JP3212440B2 - Thermal transfer recording material and heat-resistant image forming method - Google Patents
Thermal transfer recording material and heat-resistant image forming methodInfo
- Publication number
- JP3212440B2 JP3212440B2 JP07616994A JP7616994A JP3212440B2 JP 3212440 B2 JP3212440 B2 JP 3212440B2 JP 07616994 A JP07616994 A JP 07616994A JP 7616994 A JP7616994 A JP 7616994A JP 3212440 B2 JP3212440 B2 JP 3212440B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- resin
- thermal transfer
- recording material
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims description 58
- 238000000034 method Methods 0.000 title claims description 14
- 229920006015 heat resistant resin Polymers 0.000 claims description 44
- 229920005989 resin Polymers 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 37
- 238000010438 heat treatment Methods 0.000 claims description 34
- 238000002844 melting Methods 0.000 claims description 16
- 230000008018 melting Effects 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 11
- 239000003086 colorant Substances 0.000 claims description 9
- 239000010419 fine particle Substances 0.000 claims description 7
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 6
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 5
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 4
- 239000004695 Polyether sulfone Substances 0.000 claims description 4
- 229920002492 poly(sulfone) Polymers 0.000 claims description 4
- 229920001230 polyarylate Polymers 0.000 claims description 4
- 229920006393 polyether sulfone Polymers 0.000 claims description 4
- 229920002530 polyetherether ketone Polymers 0.000 claims description 4
- 239000004962 Polyamide-imide Substances 0.000 claims description 3
- 239000004697 Polyetherimide Substances 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 238000003763 carbonization Methods 0.000 claims description 3
- 238000000354 decomposition reaction Methods 0.000 claims description 3
- 229920002312 polyamide-imide Polymers 0.000 claims description 3
- 229920001601 polyetherimide Polymers 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 239000001993 wax Substances 0.000 description 18
- -1 fatty acid imide Chemical class 0.000 description 11
- 239000012943 hotmelt Substances 0.000 description 10
- 229920001577 copolymer Polymers 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 235000014113 dietary fatty acids Nutrition 0.000 description 6
- 239000000194 fatty acid Substances 0.000 description 6
- 229930195729 fatty acid Natural products 0.000 description 6
- 238000005299 abrasion Methods 0.000 description 5
- 239000006229 carbon black Substances 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- NOPFSRXAKWQILS-UHFFFAOYSA-N docosan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCCCCCO NOPFSRXAKWQILS-UHFFFAOYSA-N 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- 239000001023 inorganic pigment Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000004166 Lanolin Substances 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- 229920006322 acrylamide copolymer Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 235000013871 bee wax Nutrition 0.000 description 1
- 239000012166 beeswax Substances 0.000 description 1
- 229940092738 beeswax Drugs 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004204 candelilla wax Substances 0.000 description 1
- 235000013868 candelilla wax Nutrition 0.000 description 1
- 229940073532 candelilla wax Drugs 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 229940082483 carnauba wax Drugs 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012185 ceresin wax Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229960000735 docosanol Drugs 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- IUJAMGNYPWYUPM-UHFFFAOYSA-N hentriacontane Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC IUJAMGNYPWYUPM-UHFFFAOYSA-N 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 235000019388 lanolin Nutrition 0.000 description 1
- 229940039717 lanolin Drugs 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 239000012170 montan wax Substances 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000012169 petroleum derived wax Substances 0.000 description 1
- 235000019381 petroleum wax Nutrition 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000196 poly(lauryl methacrylate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- 229920002720 polyhexylacrylate Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 229920006163 vinyl copolymer Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Thermal Transfer Or Thermal Recording In General (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は耐熱性印像を形成するた
めの熱転写記録材料およびそれを用いる耐熱性印像形成
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal transfer recording material for forming a heat-resistant stamped image and a method for forming a heat-resistant stamped image using the same.
【0002】[0002]
【従来の技術および発明が解決しようとする課題】熱転
写記録材料は一般に、基材上にカーボンブラックなどの
着色剤と、ワックスおよび(または)熱溶融性樹脂から
なるビヒクルとからなる熱溶融性インクを塗布したもの
であり、熱溶融性インクは熱転写性の点から、40〜1
20℃程度の融点ないし軟化点を有するようにされてい
る。2. Description of the Related Art A thermal transfer recording material generally comprises a hot-melt ink comprising a colorant such as carbon black on a substrate and a vehicle comprising a wax and / or a hot-melt resin. The heat-meltable ink is 40 to 1 from the viewpoint of thermal transferability.
It has a melting point or softening point of about 20 ° C.
【0003】近年、製造工場における製造工程での部
品、製品の管理、流通分野における商品管理、使用現場
における物品管理などに使用されているバーコードなど
を印字するのに、熱転写記録材料を使用するバーコード
プリンターやラベルプリンターが用いられるようになっ
てきている。In recent years, thermal transfer recording materials have been used to print barcodes and the like used in the management of parts and products in the manufacturing process in manufacturing factories, product management in the distribution field, and article management in the field of use. Bar code printers and label printers are being used.
【0004】このようなバーコードを付する物品などの
中にはバーコードを付した後に高温に曝されるものがあ
る。たとえば、プリント配線板の製造過程では180℃
程度、半導体の検査過程では250℃程度、ブラウン管
の製造過程では450℃程度の加熱処理が施される。し
たがって、このような物品に熱転写記録材料を用いてバ
ーコードなどを印字して管理しようとするばあい、一般
の熱転写記録材料を用いて形成した印像では前記のごと
き高温に加熱されると分解、炭化し判読不能になるの
で、前記のごとき高温に加熱されても分解、炭化しない
ような耐熱性を有する印像を形成しうる熱転写記録材料
が必要となる。Some of such bar-coded articles are exposed to a high temperature after the bar-coded. For example, in the manufacturing process of a printed wiring board, 180 ° C.
Heat treatment is performed at about 250 ° C. in a semiconductor inspection process and about 450 ° C. in a cathode ray tube manufacturing process. Therefore, when a barcode or the like is printed on such an article by using a thermal transfer recording material and is to be managed, an image formed using a general thermal transfer recording material decomposes when heated to a high temperature as described above. Therefore, a thermal transfer recording material that can form a heat-resistant printed image that does not decompose or carbonize even when heated to a high temperature as described above is required.
【0005】従来においても、耐熱性の印像を形成する
ための熱転写記録材料が提案されているが、前記のごと
き高温に耐えうる印像はえられない。Conventionally, a thermal transfer recording material for forming a heat-resistant image has been proposed, but an image which can withstand high temperatures as described above cannot be obtained.
