JP3221810B2 - Binder composition for mold, mold composition and method for producing mold - Google Patents
Binder composition for mold, mold composition and method for producing moldInfo
- Publication number
- JP3221810B2 JP3221810B2 JP32463794A JP32463794A JP3221810B2 JP 3221810 B2 JP3221810 B2 JP 3221810B2 JP 32463794 A JP32463794 A JP 32463794A JP 32463794 A JP32463794 A JP 32463794A JP 3221810 B2 JP3221810 B2 JP 3221810B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- binder composition
- weight
- aldehyde
- phenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000203 mixture Substances 0.000 title claims description 58
- 239000011230 binding agent Substances 0.000 title claims description 47
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 229930185605 Bisphenol Natural products 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 29
- -1 aldehyde compound Chemical class 0.000 claims description 28
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 27
- 150000001875 compounds Chemical class 0.000 claims description 25
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 21
- 150000002989 phenols Chemical class 0.000 claims description 21
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 16
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 16
- 150000002895 organic esters Chemical class 0.000 claims description 13
- 238000004898 kneading Methods 0.000 claims description 12
- 150000001298 alcohols Chemical class 0.000 claims description 8
- 239000001569 carbon dioxide Substances 0.000 claims description 8
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 7
- 150000003934 aromatic aldehydes Chemical class 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 3
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 3
- 229930003836 cresol Natural products 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 33
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 28
- 238000000034 method Methods 0.000 description 26
- 239000004576 sand Substances 0.000 description 24
- 239000007864 aqueous solution Substances 0.000 description 21
- 238000000465 moulding Methods 0.000 description 13
- 235000019441 ethanol Nutrition 0.000 description 12
- 238000005266 casting Methods 0.000 description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 239000007789 gas Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 8
- 238000001723 curing Methods 0.000 description 8
- 239000008187 granular material Substances 0.000 description 8
- 125000004432 carbon atom Chemical group C* 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 239000005011 phenolic resin Substances 0.000 description 6
- 239000003513 alkali Substances 0.000 description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 4
- TZIHFWKZFHZASV-UHFFFAOYSA-N methyl formate Chemical compound COC=O TZIHFWKZFHZASV-UHFFFAOYSA-N 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- URAYPUMNDPQOKB-UHFFFAOYSA-N triacetin Chemical compound CC(=O)OCC(OC(C)=O)COC(C)=O URAYPUMNDPQOKB-UHFFFAOYSA-N 0.000 description 4
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 238000007664 blowing Methods 0.000 description 3
- 238000010367 cloning Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000012643 polycondensation polymerization Methods 0.000 description 3
- BBMCTIGTTCKYKF-UHFFFAOYSA-N 1-heptanol Chemical compound CCCCCCCO BBMCTIGTTCKYKF-UHFFFAOYSA-N 0.000 description 2
- BVQVLAIMHVDZEL-UHFFFAOYSA-N 1-phenyl-1,2-propanedione Chemical group CC(=O)C(=O)C1=CC=CC=C1 BVQVLAIMHVDZEL-UHFFFAOYSA-N 0.000 description 2
- HXVNBWAKAOHACI-UHFFFAOYSA-N 2,4-dimethyl-3-pentanone Chemical compound CC(C)C(=O)C(C)C HXVNBWAKAOHACI-UHFFFAOYSA-N 0.000 description 2
- OJVAMHKKJGICOG-UHFFFAOYSA-N 2,5-hexanedione Chemical compound CC(=O)CCC(C)=O OJVAMHKKJGICOG-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000007809 chemical reaction catalyst Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- 235000013773 glyceryl triacetate Nutrition 0.000 description 2
- 239000001087 glyceryl triacetate Substances 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 description 2
- 229940035429 isobutyl alcohol Drugs 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- ZWRUINPWMLAQRD-UHFFFAOYSA-N nonan-1-ol Chemical compound CCCCCCCCCO ZWRUINPWMLAQRD-UHFFFAOYSA-N 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229960002622 triacetin Drugs 0.000 description 2
- 150000005691 triesters Chemical class 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- KJPRLNWUNMBNBZ-QPJJXVBHSA-N (E)-cinnamaldehyde Chemical compound O=C\C=C\C1=CC=CC=C1 KJPRLNWUNMBNBZ-QPJJXVBHSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- OWEYKIWAZBBXJK-UHFFFAOYSA-N 1,1-Dichloro-2,2-bis(4-hydroxyphenyl)ethylene Chemical compound C1=CC(O)=CC=C1C(=C(Cl)Cl)C1=CC=C(O)C=C1 OWEYKIWAZBBXJK-UHFFFAOYSA-N 0.000 description 1
- OZXIZRZFGJZWBF-UHFFFAOYSA-N 1,3,5-trimethyl-2-(2,4,6-trimethylphenoxy)benzene Chemical compound CC1=CC(C)=CC(C)=C1OC1=C(C)C=C(C)C=C1C OZXIZRZFGJZWBF-UHFFFAOYSA-N 0.000 description 1
- YFKBXYGUSOXJGS-UHFFFAOYSA-N 1,3-Diphenyl-2-propanone Chemical compound C=1C=CC=CC=1CC(=O)CC1=CC=CC=C1 YFKBXYGUSOXJGS-UHFFFAOYSA-N 0.000 description 1
- CVBUKMMMRLOKQR-UHFFFAOYSA-N 1-phenylbutane-1,3-dione Chemical compound CC(=O)CC(=O)C1=CC=CC=C1 CVBUKMMMRLOKQR-UHFFFAOYSA-N 0.000 description 1
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 1
- MUOPWKRYDKBMJS-UHFFFAOYSA-N 2-[(2-hydroxyphenyl)methyl]-4-methyl-3-(2-methylpropyl)phenol Chemical compound CC(C)CC1=C(C)C=CC(O)=C1CC1=CC=CC=C1O MUOPWKRYDKBMJS-UHFFFAOYSA-N 0.000 description 1
- RWKGRPMIVVAART-UHFFFAOYSA-N 2-[(2-hydroxyphenyl)methyl]-4-methyl-3-phenylphenol Chemical compound C=1C=CC=CC=1C=1C(C)=CC=C(O)C=1CC1=CC=CC=C1O RWKGRPMIVVAART-UHFFFAOYSA-N 0.000 description 1
- XSAYZAUNJMRRIR-UHFFFAOYSA-N 2-acetylnaphthalene Chemical compound C1=CC=CC2=CC(C(=O)C)=CC=C21 XSAYZAUNJMRRIR-UHFFFAOYSA-N 0.000 description 1
- JTXMVXSTHSMVQF-UHFFFAOYSA-N 2-acetyloxyethyl acetate Chemical compound CC(=O)OCCOC(C)=O JTXMVXSTHSMVQF-UHFFFAOYSA-N 0.000 description 1
- HXDLWJWIAHWIKI-UHFFFAOYSA-N 2-hydroxyethyl acetate Chemical compound CC(=O)OCCO HXDLWJWIAHWIKI-UHFFFAOYSA-N 0.000 description 1
- WUQYBSRMWWRFQH-UHFFFAOYSA-N 2-prop-1-en-2-ylphenol Chemical compound CC(=C)C1=CC=CC=C1O WUQYBSRMWWRFQH-UHFFFAOYSA-N 0.000 description 1
- UPUBPJSRVFPODT-UHFFFAOYSA-N 3-ethyl-2-[(2-hydroxyphenyl)methyl]-4-methylphenol Chemical compound CCC1=C(C)C=CC(O)=C1CC1=CC=CC=C1O UPUBPJSRVFPODT-UHFFFAOYSA-N 0.000 description 1
