JP3223009B2 - Electronic component automatic mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic electronic component mounting apparatus for taking out an electronic component from a component supply section by a take-out nozzle provided in a transport head and mounting the electronic component on a printed circuit board.

[0002]

2. Description of the Related Art This type of automatic electronic component mounting apparatus is now open.
It is disclosed in Japanese Patent Application Laid-Open No. 0-121671, and it is determined that the posture of the electronic component sucked by the suction means is correct when the light beam from the light emitting element is detected by the light receiving element, and the component thickness changes depending on the component type. In this case, the height of the light emitting element and the light receiving element is changed by rotating the drive lever in accordance with the information on the thickness of the component, so that the correct orientation of the component is determined.

[0003]

However, in the above-mentioned prior art, when the surface of the electronic component that is not to be attracted is attracted and is completely standing, the light from the light emitting element is blocked by the component. However, since the abnormality is detected in a state where the take-out nozzle, which is a normal suction means, is stopped at a predetermined position, as shown in FIG. 8, the electronic component 100 is attracted to the take-out nozzle 101 in an oblique state. When the light beam passes through the point A in FIG. 8 in a direction perpendicular to the sheet of FIG. Since the light is not shielded by the component 100, it is determined that the light is sucked in a normal posture, and if it is mounted on the printed circuit board as it is, it cannot be mounted at a predetermined position, resulting in a defective board.

SUMMARY OF THE INVENTION It is an object of the present invention to make it possible to reliably determine an abnormality in a posture sucked by a take-out nozzle of an electronic component.

[0005]

SUMMARY OF THE INVENTION Accordingly, the present invention is directed to an automatic electronic component mounting apparatus for removing an electronic component from a component supply unit by a removal nozzle provided on the transport head and mounting the component on a printed circuit board. The lower end position of the electronic component at a plurality of detection positions arranged in the horizontal direction when the electronic component sucked by the nozzle is moved relative to the sensor by the output of the line sensor provided at the moving or stopped position , A selecting means for selecting a lowermost position among a plurality of lower positions due to the movement detected by the lower position detecting means, and information on a component thickness for each type of electronic component. The electronic component held by the nozzle based on the lowermost position selected by the selector and the information on the component thickness stored in the storage. It is obtained by a determination means for determining.

According to the present invention, there is provided an automatic electronic component mounting apparatus for removing an electronic component from a component supply section by a removal nozzle provided on a transport head and mounting the electronic component on a printed circuit board. The horizontal direction during the movement or at the time of stop of the electronic component sucked by the nozzle that moves relatively to the sensor by the output
Lower end position detecting means for sequentially detecting the lower end position of the electronic component at a plurality of detection positions arranged in a row ; moving lower end position storing means for sequentially updating and storing the lower end position detected by the detecting means; A lower end position stored in the lower end position storage means and a lower end stored in the lower end position storage means each time a lower end position is stored in the lower end position storage means during the movement. Storage setting means for comparing the position with the position and storing the lower end position of the lower end in the lowermost position storage means, component thickness storage means for storing information relating to component thickness for each type of electronic component, the nozzle and the line sensor Relative movement of the electronic component held by the nozzle after passing the sensor, the information on the lower end position stored in the lowermost position storage means and the information on the component thickness stored in the storage means Those having a determining means for determining Hazuki abnormality of the electronic component held by the nozzle.

[0007]

According to the first aspect of the present invention, the selection means comprises a plurality of detection positions arranged in a horizontal direction while the electronic component sucked by the take-out nozzle is moving relative to the line sensor or stopped.
The lowermost position of the electronic component detected by the lower end position detecting means is selected at the lowermost position, and the determining means determines the lowermost position selected by the selecting means and the component thickness information stored in the component thickness storing means. Then, it is determined whether or not adsorption is performed normally.

