JP3263349B2 - Component heat treatment apparatus and chip bonder using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a method in which a component is placed on a carrier, and the carrier is sent through a tunnel-shaped furnace to heat-treat the member. The carrier relates to an apparatus for returning the carrier to the entrance side and mounting the next member.

[0002]

When processing the Related Art discrete components, it is made of heat-treating send the tunnel furnace loaded parts of it to the carrier. In this case, the heat treatment is simply heat treatment, heat treatment in a special atmosphere gas, or processing in a high-temperature atmosphere. Such heat treatment in the apparatus is fed component loaded on the carrier is finished heat treatment the next step is taken out from the carrier when leaving the tunnel furnace, empty carrier put back tunnel furnace placed green part of It is sent to the entrance side of the tunnel furnace as much as possible. Therefore, this type of apparatus is provided with means for transporting carriers, for example, a conveyor, in parallel with the tunnel furnace.

[0003]

However, in the conventional apparatus as described above, since the carrier cools down while being circulated, a large amount of energy is required for heating when the carrier has a large heat capacity. It is necessary to lengthen the tunnel furnace or reduce the feed speed. Therefore, the present invention provides a heat treatment apparatus capable of reducing the cooling in the transport of the carrier and shortening the tunnel furnace for the heat treatment as much as possible, and increasing the transport speed of the carrier.

[0004]

SUMMARY OF THE INVENTION The present invention to solve the aforementioned problem, by placing the individual separate components on the carrier, in the heat treatment apparatus of the pressurized heat component sends a tunnel furnace that carrier, the said tunnel furnace, comprise a conveying path of the feed that part article is conveyed toward the exit the placed carrier from the inlet, and a conveyance path of the return conveying the empty carrier toward the inlet from the outlet It is characterized by. According to this configuration, the carrier sent to the entrance side is returned in a state where the carrier is heated in the tunnel furnace, so that parts can be placed on the carrier and flow therethrough, so that time for heating the carrier can be saved, and accordingly the tunnel can be reduced accordingly. The furnace can be shortened and the carrier feeding speed can be increased. Furthermore, not mounting the Rino conveying path returns the empty carrier of the conveying path of the feed to the outlet side of the tunnel furnace
May be provided with a replacement El put replacement means.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The components and carriers applied to the apparatus of the present invention may be of any type, but the effect is particularly remarkable when a carrier having a large heat capacity is used. The content of the heat treatment may be a process of simply applying heat or a process of applying heat in a special gas atmosphere. But it is good.

[0006] conveying path and the return conveyance path of the feed may be as a rail for transporting put the carrier may be a rail for conveying supported form down to Ri suspended carrier. Furthermore,
A feeding driving means may be separately provided, or a feeding path itself may be moved like a belt conveyor, for example. Transport path of the transport path and the return of the feed to the carrier that has completed thermal treatment lead component at the exit end of the tunnel furnace can be constructed as moves to the transport path of the return naturally, placing another thing <br / > A replacement means may be provided. Since the former case must have R in accordance with the magnitude of the carrier, may latter <br/> side is Ru can structure compact, can be selected depending on the application.

[0007] Similarly, the entrance side of the tunnel furnace may be configured so that the empty carrier which has been circulated by connecting the feed conveyance path and the return conveyance path naturally moves to the feed conveyance path. may be provided mounting was re means as being.