- AFPCWCAQLKFITQ-UHFFFAOYSA-N 3-hexyl-2-[(2-hydroxyphenyl)methyl]-4-methylphenol Chemical compound CCCCCCC1=C(C)C=CC(O)=C1CC1=CC=CC=C1O AFPCWCAQLKFITQ-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- VGVHNLRUAMRIEW-UHFFFAOYSA-N 4-methylcyclohexan-1-one Chemical compound CC1CCC(=O)CC1 VGVHNLRUAMRIEW-UHFFFAOYSA-N 0.000 description 1
- KHLRJDNGHBXOSV-UHFFFAOYSA-N 5-trimethoxysilylpentane-1,3-diamine Chemical compound CO[Si](OC)(OC)CCC(N)CCN KHLRJDNGHBXOSV-UHFFFAOYSA-N 0.000 description 1
- 244000226021 Anacardium occidentale Species 0.000 description 1
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical group CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
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- 239000002253 acid Substances 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
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- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
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- 238000007865 diluting Methods 0.000 description 1
- CDMADVZSLOHIFP-UHFFFAOYSA-N disodium;3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane;decahydrate Chemical compound O.O.O.O.O.O.O.O.O.O.[Na+].[Na+].O1B([O-])OB2OB([O-])OB1O2 CDMADVZSLOHIFP-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
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- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000033444 hydroxylation Effects 0.000 description 1
- 238000005805 hydroxylation reaction Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
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- 239000003110 molding sand Substances 0.000 description 1
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
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- 239000010450 olivine Substances 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- PJGSXYOJTGTZAV-UHFFFAOYSA-N pinacolone Chemical compound CC(=O)C(C)(C)C PJGSXYOJTGTZAV-UHFFFAOYSA-N 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- KRIOVPPHQSLHCZ-UHFFFAOYSA-N propiophenone Chemical compound CCC(=O)C1=CC=CC=C1 KRIOVPPHQSLHCZ-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- KUCOHFSKRZZVRO-UHFFFAOYSA-N terephthalaldehyde Chemical compound O=CC1=CC=C(C=O)C=C1 KUCOHFSKRZZVRO-UHFFFAOYSA-N 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- WTLBZVNBAKMVDP-UHFFFAOYSA-N tris(2-butoxyethyl) phosphate Chemical compound CCCCOCCOP(=O)(OCCOCCCC)OCCOCCCC WTLBZVNBAKMVDP-UHFFFAOYSA-N 0.000 description 1
- XKGLSKVNOSHTAD-UHFFFAOYSA-N valerophenone Chemical compound CCCCC(=O)C1=CC=CC=C1 XKGLSKVNOSHTAD-UHFFFAOYSA-N 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Mold Materials And Core Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は鋳型を製造する際に使用
する粘結剤組成物に関するものである。又、この粘結剤
組成物を配合した鋳型組成物、およびこの粘結剤組成物
を使用して、鋳型を製造する方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a binder composition used for producing a mold. The present invention also relates to a mold composition containing the binder composition, and a method for producing a mold using the binder composition.
【0002】[0002]
【従来の技術】有機粘結剤を用いて主型や中子のような
鋳型を製造する造型法として、自硬性鋳型法、コールド
ボックス鋳型法、クローニング法(シェル法)は公知で
ある。特に有機自硬性鋳型造型法は機械鋳物分野を中心
に生産性、鋳物品質、安全衛生上の観点から無機系に代
わって既に汎用的な造型法となっている。一方、従来、
中、高速で鋳型を製造するにはフェノール樹脂を粒状耐
火物に被覆した、所謂コーテッドサンド(Coated Sand)
を加熱硬化して鋳型を製造するクローニング法が幅広く
使用されている。しかし、鋳型製造時の省エネルギー、
鋳型生産速度、更に鋳型、鋳物の品質を改善するため
に、ガス状又はエロゾル状物質で常温硬化させるコール
ドボックス鋳型法がクローニング法を代替する鋳型の製
造法として鋳物業界で真剣に導入が試みられてきてい
る。2. Description of the Related Art As a molding method for producing a mold such as a main mold or a core using an organic binder, a self-hardening mold method, a cold box mold method, and a cloning method (shell method) are known. In particular, the organic self-hardening molding method is already a general-purpose molding method in place of the inorganic type from the viewpoint of productivity, casting quality, safety and health mainly in the field of mechanical casting. On the other hand,
So-called coated sand, in which phenolic resin is coated on granular refractories to produce molds at high speeds
A cloning method of producing a template by heat-curing is widely used. However, energy saving during mold production,
In order to improve mold production speed, mold and casting quality, cold box mold method of curing at room temperature with gaseous or aerosol-like material has been seriously introduced in the casting industry as a mold production method that replaces the cloning method. Is coming.
【0003】[0003]
【発明が解決しようとする課題】有機自硬性鋳型造型法
及びガス硬化性鋳型造型法に用いられる粘結剤組成物と
して、水溶性フェノール樹脂を粘結剤とし、これを有機
エステルで硬化せしめる鋳物砂用粘結剤組成物が、特開
昭50−130627号公報、特開昭58-154433 号公報、特開昭
58-154434 号公報等により公知である。また、ビスフェ
ノールとホルムアルデヒドとを縮重合させたフェノール
系樹脂を粘結剤として使用すること (特開昭62-40948号
公報、特開昭63-40636号公報) や、カリウムアルカリ性
ビスフェノール・フェノール共重合型レゾール樹脂を粘
結剤として使用すること (特開平5-123818号公報) も公
知である。As a binder composition for use in an organic self-hardening mold molding method and a gas-curable mold molding method, a casting obtained by using a water-soluble phenol resin as a binder and curing the same with an organic ester. The binder composition for sand is disclosed in JP-A-50-130627, JP-A-58-154433,
It is publicly known, for example, from JP-A-58-154434. Further, a phenolic resin obtained by polycondensation of bisphenol and formaldehyde may be used as a binder (JP-A-62-40948, JP-A-63-40636), or potassium-alkaline bisphenol-phenol copolymer It is also known to use a type resole resin as a binder (Japanese Patent Application Laid-Open No. H5-123818).
【0004】また、最近ではガス硬化の鋳型造型法とし
て二酸化炭素を用いるプロセスが提案されている(特公
平1-224263号公報)。これは、有機エステルのガスに比
べ人体への悪影響が少ない二酸化炭素のガスを使用する
ため、安全衛生上の観点から特に注目されている。[0004] Recently, a process using carbon dioxide has been proposed as a molding method for gas curing (Japanese Patent Publication No. 1-224263). This is particularly noted from the viewpoint of health and safety because it uses carbon dioxide gas, which has less adverse effect on the human body than organic ester gas.
【0005】これらの粘結剤を用いた鋳型造型法は粘結
剤中に硫黄原子を含まないため酸硬化性樹脂を用いた鋳
型造型法に比較して浸硫の傾向が小さい等の長所を有す
る反面、酸硬化性鋳型造型法に比較して、鋳型強度が低
い、可使時間が短い、砂再生性が劣るなどの欠点を有し
ており、更にその改良が望まれている。[0005] The mold making method using these binders has advantages such as a lower tendency of sulfuration as compared with the mold making method using an acid-curable resin because no sulfur atom is contained in the binder. On the other hand, it has disadvantages such as low mold strength, short pot life, and poor sand recyclability as compared with the acid-curable mold molding method, and further improvement is desired.
