JP3187504B2 - Polyamide resin and its resin composition - Google Patents
Polyamide resin and its resin compositionInfo
- Publication number
- JP3187504B2 JP3187504B2 JP02920892A JP2920892A JP3187504B2 JP 3187504 B2 JP3187504 B2 JP 3187504B2 JP 02920892 A JP02920892 A JP 02920892A JP 2920892 A JP2920892 A JP 2920892A JP 3187504 B2 JP3187504 B2 JP 3187504B2
- Authority
- JP
- Japan
- Prior art keywords
- aromatic
- aromatic polyamide
- group
- dicarboxylic acid
- polyamide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004760 aramid Substances 0.000 claims description 81
- 229920003235 aromatic polyamide Polymers 0.000 claims description 81
- -1 4-aminophenoxy Chemical group 0.000 claims description 69
- 239000000835 fiber Substances 0.000 claims description 40
- 125000003118 aryl group Chemical group 0.000 claims description 33
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 30
- 238000006243 chemical reaction Methods 0.000 claims description 19
- 239000011342 resin composition Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 239000003795 chemical substances by application Substances 0.000 claims description 16
- 239000002253 acid Substances 0.000 claims description 15
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 14
- 239000003365 glass fiber Substances 0.000 claims description 14
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 13
- 239000004917 carbon fiber Substances 0.000 claims description 13
- 238000006068 polycondensation reaction Methods 0.000 claims description 12
- 150000004984 aromatic diamines Chemical class 0.000 claims description 10
- 239000003960 organic solvent Substances 0.000 claims description 10
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 9
- 150000001412 amines Chemical class 0.000 claims description 8
- 125000005843 halogen group Chemical group 0.000 claims description 8
- 239000012779 reinforcing material Substances 0.000 claims description 8
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 5
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 150000001735 carboxylic acids Chemical class 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 2
- 239000004952 Polyamide Substances 0.000 description 73
- 229920002647 polyamide Polymers 0.000 description 73
- 239000000843 powder Substances 0.000 description 70
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 39
- 238000000034 method Methods 0.000 description 27
- 238000010521 absorption reaction Methods 0.000 description 21
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 18
- 150000002148 esters Chemical class 0.000 description 17
- 238000000862 absorption spectrum Methods 0.000 description 12
- 230000009477 glass transition Effects 0.000 description 11
- 238000003756 stirring Methods 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 10
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 238000000465 moulding Methods 0.000 description 9
- 230000004580 weight loss Effects 0.000 description 9
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000155 melt Substances 0.000 description 7
- 230000000704 physical effect Effects 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- OISVCGZHLKNMSJ-UHFFFAOYSA-N 2,6-dimethylpyridine Chemical compound CC1=CC=CC(C)=N1 OISVCGZHLKNMSJ-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 150000001408 amides Chemical class 0.000 description 6
- 238000000921 elemental analysis Methods 0.000 description 6
- 238000001914 filtration Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 5
- 150000007513 acids Chemical class 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000012299 nitrogen atmosphere Substances 0.000 description 5
- JYYNAJVZFGKDEQ-UHFFFAOYSA-N 2,4-Dimethylpyridine Chemical compound CC1=CC=NC(C)=C1 JYYNAJVZFGKDEQ-UHFFFAOYSA-N 0.000 description 4
- PVAFXZHYHVOLDG-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)-5-chlorophenoxy]aniline Chemical group NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=C(Cl)C=2)=C1 PVAFXZHYHVOLDG-UHFFFAOYSA-N 0.000 description 4
- FKNQCJSGGFJEIZ-UHFFFAOYSA-N 4-methylpyridine Chemical compound CC1=CC=NC=C1 FKNQCJSGGFJEIZ-UHFFFAOYSA-N 0.000 description 4
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 4
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- FDQSRULYDNDXQB-UHFFFAOYSA-N benzene-1,3-dicarbonyl chloride Chemical group ClC(=O)C1=CC=CC(C(Cl)=O)=C1 FDQSRULYDNDXQB-UHFFFAOYSA-N 0.000 description 4
- 150000004985 diamines Chemical class 0.000 description 4
- GGSUCNLOZRCGPQ-UHFFFAOYSA-N diethylaniline Chemical compound CCN(CC)C1=CC=CC=C1 GGSUCNLOZRCGPQ-UHFFFAOYSA-N 0.000 description 4
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 150000002763 monocarboxylic acids Chemical class 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 4
- 230000003014 reinforcing effect Effects 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 4
- UBOXGVDOUJQMTN-UHFFFAOYSA-N 1,1,2-trichloroethane Chemical compound ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 229920000271 Kevlar® Polymers 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- PASDCCFISLVPSO-UHFFFAOYSA-N benzoyl chloride Chemical compound ClC(=O)C1=CC=CC=C1 PASDCCFISLVPSO-UHFFFAOYSA-N 0.000 description 3
- UAOMVDZJSHZZME-UHFFFAOYSA-N diisopropylamine Chemical compound CC(C)NC(C)C UAOMVDZJSHZZME-UHFFFAOYSA-N 0.000 description 3
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 3
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000004761 kevlar Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000000691 measurement method Methods 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 2
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 2
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- PAMIQIKDUOTOBW-UHFFFAOYSA-N 1-methylpiperidine Chemical compound CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 description 2
- RUFPHBVGCFYCNW-UHFFFAOYSA-N 1-naphthylamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1 RUFPHBVGCFYCNW-UHFFFAOYSA-N 0.000 description 2
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 2
- CZZZABOKJQXEBO-UHFFFAOYSA-N 2,4-dimethylaniline Chemical group CC1=CC=C(N)C(C)=C1 CZZZABOKJQXEBO-UHFFFAOYSA-N 0.000 description 2
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 2
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 2
- DZLUPKIRNOCKJB-UHFFFAOYSA-N 2-methoxy-n,n-dimethylacetamide Chemical compound COCC(=O)N(C)C DZLUPKIRNOCKJB-UHFFFAOYSA-N 0.000 description 2
- XWKFPIODWVPXLX-UHFFFAOYSA-N 2-methyl-5-methylpyridine Natural products CC1=CC=C(C)N=C1 XWKFPIODWVPXLX-UHFFFAOYSA-N 0.000 description 2
- KDSNLYIMUZNERS-UHFFFAOYSA-N 2-methylpropanamine Chemical compound CC(C)CN KDSNLYIMUZNERS-UHFFFAOYSA-N 0.000 description 2
- DOLQYFPDPKPQSS-UHFFFAOYSA-N 3,4-dimethylaniline Chemical group CC1=CC=C(N)C=C1C DOLQYFPDPKPQSS-UHFFFAOYSA-N 0.000 description 2
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical compound CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 2
- JJYPMNFTHPTTDI-UHFFFAOYSA-N 3-methylaniline Chemical compound CC1=CC=CC(N)=C1 JJYPMNFTHPTTDI-UHFFFAOYSA-N 0.000 description 2
- ITQTTZVARXURQS-UHFFFAOYSA-N 3-methylpyridine Chemical compound CC1=CC=CN=C1 ITQTTZVARXURQS-UHFFFAOYSA-N 0.000 description 2
- MUNOBADFTHUUFG-UHFFFAOYSA-N 3-phenylaniline Chemical group NC1=CC=CC(C=2C=CC=CC=2)=C1 MUNOBADFTHUUFG-UHFFFAOYSA-N 0.000 description 2
- NPDACUSDTOMAMK-UHFFFAOYSA-N 4-Chlorotoluene Chemical compound CC1=CC=C(Cl)C=C1 NPDACUSDTOMAMK-UHFFFAOYSA-N 0.000 description 2
- NWWQCWKMNLSXDT-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)-5-chlorophenoxy]aniline Chemical compound NC1=CC=C(OC2=CC(=CC(=C2)Cl)OC2=CC=C(C=C2)N)C=C1 NWWQCWKMNLSXDT-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- ZWXPDGCFMMFNRW-UHFFFAOYSA-N N-methylcaprolactam Chemical compound CN1CCCCCC1=O ZWXPDGCFMMFNRW-UHFFFAOYSA-N 0.000 description 2
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- DMVOXQPQNTYEKQ-UHFFFAOYSA-N biphenyl-4-amine Chemical group C1=CC(N)=CC=C1C1=CC=CC=C1 DMVOXQPQNTYEKQ-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- QARVLSVVCXYDNA-UHFFFAOYSA-N bromobenzene Chemical compound BrC1=CC=CC=C1 QARVLSVVCXYDNA-UHFFFAOYSA-N 0.000 description 2
- 125000004799 bromophenyl group Chemical group 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 125000000068 chlorophenyl group Chemical group 0.000 description 2
- 229960000359 chromic chloride Drugs 0.000 description 2
- LJAOOBNHPFKCDR-UHFFFAOYSA-K chromium(3+) trichloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Cl-].[Cr+3] LJAOOBNHPFKCDR-UHFFFAOYSA-K 0.000 description 2
- 239000011636 chromium(III) chloride Substances 0.000 description 2
- 235000007831 chromium(III) chloride Nutrition 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- NZNMSOFKMUBTKW-UHFFFAOYSA-N cyclohexanecarboxylic acid Chemical compound OC(=O)C1CCCCC1 NZNMSOFKMUBTKW-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
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- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- KNDKUJRSVOCRCY-UHFFFAOYSA-N tetrachloromethane;1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl.ClC(Cl)(Cl)Cl KNDKUJRSVOCRCY-UHFFFAOYSA-N 0.000 description 1
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 1
- 229960004319 trichloroacetic acid Drugs 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 238000002166 wet spinning Methods 0.000 description 1
Landscapes
- Polyamides (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、高耐熱性の溶融成形可
能な新規な芳香族ポリアミドに関する。さらに、寸法安
定性、機械的特性に優れ、しかも成形加工性に優れた新
規な芳香族ポリアミド樹脂組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a novel heat-meltable aromatic polyamide having high heat resistance. Further, the present invention relates to a novel aromatic polyamide resin composition having excellent dimensional stability and mechanical properties and also having excellent moldability.
【0002】[0002]
【従来技術】従来より、芳香族ジアミンまたは芳香族ジ
イソシアナートと、芳香族ジカルボン酸またはその誘導
体とを反応させて得られる芳香族ポリアミドは、種々の
優れた物性や良好な耐熱性のため、今後も耐熱性が要求
される分野に広く用いられることが期待されている。し
かしながら、従来開発されてきた芳香族ポリアミドは、
優れた機械特性、耐熱性を有した物が多くあるものの、
何れも成形加工性に乏しく、また吸水率が高いという欠
点を有していた。2. Description of the Related Art Conventionally, aromatic polyamides obtained by reacting an aromatic diamine or an aromatic diisocyanate with an aromatic dicarboxylic acid or a derivative thereof have been known for their excellent physical properties and good heat resistance. It is expected to be widely used in fields requiring heat resistance in the future. However, conventionally developed aromatic polyamides are:
Although there are many that have excellent mechanical properties and heat resistance,
All had the drawbacks of poor moldability and high water absorption.
【0003】例えば、下記式(化8)For example, the following formula (Formula 8)
【0004】[0004]
【化8】 で表されるような基本骨格からなる芳香族ポリアミド
(デュポン社製品:商標Kevlar)は、難燃性、耐
熱性や高張力・高弾性率等の優れた特性を有している。
しかし、この芳香族ポリアミドは明瞭なガラス転移温度
を有さず、熱分解温度が430℃であり、加工温度と熱
分解温度が近接しているので、成形材料として用いるに
は加工が難しいという欠点があった。そのため、湿式紡
糸法による繊維、またはパルプ等の分野に利用されてい
るに過ぎない。また、吸水率が4.5%と高く、電気・
電子部品用基材として用いるには寸法安定性、絶縁性、
ハンダ耐熱性等の点に悪影響を与えることが知られてい
る。(「最新・耐熱性高分子」:総合技術センター
(株))Embedded image An aromatic polyamide having a basic skeleton represented by the following formula (a product of DuPont: trade name Kevlar) has excellent properties such as flame retardancy, heat resistance, high tension and high elastic modulus.
However, this aromatic polyamide does not have a clear glass transition temperature, has a thermal decomposition temperature of 430 ° C., and is close to the processing temperature and the thermal decomposition temperature, so that it is difficult to process as a molding material. was there. Therefore, it is only used in the field of fibers by wet spinning or pulp. In addition, the water absorption is as high as 4.5%,
Dimensional stability, insulation,
It is known that it adversely affects solder heat resistance and the like. ("Latest heat-resistant polymer": Sogo Gijutsu Center)
【0005】[0005]
【発明が解決しようとする課題】本発明の課題は、芳香
族ポリアミドが本来有する優れた耐熱性に加え、優れた
加工性と低吸水性の芳香族ポリアミドおよびその製造方
法を提供することである。さらに、前記芳香族ポリアミ
ドの機械的強度、寸法安定性を改善し、さらに加工性に
優れた新規樹脂組成物を提供することにある。An object of the present invention is to provide an aromatic polyamide having excellent processability and low water absorption, in addition to the excellent heat resistance inherent to the aromatic polyamide, and a process for producing the same. . It is still another object of the present invention to provide a novel resin composition which improves the mechanical strength and dimensional stability of the aromatic polyamide and further has excellent processability.
