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JP3224659U - Expansion card connector and expansion card module assembly - Google Patents

Expansion card connector and expansion card module assembly Download PDF

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Publication number
JP3224659U
JP3224659U JP2019004057U JP2019004057U JP3224659U JP 3224659 U JP3224659 U JP 3224659U JP 2019004057 U JP2019004057 U JP 2019004057U JP 2019004057 U JP2019004057 U JP 2019004057U JP 3224659 U JP3224659 U JP 3224659U
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screw hole
expansion card
metal shell
connector
top plane
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張中行
沈裕淵
呂浩瑜
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MSI Computer Shenzhen Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185Mounting of expansion boards
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/732Printed circuits being in the same plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/167Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

【課題】別途穴をあける必要がなく、ヒートシンクを大面積に取り付ける必要もなく、コストを削減し、回路基板上の部品取り付けスペースを増し、更に部品の高さ制限を解除できる拡張カードコネクタ及び拡張カードモジュールアセンブリを提供する。【解決手段】拡張カードコネクタは、コネクタ本体10と2本の位置決めポスト15と第1ネジ穴17と金属シェル20とを含む。コネクタ本体は、頂部平面11を含む。2本の位置決めポストは、頂部平面の一側に設けられる。第1ネジ穴は、頂部平面に貫設され、2本の位置決めポストの間に位置する。金属シェルは、上部平面21を含み、上部平面に2個の位置決め穴及び第2ネジ穴を有し、第2ネジ穴が2個の位置決め穴の間に位置し、2個の位置決め穴が各々2本の位置決めポストに貫設されることで、金属シェルをコネクタ本体に固定させる。第2ネジ穴と第1ネジ穴の投影面は、重なり合う。【選択図】図1An expansion card connector and an expansion that do not require separate drilling, do not require a heat sink to be mounted on a large area, reduce costs, increase the space for mounting components on a circuit board, and remove the height limitation of components. Provide a card module assembly. The expansion card connector includes a connector body, two positioning posts, a first screw hole, and a metal shell. The connector body includes a top plane 11. Two positioning posts are provided on one side of the top plane. The first screw hole extends through the top plane and is located between the two positioning posts. The metal shell includes an upper plane 21 having two locating holes and a second screw hole in the upper plane, wherein the second screw hole is located between the two locating holes, and each of the two locating holes is The metal shell is fixed to the connector main body by being provided through the two positioning posts. The projection planes of the second screw hole and the first screw hole overlap. [Selection diagram] Fig. 1

Description

本考案は、マザーボード分野に関し、特に、拡張カードコネクタ及び拡張カードモジュールアセンブリに関する。   The present invention relates to the field of motherboards, and more particularly, to an expansion card connector and an expansion card module assembly.

一般的に、現行マザーボード上の部品レイアウト及び取り付けのスペースを考慮するため、拡張カードコネクタ(例:M2 Socket)が、通常回路基板の末端に設けられる。通常、ヒートシンクを組み合わせることで拡張部材の温度を下げさせるが、拡張カードコネクタ付近に部品及び配線があるため、穴をあけてヒートシンクを固定させることが困難である。   Generally, an expansion card connector (eg, M2 Socket) is usually provided at the end of the circuit board to take into account the component layout and mounting space on the current motherboard. Normally, the temperature of the expansion member is lowered by combining the heat sink, but it is difficult to fix the heat sink by making holes since there are components and wiring near the expansion card connector.

このため、通常、拡張カードのヒートシンクと他の部位のヒートシンクを共同で大面積の方式で設計しているが、コストが比較的高くなる。またヒートシンクは、プラットフォーム・コントローラー・ハブ(Platform Controller Hub、PCH)に取り付けられ比較的高い熱エネルギーを発生する素子と共用するヒートシンクであるため、放熱の効果に直接影響を与える。   For this reason, the heat sink of the expansion card and the heat sink of the other part are usually jointly designed in a large-area manner, but the cost is relatively high. Further, the heat sink is a heat sink that is attached to a platform controller hub (PCH) and is used in common with an element that generates relatively high thermal energy, and thus directly affects the heat radiation effect.

