JP3194385B2 - Manufacturing method of heat resistant resin molded product - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a polyarylene sulfide resin (hereinafter referred to as a PAS resin), a polyphenylene oxide (hereinafter referred to as a PPO), a polysulfone (hereinafter referred to as a PSF), a polycarbonate (hereinafter referred to as a PC). ), Polyarylate (hereinafter, PAr)
The present invention relates to a method for producing a molded article of a resin composition comprising a polyetherimide (hereinafter, referred to as PEI) and the like, and the molded article obtained by the present invention has heat resistance,
Because of its excellent rigidity etc., for example, precision parts, various electrical
Used as electronic parts, mechanical parts, automotive parts, etc.

[0002]

2. Description of the Related Art Polyphenylene sulfide (hereinafter referred to as PP)
PA) resins represented by S) are excellent in heat resistance, chemical resistance, flame retardancy, dimensional stability and the like, but are inferior in mechanical properties such as impact resistance and glass transition temperature ( T
g) is relatively low (eg, PPS is about 85
° C) and a sharp decrease in the elastic modulus in a temperature range of Tg or higher is pointed out as a defect. Amorphous plastics with high Tg such as PPO, PSF, PC, PAr, PEI etc. to improve the impact resistance of PAS resin and the decrease in elastic modulus in the temperature range above Tg. The method of adding is also known. For example, regarding PPO, Japanese Patent Publication No. 56-34032 discloses PSF and PC and P
Regarding PO, see US Pat. No. 4,021,596 and the like.
PAr is disclosed in JP-A-53-57255. However, in these methods, impact resistance and T
Although the decrease in the elastic modulus in the temperature range of g or more is improved,
There is a disadvantage that heat resistance such as heat distortion temperature, which is a characteristic of PAS-based resins, is impaired.

[0003]

SUMMARY OF THE INVENTION The present invention relates to a molded article obtained by melt-molding a resin composition containing a PAS resin and at least one thermoplastic resin selected from PPO, PSF, PC, PAr and PEI. It is an object of the present invention to improve heat resistance such as heat distortion temperature without lowering impact resistance and elastic modulus in a temperature range higher than Tg of PAS which have been improved up to now.

[0004]

According to the present invention, a polyarylene sulfide resin, at least one kind of thermoplastic resin selected from polyphenylene oxide, polysulfone, polycarbonate, polyarylate and polyetherimide, and a filler may be used. The present invention relates to a method for producing a molded article having excellent heat resistance, which is obtained by subjecting a molded article obtained by melt-molding a resin composition containing the composition to a specific method.

The PAS resin used in the present invention has the structural formula
PAS represented by —Ar—S— (Ar: arylene group)
It is a system resin. Here, Ar of the arylene group is p-phenylene, m-phenylene, o-phenylene , (-φ-O
-Φ-) , (-φ-CH ₂ -φ-) , (-φ-SO ₂ -φ
-), (-Φ-C (CH ₃ ) ₂ -φ-) (provided that -φ- is a p-phenylene group and will be similarly described below).
A divalent aromatic residue selected from the group , and a substituent such as F, Cl, Br, or CH3 may be introduced into each aromatic ring. This may be a homopolymer, a random copolymer, or a block copolymer, and a linear, branched, or crosslinked type, or a mixture thereof is used.

The PAS resin has a melt viscosity of 10 to 10 ⁵ poise, preferably 50 to 50 poise at 10 rad / sec in the temperature range of the melting point plus 20 ° C.
000 poise is used.

Preferred PAS resins for use in the present invention are polyphenylene sulfide (PPS) and PP
S part and polyphenylene sulfide sulfone (PPS
It is a block copolymer consisting of (S) portions.

[0008] PPS is a polymer containing 70 mol%, particularly preferably 90 mol% or more, of a structural unit represented by (-φ-S-). The other constituents contained in the PPS are mainly the above-mentioned arylene sulfide groups.

Such PPS can be prepared, for example, by reacting (1) the reaction of a halogen-substituted aromatic compound with an alkali sulfide (US Pat.
No. 51188, JP-B-44-27671 and JP-B-45-3368), and (2) a condensation reaction of thiophenols in the presence of an alkali catalyst or a copper salt (US Pat. No. 3,274,165; 116
No. 0660), and (3) a condensation reaction of an aromatic compound with sulfur chloride in the presence of a Lewis acid catalyst (JP-B-46-2).
No. 7255, Belgian Patent No. 29437) and the like, and can be arbitrarily selected according to the purpose.