【0006】たとえば、特開昭63−179791号公
報には、(a)融点120℃以上の脂肪酸アミドまたは
脂肪酸イミド、および(b)融点100℃以上のポリア
ミド樹脂またはビニル樹脂を含有する熱転写インキ層を
設けた熱転写材料が記載されているが、これからえられ
る印像の耐熱性は高々140℃であるにすぎない。For example, JP-A-63-179791 discloses a thermal transfer ink layer containing (a) a fatty acid amide or a fatty acid imide having a melting point of 120 ° C. or more, and (b) a polyamide resin or a vinyl resin having a melting point of 100 ° C. or more. Is described, but the heat resistance of the resulting image is only 140 ° C. at most.
【0007】本発明の目的は前記の点に鑑みて、耐熱性
のすぐれた、たとえば250〜600℃の高温に耐えう
る印像を形成しうる熱転写記録材料およびそれに用いる
耐熱性印像形成方法を提供することにある。SUMMARY OF THE INVENTION In view of the foregoing, it is an object of the present invention to provide a heat transfer recording material having excellent heat resistance and capable of forming an image capable of withstanding a high temperature of, for example, 250 to 600.degree. To provide.
【0008】[0008]
【課題を解決するための手段】請求項1記載の発明は、
基材上にビヒクルと着色剤とからなる熱溶融性インク層
が設けられてなる熱転写記録材料において、前記ビヒク
ルが熱溶融性材料と、ポリフェニレンスルフィド樹脂、
ポリエーテルスルホン樹脂、ポリスルホン樹脂、全芳香
族ポリイミド樹脂、ポリアミドイミド樹脂、ポリエーテ
ルイミド樹脂、ポリアリレート樹脂、ポリエーテルエー
テルケトン樹脂およびフッ素樹脂よりなる群から選ばれ
た、分解、炭化温度が250℃以上である、少なくとも
1種の耐熱性樹脂とからなり、前記耐熱性樹脂が微粒子
状態で前記熱溶融性インク層中に25〜65重量%含有
されてなることを特徴とする熱転写記録材料に関する。According to the first aspect of the present invention,
In a thermal transfer recording material in which a heat-fusible ink layer comprising a vehicle and a colorant is provided on a base material, the vehicle is a heat-fusible material, a polyphenylene sulfide resin,
Polyethersulfone resin, polysulfone resin, wholly aromatic polyimide resin, polyamideimide resin, polyetherimide resin, polyarylate resin, polyetheretherketone resin and fluorine resin , decomposition and carbonization temperature of 250 ° C The present invention relates to a thermal transfer recording material comprising at least one kind of heat-resistant resin, wherein the heat-resistant resin is contained in the heat-fusible ink layer in a fine particle state in an amount of 25 to 65% by weight.
【0009】また、請求項2記載の発明は、請求項1記
載の発明において、250〜600℃の高温に耐えうる
印像を与える熱転写記録材料に関する。A second aspect of the present invention relates to the thermal transfer recording material according to the first aspect of the present invention, which provides an image capable of withstanding a high temperature of 250 to 600 ° C.
【0010】また、請求項3記載の発明は、請求項1ま
たは2記載の発明において、前記熱溶融性材料が、融点
または軟化点が40〜120℃のものである熱転写記録
材料に関する。The invention according to claim 3 relates to the thermal transfer recording material according to claim 1 or 2, wherein the heat-fusible material has a melting point or a softening point of 40 to 120 ° C.
【0011】また、請求項4記載の発明は、請求項1〜
3のいずれかに記載の発明において、前記熱溶融性イン
ク層と基材との間に離型層が設けられてなる熱転写記録
材料に関する。[0011] Further, the invention according to claim 4 is characterized in that:
3. The thermal transfer recording material according to claim 3, wherein a release layer is provided between the hot-melt ink layer and the substrate.
【0012】また、請求項5記載の発明は、請求項1〜
4のいずれかに記載の熱転写記録材料を用いて被転写体
上に印像を形成し、ついで前記耐熱性樹脂の軟化点また
は融点以上でかつ600℃以下の温度で加熱して該印像
を該被転写体に熱定着させることを特徴とする耐熱性印
像形成方法に関する。[0012] The invention according to claim 5 provides the invention according to claims 1 to 5.
4. A printed image is formed on a transfer-receiving material using the thermal transfer recording material according to any one of 4. and then heated at a temperature not lower than the softening point or melting point of the heat-resistant resin and not higher than 600 ° C. to form the printed image. The present invention relates to a method for forming a heat-resistant stamped image, which comprises thermally fixing the image on a transfer-receiving member.
【0013】[0013]
【作用および実施例】本発明の熱転写記録材料は、その
熱溶融性インク層のビヒクルが、従来よりこの種のイン
ク層のビヒクル成分として使用されている低融点ないし
低軟化点の熱溶融性材料と、前記特定の耐熱性樹脂とか
らなることを特徴するものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS The thermal transfer recording material of the present invention is characterized in that the vehicle of the heat-fusible ink layer is a low-melting point or low softening-point heat-fusible material conventionally used as a vehicle component of this kind of ink layer. And the specific heat-resistant resin.
【0014】しかして本発明の熱転写記録材料を用いて
形成された印像は、前記特定の耐熱性樹脂の存在故に高
温度、たとえば250℃以上の高温度に加熱されても、
分解、炭化により判読が不可能になることがない。[0014] impression formed by using the thermal transfer recording material of the present invention Thus, the present because high temperature for a specific heat-resistant resin, be heated in example 2 50 ° C. or more high temperature,
It is not impossible to read due to decomposition or carbonization.
【0015】したがって、本発明の熱転写記録材料は、
たとえば250℃以上の高温度に加熱される物品にバー
コードなどの印像を形成するのに好適に使用される。Therefore, the thermal transfer recording material of the present invention is:
Preferably used in the article to be heated in 2 50 ° C. or more high temperature to form the printed images, such as a bar code, for example.
【0016】なお、本発明においてビヒクル成分として
用いる熱溶融性材料は、熱転写性、加熱処理前の印像の
耐擦過性などを確保するためのものである。本発明の熱
転写記録材料を用いるばあい、通常の熱転写条件で印像
を形成できる。The heat-fusible material used as a vehicle component in the present invention is for ensuring thermal transferability, abrasion resistance of an image before heat treatment, and the like. When the thermal transfer recording material of the present invention is used, a printed image can be formed under ordinary thermal transfer conditions.
【0017】本発明の耐熱性印像形成方法においては、
前記熱転写記録媒体を用いて被転写体上に印像を形成
し、ついで前記耐熱性樹脂の軟化点または融点以上でか
つ600℃以下の温度で加熱して該印像を該被転写体に
熱定着させる。In the method for forming a heat-resistant image of the present invention,
Using the thermal transfer recording medium, a printed image is formed on the transfer object, and then heated at a temperature not lower than the softening point or melting point of the heat-resistant resin and not higher than 600 ° C. to transfer the print image to the transfer object. Fix it.