また、ヒートシンクの大面積被覆により、部品取り付けスペースが縮小され、さらに部品の高さが制限されてきた。   Also, the large area coverage of the heat sink has reduced the component mounting space and has limited the height of the components.

本考案は、かかる従来の問題点に鑑みてなされたもので、拡張カードコネクタを提供する。   The present invention has been made in view of such a conventional problem, and provides an expansion card connector.

拡張カードコネクタは、コネクタ本体と2本の位置決めポストと第1ネジ穴と金属シェルとを含む。コネクタ本体は、頂部平面を含む。2本の位置決めポストは、頂部平面の一側に設けられる。第1ネジ穴は、頂部平面に貫設され、且つ2本の位置決めポストの間に位置する。金属シェルは、上部平面を含み、上部平面に2個の位置決め穴及び第2ネジ穴を有し、第2ネジ穴が2個の位置決め穴の間に位置し、2個の位置決め穴が各々2本の位置決めポストに貫設されることで、金属シェルをコネクタ本体に固定させる。第2ネジ穴と第1ネジ穴の投影面は、重なり合う。   The expansion card connector includes a connector body, two positioning posts, a first screw hole, and a metal shell. The connector body includes a top plane. Two positioning posts are provided on one side of the top plane. The first screw hole extends through the top plane and is located between the two positioning posts. The metal shell includes an upper plane, has two positioning holes and a second screw hole in the upper plane, the second screw hole is located between the two positioning holes, and the two positioning holes are each 2. The metal shell is fixed to the connector body by being penetrated through the positioning post of the book. The projection planes of the second screw hole and the first screw hole overlap.

幾つかの実施例において、上部平面と頂部平面は、平行になる。   In some embodiments, the top plane and the top plane are parallel.

幾つかの実施例において、上部平面の面積は、頂部平面より小さい。具体的に言えば、幾つかの実施例において、金属シェルは、延伸部を更に含み、延伸部が上部平面の前端から折り曲げられて延伸されると共に、頂部平面と当接する。   In some embodiments, the area of the top plane is smaller than the top plane. Specifically, in some embodiments, the metal shell further includes an extension, the extension being bent from the front end of the top plane and extending, and abutting the top plane.

幾つかの実施例において、金属シェルは、2つの側壁を更に含み、2つの側壁が各々上部平面の両側から延伸されると共にコネクタ本体を遮蔽する。   In some embodiments, the metal shell further includes two side walls, each of which extends from both sides of the top plane and shields the connector body.

本考案は、拡張カードモジュールアセンブリを更に提供する。拡張カードモジュールアセンブリは、回路基板に取り付けられ、回路基板が第1突起と第2突起とを備える。拡張カードモジュールアセンブリは、拡張カードコネクタと拡張部材と放熱組立体とを含む。拡張カードコネクタは、コネクタ本体と2本の位置決めポストと第1ネジ穴と金属シェルとを含む。コネクタ本体は、頂部平面を含む。2本の位置決めポストは、頂部平面の一側に設けられる。第1ネジ穴は、頂部平面に貫設され、且つ2本の位置決めポストの間に位置する。金属シェルは、上部平面を含み、上部平面に2個の位置決め穴及び第2ネジ穴を有し、第2ネジ穴が2個の位置決め穴の間に位置し、2個の位置決め穴が各々2本の位置決めポストに貫設されることで、金属シェルをコネクタ本体に固定させる。第2ネジ穴と第1ネジ穴の投影面は、重なり合う。拡張部材は、回路基板に設けられ、第1突起とコネクタ本体の間に位置し、拡張部材がコネクタ本体と組み込まれ、且つ第1突起と当接する。放熱組立体は、ヒートシンク本体と第1締結部材と第2締結部材とを含む。第1締結部材は、第1ネジ穴及び第2ネジ穴内を挿通して緊締し、第2締結部材が第2突起に緊締される。   The present invention further provides an expansion card module assembly. The expansion card module assembly is mounted on a circuit board, and the circuit board has a first protrusion and a second protrusion. The expansion card module assembly includes an expansion card connector, an expansion member, and a heat dissipation assembly. The expansion card connector includes a connector body, two positioning posts, a first screw hole, and a metal shell. The connector body includes a top plane. Two positioning posts are provided on one side of the top plane. The first screw hole extends through the top plane and is located between the two positioning posts. The metal shell includes an upper plane, has two positioning holes and a second screw hole in the upper plane, the second screw hole is located between the two positioning holes, and the two positioning holes are each 2. The metal shell is fixed to the connector body by being penetrated through the positioning post of the book. The projection planes of the second screw hole and the first screw hole overlap. The extension member is provided on the circuit board and is located between the first protrusion and the connector main body. The extension member is incorporated into the connector main body and abuts on the first protrusion. The heat dissipating assembly includes a heat sink body, a first fastening member, and a second fastening member. The first fastening member is inserted and tightened in the first screw hole and the second screw hole, and the second fastening member is tightened by the second protrusion.