[0010]

A block copolymer comprising a PPS portion and a PPSS portion is typically prepared by previously synthesizing a polymer having a chlorophenyl group as a reaction terminal group and a polymer having a sodium sulfide group in advance, and reacting the two in a solvent. It can be obtained by running it. Although the ratio of the PPS portion in the block copolymer varies depending on the purpose of use and the like, it cannot be unconditionally determined, but is usually 20 to 80 mol%.
, Preferably in the range of 30 to 70 mol%. Outside this range, the characteristics of the block copolymer are not preferably exhibited. In addition, PPSS is mainly (-φ-
And a polymerization method such as dihalo aromatic sulfone such as 4,4'-dichlorodiphenyl sulfone and alkali metal sulfide such as sodium sulfide. In an organic amide solvent.

The PPO used in the present invention is also called polyphenylene ether (abbreviated as PPE), and can be obtained by polycondensing at least one kind of monocyclic phenol represented by the following general formula [1]. .

[0013]

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(However, R ₁ is a lower alkyl group having 1 to 3 carbon atoms, R ₂ and R ₃ are hydrogen or a lower alkyl group having 1 to 3 carbon atoms, and at least one ortho position of the hydroxyl group is always a lower alkyl group.) An alkyl substituent must be present.) The PPO may be a homopolymer or a copolymer.

The monocyclic phenol represented by the above formula [1] includes, for example, 2,6-dimethylphenol,
6-diethylphenol, 2,6-dipropylphenol, 2-methyl-6-ethylphenol, 2-methyl-
6-propylphenol, 2-ethyl-6-propylphenol, m-cresol, 2,3-dimethylphenol, 2,3-diethylphenol, 2,3-dipropylphenol, 2-methyl-3-ethylphenol, −
Methyl-3-propylphenol, 2-ethyl-3-methylphenol, 2-ethyl-3-propylphenol, 2-propyl-3-methylphenol, 2-propyl-3-ethylphenol, 2,3,6-trimethyl Phenol, 2,3,6-triethylphenol, 2,
3,6-tripropylphenol, 2,6-dimethyl-
3-ethyl-phenol, 2,6-dimethyl-3-propylphenol, and the like.

Examples of the PPO obtained therefrom include poly (2,6-dimethyl-1,4-phenylene) ether, poly (2,6-diethyl-1,4-phenylene) ether and poly (2,6 -Dipropyl-1,4-phenylene) ether, poly (2-methyl-6-ethyl-)
1,4-phenylene) ether, poly (2-methyl-6)
-Propyl-1,4-phenylene) ether, poly (2
-Ethyl-6-propyl-1,4-phenylene) ether, 2,6-dimethylphenol / 2,3,6-trimethylphenol copolymer, 2,6-dimethylphenol / 2,3,6-triethylphenol copolymer Polymer, 2,6
-Diethylphenol / 2,3,6-trimethylphenol copolymer, 2,6-dipropylphenol / 2
3,6-trimethylphenol copolymer, poly (2,6-dimethyl-1,4-phenylene) ether, 2,6-dimethylphenol / 2,3,6, -trimethylphenol copolymer, etc. And the like.

In particular, the preferred PPO for use in the present invention
Is a poly (2,6-dimethyl-1,4-phenylene) ether and a 2,6-dimethylphenol / 2,3,6-trimethylphenol copolymer.

PSF is defined as a polyarylene compound in which the arylene units are located randomly or orderly with ether and sulfone linkages, for example,
The following structural formulas (a) to (r) (wherein -Df- is 3,6-dibenzofuranylene, -Np- is 2,7-naphthylene,
-Ph represents a phenyl group, and n represents an integer of 10 or more.
A compound having the structure of (a) or (f) is preferable. These may be a simple substance or a block copolymer. Examples of the block copolymer include (a) and (b) block copolymers, (f) and PC block copolymers, and (f) and PAr block copolymers.

[0019]

As the PC, a homogeneous PC or a PC copolymer based on one or more of the following bisphenols can be used. Hydroquinone, resorcin, dihydroxydiphenyl, bis- (hydroxyphenyl) -alkane, bis- (hydroxyphenyl) -cycloalkane,
Bis- (hydroxyphenyl) -sulfide, bis-
(Hydroxyphenyl) -ketone, bis- (hydroxyphenyl) -ether, bis- (hydroxyphenyl)
-Sulfoxides, bis- (hydroxyphenyl) -sulphones and α, α'-bis- (hydroxyphenyl) -diisopropylbenzene and their compounds in which the nucleus is substituted by alkyl or halogen.