【0018】形成した印像を前記加熱処理に付すことに
よって、印像中の前記特定の耐熱性樹脂が部分的に軟化
するかまたは完全に軟化溶融するため、印像が被転写体
に強固に固着され、耐擦過性が向上される。そのためバ
ーコード用などとして好適な印像がえられる。By subjecting the formed image to the heat treatment, the specific heat-resistant resin in the image is partially softened or completely softened and melted. It is fixed and scratch resistance is improved. Therefore, a print image suitable for a bar code or the like can be obtained.
【0019】つぎに本発明を詳細に説明する。Next, the present invention will be described in detail.
【0020】本発明の熱転写記録材料は、基材上にビヒ
クルと着色剤とからなる熱溶融性インク層が設けられ、
該ビヒクルが熱溶融性材料と、ポリフェニレンスルフィ
ド樹脂、ポリエーテルスルホン樹脂、ポリスルホン樹
脂、全芳香族ポリイミド樹脂(芳香族アミノ化合物と芳
香族酸無水物の縮重合物である)、ポリアミドイミド樹
脂、ポリエーテルイミド樹脂、ポリアリレート樹脂、ポ
リエーテルエーテルケトン樹脂およびフッ素樹脂よりな
る群から選ばれた少なくとも1種の耐熱性樹脂とからな
るものである。The thermal transfer recording material of the present invention is provided with a heat-fusible ink layer comprising a vehicle and a colorant on a substrate,
The vehicle comprises a heat-fusible material, a polyphenylene sulfide resin, a polyether sulfone resin, a polysulfone resin, a wholly aromatic polyimide resin (which is a condensation polymer of an aromatic amino compound and an aromatic acid anhydride), a polyamide imide resin, It comprises at least one heat-resistant resin selected from the group consisting of ether imide resin, polyarylate resin, polyether ether ketone resin and fluororesin.
【0021】前記熱溶融性材料は一般の熱溶融性インク
のビヒクルとして使用されているものであり、ワックス
類および(または)熱溶融性樹脂(エラストマーを含
む、以下同様)を主体とし、融点または軟化点が40〜
120℃程度のものである。The hot-melt material is used as a vehicle for general hot-melt ink, and is mainly composed of waxes and / or hot-melt resins (including elastomers, hereinafter the same), and has a melting point or Softening point is 40 ~
It is about 120 ° C.
【0022】前記ワックス類としては、たとえば木ロ
ウ、ミツロウ、ラノリン、カルナバワックス、キャンデ
リラワックス、モンタンワックス、セレシンワックスな
どの天然ワックス;パラフィンワックス、マイクロクリ
スタリンワックスなどの石油系ワックス;酸化ワック
ス、エステルワックス、低分子量ポリエチレンワック
ス、ワックスα−オレフィン−無水マレイン酸共重合体
ワックス、ウレタン化ワックス、フィッシャートロプシ
ュワックスなどの合成ワックス;ラウリン酸、ミリスチ
ン酸、パルミチン酸、ステアリン酸、ベヘン酸などの高
級脂肪酸;ステアリルアルコール、ドコサノールなどの
高級脂肪族アルコール;高級脂肪酸モノグリセリド、シ
ョ糖の脂肪酸エステル、ソルビタンの脂肪酸エステルな
どのエステル類;オレイルアミドなどのアミド類および
ビスアミド類などで、融点が40〜120℃程度のもの
が使用できる。これらワックス類は単独でまたは2種以
上を混合して使用できる。Examples of the waxes include natural waxes such as wood wax, beeswax, lanolin, carnauba wax, candelilla wax, montan wax and ceresin wax; petroleum waxes such as paraffin wax and microcrystalline wax; oxidized waxes and esters Synthetic waxes such as wax, low molecular weight polyethylene wax, wax α-olefin-maleic anhydride copolymer wax, urethanized wax, Fischer-Tropsch wax; higher fatty acids such as lauric acid, myristic acid, palmitic acid, stearic acid, behenic acid Higher fatty alcohols such as stearyl alcohol and docosanol; higher fatty acid monoglycerides, fatty acid esters of sucrose, fatty acid esters of sorbitan and the like; Amide such as amides and bisamides such as melting point can be used is of about 40 to 120 ° C.. These waxes can be used alone or in combination of two or more.
【0023】前記熱溶融性樹脂としては、たとえばエチ
レン−酢酸ビニル共重合体、エチレン−酪酸ビニル共重
合体、エチレン−(メタ)アクリル酸共重合体、エチレ
ン−(メタ)アクリル酸アルキルエステル共重合体(ア
ルキル基としてはメチル、エチル、プロピル、ブチル、
ヘキシル、ヘプチル、オクチル、2−エチルヘキシル、
ノニル、ドデシル、ヘキサデシルなど炭素数1〜16個
程度のものがあげられる)、エチレン−アクリロニトリ
ル共重合体、エチレン−アクリルアミド共重合体、エチ
レン−N−メチロールアクリルアミド共重合体、エチレ
ン−スチレン共重合体などのエチレン系共重合体;ポリ
ラウリルメタクリレート、ポリヘキシルアクリレートな
どのポリ(メタ)アクリル酸エステル類;ポリ塩化ビニ
ル、塩化ビニル−酢酸ビニル共重合体、塩化ビニル−ビ
ニルアルコール共重合体などの塩化ビニル系(共)重合
体;その他ポリエステル樹脂、ポリアミド樹脂、セルロ
ース系樹脂、石油樹脂、ロジン類、テルペン樹脂、クマ
ロン−インデン樹脂、天然ゴム、スチレン−ブタジエン
共重合体、イソプレン重合体、クロロプレン重合体など
で、融点ないし軟化点が40〜120℃程度のものが使
用できる。これら熱可塑性樹脂は単独でもしくは2種以
上を混合して使用できる。Examples of the heat-fusible resin include ethylene-vinyl acetate copolymer, ethylene-vinyl butyrate copolymer, ethylene- (meth) acrylic acid copolymer, and ethylene- (meth) acrylic acid alkyl ester copolymer. Merging (alkyl groups such as methyl, ethyl, propyl, butyl,
Hexyl, heptyl, octyl, 2-ethylhexyl,
Nonyl, dodecyl, hexadecyl and the like having about 1 to 16 carbon atoms), ethylene-acrylonitrile copolymer, ethylene-acrylamide copolymer, ethylene-N-methylolacrylamide copolymer, ethylene-styrene copolymer Such as ethylene-based copolymers; poly (meth) acrylates such as polylauryl methacrylate and polyhexyl acrylate; and chlorides such as polyvinyl chloride, vinyl chloride-vinyl acetate copolymer and vinyl chloride-vinyl alcohol copolymer. Vinyl (co) polymers; other polyester resins, polyamide resins, cellulose resins, petroleum resins, rosins, terpene resins, coumarone-indene resins, natural rubber, styrene-butadiene copolymers, isoprene polymers, chloroprene polymers Melting point or soft Point can be used is of about 40~120 ℃. These thermoplastic resins can be used alone or in combination of two or more.