幾つかの実施例において、金属シェルは、2つの側壁を更に含み、2つの側壁が各々上部平面の両側から延伸すると共にコネクタ本体を遮蔽する。   In some embodiments, the metal shell further includes two side walls, each of which extends from opposite sides of the top plane and shields the connector body.

具体的に言えば、幾つかの実施例において、コネクタ本体及び2つの側壁は、回路基板に溶接される。   Specifically, in some embodiments, the connector body and the two sidewalls are welded to a circuit board.

幾つかの実施例において、拡張部材の上表面は、ヒートシンク本体と直接接触する。   In some embodiments, the top surface of the expansion member is in direct contact with the heat sink body.

幾つかの実施例において、金属シェルは、延伸部を更に含み、延伸部が上部平面の前端から折り曲げられて延伸されると共に、頂部平面と当接する。   In some embodiments, the metal shell further includes an extension, the extension being bent from the front end of the upper plane and extended, and abutting the top plane.

前記実施例の説明のように、コネクタ本体に2本の位置決めポスト、第1ネジ穴及び金属シェルを設けることにより、マザーボードの設計時回路基板に穴を別途あける必要がない。また、放熱組立体が、独立して拡張カードコネクタと組み込まれることができることで、大面積での取り付けを必要とせず、コストを削減し、回路基板上の部品取り付けスペースを増し、更に部品の高さの制限を解除できる。   As described in the above embodiment, by providing two positioning posts, a first screw hole, and a metal shell on the connector main body, it is not necessary to separately make a hole in the circuit board when designing the motherboard. Also, since the heat dissipating assembly can be independently incorporated with the expansion card connector, it does not require large area mounting, reduces cost, increases component mounting space on the circuit board, and increases component height. You can remove the restrictions.

拡張カードコネクタの分解図である。It is an exploded view of an expansion card connector. 拡張カードモジュールアセンブリの分解図である。FIG. 3 is an exploded view of an expansion card module assembly.

例えばある要素が別の要素に「結合された」と称する時、要素が直接別の要素上にあり、又は中間要素が存在することもでき、中間要素を通じて要素と別の要素を結合することを意味することを理解されたい。逆に、要素が「直接別の要素上にある」或いは「直接別の要素に結合される」と称する時、中間要素が存在しないことを明確に定義することを理解されたい。   For example, when an element is referred to as being "coupled" to another element, the element may be directly on another element, or there may be intermediate elements, and combining an element with another element through an intermediate element. Please understand what it means. Conversely, when an element is referred to as being "directly on another element" or "directly coupled to another element," it should be understood that it clearly defines the absence of an intermediate element.