If the present invention is applied to a chip bonder used for assembling a semiconductor device, for example, a power system in which a silicon chip is mounted on a separate metal stem via a metal disk, or a separate ceramic substrate. It is suitable for a hybrid IC in which a semiconductor chip is mounted or a chip bonder for a silicon pressure sensor in which a sensor chip made of silicon is mounted on a metal stem via a silicon base member. In this case, the stem or the ceramic substrate corresponds to the component in the present invention. A disk or a silicon pedestal can also be a component in the present invention. Of course, in the case of a chip bonder, a chip mount position is provided, and a hole provided in a tunnel furnace to supply and assemble semiconductor chips directly to a base such as a stem or a ceramic substrate, or to a base part before or after mounting the base. And a transfer means such as a suction nozzle for transferring the semiconductor chip through.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An example in which the present invention is applied to a chip bonder will be described with reference to the drawings. FIG. 1 is a conceptual plan view thereof. 1
Reference numeral 00 denotes a tunnel furnace, which will be described later in detail. A stem on which the carriers 10, 10 are mounted from the left to the right on the paper is shown on a feed rail (row in the upper side of the paper = conveyance path of the feed) (see FIG. Sent at steps per disk interval. Then, the carriers 10, 10 are sequentially pushed back from the right to the left on the paper on the return rail (row on the lower side of the paper = returning conveyance path) (see FIG. 2) which is similarly arranged. 200 is the tunnel furnace 10
The carrier reloading device disposed on the entrance side of the tunnel 0, which has a feed rail and a return rail connected to the feed rail and the return rail of the tunnel furnace 100, respectively, as will be described in detail later, and reloads the pushed back carrier 10 on the feed rail. A pusher 210 is provided. Reference numeral 300 denotes a carrier reloading device arranged on the exit side of the tunnel furnace 100, which has a feed rail and a return rail connected to a feed rail and a return rail of the tunnel furnace 100, respectively. Pusher 310 to replace on return rail
And a pusher 330 that pushes the carrier that has moved to the return rail and the carrier 10 sequentially pushes the previous carrier to push it back to the entrance-side carrier transfer device.

Next, FIG. 6 for explaining the carrier 10
6A is a plan view, and FIG. 6B is a cross-sectional view taken along line AA in FIG. The carrier 10 is a rectangular metal block, and has a stem (not shown) at regular intervals in the longitudinal direction. A plurality (5 in this case) is provided. A counterbore 12 for a disk is provided for mounting a disk (not shown) in the same positional relationship corresponding to the counterbore 11 for each stem. A feed hole 13 is provided at the same interval as the pitch of the counterbore 11 and 12 along the long side to feed a later-described feed claw and feed the step. Incidentally, reference numerals 14 and 15 denote elongated holes scattered for absorbing strain in order to prevent deformation by heat, and penetrating the front and back surfaces. The stem (not shown) applied to the stem counterbore 11 is provided with a pin hole 16 for allowing the stem (not shown) to be provided with a downwardly directed lead pin. The carrier on which the stem having the pins extending downward in this manner is thicker, and therefore has a large heat capacity, and is a handicap, for example, requiring a long furnace.

The tunnel furnace 100 will be described in more detail. FIG. 2 shows a cross section viewed from the entrance side. A heat block 101 having a U-shaped cross section extends long with an opening upward, and heaters 102 are provided at appropriate intervals in a lower block.
Is embedded and heats the heat block 101. A cover plate 103 is provided so as to cover the opening of the concave portion, and the tunnel furnace 100 is formed. In the tunnel, a return rail 111 having a U-shaped cross section with an opening facing upward and a feed rail 112 having an L-shaped cross section are arranged so as to abut against the side wall thereof. And the returning carrier 10b move with the position regulated. An inert gas such as nitrogen gas or a mixture of a reducing gas such as hydrogen gas is introduced into the tunnel to form a non-oxidizing atmosphere. Hole 1 where needed on lid plate 103
A furnace 04 is provided to access the inside of the furnace from outside. For example, reference numeral 105 denotes a feed claw that engages with the feed hole 13 of the feed carrier 10a through the hole 104 and feeds at the pitch of the feed hole 13 by a square-shaped operation. This feed claw 105
Although not shown in FIG. 1, they are arranged on the carriers 10 on the feed rail (including those on the carrier transfer devices 200 and 300). Therefore, the cover plate 103 is provided with holes.

Further, the tunnel furnace 100 has a stem supply position P1, a disk supply position P2, a chip mount position P3, a solder supply position P4, and a disk mount position P5. A stem (not shown) is sequentially supplied from outside to a stem counterbore 11 by a transfer device (not shown) such as a robot.
At the disk supply position P2, a disk (not shown) supplied to an external fixed position on the disk counterbore 12 of the carrier 10 conveyed here is suction-held by a suction nozzle (not shown) and sequentially transferred and supplied. At the chip mount position P3, semiconductor chips (not shown) positioned at an external fixed position on the surface of the disk on the carrier 10 conveyed here are suction-held by suction nozzles (not shown) and sequentially transferred and supplied. At the solder supply position P4, solder, for example, a gold-silicon eutectic alloy piece is sequentially supplied from the outside onto a stem (not shown) on the carrier 10 transported here. At the disc mounting position P5, a disc (not shown) with a semiconductor chip mounted thereon, which has been simultaneously sent onto a stem (not shown) on which the solder has already been supplied, on the carrier 10 conveyed here, is sucked by a suction nozzle. Transfer and assemble. Therefore, in each of these positions, the cover plate 103 is provided with the holes 104 for the above-mentioned tools to access. In FIG. 2, reference numerals 106 and 106 denote heat shield members for preventing the heat of the tunnel furnace 100 from exerting a harmful effect on equipment parts and works arranged in the vicinity.