Specific examples of preferred bisphenols include 4,4-dihydroxydiphenyl and
2,2-bis- (4-hydroxyphenyl) -propane, 2,4-bis- (4-hydroxyphenyl) -2-
Methylbutane, 1,1-bis- (4-hydroxyphenyl) -cyclohexane, α, α′-bis- (4-hydroxyphenyl) -p-diisopropylbenzene, 2,2
-Bis- (3-methyl-4-hydroxyphenyl) -propane, 2,2-bis- (3-chloro-4-hydroxyphenyl) -propane, bis- (3,5-dimethyl-4)
-Hydroxyphenyl) -methane, 2,2-bis-
(3,5-dimethyl-4-hydroxyphenyl) -propane, 2,2-bis- (3,5-dimethyl-4-hydroxyphenyl) -sulfone, 2,4-bis- (3,5
-Dimethyl-4-hydroxyphenyl) -2-mercaptan, 1,1-bis- (3,5-dimethyl-4-hydroxyphenyl) -cyclohexane, α, α'-bis-
(3,5-dimethyl-4-hydroxyphenyl) -p-
Diisopropylbenzene, 2,2-bis- (3,5-dichloro-4-hydroxyphenyl) -propane and 2,2-bis- (3,5-dibromo-4-hydroxyphenyl) -propane, and the like, and are preferred. Is 2,2
-Bis- (4-hydroxyphenyl) propane, 2,2
-Bis- (3,5-dimethyl-4-hydroxyphenyl) -propane, 2,2-bis- (3,5-dichloro-
4-hydroxyphenyl) -propane, 2,2-bis-
(3,5-dibromo-4-hydroxyphenyl) propane and 1,1-bis- (4-hydroxyphenyl)-
Cyclohexane is mentioned.

Preferred PCs are based on the preferred bisphenols described above. Particularly preferred PC copolymers are copolymers of 2,2 bis- (4-hydroxyphenyl) -propane with one of the above particularly preferred other bisphenols.

Another particularly preferred PC is 2,2-bis- (4
-Hydroxyphenyl) -propane or 2,2-bis- (3,5-dimethyl-4-hydroxyphenyl) -propane alone.

Incidentally, PC can be prepared by a known method, for example,
It can be produced by a method such as a melt transesterification reaction between nor and difenic carbonate, and a two-phase interfacial polymerization method between bisphenol and phosgene.

PAr is a polyester synthesized from bisphenol or its derivative and dibasic acid or its derivative. Examples of bisphenols include 2,2-
Bis- (4-hydroxyphenyl) -propane, 4,
4'-dihydroxy-diphenyl ether, 4,4'-
Dihydroxy-3,3'-dimethyldiphenyl ether, 4,4'-dihydroxy-3,3'dichlorodiphenyl ether, 4,4'-dihydroxy-diphenyl sulfide, 4,4'-dihydroxy-diphenyl sulfone, 4,4'-dihydroxy-diphenyl ketone, bis- (4-hydroxyphenyl) -methane, 1,1-bis- (4-hydroxyphenyl) -ethane, 1,1-bis- (4-hydroxyphenyl) -n -Butane, di- (4
-Hydroxyphenyl) -cyclohexyl-methane,
1,1-bis- (4-hydroxyphenyl) -2,2
2-trichloroethane, 2,2-bis- (4-hydroxy-3,5-dibromophenyl) -propane, 2,2-
Bis- (4-hydroxy-3,5-dichlorophenyl)
-Propane and the like, and particularly preferred are
It is called 2,2-bis- (4-hydroxyphenyl) -propane or bisphenol A.

Examples of dibasic acids include aromatic dicarboxylic acids such as isophthalic acid, terephthalic acid, bis- (4
-Carboxy) -diphenyl, bis- (4-carboxyphenyl) -ether, bis- (4-carboxyphenyl) -sulfone, bis- (4-carboxyphenyl)-
Carbonyl, bis- (4-carboxyphenyl) -methane, bis- (4-carboxyphenyl) -dichloromethane, 1,2- and 1,1-bis- (4-carboxyphenyl) -ethane, 1,2- and 2 , 2-bis- (4
-Carboxyphenyl) -propane, 1,2- and 2,2-bis- (4-carboxyphenyl) -1,1-
Dimethylpropane, 1,1- and 2,2-bis- (4
-Carboxyphenyl) -butane, 1,1- and 2,
2-bis- (4-carboxyphenyl) -pentane,
3,3-bis- (4-carboxyphenyl) -heptane, 2,2-bis- (4-carboxyphenyl) -heptane; and aliphatic acids such as oxalic acid, adipic acid, succinic acid, malonic acid, sebacic acid , Glutaric acid, azelaic acid, speric acid, etc., and a mixture of isophthalic acid and terephthalic acid or a derivative thereof is preferable.