【0006】特開平5-50177 号公報には、水溶性フェノ
ール樹脂及び芳香族アルデヒドを必須成分とする鋳物用
砂型の製造方法が、特開平4-118146号公報には、水溶性
フェノール樹脂及びリン酸トリエステル類を必須成分と
する鋳物用砂型の製造方法が、特開平4-118147号公報に
は、水溶性フェノール樹脂及びケトン化合物を必須成分
とする鋳物用砂型の製造方法が開示されているが、得ら
れる鋳型の強度が低いという問題点があった。JP-A-5-50177 discloses a method for producing a sand mold for castings containing a water-soluble phenolic resin and an aromatic aldehyde as essential components. JP-A-4-118146 discloses a water-soluble phenolic resin and phosphorus aldehyde. A method for producing a sand mold for castings containing an acid triester as an essential component is disclosed in JP-A-4-118147, which discloses a method for producing a sand mold for castings containing a water-soluble phenol resin and a ketone compound as essential components. However, there was a problem that the strength of the obtained mold was low.
【0007】[0007]
【課題を解決するための手段】本発明者らは前記問題点
を解決すべく鋭意研究の結果、フェノール・アルデヒド
変性樹脂を粘結剤とし、これを有機エステル及び/又は
炭酸ガスで硬化せしめる鋳型用粘結剤組成物において、
フェノール・アルデヒド変性樹脂に特定の芳香族アルデ
ヒド類、リン酸トリエステル類及びケトン化合物類の中
から選ばれる1種以上を使用することにより、鋳型強度
を大幅に向上させることを見出し、本発明を完成するに
到ったものである。Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, have found that a phenol / aldehyde-modified resin is used as a binder and this is cured with an organic ester and / or carbon dioxide gas. In the binder composition for,
The present inventors have found that the use of one or more selected from a specific aromatic aldehyde, a phosphoric acid triester and a ketone compound in a phenol-aldehyde-modified resin greatly improves the strength of a mold, and the present invention It has been completed.
【0008】即ち、本発明は、フェノール・アルデヒド
変性樹脂と芳香族アルデヒド類、リン酸トリエステル類
及び1分子中に1個以上のカルボニル基を有するケトン
化合物類の中から選ばれる1種以上とを必須成分とする
ことを特徴とする鋳型用粘結剤組成物に関するものであ
る。That is, the present invention relates to a phenol-aldehyde-modified resin and one or more aromatic aldehydes, phosphoric acid triesters and ketone compounds having one or more carbonyl groups in one molecule. As an essential component.
【0009】また、本発明は、耐火性骨材 100重量部に
対して、前記の鋳型用粘結剤組成物0.1〜15重量部から
なる混合物を混練して得られることを特徴とする鋳型組
成物に関する。The present invention also provides a mold composition obtained by kneading a mixture comprising 0.1 to 15 parts by weight of the binder composition for a mold with 100 parts by weight of a refractory aggregate. About things.
【0010】更に、本発明は、前記の鋳型用粘結剤組成
物を用い、かつ硬化剤として有機エステル及び/又は炭
酸ガスを用いることを特徴とする鋳型の製造方法に関す
る。Further, the present invention relates to a method for producing a mold, comprising using the binder composition for a mold and using an organic ester and / or carbon dioxide as a curing agent.
【0011】本発明において用いられる芳香族アルデヒ
ド類としては、テレフタルアルデヒド、サリチル酸アル
デヒド、シンナムアルデヒド、ベンズアルデヒド等が挙
げられる。The aromatic aldehydes used in the present invention include terephthalaldehyde, salicylic aldehyde, cinnamaldehyde, benzaldehyde and the like.
【0012】本発明において用いられるリン酸トリエス
テル類として、具体的には次の様なものが挙げられる。The following are specific examples of the phosphoric triesters used in the present invention.
【0013】リン酸トリメチルエステル、リン酸トリエ
チルエステル、リン酸トリブチルエステル、リン酸トリ
ブトキシエチルエステル、リン酸トリフェニルエステ
ル、リン酸トリスイソプロピルフェニルエステル、リン
酸トリクレジル、リン酸トリ2−エチルヘキシル等であ
る。[0013] Trimethyl phosphate, triethyl phosphate, tributyl phosphate, tributoxyethyl phosphate, triphenyl phosphate, trisisopropylphenyl phosphate, tricresyl phosphate, tri-2-ethylhexyl phosphate, etc. is there.
【0014】本発明において用いられるケトン化合物類
としては、分子量が60〜250 であるものが好ましく、具
体的には次の様なものが挙げられる。The ketone compounds used in the present invention preferably have a molecular weight of 60 to 250, and specific examples thereof include the following.
【0015】メチルエチルケトン、メチルプロピルケト
ン、イソプロピルメチルケトン、ブチルメチルケトン、
イソブチルメチルケトン、ピナコロン、ジエチルケト
ン、ジプロピルケトン、ジイソプロピルケトン、メシチ
ルオキシド、メチルヘプテノン、シクロブタノン、シク
ロペンタノン、シクロヘキサノン、メチルシクロヘキサ
ノン、ホロン、イソホロン、アセトフェノン、プロピオ
フェノン、ブチロフェノン、バレロフェノン、ベンゾフ
ェノン、ジベンジルケトン、2−アセトナフトン、2−
アセトフロン、ジアセチル、アセチルベンゾイル、ベン
ジル、アセチルアセトン、ベンゾイルアセトン、ジベン
ゾイルメタン、アセトニルアセトン、フェナシルアセト
ン、 2,6−ペプタンジオン等である。Methyl ethyl ketone, methyl propyl ketone, isopropyl methyl ketone, butyl methyl ketone,
Isobutyl methyl ketone, pinacolone, diethyl ketone, dipropyl ketone, diisopropyl ketone, mesityl oxide, methyl heptenone, cyclobutanone, cyclopentanone, cyclohexanone, methylcyclohexanone, holone, isophorone, acetophenone, propiophenone, butyrophenone, valerophenone, benzophenone, dibenzophenone Benzyl ketone, 2-acetonaphthone, 2-
Examples include acetofuron, diacetyl, acetylbenzoyl, benzyl, acetylacetone, benzoylacetone, dibenzoylmethane, acetonylacetone, phenacylacetone, and 2,6-peptanedione.
【0016】本発明の粘結剤組成物を用いることによ
り、鋳型強度を大幅に改善し得る理由は次の如く推定さ
れる。即ち、上記の如き化合物を存在させることによ
り、耐火性粒状材料とフェノール・アルデヒド変性樹脂
との表面水素結合を誘起して、界面接着性の改善等の表
面特性を化学的に向上せしめたこと、また硬化鋳型の組
成物界面、即ち固体−液体、液体−液体界面への浸透性
及び拡散性と耐火性粒子に対する凝集力等の特性とを物
理的に改善、改質し、向上せしめたことによると考えら
れる。The reason why the mold strength can be greatly improved by using the binder composition of the present invention is presumed as follows. That is, the presence of the compound as described above induces surface hydrogen bonding between the refractory granular material and the phenol-aldehyde-modified resin, thereby chemically improving surface properties such as improvement in interfacial adhesion. In addition, by physically improving, modifying, and improving the properties of the cured mold at the composition interface, i.e., the solid-liquid, liquid-liquid interface, and the cohesive force with respect to the refractory particles and the diffusivity and diffusivity. it is conceivable that.
【0017】本発明の鋳型用粘結剤組成物を製造するに
は、フェノール・アルデヒド変性樹脂に対し、本発明に
係る上記の化合物をフェノール・アルデヒド変性樹脂の
固形分に対し通常 0.1〜50重量%、好ましくは1〜40重
量%使用する。該化合物が 0.1重量%未満では鋳型強度
向上効果が殆どなく、逆に50重量%を超えると鋳型強度
が低下する。To produce the binder composition for a mold of the present invention, the above-mentioned compound according to the present invention is usually used in an amount of 0.1 to 50% by weight based on the solid content of the phenol-aldehyde-modified resin with respect to the phenol-aldehyde-modified resin. %, Preferably 1 to 40% by weight. If the amount of the compound is less than 0.1% by weight, there is almost no effect of improving the strength of the mold, while if it exceeds 50% by weight, the strength of the mold decreases.
