JP3228509U - Electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device capable of being applied to various changing product requirements by increasing the flexibility of combination of elements and increasing the flexibility of application. An electronic device including a circuit board 11, a drive unit 12, an operation unit 13, and an optical unit 16, wherein the circuit board includes a plate body and a plurality of conductive lines, and is formed into the plate body. Has an operating surface S, and a plurality of conductive pads 113 correspond to a plurality of conductive lines and are electrically connected. The drive unit includes a substrate, a thin film line, a thin film element, and a plurality of connection pads 124, the thin film line corresponds to the thin film element and is electrically connected to each of the plurality of connection pads, and the plurality of connection pads are circuits. It is electrically connected to some conductive pads on the substrate. The operating unit has at least one electrode 131, which is electrically connected to one of the conductive pads. The optical unit is provided on one side of the operating surface of the circuit board. [Selection diagram] FIG. 1A

Description

The present invention relates to an electronic device, particularly to an electronic device that has application flexibility and can be applied to various product requirements.

In the manufacture of general conventional electronic devices such as photoelectric devices, in each case, a plurality of thin film transistors are manufactured on a base material to form a thin film transistor substrate, and then a photoelectric element is further arranged and a thin film transistor is used. It drives the photoelectric element. However, the manufactured thin film transistor substrate can be applied only within a limited range (for example, limited to the same pixel) according to the standard at the time of design (for example, the pixel at the time of design). Therefore, it is necessary to design a thin film manufacturing process corresponding to the product size or function of each type of electronic device, and to use an expensive thin film transistor manufacturing process / resist / substrate / material, and the product changes in various ways. It was quite disadvantageous to the requirements and inflexible in application.

Different thin film manufacturing processes must be designed for different electronic device product sizes or functions, and expensive thin film manufacturing processes / resists / substrates / materials must be used, which is disadvantageous for meeting diverse product requirements. , Solves the conventional problem of inflexibility in application.

An object of the present invention is to provide a new form of electronic device that has high flexibility in combination of elements and can be applied to various changing product requirements by increasing application flexibility.

In order to achieve the above object, the electronic device of the present invention includes a circuit board, a drive unit, an operation unit, and an optical unit. The circuit board includes a plate body, a plurality of conductive lines, and a plurality of conductive pads, the plate body has an operating surface, and the plurality of conductive lines and the plurality of conductive pads are provided on the operating surface. Provided, the plurality of conductive pads correspond to the plurality of conductive lines and are electrically connected. The drive unit includes a substrate, a thin film line, a thin film element, and a plurality of connection pads. The substrate is provided with the thin film line, the thin film element, and the plurality of connection pads, and the thin film line is the thin film line. It corresponds to a thin film element and is electrically connected to the plurality of connection pads, and the plurality of connection pads are electrically connected to some conductive pads in the circuit board. The operating unit is adjacent to the driving unit and is provided on the circuit board and has at least one electrode, and the electrode is attached to one of the plurality of conductive pads on the operating surface of the plate body. It is electrically connected. The optical unit is provided on one side of the operating surface of the circuit board and covers at least a part of the operating surface of the circuit board.

In response to the above, in the electronic device of the present invention; a plurality of conductive lines and a plurality of conductive pads are provided on the operating surface of the circuit board, and the plurality of conductive pads correspond to the plurality of conductive lines and are electrically connected. A thin film line, a thin film element, and a plurality of connection pads are provided on the substrate of the drive unit, the thin film line corresponds to the thin film element and is electrically connected to the plurality of connection pads, and the plurality of connection pads are one in the circuit board. Each is electrically connected to the conductive pads of the unit; at least one electrode of the operating unit is electrically connected to one of a plurality of conductive pads on the operating surface; the optical unit operates the circuit board. By having a structural design that is provided on one side of the surface and covers at least a part of the operating surface of the circuit board; the electronic device of the present invention corresponds to different operating units and them according to different fields. By selecting the drive unit to be used, it is possible to apply it to different technical fields. The drive unit and operation unit on the circuit board are independent of each other, and the flexibility of their combination is high. It can be applied to various changing product requirements.

In a preferred embodiment, the substrate is a glass substrate, a polyimide substrate, a light absorbing substrate, or a combination thereof.

In a preferred embodiment, the operating unit includes a photoelectric element, a thermoelectric element, a piezoelectric element, a detection element, or an antenna module.

In a preferred embodiment, the photoelectric element includes a light emitting diode chip or a light emitting diode package of mm level or less.

In a preferred embodiment, the optical unit is a diffusion sheet or light guide plate having continuous light transmissibility.

In a preferred embodiment, the optical unit is a reflective sheet, a light absorbing sheet, a diffusing sheet, or a light guide plate, and has a passage window corresponding to at least one of the operating unit and the driving unit.