【0024】前記耐熱性樹脂のそれぞれの代表例の構造
式を物性値と共に表1〜2に示す。Tables 1 and 2 show the structural formulas of typical examples of each of the heat-resistant resins together with physical properties.
【0025】[0025]
【表1】 [Table 1]
【0026】[0026]
【表2】 [Table 2]
【0027】これらの耐熱性樹脂は、250℃以上の高
温に加熱しても、分解、炭化することがない。しかし加
熱温度が高すぎると耐熱性樹脂が分解し、印像としての
形態が消失されるので、加熱温度は600℃以下が好ま
しい。 These heat resistant resins do not decompose or carbonize even when heated to a high temperature of 250 ° C. or higher . But
If the heat temperature is too high, the heat-resistant resin will decompose,
Since the form is lost, the heating temperature is preferably 600 ° C or less.
New
【0028】印像の耐熱性の点からはビヒクル中におけ
る耐熱性樹脂の割合が多い方がよい。一方、熱転写性の
点からは、耐熱性樹脂の割合は少ない方がよい。From the viewpoint of the heat resistance of the image, it is preferable that the ratio of the heat-resistant resin in the vehicle is large. On the other hand, from the viewpoint of thermal transferability, the smaller the proportion of the heat-resistant resin, the better.
【0029】この両者を勘案して、本発明では耐熱性樹
脂の熱溶融性インク層における含有量を、25〜65重
量%とするのが好ましい。耐熱性樹脂の含有量が前記範
囲未満では、印像の耐熱性が充分でなく、一方前記範囲
を超えると、熱転写性が劣る。In consideration of the both, in the present invention, the content of the heat-resistant resin in the heat-fusible ink layer is preferably 25 to 65% by weight. When the content of the heat-resistant resin is less than the above range, the heat resistance of the printed image is not sufficient. On the other hand, when the content exceeds the above range, the thermal transferability is poor.
【0030】前記耐熱性樹脂は、インク層中に微粒子状
態で含有されている。The heat resistant resin is contained in the ink layer in the form of fine particles.
【0031】耐熱性樹脂が微粒子状態で分散されている
本発明においては、熱転写時におけるインクの溶融粘度
が比較的低いので、熱転写性がよいという利点がある。
したがって、本発明は印像の耐熱性を高めるために耐熱
性樹脂のインク層中における含有量を比較的多くするば
あい、たとえば25〜65重量%の範囲とするばあいに
好適である。In the present invention, in which the heat-resistant resin is dispersed in the form of fine particles, the ink has a relatively low melt viscosity at the time of thermal transfer, and thus has the advantage of good thermal transferability.
Therefore, the present invention is suitable when the content of the heat-resistant resin in the ink layer is relatively large in order to enhance the heat resistance of the printed image, for example, when the content is in the range of 25 to 65% by weight.
【0032】本発明のばあい、通常平均粒径が0.1〜
50μm、より好ましくは0.1〜25μmのものが使
用される。In the present invention, the average particle size is usually 0.1 to
50 μm, more preferably 0.1 to 25 μm is used.
【0033】前記耐熱性樹脂について使用可能な態様
(微粒子状態)を表3に示す。表3において、○印はそ
の態様で使用可能であること、×印は使用困難または不
可能なことを意味する。Table 3 shows the usable modes (fine particle state) of the heat-resistant resin. In Table 3, the mark ○ means that the product can be used in that mode, and the mark X means that use is difficult or impossible.
【0034】[0034]
【表3】 [Table 3]
【0035】本発明に用いる着色剤としては、カーボン
ブラックをはじめ、各種有機、無機の顔料が使用でき
る。加熱処理温度がたとえば450℃程度以上と高いば
あいには、カーボンブラック、無機顔料が好ましい。着
色剤のインク層中における含有量は5〜50重量%、よ
り好ましくは10〜20重量%が適当である。As the colorant used in the present invention, various organic and inorganic pigments such as carbon black can be used. When the heat treatment temperature is as high as, for example, about 450 ° C. or more, carbon black and inorganic pigments are preferred. The content of the colorant in the ink layer is suitably 5 to 50% by weight, more preferably 10 to 20% by weight.
【0036】本発明における熱溶融性インク層には前記
成分の他に、分散剤、可塑剤、界面活性剤(アニオン
系、カチオン系、ノニオン系、両性系)、カップリング
剤(シラン系、チタネート系、ジルコネート系、ジルコ
アルミネート系など)などを適宜配合することができ
る。In the hot-melt ink layer of the present invention, in addition to the above components, a dispersant, a plasticizer, a surfactant (anionic, cationic, nonionic, amphoteric) and a coupling agent (silane, titanate). System, zirconate system, zircoaluminate system, etc.) can be appropriately blended.
【0037】本発明における熱溶融性インク層の形成は
つぎのようにして行なうことができる。The formation of the heat-fusible ink layer in the present invention can be carried out as follows.
【0038】熱溶融性材料は溶解するが、耐熱性樹脂は
溶解しない溶剤に、熱溶融性材料を溶解し、それに耐熱
性樹脂の粉末を分散させ、着色剤その他の添加剤を溶
解、分散させて塗工液を調製し、この塗工液を基材上
(後述する離型層を設けるばあいは離型層上)に塗布
し、乾燥することによって形成できる。The heat-fusible material is dissolved in a solvent in which the heat-fusible material dissolves but the heat-resistant resin does not. The heat-resistant resin powder is dispersed therein, and the colorant and other additives are dissolved and dispersed. A coating solution is prepared by applying the coating solution onto a base material (on a release layer if a release layer described later is provided), and then dried.
【0039】本発明における熱溶融性インク層の塗布量
は、通常2.5〜7g/m2、より好ましくは3〜5g
/m2が適当である。The coating amount of the hot-melt ink layer in the present invention is usually 2.5 to 7 g / m 2 , more preferably 3 to 5 g.
/ M 2 is appropriate.