【0018】フェノール・アルデヒド変性樹脂と上記の
如き化合物とを併用する形態としては、フェノール・ア
ルデヒド変性樹脂又は水溶液中に含有させてもよいし、
硬化剤として有機エステルを使用する場合有機エステル
中に混合せしめてもよいし、或いはそれらと別途に耐火
性粒状材料に添加してもよい。またこの際、周知の溶媒
に希釈して混練性を高めて添加することもできる。The form in which the phenol-aldehyde-modified resin and the compound as described above are used in combination may be contained in the phenol-aldehyde-modified resin or an aqueous solution,
When an organic ester is used as a curing agent, it may be mixed in the organic ester, or may be separately added to the refractory granular material. At this time, it may be added by diluting it with a known solvent to improve the kneading property.
【0019】本発明の鋳型用粘結剤組成物を用いて鋳型
を自硬性鋳型造型法によって製造するには、耐火性粒状
材料 100重量部に、本発明の鋳型用粘結剤組成物をアル
カリ水溶液の形態で固形分として 0.1〜15重量部、好ま
しくは 0.3〜5重量部及び硬化剤である有機エステル0.
05〜9重量部、好ましくは 0.1〜5重量部を周知の方法
で混練し、従来の自硬性鋳型製造プロセスをそのまま利
用して鋳型を製造することができる。In order to produce a mold by the self-hardening molding method using the binder composition for a mold of the present invention, the binder composition for a mold of the present invention is added to 100 parts by weight of the refractory granular material. 0.1 to 15 parts by weight, preferably 0.3 to 5 parts by weight, as a solid content in the form of an aqueous solution, and an organic ester as a curing agent 0.1.
05 to 9 parts by weight, preferably 0.1 to 5 parts by weight, can be kneaded by a well-known method, and a mold can be manufactured by using a conventional self-hardening mold manufacturing process as it is.
【0020】また、本発明において、鋳型をガス硬化性
鋳型造型法によって製造するには、まず耐火性粒状材料
100重量部に、本発明の鋳型用粘結剤組成物をアルカリ
水溶液の形態で固形分として 0.1〜15重量部、好ましく
は 0.3〜5重量部を加えた混練砂を手込め、もしくは加
圧空気でのブローイングにより模型中に充填し、次いで
ガス状もしくはエロゾル状の有機エステル0.05〜9重量
部を吹き込んでフェノール・アルデヒド変性樹脂混合物
を硬化させることにより、鋳型を製造する。In the present invention, in order to produce a mold by a gas-curable mold molding method, first, a refractory granular material is used.
100 parts by weight of kneading sand obtained by adding 0.1 to 15 parts by weight, preferably 0.3 to 5 parts by weight of the binder composition for a mold of the present invention as a solid content in the form of an aqueous alkaline solution, or pressurized air The mold is manufactured by blowing into a model by blowing in the above and then blowing in 0.05 to 9 parts by weight of a gaseous or aerosol organic ester to cure the phenol-aldehyde-modified resin mixture.
【0021】更に、本発明の鋳型用粘結剤組成物に、シ
ランカップリング剤を併用する場合、シランカップリン
グ剤は本発明の鋳型用粘結剤組成物 100重量部に対して
0.001 〜1重量部、好ましくは 0.002〜0.5 重量部を添
加し、上記と同様のプロセスによって鋳型を造型するこ
とができる。Further, when a silane coupling agent is used in combination with the binder composition for a mold of the present invention, the silane coupling agent is added to 100 parts by weight of the binder composition for a mold of the present invention.
0.001 to 1 part by weight, preferably 0.002 to 0.5 part by weight is added, and a mold can be formed by the same process as described above.
【0022】本発明に用いられる上記化合物類は粉末状
で鋳物用砂又はその再生砂に添加してもよいが、予め上
記化合物類の溶剤溶液又はこれらのスラリー分散液を調
製して添加してもよい。The above compounds used in the present invention may be added in powder form to foundry sand or its reclaimed sand. However, a solvent solution of the above compounds or a slurry dispersion of these is prepared and added in advance. Is also good.
【0023】本発明に用いられる硬化剤である有機エス
テルとしてはラクトン類或は炭素数1〜10の一価又は多
価アルコールと炭素数1〜10の有機カルボン酸より誘導
される有機エステルの単独若しくは混合物が用いられる
が、自硬性鋳型造型法ではγ−ブチロラクトン、プロピ
オンラクトン、ε−カプロラクトン、ギ酸エチル、エチ
レングリコールジアセテート、エチレングリコールモノ
アセテート、トリアセチン等を用いるのが好ましく、ガ
ス硬化性鋳型造型法ではギ酸メチルを用いるのが好まし
い。更に、ガス状等の有機エステルに代えて、炭酸ガス
を使用して鋳型用粘結剤組成物を硬化させる場合には、
粘結剤組成物中に適正量の硼酸、硼酸塩、アルミン酸塩
等のオキシアニオンを有する化合物を添加し、このオキ
シアニオンを有する化合物と炭酸ガスの共働作用によっ
て、フェノール・アルデヒド変性樹脂を硬化させること
ができる (特開平1-224263号公報) 。本発明の鋳型用粘
結剤組成物については自硬性鋳型造型法でもガス硬化性
鋳型造型法でも、特に制限されるものではない。As the organic ester as a curing agent used in the present invention, a lactone or an organic ester derived from a monohydric or polyhydric alcohol having 1 to 10 carbon atoms and an organic carboxylic acid having 1 to 10 carbon atoms can be used alone. Or a mixture is used, but in the self-hardening mold molding method, it is preferable to use γ-butyrolactone, propionlactone, ε-caprolactone, ethyl formate, ethylene glycol diacetate, ethylene glycol monoacetate, triacetin, etc. In the method, it is preferable to use methyl formate. Furthermore, in the case of curing the binder composition for a mold using carbon dioxide gas instead of an organic ester in a gaseous state,
An appropriate amount of a compound having an oxyanion, such as boric acid, borate, or aluminate, is added to the binder composition, and the compound having the oxyanion and carbon dioxide gas cooperate to form a phenol / aldehyde-modified resin. It can be cured (JP-A-1-224263). The binder composition for a mold of the present invention is not particularly limited, regardless of whether it is a self-hardening mold molding method or a gas-curable mold molding method.
【0024】本発明で用いられるフェノール・アルデヒ
ド変性樹脂は、下記の一般式(1) で表されるビスフェノ
ール類から選ばれる1種以上の化合物と、アルデヒド化
合物と、アルコール類とを共縮合して得られるもの、も
しくは、フェノール類から選ばれる1種以上の化合物及
び上記の一般式(1) で表されるビスフェノール類から選
ばれる1種以上の化合物と、アルデヒド化合物と、アル
コール類とを共縮合して得られるものである。The phenol-aldehyde modified resin used in the present invention is obtained by co-condensing at least one compound selected from bisphenols represented by the following general formula (1), an aldehyde compound and an alcohol. those obtained or, with one or more compounds selected from bisphenols represented by one or more compounds selected from the phenols and the general formula (1), an aldehyde compound, Al
A call such is obtained by co-condensing.
