JP3257372B2 - Oscillator - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an oscillator having a control element for controlling oscillation.

[0002]

2. Description of the Related Art For example, an oscillator having a temperature compensation function has an oscillation element and a control element mounted on a substrate, and the control element controls the oscillation.

[0003]

The problem with the above arrangement is that the oscillation element and the control element must be provided side by side on the substrate, which increases the size of the substrate.

An object of the present invention is to reduce the size of a substrate.

[0005]

In order to achieve this object, the present invention provides a control device and an oscillating device which are mounted on a substrate by superimposing them vertically so that the electrodes of the lower device are exposed. Bring the exposed electrode of the lower element and the electrode of the upper element as close as possible with a bonding wire.
The connection is made in such a manner that the size of the substrate is reduced.

[0006]

According to the first aspect of the present invention, a control element and an oscillating element are mounted vertically on a substrate, so that the size of the substrate can be reduced.

Also, since the electrodes of the lower element are exposed despite such vertical stacking, they can be easily connected to the electrodes of the upper element by bonding wires.

[0008] In addition, such connection using a bonding wire suppresses frequency fluctuation of the oscillation element.

That is, when these electrodes are connected by a wiring pattern provided on the substrate, the oscillation frequency greatly changes due to a large change in the parasitic capacitance of the wiring pattern due to moisture absorption of the substrate. When connected, the bonding wire is present in a hollow state on the substrate, so that it is less susceptible to fluctuations in parasitic capacitance, and as a result, frequency fluctuations of the oscillation element are less likely to occur.

FIGS. 1 and 2 show an embodiment of the present invention.
Reference numeral 1 denotes a substrate made of a glass epoxy substrate, and a plurality of wiring patterns 2 and external terminals 3 are provided on the upper surface of the substrate 1. On the upper surface of the substrate 1, a rectangular oscillation element 4 and a rectangular control element 5 are mounted in a state where they are superposed on each other. The control element 5 is mounted in a recess 1 a provided in the substrate 1, and the oscillation element 4 is mounted on the substrate 1 so as to be orthogonal to the control element 5.

According to this mounting structure, the electrodes 5a of the control element 5 are exposed on both sides of the oscillation element 4 mounted above, and the plurality of electrodes 5a are connected to the wiring pattern 2 on the substrate 1 by bonding wires 6. The two electrodes 5a provided at both ends of the upper surface of the control element 5 and the oscillation element 4
The electrodes 4a are also directly connected by the hollow wires by the bonding wires 6.

That is, the oscillation of the oscillation element 4 is controlled by the control element 5 via the bonding wire 6, and the oscillation output is output from the external terminal 3 via the electrode 4 a, the bonding wire 6 and the control element 5.

Note that a shield electrode 7 is provided on the entire lower surface and the upper surface of the oscillation element 4. Since the electrode 4a of the oscillation element 4 is extended through the side of the upper surface, the shield electrode 7 on the inner upper surface is in non-contact with the electrode 4a including the extended portion. The reason why the electrode 4a is extended is to make the connection with the bonding wire 6 easy by bringing the electrode 4a as close as possible to the electrode 5a of the control element 5.

In the above embodiment, the control element 5 is provided below the oscillating element 4. However, the control element 5 may be reversed, and the lower element need not be provided in the recess 1a.

Further, in the above embodiment, the electrodes 5a of the control element 5 are exposed on both sides of the oscillation element 4. However, the electrodes 5a may be exposed on one side. 5 may be provided intensively at the exposed end.

[0016]

As described above, the present invention comprises a substrate, an oscillation element mounted on the substrate, and a control element mounted on the substrate for controlling the oscillation element.
On the substrate, the control element and the oscillating element are vertically stacked and mounted as if the electrodes of the lower element are exposed, and the exposed electrode of the lower element and the electrode of the upper element are bonded by bonding wires. They are connected as close as possible .

According to the above configuration, since the control element and the oscillation element are mounted on the substrate by being vertically stacked, the size of the substrate can be reduced.

Further, since the electrodes of the lower element are exposed despite such vertical stacking, they can be easily connected to the electrodes of the upper element by bonding wires.

Further, such connection by the bonding wire suppresses the frequency fluctuation of the oscillation element.

That is, when the two electrodes are connected by a wiring pattern provided on the substrate, the oscillation frequency greatly varies due to a large variation in the parasitic capacitance of the wiring pattern due to moisture absorption of the substrate. When connected, the bonding wire is present in a hollow state on the substrate, so that it is less susceptible to fluctuations in parasitic capacitance, and as a result, frequency fluctuations of the oscillation element are less likely to occur.

[Brief description of the drawings]

FIG. 1 is a plan view of an embodiment of the present invention.

FIG. 2 is a sectional view of FIG.

FIG. 3 is a perspective view of the oscillation element of FIG. 1;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Wiring pattern 3 External terminal 4 Oscillation element 4a electrode 5 Control element 5a electrode 6 Bonding wire 7 Shield electrode

──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H03B 5/36 H03B 5/04 H03B 5/32 H03H 9/02 H01L 21/60 301

Claims (1)

(57) [Claims] A substrate having a concave portion, and mounting in the concave portion
Control element and the control element above the control element
Oscillation mounted by overlapping vertically as if the electrodes of the
Element and at least one of the upper and lower surfaces of the oscillation element
And the oscillation element is provided on the upper surface.
Both ends were provided in a non-contact state with the shield electrode
An electrode and at least a part of the electrode are formed by extension.
And an extension electrode, wherein the extension electrode exposes the control element.
Connected directly to the bonding electrode with a bonding wire
Oscillator.