JP3203643U - Electronic equipment with heat dissipation structure for heat-generating parts - Google Patents

Abstract

[PROBLEMS] To effectively arrange heat-generating parts by shortening a wiring pattern used for electrical connection and disposing heat-radiating fins in a place that receives air flow without being obstructed by other parts. Provided is an electronic device having a heat-dissipating structure for heat-generating components that can dissipate heat. An electronic device includes a heat generating component mounted at a position where a wiring pattern for electrical connection on a printed wiring board is shortened, and a position on the printed wiring board where the air flow is not obstructed by other components. Or it is arrange | positioned in the arbitrary positions arrange | positioned at height, and it has the radiation fin 6 which cools the said heat-emitting component, and the wiring pattern which transmits the heat which the said heat-generating component generate | occur | produces to the heat-radiation fin 6. FIG. [Selection] Figure 1

Description

  The present invention relates to heat dissipation of an electronic device using a heat generating component such as a switching power supply device.

  The switching power supply device once converts the input direct current into a rectangular wave alternating current, and converts the direct current into a direct current to generate a desired direct current. Thus, components such as power elements, transformers, and reactors generate heat. In addition, since the rectangular wave-like alternating current has a large current change and voltage change, it is necessary to suppress the generation of noise at the place where the rectangular wave-like alternating current flows by shortening the wiring pattern.

  Therefore, in Patent Document 1, a thermal conductor such as solder is continuously formed on a copper foil on the surface layer of a printed board connected to a signal terminal of a heat generating component. The amount of heat transfer can be easily increased by lowering the thermal resistance of the portion to which the heat conductor is added.

  Further, Patent Document 2 transfers the heat generated in the power element to the back pattern by soldering a power element having a surface-mounted heat radiation fin portion on the surface and connecting it to the back pattern through a through hole. To do. Since the back surface pattern is attached to the device frame in a surface contact state via an electrically insulating sheet having heat conductivity, heat generated in the power element can be radiated to the device frame.

Japanese Patent Laid-Open No. 10-84175 JP 2006-19660 A

  Since Patent Document 1 conducts heat without enlarging the heat dissipation structure, efficient heat dissipation is possible. However, since the components are mounted on the printed wiring board, as shown in FIG. 7, the components may not be exposed to the wind and the heat may not be radiated efficiently. The switching power supply device 1 in FIG. 7 mounts the power semiconductor element 3 on the printed wiring board 2, but since the terminal block 4 is also mounted on the printed wiring board 2, the power semiconductor element 3 and the power semiconductor are blocked by the terminal block 4. Air flow is not directly applied to the wiring pattern connected to the terminal of the element. For this reason, it is not possible to dissipate heat effectively.

  In Patent Document 2, heat generated by the power element is transmitted through the wiring pattern and radiated from the device frame, so that the structure is not affected by the flow of air due to other components.

  In order to effectively dissipate heat, heat dissipating fins are often provided. However, the arrangement of parts for shortening the wiring pattern does not necessarily match the place where the air flow is received without being disturbed by other parts. Further, since the heat dissipating fins generally have conductivity, it is necessary to insulate from other parts, and therefore, the arrangement is restricted. The present invention is advantageous in that the heat generating parts are arranged so that the wiring pattern used for electrical connection is shortened, and the radiation fins are arranged in a place where the air flow is received without being obstructed by other parts. It is the electronic device provided with the heat dissipation structure which can thermally radiate.

  The electronic device of the present invention has a heat generating component mounted at a position where the wiring pattern for electrical connection on the printed wiring board is shortened, and a position or height at which the air flow is not obstructed by other components on the printed wiring board. The heat dissipating structure includes a heat dissipating fin that cools the heat generating component and a wiring pattern that transmits heat generated by the heat generating component to the heat dissipating fin.

  The switching power supply device of the present invention can dissipate heat effectively by arranging parts to shorten the wiring pattern and disposing heat radiation fins in a place where the air flow is received without being obstructed by other parts.