According to the second aspect of the present invention , a plurality of detection positions arranged in the horizontal direction based on the output of the line sensor during the relative movement of the take-out nozzle with respect to the line sensor or at the time of stopping are taken.
At each position, when the lower end position detected by the lower end position detecting means is stored by the lower end position storing means during the movement, the storage setting means is stored by the lower end position stored in the lowermost position storing means and the lower end position storing means during the movement. The lower end position of the lower end is stored in the lowermost position storage means,
Until the electronic components held by the take-out nozzle pass through the sensor, at each detection position arranged in the horizontal direction , the lower end position detected by the lower end position detection means is sequentially stored in the lower end position storage means during the movement, and after passing through the sensor, The lowermost position is stored in the lowermost position storage means, and the determination means determines whether or not the suction is normally performed based on the lowermost position and the component thickness information stored in the component thickness storage means.

[0009]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 and 3, reference numeral 1 denotes a Y table which moves in the Y direction by rotation of a Y-axis motor 2, and 3 denotes a movement in the X direction on the Y table 1 by rotation of an X-axis motor 4. As a result, the printed circuit board 6 on which the chip-shaped electronic components 5 (hereinafter, referred to as chip components or components) are mounted is fixedly mounted on fixing means (not shown).

Reference numeral 7 denotes a supply table, on which a number of component supply devices 8 for supplying the chip components 5 are provided. Reference numeral 9 denotes a supply table drive motor, which rotates the ball screw 10 so that the supply table 7 is guided by the linear guide 12 via a nut 11 fitted with the ball screw 10 and fixed to the supply table 7, and X Move in the direction. Reference numeral 13 denotes a rotary table which rotates intermittently. At the outer edge of the table 13, mounting heads 15 as transfer heads having six suction nozzles 14 as take-out nozzles are arranged at equal intervals in accordance with an intermittent pitch. I have.

A stop position of the mounting head 15 where the suction nozzle 14 sucks and picks up the component 5 from the supply device 8 is a suction station, and the suction nozzle 14 sucks the component 5 at the suction station. Reference numeral 16 denotes a component recognition device for recognizing a positional shift of the component 5 to be sucked by the suction nozzle 14 by using a camera to image the lower surface of the component 5 within a predetermined visual field range and recognizing and processing the captured screen. The station where the moving mounting head 15 stops on the device 16 is the recognition station.

The position at which the mounting head 15 next to the recognition station stops is the angle correction station, and mounting data (not shown) in which the angle amount for correcting the angular displacement of the chip component 5 based on the recognition result of the recognition device 16 is predetermined. Head rotation device 1 by an angle amount that is added to the angle amount shown in FIG.
7 rotates the mounting head 15 in the θ direction. The next stop position after the angle correction station is the mounting station, and the component 5 to be suctioned by the suction nozzle 14 of the station is mounted on the substrate 6.

Numeral 20 denotes an elevating rod which moves up and down, engages with an oscillating lever 21 of the component supply device 8 and oscillates to fit a component storage tape (not shown) in which the chip components 5 are sealed at a predetermined interval. The chip component 5 is supplied to the component suction position of the suction nozzle 14 by intermittent feeding. Reference numeral 22 denotes a tape reel for winding the component storage tape (not shown). The next station following the suction station is provided with a line sensor 27 for detecting the attitude of the chip component 5 that is suctioned and held by the suction nozzle 14. As shown in FIG. 4, the line sensor 27 emits a light beam that travels straight in the horizontal direction, and a light receiving device in which a number of CCD elements are arranged on a straight line in the vertical direction so as to be able to receive the light beam. And a vessel 29. The light projector may condense the light of the LED with a lens and emit a light beam that travels in parallel, or may do so using a laser. For example, a CCD device in which about 1,000 CCD elements are arranged in a vertical width of about 10 mm can be realized. Each of the CCD elements can detect the amount of received light, and can be used as an ON / OFF sensor by determining a threshold value of the amount of received light. With the ON / OFF output, the part shielded by the component 5 or the suction nozzle 14 can be detected as height position data.

The line sensor 27 is a rotary table 1
In FIG. 2 due to the rotation of 3, the suction nozzle 14 is fixed and attached so that the light beam emitted from the light projector 28 hits the approximate center of the suction nozzle 14 at the stop position. next,
A control block of the electronic component automatic mounting apparatus according to the present embodiment will be described with reference to FIG.

