JP3187742B2 - Wiring board manufacturing method, liquid crystal element manufacturing method, and wiring board manufacturing apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for producing a wiring board features a transparent electrode and a metal wire, a method of manufacturing a liquid crystal device using the wiring substrate, and a manufacturing apparatus of the wiring board.

[0002]

2. Description of the Related Art Conventionally, liquid crystal display elements for displaying information using liquid crystal have been used in various fields.
With the recent demand for higher definition and larger area, the structure has been changing as follows (1) to (4). (1) As shown in FIG. 1 (a), the initial liquid crystal display device has a pair of glass substrates 1, 1 arranged substantially in parallel, and these glass substrates 1, 1 are sealed by a sealing member 2. The liquid crystal 3 was held in the internal gap. On the surface of each of the substrates 1 and 1, a number of transparent electrodes 6 made of ITO (indium tin oxide) or the like as shown in FIG.
An insulating film 7 and an orientation control film 9 were formed on the surfaces of these transparent electrodes 6,. And these transparent electrodes 6,
By applying a predetermined pulse signal ..., I was driving the liquid crystal display element P _1.

However, since the transparent electrodes 6,... Have a large resistance, a delay in a voltage waveform has been a problem with an increase in a display area, a high definition, and a high speed driving of a liquid crystal.

It is conceivable to reduce the resistance by increasing the thickness of the transparent electrodes 6, but it takes time and cost to form the transparent electrodes 6,..., And the adhesion to the glass substrate 1 is poor. There was a problem of becoming. (2) In order to solve such a problem, an arrangement in which a low-resistance metal wiring is arranged on the back surface of the transparent electrode (the surface on the side of the glass substrate) is disclosed in JP-A-6-347810.

As shown in FIG. 2A, the liquid crystal display element P ₂ has a pair of wiring boards 10 arranged in parallel. As shown in detail in FIG. 1B, the wiring substrate 10 includes a transparent glass substrate 11, and on the surface of the glass substrate 11, stripe-shaped metal wirings 12,
Are formed in large numbers. These metal wirings 12,... Are arranged with a predetermined gap therebetween. In the gap, an insulating layer, specifically, an ultraviolet curing resin (UV curing resin) 13,
... are filled. The resin 13,... Together with the metal wirings 12,... Form a substantially smooth surface, and a large number of transparent electrodes 6,.

Next, a method for manufacturing such a wiring board 10 will be briefly described with reference to FIGS. (Metal Wiring Forming Step) First, a metal layer having a thickness of about 1 μm is formed on the surface of a glass substrate 11 by a sputtering method or the like, and the metal layer is patterned by a photolithography method or the like. Are formed in large numbers. As a result, the structure (hereinafter referred to as “metal wiring board A ₁ ”) denoted by reference numeral A ₁ in FIG.
The surface on the side where the metal wirings 12,... In ₁ are formed is referred to as “wiring surface 15”.) (Resin Supply Step) Next, a smooth plate-like member 16 (hereinafter, referred to as a
On the surface of the "type substrate 16" and), see UV curing resin 13L liquid using a dispenser 17 was added dropwise a predetermined amount (FIG. (A)), stacked and this type substrate 16 and the metal wiring board A ₁ (Refer to FIG. 2 (b). Hereinafter, the liquid UV curable resin before being cured is represented by reference numeral 13L, and the UV curable resin after curing is represented by reference numeral 13S. Resin 13 ″). Thus, UV curing resin 13L is to be supplied to the metal wiring mutually gap (hereinafter, the structure A ₂ which sandwich the UV curing resin 13L at -type substrate 16 and the metal wiring board A ₁ "under pressure the body a ₂ "). (Resin molding step) Next, (see Fig. (C) and (d)) to be pressure body A ₂ was set in a press 19, in addition to pressing pressure F _1, a mold substrate 16 metal wires 12, ...
Thereby, the UV curable resin 13L is connected to the metal wiring 12,.
Completely or from the surface of the metal wiring 12 to such an extent that it remains very thinly. Reference numerals 19a, 19b
Is a press plate of a press machine. (Resin curing step) Thereafter, the pressed body A ₂ is
Then, ultraviolet light L (hereinafter, referred to as “UV light L”) is irradiated in that state (see FIG. 4E). By this UV light irradiation, the UV curable resin 13 is cured. (Stripping step) Then, after the curing of the UV curable resin 13 is completed, separating the molding substrate 16 by applying force in the direction of the illustrated F ₂ by the release apparatus (not shown) (FIG. (F) and (g) reference). (Transparent electrode forming step) Thereafter, the transparent electrodes 6,... Are formed on the surfaces of the cured UV curable resin 13S and the metal wirings 12,.
Is formed by a method such as a sputtering method and then patterned by a photolithography method or the like (see FIG.
(h)). (Other Steps) Next, an insulating film 7 and an orientation control film 9 are formed on the surfaces of the transparent electrodes 6, and a rubbing process is performed on the surface of the orientation control film 9. Further, the two wiring boards 10, 10
And a liquid crystal 3 is injected into the gap to form a liquid crystal display element.

By the way, in such a wiring board 10, it is needless to say that it is necessary to ensure insulation between adjacent electrodes. To this end, the transparent electrode 6 and the metal wiring adjacent to the transparent electrode 6 are required. It was necessary to provide a gap W between the first and second substrates 12 (see FIG. 3H). Therefore, even if the manufactured liquid crystal display element is driven, no voltage is applied to the liquid crystal 3 in the portion of the gap W, and this portion does not contribute to image display, and is in a state where light is always transmitted.
There is a problem that the image quality is reduced accordingly. (3) On the other hand, FIG.
Has been proposed as shown in FIG.

In the wiring board 20, for example, a metal light-shielding layer 21,... Is arranged in a region corresponding to the gap W on the glass substrate 11, so as to prevent light transmission in that region. Have been.

However, in such a wiring board 20, a region having a width larger than the metal wiring width is shielded from light. For this reason, the amount of light transmitted through the liquid crystal display element is reduced, so that the so-called aperture ratio is reduced, and there is a problem that an image is darkened. Further, the necessity of forming the light shielding layers 21,... Complicates the manufacturing process and raises the manufacturing cost. (4) In order to solve such a problem, a wiring board with a special shape of an insulating layer and a method of manufacturing the same are disclosed in
No. 63019.