Next, the carrier reloading device 20 on the entrance side
0 will be explained. FIG. 3 is a plan view conceptually showing it, and FIG. 4 is a sectional view taken along line BB. The carrier reloading device 200 is arranged so that a rail holding block 201 having a U-shaped cross section similar to the heat block 101 in the tunnel furnace 100 and having an opening facing upward extends to the heat block 101. However, since the heat block 101 expands and contracts due to thermal expansion during operation or non-operation, it is better to provide a small interval. If the interval is set, the heat of the heat block 101 is less likely to be wasted to the rail holding block 201, which is convenient. A return rail 231 and a feed rail 232 are respectively provided in the recesses of the rail holding block 201 in the same manner as in the tunnel furnace 100.
11 and the feed rail 112 are arranged to extend.
A pusher (first pusher) 210 that pushes and moves the carrier 10c having the return rail 231 pushed back to a predetermined position against the feed rail 232 is provided. Pusher 2
10 is driven by an appropriate actuator such as an air cylinder 211.

Thus, the carrier 10 is pushed by the pusher 210.
c is moved in a horizontal direction by pushing the rail holding block 201 and the pusher 21 of the return rail 231.
The side wall on the 0 side has at least a portion corresponding to the pusher 210 as shown in FIG.
0c is set low enough. Further, the side wall between the return rail 231 and the feed rail 232 is removed at a portion corresponding to the carrier 10c to be repositioned and moved, so that the carrier 10c can be pushed and moved. Instead, it retreats downward when reloading, and moves upward when transporting the carrier on the rail.
Is provided so as to be able to move forward and backward by an actuator such as an air cylinder 221.

Next, the outlet-side carrier transfer device 300 will be described. FIG. 5 is a plan view conceptually showing this. This device finishes feeding on the feed rail by a feed claw (not shown) and pushes the carrier 10d at a fixed position into the pusher 3.
It has a function of pushing on 10 and reloading it on the return rail, which is similar to the carrier reloading device 200 on the entrance side. That is, a rail holding block 301, a return rail, a feed rail, a pusher 310 (second pusher), and a guide plate 320 are similarly provided. Therefore, description of this part is omitted. This device further pushes the carrier 10e that has been replaced on the return rail, and the pressed carrier 10 sequentially pushes the previous carrier 10 so that the foremost carrier 10c stops at a predetermined position of the entrance-side carrier reloading device 200. And a pusher 330 (third pusher).
A work take-out position P6 is also provided in which the carrier 10 is fed on the feed rail by the feed claw 105, and the disc and a stem (not shown) on which the semiconductor chip is mounted are sequentially taken out by a pickup means such as a robot. I have.