In a preferred embodiment, the optical unit is further provided with a shielding layer, and the area of the passage window is determined by a portion that is not shielded by the shielding layer.

In a preferred embodiment, the passage window is an opening that penetrates the optical unit.

In a preferred embodiment, at least one of the operating unit and the driving unit penetrates the passage window, and at least one of the other is superposed on at least a part of the passage window.

In a preferred embodiment, the optical unit has a plurality of passage windows, one of which corresponds to the operating unit and one of which corresponds to the drive unit.

In a preferred embodiment, the optical unit has a plurality of passage windows, one of the plurality of passage windows corresponds to the operation unit, and the other corresponds to the drive unit; Alternatively, the operating unit overlaps at least a portion of its one passage window, and / and the drive unit overlaps at least a portion of its other passage window.

In a preferred embodiment, a black resist member that covers at least a part of the drive unit or the circuit board is further included.

In a preferred embodiment, at least a protective material for coating the thin film device is further included.

In a preferred embodiment, the substrate has a first surface of the plate body facing the operating surface and a second surface facing the first surface, the substrate having the second surface. A plurality of wave absorbing structures, a plurality of atomized structures, a wave absorbing layer, an atomized layer, a reflecting layer, or a plurality of reflecting structures are attached along the surface of the above.

In a preferred embodiment, the wave absorbing layer is a wave absorbing film.

In a preferred embodiment, the plurality of wave absorbing structures are a plurality of black spray coated dots.

In a preferred embodiment, the second surface comprises the wave absorbing structure, the atomized structure, the atomized layer, the reflective layer, or the plurality of reflective structures.

In a preferred embodiment, the drive unit and at least one operating unit are configured as operating assemblies, and the plurality of operating assemblies are provided on the operating surface of the circuit board.

In a preferred embodiment, each of the plurality of motion assemblies includes each of the plurality of motion units, the drive unit driving the plurality of motion units.

In the electronic device of the present application, since the drive unit and the operation unit on the circuit board are independent of each other, the flexibility of the combination with each other is enhanced.

It is a side schematic of the electronic device of one Example of this invention. It is a top view of the plane of the electronic device of one Example of this invention. It is the schematic of the drive unit of one Example of this invention. It is a side schematic of the electronic device of a further different embodiment of the present invention. It is a side schematic of the electronic device of a further different embodiment of the present invention. It is a side schematic of the electronic device of a further different embodiment of the present invention. It is a side schematic of the electronic device of a further different embodiment of the present invention. It is a side schematic of the electronic device of a further different embodiment of the present invention. It is a side schematic of the electronic device of a further different embodiment of the present invention. It is a side schematic of the electronic device of a further different embodiment of the present invention. It is a side schematic of the electronic device of a further different embodiment of the present invention. It is a top view of the plane of the electronic device of a further different embodiment of the present invention. It is a plan schematic diagram of the electronic device of a further different embodiment of the present invention.

The electronic devices according to preferred embodiments of the present invention will be described below with reference to the relevant drawings, with the same components having the same reference numerals. In order to explain the present invention in an easy-to-understand manner, the drawings in the following examples are merely schematically shown, and the size and ratio of each element are merely examples for explaining the technique of the present invention. Does not limit.

1A and 1B are a schematic side view and a schematic plan view of an electronic device according to an embodiment of the present invention, respectively, and FIG. 2 is a schematic view of a drive unit according to an embodiment of the present invention.

See FIGS. 1A and 1B. The electronic device 1 of this embodiment includes a circuit board 11, a drive unit 12, an operation unit 13, and an optical unit 16, and the drive unit 12 and the operation unit 13 are provided on the circuit board 11 and are electrically connected to the circuit board 11. The circuit board 11 drives the operation of the operation unit 13 via the drive unit 12, and the optical unit 16 is provided on one side of the circuit board 11 and covers at least a part of the circuit board 11.

The circuit board 11 is a drive circuit board, and may have a plate body 111, a plurality of conductive lines 112, and a plurality of conductive pads 113. The plate 111 is not limited to an insulating substrate or a conductive substrate to which an insulating layer is further added. The plate 111 has an operating surface S, their conductive lines 112 and their conductive pads 113 are provided on the operating surface S, and their conductive pads 113 correspond to and electrically connect to their conductive lines 112. Will be done. The circuit board 11 of this embodiment will be described with an example having four conductive pads 113 (FIG. 1A) shown and two intersecting conductive lines 112 (FIG. 1B). In some embodiments, the electronic device 1 serves as a display device and has two or more conductive lines 112 [for example, a scanning line (Scan Line), a data line (Data Line), a power supply line (Vdd), a ground line (Vss), It is also possible to have the combination, or other wiring capable of transmitting an electric signal, but not limited to these. Further, in some embodiments, the electronic device is a backlight module or a lighting device, and the circuit board 11 is a soft circuit board or a hard circuit board.