「第1」、「第2」、「第3」等の用語は、本明細書において各種要素、部材、領域又は部分の描写に使用されることができるが、それらの要素、部材、領域及び/或いは部分はそれらの用語の制限を受けない。それらの用語は、1個の要素、部材、領域又は部分を別の要素、部材、領域、層或いは部分と区別するためだけに使用される。よって、以下に記述する「第1要素」、「第1部材」、「第1領域」、又は「第1部分」は、「第2要素」、「第2部材」、「第2領域」、或いは「第2部分」として解釈でき、本明細書の教示から逸脱しない。   Terms such as "first," "second," "third," and the like can be used herein to describe various elements, members, regions, or portions, but the elements, members, regions, And / or parts are not restricted by those terms. These terms are only used to distinguish one element, member, region or section from another element, member, region, layer or section. Therefore, the “first element”, “first member”, “first region”, or “first portion” described below is “second element”, “second member”, “second region”, Alternatively, it can be construed as a "second part" without departing from the teachings herein.

例えば、「下」又は「底部」及び「上」或いは「頂部」の相対位置用語は、図に示すように、本明細書において1個の要素と別の要素の関係の描写に用いられることができる。相対位置用語は、図面内に示した方位以外の装置の異なる方位を含むことを目的とすることが理解されたい。例えば、添付図面の装置を上下回転させた場合、他の要素の「下」側に描写されていた要素が他の要素の「上」側の方位になる。よって、例示的な用語「下」は、「下」及び「上」の方位は、添付図面の特定の方位に取り決める。同様に、添付図面の装置を上下回転させた場合、他の要素の「下方」又は「下面」に描写された要素は、他の「上方」の方位になる。よって、例示的な用語「下方」或いは「下面」は、「上方」及び「下方」の方位を含むことができる。   For example, the terms "bottom" or "bottom" and "top" or "top" may be used herein to describe the relationship between one element and another, as shown in the figures. it can. It should be understood that the relative position terms are intended to include different orientations of the device other than the orientation shown in the figures. For example, when the device in the attached drawing is rotated up and down, the element described on the “lower” side of the other element becomes the “upper” orientation of the other element. Thus, the exemplary term “bottom” refers to the “bottom” and “top” orientations being specific orientations in the accompanying drawings. Similarly, when the device of the accompanying drawings is rotated up and down, elements depicted "below" or "below" other elements will have other "up" orientations. Thus, the exemplary terms "down" or "bottom" can include "up" and "down" orientations.

図1は、拡張カードコネクタの分解図である。
図1に示すように、拡張カードコネクタ1は、コネクタ本体10と2本の位置決めポスト15と第1ネジ穴17と金属シェル20とを含む。コネクタ本体10は、頂部平面11を含む。2本の位置決めポスト15は、頂部平面11の一側に設けられる。第1ネジ穴17は、頂部平面11に貫設され、且つ2本の位置決めポスト15の間に位置する。
FIG. 1 is an exploded view of the expansion card connector.
As shown in FIG. 1, the expansion card connector 1 includes a connector body 10, two positioning posts 15, a first screw hole 17, and a metal shell 20. The connector body 10 includes a top plane 11. Two positioning posts 15 are provided on one side of the top plane 11. The first screw hole 17 extends through the top plane 11 and is located between the two positioning posts 15.

金属シェル20は、上部平面21を含み、上部平面21に2個の位置決め穴215及び第2ネジ穴217を有し、第2ネジ穴217が2個の位置決め穴215の間に位置し、2個の位置決め穴215が2本の位置決めポスト15に各々貫設されることで金属シェル20をコネクタ本体10に固定する。第2ネジ穴217と第1ネジ穴17の投影面が重なり合う。言い換えると、第2ネジ穴217と第1ネジ穴17が連通することで、緊締装置が締結できる連続ネジ穴を形成する。   The metal shell 20 includes an upper plane 21, and has two positioning holes 215 and a second screw hole 217 in the upper plane 21, and the second screw hole 217 is located between the two positioning holes 215, and The metal shell 20 is fixed to the connector body 10 by piercing the positioning holes 215 through the two positioning posts 15 respectively. The projection surfaces of the second screw hole 217 and the first screw hole 17 overlap. In other words, the continuous communication between the second screw hole 217 and the first screw hole 17 forms a continuous screw hole to which the tightening device can be fastened.