PEI has the following formula [2].

[0028]

Embedded image

In the above formula, —O—Q ₁ —O— is bonded at the 3 or 4 and 3 ′ or 4 ′ position, and Q ₁ is
The following equation [3] to equation [5]

[0030]

Embedded image

A divalent substituted or unsubstituted aromatic group such as
Alternatively, it is selected from divalent substituted or unsubstituted aromatic derivative groups. Here, Q ′ is independently C ₁ -C ₆ alkyl, aryl or halogen. Q ₃ is —O—,
-S -, - CO -, - SO 2 -, - SO-, 1~ carbon atoms
Selected from cycloalkylene having 6 carbon atoms, alkylidene having 1 to 6 carbon atoms and cycloalkylidene having 4 to 8 carbon atoms;
₂ represents an aromatic hydrocarbon group having 6 to 20 carbon atoms and a halogenated derivative thereof (where the alkyl group is 1
Containing 6 carbon atoms), alkylene and cycloalkylene groups and C ₂ ~ having 2 to 20 carbon atoms
It is a polydiorganosiloxane having a C ₈ alkylene as a terminal group or the formula [5].

In the present invention, the mixing ratio of the resin component varies depending on the resin used and cannot be unconditionally specified. However, the thermoplastic resin is usually 5 to 140 parts by weight, particularly preferably 100 parts by weight of the PAS resin. Is 8-12
0 parts by weight. When the amount of the thermoplastic resin is less than 5 parts by weight, the effect of modifying the PAS-based resin is not exhibited, and when the amount exceeds 140 parts by weight, properties such as moldability and heat resistance are undesirably reduced. These resins may be modified with an acid or the like, or may be used in combination.

The fillers usable in the present invention include fibrous fillers such as carbon fiber, glass fiber, silane glass fiber, ceramic fiber, aramid fiber, boron fiber, metal fiber, asbestos, whisker, and titanate. Potassium, silicon carbide, and the like.Particulate fillers include barium sulfate, calcium sulfate, clay, virophilite, bentonite, sericite, zeolite, mica, mica, talc, atalpargite, ferrite, calcium silicate, and carbonic acid. Calcium, magnesium carbonate, glass beads and the like. These may be used in combination. The addition amount of these fillers varies depending on the type of the additives, and thus is not generally specified. However, usually, 3 to 300 parts by weight is used based on 100 parts by weight of the whole resin. In particular, in the case of a particulate filler, 80 parts by weight or less is used.

In the composition used in the present invention, a small amount of a releasing agent, a color-enhancing agent, a heat-resistant stabilizer, a UV-ray stabilizer, a foaming agent, a rust-proofing agent is added as an additive within a range not departing from the object of the present invention. Agents and the like can be included. Furthermore, the following resins can be mixed and used in the composition used in the present invention. Homopolymers or copolymers of monomers such as ethylene, propylene, pentene, butadiene, isoprene, chloroprene, styrene, α-methylstyrene, vinyl acetate, acrylate, (meth) acrylonitrile, polyurethane, polyethylene terephthalate and poly Examples include homopolymers and various copolymers of polyester such as butylene terephthalate, polyacetal, polyetheretherketone, polyamide, phenoxy resin, silicone resin, fluorine resin, epoxy resin, phenol resin and the like. Two or more of these resins may be used in combination. Further, a modified product with an acid or the like may be used.

The above resin composition can be melt-molded by various known methods. PAS resin, the above thermoplastic resin and optional fillers are added to a tumbler or Henschel mixer. For example, a method of uniformly mixing and feeding the mixture to a single-screw or twin-screw extruder, melt-kneading, pelletizing, subjecting the resulting mixture to a molding machine, and melt-molding the resulting mixture is preferable.

Examples of the melt molding method of the composition include injection molding, extrusion molding, and compression molding, and among them, injection molding is particularly preferable.