As shown in FIG. 2, the drive unit 12 includes a substrate 121, a thin film line 122, at least one thin film element, and a plurality of connection pads 124. As an example, the drive unit 12 in the embodiment of FIG. 2 has two thin film elements (for example, thin film transistors) 123a and 123b, four connection pads 124, and a plurality of thin film lines 122, and the drive unit 12 is a thin film transistor component. And. FIG. 2 illustrates a circuit structure of 2T1C, but other circuit structures (for example, 4T2C or 5T1C, etc.) may be used in different embodiments, and the present invention is not limited thereto.

See FIGS. 1A and 2 at the same time. The substrate 121 of the drive unit 12 has a first surface S1 facing the operating surface S of the plate body 111 and a second surface S2 facing the first surface S1, as well as a thin film line 122 and a thin film element 123a. , 123b and their connection pads 124 are provided on the substrate 121 (not limited to any surface of the substrate 121 or the substrate 121). In some embodiments, the thin film lines 122, the thin film elements 123a, 123b and their connection pads 124 may be simultaneously provided on the first surface S1 or the second surface S2, or at least their connection pads 124 may be. It may be provided on the first surface S1 or the second surface S2 of the substrate 121. Further, the thin film elements 123a and 123b are electrically connected to each other via the thin film line 122. In some embodiments, the thin film line 122 may be electrically connected to the thin film elements 123a, 123b, either directly or indirectly via another conductive layer, or the two thin film elements 123a, 123b may be connected to each other or It may be a conductive line electrically connected to another element, and the present invention is not limited thereto. The thin film line 122 described above is a common name, and the wiring formed on the substrate 121 in the thin film manufacturing process may be referred to as a conductive line 122 as long as a conductive film layer or a conducting wire is present. In some embodiments, the thin film line 122 may include wiring for transmitting a scanning signal or a data signal, depending on the function and application of the electronic device.

The thin film lines 122 correspond to the thin film elements 123a and 123b and are electrically connected to their connection pads 124 (FIG. 2), and the connection pads 124 are electrically connected to a partially conductive pad 113 in the circuit board 11, respectively. Connected (Fig. 1A). In this embodiment, the second surface S2 of the substrate 121 is separated from the operating surface S of the plate 111. By providing the drive unit 12 on the operation surface S of the circuit board 11 with the first surface S1 of the substrate 121 facing the operation surface S of the plate body 111, those connection pads 124 of the drive unit 12 are provided on the operation surface S. It is electrically connected to each of the partially conductive pads 113 in S. That is, the first surface S1 provided with the thin film line 122, the thin film elements 123a, 123b and their connection pads 124 is provided so as to face the operating surface S of the plate body 111, and the thin film line is provided on the substrate 121. The second surface S2 to which 122, the thin film elements 123a and 123b and their connection pads 124 are not provided is separated from the operating surface S of the plate body 111. In this embodiment, no element is superposed on the second surface S2. The substrate 121 described above is a hard substrate (for example, a glass substrate, but not limited to this), a soft substrate [for example, a polyimide (polyimide, PI) substrate, but is not limited to this], or a combination thereof (for example, on a hard substrate). A soft substrate can be stacked on the surface). In some embodiments, the thickness of the substrate 121 of the drive unit 12 can be, for example, less than 200 μm, and for example, the thickness of the glass substrate 121 can be reduced to less than 200 μm by a thinning technique. Further, the material of the connection pad 124 can be, for example, copper, silver, gold, a combination thereof, or other suitable conductive material, but is not limited thereto. In some embodiments, the thin film lines 122 and the thin film elements 123a, 123b are combined with, for example, by electroplating, printing, or a life-off patterning manufacturing process to produce a thicker connection pad 124. A plurality of connection pads 124 are manufactured on the substrate 121 so that they can be electrically connected to the connection pads 124 of the above. In some other examples, the connection pad 124 may be manufactured using the thin film manufacturing process, but is not limited thereto.