【0006】[0006]
【課題を解決するための手段】本発明者らは、上述の課
題を達成するため鋭意検討した結果、所望の性能を有す
る新規な芳香族ポリアミドおよびその樹脂組成物を見い
だし、以下に示す本発明を完成するに至った。Means for Solving the Problems The present inventors have found, after intensive investigations to achieve the above-mentioned problems, found a novel aromatic polyamide and the resin composition having the desired performance, the present invention described below Was completed.
【0007】[1]下記式(I)で表される構造単位お
よび該構造単位の末端を封止する基のみからなる芳香族
ポリアミド。[1] A structural unit represented by the following formula (I)
And an aromatic polyamide comprising only a group that blocks the terminal of the structural unit .
【化201】 (式中、Xはハロゲン基、Zは縮合多環式芳香族基また
は次式Embedded image (Wherein X is a halogen group, Z is a condensed polycyclic aromatic group or
【化202】 からなる群より選ばれた少なくとも1種の基である。た
だし、Yは直接結合、次式Embedded image At least one group selected from the group consisting of Where Y is a direct bond,
【化203】 Rは炭素数1〜4のアルキル基、アルコキシ基、または
ハロゲン基、フェニル基、aは0、1または2、bは0
または1〜4の整数を表す。また、nは1〜1000の
整数を表す。)で表される芳香族ポリアミド。 [2]次式(II)Embedded image R represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group, or a halogen group, a phenyl group, a represents 0, 1 or 2, and b represents 0.
Or, represents an integer of 1 to 4. N represents an integer of 1 to 1000. The aromatic polyamide represented by). [2] The following formula (II)
【化204】 で表される1,3−ビス(4−アミノフェノキシ)−5
−ハロゲノベンゼンおよび/または1,3−ビス(3−
アミノフェノキシ)−5−ハロゲノベンゼンと、芳香族
ジカルボン酸ジハライドとを脱ハロゲン化水素剤存在下
で、有機溶媒中で60℃以下の反応温度で重縮合させる
ことにより得られることを特徴とする、請求項1]記載
の芳香族ポリアミドの製造方法。 [3]式(II)Embedded image 1,3-bis (4-aminophenoxy) -5 represented by
-Halogenobenzene and / or 1,3-bis (3-
(Aminophenoxy) -5-halogenobenzene and an aromatic dicarboxylic acid dihalide in the presence of a dehydrohalogenating agent in an organic solvent at a reaction temperature of 60 ° C. or lower, which is obtained by polycondensation. [1] A method for producing an aromatic polyamide according to [1]. [3] Formula (II)
【化205】 で表される1,3−ビス(4−アミノフェノキシ)−5
−ハロゲノベンゼンおよび/または1,3−ビス(3−
アミノフェノキシ)−5−ハロゲノベンゼンと、芳香族
ジカルボン酸とを縮合剤存在下で、有機溶媒中で10〜
150℃の反応温度で、重縮合させることにより得られ
ることを特徴とする、[1]記載の芳香族ポリアミドの
製造方法。 [4]式(II)Embedded image 1,3-bis (4-aminophenoxy) -5 represented by
-Halogenobenzene and / or 1,3-bis (3-
Aminophenoxy) -5-halogenobenzene and an aromatic dicarboxylic acid in an organic solvent in the presence of a condensing agent in an organic solvent.
The method for producing an aromatic polyamide according to [1], wherein the aromatic polyamide is obtained by polycondensation at a reaction temperature of 150 ° C. [4] Formula (II)
【化206】 で表される1,3−ビス(4−アミノフェノキシ)−5
−ハロゲノベンゼンおよび/または1,3−ビス(3−
アミノフェノキシ)−5−ハロゲノベンゼンと、芳香族
ジカルボン酸ジアルキレートおよび/または芳香族ジカ
ルボン酸ジアリレートとを、有機溶媒中で100〜30
0℃の反応温度で、重縮合させることにより得られるこ
とを特徴とする、[1]記載の芳香族ポリアミドの製造
方法。 [5]下記式(I)で表される構造単位および該構造単
位の末端を封止する基のみからなり、該構造単位の末端
が、一価のカルボン酸、該カルボン酸誘導体または一価
のアミンにより封止された芳香族ポリアミド。Embedded image 1,3-bis (4-aminophenoxy) -5 represented by
-Halogenobenzene and / or 1,3-bis (3-
Aminophenoxy) -5-halogenobenzene and an aromatic dicarboxylic acid dialkylate and / or an aromatic dicarboxylic acid diallylate in an organic solvent for 100 to 30.
The method for producing an aromatic polyamide according to [1], wherein the aromatic polyamide is obtained by polycondensation at a reaction temperature of 0 ° C. [5] A structural unit represented by the following formula (I) and the structural unit
Consisting only of a group that blocks the terminal of the
Is a monovalent carboxylic acid, the carboxylic acid derivative or the monovalent carboxylic acid.
Aromatic polyamide sealed with amine .
【化207】 (式中、Xはハロゲン基、Zは縮合多環式芳香族基また
は次式Embedded image (Wherein X is a halogen group, Z is a condensed polycyclic aromatic group or
【化208】 からなる群より選ばれた少なくとも1種の基である。た
だし、Yは直接結合、次式Embedded image At least one group selected from the group consisting of Where Y is a direct bond,
【化209】 Rは炭素数1〜4のアルキル基、アルコキシ基、または
ハロゲン基、フェニル基、aは0、1または2、bは0
または1〜4の整数を表す。また、nは1〜1000の
整数を表す。)で表される芳香族ポリアミド。 [6][5]記載の芳香族ポリアミドを製造する方法で
あって、重縮合反応が一価のカルボン酸またはカルボン
酸誘導体の共存下で行われ、芳香族ジカルボン酸または
芳香族ジカルボン酸誘導体の量が芳香族ジアミン1モル
当り、0.7〜1.0モルの割合であり、かつ一価のカ
ルボン酸またはカルボン酸誘導体の量が芳香族ジアミン
1モルに対し0.001〜1.0モルの割合で反応させ
ることを特徴とする芳香族ポリアミドの製造方法。 [7][5]記載の芳香族ポリアミドを製造する方法で
あって、重縮合反応が一価のアミンの共存下で行われ、
芳香族ジアミンの量が芳香族ジカルボン酸または芳香族
ジカルボン酸誘導体1モル当り、0.7〜1.0モルの
割合であり、かつ一価のアミンの量が芳香族ジカルボン
酸または芳香族ジカルボン酸誘導体1モルに対し0.0
01〜1.0モルの割合で反応させることを特徴とする
芳香族ポリアミドの製造方法。 [8][1]または[5]記載の芳香族ポリアミド10
0重量部と、繊維状補強材5〜100重量部と、よりな
る芳香族ポリアミド樹脂組成物。 [9]繊維状補強材がガラス繊維、炭素繊維、チタン酸
カリウム繊維および芳香族ポリアミド繊維よりなる群よ
り選ばれたものである[8]記載の芳香族ポリアミド樹
脂組成物。 [10]芳香族ポリアミド繊維が、下記の式(1)、式
(2)および式(3)で表わされる繰り返し構造単位を
有するものよりなる群より選ばれた少なくとも1種であ
る、[9]記載の芳香族ポリアミド樹脂組成物。Embedded image R represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group, or a halogen group, a phenyl group, a represents 0, 1 or 2, and b represents 0.
Or, represents an integer of 1 to 4. N represents an integer of 1 to 1000. The aromatic polyamide represented by). [6] The method for producing an aromatic polyamide according to [5], wherein the polycondensation reaction is performed in the presence of a monovalent carboxylic acid or a carboxylic acid derivative, and the aromatic polycarboxylic acid or the aromatic dicarboxylic acid derivative is reacted. The amount is 0.7 to 1.0 mole per mole of aromatic diamine, and the amount of monovalent carboxylic acid or carboxylic acid derivative is 0.001 to 1.0 mole per mole of aromatic diamine. A process for producing an aromatic polyamide. [7] The method for producing an aromatic polyamide according to [5], wherein the polycondensation reaction is performed in the presence of a monovalent amine,
The amount of the aromatic diamine is 0.7 to 1.0 mol per 1 mol of the aromatic dicarboxylic acid or the aromatic dicarboxylic acid derivative, and the amount of the monovalent amine is the aromatic dicarboxylic acid or the aromatic dicarboxylic acid. 0.0 per mole of derivative
A method for producing an aromatic polyamide, characterized in that the reaction is carried out at a rate of from 01 to 1.0 mol. [8] The aromatic polyamide 10 according to [1] or [5].
An aromatic polyamide resin composition comprising 0 parts by weight and 5 to 100 parts by weight of a fibrous reinforcing material. [9] The aromatic polyamide resin composition according to [8], wherein the fibrous reinforcing material is selected from the group consisting of glass fibers, carbon fibers, potassium titanate fibers, and aromatic polyamide fibers. [10] The aromatic polyamide fiber is at least one selected from the group consisting of those having a repeating structural unit represented by the following formulas (1), (2) and (3), [9] The aromatic polyamide resin composition according to the above.
【化210】 Embedded image
【化211】 Embedded image
【化212】 [11][8]乃至[10]いずれかに記載の芳香族ポ
リアミド樹脂組成物からなる成形品。Embedded image [11] A molded article comprising the aromatic polyamide resin composition according to any one of [8] to [10].
【0008】[0008]
【0009】[0009]
【0010】[0010]
【0011】[0011]
【0012】[0012]
【0013】[0013]
【0014】[0014]
【0015】本発明の芳香族ポリアミドは、ジアミン成
分として式(II) The aromatic polyamide of the present invention comprises a diamine component.
Formula (II)
【化16】 で表されるジアミン、すなわち1,3−ビス(4−アミ
ノフェノキシ)−5−ハロゲノベンゼンおよび/または
1,3−ビス(3−アミノフェノキシ)−5−ハロゲノ
ベンゼンを用い、これと芳香族ジカルボン酸またはその
誘導体とを重合させて得られる。さらに本発明の芳香族
ポリアミド樹脂組成物は、本発明の芳香族ポリアミドに
繊維状補強材を加えることにより得られる。すなわち、
本発明の芳香族ポリアミドおよびその樹脂組成物は、
1,3−ビス(4−アミノフェノキシ)−5−ハロゲノ
ベンゼンおよび/または1,3−ビス(3−アミノフェ
ノキシ)−5−ハロゲノベンゼンをジアミン成分として
用いることを特徴とし、本来、芳香族ポリアミドの有す
る耐熱性に加え、優れた加工性を併せ持つ、熱可塑性の
芳香族ポリアミドおよびその樹脂組成物である。この芳
香族ポリアミドおよびその樹脂組成物は、優れた耐熱性
に加え熱可塑性であるために、押出成形、射出成形が可
能であり、宇宙・航空機用基材、電気・電子部品用基材
として、さらにまた溶融紡糸法による高強度の高耐熱性
繊維の原料などとして多目的用途に活用が期待でき、極
めて有用である。Embedded image , Ie, 1,3-bis (4-aminophenoxy) -5-halogenobenzene and / or 1,3-bis (3-aminophenoxy) -5-halogenobenzene, and an aromatic dicarboxylic acid It is obtained by polymerizing an acid or a derivative thereof. Further, the aromatic polyamide resin composition of the present invention can be obtained by adding a fibrous reinforcing material to the aromatic polyamide of the present invention. That is,
The aromatic polyamide of the present invention and a resin composition thereof,
An aromatic polyamide characterized by using 1,3-bis (4-aminophenoxy) -5-halogenobenzene and / or 1,3-bis (3-aminophenoxy) -5-halogenobenzene as a diamine component. A thermoplastic aromatic polyamide and a resin composition having excellent processability in addition to the heat resistance of the above. Since the aromatic polyamide and its resin composition are thermoplastic in addition to excellent heat resistance, extrusion molding and injection molding are possible, and as a base material for space and aircraft, and a base material for electric and electronic parts, Furthermore, it can be expected to be used for multipurpose applications as a raw material for high-strength, high heat-resistant fibers by a melt spinning method, and is extremely useful.
【0016】[0016]
【0017】[0017]
【0018】本発明の芳香族ポリアミドを製造する方法
は特に限定がなく、種々の方法を採用できる。例えば、
請求項2〜4に記載の方法である。この方法で使用され
る芳香族ジアミンは、1,3−ビス(4−アミノフェノ
キシ)−5−ハロゲノベンゼンおよび/または1,3−
ビス(3−アミノフェノキシ)−5−ハロゲノベンゼン
である。また、使用される芳香族ジカルボン酸類として
は、請求項3の方法では、芳香族ジカルボン酸が用いら
れる。例えば、前記式中のaが0の場合はフタル酸、メ
チルフタル酸類、エチルフタル酸類、メトキシフタル酸
類、エトキシフタル酸類、クロロフタル酸類、ブロモフ
タル酸類、イソフタル酸類、メチルイソフタル酸類、エ
チルイソフタル酸類、メトキシイソフタル酸類、エトキ
シイソフタル酸類、クロロイソフタル酸類、ブロモイソ
フタル酸類、テレフタル酸、メチルテレフタル酸類、エ
チルテレフタル酸類、メトキシテレフタル酸類、エトキ
シテレフタル酸類、クロロテレフタル酸類、ブロモテレ
フタル酸類などがあげられる。また、aが1または2の
場合は、2,2’−ビフェニルジカルボン酸、4,4’
−ビフェニルジカルボン酸、4,4’−ジフェニルエー
テルジカルボン酸、4,4’−ジフェニルスルフィドジ
カルボン酸、4,4’−ベンゾフェノンジカルボン酸、
4,4’−ジフェニルスルホンジカルボン酸、4,4’
−ジフェニルメタンジカルボン酸、2,2−ビス(4−
カルボキシフェニル)プロパン、2,2−ビス(4−カ
ルボキシフェニル)−1,1,1,3,3,3−ヘキサ
フルオロプロパンなどがあげられる。また、前記式中の
Zが縮合多環式芳香族基の場合は、1,4−ナフタレン
ジカルボン酸、2,3−ナフタレンジカルボン酸、2,
6−ナフタレンジカルボン酸などがあげられる。これら
の芳香族ジカルボン酸は、単独または2種以上混合して
用いられる。The method for producing the aromatic polyamide of the present invention is not particularly limited, and various methods can be employed. For example,
A method according to claims 2-4 . The aromatic diamine used in this method is 1,3-bis (4-aminophenoxy) -5-halogenobenzene and / or 1,3-bis (4-aminophenoxy) -5-halogenobenzene.