【0040】前記基材としては、ポリエチレンテレフタ
レートフィルム、ポリブチレンテレフタレートフィル
ム、ポリエチレンナフタレートフィルム、ポリアリレー
トフィルムなどのポリエステルフィルム、ポリカーボネ
ートフィルム、ポリアミドフィルム、アラミドフィル
ム、ポリエーテルスルホンフィルム、ポリスルホンフィ
ルム、ポリフェニレンスルフィドフィルム、ポリエーテ
ルエーテルケトンフィルム、ポリエーテルイミドフィル
ム、変性ポリフェニレンエーテルフィルム、ポリアセタ
ールフィルム、その他この種のインクリボンの基材用フ
ィルムとして一般に使用されている各種のプラスチック
フィルムが使用できる。またコンデンサーペーパーのよ
うな高密度の薄い紙を使用てもよい。基材の厚さは通常
1〜10μm程度であり、熱拡散を小さくして解像度を
高めうる点からは1〜6μmの範囲が好ましい。Examples of the substrate include polyester films such as polyethylene terephthalate film, polybutylene terephthalate film, polyethylene naphthalate film, and polyarylate film, polycarbonate films, polyamide films, aramid films, polyethersulfone films, polysulfone films, polyphenylene sulfides. A film, a polyetheretherketone film, a polyetherimide film, a modified polyphenyleneether film, a polyacetal film, and various other plastic films generally used as a substrate film for this type of ink ribbon can be used. Alternatively, high-density thin paper such as condenser paper may be used. The thickness of the substrate is usually about 1 to 10 μm, and preferably 1 to 6 μm from the viewpoint that the thermal diffusion can be reduced and the resolution can be increased.
【0041】本発明の熱転写記録材料をサーマルヘッド
を備えた熱転写プリンターで使用するばあいは、基材の
背面(サーマルヘッドに摺接する側の面)にシリコーン
樹脂、フッ素樹脂、ニトロセルロース樹脂、あるいはこ
れらによって変性された、たとえばシリコーン変性ウレ
タン樹脂、シリコーン変性アクリル樹脂など各種の耐熱
性樹脂、あるいはこれら耐熱性樹脂に滑剤を混合したも
のなどからなる、従来から知られているスティック防止
層を設けるのが好ましい。When the thermal transfer recording material of the present invention is used in a thermal transfer printer having a thermal head, a silicone resin, a fluororesin, a nitrocellulose resin, By providing a conventionally known stick prevention layer made of various heat-resistant resins modified by these, for example, silicone-modified urethane resin, silicone-modified acrylic resin, or a mixture of these heat-resistant resins with a lubricant. Is preferred.
【0042】本発明の熱転写記録材料においては前記イ
ンク層と基材との間に離型層を設けてもよい。In the thermal transfer recording material of the present invention, a release layer may be provided between the ink layer and the substrate.
【0043】本発明のインク層のばあい、耐熱性樹脂の
割合が多くなるにつれて熱転写性が低下するので、耐熱
性樹脂のインク層中における含有量が47〜65重量
%、とくに55〜65重量%であるばあいは、離型層を
設けるのが好ましい。In the case of the ink layer of the present invention, since the thermal transferability decreases as the proportion of the heat-resistant resin increases, the content of the heat-resistant resin in the ink layer is 47 to 65% by weight, particularly 55 to 65% by weight. %, It is preferable to provide a release layer.
【0044】離型層としては通常ワックス類を主体とす
るものが使用できる。接着性の調節のために熱可塑性樹
脂を離型層の10重量%以下で配合してもよい。これら
ワックス類および熱可塑性樹脂としては前記インク層の
熱溶融性材料として例示したワックス類および熱溶融性
樹脂が使用できる。As the release layer, a layer mainly composed of waxes can be generally used. A thermoplastic resin may be blended in an amount of 10% by weight or less of the release layer for adjusting the adhesiveness. As the wax and the thermoplastic resin, the wax and the heat-meltable resin exemplified as the heat-meltable material of the ink layer can be used.
【0045】離型層の塗布量は、通常0.3〜1g/m
2程度が適当である。The coating amount of the release layer is usually 0.3 to 1 g / m
About 2 is appropriate.
【0046】本発明の熱転写記録材料を用いて印像を形
成するには、熱転写記録材料のインク層を被転写体と重
ね合せ、インク層に像状に熱エネルギーを与える。熱エ
ネルギーを与える熱源としてはサーマルヘッドが一般的
であるが、レーザー光、赤外線フラッシュ、熱ペンなど
公知のものがいずれも使用できる。In order to form a printed image using the thermal transfer recording material of the present invention, an ink layer of the thermal transfer recording material is superposed on a transfer object, and thermal energy is applied to the ink layer in an image-like manner. A thermal head is generally used as a heat source for applying thermal energy, but any known one such as a laser beam, an infrared flash, and a hot pen can be used.
【0047】被転写体がシート状物でない立体形状のば
あい、その表面が曲面であるばあいなどにおいては、熱
エネルギーの適用が容易な点から、レーザー光による熱
転写が有利である。When the object to be transferred has a three-dimensional shape other than a sheet-like material, or when the surface thereof is a curved surface, thermal transfer using a laser beam is advantageous because heat energy can be easily applied.
【0048】本発明の熱転写記録材料は、前記のごとく
耐熱性のすぐれた印像を与えるので、250℃以上の温
度で加熱処理を受ける被転写体に印像を形成するのに好
適に使用される。被転写体の受ける加熱処理の温度が高
すぎると、着色剤や耐熱性樹脂などが分解し、印像とし
ての形態が消失されるので、被転写体の受ける加熱処理
の温度は600℃以下、なかんづく500℃以下である
のが好ましい。The thermal transfer recording material of the present invention, because it gives the heat resistance of the good impression as above, preferably used to form printed images on the transfer member for receiving the heat treatment at 2 50 ° C. or more temperature Is done. If the temperature of the heat treatment applied to the transfer object is too high, the coloring agent or the heat-resistant resin is decomposed, and the form as a printed image is lost. It is particularly preferable that the temperature is 500 ° C. or lower.
【0049】つぎに本発明の耐熱性印像形成方法につい
て説明すると、本発明の方法においては、被転写体上に
印像を形成したのち、該印像に、前記耐熱性樹脂の軟化
点または融点以上でかつ600℃以下の温度で加熱処理
を施して該印像を被転写体に熱定着させて最終的な耐熱
性印像をうる。Next, the method of forming a heat-resistant stamped image of the present invention will be described. In the method of the present invention, after forming a printed image on an object to be transferred, the softened point of the heat-resistant resin or A heat treatment is performed at a temperature not lower than the melting point and not higher than 600 ° C., and the image is thermally fixed on the transfer-receiving member to obtain a final heat-resistant image.