【0025】[0025]
【化3】 Embedded image
【0026】一般式(1) で表されるビスフェノール類の
具体例としては、ビスフェノールA、ビスフェノール
F、ビスフェノールC、ビスフェノールE、ビスフェノ
ールZ、ビスフェノールS、ビスフェノールAF、ビス
フェノールAP、ジ− sec−ブチル−ビスフェノール
A、ジ−イソプロピル−ビスフェノールA、 1,1−エチ
リデン−ビスフェノール、メチル−エチル−メチレン−
ビスフェノールA、メチルイソブチル−メチレン−ビス
フェノール、メチル−ヘキシル−メチレン−ビスフェノ
ール、メチル−フェニル−メチレン−ビスフェノール、
4,4'−チオジフェノール等が挙げられ、それらが単独で
又は混合して使用される。Specific examples of the bisphenols represented by the general formula (1) include bisphenol A, bisphenol F, bisphenol C, bisphenol E, bisphenol Z, bisphenol S, bisphenol AF, bisphenol AP, di-sec-butyl- Bisphenol A, di-isopropyl-bisphenol A, 1,1-ethylidene-bisphenol, methyl-ethyl-methylene-
Bisphenol A, methyl isobutyl-methylene-bisphenol, methyl-hexyl-methylene-bisphenol, methyl-phenyl-methylene-bisphenol,
4,4'-thiodiphenol and the like are used alone or as a mixture.
【0027】フェノール類としては、下記の一般式 (2)
〜(4) で表される化合物の中から選ばれる1種以上が使
用される。The phenols are represented by the following general formula (2)
One or more compounds selected from the compounds represented by (4) to (4) are used.
【0028】[0028]
【化4】 Embedded image
【0029】(式中、R5及びR6は、水素原子又は炭素数
2以下の炭化水素基を表わす。)(In the formula, R 5 and R 6 represent a hydrogen atom or a hydrocarbon group having 2 or less carbon atoms.)
【0030】[0030]
【化5】 Embedded image
【0031】(式中、R7は、水素原子、水酸基又は炭素
数2以下の炭化水素基を表わす。)(In the formula, R 7 represents a hydrogen atom, a hydroxyl group or a hydrocarbon group having 2 or less carbon atoms.)
【0032】[0032]
【化6】 Embedded image
【0033】(式中、R8は、炭素数3以上の脂肪族炭化
水素基又は芳香族炭化水素基を表わす。) 。(Wherein, R 8 represents an aliphatic or aromatic hydrocarbon group having 3 or more carbon atoms).
【0034】フェノール類のうち、一般式(2) で表され
る化合物の具体例としては、フェノール、クレゾール、
3,5−キシレノール等が挙げられる。一般式(3) で表さ
れる化合物は多価フェノールであって、具体例として
は、レゾルシノールやカテコール等が挙げられる。ま
た、一般式(4) で表される化合物は、主としてパラ位に
炭素数3以上のアルキル基やフェニル基が結合したもの
であり、具体例としては、ノニルフェノール、p−tert
−ブチルフェノール、イソプロペニルフェノール、フェ
ニルフェノール等が挙げられる。また、カシューナッツ
殻液のような各種のフェノール類の混合物等も使用でき
る。特に、フェノール類としては、フェノールとクレゾ
ールの混合物が好ましい。Among the phenols, specific examples of the compound represented by the general formula (2) include phenol, cresol,
3,5-xylenol and the like. The compound represented by the general formula (3) is a polyhydric phenol, and specific examples include resorcinol and catechol. The compound represented by the general formula (4) is mainly a compound in which an alkyl group having 3 or more carbon atoms or a phenyl group is bonded to the para position, and specific examples thereof include nonylphenol and p-tert.
-Butylphenol, isopropenylphenol, phenylphenol and the like. Also, a mixture of various phenols such as cashew nut shell liquid can be used. Particularly, as the phenols, a mixture of phenol and cresol is preferable.
【0035】また、アルデヒド化合物としては、ホルム
アルデヒド、パラホルムアルデヒド、フルフラール、グ
リオキザール等が、単独で又は混合して使用される。As the aldehyde compound, formaldehyde, paraformaldehyde, furfural, glyoxal and the like are used alone or in combination.
【0036】ビスフェノール類、もしくはフェノール類
及びビスフェノール類と、アルデヒド化合物とを共縮合
する際、各化合物のモル比は、以下の通りであるのが好
ましい。即ち、ビスフェノール類のモル数、もしくはフ
ェノール類のモル数とビスフェノール類のモル数との合
計モル数に対する、アルデヒド化合物のモル数の比が1.
0〜5.0 〔 (ビスフェノール類のモル数、もしくはフェ
ノール類のモル数+ビスフェノール類のモル数) :アル
デヒド化合物のモル数=1: 1.0〜5.0 〕であるのが好
ましい。特に、アルデヒド化合物のモル数の比が 1.5〜
3.0 であるのが、より好ましい。アルデヒド化合物のモ
ル数の比が 1.0未満になると、得られたフェノール・ア
ルデヒド変性樹脂を使用して造型しても、鋳型の強度が
充分に向上しない傾向が生じる。逆に、アルデヒド化合
物のモル数の比が 5.0を超えると、得られたフェノール
・アルデヒド変性樹脂のアルデヒド臭が強く、作業環境
が悪くなる恐れがある。また、フェノール類とビスフェ
ノール類を併用する場合、フェノール類のモル数に対す
る、ビスフェノール類のモル数の比は、 0.001〜1000程
度 (フェノール類のモル数:ビスフェノール類のモル数
=1:0.001 〜1000) が好ましい。特に、ビスフェノー
ル類のモル数の比が0.01〜90であるのがより好ましい。
ビスフェノール類のモル数が 0.001未満であったり、或
いは1000を超えると、得られる鋳型の強度が充分に向上
しない傾向が生じる。When co-condensing bisphenols, or phenols and bisphenols, and aldehyde compounds, the molar ratio of each compound is preferably as follows. That is, the ratio of the number of moles of the aldehyde compound to the number of moles of the bisphenols or the total number of moles of the phenols and the number of moles of the bisphenols is 1.
0 to 5.0 [(mol number of bisphenols or mol number of phenols + mol number of bisphenols): mol number of aldehyde compound = 1: 1.0 to 5.0]. In particular, the molar ratio of the aldehyde compound is 1.5 to
3.0 is more preferred. When the ratio of the number of moles of the aldehyde compound is less than 1.0, there is a tendency that the strength of the mold is not sufficiently improved even when molding is performed using the obtained phenol / aldehyde-modified resin. Conversely, if the ratio of the number of moles of the aldehyde compound exceeds 5.0, the obtained phenol / aldehyde-modified resin has a strong odor of aldehyde, which may deteriorate the working environment. When phenols and bisphenols are used together, the ratio of the number of moles of bisphenols to the number of moles of phenols is about 0.001 to 1000 (the number of moles of phenols: the number of moles of bisphenols = 1: 0.001 to 1000 ) Is preferred. In particular, the ratio of the number of moles of bisphenols is more preferably 0.01 to 90.
When the number of moles of the bisphenol is less than 0.001 or more than 1,000, the strength of the obtained mold tends not to be sufficiently improved.