Bis (3-aminophenoxy) -5-halogenobenzene. The aromatic dicarboxylic acids used in the method of claim 3 are aromatic dicarboxylic acids. For example, when a in the above formula is 0, phthalic acid, methylphthalic acid, ethylphthalic acid, methoxyphthalic acid, ethoxyphthalic acid, chlorophthalic acid, bromophthalic acid, isophthalic acid, methylisophthalic acid, ethylisophthalic acid, methoxyisophthalic acid, Examples include ethoxyisophthalic acids, chloroisophthalic acids, bromoisophthalic acids, terephthalic acid, methylterephthalic acids, ethylterephthalic acids, methoxyterephthalic acids, ethoxyterephthalic acids, chloroterephthalic acids, and bromoterephthalic acids. When a is 1 or 2, 2,2′-biphenyldicarboxylic acid, 4,4 ′
-Biphenyl dicarboxylic acid, 4,4'-diphenyl ether dicarboxylic acid, 4,4'-diphenyl sulfide dicarboxylic acid, 4,4'-benzophenone dicarboxylic acid,
4,4'-diphenylsulfonedicarboxylic acid, 4,4 '
-Diphenylmethanedicarboxylic acid, 2,2-bis (4-
Carboxyphenyl) propane and 2,2-bis (4-carboxyphenyl) -1,1,1,3,3,3-hexafluoropropane. Further, when Z in the above formula is a condensed polycyclic aromatic group, 1,4-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid,
6-naphthalenedicarboxylic acid and the like. These aromatic dicarboxylic acids are used alone or in combination of two or more.
【0019】また、請求項2の方法では、芳香族ジカル
ボン酸ジハライドが用いられる。例えば、前記の芳香族
ジカルボン酸のジハライド、すなわち芳香族ジカルボン
酸ジクロリド、芳香族ジカルボン酸ジブロミドなどがあ
げられる。これらの芳香族ジカルボン酸ジハライドは、
単独または2種以上混合して用いられる。In the method according to the second aspect, an aromatic dicarboxylic acid dihalide is used. For example, dihalides of the above-mentioned aromatic dicarboxylic acids, that is, aromatic dicarboxylic acid dichloride, aromatic dicarboxylic acid dibromide and the like can be mentioned. These aromatic dicarboxylic dihalides are:
They may be used alone or in combination of two or more.
【0020】また、請求項4の方法では、芳香族ジカル
ボン酸ジアルキルエステルおよび/または芳香族ジカル
ボン酸ジアリルエステルが用いられる。例えば、前記の
芳香族ジカルボン酸のそれぞれ、炭素数1〜10のジア
ルキルエステル、ジフェニルエステル、ジ(フルオロフ
ェニル)エステル、ジ(クロロフェニル)エステル、ジ
(ブロモフェニル)エステル、ジ(メチルフェニル)エ
ステル、ジ(エチルフェニル)エステル、ジ(プロピル
フェニル)エステル、ジ(イソプロピルフェニル)エス
テル、ジ(ブチルフェニル)エステル、ジ(イソブチル
フェニル)エステル、ジ(t−ブチルフェニル)エステ
ル、ジ(メトキシフェニル)エステル、ジ(エトキシフ
ェニル)エステル、ジ(ニトロフェニル)エステル、ジ
(フェニルフェニル)エステル、ジナフチルエステルな
どがあげられる。これらの芳香族ジカルボン酸ジエステ
ルは、単独または2種以上混合して用いられる。Further, in the method of claim 4, an aromatic dicarboxylic acid dialkyl ester and / or an aromatic dicarboxylic acid diallyl ester are used. For example, each of the aromatic dicarboxylic acids has 1 to 10 carbon atoms such as dialkyl ester, diphenyl ester, di (fluorophenyl) ester, di (chlorophenyl) ester, di (bromophenyl) ester, di (methylphenyl) ester, Di (ethylphenyl) ester, di (propylphenyl) ester, di (isopropylphenyl) ester, di (butylphenyl) ester, di (isobutylphenyl) ester, di (t-butylphenyl) ester, di (methoxyphenyl) ester And di (ethoxyphenyl) ester, di (nitrophenyl) ester, di (phenylphenyl) ester, and dinaphthyl ester. These aromatic dicarboxylic diesters are used alone or in combination of two or more.
【0021】上記のジアミン成分と芳香族ジカルボン酸
またはその誘導体は、溶媒中で重合させる。使用される
溶媒としては、例えば、N,N−ジメチルホルムアミ
ド、N,N−ジメチルアセトアミド、N,N−ジエチル
アセトアミド、N,N−ジメチルメトキシアセトアミ
ド、N−メチル−2−ピロリドン、1,3−ジメチル−
2−イミダゾリジノン、N−メチルカプロラクタム、ジ
メチルスルホキシド、ジメチルスルホン、スルホラン、
テトラメチル尿素、ヘキサメチルホスホルアミド、ピリ
ジン、α−ピコリン、β−ピコリン、γ−ピコリン、
2,4−ルチジン、2,6−ルチジン、キノリン、イソ
キノリン、トリエチルアミン、トリプロピルアミン、ト
リブチルアミン、トリベンチルアミン、N,N−ジメチ
ルアニリン、N,N−ジエチルアニリン、ジクロロメタ
ン、クロロホルム、四塩化炭素、1、1、1−トリクロ
ロエタン、1,1,2−トリクロロエタン、トリクロロ
エチレン、1,1,2,2−テトラクロロエタン、テト
ラクロロエチレン、n−ヘキサン、シクロヘキサン、酢
酸メチル、酢酸エチル、酢酸プロピル、酢酸ブチル、ア
セトニトリル、プロピオニトリル、アセトン、メチルエ
チルケトン、メチルブチルケトン、メチルイソブチルケ
トン、シクロヘキサノン、アセトフェノン、イソプロピ
ルエーテル、テトラヒドロフラン、テトラヒドロピラ
ン、1,3−ジオキサン、1,4−ジオキサン、アニソ
ール、フェネトール、ベンジルエーテル、フェニルエー
テル、1,2−ジメトキシエタン、ビス(2−メトキシ
エチル)エーテル、1,2−ビス(2−メトキシエトキ
シ)エタン、ベンゼン、トルエン、o−キシレン、m−
キシレン、p−キシレン、ジフェニル、ターフェニル、
塩化ベンジル、ニトロベンゼン、2−ニトロトルエン、
3−ニトロトルエン、4−ニトロトルエン、クロロベン
ゼン、2−クロロトルエン、3−クロロトルエン、4−
クロロトルエン、o−ジクロロベンゼン、p−ジクロロ
ベンゼン、ブロモベンゼン、フェノール、o−クレゾー
ル、m−クレゾール、p−クレゾール、2,3−キシレ
ノール、2,4−キシレノール、2,5−キシレノー
ル、2,6−キシレノール、3,4−キシレノール、
3,5−キシレノール、o−クロロフェノール、p−ク
ロロフェノール、メタノール、エタノール、プロパノー
ル、イソプロパノール、ブタノール、イソブタノール、
t−ブタノール、シクロヘキサノール、ベンジルアルコ
ール、水等が挙げられる。また、これらの溶媒は、反応
原料モノマーの種類および重合手法により、単独または
2種以上混合して使用しても差し支えない。The above diamine component and aromatic dicarboxylic acid or a derivative thereof are polymerized in a solvent. As the solvent used, for example, N, N-dimethylformamide, N, N-dimethylacetamide, N, N-diethylacetamide, N, N-dimethylmethoxyacetamide, N-methyl-2-pyrrolidone, 1,3- Dimethyl-
2-imidazolidinone, N-methylcaprolactam, dimethylsulfoxide, dimethylsulfone, sulfolane,
Tetramethylurea, hexamethylphosphoramide, pyridine, α-picoline, β-picoline, γ-picoline,
2,4-lutidine, 2,6-lutidine, quinoline, isoquinoline, triethylamine, tripropylamine, tributylamine, tribunylamine, N, N-dimethylaniline, N, N-diethylaniline, dichloromethane, chloroform, carbon tetrachloride 1,1,1-trichloroethane, 1,1,2-trichloroethane, trichloroethylene, 1,1,2,2-tetrachloroethane, tetrachloroethylene, n-hexane, cyclohexane, methyl acetate, ethyl acetate, propyl acetate, butyl acetate, Acetonitrile, propionitrile, acetone, methyl ethyl ketone, methyl butyl ketone, methyl isobutyl ketone, cyclohexanone, acetophenone, isopropyl ether, tetrahydrofuran, tetrahydropyran, 1,3-dioxy 1,4-dioxane, anisole, phenetole, benzyl ether, phenyl ether, 1,2-dimethoxyethane, bis (2-methoxyethyl) ether, 1,2-bis (2-methoxyethoxy) ethane, benzene, toluene , O-xylene, m-
Xylene, p-xylene, diphenyl, terphenyl,
Benzyl chloride, nitrobenzene, 2-nitrotoluene,
3-nitrotoluene, 4-nitrotoluene, chlorobenzene, 2-chlorotoluene, 3-chlorotoluene, 4-
Chlorotoluene, o-dichlorobenzene, p-dichlorobenzene, bromobenzene, phenol, o-cresol, m-cresol, p-cresol, 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2, 6-xylenol, 3,4-xylenol,
3,5-xylenol, o-chlorophenol, p-chlorophenol, methanol, ethanol, propanol, isopropanol, butanol, isobutanol,
t-butanol, cyclohexanol, benzyl alcohol, water and the like. These solvents may be used alone or in combination of two or more, depending on the type of the reaction raw material monomer and the polymerization technique.
【0022】反応原料のモノマーとして芳香族ジカルボ
ン酸ジハライドを用いる場合、通常、脱ハロゲン化水素
剤が併用される。使用される脱ハロゲン化水素剤として
は、トリメチルアミン、トリエチルアミン、トリプロピ
ルアミン、トリブチルアミン、トリペンチルアミン、
N,N−ジメチルベンジルアミン、N,N−ジエチルベ
ンジルアミン、N,N−ジメチルシクロヘキシルアミ
ン、N,N−ジエチルシクロヘキシルアミン、N,N−
ジメチルアニリン、N,N−ジエチルアニリン、N−メ
チルピロリジン、N−エチルピロリジン、N−メチルピ
ペリジン、N−エチルピペリジン、N−メチルモルホリ
ン、N−エチルモルホリン、ピリジン、α−ピコリン、
β−ピコリン、γ−ピコリン、2,4−ルチジン、2,
6−ルチジン、キノリン、イソキノリン、水酸化ナトリ
ウム、水酸化カリウム、水酸化カルシウム、水酸化リチ
ウム、炭酸ナトリウム、炭酸カリウム、炭酸リチウム、
炭酸カルシウム、炭酸水素ナトリウム、炭酸水素カリウ
ム、酸化カルシウム、酸化リチウム、酢酸ナトリウム、
酢酸カリウム、エチレンオキシド、プロピレンオキシド
等が挙げられる。When an aromatic dicarboxylic acid dihalide is used as a reaction raw material monomer, a dehydrohalogenating agent is usually used in combination. As the dehydrohalogenating agent used, trimethylamine, triethylamine, tripropylamine, tributylamine, tripentylamine,
N, N-dimethylbenzylamine, N, N-diethylbenzylamine, N, N-dimethylcyclohexylamine, N, N-diethylcyclohexylamine, N, N-
Dimethylaniline, N, N-diethylaniline, N-methylpyrrolidine, N-ethylpyrrolidine, N-methylpiperidine, N-ethylpiperidine, N-methylmorpholine, N-ethylmorpholine, pyridine, α-picoline,
β-picoline, γ-picoline, 2,4-lutidine, 2,
6-lutidine, quinoline, isoquinoline, sodium hydroxide, potassium hydroxide, calcium hydroxide, lithium hydroxide, sodium carbonate, potassium carbonate, lithium carbonate,
Calcium carbonate, sodium bicarbonate, potassium bicarbonate, calcium oxide, lithium oxide, sodium acetate,
Potassium acetate, ethylene oxide, propylene oxide and the like can be mentioned.