A CPU 31 controls various operations related to the mounting of the chip component 5 in accordance with a program stored in a ROM 33 based on various data stored in a RAM 32 and information on sensors such as a line sensor 27. . The line sensor 31 is connected to the CPU 31 via an interface 34. The index motor 35, which is one of the control objects of the CPU 31, is connected to the CPU 31 via the interface 34 and the drive circuit 36.
It is connected to the.

The output of the line sensor 27 is output for each CCD element, and the lower end peak value is the lower end position where the height position of the boundary from the lowermost light-shielded portion to the light-transmitted portion is the lower end position. Is calculated by the CPU 31. RAM
32 is provided with a capture memory 38 as a lower end position storage means during movement and a hold memory 39 as a lowermost position storage means, and the capture memory 38 is calculated from the output of the line sensor 27 at regular time intervals. That is, the lower end height position of the component 5 for each predetermined moving distance of the suction nozzle 14 is read, and the hold memory 39 stores a lower end position which is larger than the value of the loading memory 38, that is, the lower end position of the lower end.

The RAM 32 further stores component data as shown in FIG. 6 for each component type. The component thickness data for comparison with the height position, which is the lowermost position, stored in the hold memory 39. In addition, data of a component thickness allowable value to be viewed as an allowable value at the time of the comparison is stored. The operation of the above configuration will be described below.

First, when an operation unit (not shown) is operated to start automatic operation of the electronic component automatic mounting apparatus, the RAM 3
Components 5 to be mounted in the mounting order (not shown) stored in 2
Supply table 7 according to the stored data on
Then, the component supply device 8 of the chip component 5 to be supplied stops at the suction position of the suction nozzle 14 of the mounting head 15 of the suction station, and the chip component 5 is taken out by descending the nozzle 14.

Next, the rotation of the index motor 35 causes the rotary table 13 to rotate intermittently via an index mechanism (not shown), the head 15 moves to the next station and stops, and the line sensor is driven by the next rotation. It moves to the station provided with 27. When it is time to start detection shortly before the movement of the rotary table 13 stops, the CPU 31 detects this timing and performs the operation shown in the flowchart of FIG. This timing is a timing at which the CPU 31 detects the ON when a sensor (not shown) that detects a predetermined rotation angle of the cam shaft that rotates once every one intermittent rotation of the rotary table 13 is turned on. 1
The moving position of the suction nozzle 14 is always a fixed position.
The tip of the line sensor 27 taking into account the shift in the moving direction of the largest type of component 5 among the chip components 5 sucked into the
The timing is to start the detection when the position of the light beam, which is the detection position, is not reached. The light beam of the light emitter 28 of the line sensor 27 is always emitted and the light receiver 29 is always emitted.
It is assumed that the light is received and the output is always made. When the detection start timing comes, the light emitter 28 may emit light and the output of the line sensor 27 may be started. Alternatively, the detection start timing and the detection end timing to be described later may be set within a range in which even a component 5 of a certain size can be detected.

At this start timing, first, the capture memory 38 and the hold memory 39 are cleared, and the CPU 31 calculates, from the output of the line sensor 27, the position at which light is transmitted from light shielding at the bottom as a bottom peak value. The value is fetched and stored in the memory 38. This value is set so that the origin is set higher than the height position of the lower end surface of the suction nozzle 14 and becomes positive downward.

The CPU 31 stores this value in the hold memory 39
Is stored in the hold memory 39. Since the position is initially the position where the component 5 is not present,
It remains "0". While this process is being performed, the nozzle 14 is moving and is different from the detection end timing, so the CPU 31 performs the same process again. When the position indicated by the second vertical dotted line from the left of FIG. 7 becomes the position of the light beam of the light projector 28 of the line sensor 27, this output is output to the CPU.
When the data 31 is read, the lower end position indicated by the black circle of the dotted line in FIG. 7 is calculated, the value of this position is stored in the capture memory 38, and compared with the value of the hold memory 39. This value is read into the memory 39. Next, during this process, the nozzle 14
Move, and at the time of the next reading of the CPU 31, the output of the third dotted line sensor 27 from the left in FIG.
Read to 1. Since this value is larger than the value of the hold memory 39, the value of the hold memory 39 is updated.