【0037】ビスフェノール類、もしくはフェノール類
及びビスフェノール類と、アルデヒド化合物との共縮重
合は、一般的に水溶液中で行われ、フェノール・アルデ
ヒド変性樹脂が得られる。例えば、所定量のビスフェノ
ール類もしくはフェノール類及びビスフェノール類を溶
解させた水溶液中に、所定量のアルデヒド化合物を徐々
に添加しながら、共縮重合させて得るのが好ましい。こ
の際、反応触媒としては、水酸化カリウム(KOH) 、水酸
化ナトリウム(NaOH)、水酸化リチウム(LiOH)等のアルカ
リ触媒が使用されるが、特に、水酸化カリウムを使用す
るのが好ましい。本発明におけるフェノール・アルデヒ
ド変性樹脂は、アルカリ性水溶液に調整されるため、共
縮重合の際に所定量の水酸化カリウムを使用しても良い
し、また反応触媒として最小限の水酸化カリウムを使用
し、共縮重合を終えた後、所定量の水酸化カリウムを添
加してもよい。また、共縮重合を終えた後において、水
酸化カリウムと共に水酸化ナトリウムや水酸化リチウム
を併用して、所定のアルカリ性になるようにしてもよ
い。更に、酸触媒を使用して共縮重合させた後、次いで
水酸化カリウム等のアルカリ触媒を使用して共縮重合を
進行させてもよい。フェノール・アルデヒド変性樹脂の
アルカリ水溶液において、ビスフェノール類の水酸基の
モル数、もしくはフェノール類の水酸基のモル数とビス
フェノール類の水酸基のモル数との合計モル数に対す
る、全アルカリのモル数の比は、 0.2〜1.2 であるのが
好ましい。また、アルカリ水溶液中における、フェノー
ル・アルデヒド変性樹脂の濃度は、30〜75重量%である
のが好ましい。Copolycondensation polymerization of bisphenols or phenols and bisphenols with an aldehyde compound is generally carried out in an aqueous solution to obtain a phenol-aldehyde-modified resin. For example, it is preferable to obtain by co-condensation polymerization while gradually adding a predetermined amount of an aldehyde compound to an aqueous solution in which a predetermined amount of a bisphenol or a phenol and a bisphenol are dissolved. At this time, as a reaction catalyst, an alkali catalyst such as potassium hydroxide (KOH), sodium hydroxide (NaOH), and lithium hydroxide (LiOH) is used, but potassium hydroxide is particularly preferable. Since the phenol-aldehyde-modified resin in the present invention is adjusted to an alkaline aqueous solution, a predetermined amount of potassium hydroxide may be used at the time of copolycondensation, or a minimum amount of potassium hydroxide is used as a reaction catalyst. After completion of the copolycondensation, a predetermined amount of potassium hydroxide may be added. After the completion of the copolycondensation, sodium hydroxide or lithium hydroxide may be used in combination with potassium hydroxide so as to attain a predetermined alkalinity. Further, after co-condensation polymerization using an acid catalyst, co-condensation polymerization may be subsequently advanced using an alkali catalyst such as potassium hydroxide. In the aqueous alkali solution of the phenol-aldehyde-modified resin, the ratio of the number of moles of the total alkali to the total number of moles of the hydroxyl group of the bisphenol or the number of moles of the hydroxyl group of the phenol and the number of moles of the hydroxyl group of the bisphenol is It is preferably from 0.2 to 1.2. Further, the concentration of the phenol / aldehyde-modified resin in the aqueous alkali solution is preferably 30 to 75% by weight.
【0038】また、フェノール・アルデヒド変性樹脂
は、更にアルコール類を共縮合することにより、耐火性
粒状材料と混練した場合における、混練砂の流動性及び
模型への充填性に優れるものとなる。アルコール類とし
ては、炭素数2〜10の1価アルコールが好ましく、例え
ば、エチルアルコール、プロピルアルコール、イソプロ
ピルアルコール、ブチルアルコール、イソブチルアルコ
ール、 sec−ブチルアルコール、tert−ブチルアルコー
ル、n−アミルアルコール、イソアミルアルコール、ヘ
キシルアルコール、ヘプチルアルコール、オクチルアル
コール、カプリルアルコール、ノニルアルコール、デシ
ルアルコール等が挙げられる。特に、1価アルコールと
して、プロピルアルコール、イソプロピルアルコール、
ブチルアルコール、イソブチルアルコール、 sec−ブチ
ルアルコール又はtert−ブチルアルコールを使用するの
が最も好ましい。配合割合としては、ビスフェノール類
のモル数、もしくはフェノール類のモル数とビスフェノ
ール類のモル数との合計モル数に対して0.0001〜0.5 倍
モルが好ましい。特に、アルコール類が0.01〜0.2 倍モ
ルであるのがより好ましい。アルコール類のモル数が0.
0001倍モル未満になると、アルコール類を添加する効果
がなく、逆に、 0.5倍モルを超えると鋳型の強度が充分
に向上しない傾向が生じる。The phenol / aldehyde-modified resin is further co-condensed with an alcohol, so that when kneaded with the refractory granular material, the kneaded sand is excellent in fluidity and filling property in a model. As the alcohols, monohydric alcohols having 2 to 10 carbon atoms are preferable. For example, ethyl alcohol, propyl alcohol, isopropyl alcohol, butyl alcohol, isobutyl alcohol, sec-butyl alcohol, tert-butyl alcohol, n-amyl alcohol, isoamyl Alcohol, hexyl alcohol, heptyl alcohol, octyl alcohol, caprylic alcohol, nonyl alcohol, decyl alcohol and the like can be mentioned. In particular, as monohydric alcohols, propyl alcohol, isopropyl alcohol,
Most preferably, butyl alcohol, isobutyl alcohol, sec-butyl alcohol or tert-butyl alcohol is used. The mixing ratio is preferably 0.0001 to 0.5 times the mole number of the bisphenols or the total number of moles of the phenols and the bisphenols. In particular, it is more preferable that the amount of the alcohol is 0.01 to 0.2 times mol. The number of moles of alcohols is 0.
If the molar ratio is less than 0001 times, there is no effect of adding alcohols. Conversely, if it exceeds 0.5 times, the strength of the mold tends not to be sufficiently improved.
【0039】耐火性粒状材料としては石英質を主成分と
する珪砂の他、クロマイト砂、ジルコン砂、オリビン
砂、アルミナサンド等の無機耐火性粒状材料が使用され
るが、特に限定されるものではない。また、更に鋳型強
度を向上させる目的でシランカップリング剤を加えても
差し支えない。好ましいシランカップリング剤として
は、γ−アミノプロピルトリエトキシシランやγ−(2
−アミノエチル)アミノプロピルトリメトキシシラン等
が挙げられる。As the refractory granular material, inorganic refractory granular materials such as chromite sand, zircon sand, olivine sand, and alumina sand are used in addition to silica sand containing quartz as a main component, but are not particularly limited. Absent. Further, a silane coupling agent may be added for the purpose of further improving the mold strength. Preferred silane coupling agents include γ-aminopropyltriethoxysilane and γ- (2
-Aminoethyl) aminopropyltrimethoxysilane and the like.