【0023】また、反応原料モノマーとして芳香族ジカ
ルボン酸を用いる場合は、通常、縮合剤が用いられる。
使用される縮合剤としては、無水硫酸、塩化チオニル、
亜硫酸エステル、塩化ピクリル、五酸化リン、オキシ塩
化リン、亜リン酸エステル−ピリジン系縮合剤、トリフ
ェニルホスフィン−ヘキサクロロエタン系縮合剤、プロ
ピルリン酸無水物−N−メチル−2−ピロリドン系縮合
剤等が挙げられる。反応温度は、重合手法、溶媒の種類
により異なるが、通常300℃以下である。反応圧力は
特に限定されず常圧で十分実施できる。反応時間は、反
応原料モノマーの種類、重合手法、溶媒の種類、脱ハロ
ゲン化水素剤の種類、縮合剤の種類及び反応温度により
異なるが、通常、式(I)で表される芳香族ポリアミド
の生成が完了するに十分な時間反応させる通常、10分
〜24時間で十分である。このような反応により式
(I)で表される繰り返し単位を有する芳香族ポリアミ
ドが得られる。When an aromatic dicarboxylic acid is used as a reaction raw material monomer, a condensing agent is usually used.
As the condensing agent used, sulfuric anhydride, thionyl chloride,
Sulfite, picryl chloride, phosphorus pentoxide, phosphorus oxychloride, phosphite-pyridine condensing agent, triphenylphosphine-hexachloroethane condensing agent, propyl phosphoric anhydride-N-methyl-2-pyrrolidone condensing agent And the like. The reaction temperature varies depending on the polymerization technique and the type of solvent, but is usually 300 ° C. or lower. The reaction pressure is not particularly limited, and the reaction can be carried out at normal pressure. The reaction time varies depending on the type of the reaction raw material monomer, the polymerization method, the type of the solvent, the type of the dehydrohalogenating agent, the type of the condensing agent and the reaction temperature, but usually, the aromatic polyamide represented by the formula (I) Usually, 10 minutes to 24 hours are sufficient to allow the reaction to proceed for a time sufficient to complete the production. By such a reaction, an aromatic polyamide having a repeating unit represented by the formula (I) is obtained.
【0024】すなわち、従来、芳香族ポリアミドの合成
法として公知の低温溶液重縮合法、直接重縮合法等のど
の手法によっても、本発明の芳香族ポリアミドを得るこ
とができる。That is, the aromatic polyamide of the present invention can be obtained by any method such as a low-temperature solution polycondensation method and a direct polycondensation method which are conventionally known as a method for synthesizing an aromatic polyamide.
【0025】なお、本発明の芳香族ポリアミドは、反応
原料モノマーとして、1,3−ビス(4−アミノフェノ
キシ)−5−ハロゲノベンゼンおよび/または1,3−
ビス(3−アミノフェノキシ)−5−ハロゲノベンゼン
と芳香族ジカルボン酸またはジカルボン酸ジハライドの
ような芳香族ジカルボン酸誘導体を用いるところに特徴
を有するものである。しかしながら、芳香族ポリアミド
の熱安定性および成形性を向上させるために、一価のカ
ルボン酸またはカルボン酸誘導体もしくは一価のアミン
を用いて、ポリマー分子の末端を封止したものであって
も何ら差し支えない。このような芳香族ポリアミドは、
前記(II)の1,3−ビス(4−アミノフェノキシ)
−5−ハロゲノベンゼンおよび/または1,3−ビス
(3−アミノフェノキシ)−5−ハロゲノベンゼンを主
成分とする芳香族ジアミンと芳香族ジカルボン酸または
芳香族ジカルボン酸誘導体を、一価のカルボン酸または
カルボン酸誘導体、または一価のアミンの共存下に反応
させることによって得られる。すなわち、芳香族ジカル
ボン酸または芳香族ジカルボン酸誘導体の一部を芳香族
および/または脂肪族および/または脂環式モノカルボ
ン酸またはモノカルボン酸ハライドのようなモノカルボ
ン酸誘導体で、またジアミン成分の一部を芳香族および
/または脂肪族および/または脂環式モノアミンで置き
換えて製造する。これらの方法で使用されるモノカルボ
ン酸としては、安息香酸、クロロ安息香酸類、ブロモ安
息香酸類、メチル安息香酸類、エチル安息香酸類、メト
キシ安息香酸類、エトキシ安息香酸類、ニトロ安息香酸
類、アセチル安息香酸類、アセトキシ安息香酸類、ヒド
ロキシ安息香酸類、ビフェニルカルボン酸類、ベンゾフ
ェノンカルボン酸類、ジフェニルエーテルカルボン酸
類、ジフェニルスルフィドカルボン酸類、ジフェニルス
ルホンカルボン酸類、2,2−ジフェニルプロパンカル
ボン酸類、2,2−ジフェニル−1,1,1,3,3,
3−ヘキサフルオロプロパンカルボン酸類、ナフタレン
カルボン酸類、酢酸、クロロ酢酸、ジクロロ酢酸、トリ
クロロ酢酸、フルオロ酢酸、ジフルオロ酢酸、トリフル
オロ酢酸、ニトロ酢酸、プロピオン酸、酪酸、吉草酸、
カプロン酸、シクロヘキサンカルボン酸等があげられ
る。これにモノカルボン酸は単独あるいは2種以上混合
して用いられる。The aromatic polyamide of the present invention has 1,3-bis (4-aminophenoxy) -5-halogenobenzene and / or 1,3-bis (4-aminophenoxy) -5
It is characterized by using bis (3-aminophenoxy) -5-halogenobenzene and an aromatic dicarboxylic acid derivative such as aromatic dicarboxylic acid or dicarboxylic acid dihalide. However, in order to improve the thermal stability and moldability of the aromatic polyamide, even if the terminal of the polymer molecule is blocked with a monovalent carboxylic acid or a carboxylic acid derivative or a monovalent amine, the aromatic polyamide is not modified. No problem. Such aromatic polyamides are
1,3-bis (4-aminophenoxy) of the above (II)
-5-halogenobenzene and / or 1,3-bis (3-aminophenoxy) -5-halogenobenzene as a main component is obtained by converting an aromatic diamine and an aromatic dicarboxylic acid or an aromatic dicarboxylic acid derivative into a monovalent carboxylic acid. Alternatively, it can be obtained by reacting in the presence of a carboxylic acid derivative or a monovalent amine. That is, a part of the aromatic dicarboxylic acid or the aromatic dicarboxylic acid derivative is a monocarboxylic acid derivative such as an aromatic and / or aliphatic and / or alicyclic monocarboxylic acid or a monocarboxylic acid halide, and a diamine component. It is prepared by replacing a part with an aromatic and / or aliphatic and / or alicyclic monoamine. Monocarboxylic acids used in these methods include benzoic acid, chlorobenzoic acids, bromobenzoic acids, methylbenzoic acids, ethylbenzoic acids, methoxybenzoic acids, ethoxybenzoic acids, nitrobenzoic acids, acetylbenzoic acids, acetoxybenzoic acid Acids, hydroxybenzoic acids, biphenylcarboxylic acids, benzophenonecarboxylic acids, diphenylethercarboxylic acids, diphenylsulfidecarboxylic acids, diphenylsulfonecarboxylic acids, 2,2-diphenylpropanecarboxylic acids, 2,2-diphenyl-1,1,1,3 , 3,
3-hexafluoropropanecarboxylic acids, naphthalenecarboxylic acids, acetic acid, chloroacetic acid, dichloroacetic acid, trichloroacetic acid, fluoroacetic acid, difluoroacetic acid, trifluoroacetic acid, nitroacetic acid, propionic acid, butyric acid, valeric acid,
Examples include caproic acid and cyclohexanecarboxylic acid. Monocarboxylic acids may be used alone or in combination of two or more.
【0026】また、モノカルボン酸ハライドとしては、
例えば、前記のモノカルボン酸の酸クロリド、酸ブロミ
ド等があげられる。これらモノカルボン酸ハライドは単
独あるいは2種以上混合して用いられる。Further, as the monocarboxylic acid halide,
For example, there may be mentioned the acid chlorides and acid bromides of the aforementioned monocarboxylic acids. These monocarboxylic acid halides may be used alone or in combination of two or more.
【0027】また、モノカルボン酸エステルとしては、
例えば、前記のモノカルボン酸の炭素数1〜10のアル
キルエステル、フェニルエステル、フルオロフェニルエ
ステル、クロロフェニルエステル、ブロモフェニルエス
テル、メチルフェニルエステル、エチルフェニルエステ
ル、プロピルフェニルエステル、イソプロピルフェニル
エステル、ブチルフェニルエステル、イソブチルフェニ
ルエステル、t−ブチルフェニルエステル、メトキシフ
ェニルエステル、エトキシフェニルエステル、ニトロフ
ェニルエステル、フェニルフェニルエステル、ナフチル
エステル等があげられる。これらのモノカルボン酸エス
テルは、単独または2種以上混合して用いられる。The monocarboxylic acid esters include:
For example, alkyl esters of the above-mentioned monocarboxylic acids having 1 to 10 carbon atoms, phenyl esters, fluorophenyl esters, chlorophenyl esters, bromophenyl esters, methylphenyl esters, ethylphenyl esters, propylphenyl esters, isopropylphenyl esters, butylphenyl esters , Isobutylphenyl ester, t-butylphenyl ester, methoxyphenyl ester, ethoxyphenyl ester, nitrophenyl ester, phenylphenyl ester, naphthyl ester and the like. These monocarboxylic acid esters are used alone or in combination of two or more.
【0028】用いられるモノカルボン酸類の量は、芳香
族ジアミン1モル当り0.001〜1.0モルである。
0.001モル未満では、高温成形時に粘度の上昇がみ
られ、成形加工性低下の原因となる。また、1.0モル
を越えると機械的特性が低下する。好ましい使用量は、
0.01〜0.5モルの割合である。The amount of the monocarboxylic acid used is from 0.001 to 1.0 mol per mol of the aromatic diamine.
If the amount is less than 0.001 mol, the viscosity increases during high-temperature molding, which causes a reduction in moldability. On the other hand, if it exceeds 1.0 mol, the mechanical properties deteriorate. The preferred amount is
The ratio is 0.01 to 0.5 mol.
【0029】また、一価のアミンを使用する場合は、例
えば、アニリン、o−トルイジン、m−トルイジン、p
−トルイジン、2,3−キシリジン、2,4−キシリジ
ン、,5−キシリジン、2,6−キシリジン、3,4−
キシリジン、3,5−キシリジン、o−クロロアニリ
ン、m−クロロアニリン、p−クロロアニリン、o−ブ
ロモアニリン、m−ブロモアニリン、p−ブロモアニリ
ン、o−ニトロアニリン、m−ニトロアニリン、p−ニ
トロアニリン、o−アニシジン、m−アニシジン、p−
アニシジン、o−フェネチジン、m−フェネチジン、p
−フェネチジン、o−アミノフェノール、m−アミノフ
ェノール、p−アミノフェノール、o−アミノベンズア
ルデヒド、m−アミノベンズアルデヒド、p−アミノベ
ンズアルデヒド、o−アミノベンゾニトリル、m−アミ
ノベンゾニトリル、p−アミノベンゾニトリル、2−ア
ミノビフェニル、3−アミノビフェニル、4−アミノビ
フェニル、2−アミノフェニルフェニルエーテル、3−
アミノフェニルフェニルエーテル、4−アミノフェニル
フェニルエーテル、2−アミノベンゾフエノン、3−ア
ミノベンゾフエノン、4−アミノベンゾフエノン、2−
アミノフェニルフェニルスルフィド、3−アミノフェニ
ルフェニルスルフィド、4−アミノフェニルフェニルス
ルフィド、2−アミノフェニルフェニルスルホン、3−
アミノフェニルフェニルスルホン、4−アミノフェニル
フェニルスルホン、α−ナフチルアミン、β−ナフチル
アミン、1−アミノ−2−ナフトール、2−アミノ−1
−ナフトール、4−アミノ−1−ナフトール、5−アミ
ノ−1−ナフトール、5−アミノ−2−ナフトール、7
−アミノ−2−ナフトール、8−アミノ−1−ナフトー
ル、8−アミノ−2−ナフトール、1−アミノアントラ
セン、2−アミノアントラセン、9−アミノアントラセ
ン、メチルアミン、ジメチルアミン、エチルアミン、ジ
エチルアミン、プロピルアミン、ジプロピルアミン、イ
ソプロピルアミン、ジイソプロピルアミン、ブチルアミ
ン、ジブチルアミン、イソブチルアミン、ジイソブチル
アミン、ペンチルアミン、ジペンチルアミン、ベンジル
アミン、シクロプロピルアミン、シクロブチルアミン、
シクロペンチルアミン、シクロヘキシルアミン等が挙げ
られる。これらモノアミンは単独あるいは2種以上混合
して用いられる。用いられるモノアミンの量は、芳香族
ジカルボン酸類1モル当り0.001〜1.0モルであ
る。0.001モル未満では、高温成形時に粘度の上昇
がみられ、成形加工性低下の原因となる。また、1.0
モルを越えると機械的特性が低下する。好ましい使用量
は、0.01〜0.5モルの割合である。When a monovalent amine is used, for example, aniline, o-toluidine, m-toluidine, p-toluidine,
-Toluidine, 2,3-xylidine, 2,4-xylidine, 5,5-xylidine, 2,6-xylidine, 3,4-
Xylidine, 3,5-xylidine, o-chloroaniline, m-chloroaniline, p-chloroaniline, o-bromoaniline, m-bromoaniline, p-bromoaniline, o-nitroaniline, m-nitroaniline, p- Nitroaniline, o-anisidine, m-anisidine, p-
Anisidine, o-phenetidine, m-phenetidine, p
-Phenetidine, o-aminophenol, m-aminophenol, p-aminophenol, o-aminobenzaldehyde, m-aminobenzaldehyde, p-aminobenzaldehyde, o-aminobenzonitrile, m-aminobenzonitrile, p-aminobenzonitrile 2-aminobiphenyl, 3-aminobiphenyl, 4-aminobiphenyl, 2-aminophenylphenyl ether, 3-aminobiphenyl
Aminophenylphenyl ether, 4-aminophenylphenyl ether, 2-aminobenzophenone, 3-aminobenzophenone, 4-aminobenzophenone, 2-aminobenzophenone
Aminophenylphenyl sulfide, 3-aminophenylphenyl sulfide, 4-aminophenylphenyl sulfide, 2-aminophenylphenyl sulfone, 3-aminophenylphenyl sulfide
Aminophenylphenylsulfone, 4-aminophenylphenylsulfone, α-naphthylamine, β-naphthylamine, 1-amino-2-naphthol, 2-amino-1
-Naphthol, 4-amino-1-naphthol, 5-amino-1-naphthol, 5-amino-2-naphthol, 7
-Amino-2-naphthol, 8-amino-1-naphthol, 8-amino-2-naphthol, 1-aminoanthracene, 2-aminoanthracene, 9-aminoanthracene, methylamine, dimethylamine, ethylamine, diethylamine, propylamine , Dipropylamine, isopropylamine, diisopropylamine, butylamine, dibutylamine, isobutylamine, diisobutylamine, pentylamine, dipentylamine, benzylamine, cyclopropylamine, cyclobutylamine,
Cyclopentylamine, cyclohexylamine and the like can be mentioned. These monoamines are used alone or in combination of two or more. The amount of the monoamine used is 0.001 to 1.0 mol per 1 mol of aromatic dicarboxylic acids. If the amount is less than 0.001 mol, the viscosity increases during high-temperature molding, which causes a reduction in moldability. Also, 1.0
If the molar ratio is exceeded, the mechanical properties deteriorate. A preferred amount is 0.01 to 0.5 mol.