FIG. 5 is a cross-sectional view showing the structure of the wiring board 30. The wiring board 30 has a glass substrate 11. On the surface of the glass substrate 11, metal wirings 12A, 12B,... Are formed with a predetermined gap therebetween. In the gap between the metal wirings, insulating layers 33 made of photosensitive polyimide or the like are arranged. I have.

Each insulating layer 33 has a thick portion 33a thicker than the metal wiring 12, and has a width direction end 33b.
Are formed to be inclined so that the thickness gradually decreases. Further, the central portion in the width direction of the metal wiring 12 is located on the insulating layer 3.
3 and is exposed.

Further, on the surfaces of the insulating layers 33,... And the metal wirings 12,.
... are formed. Each of the transparent electrodes 36 extends in a direction perpendicular to the paper along the metal wiring 12. In the transparent electrode 36, one edge 36a in the width direction is in contact with one metal wiring 12A, and the other edge 36b is almost at the edge E of another metal wiring 12B adjacent to the metal wiring 12A. They are arranged to match.

Next, an example of a method for manufacturing the wiring board 30 will be described with reference to FIGS. 6 (a) to 6 (d).

First, the metal wiring 1 is formed on the surface of the glass substrate 11.
2, to form a ..., to produce a metal wiring board A ₁ (FIGS. 6 (a)
reference).

[0015] Then, the metal wiring board A _1, is coated with a photosensitive resin 33L liquid by spin coating or the like (FIG. (B)
reference). It is assumed that the thickness to be applied is thicker than the metal wirings 12,.

Further, the photosensitive resin 33L is cured by irradiating light using a photomask 37 having light shielding portions 37a,... Smaller than the widths of the metal wirings 12, (see FIG. 3C). Thereafter, the glass substrate 11 is immersed in a developing solution or the like to make the shape of the photosensitive resin 33L predetermined (see FIG.
(d)).

In this wiring board 30, the transparent electrode 3
6,... Extend so as to substantially coincide with the edge E of the adjacent metal wiring 12B, so that the aperture ratio is increased and a bright image can be obtained.

[0018]

By the way, the above-mentioned photosensitive resin 33 needs to be excellent in patternability and durability, and the thick portion 33a needs to be flat. It was difficult to find a practical photosensitive resin, and it was difficult to implement such a manufacturing method in practice.
Further, it is not easy to mold the photosensitive resin 33 into a predetermined shape only by the conditions of the developing process. In particular, it is difficult to secure the inclination angle of the width direction end 33b. It was easy to become a vertical thing. In this case, there is a problem that the transparent electrode 36 is easily broken, and an image defect is easily generated.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a wiring substrate which can solve the problem of so-called voltage waveform delay and can cope with an increase in area and definition.

Further, the present invention is an object to provide a method of manufacturing a wiring board on which an image has excellent bright image quality.

Furthermore, the present invention can reduce the luminance of the backlight device, it is an object to provide a <br/> manufacturing method of a small wiring board power consumption with high luminance.

Still another object of the present invention is to provide a method of manufacturing a wiring board in which the operation is simple and the cost is reduced.

Another object of the present invention is to provide a method of manufacturing a wiring board which can prevent disconnection of a transparent electrode and the like.

Still another object of the present invention is to provide a method of manufacturing a wiring board for color display having the various effects described above.

[0025] Furthermore, the present invention is an object to provide a method of manufacturing a wiring substrate on which the color filter is not discolored.

It is another object of the present invention to provide a method for manufacturing a liquid crystal element using the method for manufacturing a wiring board which achieves the above-mentioned object.

Another object of the present invention is to provide an apparatus for manufacturing a wiring board having the various effects described above.

[0028]

SUMMARY OF THE INVENTION The present invention provides a light-transmitting substrate.
A metal wiring forming step of forming a plurality of metal wirings on the surface,
A resin supplier that supplies resin to the gap between multiple metal wires
The resin curing step of curing the resin, and the cured
Forming a transparent electrode on the surface of the resin.
A method of manufacturing a wiring board having a base plate and a base plate.
A mold substrate having a ridge provided on a metal plate,
Position narrower than the metal wiring and corresponding to the metal wiring
And at least one side surface of the base plate
A mold substrate having a ridge not perpendicular to the surface of the
So that the position of the part corresponds to the position of the metal wiring.
Pressing the resin to form the resin,
A wiring board, which is performed before the fat curing step
And a method for producing the same.

[0029]

[0030]

Further, the present invention relates to a method for manufacturing a liquid crystal element in which a liquid crystal is sandwiched between a pair of substrates, comprising a step of forming a plurality of metal wirings on a surface of a light transmitting substrate; A resin supply step of supplying a resin to the space between the wirings, a resin curing step of curing the resin, and a transparent electrode forming step of forming a transparent electrode on the surface of the cured resin, A mold substrate having a ridge provided on a base plate, wherein the mold substrate is formed at a position narrower than the metal wiring and corresponding to the metal wiring and at least one side surface is perpendicular to the surface of the base plate. A resin molding step of pressing a mold substrate having a non-projecting portion against the resin so that the position of the projecting portion corresponds to the position of the metal wiring, and molding the resin before the resin curing step Liquid crystal characterized by being implemented To provide a method of manufacturing a child.

Further, according to the present invention, the metal wiring is formed on a surface of the substrate or a position narrower than the metal wiring and corresponding to the metal wiring, and at least one side surface is formed on the surface of the base plate. A resin supply unit that supplies a resin to the surface of a mold substrate having a non-perpendicular ridge portion, and pressing the mold substrate against the resin so that the position of the ridge portion corresponds to the position of the metal wiring. Provided is an apparatus for manufacturing a wiring board, comprising: a resin molding unit for molding the resin; a resin curing unit for curing the molded resin; and a release unit for releasing the mold substrate from the cured resin. .

[0033]

Embodiments of the present invention will be described below with reference to the drawings. The same parts as those shown in FIGS. 1 to 7 are denoted by the same reference numerals, and description thereof will be omitted.

First, a first embodiment of the present invention will be described with reference to FIGS.

As shown in FIG. 8A, the liquid crystal element P _{3 according} to the present invention comprises a pair of wiring boards 30 arranged substantially in parallel.
30.