【0040】[0040]
【実施例】以下、実施例をもって本発明を詳細に説明す
るが、本発明はこれらの実施例のみに限定されるもので
はない。 〔鋳型用粘結剤組成物水溶液1の調整〕50%水酸化カリ
ウム水溶液に、表1に示したモル比で定められる量のフ
ェノール類とビスフェノール類とアルコール類とを加
え、攪拌し溶解させた。この溶液を80℃に保持しなが
ら、表1に示したモル比で定められる量のアルデヒド化
合物を徐々に加えた。そして、反応溶液中におけるフェ
ノール・アルデヒド変性樹脂の重量平均分子量が2500に
達する時点まで80℃で反応を続けた。重量平均分子量が
2500に達する時点の判定は、反応溶液の粘度を測定する
ことによって行った。反応終了後、室温まで冷却した
後、フェノール類の水酸基のモル数とビスフェノール類
の水酸基のモル数の合計モル数に対する、水酸化カリウ
ムのモル数の比が0.85となるように、50%水酸化カリウ
ム水溶液を加えた。以上のようにして、フェノール・ア
ルデヒド変性樹脂のアルカリ水溶液を得た。そして、表
1に示した各種の化合物をフェノール・アルデヒド変性
樹脂 100重量部に対して、10重量部水溶液中に添加し
た。以上のようにして、鋳型用粘結剤組成物水溶液1を
調整した。なお、粘結剤組成物水溶液中の粘結剤組成物
(フェノール・アルデヒド変性樹脂、各種の化合物) の
含有量は50重量%であった。フェノール・アルデヒド変
性樹脂水溶液の固形分量は、空気循環式炉内で秤量した
試料(2.0±0.1g) を3時間 100℃に加熱することによっ
て測定した。EXAMPLES The present invention will be described below in detail with reference to examples, but the present invention is not limited to these examples. [Preparation of aqueous solution of binder composition 1 for mold] To a 50% aqueous solution of potassium hydroxide, phenols, bisphenols, and alcohols in amounts specified by the molar ratio shown in Table 1 were added, and the mixture was stirred and dissolved. . While maintaining this solution at 80 ° C., an amount of the aldehyde compound determined by the molar ratio shown in Table 1 was gradually added. Then, the reaction was continued at 80 ° C. until the weight average molecular weight of the phenol-aldehyde-modified resin in the reaction solution reached 2500. Weight average molecular weight
The determination when the temperature reached 2500 was made by measuring the viscosity of the reaction solution. After the reaction is completed, the reaction mixture is cooled to room temperature, and then subjected to 50% hydroxylation so that the ratio of the number of moles of potassium hydroxide to the total number of moles of hydroxyl groups of phenols and the number of moles of hydroxyl groups of bisphenols becomes 0.85. An aqueous potassium solution was added. As described above, an alkaline aqueous solution of the phenol / aldehyde-modified resin was obtained. Then, various compounds shown in Table 1 were added to an aqueous solution of 10 parts by weight based on 100 parts by weight of the phenol-aldehyde-modified resin. As described above, the aqueous binder composition aqueous solution 1 for a mold was prepared. The binder composition in the binder composition aqueous solution
(Phenol-aldehyde-modified resin, various compounds) content was 50% by weight. The solid content of the phenol / aldehyde-modified resin aqueous solution was measured by heating a sample (2.0 ± 0.1 g) weighed in an air circulation furnace to 100 ° C. for 3 hours.
【0041】なお、表1中のAなる項目は、フェノール
類のモル数、ビスフェノール類のモル数、もしくはフェ
ノール類のモル数とビスフェノール類のモル数との合計
モル数に対する、アルデヒド化合物のモル数の比であ
る。即ち、〔アルデヒド化合物のモル数/ (フェノール
類のモル数+ビスフェノール類のモル数) 〕である。ま
た、Bなる項目は、フェノール類とビスフェノール類を
併用した場合、フェノール類のモル数に対する、ビスフ
ェノール類のモル数の比である。即ち、〔ビスフェノー
ル類のモル数/フェノール類のモル数〕である。さら
に、Cなる項目は、フェノール類のモル数、ビスフェノ
ール類のモル数、もしくはフェノール類のモル数とビス
フェノール類のモル数との合計のモル数に対する、アル
コール類のモル数の比である。即ち、〔アルコール類の
モル数/(フェノール類のモル数+ビスフェノール類の
モル数)〕である。以下、表中のA〜Cは、これと同様
である。The item A in Table 1 indicates the number of moles of the aldehyde compound relative to the number of moles of the phenol, the number of moles of the bisphenol, or the total number of moles of the phenol and the bisphenol. Is the ratio of That is, [mol number of aldehyde compound / (mol number of phenols + mol number of bisphenols)]. Item B is the ratio of the number of moles of bisphenol to the number of moles of phenol when phenols and bisphenols are used in combination. That is, [mol number of bisphenol / mol number of phenol]. Further, item C is the ratio of the number of moles of alcohol to the number of moles of phenols, the number of moles of bisphenols, or the total number of moles of phenols and bisphenols. That is, [mol number of alcohols / (mol number of phenols + mol number of bisphenols)]. Hereinafter, A to C in the table are the same as above.
【0042】〔鋳型用粘結剤組成物水溶液2の調整〕反
応溶液中におけるフェノール・アルデヒド変性樹脂の重
量平均分子量が1800に達する時点まで反応を続けた以外
は、鋳型用粘結剤組成物水溶液1と同一の方法で、鋳型
用粘結剤組成物水溶液2を調整した。表2に反応モル比
及び添加した化合物の種類・量を示す。[Preparation of aqueous solution of binder composition for template 2] The aqueous solution of binder composition for template was prepared except that the reaction was continued until the weight average molecular weight of the phenol-aldehyde-modified resin in the reaction solution reached 1800. In the same manner as in 1, an aqueous solution 2 of the binder composition for a mold was prepared. Table 2 shows the reaction molar ratio and the type and amount of the added compound.
【0043】〔鋳型用粘結剤組成物水溶液3の調整〕鋳
型用粘結剤組成物水溶液2の調整の際に、反応終了後に
得られたフェノール・アルデヒド変成樹脂の水溶液90重
量部と、四硼酸ナトリウム・10水和物5重量部と、95%
水酸化カリウム5重量部とを混合して、鋳型用粘結剤組
成物水溶液3を調整した。表3に反応モル比及び添加し
た化合物の種類・量を示す。[Preparation of aqueous solution of binder composition for mold 3] In the preparation of aqueous solution of binder composition for mold 2, 90 parts by weight of an aqueous solution of a phenol-aldehyde-modified resin obtained after completion of the reaction was added. 5 parts by weight of sodium borate decahydrate, 95%
5 parts by weight of potassium hydroxide were mixed to prepare a binder composition aqueous solution 3 for a mold. Table 3 shows the reaction molar ratio and the type and amount of the compound added.
【0044】実施例1〜6、比較例1〜4 自硬性鋳型造型法における鋳型強度を評価した。即ち、
珪砂 100重量部に対して、トリアセチンを 0.3重量部、
鋳型用粘結剤組成物水溶液1を 1.5重量部添加混練して
なる混合物を、50mmφ×50mmhのテストピース用模型に
充填し、混練から24時間後の圧縮強度を測定した。ま
た、同時に混練砂の流動性・充填性を測定した。即ち、
内径50mm、内部有効長 100mmの試験筒の底部に受台を取
り付け、3mm 目の篩を通して、試験筒に混練砂を粗充填
する。次に、上部の余分な混練砂をかき落として、「ジ
ョージ・フィシャー社製のコンパクタビリティ・テスタ
ー」にかけ、10kg/cm2のスクイズ圧で加圧した。この後
における混練砂の高さの減少を測定し、この減少高さX
mm〔=C.B.(コンパクタビリティー)〕を混練砂の
流動性・充填性の指標とした。Xが小さい程、混練砂の
流動性及び充填性が良いことを示している。結果を表1
に示す。Examples 1 to 6 and Comparative Examples 1 to 4 The mold strength in the self-hardening mold making method was evaluated. That is,
For 100 parts by weight of silica sand, 0.3 parts by weight of triacetin,
A mixture obtained by adding and kneading 1.5 parts by weight of the aqueous binder composition solution for a mold 1 was filled into a test piece model of 50 mmφ × 50 mmh, and the compressive strength 24 hours after the kneading was measured. At the same time, the fluidity and filling properties of the kneaded sand were measured. That is,
Attach a pedestal to the bottom of a test tube with an inner diameter of 50 mm and an effective inner length of 100 mm, pass through a 3 mm sieve and roughly fill the test tube with kneading sand. Next, the excess kneading sand at the top was scraped off and applied to a “Compactability tester manufactured by George Fisher Co.”, and pressurized with a squeeze pressure of 10 kg / cm 2 . Thereafter, the decrease in height of the kneading sand was measured, and the decrease height X
mm [= C. B. (Compactability)] was used as an index for the fluidity and filling properties of the kneaded sand. The smaller the value of X, the better the fluidity and filling properties of the kneaded sand. Table 1 shows the results
Shown in
【0045】[0045]
【表1】 [Table 1]
【0046】実施例7〜12及び比較例5〜8 ガス硬化性鋳型造型法における鋳型強度を評価した。即
ち、珪砂 100重量部に対し、鋳型用粘結剤組成物水溶液
2を 2.0重量部添加混練してなる混合物を、50mmφ×50
mmhのガス硬化用テストピース用模型に充填した。この
模型中に 1.5重量部のガス状のギ酸メチルを注入し、注
入後から24時間後の圧縮強度を測定した。結果を表2に
示す。Examples 7 to 12 and Comparative Examples 5 to 8 The mold strength in the gas-curable mold making method was evaluated. That is, a mixture formed by adding and kneading 2.0 parts by weight of a binder composition aqueous solution 2 for 100 parts by weight of silica sand to a 50 mmφ × 50
The test piece was filled into a mmh gas-hardening test piece model. 1.5 parts by weight of gaseous methyl formate was injected into the model, and the compressive strength was measured 24 hours after the injection. Table 2 shows the results.