【0050】ここで、熱定着とは、印像を耐熱性樹脂の
軟化点または融点以上に加熱して印像を被転写体に強固
に固着させることをいう。このような熱定着により耐擦
性のすぐれた印像がえられる。Here, the term "thermal fixing" means that the image is heated to a temperature higher than the softening point or the melting point of the heat-resistant resin so that the image is firmly fixed to the object to be transferred. By such heat fixing, a printed image having excellent abrasion resistance can be obtained.
【0051】前記耐熱性樹脂の軟化点とは該樹脂が粘着
性を帯びはじめる温度であり、通常それらのガラス転移
点より高く、たとえばそれらのガラス転移点より50〜
100℃程度高いが、さらにこれより高いばあいもあ
る。したがって、前記熱定着のためには、印像を耐熱性
樹脂のガラス転移点より高く、なかんづくガラス転移点
より50〜100℃高い温度、あるいはかかる温度より
さらに高い温度に加熱するのが好ましい。とりわけ耐熱
性樹脂の融点以上に加熱して、熱定着をより完全にする
のが好ましい。The softening point of the heat-resistant resin is a temperature at which the resin starts to become tacky, and is usually higher than their glass transition point, for example, 50 to 50 degrees below their glass transition point.
It is higher by about 100 ° C, but may be higher. Therefore, for the heat fixing, it is preferable to heat the printed image to a temperature higher than the glass transition point of the heat-resistant resin, especially 50 to 100 ° C. higher than the glass transition point, or higher than such temperature. In particular, it is preferable to heat the resin to a temperature equal to or higher than the melting point of the heat-resistant resin to complete the heat fixing more completely.
【0052】一方、前記加熱処理の温度が高すぎると、
着色剤や耐熱性樹脂などが分解し、印像としての形態が
消失されるので、この点から加熱処理の温度の上限は通
常600℃程度であり、より好ましくは500℃程度で
ある。On the other hand, if the temperature of the heat treatment is too high,
Since the colorant and the heat-resistant resin are decomposed and the form as an image is lost, the upper limit of the temperature of the heat treatment is usually about 600 ° C., more preferably about 500 ° C. from this point.
【0053】本発明において、前記加熱処理は、通常被
転写体がその製造過程などで受ける加熱処理の際に行な
われる。In the present invention, the above-mentioned heat treatment is usually carried out at the time of the heat treatment to be performed on the object to be transferred during the manufacturing process.
【0054】しかしながら、被転写体がその製造過程な
どで受ける加熱処理とは別途に予め加熱処理を施しても
よい。被転写体に印像を形成したのち、それ自体の加熱
処理を受ける前に移送などされるもので、その間に印像
が擦れなどの外力を受けるばあいは、予め加熱処理を施
して耐擦性を向上しておくのが好ましい。本発明のもの
は、耐熱性樹脂が熱溶融性インク層中に熱溶融性材料と
相溶状態で含有されているものに比べ加熱処理前の耐擦
性に劣るので、予め加熱処理を施しておくのが好まし
い。この場合の加熱処理は被転写体全体を前記温度に加
熱することによって行なってもよいが、熱コテやレーザ
ー光照射などにより印像を加熱することによって行なっ
てもよい。However, a heat treatment may be performed in advance separately from the heat treatment that the object to be transferred receives during the manufacturing process or the like. After the imprint is formed on the transfer object, it is transported before undergoing its own heat treatment.If the imprint receives external force such as rubbing during that time, it is subjected to heat treatment in advance to It is preferable to improve the properties. The thing of the present invention is inferior in the abrasion resistance before the heat treatment compared with the heat-fusible resin contained in the heat-fusible ink layer in a state compatible with the heat-fusible material, so that the heat-treated resin is subjected to heat treatment in advance. It is preferable to keep it. In this case, the heat treatment may be performed by heating the entire transfer-receiving body to the above-described temperature, or may be performed by heating the imprint by a heat iron, laser beam irradiation, or the like.
【0055】本発明の方法では、前記のごとく目的とす
る被転写体に直接印像を形成してもよいが、予めシート
状の被転写体(受像体)に印像を形成したのち、この受
像体を目的とする被転写体に耐熱性接着剤などの適宜の
手段で貼付してもよい。このばあい、印像を形成した受
像体を被転写体に貼付したのち前記加熱処理を施しても
よく、あるいは印像を形成した受像体を被転写体に貼付
する前に前記加熱処理を施してもよい。In the method of the present invention, as described above, a printed image may be directly formed on a target transfer object. However, after a print image is formed on a sheet-shaped transfer object (image receiving member) in advance, the image is formed. It may be affixed to an object to be transferred as an image receiving body by an appropriate means such as a heat-resistant adhesive. In this case, the heat treatment may be performed after the image receiving body on which the imprinted image is formed is attached to the transfer object, or the heat treatment may be performed before the image receiving body on which the imprint image is formed is stuck on the transfer object. You may.
【0056】前記シート状の受像体としては、耐熱性の
シート状物が使用され、ガラス繊維やセラミック繊維の
布状物、これに耐熱性樹脂を塗布、含浸させたもの、ガ
ラスやセラミックスのシート状物、金属のシート状物な
どがあげられる。As the sheet-shaped image receiving member, a heat-resistant sheet-like material is used. A cloth-like material of glass fiber or ceramic fiber, a material obtained by applying and impregnating a heat-resistant resin to this, or a sheet of glass or ceramic And a metal sheet.
【0057】本発明の熱転写記録材料は耐熱性のすぐれ
た印像を与えるので、被転写体が、ブラウン管、螢光表
示管、プリント配線板など製造過程において、半導体な
ど検査過程において、250〜600℃、なかんづく2
50〜500℃という高温で加熱処理を受けるものに印
像を形成するのに好適に使用される。Since the thermal transfer recording material of the present invention gives an image having excellent heat resistance, the transferred material can be used in the production process of a cathode ray tube, a fluorescent display tube, a printed wiring board, etc., in the inspection process of a semiconductor, etc., in the range of 250-600. ℃, especially 2
It is suitably used for forming a printed image on a material which is subjected to a heat treatment at a high temperature of 50 to 500 ° C.
【0058】つぎに実験例をあげて本発明を説明する。Next, the present invention will be described with reference to experimental examples.
【0059】実験例1〜17 厚さ4μmのポリエチレンテレフタレートフィルムの片
面にシリコーン樹脂からなる塗布量0.2g/m2のス
ティック防止層を形成し、その反対面に表4に示される
インク塗工液を塗布し、乾燥して、塗布量4g/m
2の、ポリフェニレンスルフィド樹脂が微粒子状態で分
散されているインク層を形成して熱転写記録材料をえ
た。EXPERIMENTAL EXAMPLES 1-17 A 4 μm-thick polyethylene terephthalate film was coated on one side with a stick prevention layer made of silicone resin at a coating amount of 0.2 g / m 2 , and the other side was coated with the ink shown in Table 4. Apply the liquid and dry it to apply 4 g / m
In 2 , an ink layer in which polyphenylene sulfide resin was dispersed in the form of fine particles was formed to obtain a thermal transfer recording material.