Next, at the next reading position, since the lower end position becomes higher and the value becomes smaller, the value in the hold memory 39 is held as it is. In this way, each vertical line shown in FIG.
, That is, a plurality of detection positions arranged in the horizontal direction
When the output of the line sensor 27 is read out and the detection end timing is detected by a sensor provided on a cam shaft (not shown) similar to the above, the CPU 31 stops reading and stores the value stored in the hold memory and the RAM 32. The component thickness of the stored component data of the component type to be compared is compared with a value added to the data of the nozzle level, which is the lower end position of the suction nozzle 14, and the difference is not within the allowable component pressure value. Since the value is larger, it is determined that the suction is abnormal (abnormal posture), and the following abnormal process control is performed.

Next, as an abnormal process, the suction nozzle 14
Does not carry out any work related to component mounting even if it stops at the subsequent stop station, does not perform component mounting even at the mounting station, and at a predetermined discharge station, the chip component 5
To discharge. Next, when the chip component 5 is normally sucked, if the component 5 moves to the station provided with the line sensor 27 by the movement of the mounting head 15, the component 5 Is calculated each time the CPU 31 reads the output of the line sensor 27, and is taken into the acquisition memory 38, and the hold memory 39
Stores the lowermost position. When the suction is performed normally, the value of the capture memory 38 is substantially constant.
1 determines whether or not the component posture is abnormal after the detection end timing, but it is within the component allowable value compared with the lower end position based on the nozzle data of the component data and the component thickness data as described above, so that it is normal. Judge and control the following normal processing operation.

Then, at the recognition station, the recognition device 16
The head 15 is rotated by the head rotation device 17 for swinging the chip component 5 based on the recognition result, and the XY table 3 is set at the mounting station.
The chip component 5 is mounted on the printed circuit board 6 positioned by the movement of. At this time, since the lower end position which is the height position of the lower end of the component 5 is detected, the descending distance of the suction nozzle is adjusted according to the lower end position, and the component 5 is mounted on the printed circuit board 6 with an appropriate pressure. Is done.

Next, when the component 5 is not sucked by the suction nozzle 14, the value of the hold memory 39 based on the output of the line sensor 27 is at the height position of the lower end of the suction nozzle 14, so that the component 5 It is determined that there is no component, and also in this case, the mounting operation of the component 5 is not performed as the abnormal processing. Next, when the wrong component 5 having a different size is sucked and the value of the hold memory 39 is larger than the lower end position of the nozzle 14 but smaller than the lower end position due to the component thickness and exceeds the allowable value range, the CPU 31 After determining that the component 5 is abnormal, the mounting operation of the component 5 is not performed, and the component 5 is discharged at a predetermined discharge station.

In this way, the component 5 is
Each time the robot moves to the stop station, the abnormality of the attitude of the component 5 is determined, and appropriate measures are taken. In this embodiment, when the output of the line sensor 27 is read by the CPU 31, the CPU 31 calculates the lower end position and reads the output from the memory 3.
The output of the next line sensor 27 was read immediately after processing such as a comparison between the memory 8 and the hold memory 39, but other processing is performed during the vacant time by increasing the reading interval. Alternatively, the function shown in FIG. 5 may be provided as a processing unit including another CPU, a capture memory, and a hold memory, connected to the CPU of the electronic component automatic mounting apparatus via an interface, and the other may be provided as a line sensor. As a connected configuration, a signal of detection start timing and detection end timing is given from the CPU of the mounting device, and the CPU of the mounting device reads the contents of the hold memory after the detection is completed, and determines whether the above is normal or abnormal as described above. It may be performed.