The present invention is characterized in that the molded article obtained as described above is subjected to a heat treatment. The conditions cannot be specified unconditionally because the conditions differ depending on the type of thermoplastic resin used and the mixing ratio of the resin. Usually, the processing temperature is preferably P
The melting point of AS resin minus 5-5 melting point minus 100C,
Particularly preferably, the melting point of the PAS-based resin is minus 8 to the melting point minus 80 ° C. Although the treatment time varies relatively depending on the treatment temperature, it is usually preferably 1 hour or more, more preferably 3 hours or more. The upper limit of the heat treatment time is not particularly limited, but is preferably 1000 hours or less.

The method of heat-treating the molded article is not particularly limited, but a method of heating for a predetermined time in a heating device maintained at a predetermined temperature is suitable. Although there is no particular limitation on the heating device, for example, a hot air circulation type electric open or the like is used.

In the molded article heat-treated in this way, the heat distortion temperature was improved by 10 ° C. or more, and no decrease in impact strength due to the heat treatment was observed, which was observed with the PAS resin alone. The reason why such effects of the present invention are manifested is unknown, but it is presumed that the heat treatment causes a crosslinking reaction and the like in the resin even in the solid phase.

The molded product obtained by the present invention is, for example,
Electrical and electronic components such as connectors, printed circuit boards, molded products, lamp reflectors, automotive components such as various electrical components, interior components such as various buildings and aircraft and automobiles,
Audio equipment parts such as tennis rackets, skis, golf clubs, leisure sports equipment such as fishing rods, enclosures such as speakers, back decks such as wind instruments, OA equipment parts, camera parts, It is useful as a method for manufacturing molded articles used in various molding fields such as injection molding and compression molding of precision parts such as timepiece parts, and extrusion molding and drawing molding of composites, sheets and pipes.

[0041]

The present invention will be described below in more detail with reference to examples. Note that the present invention is not limited to only these examples.

Example 1, Comparative Example 1 70 parts by weight of PPS and 30 parts by weight of PPO were melt-kneaded at 320 ° C. in an extruder to form a pellet, and then the test piece was molded using an injection molding machine. Created. The obtained test piece was 26
Heat treatment was performed at 5 ° C. for 4 hours. The Izod impact test (without notch), the thermal deformation temperature, and the temperature dependence of the complex modulus were investigated. Izod impact strength, heat distortion temperature, and 3
Table 1 shows the storage modulus [E '] at 1 Hz of 0 ° C, 80 ° C, 130 ° C, and 180 ° C.

As Comparative Example 1, a similar study was conducted for the case where no heat treatment was performed. The results are shown in Table 1.

The PPS is manufactured by Dainippon Ink and Chemicals, Inc.
600 and PPO is poly (2,6-dimethyl-1,4-
(Phenylene) ether was used. The melting point of PPS is 285
° C and the dynamic viscosity at 305 ° C and 10 rad / sec was about 2000.

[Examples 2 to 5, Comparative Examples 2 to 5] In the case of using PSF, PC, PAr, and PEI instead of PPO, the same examination as in Example 1 and Comparative Example 1 was performed. The melt-kneading temperature was 310 ° C for PC and 3 for others.
40 ° C. The results are shown in Table 1.

The PSF is UDEL P manufactured by Amoco.
-3703, PC used Iupilon S-2000 manufactured by Mitsubishi Gas Chemical Company, PAr used U-polymer U-100 manufactured by Unitika, and PEI used Ultem 1000 manufactured by General Electric.

[0047]

[Table 1]

Examples 6 and 7 In the case where the heat treatment time was set to 2 hours and 12 hours,
The same study as in Example 1 was performed. The results are shown in Table 2.

Examples 8 and 9 In the case where the heat treatment time was set to 2 hours and 12 hours,
The same study as in Example 4 was performed. The results are shown in Table 2.

[0050]

[Table 2]

Example 10, Comparative Example 6 70 parts by weight of PPS, 30 parts by weight of PPO, PPS and PP
A sample was prepared in the same manner as in Example 1 using 67 parts by weight of glass fiber with respect to 100 parts by weight of O in total. An Izod impact test (with no notch) and a thermal deformation test were performed.
Further, as a comparative example, a similar study was conducted for a case where no heat treatment was performed. The results are shown in Table-3.

[Reference Examples 1 and 2] For PPS alone, samples were prepared in the same manner as in Example 1 and Comparative Example 1, and an Izod impact test (no notch) was performed. When heat-treated, it is very brittle and difficult to measure, and the Izod impact strength is 1 (Kg · c
m / cm ² ) or less, and 3 (Kg
Cm / cm ² ). It can be seen that the heat treatment significantly reduces the impact resistance.