【0060】前記インク塗工液は、トルエンにα−オレ
フィン−無水マレイン酸共重合体ワックス(融点74
℃)とエチレン−酢酸ビニル共重合体(軟化点66℃)
を溶解し、これにポリフェニレンスルフィド樹脂粉末
(平均粒径24μm)およびカーボンブラックを均一に
分散させて調製した。The ink coating solution was prepared by adding α-olefin-maleic anhydride copolymer wax (melting point: 74) to toluene.
℃) and ethylene-vinyl acetate copolymer (softening point 66 ℃)
Was dissolved therein, and a polyphenylene sulfide resin powder (average particle size: 24 μm) and carbon black were uniformly dispersed and prepared.
【0061】なお実験例3、5、7、9、11、13、
15および17では、基材上に下記離型層塗工液を塗
布、乾燥して塗布量0.9g/m2の離型層を形成し、
そのうえにインク層を形成した。Experimental Examples 3, 5, 7, 9, 11, 13,
In Nos. 15 and 17, the following release layer coating solution was applied on the substrate and dried to form a release layer having an application amount of 0.9 g / m 2 .
An ink layer was formed thereon.
【0062】 成 分 重量部 パラフィンワックス 20 イソプロピルアルコール 68 トルエン 12Component Parts by weight Paraffin wax 20 Isopropyl alcohol 68 Toluene 12
【0063】前記でえられた各熱転写記録材料を熱転写
式バーコードプリンター(東京電気(株)製B−30)
に使用し、印加エネルギー30.5mJ/mm2、印字
速度2インチ/sec、プラテン圧強の印字条件下でポ
リイミドフィルム上に印像を形成し、熱オーブン中で4
10℃で1時間加熱処理を施した。なお熱定着のために
は短時間の加熱でよいが、耐熱性の評価のために1時間
という長時間加熱した。加熱処理前の印像と加熱処理後
の印像について、反射濃度(OD値)を測定し、かつ下
記の方法で耐擦過性を調べた。結果を表4に示す。Each of the thermal transfer recording materials obtained above is applied to a thermal transfer type bar code printer (B-30 manufactured by Tokyo Electric Co., Ltd.).
To form an image on a polyimide film under the conditions of applied energy of 30.5 mJ / mm 2 , printing speed of 2 inch / sec, and strong platen pressure,
Heat treatment was performed at 10 ° C. for 1 hour. Heating for a short time is sufficient for heat fixing, but heating was performed for a long time of 1 hour for evaluation of heat resistance. The reflection density (OD value) of the image before the heat treatment and the image after the heat treatment were measured, and the scratch resistance was examined by the following method. Table 4 shows the results.
【0064】耐擦過性 ポリイミドフィルム上に形成されたチェッカーフラッグ
パターンの印像(4mm×4mmの大きさのベタ印字部
21個がチェッカーフラッグパターン状に配列されたも
の)を、摩擦試験機(アトラス・エレクトリック・デバ
イス社製A.A.T.C.C.クロックメーター、モデ
ルCM−1)を使用し、綿布を510g/cm2の圧力
下に30回往復させて擦った。21個のベタ印字部のう
ちで最も欠けの大きいベタ印字部について、元の面積
(16mm2)に対する欠け部分の面積の割合(%)を
求め、つぎの基準にしたがって判定した。 5:前記割合が0%である。 4:前記割合が1%未満である。 3:前記割合が1%以上、3%未満である。 2:前記割合が3%以上、5%未満である。 1:前記割合が5%以上である。Abrasion Resistance An image of a checker flag pattern formed on a polyimide film (21 solid printed portions having a size of 4 mm × 4 mm and arranged in a checker flag pattern) was placed on a friction tester (Atlas). A cotton cloth was rubbed by reciprocating 30 times under a pressure of 510 g / cm 2 using an AATCC clock meter (Model CM-1) manufactured by Electric Devices Co., Ltd. For the solid printing portion having the largest chipping among the 21 solid printing portions, the ratio (%) of the area of the notched portion to the original area (16 mm 2 ) was determined, and the judgment was made according to the following criteria. 5: The ratio is 0%. 4: The ratio is less than 1%. 3: The ratio is 1% or more and less than 3%. 2: The ratio is 3% or more and less than 5%. 1: The ratio is 5% or more.
【0065】なお前記割合が前記基準値3以上ではバー
コードリーダーでの判読上支障がない。When the ratio is equal to or more than the reference value 3, there is no problem in reading with a bar code reader.
【0066】[0066]
【表4】 [Table 4]
【0067】表4から明らかなごとく、耐熱性樹脂がイ
ンク層中で微粒子状態で含有されているばあい、反射濃
度がバーコードリーダーで判読可能な反射濃度である
0.80以上の印像をうるには、耐熱性樹脂のインク層
中における含有量を25〜65重量%とするのが好まし
い。また耐熱性樹脂のインク層中における含有量が47
〜65重量のばあいは、インク層と基材との間に離型層
を設けるのが好ましく、とくに耐熱性樹脂の含有量が5
5〜65重量%のばあいは離型層を設ける必要がある。As is clear from Table 4, when the heat-resistant resin is contained in the ink layer in the form of fine particles, an image having a reflection density of 0.80 or more, which is a reflection density readable by a bar code reader, is obtained. To achieve this, the content of the heat-resistant resin in the ink layer is preferably 25 to 65% by weight. When the content of the heat-resistant resin in the ink layer is 47
When the weight is 65 to 65%, it is preferable to provide a release layer between the ink layer and the base material.
In the case of 5 to 65% by weight, it is necessary to provide a release layer.
【0068】実験例18〜25 実験例1〜17において、インク層塗工液として表5に
示す処方のものを用いたほかは実験例1〜17と同様に
して、耐熱性樹脂がインク層中に分散状態で含有されて
いる熱転写記録媒体を得、試験を行なった。結果を表5
に示す。Experimental Examples 18 to 25 In the same manner as in Experimental Examples 1 to 17, except that the ink layer coating liquid having the formulation shown in Table 5 was used, the heat-resistant resin was added to the ink layer. Was obtained in a dispersed state, and a test was conducted. Table 5 shows the results
Shown in
【0069】[0069]
【表5】 [Table 5]
【0070】[0070]
【発明の効果】請求項1〜3記載の発明によるときは、
ビヒクルとして熱溶融性材料と特定の耐熱性樹脂を併用
することにより、熱転写性を確保しながら、耐熱性のす
ぐれた印像をうることができる。耐熱性がとくに良好で
あると共に、加熱処理前の印像の耐擦過性が良好であ
る。According to the first to third aspects of the present invention,
By using a heat-fusible material and a specific heat-resistant resin in combination as a vehicle, an image having excellent heat resistance can be obtained while ensuring thermal transferability. The heat resistance is particularly good, and the scratch resistance of the image before the heat treatment is good.