図1に示すように、金属シェル20は、2つの側壁23を更に含む。2つの側壁23は、各々上部平面21の両側から下方に向けて延伸されると共にコネクタ本体10を遮蔽する。側壁23及び位置決めポスト15は、上部平面21を支え、同時に、2つの側壁23が更にコネクタ本体10に対し金属のシールド効果を奏することができる。   As shown in FIG. 1, the metal shell 20 further includes two side walls 23. The two side walls 23 each extend downward from both sides of the upper flat surface 21 and shield the connector body 10. The side walls 23 and the positioning posts 15 support the upper flat surface 21, and at the same time, the two side walls 23 can further exert a metal shielding effect on the connector body 10.

ここで、上部平面21と頂部平面11は、ほぼ平行になり、やや角度のずれがあってもよい。ただし、これは例示であって、これに限られるものではない。上部平面21と頂部平面11は平行にならなくてもよく、例えば互いに平行でない形状となり得、位置決め穴215と位置決めポスト15の相互貫設固定、及び第2ネジ穴217と第1ネジ穴17の投影面の重なりを維持できるだけでよい。   Here, the upper plane 21 and the top plane 11 are substantially parallel, and there may be a slight angle shift. However, this is only an example, and the present invention is not limited to this. The upper plane 21 and the top plane 11 do not have to be parallel and may be, for example, non-parallel to each other, and the positioning holes 215 and the positioning posts 15 are interpenetrated and fixed. It is only necessary to maintain the overlap of the projection planes.

また、図1において、金属シェル20の上部平面21は、頂部平面11の後側に位置し、且つその面積が頂部平面11より小さい。ただし、これは例示であって、これに限られるものではない。金属シェル20は、延伸部25を更に含み、延伸部25が上部平面21の前端から折り曲げられて延伸され、頂部平面11と当接できる。こうして、更に金属のシールド効果を奏することができる。   In FIG. 1, the upper plane 21 of the metal shell 20 is located behind the top plane 11 and has an area smaller than that of the top plane 11. However, this is only an example, and the present invention is not limited to this. The metal shell 20 further includes an extension part 25, which is bent from the front end of the upper plane 21 and is extended to be able to abut the top plane 11. Thus, a metal shielding effect can be further achieved.

図2は、拡張カードモジュールアセンブリの分解図である。
図2に示すように、拡張カードモジュールアセンブリ100は、回路基板500に取り付けられ、ここで回路基板500がコンピュータ、携帯型電子機器のマザーボードとすることができる。回路基板500は、第1突起510と第2突起520とを備える。拡張カードモジュールアセンブリ100は、拡張カードコネクタ1と拡張部材2、と放熱組立体3とを含む。拡張カードコネクタ1の技術的特徴は、図1及び前段落の描写とほぼ同じであるため、ここではその説明を省略する。
FIG. 2 is an exploded view of the expansion card module assembly.
As shown in FIG. 2, the expansion card module assembly 100 is mounted on a circuit board 500, where the circuit board 500 can be a computer, a motherboard of a portable electronic device. The circuit board 500 includes a first protrusion 510 and a second protrusion 520. The expansion card module assembly 100 includes an expansion card connector 1, an expansion member 2, and a heat dissipation assembly 3. The technical features of the expansion card connector 1 are substantially the same as those described in FIG.

拡張部材2は、回路基板500に設けられ、第1突起510とコネクタ本体10との間に位置する。拡張部材2は、コネクタ本体10と組み込まれることで、通電を実現する。また、拡張部材2は、第1突起510と当接するための凹部を備えることができる。従って、拡張部材2は、第1突起510とコネクタ本体10により制限されることで、摺動を防止できる。ここで拡張部材2は、ソリッドステートドライブ(solid state drive、SSD)チップとすることができるが、これは例示であって、これに限られるものではない。   The extension member 2 is provided on the circuit board 500 and is located between the first protrusion 510 and the connector body 10. The expansion member 2 is energized by being incorporated with the connector body 10. Further, the expansion member 2 may include a recess for abutting on the first protrusion 510. Therefore, the expansion member 2 is prevented from sliding by being restricted by the first protrusion 510 and the connector main body 10. Here, the expansion member 2 may be a solid state drive (SSD) chip, but this is merely an example and the present invention is not limited to this.