【0030】本発明の芳香族ポリアミドおよびその樹脂
組成物は溶融成形に供することが可能である。この場
合、本発明の目的を損なわない範囲で、他の熱可塑性樹
脂を目的に応じて適当量配合することも可能である。配
合することのできる熱可塑性樹脂としては、ポリエチレ
ン、ポリプロピレン、ポリカーボネート、ポリアリレー
ト、ポリアミド、ポリイミド、ポリスルホン、ポリエー
テルスルホン、ポリエーテルケトン、ポリエーテルエー
テルケトン、ポリフェニレンスルフィド、ポリアミドイ
ミド、ポリエーテルイミド、変性ポリフェニレンオキシ
ドなどがあげられる。また、熱硬化性樹脂または充填材
を、本発明の目的を損なわない程度で配合することも可
能である。熱硬化性樹脂としては、フェノール樹脂、エ
ポキシ樹脂等があげられる。充填材としては、グラファ
イト、カーボランダム、ケイ石粉、二硫化モリブデン、
フッ素樹脂等の耐摩耗性向上材、ガラス繊維、カーボン
繊維、ボロン繊維、炭化ケイ素繊維、カーボンウィスカ
ー、アスベスト、金属繊維、セラミックス繊維等の補強
材、三酸化アンチモン、炭酸マグネシウム、炭酸カルシ
ウム等の難燃性向上材、クレー、マイカなどの電気的特
性向上材、アスベスト、シリカ、グラファイトなどの耐
トラッキング向上材、硫酸バリウム、シリカ、メタケイ
酸カルシウム等の耐酸性向上材、鉄粉、亜鉛粉、アルミ
ニウム粉、銅粉等の熱伝導度向上材、その他ガラスビー
ズ、タルク、ケイ藻土、アルミナ、シラスバルン、水和
アルミナ、金属酸化物、着色料等である。The aromatic polyamide and the resin composition of the present invention can be subjected to melt molding. In this case, other thermoplastic resins can be blended in an appropriate amount according to the purpose within a range that does not impair the purpose of the present invention. As thermoplastic resins that can be blended, polyethylene, polypropylene, polycarbonate, polyarylate, polyamide, polyimide, polysulfone, polyethersulfone, polyetherketone, polyetheretherketone, polyphenylenesulfide, polyamideimide, polyetherimide, modified And polyphenylene oxide. It is also possible to add a thermosetting resin or a filler to such an extent that the object of the present invention is not impaired. Examples of the thermosetting resin include a phenol resin and an epoxy resin. Fillers include graphite, carborundum, silica stone powder, molybdenum disulfide,
Reinforcement materials such as abrasion resistance improving materials such as fluororesins, glass fibers, carbon fibers, boron fibers, silicon carbide fibers, carbon whiskers, asbestos, metal fibers, ceramic fibers, etc., and difficulties in antimony trioxide, magnesium carbonate, calcium carbonate, etc. Flame retardant, electrical properties improver such as clay and mica, tracking improver such as asbestos, silica, graphite, acid resistant improver such as barium sulfate, silica, calcium metasilicate, iron powder, zinc powder, aluminum Thermal conductivity improving materials such as powder and copper powder, and other glass beads, talc, diatomaceous earth, alumina, shirasubarun, hydrated alumina, metal oxides, coloring agents, and the like.
【0031】本発明に用いられる繊維状補強材としては
種々のものが用いられ、例えばガラス繊維、炭素繊維、
チタン酸カリウム繊維、芳香族ポリアミド繊維、炭化ケ
イ素繊維、アルミナ繊維、ボロン繊維、セラミック繊維
など、通常公知の無機、または有機繊維が挙げられるが
特に好ましく用いられるものは、ガラス繊維、炭素繊
維、チタン酸カリウム繊維、芳香族ポリアミド繊維であ
る。As the fibrous reinforcing material used in the present invention, various materials are used, for example, glass fiber, carbon fiber,
Usually known inorganic or organic fibers such as potassium titanate fiber, aromatic polyamide fiber, silicon carbide fiber, alumina fiber, boron fiber, and ceramic fiber can be used, but particularly preferably used are glass fiber, carbon fiber, and titanium fiber. Potassium acid fiber and aromatic polyamide fiber.
【0032】本発明に用いられるガラス繊維は、溶融ガ
ラスを種々の方法にて延伸しながら急冷し、所定直径の
細い繊維状としたものであり、単繊維同志を集束剤で集
束させたストランド、ストランドを均一に引きそろえた
束にしたロービング等を意味しており、本発明において
はいずれも使用できる。該ガラス繊維は、本発明の基材
樹脂と親和性をもたせるために、アミノシラン、エポキ
シシランなどのシランカップリング剤、クロミッククロ
ライド、その他目的に応じた表面処理剤で処理したもの
を使用することができる。本発明のおけるガラス繊維の
長さは得られる成形品の物性及び成形品製造時の作業性
に大きく影響する。一般にはガラス繊維長が大となるほ
ど、成形品の物性は向上するが、逆に成形品製造時の作
業性が悪くなる。この為、ガラス繊維の長さが本発明に
おいては0.1〜6mm、好ましくは0.3〜4mmの
範囲にあるものが、成形品の物性及び作業性のバランス
がとれているので好ましい。The glass fiber used in the present invention is obtained by quenching molten glass while stretching it by various methods to form a thin fiber having a predetermined diameter. A strand in which single fibers are bundled with a sizing agent, It means roving or the like in which strands are uniformly arranged in a bundle, and any of them can be used in the present invention. The glass fiber may be treated with a silane coupling agent such as aminosilane or epoxysilane, chromic chloride, or a surface treatment agent according to the intended purpose in order to have an affinity with the base resin of the present invention. it can. The length of the glass fiber in the present invention greatly affects the physical properties of the obtained molded article and the workability during the production of the molded article. Generally, as the glass fiber length increases, the physical properties of the molded article improve, but conversely, the workability during the production of the molded article deteriorates. For this reason, in the present invention, the length of the glass fiber is preferably in the range of 0.1 to 6 mm, more preferably 0.3 to 4 mm, because the physical properties and workability of the molded product are well balanced.
【0033】また本発明で使用される炭素繊維とはポリ
アクリルニトリル、石油ピッチなどを主原料とし、炭化
して得られる高弾性、高強度繊維を示す。本発明ではポ
リアクリルニトリル系、石油ピッチ系いずれも使用でき
る。炭素繊維は補強効果及び混合性などにより、適当な
直径と適当なアスペクト比(長さ/直径の比)を有する
ものを用いる。炭素繊維の直径は、通常5〜20μm、
特に8〜15μm程度のものが好ましい。またアスペク
ト比は1〜600、特に補強効果および混合性とより、
100〜350程度が好ましい。アスペクト比が小さい
と補強効果がなく、またアスペクト比が大きいと混合性
が悪くなり、良好な成形品が得られない。また該炭素繊
維の表面を種々の処理剤、例えばエポキシ樹脂、ポリア
ミド樹脂、ポリカーボネート樹脂、ポリアセタール樹脂
等で処理したもの、その他目的に応じ公知の表面処理剤
を使用したものも用いられる。The carbon fiber used in the present invention is a high elasticity and high strength fiber obtained by carbonizing polyacrylonitrile, petroleum pitch or the like as a main raw material. In the present invention, both polyacrylonitrile and petroleum pitch can be used. Carbon fibers having an appropriate diameter and an appropriate aspect ratio (length / diameter ratio) are used depending on the reinforcing effect and the mixing property. The diameter of the carbon fiber is usually 5 to 20 μm,
Particularly, those having a thickness of about 8 to 15 μm are preferable. In addition, the aspect ratio is 1 to 600, in particular, the reinforcing effect and the mixing property,
About 100 to 350 is preferable. If the aspect ratio is small, there is no reinforcing effect, and if the aspect ratio is large, the mixing property is poor, and a good molded product cannot be obtained. In addition, those obtained by treating the surface of the carbon fiber with various treatment agents, for example, an epoxy resin, a polyamide resin, a polycarbonate resin, a polyacetal resin, and the like, and those using a known surface treatment agent depending on the purpose are also used.
【0034】また本発明で使用されるチタン酸カリウム
繊維は高強度繊維(ウィスカー)の一種であり、化学組
成として K2O・6TiO2 、K2O ・6TiO2 ・1/2H2Oを基本と
する針状結晶であり、代表的融点は1300〜1350
℃である。平均繊維長は5〜50μm、平均繊維径は
0.05〜1.0μmのものが適用されるが、平均繊維
長は20〜30μm、平均繊維径は0.1〜0.3μm
のものが好ましい。該チタン酸カリウム繊維は通常無処
理でも使用しうるが、本発明の基材樹脂と親和性をもた
せる為に、アミノシラン、エポキシシランなどのシラン
カップリング剤、クロミッククロライド、その他目的に
応じた表面処理剤を使用することができる。The potassium titanate fiber used in the present invention is a kind of high-strength fiber (whisker), and its basic chemical composition is K 2 O.6TiO 2 , K 2 O.6TiO 2 .1 / 2H 2 O. Having a typical melting point of 1300 to 1350
° C. An average fiber length of 5 to 50 μm and an average fiber diameter of 0.05 to 1.0 μm are applied, but an average fiber length of 20 to 30 μm and an average fiber diameter of 0.1 to 0.3 μm
Are preferred. The potassium titanate fiber can be usually used without any treatment, but in order to have an affinity with the base resin of the present invention, a silane coupling agent such as aminosilane or epoxysilane, chromic chloride, or other surface treatment according to the purpose. Agents can be used.
【0035】また本発明で使用される芳香族ポリアミド
繊維は比較的新しく開発された耐熱性有機繊維であり、
多くのユニークな特性を生かして各分野への展開が期待
されている。例えば代表的な例として次の様な繰り返し
単位を有する構造式(1)(化17)、式(2)(化1
8)、式(3)(化19)などからなるものが挙げら
れ、これらの1種または2種以上の混合物が用いられ
る。The aromatic polyamide fiber used in the present invention is a relatively newly developed heat-resistant organic fiber,
It is expected to expand into various fields by utilizing many unique characteristics. For example, as typical examples, the structural formulas (1) (formula 17) and (2) (formula 1) having the following repeating units
8) and those represented by the formula (3) (Chemical Formula 19), and one or a mixture of two or more of these are used.