The operation unit 13 is provided adjacent to the drive unit 12 and on the circuit board 11 (not limited to any surface of the circuit board 11), but in some embodiments, the operation unit 13 is a drive unit 12. Similarly, they are provided adjacent to each other on the operating surface S of the circuit board 11. The operating unit 13 has a second upper surface T away from the operating surface S and at least one electrode 131, and the electrode 131 is electrically connected to one of those conductive pads 113 on the operating surface S of the plate 111. Can be connected. The operating unit 13 can be, for example, an element having a mm or μm level size, but is not limited thereto. The operation unit 13 includes, for example, a photoelectric element [a light emitting diode chip (LED chip) or package (Package), a micro LED chip (microLED chip) or package, or a photoelectric chip having a size equal to or smaller than the mm level or μm level. Package], thermoelectric element, piezoelectric element (including, but not limited to, piezoelectric fingerprint chip), detection element [including infrared detection chip, ultrasonic detection chip, temperature detection chip, or image sensor. Not limited to], or includes, but is not limited to, antenna modules. Then, the light emitting diode chip described above can be a light emitting diode crystal particle of a horizontal electrode, a flip chip type electrode, or a vertical electrode, and moreover, by wire bonding (wire bonding) or flip chip bonding (flip chip bonding). It is provided on the operating surface S of the circuit board 11 and can be electrically connected to the conductive pad 113. It should be noted that the second upper surface T of the operating unit 13 is not affected by wire bonding or flip-chip bonding, or the installation of the horizontal electrode or the vertical electrode. Specifically, it is tentatively operated. The second upper surface T described above is determined including the wire, the upper electrode, and other elements even when the overlap of the wire or the upper electrode becomes slightly thicker on the surface of the unit 13 away from the operating surface S. You can think of it as.

It should be noted that the operating unit 13 may be an interface device that is electrically connected to the receiver or transmitter, and the receiver or transmitter is provided inside or outside the electronic device. obtain. In some embodiments, the operating unit 13 is a proximity sensor [eg, a capacitive sensor (eg, a complementary metal oxide semiconductor), a capacitive mobile sensor, a Doppler effect sensor based on the Doppler effect, an inductance sensor, a magnetic sensor. (Including magnetic proximity sensor), optical sensor, photoelectric sensor, photoelectric tube sensor (reflection type sensor), laser distance measuring device, passive type sensor (for example, charge coupling device), passive type thermal infrared sensor, ionization radiation reflection sensor, sonar sensor (Active or passive type), including or similar ultrasonic sensors, optical fiber sensors, Hall effect sensors, etc.], temperature sensors [eg, thermal scanners, thermocouples, temperature measuring resistance elements, silicon bandgap ) Including temperature sensors and the like], interface devices (for example, X-ray detectors, antennas, or the like), or pressure sensors. Not limited to the examples mentioned above, the operating unit 13 may be understood as any electronic member applied to the surface mounting technology (SMT).

As shown in FIG. 1A, the operation unit 13 of this embodiment is, for example, a microLED chip of a horizontal electrode, and the two electrodes 131 are flip-chip bonding, respectively, and two on the operation surface S. It is electrically connected to the conductive pad 113. In this embodiment, the electrode 131 of the operation unit 13 and the connection pad 124 of the drive unit 12 are electrically connected to the corresponding conductive pad 113 via the conductive material C, and the circuit board 11 is electrically connected to the corresponding conductive pad 113 via the drive unit 12. The operation unit 13 (for example, a micro LED chip) is driven so as to emit light. The material of the conductive material C can include, but is not limited to, for example, solder paste, silver paste, anisotropic conductive adhesive (AFC), a combination thereof, or other suitable conductive material. In some embodiments, when the operating unit 13 is a light emitting diode package, it has a mounting board and at least one micro LED chip, the micro LED chip is provided on the mounting board, and its electrodes are circuit boards. It corresponds to the conductive pad 113 on 11 and is electrically connected.

Further, in the electronic device 1 of the present embodiment, the first height h is determined by the distance between the second surface S2 of the substrate 121 of the drive unit 12 and the operating surface S of the plate body of the circuit board 11. The second height H is determined by the distance between the upper surface T of the operating unit 13 and the operating surface S of the plate 111, and the second height H is equal to or greater than the first height h. Therefore, when the drive unit 12 is driven so that the operation unit 13 operates, interference does not occur between the drive unit 12 and the operation unit 13. Specifically, in this embodiment, since the second height H is equal to or higher than the first height h, the drive unit 12 optically interferes with the optical path of the operating unit 13 (light emitting diode) to emit light. It has no effect. In some other embodiments, when the operation unit 13 is, for example, a detection element (for example, a sensor), the drive unit 12 does not interfere with the sensitivity of the operation unit 13 (detection element) and affect the detection result. Other situations can be inferred from the above results. Further, in order to avoid a situation in which the substrate 121 reflects light and interferes with the light emission of the light emitting diode, the substrate 121 of the drive unit 12 is a light absorbing substrate containing a light absorbing material to reflect light (waves). It can be avoided. In some embodiments, the second height H is equal to or less than the first height h, but the present invention is not limited to this.