放熱組立体3は、ヒートシンク本体31と第1締結部材33と第2締結部材35とを含む。第1締結部材33は、第1ネジ穴17及び第2ネジ穴217内を挿通して緊締する。第2突起520は、ネジ穴を備えるため、第2締結部材35が第2突起520に緊締できる。ここで、コネクタ本体10、第1突起510及び第2突起520の位置は、マザーボード規格の標準規定に適合する。従って、放熱組立体3は、単独で拡張部材2に固定されることができ、回路基板500上に別途穴をあける、或いは、PCHのヒートシンクと接続する必要がないため、コスト削減、放熱効率アップの効果を奏することができる。更に、回路基板500上の一部のスペースが空くため、部品の設置により高い柔軟性を持たせることができる。   The heat dissipating assembly 3 includes a heat sink body 31, a first fastening member 33, and a second fastening member 35. The first fastening member 33 is inserted and tightened in the first screw hole 17 and the second screw hole 217. Since the second protrusion 520 has a screw hole, the second fastening member 35 can be tightened to the second protrusion 520. Here, the positions of the connector body 10, the first protrusion 510, and the second protrusion 520 conform to the standard specification of the motherboard standard. Therefore, the heat dissipating assembly 3 can be fixed to the expansion member 2 independently, and it is not necessary to make a separate hole on the circuit board 500 or connect to the heat sink of the PCH, thereby reducing costs and increasing heat dissipating efficiency. The effect can be achieved. Furthermore, since a part of the space on the circuit board 500 is vacant, it is possible to provide the component with higher flexibility by installing components.

更に、拡張部材2の上表面は、直接ヒートシンク本体31と接触することで、迅速な放熱効果を奏することができる。第1締結部材33、第2締結部材35、及び対応する第1ネジ穴17及び第2ネジ穴217、第2突起520の締結設計を通じて、緊締において、より人間工学に適合し、簡単に操作可能な効果を奏することができる。   In addition, the upper surface of the expansion member 2 is brought into direct contact with the heat sink main body 31, so that a rapid heat radiation effect can be achieved. Through the fastening design of the first fastening member 33, the second fastening member 35, and the corresponding first screw hole 17, second screw hole 217, and second protrusion 520, the tightening is more ergonomic and easy to operate. Effects can be achieved.

幾つかの実施例において、コネクタ本体10及び金属シェル20の2つの側壁23は、回路基板500に溶接されることで、アース機能を実現し、更に信号の相互干渉を防止すると共に金属のシールド効果を高めることができる。   In some embodiments, the connector body 10 and the two side walls 23 of the metal shell 20 are welded to the circuit board 500 to provide a grounding function, further prevent signal interference, and provide a metal shielding effect. Can be increased.

以上をまとめると、拡張カードコネクタの構造の変更を通じて、コネクタ本体10に2本の位置決めポスト15、第1ネジ穴17及び金属シェル20を設置することで、マザーボードの設計時、回路基板500に別途穴をあけて放熱組立体3を固定する必要がなくなる。
また、放熱組立体3は、独立して拡張カードコネクタ1と組み込むことができ、大面積の取り付けを必要とせず、更に高熱の熱源と分離することでより一層放熱効果を奏することができる。
更に、放熱組立体3の面積を縮小させることにより、コストを削減する他、回路基板500上の部品設置スペースを増やし、更に部品の高さの制限を解除する。よって、マザーボード設計時の部品レイアウトの柔軟性を提供できる。
In summary, the two positioning posts 15, the first screw holes 17 and the metal shells 20 are installed on the connector body 10 through the modification of the structure of the expansion card connector, so that when the motherboard is designed, it is separately attached to the circuit board 500. There is no need to fix the heat dissipating assembly 3 by making holes.
Further, the heat dissipating assembly 3 can be independently incorporated with the expansion card connector 1, does not require a large-area mounting, and can further exhibit a heat dissipating effect by being separated from a heat source of higher heat.
Further, by reducing the area of the heat dissipating assembly 3, the cost is reduced, the space for installing components on the circuit board 500 is increased, and the restriction on the height of components is released. Therefore, it is possible to provide flexibility in component layout when designing the motherboard.