In this embodiment, the line sensor 27 is provided at the stop station of the rotary table 13 to detect the lower end position of the moving part 5 before and after stopping. A line sensor may be provided in between to detect the moving component 5, or the line sensor may be moved in the horizontal direction during the stop of the stop station to relatively move the detection position. The moving path of the head of the mounting device is not a rotary table type electronic component automatic mounting device, but a mounting head that is mounted on an XY table and moves to mount the electronic component at a predetermined position on a printed circuit board from a component supply unit. May be provided in the middle of the process.

Although component thickness and nozzle level data are stored in the component data stored in the RAM 32 and these are added to the lower end position, data of the lower end position may be stored directly.

[0029]

As described above, according to the present invention, even when an electronic component is obliquely attracted to the take-out nozzle , the take-out nozzle
Horizontal direction when moving or stopping electronic components
The lower end position is detected at a plurality of detection positions
Since the height position of the lowermost end of the electronic component can be detected from the lower end position of the electronic component, it is possible to reliably determine an abnormal posture and to reduce the occurrence of defective boards.

[Brief description of the drawings]

FIG. 1 is a control block diagram of an electronic component automatic mounting apparatus to which the present invention is applied.

FIG. 2 is a plan view of the electronic component automatic mounting apparatus.

FIG. 3 is a side view of the electronic component automatic mounting apparatus.

FIG. 4 is a side view showing a line sensor.

FIG. 5 is a diagram showing a flowchart.

FIG. 6 is a diagram showing component data.

FIG. 7 is a side view showing a state where a chip component is sucked by a suction nozzle.

FIG. 8 is a side view showing a state in which a chip component is sucked by a suction nozzle according to the related art.

[Explanation of symbols]

Reference Signs List 5 Chip-shaped electronic component (electronic component) 6 Printed circuit board 14 Suction nozzle (extraction nozzle) 15 Mounting head (transport head) 27 Line sensor 31 CPU 32 RAM (storage means) 38 Capture memory (moving lower end position storage means) 39 hold Memory (lowest position storage means)

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 13/04 H05K 13/08

Claims (2)

(57) [Claims] 1. An automatic electronic component mounting apparatus for taking out an electronic component from a component supply unit by a take-out nozzle provided on a transport head and mounting the electronic component on a printed circuit board, based on an output of a line sensor provided on a movement path of the transport head. A plurality of horizontally aligned electronic components adsorbed by the nozzles that move relative to the sensor are moved or stopped .
A lower end position detecting means for detecting a lower end position of the electronic component at the detection position ; a selecting means for selecting a lowermost position among a plurality of lower end positions due to the movement detected by the lower end position detecting means; A storage unit for storing information on the component thickness for each type, and an abnormality of the electronic component held in the nozzle is determined based on the lowermost position selected by the selection unit and the information on the component thickness stored in the storage unit. An electronic component automatic mounting apparatus comprising: a determination unit. 2. An automatic electronic component mounting apparatus for picking up an electronic component from a component supply unit by a pick-up nozzle provided on a transport head and mounting the electronic component on a printed circuit board, based on an output of a line sensor provided on a moving path of the transport head. A plurality of electronic components adsorbed by the nozzle that moves relative to a sensor are arranged in the horizontal direction during or during movement of the electronic component .
Lower end position detecting means for sequentially detecting the lower end position of the electronic component at the detected position, moving lower end position storing means for sequentially updating and storing the lower end position detected by the detecting means, and a lower end position storing means for storing the lowermost position. Each time the lower end position is stored in the lower end position storage unit, the lower end position stored in the lower end position storage unit is compared with the lower end position stored in the lowermost position storage unit. Storage setting means for storing the lower end position of the lower end in the lowermost position storage means, component thickness storage means for storing information relating to component thickness for each type of electronic component, and relative movement of the nozzle and the line sensor. After the electronic component held by the nozzle has passed through the sensor, the lower end position information stored in the lowermost position storage means and the information regarding the component thickness stored in the storage means are used to determine the nozzle position. Automatic electronic part mounting apparatus characterized by comprising determination means for determining an abnormality of the electronic component held by the Le.