As shown in FIG. 8 (b), the wiring substrate 30 has a light-transmitting glass substrate 11, and the surface of the glass substrate 11 has stripe-shaped metal wirings 12A,
Are arranged so as to be separated from each other.

The space between the metal wirings 12A, 12B,... Is cured by irradiating UV light.
Cured resins (insulating layers) 33 are arranged respectively. Each UV curable resin 33 has a thick portion (flat portion) 33a having a substantially flat surface protruding from the metal wiring 12, and a width direction end portion (inclined portion) adjacent to the thick portion 33a.
33b forms an inclined plane and forms a gentle surface from the surface of the metal wiring 12 to the surface of the thick portion 33a. The central portion in the width direction of the metal wiring 12 is exposed without being covered with the resin, and the exposed portion (surface) of the metal wiring 12 and the resin end portion 3 adjacent to each other with the exposed portion interposed therebetween.
3b, by the 33b, as shown in FIG. 9 (g), to form a gap portion S ₀ of isosceles trapezoidal cross-sectional shape.

It is preferable that the inclination angle of the inclined plane of the end portion 33b is not less than 15 ° and not more than 60 °. If the angle of inclination is less than 15 °, the width of the inclined portion is too wide, and the inclined plane may not fit within the wiring width. If the inclined plane does not fall within the width of the wiring, the flatness of the transparent electrode is lost in the pixel of the liquid crystal element, which may cause threshold unevenness and alignment defects. On the other hand, if the inclination angle exceeds 60 °, the transparent electrode 36 may be disconnected at the end 33b. In particular, there is a concern that the transparent electrode may be cracked due to thermal expansion and contraction of the transparent electrode in a later step such as an alignment control film forming step.

The thick portion 33a of the UV curable resin 33
Is preferably formed to be 0.1 to 5 μm thicker than the metal wiring 12, and preferably 0.5 to 3 μm thicker. If the thick portion 33a is thinner than the above range, insulation between adjacent electrodes may not be able to be secured due to unevenness of the metal wiring 12 or a pinhole of the UV curable resin 33.
On the other hand, if the thick portion 33a is thicker than the above range, there is a problem similar to the case where the above-mentioned inclination angle is less than 15 °.

Further, a large number of transparent electrodes 36 made of ITO are formed on the surface of the UV curable resin 33 and the metal wiring 12. Each transparent electrode 36 is formed in a stripe shape along each metal wiring 12, and one edge 36 a in the width direction is electrically connected to only one metal wiring 12 A, and the other edge 36 b Are formed so as to extend so as to cover an edge E of another metal wiring 12B adjacent to the metal wiring 12A. In this case, the other edge 36b of the transparent electrode 36 may be extended so as to substantially coincide with the edge E of the adjacent metal wiring 12B.

Here, the glass substrate 11 may be a glass substrate which is polished on both sides and has good parallelism and has a thickness of about 1 mm, and is generally used for a liquid crystal substrate, for example, soda. Glass (blue plate glass) is good.

The metal wirings 12,... Have a small resistance value, can be easily formed into a thickness of about 1 μm by a vacuum deposition method, a sputtering method, or the like, and have good adhesion to the glass substrate 11. It is preferably, for example, aluminum, chromium, molybdenum, tungsten, gold, silver, copper and the like are preferable, and aluminum and copper are more preferable. The surface of the metal wirings 12,... May be subjected to an adhesion treatment such as a silane coupling treatment so that the UV-curable resin 33 adheres well.

Further, as the transparent electrodes 36,.
Instead of O, indium oxide, tin oxide or the like may be used. The thickness of the transparent electrode is 10
It is preferably about 0 to 5000 °.

When the thickness of the transparent electrode is less than 100 °,
The resistivity may increase and the risk of disconnection increases. On the other hand, when the thickness of the transparent electrode exceeds 5000 °, the transmittance is reduced, and there is a possibility that the quality when used in an element is reduced.

As the UV-curable resin 33, U
It is a mixed composition of a V-curable resin monomer, oligomer and photoinitiator, and may be of any polymerization type such as an acrylic type, an epoxy type, or an ene / thiol type. Film baking process)
It is necessary to have heat resistance, chemical resistance and washing resistance so as to be able to withstand the heat. Therefore, for example, it is preferable to use a reactive oligomer which is a main component, into which a heat-resistant molecular structure has been introduced, or a cross-linking density increased by a multi-sensitive monomer.

Next, a method of manufacturing the wiring board 30 according to the present embodiment will be described with reference to FIGS. (Metal wiring forming step) A large number of metal wirings 1 are formed on the surface of the glass substrate 11 by sputtering or photolithography.
2, to form a ..., to produce a metal wiring board A _1. (Resin Supply Step) In this step, a mold substrate 50 as shown in FIG. 9A is used.

The mold substrate 50 has a large number of ridges 51,..., And each ridge 51 is substantially continuous with the flat portion 51a narrower than the metal wiring 12 and the flat portion 51a. And a side surface portion 51b forming an inclined surface. And
Both the flat portion 51a and the side portion 51b form a flat surface. In particular, when the flat portion 51a is a flat surface, the flat portion 51a is
, So that a substantially central portion of the metal wiring 12 is exposed by a certain area. Incidentally, the ridge portion 51, as is apparent from the figure, the cross-sectional shape has a substantially isosceles trapezoid, so that the gap portion S ₀ of the same shape is formed by transfer of the ridges 51 . Are formed at positions corresponding to the metal wirings 12, at the same pitch as the pitch of the metal wirings 12,..., Preferably 0.1 to 5 μm, more preferably 0.2
The height is set to about 3 μm. It is preferable that the inclination angle of the side surface portion 51a is not less than 15 ° and not more than 60 °.

The mold substrate 50 may be made of any material such as metal, glass or ceramic as long as it has a predetermined rigidity. However, when the ridge 51 is formed by precision cutting, Is a material with high machinability (eg, copper, phosphor bronze, brass, aluminum, nickel, etc.)
Or at least such a material having high machinability is preferably laminated on a portion of the base substrate on which the ridge portion 51 is formed by plating or the like.

Next, an example of a method for forming the ridge portion 51 will be described. First, the surface of the mold substrate 50 is smoothed by polishing or the like. Next, the smoothed mold substrate 50 is fixed to a processing table 60 as shown in FIG. Then, the processing table 60 is moved to the ridge portion 5.
1 is moved by a predetermined distance p in a direction (direction C in the drawing) orthogonal to the longitudinal direction, and the same cutting is repeated. This allows
A large number of ridges 51 are formed.