本考案の技術的内容は、好ましい実施例で上記の通り開示されたが、そのような実施例により本考案の保護範囲が限定されるべきものではなく、当業者が本考案の精神から離れることなく種々の変更及び改変を為し得ることは、当然に本考案の範囲に含められるべきである。よって本考案の保護範囲は、本明細書に添付する実用新案登録請求の範囲で定義しているものを基準とする。   Although the technical contents of the present invention have been disclosed in the preferred embodiments as described above, such embodiments should not limit the protection scope of the present invention, and those skilled in the art may depart from the spirit of the present invention. It should be understood that various changes and modifications can be made without departing from the scope of the present invention. Therefore, the protection scope of the present invention is based on what is defined in the utility model registration claims attached to this specification.

100 拡張カードモジュールアセンブリ
10 コネクタ本体
1 拡張カードコネクタ
11 頂部平面
15 位置決めポスト
17 第1ネジ穴
20 金属シェル
2 拡張部材
21 上部平面
215 位置決め穴
217 第2ネジ穴
23 側壁
25 延伸部
3 放熱組立体
31 ヒートシンク本体
33 第1締結部材
35 第2締結部材
500 回路基板
510 第1突起
520 第2突起
REFERENCE SIGNS LIST 100 Expansion card module assembly 10 Connector body 1 Expansion card connector 11 Top plane 15 Positioning post 17 First screw hole 20 Metal shell 2 Expansion member 21 Upper plane 215 Positioning hole 217 Second screw hole 23 Side wall 25 Extension part 3 Heat dissipating assembly 31 Heat sink body 33 First fastening member 35 Second fastening member 500 Circuit board 510 First protrusion 520 Second protrusion

Claims (10)