【0047】[0047]
【表2】 [Table 2]
【0048】実施例13〜18及び比較例9〜12 耐火性粒状材料である珪砂 100重量部に対し、鋳型用粘
結剤組成物水溶液3を3.5重量部添加混練した混合物を5
0mmφ×50mmhのガス用テストピース枠に充填し、炭酸
ガスを10リットル/分の流速で2分間通気させ、ガス硬
化性鋳型製造法で鋳型を造型した。この鋳型の24時間経
過後の圧縮強度(kg/cm2)を測定した。その結果を表3に
示す。Examples 13 to 18 and Comparative Examples 9 to 12 A mixture obtained by adding and kneading 3.5 parts by weight of an aqueous solution 3 of a binder composition for a mold was added to 100 parts by weight of silica sand as a refractory granular material.
A test piece frame for gas of 0 mmφ × 50 mmh was filled, carbon dioxide gas was passed at a flow rate of 10 liter / min for 2 minutes, and a mold was formed by a gas-curable mold manufacturing method. After 24 hours, the compression strength (kg / cm 2 ) of the mold was measured. Table 3 shows the results.
【0049】[0049]
【表3】 [Table 3]
【0050】[0050]
【発明の効果】上記の実施例で明白なように、本発明の
製造方法によれば、従来の製造方法によって得られる鋳
型に比べ高強度の鋳型が得られる。その結果、粘結剤の
使用量の低減が可能となるため、鋳物砂の回収が容易と
なり、また、鋳込時の鋳型から発生するガス量を減少し
得るので、ガス欠陥の発生を抑制し健全な鋳物が製造で
き、実用上有益なものとなる。As is apparent from the above embodiments, according to the manufacturing method of the present invention, a mold having a higher strength can be obtained as compared with the mold obtained by the conventional manufacturing method. As a result, it becomes possible to reduce the amount of the binder used, so that the molding sand can be easily collected, and the amount of gas generated from the casting mold at the time of casting can be reduced. A sound casting can be produced, which is practically useful.
フロントページの続き (56)参考文献 特開 昭61−238439(JP,A) 特開 平4−118146(JP,A) 特開 平4−118147(JP,A) 特開 昭63−142016(JP,A) 特開 昭63−177938(JP,A) (58)調査した分野(Int.Cl.7,DB名) B22C 1/00 - 1/26 Continuation of the front page (56) References JP-A-61-238439 (JP, A) JP-A-4-118146 (JP, A) JP-A-4-118147 (JP, A) JP-A-63-142016 (JP) , A) JP-A-63-177938 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) B22C 1/00-1/26
Claims (7)
ール類から選ばれる1種以上の化合物と、アルデヒド化
合物と、アルコール類とを共縮合して得られたフェノー
ル・アルデヒド変性樹脂(A) と、芳香族アルデヒド類、
リン酸トリエステル類及び1分子中に1個以上のカルボ
ニル基を有するケトン化合物類の中から選ばれる1種以
上(B) とを必須成分とすることを特徴とする鋳型用粘結
剤組成物。 【化1】 1. A phenol-aldehyde-modified resin (A) obtained by co-condensing at least one compound selected from bisphenols represented by the following general formula (1), an aldehyde compound and alcohols: ) And aromatic aldehydes,
A binder composition for a mold, comprising, as an essential component, at least one selected from phosphoric acid triesters and ketone compounds having one or more carbonyl groups in one molecule. . Embedded image
合物及び下記の一般式(1) で表されるビスフェノール類
から選ばれる1種以上の化合物と、アルデヒド化合物
と、アルコール類とを共縮合して得られたフェノール・
アルデヒド変性樹脂(a) と、芳香族アルデヒド類、リン
酸トリエステル類及び1分子中に1個以上のカルボニル
基を有するケトン化合物類の中から選ばれる1種以上
(b) とを必須成分とすることを特徴とする鋳型用粘結剤
組成物。 【化2】 2. An aldehyde compound and an alcohol which are co-condensed with at least one compound selected from phenols and at least one compound selected from bisphenols represented by the following general formula (1): Phenol obtained by
Aldehyde-modified resin (a) and at least one selected from aromatic aldehydes, phosphoric acid triesters and ketone compounds having at least one carbonyl group in one molecule
and (b) as an essential component. Embedded image
A又はビスフェノールFを使用する請求項1又は2記載
の鋳型用粘結剤組成物。3. The binder composition for a mold according to claim 1, wherein bisphenol A or bisphenol F is used as the bisphenol.
ールとの混合物を使用する請求項2又は3記載の鋳型用
粘結剤組成物。4. The binder composition for a mold according to claim 2, wherein a mixture of phenol and cresol is used as the phenol.
1〜4の何れか1項に記載の鋳型用粘結剤組成物 0.1〜
15重量部からなる混合物を混練して得られることを特徴
とする鋳型組成物。5. The binder composition for a mold according to any one of claims 1 to 4 , wherein the binder composition is 0.1 to 100 parts by weight of the refractory aggregate.
A mold composition obtained by kneading a mixture consisting of 15 parts by weight.
ステル硬化剤0.05〜9重量部、請求項1〜4の何れか1
項に記載の鋳型用粘結剤組成物 0.1〜15重量部からなる
混合物を混練して得られることを特徴とする鋳型組成
物。6. The organic ester curing agent of 0.05 to 9 parts by weight, based on 100 parts by weight of the refractory aggregate, any one of claims 1 to 4
A mold composition obtained by kneading a mixture consisting of 0.1 to 15 parts by weight of a binder composition for a mold as described in Item.
用粘結剤組成物を用い、かつ硬化剤として有機エステル
及び/又は炭酸ガスを用いることを特徴とする鋳型の製
造方法。7. A method for producing a mold, comprising using the binder composition for a mold according to any one of claims 1 to 4 and using an organic ester and / or carbon dioxide as a curing agent. .
Priority Applications (1)
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JP32463794A JP3221810B2 (en) | 1994-12-27 | 1994-12-27 | Binder composition for mold, mold composition and method for producing mold |
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Application Number | Priority Date | Filing Date | Title |
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JP32463794A JP3221810B2 (en) | 1994-12-27 | 1994-12-27 | Binder composition for mold, mold composition and method for producing mold |
Publications (2)
Publication Number | Publication Date |
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JPH08174137A JPH08174137A (en) | 1996-07-09 |
JP3221810B2 true JP3221810B2 (en) | 2001-10-22 |
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ID=18168058
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JP5205939B2 (en) * | 2007-11-26 | 2013-06-05 | 住友ベークライト株式会社 | Resol type phenolic resin composition and abrasive cloth paper using the same |
JP2020143224A (en) * | 2019-03-07 | 2020-09-10 | 住友ベークライト株式会社 | Phenol resin molding material and molded article |
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1994
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