Note that, in this case, the cutting depth d is
, And the moving distance p of the cutting bit 61 defines the pitch and width of the ridges 51. Here, it is preferable that the mold substrate 50 has a high flatness at a portion other than the protrusion 51. In addition, the precision of the mold substrate 50 is such that the surface roughness is within ± 100 nm, preferably 20n.
m. The surface roughness can be measured by heterodyne interferometry.

The mold substrate 50 has a liquid UV.
A predetermined amount of the cured resin 33L is dropped using the dispenser 17 (see FIG. 9 (a).
The V-cured resin is represented by reference numeral 33L, and the UV-cured resin after curing is represented by reference numeral 33S, and is simply referred to as “UV-cured resin 33” when no particular distinction is required.

Next, the metal wiring board A ₁ is connected to its wiring surface 1.
5 so that the mold substrate 50 contacts the UV curing resin 33L.
Those superposition slowly so as not to involve air bubbles, supplying UV curable resin 33L the metal wiring mutual gap (see FIG (b). Hereinafter, superposed and the metal wiring board A ₁ and the mold substrate 50 in Is referred to as “pressurized body B ₂ ”).

Then, the metal wiring board A _{1 and the} mold substrate 50 are aligned so that the center line position of each ridge 51 matches the center line position of each metal wiring 12. This alignment may be performed by alignment marks attached to the metal wiring board A ₁ and type substrate 50 (not shown) for detecting by using a means such as a microscope, other, usually used for photolithography or the like May be performed by the above-described alignment method. (Resin Molding Step) Next, the pressurized body B ₂ prepared by the above-described method is pressed into upper and lower press plates 19 a and 19
b) and pressurized (see FIGS. 3 (c) and 3 (d)).

As a result, the mold substrate 50 is
.. Are pressed into contact with the metal wirings 12, and the UV curable resin 33L is formed into a shape defined by the mold substrate 50 and the like. The UV curable resin 33L is completely removed from the surfaces of the metal wirings 12,.

[0055] As the press 19, the pressure from above and below in the pressure body B ₂ added, a UV curing resin 33L may be as any as long as it can be pushing the entire glass substrate, for example, Alternatively, a press using a hydraulic cylinder or an air cylinder, a liquid press, or the like, or a roll press may be used. Further, the pressure is desirably in the range of 5 to 50 kg / cm ² .

In this case, the upper and lower press plates 19a, 19b
An electric heater or flowing incorporating Dari heating fluid, etc, may be heating the pressure body B _2. Also,
To be pressure body B ₂ before setting the pressing machine 19 may be heated by a heating device such as hot plate or oven. By thus heating the pressure body B _2, it reduces the viscosity of the UV curable resin 33L, UV curing resin 33L is smoothly pushed and spread by the pressure. (Resin curing step) then removed the target pressure body B ₂ from the press 19, using a UV lamp (not shown), U
The V-cured resin 33L is irradiated with UV light L from the side of the glass substrate 11 (see (e) in the same figure) to completely cure the UV-cured resin 33.

Here, as the UV lamp, a high-pressure mercury lamp, a low-pressure mercury lamp, a xenon lamp, or the like may be used.
In addition, any material may be used as long as it cures the UV curable resin 33L to be irradiated.

Further, since the UV light L passes through the glass substrate 11 and the like and reaches the UV curable resin 33L, the amount of light that is transmitted through the glass substrate 11 and the like has a loss.
Therefore, it is desirable that the illuminance of the UV lamp is sufficient to cure the UV curable resin 33L despite such a loss.

Here, the UV curable resin 33L is irradiated with UV light L by using the UV curable resin 33L.
Was cured, but of course there is no need to be limited to this, UV
A resin that is cured by light other than light, for example, visible light or infrared light may be used. (Stripping step) Then, when completion of curing of the UV curable resin 33 is peeled off -type substrate 50 by applying force in the direction of the illustrated F ₂ by the release apparatus (not shown) (FIG. (F) and (g) reference).

The peeling step is performed after the curing of the UV curable resin 33 is completely completed. However, it is needless to say that the peeling step is not limited to this. A peeling process is performed, and the mold substrate 50
Is peeled off and UV light L is irradiated again to cure the UV curable resin 3
3 may be finished. In such a case, even if the illuminance of the UV lamp is slightly lower than the illuminance sufficient to completely cure the UV curable resin 33, the UV curable resin 33 can be similarly cured. (Transparent electrode forming step) Then, transparent electrodes 36,... Made of ITO are formed along the metal wirings 12,. (Other Steps) Thereafter, the insulating film 7 and the orientation control film 9 are formed so as to cover these transparent electrodes 36,...

[0061] Then, bonding a pair of wiring substrates 30 and 30, by injecting a liquid crystal 3 to substrate gap, creating a liquid crystal element P _3. Incidentally, only one side may be used as the wiring board 30 of the substrate of the liquid crystal element P _3. Further, the alignment control films 9 of both substrates may be made of different materials.

Next, an apparatus used in the present embodiment will be described with reference to FIG.

FIG. 11 is a view showing the overall configuration of an apparatus used in the present invention. This apparatus 70 comprises a resin installation unit 71, a resin supply unit 72, a positioning unit 7
3, a resin molding unit 74, a resin curing unit 75, a release unit 76, and the like. A large number of mold substrates 50 are stocked in the mold substrate stocker 77.

Now, when one mold substrate 50 is supplied from the mold substrate stocker 77 to the resin setting unit 71, the UV curing resin 33L is supplied from the resin tank 78 via the dispenser 17 to the surface of the mold substrate 50. Is done.

Next, this type substrate 50 is moved to the resin supply unit 72, the metal wiring board A ₁ supplied from the metal wiring board stocker 79 is superimposed. Thereby, the plurality of metal wirings 12 provided on the glass substrate 11,
... The UV curable resin 33L is supplied to the gap between each other. If necessary, the UV curable resin 33L may be left for a short time so as to spread to some extent.

Then, the mold substrate 50 and the metal wiring board A ₁ are moved to the positioning unit 73 and are aligned using the precision positioning table 73a and the microscope 73b. Thereby, positioning is performed such that the center line position of the ridge portion 51 and the center line position of the metal wiring 12 match. Note that the center line positions may be shifted as needed.