The optical unit 16 is provided on one side of the operating surface S of the circuit board 11, and covers all or at least a part of the operating surface S of the circuit board 11. In this embodiment, the second height H between the upper surface T of the operating unit 13 and the operating surface S of the plate 111 is the second surface S2 of the substrate 121 of the drive unit 12 and the operating surface S of the plate 111. It is equal to or higher than the first height h between S and S. Therefore, the optical unit 16 comes into direct contact with the upper surface T of the operating unit 13, but does not come into contact with the second surface S2 of the substrate 121. Further, the optical unit 16 may or may not have a passage window 161 (see FIGS. 3B to 3D). That is, in one embodiment, the optical unit 16 provided on the drive unit 12 and the operation unit 13 and capable of covering them may or may not have the passage window 161. In some other embodiments, the electronic device is a backlight module, the optical unit 16 is a diffuse sheet or light guide plate with continuous light transmission, and the light emitted by the operating unit 13 (eg, a micro LED chip). It is not necessary to have a passing window 161 because the (wave) can be softened or propagated and the light can be uniformly emitted by the electronic device 1. In the present embodiment, the optical unit 16 having continuous light transmission means that the optical unit 16 itself is an integral object having continuous light transmission. For example, when the electronic device is a backlight module, the optical unit 16 is a diffusion sheet or a light guide plate, and another optical sheet (for example, a reflection sheet or a light absorption sheet) can be further added.

In response to the above, for convenience of explanation, the operation unit 13 in this embodiment is a micro LED chip, but the electronic device 1 in this embodiment has different operation units 13 and corresponding drive means units according to different technical fields. 12 can be selected and used. That is, the operation unit 13 is of a type capable of emitting signals such as electromagnetic waves, light waves, sound waves, pressure waves, etc. of a photoelectric element, a thermoelectric element, a piezoelectric element, a detection element, an antenna module, etc. different from the above, and a size of mm level. By using an electronic device at the μm level or lower, it can be applied to these different technical fields. As the optical unit 16, either a visible light element or an invisible light element may be selected. Moreover, the elements (drive unit 12 and operation unit 13) on the circuit board 11 are provided independently, and the flexibility of their combination is high. For example, one drive unit 12 has one or more operation units 13. Can be combined. Therefore, the present invention has application flexibility and can be applied to various changing product requirements.

See FIGS. 3A to 3H. It is the side schematic of the electronic device of each different embodiment of this invention.

As shown in FIG. 3A, the electronic device 1a of this embodiment and the electronic device 1 of the above embodiment have substantially the same element configuration and connection relationship of each element. The difference is that in the electronic device 1a of the present embodiment, the second height H between the upper surface T of the operating unit 13 and the operating surface S of the plate 111 is the second surface of the substrate 121 of the drive unit 12. It is equal to or less than the first height h between S2 and the operating surface S of the plate 111, so that the optical unit 16 comes into direct contact with the second surface S2 of the substrate 121, but with the upper surface T of the operating unit 13. No contact.

As shown in FIG. 3B, the electronic device 1b of this embodiment and the electronic device 1 of the above embodiment have substantially the same element configuration and connection relationship of each element. The difference is that the optical unit 16 in the electronic device 1b of the present embodiment has one passage window 161, the passage window 161 is provided at a position corresponding to the operation unit 13, and the optical unit 16 is a drive unit 12. This is a point of direct contact with the second surface S2 of the substrate 121. In some embodiments, the electronic device is a display module, the optical unit 16 has a passage window 161 corresponding to the operating unit 13, and the light (wave) emitted by the operating unit 13 (for example, a micro LED chip) is emitted. It may propagate through the passage window 161, the passage window 161 may be an opening that penetrates the optical unit 16 (for example, a reflective sheet or a light absorbing sheet), or the optical unit 16 (for example, a reflective sheet or light). The absorption sheet) may be further provided with a shielding layer, and the region of the passage window 161 may be determined by a portion of the optical unit 16 that is not shielded by the shielding layer. In some embodiments, the light (wave) emitted by the operating unit 13 (eg, a micro LED chip) propagates from the top surface T through the passage window 161. In some embodiments, the operating unit 13 penetrates and / or at least partially overlaps the opening through window 161 so that the light (wave) emitted by the operating unit 13 (eg, a micro LED chip) is at least semicircular. It presents and diverges and propagates through the passage window 161. Further, in some embodiments, the operation unit 13 does not penetrate the passage window 161 but is only provided at a position corresponding to the passage window 161. In some embodiments, the optical unit 16 is a reflective sheet or a light absorbing sheet, and an optical unit 16 having a different function can be adopted depending on the usage situation. The reflective sheet improves the brightness of the electronic device, and the light absorbing sheet can prevent external light (waves) from interfering with the light emission of the light emitting diode. In this embodiment, it is shown that the optical characteristics of the optical unit 16 are affected by the installation of the passing window 161 (that is, the optical unit 16 loses the continuous light transmissibility due to the installation of the passing window 161). In some embodiments, when the optical unit 16 simultaneously covers the drive unit 12 and the operating unit 13, the optical unit 16 does not have continuous light transmissibility, and the region of the passage window 161 is determined by a shielding layer. The drive unit 12 and the operation unit 13 can be installed so as to be located between the optical unit 16 and the circuit board 11. In some embodiments, the drive unit 12 and the operating unit 13 are between the optical unit 16 and the circuit board 11, even if the optical unit 16 does not have continuous light transmission and the passage window 161 is an opening. You can choose to be located. Further, in some embodiments, even if the optical unit 16 does not have continuous light transmissibility and the passage window 161 is an opening, the drive unit 12 and / or the operation unit 13 penetrates the passage window 161 (opening). It can be selected to be located in the passage window 161 (opening) so as to overlap at least a part of it. Also, the term "passing window" is not limited to its structure or size, whether it is composed of closed curves, or whether it is regularized or patterned.