The perspective view which shows Example 1 of this invention Sectional drawing which shows the structure of the power semiconductor of Example 1 of this invention, and a radiation fin The side view explaining the flow of the air of Example 1 of this invention The perspective view which shows Example 2 of this invention The top view explaining the flow of the air of Example 2 of the present invention The front view which shows Example 2 of this invention Side view for explaining the air flow of the conventional example

  A first embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is a perspective view showing Embodiment 1 of the present invention. In the first embodiment, radiating fins 6 are added to the conventional example of FIG. FIG. 2 is an enlarged cross-sectional view of the radiation fin 6 and the power semiconductor element 3. As shown in FIG. 2, the power semiconductor element 3 is connected to a wiring pattern 8 of a printed wiring board. Furthermore, the wiring pattern 8 is connected to the radiation fin 6. At this time, no current flows through the wiring pattern between the power semiconductor element 3 and the radiation fin 6. For this reason, the heat generated in the power semiconductor element 3 is transmitted to the radiation fins 6 through the wiring pattern 8. Since the radiating fin 6 is made higher than the terminal block 4, the air flowing on the terminal block directly hits the radiating fin 6 without being obstructed by other components and cools the radiating fin 6. For this reason, since the power semiconductor element 3 is attached with the radiation fins via the wiring pattern 6, the power semiconductor element 3 is easily cooled by the radiation fins with a simple structure.

  In the first embodiment, the power semiconductor element 3 is radiated by the heat radiation fin 6 by making the heat radiation fin 6 higher than the other components, but the heat radiation fin 6 may not be made higher depending on the structure of the switching power supply device. In the second embodiment, the radiation fins are arranged at positions where the air flow is not obstructed by other components, and the wiring pattern is extended to thermally couple the power semiconductor element and the radiation fins to radiate heat.

  FIG. 4 is a perspective view showing Embodiment 2 of the present invention. In the second embodiment, the wiring pattern 8 for transmitting the heat generated by the power semiconductor element 3 is extended to a place where there are no other parts that obstruct the air flow, and the radiation fins 7 are attached thereto. As shown in FIG. 5, since the air flow is not hindered by other components, the power semiconductor element 3 can be easily cooled by the radiation fins with a simple structure. FIG. 6 is a side view as seen from the surface to which the terminal block 4 is attached. Thus, the radiation fin 6 is arrange | positioned in the position where the flow of air is not inhibited by other components. In this case, since there is no need for the wiring pattern 8 to pass a current, the wiring pattern in the portion where the rectangular wave AC flows does not increase. Further, there is a heat dissipation effect by the wiring pattern 8. Since heat is transmitted by the wiring pattern, the heat can be dispersed even if the components that generate heat are concentrated.

In the first and second embodiments, the power semiconductor element is taken as an example of the component that generates heat. However, the present invention is not limited to the semiconductor element. Heat-generating components such as transformers, reactors, resistors, and the like also have the same effect when the terminals and heat-dissipating fins arranged at arbitrary positions are thermally coupled by a wiring pattern.
Moreover, although Example 1 and Example 2 are natural air cooling, this invention is not limited to this. The same effect can be obtained by using the present invention even in forced air cooling using a heat radiating fan.

  Since the heat generating component is effectively dissipated, it can be used for heat dissipation of electronic equipment such as a switching power supply.

DESCRIPTION OF SYMBOLS 1 Switching power supply device 2 Printed wiring board 3 Power semiconductor element 4 Terminal block 5 Connector 6, 7 Radiation fin 8 Wiring pattern

Claims (2)

A heat-generating component mounted on a printed wiring board;
Arranging at an arbitrary position on the printed circuit board, and radiating fins for cooling the heat generating component,
An electronic apparatus comprising: a wiring pattern that transmits heat generated by the heat generating component to the heat radiating fins. The heat generating component is mounted at a position where a wiring pattern for electrical connection is shortened,
The electronic device according to claim 1, wherein the heat radiating fin is disposed at a position or a height at which the air flow is not obstructed by another component.

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