performed on the inspection result, and a pass / fail judgment is made (steps S7 to S7).
9).

In FIG. 14, when compared with the specifications of the conventional inspection apparatus, steps S1, S7 to S9 (indicated by solid lines) are processing without any specification change, and steps S2, S7
Steps S3 and S6 (indicated by dotted lines) are processing in which the specifications of the image processing unit are changed, and steps S4 and S5 (indicated by dashed lines) are processing in which the specifications of the software are changed.

[0088]

As described above, the board component mounting inspection method and the inspection apparatus according to the present invention provide the conventional image processing capability without changing the mechanical configuration and hardware specifications of the conventional inspection apparatus. By incorporating software that can cope with a rotated positional deviation by utilizing the above, component mounting inspection can be performed while correcting the substrate positional deviation. Therefore, the performance of the conventional inspection apparatus can be significantly improved without changing the product cost.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a basic configuration of an inspection apparatus to which a method for correcting a substrate displacement according to the present invention is applied.

FIG. 2 is an explanatory diagram showing a resolution of a maximum standard X image in the inspection apparatus.

FIG. 3 is an explanatory diagram showing a resolution of a minimum standard X image in the inspection apparatus.

FIG. 4 is an explanatory diagram showing a resolution of a maximum enlarged X image in the inspection apparatus.

FIG. 5 is an explanatory diagram showing a resolution of a minimum enlarged X image in the inspection apparatus.

FIG. 6 is an explanatory diagram showing a resolution of a maximum standard Y image in the inspection apparatus.

FIG. 7 is an explanatory diagram showing a resolution of a minimum standard Y image in the inspection apparatus.

FIG. 8 is an explanatory diagram showing a resolution of a maximum enlarged Y image in the inspection apparatus.

FIG. 9 is an explanatory diagram showing a resolution of a minimum enlarged Y image in the inspection apparatus.

FIG. 10 is an explanatory diagram showing a procedure for obtaining coordinates of a rotation center of a substrate.

FIG. 11 is an explanatory diagram showing a procedure for correcting an inspection window.

FIG. 12 is an explanatory diagram showing an operation menu.

FIG. 13 is an explanatory diagram showing a display for setting a substrate position correction reference window.

FIG. 14 is a flowchart showing an inspection procedure according to the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Inspection apparatus 2 Image data input part 3 Board position correction part 4 Image processing part 5 Pass / fail judgment part P10, P11, P20, P21 Position of components on an image Pc Rotation center of substrate C Rotation angle of substrate

Claims (6)

(57) [Claims] 1. An image processing apparatus having reference image data used for inspection.
Inspection window having a predetermined area based on X / Y-axis coordinates
An inspection method for performing component mounting inspection based on a dough, wherein a plurality of components are selected from components mounted on a board to be inspected,
Each position of the selected component is compared with the reference image data to calculate a position shift amount, a position shift amount of the board is calculated based on the position shift amount, and based on the calculated position shift amount. A component mounting inspection method for a substrate, wherein the mounting of the component is inspected by shifting and correcting the inspection window . 2. The method according to claim 1, wherein the plurality of selected parts are
The components mounted on the inspection board by different processes
The component mounting of the board according to claim 1, wherein:
Inspection methods. 3. The displacement amount of a part is determined by a plurality of selected parts.
Rotation center coordinates and rotation angles based on X / Y coordinates of each part
3. The method according to claim 1, wherein the calculation is performed using degrees.
3. The board component mounting inspection method according to 1. 4. It has reference image data used for inspection.
Component mounting based on an inspection window with a predetermined area
An inspection device for performing an inspection, wherein a plurality of components are selected from components mounted on a substrate to be inspected,
Position shift amount calculating means for calculating the position shift amount by comparing each position of the selected component with the reference image data,
A board position correcting means for calculating a board position shift amount based on the position shift amount, and shifting and correcting the inspection window based on the calculated position shift amount to check component mounting. 5. The apparatus according to claim 5, wherein the plurality of selected parts are
The components mounted on the inspection board by different processes
The inspection apparatus according to claim 4, wherein the inspection apparatus is provided. 6. The position shift amount of a component may be selected from a plurality of selected ones.
Rotation center coordinates and rotation angles based on X / Y coordinates of each part
7. The method according to claim 5, wherein the calculation is performed using degrees.
The inspection device according to item 1.