As shown in FIG. 3C, the electronic device 1c of this embodiment and the electronic device 1b of the above embodiment have substantially the same element configuration and connection relationship of each element. The difference is that the passage window 161 of the optical unit in the electronic device 1c of this embodiment has a wider range and corresponds not only to the operating unit 13 but also to the driving unit 12. In this embodiment, the second surface S2 of the substrate 121 of the drive unit 12 does not penetrate the passage window 161 but in other embodiments, it may penetrate the passage window 161.

As shown in FIG. 3D, the electronic device 1d of this embodiment and the electronic device 1c of the above embodiment have substantially the same element configuration and connection relationship of each element. The difference is that the first height (not marked) between the second surface S2 of the substrate 121 of the drive unit 12 and the operating surface S of the plate 111 in the electronic device 1d of this embodiment is the operating unit 13. It is equal to or higher than the second height (not marked) between the upper surface T of the above surface and the operating surface S of the plate body 111. Therefore, the second surface S2 of the substrate 121 of the drive unit 12 and the upper surface T of the operation unit 13 both penetrate the passage window 161.

As shown in FIG. 3E, the electronic device 1e of this embodiment and the electronic device 1d of the above embodiment have substantially the same element configuration and connection relationship of each element. The difference is that the electronic device 1e in this embodiment has a plurality of passage windows (for example, two), one passage window 161a corresponds to the operating unit 13, and the other passage window 161b is driven. It corresponds to the unit 12. In another embodiment, the drive unit 12 can correspond to the passage window 161a, and the operation unit 13 can correspond to the passage window 161b.

As shown in FIG. 3F, the electronic device 1f of this embodiment and the electronic device 1 of the above embodiment have substantially the same element configuration and connection relationship of each element. The difference is that in the base 121 of the drive unit 12 of the electronic device 1f in this embodiment, the wave absorbing layer 14 is attached along the second surface S2. In this embodiment, the wave absorbing layer 14 is a wave absorbing film. For example, by providing the wave absorbing layer 14 on the second surface S2 by a mounting method, when the light emitting diode (operating unit 13) emits a light wave, the wave absorbing layer 14 is a substrate. It is possible to absorb the light (wave) irradiated toward the second surface of 121, thereby reducing the possibility of the light (wave) being reflected and avoiding the influence on the light emission. In different embodiments, the substrate 121 of the drive unit 12 may be provided with an atomizing layer, a plurality of wave absorbing structures, a plurality of atomizing structures, a reflecting layer, or a plurality of reflecting structures along the second surface S2. Alternatively, the second surface S2 of the substrate 121 itself may include an atomization layer, a plurality of wave absorption structures, a plurality of atomization structures, a reflection layer, or a plurality of reflection structures. The plurality of wave absorbing layers, the plurality of atomized structures, or the plurality of reflective structures described above are dispersed (discontinuously transmissive) structures, and are, for example, jagged or jagged on the second surface S2 of the substrate 121 by a surface processing method. By generating a wave absorption or atomization structure such as scattering, a wave absorption, wave atomization, or wave reflection effect is generated. In some other examples, the surface roughness can be improved and the diffusion of light (wave) can be enhanced by adopting a surface treatment method such as physical surface treatment or chemical surface treatment. Further, in some embodiments, light (waves) may be absorbed by applying a black wave absorbing layer or wave absorbing dots on the second surface S2 of the substrate 121, or by a spray coating method. A plurality of black spray-coated dots may be formed on the second surface S2 to form a plurality of wave absorbing structures. The wave absorbing layer 14 of this embodiment can be applied to other examples. Further, in some examples, a material having a high reflectance (for example, a metal material) can be formed with a reflective layer or a reflective structure on the second surface S2 by, for example, spray coating, printing, or a similar technique.