[Production Example] (Synthesis of Block Copolymer Consisting of PPS and PPSS Parts) In a 10-liter (L) autoclave, 1980 g of n-methylpyrrolidone (NMP), 388 g of sodium hydrosulfide 1.2 hydrate, and water Sodium oxide 2
00g, bis (p-chlorophenyl) sulfone 1436
g, and reacted at 200 ° C. for about 6 hours under a nitrogen atmosphere. Further, bis (p-chlorophenyl) sulfone 72
g of NMP and 200 g of NMP were added and reacted at 200 ° C. for 1 hour to obtain a slurry of a chloro-terminal PPSS reaction product.

Next, NMP 3 was placed in a 10 L autoclave.
100 g, sodium hydrosulfide 1.2 hydrate 597.5
g, and 308 g of sodium hydroxide, and the temperature was increased while allowing water to flow out. After dehydration, the autoclave was sealed. At 220 ° C., 1029 g of p-dichlorobenzene was added to the dehydrated system. 700 g of NMP was added by press-in, and further reacted at a temperature of 260 ° C. for 2 hours.
A slurry of a PPS reactant having a terminal sodium sulfide group was obtained.

The PPSS reactant slurry and the PPS reactant slurry were charged into an autoclave, reacted at 220 ° C. for 3 hours, and purified by a known method.
A part by weight of a block copolymer (PTES) was obtained.

The melting point of PTES is 270 ° C.
The dynamic viscosity measured at 10 rad / sec was about 2000 poise.

Example 11, Comparative Example 7 With respect to 60 parts by weight of PTES, 40 parts by weight of PPO, and 100 parts by weight of PTES and PPO in total, 67 parts by weight of glass fiber were melt-kneaded at 330 ° C. using an extruder. Then, after pelletizing, a sample piece was prepared using an injection molding machine.
The sample piece was heat-treated at 250 ° C. for 3 hours, and subjected to an Izod impact test (no notch) and a thermal deformation test.
The same study was conducted as a comparative example in the case where no heat treatment was performed. The results are shown in Table-3.

Example 12, Comparative Example 8 In the case where PAr was used instead of PPO, the same study as in Example 11 and Comparative Example 7 was performed. Table 3 shows the results.
Shown in

[0059]

[Table 3]

[0060]

According to the production method of the present invention, a molded article having improved heat resistance, dimensional stability, water resistance, flame retardancy, moldability, impact resistance, flexibility, elastic modulus in a high temperature range, and the like can be obtained. It is possible to get.

────────────────────────────────────────────────── ─── Continued on the front page (51) Int.Cl. ⁷ Identification code FI C08L 79/08 C08L 79/08 81/02 81/02 81/06 81/06 // B29K 81:00 (72) Inventor Matsuki Keiko 1550-2 Rokuzaki, Sakura City, Chiba Prefecture (56) References JP-A-64-40015 (JP, A) JP-A-54-146867 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB Name) B29C 71/00-71/04 C08J 7/00 B29C 45/00 B29C 45/72 B29C 47/00 B29C 47/78-47/90 B29C 43/00 B29C 43/52

Claims (4)

(57) [Claims] (A) Structural formula -Ar-S- (where Ar is p-phenylene, m-phenylene, o
-Phenylene , (-φ- O-φ-) , (-φ-CH ₂ -φ
−), ( −φ −SO ₂ −φ −) (− φ−C (CH ₃ ) ₂ −
φ-) (However, -φ- is a p-phenylene group.)
At least one member selected from the group consisting of polyarylene sulfide resin represented by a divalent aromatic residue selected from the group consisting of: (B) polyphenylene oxide, polysulfone, polycarbonate, polyarylate and polyetherimide A method for producing a heat-resistant resin molded product, comprising heat-treating a molten molded product obtained from a resin composition containing a thermoplastic resin. 2. A (A) polyarylene sulfide resin, (B) at least one thermoplastic resin selected from the group consisting of polyphenylene oxide, polysulfone, polycarbonate, polyarylate and polyetherimide, and (C) a filler. And subjecting the melt-molded product obtained from the resin composition comprising a heat treatment to a heat-resistant resin molded product. 3. The method for producing a heat-resistant resin molded article according to claim 1, wherein the heat treatment temperature is from the melting point of the polyarylene sulfide-based resin minus 5 ° C. to the melting point minus 100 ° C. 4. The method for producing a heat-resistant resin molded product according to claim 1, wherein the thermoplastic resin is polyphenylene oxide or polysulfone.