頂部平面を含むコネクタ本体と、
前記頂部平面の一側に設けられた2本の位置決めポストと、
前記頂部平面に貫設され、且つ前記2本の位置決めポストの間に位置する第1ネジ穴と、
上部平面を含み、前記上部平面に2個の位置決め穴及び第2ネジ穴を有し、前記第2ネジ穴が前記2個の位置決め穴の間に位置し、前記2個の位置決め穴が各々前記2本の位置決めポストに貫設されることで、金属シェルを前記コネクタ本体に固定させ、前記第2ネジ穴と前記第1ネジ穴の投影面は重なり合う金属シェルと、を含む、
拡張カードコネクタ。
A connector body including a top plane;
Two positioning posts provided on one side of the top plane,
A first screw hole extending through the top plane and located between the two positioning posts;
An upper plane, the upper plane having two positioning holes and a second screw hole, wherein the second screw hole is located between the two positioning holes, and each of the two positioning holes is A metal shell fixed to the connector body by being penetrated through the two positioning posts, including a metal shell in which the projection surface of the second screw hole and the first screw hole overlap.
Expansion card connector.
前記上部平面と前記頂部平面は、平行になる、請求項1に記載の拡張カードコネクタ。   The expansion card connector of claim 1, wherein the top plane and the top plane are parallel. 前記上部平面の面積は、前記頂部平面より小さい、請求項1に記載の拡張カードコネクタ。   The expansion card connector of claim 1, wherein the area of the top plane is smaller than the top plane. 前記金属シェルは、延伸部を更に含み、前記延伸部が前記上部平面の前端から折り曲げられて延伸されると共に、前記頂部平面と当接する、請求項3に記載の拡張カードコネクタ。   4. The expansion card connector of claim 3, wherein the metal shell further comprises an extension, wherein the extension is bent and extended from a front end of the top plane and abuts the top plane. 前記金属シェルは、2つの側壁を更に含み、前記2つの側壁が各々前記上部平面の両側から延伸されると共に前記コネクタ本体を遮蔽する、請求項1に記載の拡張カードコネクタ。   The expansion card connector according to claim 1, wherein the metal shell further includes two side walls, each of the two side walls extending from both sides of the upper plane and shielding the connector body. 第1突起と第2突起とを備えた回路基板に取り付けられた拡張カードモジュールアセンブリであって、
コネクタ本体と2本の位置決めポストと第1ネジ穴と金属シェルとを含み、前記コネクタ本体は、頂部平面を含み、前記2本の位置決めポストが前記頂部平面の一側に設けられ、前記第1ネジ穴が前記頂部平面に貫設され、且つ前記2本の位置決めポストの間に位置し、前記金属シェルが上部平面を含み、前記上部平面に2個の位置決め穴及び第2ネジ穴を有し、前記第2ネジ穴が前記2個の位置決め穴の間に位置し、前記2個の位置決め穴が各々前記2本の位置決めポストに貫設されることで、前記金属シェルを前記コネクタ本体に固定させ、前記第2ネジ穴と前記第1ネジ穴の投影面が重なり合う拡張カードコネクタと、
前記回路基板に設けられ、前記第1突起と前記コネクタ本体の間に位置し、前記コネクタ本体と組み込まれ、且つ前記第1突起と当接する拡張部材と、
ヒートシンク本体と第1締結部材と第2締結部材とを含み、前記第1締結部材は、前記第1ネジ穴及び前記第2ネジ穴内を挿通して緊締し、前記第2締結部材が前記第2突起に緊締される放熱組立体と、を含む、
拡張カードモジュールアセンブリ。
An expansion card module assembly attached to a circuit board having a first projection and a second projection,
A connector body including two positioning posts, a first screw hole, and a metal shell, wherein the connector body includes a top flat surface, wherein the two positioning posts are provided on one side of the top flat surface; A screw hole extends through the top plane and is located between the two locating posts, the metal shell includes an upper plane, and has two locating holes and a second screw hole in the upper plane. Fixing the metal shell to the connector body by the second screw hole being located between the two positioning holes, and the two positioning holes being respectively penetrated through the two positioning posts. An expansion card connector, wherein the projection surface of the second screw hole and the projection surface of the first screw hole overlap;
An extension member provided on the circuit board, located between the first protrusion and the connector body, integrated with the connector body, and in contact with the first protrusion;
A heat sink body, a first fastening member, and a second fastening member, wherein the first fastening member is inserted into the first screw hole and the second screw hole and tightened; A heat dissipating assembly secured to the protrusion.
Expansion card module assembly.
前記金属シェルは、2つの側壁を更に含み、前記2つの側壁が各々前記上部平面の両側から延伸されると共に前記コネクタ本体を遮蔽する、請求項6に記載の拡張カードモジュールアセンブリ。   The expansion card module assembly according to claim 6, wherein the metal shell further includes two side walls, each of the two side walls extending from both sides of the upper plane and shielding the connector body. 前記コネクタ本体及び前記2つの側壁は、前記回路基板に溶接される、請求項7に記載の拡張カードモジュールアセンブリ。   The expansion card module assembly according to claim 7, wherein the connector body and the two side walls are welded to the circuit board. 前記拡張部材の上表面は、前記ヒートシンク本体と直接接触する、請求項6に記載の拡張カードモジュールアセンブリ。   The expansion card module assembly according to claim 6, wherein an upper surface of the expansion member is in direct contact with the heat sink body. 前記金属シェルは、延伸部を更に含み、前記延伸部が前記上部平面の前端から折り曲げられて延伸されると共に、前記頂部平面と当接する、請求項6に記載の拡張カードモジュールアセンブリ。
The expansion card module assembly according to claim 6, wherein the metal shell further includes an extension, wherein the extension is bent and extended from a front end of the upper plane, and abuts the top plane.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7554802B2 (en) 2022-09-22 2024-09-20 Necパーソナルコンピュータ株式会社 Heat dissipation structure and electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7554802B2 (en) 2022-09-22 2024-09-20 Necパーソナルコンピュータ株式会社 Heat dissipation structure and electronic device

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