【0036】[0036]
【化17】 例)デュポン社商標:KevlarEmbedded image Example) DuPont trademark: Kevlar
【0037】[0037]
【化18】 例)デュポン社商標:Nomex 帝人商標 :ConexEmbedded image Example) DuPont trademark: Nomex Teijin trademark: Conex
【0038】[0038]
【化19】 ガラス繊維及び炭素繊維においては、5重量部以下では
本発明の特徴とするガラス繊維または炭素繊維特有の補
強効果は得られない。また逆に100重量部以上使用す
ると、組成物の成形時の流動性が悪くなり満足な成形品
を得ることが困難となる。チタン酸カリウム繊維におい
ては5重量部以下では、本発明の特徴とする高温時の機
械特性の改良が不十分である。また逆にその量が多くな
ると溶融混合での分散が不十分になり、更には流動性が
低くなり、通常の条件での成形が困難となり、好ましく
ない。好ましい使用量は10〜100重量部である。芳
香族ポリアミド繊維においては5重量部以下では、本発
明の特徴とする成形加工性及び機械強度の優れた組成物
は得られない。また100重量部以上使用すると、組成
物の成形時の流動性は悪くなり満足な成形品を得ること
が困難となる。好ましい使用量は10〜50重量部であ
る。Embedded image In the case of 5 parts by weight or less of the glass fiber and the carbon fiber, the reinforcing effect peculiar to the glass fiber or the carbon fiber characteristic of the present invention cannot be obtained. Conversely, if it is used in an amount of 100 parts by weight or more, the fluidity during molding of the composition becomes poor, and it becomes difficult to obtain a satisfactory molded product. If the content of the potassium titanate fiber is 5 parts by weight or less, the improvement in mechanical properties at high temperatures, which is a feature of the present invention, is insufficient. Conversely, if the amount is large, dispersion in melt mixing becomes insufficient, and further, the fluidity becomes low, and molding under ordinary conditions becomes difficult, which is not preferable. The preferred amount is 10 to 100 parts by weight. When the amount of the aromatic polyamide fiber is 5 parts by weight or less, a composition excellent in moldability and mechanical strength, which is a feature of the present invention, cannot be obtained. If it is used in an amount of 100 parts by weight or more, the fluidity of the composition at the time of molding deteriorates, and it becomes difficult to obtain a satisfactory molded product. The preferred amount is 10 to 50 parts by weight.
【0039】本発明の芳香族ポリアミドを用いた樹脂組
成物は、通常公知の方法により製造できるが、特に次の
示す方法が好ましい。The resin composition using the aromatic polyamide of the present invention can be produced by a generally known method, but the following method is particularly preferable.
【0040】(1)芳香族ポリアミド粉末、繊維状補強
材を乳鉢、ヘンシェルミキサー、ドラムブレンダー、タ
ンブラーブレンダー、ボールミル、リボンブレンダーな
どを利用して予備混合し、ついで通常公知の溶融混合
機、熱ロールなどで混練したのち、ペレット又は粉状に
する。(1) Aromatic polyamide powder and fibrous reinforcing material are premixed using a mortar, Henschel mixer, drum blender, tumbler blender, ball mill, ribbon blender, and the like, and then a conventionally known melt mixer, hot roll After kneading, the mixture is formed into pellets or powder.
【0041】(2)芳香族ポリアミド粉末をあらかじめ
有機溶媒に溶解あるいは懸濁させ、この溶液あるいは懸
濁液に繊維状補強材を浸漬し、然る後、溶媒を熱風オー
ブン中で除去したのち、ペレット状又は粉状にする。こ
の場合、溶媒として例えばN,N−ジメチルホルムアミ
ド、N,N−ジメチルアセトアミド、N,N−ジエチル
アセトアミド、N,N−ジメチルメトキシアセトアミ
ド、N−メチル−2−ピロリドン、1,3−ジメチル−
2−イミダゾリジノン、N−メチルカプロラクタム、
1,2−ジメトキシエタン、ビス(2−メトキシエチ
ル)エーテル、1,2−ビス(2−メトキシエトキシ)
エタン、ビス{2−(2−メトキシエトキシ)エチル}
エーテル、テトラヒドロフラン、1,3−ジオキサン、
1,4−ジオキサン、ピリジン、ピコリン、ジメチルス
ルホキシド、ジメチルスルホン、テトラメチル尿素、ヘ
キサメチルホスホルアミド等が挙げられる。またこれら
の有機溶媒は単独でも或いは2種以上混合して用いても
差し支えない。(2) The aromatic polyamide powder is previously dissolved or suspended in an organic solvent, the fibrous reinforcing material is immersed in this solution or suspension, and then the solvent is removed in a hot air oven. Pellet or powder. In this case, as a solvent, for example, N, N-dimethylformamide, N, N-dimethylacetamide, N, N-diethylacetamide, N, N-dimethylmethoxyacetamide, N-methyl-2-pyrrolidone, 1,3-dimethyl-
2-imidazolidinone, N-methylcaprolactam,
1,2-dimethoxyethane, bis (2-methoxyethyl) ether, 1,2-bis (2-methoxyethoxy)
Ethane, bis {2- (2-methoxyethoxy) ethyl}
Ether, tetrahydrofuran, 1,3-dioxane,
Examples thereof include 1,4-dioxane, pyridine, picoline, dimethyl sulfoxide, dimethyl sulfone, tetramethyl urea, and hexamethyl phosphoramide. These organic solvents may be used alone or in combination of two or more.
【0042】本発明の芳香族ポリアミド樹脂組成物は、
射出成形法、押出成形法、圧縮成形法、回転成形法など
の公知の成形法により成形され実用に供される。The aromatic polyamide resin composition of the present invention comprises:
It is molded by a known molding method such as an injection molding method, an extrusion molding method, a compression molding method, and a rotational molding method, and put into practical use.
【0043】[0043]
【実施例】以下、実施例および比較例により、本発明の
芳香族ポリアミドの製造例および得られた芳香族ポリア
ミドの物性と性能を、詳細に説明する。EXAMPLES Hereinafter, the production examples of the aromatic polyamide of the present invention and the physical properties and performance of the obtained aromatic polyamide will be described in detail with reference to Examples and Comparative Examples.
【0044】なお、例中で各種物性の測定は次の方法に
よった。 対数粘度:ポリアミド粉末0.50gをヘキサメチルリ
ン酸トリアミド100mlに溶解させた後、35℃にお
いて測定した。 ガラス転移温度(Tg):DSC(島津DT−40シリ
ーズ、DSC−41M)により測定。 5%重量減少温度:空気中でDTA−TG(島津DT−
40シリーズ、DTG−40M)により測定。 溶融粘度:島津高化式フローテスターCFT500Aに
より荷重100Kgで測定。In the examples, various physical properties were measured by the following methods. Logarithmic viscosity: Measured at 35 ° C. after dissolving 0.50 g of polyamide powder in 100 ml of hexamethylphosphoric triamide. Glass transition temperature (Tg): Measured by DSC (Shimadzu DT-40 series, DSC-41M). 5% weight loss temperature: DTA-TG (Shimadzu DT-
40 series, measured by DTG-40M). Melt viscosity: Measured with a load of 100 kg using a Shimadzu Koka type flow tester CFT500A.
【0045】実施例1 攪拌機、窒素導入管を備えた容器に窒素雰囲気下におい
て、1,3−ビス(4−アミノフェノキシ)−5−クロ
ロベンゼン32.68g(0.10モル)とN−メチル
−2−ピロリドン410gを装入して溶解させた後、ト
リエチルアミン24.29g(0.24モル)を添加
し、5℃に冷却した。その後、攪拌を強めテレフタル酸
クロリド20.30g(0.10モル)を装入し、室温
で3時間攪拌を続けた。かくして得られた粘稠なポリマ
ー溶液を、激しく攪拌しているメタノール中に排出して
白色粉末を析出させた。この白色粉末を濾別後、メタノ
ールで洗浄し、180℃で12時間減圧乾燥して、4
4.00g(収率96.3%)のポリアミド粉末を得
た。このポリアミド粉末の対数粘度は0.81dl/
g、ガラス転移温度は241℃、5%重量減少温度は4
70℃であった。得られたポリアミド粉末の元素分析の
結果は次の通りである。Example 1 In a vessel equipped with a stirrer and a nitrogen inlet tube, under a nitrogen atmosphere, 32.68 g (0.10 mol) of 1,3-bis (4-aminophenoxy) -5-chlorobenzene and N-methyl- After charging and dissolving 410 g of 2-pyrrolidone, 24.29 g (0.24 mol) of triethylamine was added, and the mixture was cooled to 5 ° C. Thereafter, stirring was strengthened, and 20.30 g (0.10 mol) of terephthalic acid chloride was charged, and stirring was continued at room temperature for 3 hours. The viscous polymer solution thus obtained was discharged into vigorously stirred methanol to precipitate a white powder. This white powder was separated by filtration, washed with methanol, dried at 180 ° C. under reduced pressure for 12 hours, and dried.
4.00 g (yield 96.3%) of polyamide powder was obtained. The logarithmic viscosity of this polyamide powder is 0.81 dl /
g, glass transition temperature is 241 ° C, 5% weight loss temperature is 4
70 ° C. The results of elemental analysis of the obtained polyamide powder are as follows.
【0046】 C H N 計算値(%) 68.35 3.75 6.13 実測値(%) 69.25 3.60 5.98 また、得られたポリアミド粉末の赤外吸収スペクトル図
を第1図に示す。このスペクトル図では、アミドの特性
吸収帯である1650cm-1と1520cm-1付近に、
顕著な吸収が認められた。さらに得られたポリアミド粉
末をN−メチル−2−ピロリドンに溶解した後、ガラス
板上にキャストし、150℃で1時間、250℃で2時
間加熱して無色透明のポリアミドフィルムを得た。この
ポリアミドフィルムの引張強度は1400Kg/c
m2 、引張伸び率は25%であった。測定法は共にAS
TM D−882に拠る。また、このフィルムの吸水率
は0.71%であった。測定法はASTM D−750
−63に拠る。 C H N calculated value (%) 68.35 3.75 6.13 actually measured value (%) 69.25 3.60 5.98 Also, the infrared absorption spectrum of the obtained polyamide powder is shown in FIG. Shown in the figure. This spectrum diagram, in the vicinity of 1650 cm -1 and 1520 cm -1 which is the characteristic absorption band of amide,
Significant absorption was observed. Furthermore, after dissolving the obtained polyamide powder in N-methyl-2-pyrrolidone, it was cast on a glass plate and heated at 150 ° C. for 1 hour and at 250 ° C. for 2 hours to obtain a colorless and transparent polyamide film. The tensile strength of this polyamide film is 1400 Kg / c
m 2 and the tensile elongation were 25%. Both measurement methods are AS
According to TM D-882. The water absorption of this film was 0.71%. The measurement method is ASTM D-750.
According to -63.
【0047】実施例2 実施例1におけるテレフタル酸クロリドをイソフタル酸
クロリドに代えた以外は実施例1と同様に行い、対数粘
度は0.75dl/gのポリアミド粉末44.50g
(収率97.4%)を得た。このポリアミド粉末のガラ
ス転移温度は228℃、5%重量減少温度は472℃で
あった。得られたポリアミド粉末の元素分析の結果は次
の通りである。Example 2 The procedure of Example 1 was repeated, except that terephthalic acid chloride was replaced with isophthalic acid chloride. 44.50 g of a polyamide powder having a logarithmic viscosity of 0.75 dl / g.
(Yield 97.4%). The glass transition temperature of this polyamide powder was 228 ° C., and the 5% weight loss temperature was 472 ° C. The results of elemental analysis of the obtained polyamide powder are as follows.
【0048】 C H N 計算値(%) 68.35 3.75 6.13 実測値(%) 69.18 3.55 5.91 また、得られたポリアミド粉末の赤外吸収スペクトル図
を第2図に示す。このスペクトル図では、アミドの特性
吸収帯である1660cm-1と1540cm-1付近に、
顕著な吸収が認められた。さらに得られたポリアミド粉
末を用いて、実施例1と同様の方法で無色透明のポリア
ミドフィルムを得た。このポリアミドフィルムの引張強
度は1280Kg/cm2 、引張伸び率は28%、吸水
率は0.68%であった。 C H N calculated value (%) 68.35 3.75 6.13 actually measured value (%) 69.18 3.55 5.91 The infrared absorption spectrum of the obtained polyamide powder is shown in the second section. Shown in the figure. This spectrum diagram, in the vicinity of 1660 cm -1 and 1540 cm -1 which is the characteristic absorption band of amide,
Significant absorption was observed. Further, a colorless and transparent polyamide film was obtained in the same manner as in Example 1 using the obtained polyamide powder. The tensile strength of this polyamide film was 1280 kg / cm 2 , the tensile elongation was 28%, and the water absorption was 0.68%.
【0049】実施例3 実施例1におけるテレフタル酸クロリド20.30g
(0.10モル)をテレフタル酸クロリド10.15g
(0.05モル)とイソフタル酸クロリド10.15g
(0.05モル)に代えた以外は実施例1と同様に行
い、対数粘度は0.77dl/gのポリアミド粉末4
4.55g(収率97.5%)を得た。このポリアミド
粉末のガラス転移温度は233℃、5%重量減少温度は
468℃であった。得られたポリアミド粉末を用いて、
実施例1と同様の方法で無色透明のポリアミドフィルム
を得た。このポリアミドフィルムの引張強度は1310
Kg/cm2 、引張伸び率は28%、吸水率は0.69
%であった。Example 3 20.30 g of terephthalic acid chloride in Example 1
(0.10 mol) to 10.15 g of terephthalic acid chloride
(0.05 mol) and 10.15 g of isophthalic chloride
(0.05 mol) was carried out in the same manner as in Example 1, except that the logarithmic viscosity was 0.77 dl / g.
4.55 g (97.5% yield) was obtained. The glass transition temperature of this polyamide powder was 233 ° C, and the 5% weight loss temperature was 468 ° C. Using the obtained polyamide powder,
A colorless and transparent polyamide film was obtained in the same manner as in Example 1. The tensile strength of this polyamide film is 1310
Kg / cm 2 , tensile elongation 28%, water absorption 0.69
%Met.