【0071】請求項4記載の発明によるときは、離型層
を設けることにより熱転写性がすぐれている。According to the fourth aspect of the present invention, the heat transfer property is excellent by providing the release layer.
【0072】請求項5記載の発明によるときは、えられ
た印像に加熱処理を施すことにより、耐擦過性のすぐれ
た耐熱性印像がえられる。According to the fifth aspect of the present invention, by applying heat treatment to the obtained image, a heat-resistant image having excellent scratch resistance can be obtained.
【0073】つぎに本発明の好ましい態様を示す。Next, preferred embodiments of the present invention will be described.
【0074】(1)請求項1記載の発明において、前記
耐熱性樹脂の前記熱溶融性インク層中における含有量が
47〜65重量%であり、前記熱溶融性インク層と基材
との間に離型層が設けられてなる熱転写記録材料。(1) In the first aspect of the present invention, the content of the heat-resistant resin in the hot-melt ink layer is 47 to 65% by weight, and the content of the heat-resistant resin between the hot-melt ink layer and the substrate is And a thermal transfer recording material comprising a release layer.
【0075】耐熱性樹脂の割合が多くても熱転写性が良
好である。Even when the proportion of the heat-resistant resin is large, the thermal transferability is good.
【0076】(2)請求項5項記載の発明において、加
熱処理の温度が500℃以下である耐熱性印像形成方
法。(2) The method according to claim 5, wherein the temperature of the heat treatment is 500 ° C. or less.
【0077】印像の劣化を防止しながら、耐擦過性が向
上される。The abrasion resistance is improved while preventing the deterioration of the printed image.
【0078】(3)請求項5記載の発明において、被転
写体としてシート状受像体を用い、該受像体上に印像を
形成したものを別の被転写体に貼付し、そののち前記加
熱処理を施して印像を受像体に融着させる耐熱性印像形
成方法。(3) In the invention as set forth in claim 5, a sheet-shaped image receiving body is used as the object to be transferred, and an image formed on the image receiving body is attached to another object to be transferred, and then the heating is performed. A heat-resistant stamped image forming method for applying a process to fuse the stamped image to an image receiving member.
【0079】印像の形成が容易である。It is easy to form a printed image.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平3−211090(JP,A) 特開 平1−255589(JP,A) 特開 昭58−16865(JP,A) 特開 昭59−67065(JP,A) (58)調査した分野(Int.Cl.7,DB名) B41M 5/38 - 5/40 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-3-211090 (JP, A) JP-A-1-255589 (JP, A) JP-A-58-16865 (JP, A) JP-A-59-865 67065 (JP, A) (58) Field surveyed (Int. Cl. 7 , DB name) B41M 5/38-5/40
Claims (5)
溶融性インク層が設けられてなる熱転写記録材料におい
て、前記ビヒクルが熱溶融性材料と、ポリフェニレンス
ルフィド樹脂、ポリエーテルスルホン樹脂、ポリスルホ
ン樹脂、全芳香族ポリイミド樹脂、ポリアミドイミド樹
脂、ポリエーテルイミド樹脂、ポリアリレート樹脂、ポ
リエーテルエーテルケトン樹脂およびフッ素樹脂よりな
る群から選ばれた、分解、炭化温度が250℃以上であ
る、少なくとも1種の耐熱性樹脂とからなり、前記耐熱
性樹脂が微粒子状態で前記熱溶融性インク層中に25〜
65重量%含有されてなることを特徴とする熱転写記録
材料。1. A thermal transfer recording material comprising a substrate and a heat-fusible ink layer comprising a vehicle and a colorant, wherein the vehicle comprises a heat-fusible material, a polyphenylene sulfide resin, a polyether sulfone resin, and a polysulfone. Resin, wholly aromatic polyimide resin, polyamideimide resin, polyetherimide resin, polyarylate resin, polyetheretherketone resin and fluororesin , the decomposition and carbonization temperature is 250 ° C or higher.
And at least one kind of heat-resistant resin, wherein the heat-resistant resin is contained in the heat-fusible ink layer in a fine particle state in an amount of 25 to 25%.
A thermal transfer recording material comprising 65% by weight.
を与える請求項1記載の熱転写記録材料。2. The thermal transfer recording material according to claim 1, which provides an image which can withstand a high temperature of 250 to 600 ° C.
が40〜120℃のものである請求項1または2記載の
熱転写記録材料。3. The thermal transfer recording material according to claim 1, wherein the heat-fusible material has a melting point or a softening point of 40 to 120 ° C.
型層が設けられてなる請求項1〜3のいずれかに記載の
熱転写記録材料。4. The thermal transfer recording material according to claim 1, wherein a release layer is provided between the heat-fusible ink layer and the substrate.
記録材料を用いて被転写体上に印像を形成し、ついで前
記耐熱性樹脂の軟化点または融点以上でかつ600℃以
下の温度で加熱して該印像を該被転写体に熱定着させる
ことを特徴とする耐熱性印像形成方法。5. A printed image is formed on an object to be transferred by using the thermal transfer recording material according to claim 1, and a temperature not lower than the softening point or melting point of the heat-resistant resin and not higher than 600 ° C. A method for forming a heat-resistant printed image, comprising heating the image at a temperature to thermally fix the printed image on the transfer object.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP07616994A JP3212440B2 (en) | 1994-04-14 | 1994-04-14 | Thermal transfer recording material and heat-resistant image forming method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP07616994A JP3212440B2 (en) | 1994-04-14 | 1994-04-14 | Thermal transfer recording material and heat-resistant image forming method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07276811A JPH07276811A (en) | 1995-10-24 |
JP3212440B2 true JP3212440B2 (en) | 2001-09-25 |
Family
ID=13597594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP07616994A Expired - Fee Related JP3212440B2 (en) | 1994-04-14 | 1994-04-14 | Thermal transfer recording material and heat-resistant image forming method |
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JP (1) | JP3212440B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4494928B2 (en) * | 2004-10-13 | 2010-06-30 | 株式会社リコー | Thermal transfer recording medium, thermal transfer recording method, and recording medium |
-
1994
- 1994-04-14 JP JP07616994A patent/JP3212440B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JPH07276811A (en) | 1995-10-24 |
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