Further, the pressed body B ₂ composed of the mold substrate 50 and the metal wiring board A ₁ is attached to the resin molding unit 74.
And the resin molding step is performed by the press machine 19. As a result, the mold substrate 50 presses the UV curable resin 33L to form it.

Next, the pressed body B ₂ is
5, and the UV curing resin 33L is cured by irradiation with UV light from the UV lamp 75a. further,
The pressed body B ₂ is moved to the release unit 76. Here, the release unit 76 has a vertically movable vacuum chuck 76a, and a vacuum passage 76b is opened on the lower surface of the vacuum chuck 76a. The vacuum passage 76b is connected to a vacuum pump 76c. The vacuum passage 76b is evacuated and the vacuum chuck 76a is moved upward to peel off the mold substrate 50. Then, the metal wiring board A ₁ in a state where adhesion and molding is performed in UV curing resin 33 is accommodated in the product stocker 80 by the loading device, such as automatic hand robot.

On the other hand, the separated mold substrate 50 is again stored in the mold substrate stocker 77 after a cleaning step and the like, and is reused. Incidentally, the pressing body B ₂ is adapted to move between the units by the conveyor or the like, each unit 71,72,73,74,75,76 is adapted to be controlled by the sequence controller .

On the other hand, the metal wiring board A _{1 on} which the UV curable resin 33 has been attached and formed is moved to a transparent electrode forming unit (not shown), and the molded UV curable resin 3 is formed.
A transparent electrode 36 is formed on the surfaces of the metal wiring 3 and the metal wiring 12.

Next, the effect of the present embodiment will be described.

According to the present embodiment, the transparent electrodes 36,.
Are provided in parallel with each other, so that a substrate having low resistance and having no problem of voltage waveform delay can be obtained. According to actual measurements made by the inventor, the resistance of these electrodes 36,..., 12,.
It was less than 00Ω. And such a wiring board 30
The liquid crystal element P ₃ produced using the becomes capable over a larger and higher resolution.

The UV curable resin 33 and the metal wiring 12 do not form a plane but have a step. Accordingly, the transparent electrode 36 and the metal wiring 12 adjacent to the transparent electrode 36 are formed.
In order to avoid contact with the transparent electrode 36, there is no need to provide a gap W as shown in FIG.
Can be extended to the end position E of the adjacent metal wiring 12 (see FIG. 8B). As a result, there is no need to provide the light shielding layers 21,... As shown in FIG.
There is no darkening of the image. Therefore, the luminance of the backlight device can be reduced, and as a result, higher luminance of the liquid crystal element and reduction of power consumption can be achieved. Further, the light shielding layer 21,
Are not required, the manufacturing process is simplified, and the manufacturing cost is reduced. Further, the area where the liquid crystal is switched is widened, and the image quality is improved.

On the other hand, according to the present embodiment, the mold substrate 50
As a result, the UV-curable resin 33 can be formed into an accurate cross-sectional shape, the production can be simplified, and the disconnection of the transparent electrodes 36,.

Further, the UV-curable resin 3
3, the flatness of the thick portion 33a becomes better than when the spin coating method is used. Therefore, the transparent electrodes 36 formed on the surface of the UV curable resin 33,.
In addition, the flatness of the insulating film 7 and the alignment control film 9 can be improved, the cell gap can be made uniform, and the alignment of the liquid crystal can be improved. Therefore, the production yield of the liquid crystal element can be improved, and there is an advantage in the ease of designing the panel.

[0076] In the above description, the dripping the UV curable resin 33L in type substrate 50, the mold substrate 50 was added dropwise to the UV curable resin 33L by superimposing the metal wiring board A _1, UV curing resin 33L are supplied to the gaps between the metal wirings 12,..., Of course, but need not be limited to this, and as shown in FIGS. 12 (a) to 12 (c), as shown in FIGS. U)
33 L of V-cured resin is dropped, and then the metal wiring board A ₁
Alternatively, the mold substrate 50 may be superimposed.

Further, in the above-described manufacturing method, an inclined plane is formed by the resin end portion 33b, and the metal wiring 1 is formed.
2 is formed by an exposed portion (surface) of the second resin portion and resin ends 33b, 33b adjacent to each other across the exposed portion.
_Although the cross-sectional shape of ₀ is an isosceles trapezoid, the shape is not limited to this and may be other shapes shown in FIGS. 13 (a) to 13 (c). That is, for example, as shown in FIG. 13 (a), may also be widthwise end portion 52b which faces the UV curable resin 52, the cross-section by 52b forming the gap portion S ₁ of the semicircular, the As shown in FIG. 7B, the width direction end 53b of the UV curable resin 53 may be curved to the opposite side to that in FIG. Further, as shown in FIG. 5C, one width direction end 54ba of the UV curable resin 54 is inclined,
The other widthwise end portion 54bb is vertically formed, may be formed a gap portion S ₃ of the unequal leg trapezoidal cross-section with these.

Next, a second embodiment of the present invention will be described with reference to FIGS.

The liquid crystal device according to the present embodiment has a wiring board 100 shown in FIG. This wiring board 100
Has a glass substrate 11, and on the surface of the glass substrate 11, a large number of striped metal wirings 12,... Are arranged with a predetermined gap. And metal wiring 1
The three primary color filters 101,... Are arranged on the surface of the glass substrate 11 in the gap between the two. A UV curable resin (insulating layer) 33 is provided between the metal wirings 12.

In this embodiment, a metal wiring forming step is performed to form metal wirings 12,... On the surface of glass substrate 11, and then a color filter forming step is performed to form color filters 101,. (See FIG. 15A). Further, similarly to the above-described first embodiment, a resin supply step, a resin molding step, a resin curing step, and a peeling step are performed, and a structure as shown in FIG. 15B is created. Further, a transparent electrode forming step is performed, and transparent electrodes 36,... Are formed on the surfaces of the UV curable resins 33,... And the metal wirings 12, (FIG. (C)).

Next, effects of the present embodiment will be described.

According to the present embodiment, it is possible to obtain a color liquid crystal element having the same effects as in the first embodiment.

The relative order of the metal wiring forming step and the color filter forming step may be performed in any order. The metal wiring forming step may be performed after the color filter forming step. May be performed before the color filter forming step.