【0050】実施例4 実施例1における1,3−ビス(4−アミノフェノキ
シ)−5−クロロベンゼンを1,3−ビス(3−アミノ
フェノキシ)−5−クロロベンゼンに代えた以外は実施
例1と同様に行い、対数粘度は0.86dl/gのポリ
アミド粉末44.55g(収率97.5%)を得た。こ
のポリアミド粉末のガラス転移温度は197℃、5%重
量減少温度は467℃であった。得られたポリアミド粉
末の元素分析の結果は次の通りである。Example 4 Example 1 was repeated except that 1,3-bis (4-aminophenoxy) -5-chlorobenzene in Example 1 was replaced with 1,3-bis (3-aminophenoxy) -5-chlorobenzene. In the same manner, 44.55 g (yield 97.5%) of a polyamide powder having a logarithmic viscosity of 0.86 dl / g was obtained. The glass transition temperature of this polyamide powder was 197 ° C, and the 5% weight loss temperature was 467 ° C. The results of elemental analysis of the obtained polyamide powder are as follows.
【0051】 C H N 計算値(%) 68.35 3.75 6.13 実測値(%) 69.00 3.55 6.03 また、得られたポリアミド粉末の赤外吸収スペクトル図
を第3図に示す。このスペクトル図では、アミドの特性
吸収帯である1660cm-1と1540cm-1付近に、
顕著な吸収が認められた。さらに得られたポリアミド粉
末を用いて、実施例1と同様の方法で無色透明のポリア
ミドフィルムを得た。このポリアミドフィルムの引張強
度は1160Kg/cm2 、引張伸び率は30%、吸水
率は0.78%であった。 C H N calculated value (%) 68.35 3.75 6.13 actually measured value (%) 69.00 3.55 6.03 Further , the infrared absorption spectrum of the obtained polyamide powder is shown in the third part. Shown in the figure. This spectrum diagram, in the vicinity of 1660 cm -1 and 1540 cm -1 which is the characteristic absorption band of amide,
Significant absorption was observed. Further, a colorless and transparent polyamide film was obtained in the same manner as in Example 1 using the obtained polyamide powder. The tensile strength of this polyamide film was 1160 kg / cm 2 , the tensile elongation was 30%, and the water absorption was 0.78%.
【0052】実施例5 実施例4におけるテレフタル酸クロリドをイソフタル酸
クロリドに代えた以外は実施例4と同様に行い、対数粘
度は0.77dl/gのポリアミド粉末44.78g
(収率98.0%)を得た。このポリアミド粉末のガラ
ス転移温度は194℃、5%重量減少温度は460℃で
あった。得られたポリアミド粉末の元素分析の結果は次
の通りである。Example 5 The procedure of Example 4 was repeated except that terephthalic acid chloride was replaced with isophthalic acid chloride. 44.78 g of a polyamide powder having a logarithmic viscosity of 0.77 dl / g was used.
(Yield 98.0%). The glass transition temperature of this polyamide powder was 194 ° C, and the 5% weight loss temperature was 460 ° C. The results of elemental analysis of the obtained polyamide powder are as follows.
【0053】 C H N 計算値(%) 68.35 3.75 6.13 実測値(%) 69.11 3.61 5.99 また、得られたポリアミド粉末の赤外吸収スペクトル図
を第4図に示す。このスペクトル図では、アミドの特性
吸収帯である1650cm-1と1520cm-1付近に、
顕著な吸収が認められた。さらに得られたポリアミド粉
末を用いて、実施例1と同様の方法で無色透明のポリア
ミドフィルムを得た。このポリアミドフィルムの引張強
度は1100Kg/cm2 、引張伸び率は36%、吸水
率は0.77%であった。 C H N calculated value (%) 68.35 3.75 6.13 actually measured value (%) 69.11 3.61 5.99 The infrared absorption spectrum of the obtained polyamide powder is shown in FIG. Shown in the figure. This spectrum diagram, in the vicinity of 1650 cm -1 and 1520 cm -1 which is the characteristic absorption band of amide,
Significant absorption was observed. Further, a colorless and transparent polyamide film was obtained in the same manner as in Example 1 using the obtained polyamide powder. The tensile strength of this polyamide film was 1100 kg / cm 2 , the tensile elongation was 36%, and the water absorption was 0.77%.
【0054】実施例6 実施例4におけるテレフタル酸クロリド20.30g
(0.10モル)をテレフタル酸クロリド10.15g
(0.05モル)とイソフタル酸クロリド10.15g
(0.05モル)に代えた以外は実施例4と同様に行
い、対数粘度は0.80dl/gのポリアミド粉末4
4.50g(収率97.4%)を得た。このポリアミド
粉末のガラス転移温度は195℃、5%重量減少温度は
462℃であった。得られたポリアミド粉末を用いて、
実施例1と同様の方法で無色透明のポリアミドフィルム
を得た。このポリアミドフィルムの引張強度は1120
Kg/cm2 、引張伸び率は35%、吸水率は0.77
%であった。Example 6 20.30 g of terephthalic acid chloride in Example 4
(0.10 mol) to 10.15 g of terephthalic acid chloride
(0.05 mol) and 10.15 g of isophthalic chloride
(0.05 mol) was carried out in the same manner as in Example 4, and the logarithmic viscosity was 0.80 dl / g.
4.50 g (97.4% yield) were obtained. The glass transition temperature of this polyamide powder was 195 ° C, and the 5% weight loss temperature was 462 ° C. Using the obtained polyamide powder,
A colorless and transparent polyamide film was obtained in the same manner as in Example 1. The tensile strength of this polyamide film is 1120
Kg / cm 2 , tensile elongation 35%, water absorption 0.77
%Met.
【0055】実施例7 攪拌機、窒素導入管を備えた容器に窒素雰囲気下におい
て、テレフタル酸16.62g(0.10モル)、塩化
リチウム20.0g、塩化カルシウム60.0g、ピリ
ジン200g、亜リン酸トリフェニル62.0g(0.
20g)、N−メチル−2−ピロリドン850gを装入
して溶解させた後、120℃に昇温した。そこへ、1,
3−ビス(3−アミノフェノキシ)−5−クロロベンゼ
ン32.68g(0.10モル)を装入し、120℃で
2時間攪拌した。かくして得られた粘稠なポリマー溶液
を、激しく攪拌しているメタノール中に排出して白色粉
末を析出させた。この白色粉末を濾別後、メタノールで
洗浄し、180℃で12時間減圧乾燥して、44.82
g(収率98.1%)のポリアミド粉末を得た。このポ
リアミド粉末の対数粘度は0.92dl/g、ガラス転
移温度は197℃、5%重量減少温度は465℃であっ
た。得られたポリアミド粉末の元素分析の結果は次の通
りである。Example 7 In a vessel equipped with a stirrer and a nitrogen inlet tube, under a nitrogen atmosphere, 16.62 g (0.10 mol) of terephthalic acid, 20.0 g of lithium chloride, 60.0 g of calcium chloride, 200 g of pyridine, 200 g of phosphorus suboxide 62.0 g of triphenyl acid (0.
20 g) and 850 g of N-methyl-2-pyrrolidone were charged and dissolved, and then heated to 120 ° C. There, 1,
32.68 g (0.10 mol) of 3-bis (3-aminophenoxy) -5-chlorobenzene was charged and stirred at 120 ° C. for 2 hours. The viscous polymer solution thus obtained was discharged into vigorously stirred methanol to precipitate a white powder. This white powder was separated by filtration, washed with methanol, and dried under reduced pressure at 180 ° C. for 12 hours.
g (yield 98.1%) of a polyamide powder was obtained. The logarithmic viscosity of this polyamide powder was 0.92 dl / g, the glass transition temperature was 197 ° C., and the 5% weight loss temperature was 465 ° C. The results of elemental analysis of the obtained polyamide powder are as follows.
【0056】 C H N 計算値(%) 68.35 3.75 6.13 実測値(%) 69.15 3.58 5.88 また、得られたポリアミド粉末の赤外吸収スペクトル図
を第5図に示す。このスペクトル図は実施例4で得られ
たポリアミド粉と全く同様であり、アミドの特性吸収帯
である1650cm-1と1540cm-1 付近に、顕著
な吸収が認められた。 C H N calculated value (%) 68.35 3.75 6.13 actually measured value (%) 69.15 3.58 5.88 The infrared absorption spectrum of the obtained polyamide powder is shown in FIG. Shown in the figure. The spectrogram is exactly the same as the polyamide powder obtained in Example 4, in the vicinity of 1650 cm -1 and 1540 cm -1 which is the characteristic absorption band of amide, significant absorption was observed.
【0057】実施例8 攪拌機、窒素導入管を備えた容器に窒素雰囲気下におい
て、テレフタル酸ジメチル19.42g(0.10モ
ル)、1,3−ビス(3−アミノフェノキシ)−5−ク
ロロベンゼン32.68g(0.10モル)、ジフェニ
ルエーテル1000gを装入し、250℃で8時間攪拌
した。かくして得られた反応物を激しく攪拌しているメ
タノール中に排出して白色粉末を析出させた。この白色
粉末を濾別後、メタノールで洗浄し、180℃で12時
間減圧乾燥して、43.31g(収率94.8%)のポ
リアミド粉末を得た。このポリアミド粉末の対数粘度は
0.78dl/g、ガラス転移温度は195℃、5%重
量減少温度は462℃であった。得られたポリアミド粉
末の元素分析の結果は次の通りである。Example 8 19.42 g (0.10 mol) of dimethyl terephthalate, 1,3-bis (3-aminophenoxy) -5-chlorobenzene 32 in a vessel equipped with a stirrer and a nitrogen inlet tube under a nitrogen atmosphere. .68 g (0.10 mol) and 1000 g of diphenyl ether were charged and stirred at 250 ° C. for 8 hours. The reaction product thus obtained was discharged into vigorously stirred methanol to precipitate a white powder. This white powder was separated by filtration, washed with methanol, and dried under reduced pressure at 180 ° C. for 12 hours to obtain 43.31 g (yield 94.8%) of a polyamide powder. The logarithmic viscosity of this polyamide powder was 0.78 dl / g, the glass transition temperature was 195 ° C, and the 5% weight loss temperature was 462 ° C. The results of elemental analysis of the obtained polyamide powder are as follows.
【0058】 C H N 計算値(%) 68.35 3.75 6.13 実測値(%) 69.08 3.61 6.03 また、得られたポリアミド粉末の赤外吸収スペクトル図
を第6図に示す。このスペクトル図は実施例4で得られ
たポリアミド粉と全く同様であり、アミドの特性吸収帯
である1640cm-1と1520cm-1 付近に、顕著
な吸収が認められた。 C H N calculated value (%) 68.35 3.75 6.13 actually measured value (%) 69.08 3.61 6.03 Further , the infrared absorption spectrum of the obtained polyamide powder is shown in FIG. Shown in the figure. The spectrogram is exactly the same as the polyamide powder obtained in Example 4, in the vicinity of 1640 cm -1 and 1520 cm -1 which is the characteristic absorption band of amide, significant absorption was observed.
【0059】実施例9 攪拌機、窒素導入管を備えた容器に窒素雰囲気下におい
て、1,3−ビス(3−アミノフェノキシ)−5−クロ
ロベンゼン32.68g(0.10モル)とN−メチル
−2−ピロリドン410gを装入し溶解させた後、トリ
エチルアミン24.29g(0.24モル)を添加し、
5℃に冷却した。その後、攪拌を強めテレフタル酸クロ
リド19.29g(0.095モル)を装入し、室温で
2時間攪拌を続けた。その後、ベンゾイルクロリド2.
11g(0.015モル)を装入し、室温で2時間攪拌
を続けた。得られたポリマー溶液を、激しく攪拌してい
るメタノール中に排出して白色粉末を析出させた。この
白色粉末を濾別後、メタノールで洗浄し、180℃で1
2時間減圧乾燥して、43.82g(収率95.1%)
のポリアミド粉末を得た。このポリアミド粉末の対数粘
度は0.48dl/gであった。得られたポリアミド粉
末の溶融粘度を測定したところ、300℃において70
00ポイズであった。また、得られたストランドは、淡
黄色透明で可撓性に富み、非常に強靱であった。また、
本実施例で得られたポリアミドの熱安定性をフローテス
ターのシリンダー内滞留時間を変えて測定した。測定温
度は300℃で行った。結果を第7図に示す。シリンダ
ー内での滞留時間が長くなっても、溶融粘度はほとんど
変化せず、熱安定性が良好であることがわかる。また、
このポリアミド粉末を280℃、150Kg/cm2 で
15分間圧縮成形して得た成形物の熱変形温度を測定し
たところ、185℃であった。測定法はASTM D−
648、荷重18.6Kg/cm2 に拠る。Example 9 In a vessel equipped with a stirrer and a nitrogen inlet tube, under a nitrogen atmosphere, 32.68 g (0.10 mol) of 1,3-bis (3-aminophenoxy) -5-chlorobenzene and N-methyl- After charging and dissolving 410 g of 2-pyrrolidone, 24.29 g (0.24 mol) of triethylamine was added,
Cooled to 5 ° C. Thereafter, the stirring was strengthened and 19.29 g (0.095 mol) of terephthalic acid chloride was charged, and stirring was continued at room temperature for 2 hours. Then, benzoyl chloride 2.
11 g (0.015 mol) were charged and stirring was continued at room temperature for 2 hours. The resulting polymer solution was discharged into vigorously stirred methanol to precipitate a white powder. This white powder was separated by filtration, washed with methanol, and dried at 180 ° C for 1 hour.