As shown in FIG. 3G, the electronic device 1g of this embodiment and the electronic device 1 of the above embodiment have substantially the same element configuration and connection relationship of each element. The difference is that the electronic device 1g of this embodiment further includes a black resist member 15, and the black resist member 15 covers at least the drive unit 12 or a part of the circuit board 11. In this embodiment, the black resist member 15 covers the second surface S2 of the substrate 121 of the drive unit 12, and the black resist member 15 absorbs the light (wave) irradiated on the second surface S2 of the substrate 121. By doing so, it is possible to avoid interference with the light emission of the light emitting diode and improve the contrast. The material of the black resist member 15 can be a black matrix resist, and the drive unit 12 or the drive unit 12 and the circuit board 11 are covered, and only the operation unit 13 is covered. It is to be exposed. Further, the black resist member 15 of this embodiment can be applied to other examples.

As shown in FIG. 3H, the electronic device 1h of this embodiment and the electronic device 1 of the above embodiment have substantially the same element configuration and connection relationship of each element. The difference is that the electronic device 1h of this embodiment further includes a protective material 17, the protective material 17 is provided on the first surface S1 of the substrate 121, and the protective material 17 at least covers the thin film element. When the protective material 17 is coated with the thin film element by resin transfer molding, sealing adhesive dispensing, or other suitable method, moisture or foreign matter enters the thin film element and its characteristics are impaired. Can be protected from being prevented. Preferably, the protective material 17 can also cover the thin film element and the thin film line. The material of the protective material 17 may be, for example, a polymer material (for example, PI). Further, the protective material 17 of this embodiment can be applied to other examples.

The newly added elements presented in the above embodiment, that is, the wave absorbing layer 14, the atomizing layer, the reflecting layer, the wave absorbing structure, the atomizing structure, the reflecting structure, the black resist member 15, the protective material 17, and the optical unit. With respect to 16 variations, such as a reflective sheet, a light absorbing sheet, a diffusing sheet, a light guide plate, etc., the user assembles or uses a combination thereof according to actual needs, but the present invention presents the combination and application. The method is not limited.

See FIGS. 4 and 5. It is a plan schematic view of the electronic device of each different embodiment of this invention.

In the electronic device 1i of FIG. 4, the combination of the drive unit 12 and the operation unit 13 is one operation assembly G, and the plurality of operation assemblies G are any surface or the same surface (for example, the operation surface S) of the circuit board 11. ) Can be provided. The circuit board 11 can drive the corresponding operation unit 13 via the drive unit 12 of each operation assembly G. The present invention does not limit whether the plurality of motion assemblies G are arranged in a one-dimensional or two-dimensional array, irregularly arranged on the motion plane S, or arranged as a circle, ellipse, or polyhedron. .. In this embodiment, a plurality of operation assemblies G are arranged in a two-dimensional array. Further, the optical unit 16 of this embodiment covers the drive unit 12 and the operation unit 13 in all the operation assemblies G.

In the electronic device 1j of FIG. 5, each operation assembly G includes four operation units 13, and the drive unit 12 of each operation assembly G can drive the four operation units 13 so as to correspond to each other. The quantity of the operating units 13 of each operating assembly G of this embodiment is merely an example, and in different embodiments, the quantity of the operating units 13 may be two, three, five, and so on. Further, the optical unit 16 of this embodiment also covers the drive unit 12 and the operation unit 13 in all the operation assemblies G.

To summarize the above, in the electronic device of the present invention, a plurality of conductive lines and a plurality of conductive pads are provided on the operating surface of the circuit board, and the plurality of conductive pads correspond to the plurality of conductive lines and are electrically connected. A thin film line, a thin film element, and a plurality of connection pads are provided on the substrate of the drive unit, the thin film line corresponds to the thin film element and is electrically connected to a plurality of connection pads, and the plurality of connection pads are a part of the circuit board. Electrically connected to each of the conductive pads of the; at least one electrode of the operating unit is electrically connected to one of a plurality of conductive pads on the operating surface; the optical unit is the operating surface of the circuit board. Due to the structural design provided on one side and covering at least a portion of the operating surface of the circuit board; the electronic devices of the present invention have different operating units and corresponding drive units for different fields. By selecting it, it is possible to apply it to different technical fields. Furthermore, since the drive unit and the operation unit on the circuit board are independent of each other and the flexibility of combination with each other is high, the drive unit and the operation unit can be applied to various changing product requirements with application flexibility.