Are not necessarily formed on the surface of the glass substrate 11, and color filters 111,... Are formed on the entire surface of the glass substrate 11, as in a wiring substrate 110 shown in FIG. May be formed on the surfaces of the color filters 111,.

In this case, first, a color filter forming step is performed to attach the color filters 111,.
Then, a metal wiring forming step is performed to form metal wirings 12,... (See FIG. 17A). Then, a resin supply step, a resin molding step, a resin curing step, and a peeling step are performed (see FIG. 3B), and then a transparent electrode forming step is performed (see FIG. 3C).

As the method of forming the color filters 111,..., A photolithography method, a printing method, a sublimation transfer method, an ink jet method, or the like is used. When the inkjet method is used, the receiving layer may be coated on the entire surface of the glass substrate 11 by a method such as a spin coating method, and then the dye ink may be accurately spattered so as to permeate the receiving layer. .

Next, a third embodiment of the present invention will be described with reference to FIGS.

The liquid crystal element according to the present embodiment has a wiring board 120 as shown in FIG. The wiring substrate 120 has a glass substrate 11, and color filters 111,... Are formed on the entire surface of the glass substrate 11. Further, a protective layer 121 is formed so as to cover the color filters 111,..., And the metal wirings 12,.
3,... Are formed.

Then, at the time of manufacturing the wiring board 120, first, a color filter forming step is performed to form the color filters 111 on the surface of the glass substrate 11,
After that, a protective layer forming step is performed, and the color filter 1 is formed.
The protective layer 121 is formed so as to cover 11,. Thereafter, a metal wiring forming step is performed to produce a structure shown in FIG. Next, a resin supply step, a resin molding step,
After performing the resin curing step and the peeling step, FIG. 19 (b)
Then, the structure shown in FIG. 3 (c) is manufactured by performing a transparent electrode forming step.

Next, effects of the present embodiment will be described.

Generally, when the metal wiring forming step is performed after the color filter forming step, the metal wirings 12,.
May be discolored by an etching solution for patterning the color filters. However, according to the present embodiment, the color filters 111,
Are covered by the protective layer 121, so that such discoloration is prevented.

According to this embodiment, a color liquid crystal element having the same effects as those of the first embodiment can be obtained.

[0093]

Embodiments of the present invention will be described below. (Embodiment 1) In the present embodiment, the mold substrate 50 is formed by applying an electroless nickel plating having a thickness of about 50 μm to a stainless steel plate and forming ridges 51,. Was. In this embodiment, the ridges 51
Is 2 μm in height, 10 μm in width at the top, and 20 μm in width at the bottom
m, approximately equal-length trapezoidal shape with 2/5 edge gradient, pitch 320
μm, and the length was 250 mm. The size of the mold substrate 50 was 200 × 250 × 5 mm, and the surface was polished.

The protruding ridges 51 are formed by using a cutting tool 61 having a tip width of 300 μm and a tip shape having an edge gradient of 2/5, and an ultra-precision cutting machine to make the plating portion ultra-precise. It was formed by processing.

The glass substrate 11 has a size of 210 × 24
A 0 × 1.1 mm double-side polished blue plate glass was used.

Further, the UV curable resin 33 contains 50 parts by weight of pentaerythritol triacrylate, 50 parts by weight of neopentyl glycol diacrylate, and 2 parts by weight of 1-hydroxycyclohexyl phenyl ketone.
Using a curable resin composition, 33 L of liquid UV curable resin
In the resin supply step, the dispenser 17 is used to drop the resin onto the center of the mold substrate 50.

Further, the metal wirings 12,... Have a thickness of 2 μm, a pitch of 320 μm, and an electrode width of 30 μm.
m and the length was 240 mm. That is, the pitch of the ridges 51,... Of the mold substrate 50 is equal to the pitch of the metal wirings 12,. The material of the metal wirings 12,.
Aluminum.

Are formed of ITO, the pitch is 320 μm, the electrode width is 312 μm, and the thickness is 700 °.

Next, a method of manufacturing the wiring board 30 in this embodiment will be described. (Metal Wiring Forming Step) In this step, 240 mm long metal wirings 12,... Were formed on the surface of the glass substrate 11 by using the sputtering method and the photolithographic etching method. Al is used as a target during sputtering.
And a substrate temperature of 120 ° and an atmosphere of Ar / O ₂ (O ₂
Addition concentration 2000 ppm), gas flow rate 200 SCCM,
The input power was 2.8 kW.

In the present embodiment, the wiring surface 15 was spin-coated with a coupling agent and subjected to a heat treatment at a temperature of 100 ° C. for 20 minutes to perform an adhesion treatment. As the coupling agent, 1 part by weight of silane coupling agent A-174 manufactured by Nippon Unicar Co., Ltd., ethyl alcohol 40
Those consisting of parts by weight were used. (Resin supply step) In this step, the mold substrate 5 described above is used.
0, and the above liquid UV-curable resin composition 33L is placed on the mold substrate 50 using the dispenser 17 for 800
mg was added dropwise. Then, the wiring surface 15 of the metal wiring board A ₁
Was slowly superimposed on the mold substrate 50 onto which the UV curing resin 33L had been dropped so that air bubbles would not be trapped.

Here, the size of the mold substrate 50 is 200 × 250 mm as described above, the size of the glass substrate 11 is 210 × 240 mm, and the length of each side is
1 is longer than the mold substrate 50 by 10 mm, but the glass substrate 11 protrudes by 5 mm from the edge of the mold substrate 50, and the center line of the ridges 51,.
Positioning using microscope observation (magnification: 400 times) was also performed so that the center lines of 2,. (Resin molding step) In this step, a 5-ton hydraulic press was used, and the size of the upper and lower press plates 19a, 19b was set to 300 mm x 300 mm square. In this step, a press plate 19a, is set to be pressure body B ₂ substantially in the center of 19b by performing pressurization, but the pressure in about 1 minute from the start pressurization 3
Tonnes, hold the pressure for 10 minutes, then
The pressurization was released, and the pressurized body B ₂ was taken out of the press 19. (Resin Curing Step) In this step, a UV lamp composed of four 100 W high-pressure mercury lamps is used, and the object B ₂ is irradiated with UV light (illuminance: 15 W / cm ² ) for 2 minutes. Done. (Release Step) After the curing of the UV-curable resin 33 was completed, the mold substrate 50 was peeled off by a release device. Note that this peeling is performed by fixing the end of the glass substrate 11 (the end protruding by 5 mm from the mold substrate 50) and the end of the mold substrate 50 (the end protruding by 5 mm from the glass substrate 11). ) Was performed. (Transparent Electrode Forming Step) Then, the transparent electrodes 36,... Made of ITO were formed along the metal wirings 12,.
As for the film forming conditions, the substrate temperature is set to room temperature (however, the substrate temperature is increased to 50 to 60 ° C. with the film formation), and the atmosphere gas is set to A.
r / O ₂ (the concentration of O ₂ was 0.5%), the Ar gas pressure was 7 mTorr, and the target was ITO. (Other Steps) Thereafter, an insulating film 7 made of SiO ₂ and an orientation control film 9 made of polyimide were formed so as to cover these transparent electrodes 36,.