Next, a more detailed configuration will be described while explaining the operation of the chip bonder. The carrier 10 shown in FIG.
Indicates a state in which each carrier 10 has been sent by each feed claw 105. (1) Next, first, the guide plates 220 and 32 of the carrier transfer devices 200 and 300 on both the entrance side and the exit side, respectively.
0 descends and retreats. (2) then a final Ete position feeding the pawl 105 feed at the beginning on the rail pusher 310 sends along with the pusher 210 is reloaded into the return head at a feed press carrier 10 that is stopped in position rail on the rail The stopped carrier 10 is pushed and replaced on the return rail. And the pusher 210 and 310 Ru back to the original. (3) Subsequently, the guide plates 220 and 320 are arranged so as to rise, and the carriers 10 on the feed rail are fed at the pitch of the feed holes 13 of the carriers 10 by the feed claws 105 engaged with the respective guides. Then, the stem was supplied at the stem supply position P1, the disk was supplied at the disk supply position P2, and the temperature was raised to a temperature sufficient to melt the solder by being sent through the tunnel furnace 100 with both being mounted on the carrier 10. At the chip mounting position P3, a semiconductor chip made of silicon whose back surface is thickly plated with gold is supplied onto the disk. Then, gold and silicon are eutectic , soldered, and mounted. Further, the carrier is sent, and solder pieces made of, for example, a gold-silicon eutectic alloy are sequentially supplied onto the stem at the solder supply position P4. Then the solder pieces melt and spread on the upper surface of the stem. In this state , the disk is sent to the disk mount position P5, where the disk on which the semiconductor chip is mounted is picked up by the suction nozzle, moved to the stem to which the solder is supplied, and mounted. (4) While the carrier 10 is being stepped on the feed rail as described above, while the disk or the semiconductor chip is being assembled to the stem, the pusher 330 pushes the pushed carrier 10 on the return rail at the exit side on the return rail. The pushed carriers 10 sequentially push the previous carrier 10, and when the leading carrier 10 reaches a predetermined position, the pusher 330 returns to the original position. (5) When the step feed for one carrier is completed, the state returns to the initial state, and thereafter the steps (1) to (4) are repeated.

According to this embodiment, since the empty carrier 10 is circulated in the tunnel furnace 100, the temperature is high due to the residual heat when the parts (stems) are mounted and re-enter the tunnel furnace, and the temperature of the parts rises quickly. Therefore, even when the carrier 10 is block-shaped and has a large heat capacity as in this embodiment, there is an effect that the tunnel furnace can be shortened or the feeding speed can be increased.

In this embodiment, the empty carrier 10 which has been replaced on the return rail at the outlet side is pushed by the pusher 31.
2 is pushed, and the pushed carrier 10 is sequentially the previous carrier 1
The method of pushing back 0 is that, for example, by means such as a belt conveyor, a route for returning an empty belt must be provided above or below the tunnel furnace, and the upper side will obstruct the supply of chips and the supply of solder. This is because the lower side prevents the semiconductor chip from being transported as short as possible by setting the XY table for placing the semiconductor chips in a substantially aligned state and sequentially aligning them with the pickup position as high as possible.

[0019]

As described above, according to the apparatus of the present invention, since the carrier is pre-heated, the temperature of the parts is stably increased at a high speed, and the size of the tunnel furnace is reduced and the processing speed is improved. It is informative.

[Brief description of the drawings]

FIG. 1 is a conceptual plan view of an embodiment of the present invention.

FIG. 2 is a sectional view of the tunnel furnace part.

FIG. 3 is a conceptual plan view of a carrier reloading device arranged on the entrance side.

FIG. 4 is a sectional view taken along the line BB.

FIG. 5 is a conceptual plan view of a carrier reloading device disposed on the exit side of a tunnel furnace.

FIG. 6A is a plan view of a carrier. (B) It is sectional drawing along the AA line.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Carrier 100 Tunnel furnace 112 Feed rail (feeding conveyance path) 111 Return rail (returning conveyance path) 105 Feeding claw 330 Pusher 200, 300 Carrier reloading device

Claims (4)

(57) [Claims] Placing a 1. A discrete components to a carrier, in the heat treatment apparatus of the part to heat the carrier sends a tunnel furnace, the said tunnel furnace, a carrier from the entrance part article is placed A component heat treatment apparatus, comprising: a feed conveyance path for conveying an outlet; and a return conveyance path for conveying an empty carrier from an exit toward an entrance. (2) Place the individual substrates on the carrier and
The rear is placed inside the tunnel in a non-oxidizing atmosphere.
Heats the substrate by sequentially sending it at a pitch and semiconductors at predetermined positions
In a chip bonder for assembling chips,Is the substrateInsert the carrier on which
Transport path for transport from the outlet to the exit, and
Transport path for transporting empty carriers toward the entrance
And a chip bonder. Conveyance path wherein the back is a rail placing a carrier, the outlet side of the pre-Symbol tunnel furnace pushing an empty carrier which is placed on the transport path before Symbol return, the carrier is in front The chip bonder according to claim 2, further comprising a pusher that pushes the carrier row and pushes a leading carrier back to a predetermined position on the entrance side of the tunnel furnace. 4. The chip bonder according to claim 2, further comprising a carrier reloading device for reloading the carrier between the transport paths at an entrance side and an exit side of the tunnel furnace.