The above is merely an example and does not limit the present invention. Any equivalent modifications or changes made to the technical idea and scope of the present invention without exceeding the scope of the request for registration of a practical new proposal in the attached sheet are included in the scope of the request.

The electronic device of the present application has application flexibility and can be applied to various changing product requirements.

1, 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, 1i, 1j Electronic device 11 Circuit board 111 Plate 112 Conductive line 113 Conductive pad 12 Drive unit 121 Board 122 Thin film line 123a, 123b Thin film element 124 connection Pad 13 Operating unit 131 Electrode 14 Wave absorbing layer 15 Black resist member 16 Optical units 161, 161a, 161b Passing window 17 Protective material C Conductive material G Operating assembly h First height H Second height S Operating surface S1 First 1 surface S2 2nd surface T upper surface

Claims (19)

It ’s an electronic device
The plate body includes a plate body, a plurality of conductive lines, and a plurality of conductive pads, the plate body has an operating surface, and the plurality of conductive lines and the plurality of conductive pads are provided on the operating surface. Conductive pads correspond to the plurality of conductive lines and are electrically connected to the circuit board.
A substrate, a thin film line, a thin film element, and a plurality of connection pads are included, and the substrate is provided with the thin film line, the thin film element, and the plurality of connection pads, and the thin film line corresponds to the thin film element. A drive unit that is electrically connected to the plurality of connection pads, and the plurality of connection pads are electrically connected to some conductive pads in the circuit board.
Adjacent to the drive unit and provided on the circuit board, it has at least one electrode, which is electrically connected to one of the plurality of conductive pads on the operating surface of the plate. An operating unit, and an optical unit provided on one side of the operating surface of the circuit board and covering at least a part of the operating surface of the circuit board.
An electronic device characterized by comprising. The electronic device according to claim 1, wherein the substrate is a glass substrate, a polyimide substrate, a light absorption substrate, or a combination thereof. The electronic device according to any one of claims 1 or 2, wherein the operating unit includes a photoelectric element, a thermoelectric element, a piezoelectric element, a detection element, or an antenna module. The electronic device according to claim 3, wherein the photoelectric element includes a light emitting diode chip or a light emitting diode package having a mm level or less. The electronic device according to any one of claims 1 to 4, wherein the optical unit is a diffusion sheet or a light guide plate having continuous light transmission. Any one of claims 1 to 4, wherein the optical unit is a reflection sheet, a light absorption sheet, a diffusion sheet, or a light guide plate, and has a passage window corresponding to at least one of the operation unit and the drive unit. The electronic device described in the section. The electronic device according to claim 6, wherein the optical unit is further provided with a shielding layer, and the region of the passing window is determined by a portion that is not shielded by the shielding layer. The electronic device according to claim 7, wherein the passage window is an opening that penetrates the optical unit. The electronic device according to claim 8, wherein at least one of the operating unit and the driving unit penetrates the passing window and / or is superposed on at least a part of the passing window. The passage window of the optical unit, one of which corresponds to the operating unit, and one of which corresponds to the drive unit, according to any one of claims 6 to 9. Electronic device. The optical unit has a plurality of passage windows, one of the plurality of passage windows corresponds to the operation unit, and the other corresponds to the drive unit; or the operation unit corresponds to the operation unit. The electronic device according to any one of claims 6 to 9, wherein the drive unit overlaps at least a part of one passage window and / and the drive unit overlaps at least a part of the other passage window. The electronic device according to any one of claims 6 to 9, further comprising a black resist member that covers at least a part of the drive unit or the circuit board. The electronic device according to any one of claims 6 to 9, further comprising a protective material that covers at least the thin film element. The substrate has a first surface of the plate body facing the operating surface and a second surface facing the first surface, and the substrate has a plurality of surfaces along the second surface. The electronic device according to any one of claims 6 to 9, further comprising a wave absorbing structure, a plurality of atomizing structures, a wave absorbing layer, an atomizing layer, a reflecting layer, or a plurality of reflecting structures. The electronic device according to claim 14, wherein the wave absorbing layer is a wave absorbing film. The electronic device according to claim 14, wherein the plurality of wave absorbing structures are a plurality of black spray coated dots. The electronic device according to claim 14, wherein the second surface includes the wave absorbing structure, the atomizing structure, the atomizing layer, the reflecting layer, or the plurality of reflecting structures. The electronic device according to any one of claims 6 to 17, wherein the drive unit and at least one operation unit are configured as operation assemblies, and a plurality of the operation assemblies are provided on the operation surface of the circuit board. .. The electronic device according to claim 18, wherein each of the plurality of operation assemblies includes a plurality of the operation units, and the drive unit drives the plurality of operation units.

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