Then, a pair of wiring substrates 30 and 30 were attached to each other, and a chiral smectic liquid crystal 3 was injected into a gap between the substrates to form a liquid crystal element.

According to this embodiment, the same effects as those of the first embodiment are obtained. In Example 2 This Example was dropped UV curable resin 33 on the metal wiring board A _1, superposed then type substrate 50. Other structures and manufacturing methods are described in the first embodiment.
The same as above.

According to this embodiment, the same effects as those of the first embodiment can be obtained. (Embodiment 3) In this embodiment, as shown in FIG. 14, the color filters 101,
... was arranged. The color filters 101,... Used were pigment-based color filters (manufactured by Ube Industries, Ltd.) and had a thickness of 1 μm. The photolithography / etching method was used to form the color filters 101. Further, after release, the surface side of the UV curable resin 33 was further irradiated with UV light for 2 minutes. This is because it is considered that the UV light is somewhat blocked by the color filters 101, and the curing of the UV curable resin 33 is not completely completed only in the resin curing step in the first embodiment. Other structures and manufacturing methods were the same as those in Example 1 described above.

According to this embodiment, a color liquid crystal element having substantially the same effects as those of the above-described embodiment was obtained. (Embodiment 4) In this embodiment, color filters 111,... Were formed before forming metal wirings 12,. That is, a hydrophilic acrylic ink receiving layer is formed to a thickness of 0.8 μm by spin coating, and an aqueous color filter dye ink (manufactured by Canon Inc.) is applied at a pitch of 230 μm by a color filter ink jet printer (manufactured by Canon Inc.). , And then cured by heating at a temperature of 200 ° C. for 30 minutes. Other structures and manufacturing methods are the same as those in the first embodiment.

According to this embodiment, a color liquid crystal element having the same effects as in the third embodiment was obtained. (Embodiment 5) In this embodiment, before forming the metal wirings 12,... On the surface of the glass substrate 11, the inkjet color filter layers 111,. Then, a polyamide-based transparent coating material (manufactured by Ube Industries, Ltd.) was spin-coated as a protective layer 121 and then baked. Note that the thickness of the protective layer 121 after baking was about 0.5 μm. Other structures and manufacturing methods are the same as those in the first embodiment.

Next, the effect of this embodiment will be described.

Generally, when the metal wiring forming step is performed after the color filter forming step, the metal wirings 12,.
May be discolored by the etchant for patterning the color filters.
However, according to the present embodiment, the color filters 111,.
Is covered with the protective layer 121, so that such discoloration was prevented.

Also, according to this embodiment, a color liquid crystal element having the same effect as that of the third embodiment was obtained.

[0110]

As described above, according to the present invention,
Since the metal wiring and the transparent electrode are provided side by side, the problem of so-called voltage waveform delay is solved, and a large-area and high-definition liquid crystal element can be obtained.

The transparent electrode extends so that the other edge substantially coincides with the edge of another adjacent metal wiring, or the transparent electrode extends so as to cover the edge of another adjacent metal wiring. Since it is formed in the provided state, a wide switching area of the liquid crystal can be secured, and the image quality is improved by that much.

Further, the transparent electrode is formed in a state where the other edge portion is extended so as to substantially coincide with (or cover) the edge of another adjacent metal wiring. Therefore, there is no need to provide a light shielding layer, and the image can be brightened by increasing the aperture ratio. Therefore, the luminance of the backlight device can be reduced, and as a result, higher luminance of the liquid crystal element and reduction of power consumption can be achieved. Further, the manufacturing process is simplified, and the manufacturing cost is reduced.

Further, according to the present invention, the cross-sectional shape of the resin can be reliably formed by the protruding ridges of the mold substrate, thereby simplifying the production and preventing disconnection of the transparent electrode.

Furthermore, since the resin is molded using the mold substrate, the flatness can be improved more than the spin coating method. Therefore, the flatness of the transparent electrode or the like formed on the surface of the resin can be improved, and the cell gap can be made uniform. Therefore, the production yield of the liquid crystal element can be improved, and there is an advantage in the ease of designing the panel.

When a color filter is formed in the color filter forming step, it is possible to manufacture a wiring board which has various effects as described above and can display a color image.

In particular, when a protective layer is formed on the surface of a color filter, discoloration of the color filter when forming a transparent electrode is prevented.

[Brief description of the drawings]

FIG. 1 is a diagram showing a structure of a liquid crystal element of a first conventional example;
(a) is a sectional view, and (b) is a view showing a shape of a transparent electrode.

FIG. 2 is a diagram showing a structure of a liquid crystal element of a second conventional example;
(a) is a sectional view, and (b) is a detailed sectional view showing a structure of a wiring board.

FIG. 3 is a view for explaining a method for manufacturing a liquid crystal element of a second conventional example.

FIG. 4 is a detailed sectional view for explaining the structure of a liquid crystal element of a third conventional example.

FIG. 5 is a sectional view showing a detailed structure of a wiring board as a fourth conventional example.

FIG. 6 is a view for explaining a method of manufacturing a wiring board as a fourth conventional example.

FIG. 7 is a diagram for explaining a problem in a fourth conventional example.

8A and 8B are diagrams illustrating a structure of a liquid crystal element manufactured by using the method for manufacturing a wiring board according to the present invention, wherein FIG. 8A is a cross-sectional view illustrating the entire structure of the liquid crystal element, and FIG. FIG. 2 is a detailed sectional view showing the structure of FIG.

FIG. 9 is a view for explaining the first embodiment of the method for manufacturing a wiring board according to the present invention;

FIG. 10 is a diagram for explaining an example of an apparatus for manufacturing a mold substrate.

FIG. 11 is a view for explaining an example of a wiring board manufacturing apparatus of the present invention.

FIG. 12 is a diagram for explaining another example of the method for manufacturing a wiring board according to the present invention.

FIG. 13 is a view for explaining another example of the shape of the UV curable resin in the wiring board of the present invention.

FIG. 14 is a sectional view showing an example of a structure of a wiring board manufactured by a manufacturing method according to a second embodiment of the present invention.

FIG. 15 is a view for explaining the method for manufacturing the wiring board according to the second embodiment of the present invention.

FIG. 16 is a sectional view showing another example of the structure of the wiring board manufactured by the manufacturing method according to the second embodiment of the present invention;

FIG. 17 is a diagram for explaining another example of the method of manufacturing the wiring board according to the second embodiment of the present invention.

FIG. 18 is a sectional view showing another example of the structure of the wiring board manufactured by the manufacturing method according to the third embodiment of the present invention;

FIG. 19 is a diagram for explaining the method for manufacturing the wiring board according to the third embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 11 glass substrate (translucent substrate) 12, metal wiring 30 wiring substrate 33, UV curing resin 36, transparent electrode 50 type substrate 51, ridge portion 51a flat portion 51b side portion 101, color filter 111, ... Color filter 121 Protective layer 70 Wiring board manufacturing device 72 Resin supply unit 74 Resin molding unit 75 Resin curing unit

────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yuji Matsuo 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (56) References JP-A-5-113572 (JP, A) Shokai Sho62 -161226 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) G02F 1/1343 G02F 1/1333

Claims (15)

(57) [Claims] A metal wiring forming step of forming a plurality of metal wirings on a surface of the light transmitting substrate; a resin supplying step of supplying a resin to a gap between the plurality of metal wirings; a resin curing step of curing the resin; And a transparent electrode forming step of forming a transparent electrode on the surface of the cured resin, comprising: a mold substrate having a base plate and a ridge provided on the base plate. A mold substrate having a protrusion narrower than the metal wiring and formed at a position corresponding to the metal wiring and having at least one side surface not perpendicular to the surface of the base plate, wherein the position of the protrusion is A method of manufacturing a wiring board, wherein a resin molding step of pressing the resin so as to correspond to the position of the metal wiring and molding the resin is performed before the resin curing step. Wherein said angle between one side and the base plate surface of the protrusions is 15 to 60 °, method of manufacturing a wiring board according to claim 1, wherein a. 3. In the transparent electrode forming step, an end of the transparent electrode is electrically connected to one of the metal wirings, and an end opposite to the transparent electrode is adjacent to the metal wiring. with leads on a plane containing one side of one metal wire forming the transparent electrode so as not to connect said another metal wiring electrically method of manufacturing a wiring board according to claim 1, wherein a. 4. In the transparent electrode forming step, one end of the transparent electrode is electrically connected to one of the metal wirings, and the other end of the transparent electrode is adjacent to the metal wiring. covering a portion of one metal wire forming the transparent electrode so as not to connect said another metal wiring electrically method of manufacturing a wiring board according to claim 1, wherein a. 5. is a longitudinal and a substantially isosceles trapezoidal cross-section perpendicular of the protruding portion, method of manufacturing a wiring board according to claim 1, wherein. Wherein said having a resin supply step color filter forming step prior method of manufacturing a wiring board according to claim 1, wherein. 7. a protective layer forming step after the color filter forming step, preparation of a wiring board according to claim 1, wherein forming the protective layer, characterized in that between the color filter and the insulating layer Method. 8. A method for manufacturing a liquid crystal device in which a liquid crystal is sandwiched between a pair of substrates, comprising: a step of forming a plurality of metal wirings on a surface of a light transmitting substrate; and a gap between the plurality of metal wirings. A resin supply step of supplying a resin, a resin curing step of curing the resin, and a transparent electrode forming step of forming a transparent electrode on the surface of the cured resin. A mold substrate having a ridge provided, wherein the ridge is formed narrower than the metal wiring and is formed at a position corresponding to the metal wiring, and at least one side surface is not perpendicular to the surface of the base plate. Pressing a mold substrate having a portion against the resin such that the position of the ridge corresponds to the position of the metal wiring, and performing a resin molding step of molding the resin before the resin curing step. A method for manufacturing a liquid crystal element, comprising: 9. A method for manufacturing a liquid crystal device according to claim 8, wherein the angle between one side and the base plate surface of the protruding portion is characterized in that it is a 15 to 60 °. 10. In the transparent electrode forming step, one end of the transparent electrode is electrically connected to one of the metal wirings, and the other end of the transparent electrode is adjacent to the metal wiring. 9. The method for manufacturing a liquid crystal element according to claim 8 , wherein a transparent electrode is formed so as to reach a plane including one side surface of one metal wiring and not to be electrically connected to the other metal wiring. 11. In the transparent electrode forming step, an end of the transparent electrode is electrically connected to one of the metal wirings, and an opposite end of the transparent electrode is adjacent to the metal wiring. 9. The method for manufacturing a liquid crystal device according to claim 8 , wherein a transparent electrode is formed so as to cover a part of one metal wiring and not to be electrically connected to the other metal wiring. 12. The method for manufacturing a liquid crystal element according to claim 8 , wherein a shape of a cross section perpendicular to a longitudinal direction of the ridge is a trapezoid. 13. The method according to claim 8, further comprising a color filter forming step before the resin supplying step. 14. The method according to claim 8 , further comprising a protective layer forming step after the color filter forming step, wherein a protective layer is formed between the color filter and the insulating layer. . 15. A projection formed on a surface of a substrate on which a metal wiring is formed, or at a position narrower than the metal wiring and corresponding to the metal wiring, and at least one side surface is not perpendicular to the surface of the base plate. A resin supply unit for supplying a resin to the surface of a mold substrate having a ridge, and molding the resin by pressing the mold substrate against the resin so that the position of the ridge corresponds to the position of the metal wiring A resin molding unit,
A resin curing unit for curing the molded resin,
A release unit for releasing the mold substrate from the cured resin;