After drying under reduced pressure for 2 hours, 43.82 g (yield 95.1%)
Was obtained. The logarithmic viscosity of this polyamide powder was 0.48 dl / g. The melt viscosity of the obtained polyamide powder was measured.
It was 00 poise. Further, the obtained strand was pale yellow, transparent, highly flexible, and very tough. Also,
The thermal stability of the polyamide obtained in this example was measured by changing the residence time in the cylinder of the flow tester. The measurement was performed at 300 ° C. The results are shown in FIG. Even if the residence time in the cylinder becomes longer, the melt viscosity hardly changes, indicating that the thermal stability is good. Also,
The heat distortion temperature of a molded product obtained by compression molding this polyamide powder at 280 ° C. and 150 kg / cm 2 for 15 minutes was 185 ° C. The measurement method is ASTM D-
648, load 18.6 Kg / cm 2 .
【0060】実施例10 攪拌機、窒素導入管を備えた容器に窒素雰囲気下におい
て、1,3−ビス(3−アミノフェノキシ)−5−クロ
ロベンゼン31.04g(0.095モル)とN−メチ
ル−2−ピロリドン410gを装入し溶解させた後、ト
リエチルアミン24.29g(0.24モル)を添加
し、5℃に冷却した。その後、攪拌を強めテレフタル酸
クロリド20.30g(0.10モル)を装入し、室温
で2時間攪拌を続けた。その後、アニリン1.40g
(0.015モル)を装入し、室温で2時間攪拌を続け
た。得られたポリマー溶液を、激しく攪拌しているメタ
ノール中に排出して白色粉末を析出させた。この白色粉
末を濾別後、メタノールで洗浄し、180℃で12時間
減圧乾燥して、42.51g(収率94.5%)のポリ
アミド粉末を得た。このポリアミド粉末の対数粘度は
0.46dl/gであった。得られたポリアミド粉末の
溶融粘度を測定したところ、300℃において6000
ポイズであった。また、得られたストランドは、淡黄色
透明で可撓性に富み、非常に強靱であった。Example 10 31.04 g (0.095 mol) of 1,3-bis (3-aminophenoxy) -5-chlorobenzene and N-methyl- After charging and dissolving 410 g of 2-pyrrolidone, 24.29 g (0.24 mol) of triethylamine was added, and the mixture was cooled to 5 ° C. Thereafter, the stirring was increased and 20.30 g (0.10 mol) of terephthalic acid chloride was charged, and stirring was continued at room temperature for 2 hours. Then, 1.40 g of aniline
(0.015 mol) and stirring was continued at room temperature for 2 hours. The resulting polymer solution was discharged into vigorously stirred methanol to precipitate a white powder. This white powder was separated by filtration, washed with methanol, and dried under reduced pressure at 180 ° C. for 12 hours to obtain 42.51 g (yield 94.5%) of a polyamide powder. The logarithmic viscosity of this polyamide powder was 0.46 dl / g. The melt viscosity of the obtained polyamide powder was measured.
Poise. Further, the obtained strand was pale yellow, transparent, highly flexible, and very tough.
【0061】比較例1 攪拌機、窒素導入管を備えた容器に窒素雰囲気下におい
てp−フェニレンジアミン2.16g(0.020モ
ル)とN−メチル−2−ピロリドン56.2gを装入し
溶解させた後、トリエチルアミン4.86g(0.04
8モル)を添加し、5℃に冷却した。その後、攪拌を強
めテレフタル酸クロリド3.86g(0.019モル)
を一括装入し、室温で2時間攪拌を続けた。その後、ベ
ンゾイルクロリド0.443g(0.003モル)を装
入し、室温で2時間攪拌を続けた。得られたポリマー溶
液を、激しく攪拌しているメタノール中に排出して白色
粉末を析出させた。この白色粉末を濾別後、メタノール
で洗浄し、180℃で12時間減圧乾燥して、4.75
g(収率97.7%)のポリアミド粉末を得た。このポ
リアミド粉末のガラス転移温度を測定したところ、明瞭
な値を示さなかった。また、300℃および400℃に
おいて溶融粘度を測定したが、いずれの温度においても
溶融流動しなかった。Comparative Example 1 Under a nitrogen atmosphere, 2.16 g (0.020 mol) of p-phenylenediamine and 56.2 g of N-methyl-2-pyrrolidone were charged and dissolved in a vessel equipped with a stirrer and a nitrogen inlet tube. After that, 4.86 g of triethylamine (0.04
8 mol) and cooled to 5 ° C. Thereafter, the stirring was increased to 3.86 g (0.019 mol) of terephthalic acid chloride.
And the stirring was continued at room temperature for 2 hours. Thereafter, 0.443 g (0.003 mol) of benzoyl chloride was charged, and stirring was continued at room temperature for 2 hours. The resulting polymer solution was discharged into vigorously stirred methanol to precipitate a white powder. This white powder was separated by filtration, washed with methanol, and dried under reduced pressure at 180 ° C. for 12 hours.
g (yield 97.7%) of polyamide powder was obtained. When the glass transition temperature of this polyamide powder was measured, no clear value was shown. The melt viscosity was measured at 300 ° C. and 400 ° C., but no melt flow occurred at any temperature.
【0062】比較例2 実施例9と全く同様の方法で、ただしベンゾイルクロリ
ドを使用せずにポリアミド粉を合成した。そのポリアミ
ド粉末の対数粘度は0.48dl/gであった。実施例
9と同様の方法でフローテスターシリンダー内での滞留
時間を変え、溶融粘度を測定したところ、第7図に示す
通り、滞留時間が長くなるにしたがって溶融粘度が増加
し、実施例9で得られたポリアミドに比べて熱安定性に
劣るものであった。Comparative Example 2 A polyamide powder was synthesized in the same manner as in Example 9 except that benzoyl chloride was not used. The logarithmic viscosity of the polyamide powder was 0.48 dl / g. When the residence time in the flow tester cylinder was changed and the melt viscosity was measured in the same manner as in Example 9, the melt viscosity increased as the residence time increased, as shown in FIG. The heat stability was inferior to the obtained polyamide.
【0063】実施例11および12 実施例1および4で得られたポリアミドそれぞれ100
重量部に対して、繊維長3mm、繊維径13μmのシラ
ン処理を施したガラス繊維(日東紡績社商標:CS−3
PE−476S)を表−1に示した量添加し、ドラムブ
レンダー混合機(川田製作所製)で混合した後、口径3
0mmの単軸押出機により300℃の温度で溶融混練し
た後、ストランドを空冷、切断してペレットを得た。得
られたペレットを射出成形(アーブルグ成形機、最大型
締め力35トン、射出圧力500Kg/cm2 、シリン
ダー温度300℃、金型温度150℃)し、各種測定用
試験片を得、測定を行った。測定した引張り強度(AS
TM D−638による)、曲げ強度及び曲げ弾性率
(ASTM D−790)、アイゾット衝撃強度(ノッ
チ付き)(ASTM D−256)、熱変形温度(AS
TM D−648)、成形収縮率(ASTM D−95
5)の結果を表−1に示す。Examples 11 and 12 The polyamides obtained in Examples 1 and 4
Silane-treated glass fiber having a fiber length of 3 mm and a fiber diameter of 13 μm with respect to parts by weight (Nitto Boseki Co., Ltd .: CS-3)
PE-476S) was added in the amount shown in Table 1, and mixed with a drum blender mixer (manufactured by Kawada Seisakusho).
After melt-kneading at a temperature of 300 ° C. using a 0 mm single screw extruder, the strand was air-cooled and cut to obtain a pellet. The obtained pellets were subjected to injection molding (Arburg molding machine, maximum clamping force 35 tons, injection pressure 500 kg / cm 2 , cylinder temperature 300 ° C., mold temperature 150 ° C.) to obtain various test pieces for measurement. Was. Measured tensile strength (AS
TM D-638), flexural strength and flexural modulus (ASTM D-790), Izod impact strength (notched) (ASTM D-256), heat distortion temperature (AS
TM D-648), molding shrinkage (ASTM D-95)
Table 1 shows the results of 5).
【0064】[0064]
【表1】 [Table 1]
【0065】比較例3および4 実施例1および4で得られたポリアミドそれぞれ100
重量部に対して、実施例11および12と同じガラス繊
維を、本発明の範囲以外で用いた結果を表−2に示す。Comparative Examples 3 and 4 The polyamides obtained in Examples 1 and 4
Table 2 shows the results obtained by using the same glass fibers as those in Examples 11 and 12 in parts by weight outside the scope of the present invention.
【0066】[0066]
【表2】 [Table 2]
【0067】実施例13および14 実施例1および4で得られたポリアミドそれぞれ100
重量部に対して、平均直径12μm、長さ3mm、アス
ペクト比250の炭素繊維(東レ社商標:トレカ)を表
−3に示した量添加し、実施例11及び12と同様にし
て表−3に示す結果を得た。Examples 13 and 14 The polyamides obtained in Examples 1 and 4 respectively
Carbon fiber having an average diameter of 12 μm, a length of 3 mm, and an aspect ratio of 250 (trade name of Toray Co., Ltd.) was added to the parts by weight as shown in Table-3. Were obtained.
【0068】[0068]
【表3】 [Table 3]
【0069】比較例5および6 実施例1および4で得られたポリアミドそれぞれ100
重量部に対して、実施例13および14と同じ炭素繊維
をそれぞれ120重量部添加し、実施例13および14
と同様に押出ストランドを試みたが、何れもストランド
化不可であった。Comparative Examples 5 and 6 The polyamides obtained in Examples 1 and 4
120 parts by weight of the same carbon fibers as in Examples 13 and 14 were added to the parts by weight of Examples 13 and 14, respectively.
Extruded strands were tried in the same manner as in Example 1, but none of them could be made into strands.
【0070】実施例15および16 実施例1および4で得られたポリアミドそれぞれ100
重量部に対して、断面直径0.2μm、平均繊維長20
μmのチタン酸カリウム繊維(大塚化学薬品商標:ティ
スモーD)を表−4に示した量添加し、実施例11及び
12と同様にして、表−4に示す結果を得た。Examples 15 and 16 The polyamides obtained in Examples 1 and 4
The cross-sectional diameter is 0.2 μm and the average fiber length is 20
μm potassium titanate fiber (Otsuka Chemical Co., Ltd .: Tismo D) was added in the amount shown in Table 4, and the results shown in Table 4 were obtained in the same manner as in Examples 11 and 12.
【0071】[0071]
【表4】 [Table 4]
【0072】実施例17および18 実施例1および4で得られたポリアミドそれぞれ100
重量部に対して、平均繊維長3mmの芳香族ポリアミド
(デュポン社商標:Kevlar)を表−5に示した量
添加し、実施例11及び12と同様にして、表−5に示
す結果を得た。Examples 17 and 18 The polyamides obtained in Examples 1 and 4, respectively,
To the parts by weight, an aromatic polyamide having an average fiber length of 3 mm (Dupont: Kevlar) was added in the amount shown in Table 5, and the results shown in Table 5 were obtained in the same manner as in Examples 11 and 12. Was.
【0073】[0073]
【表5】 [Table 5]
【0074】[0074]
【発明の効果】本発明は、芳香族ポリアミドが本来有す
る優れた耐熱性に加え、優れた加工性または熱安定性を
有する全く新規な芳香族ポリアミドを提供するものであ
る。更に、本発明の芳香族ポリアミド樹脂組成物は、寸
法安定性、機械強度に優れ加工性が著しく良好なため、
これらの物性を必要とする電気・電子部品、自動車部
品、精密機械部品、更には医療機器部品、宇宙航空機用
基材等に用いられている極めて有用な材料であり、産業
上の利用効果は非常に大きい。The present invention provides a completely novel aromatic polyamide having excellent processability or heat stability in addition to the excellent heat resistance inherent to the aromatic polyamide. Furthermore, the aromatic polyamide resin composition of the present invention has excellent dimensional stability and mechanical strength, and has extremely good workability.
It is an extremely useful material used in electrical / electronic parts, automobile parts, precision machine parts, medical equipment parts, and base materials for spacecraft, etc., which require these physical properties. Big.
【図1】 本発明による実施例1により得られたポリア
ミド粉末の赤外吸収スペクトルの図FIG. 1 is a diagram of an infrared absorption spectrum of a polyamide powder obtained in Example 1 according to the present invention.
【図2】 本発明による実施例2により得られたポリア
ミド粉末の赤外吸収スペクトルの図FIG. 2 is a diagram of an infrared absorption spectrum of a polyamide powder obtained in Example 2 according to the present invention.
【図3】 本発明による実施例4により得られたポリア
ミド粉末の赤外吸収スペクトルの図FIG. 3 is a diagram of an infrared absorption spectrum of a polyamide powder obtained in Example 4 according to the present invention.
【図4】 本発明による実施例5により得られたポリア
ミド粉末の赤外吸収スペクトルの図FIG. 4 is a diagram of an infrared absorption spectrum of a polyamide powder obtained in Example 5 according to the present invention.
【図5】 本発明による実施例7により得られたポリア
ミド粉末の赤外吸収スペクトルの図FIG. 5 is a diagram of an infrared absorption spectrum of a polyamide powder obtained in Example 7 according to the present invention.
【図6】 本発明による実施例8により得られたポリア
ミド粉末の赤外吸収スペクトルのFIG. 6 shows an infrared absorption spectrum of a polyamide powder obtained in Example 8 according to the present invention.
【図7】 本発明による実施例9及び比較例2で得られ
たそれぞれのポリアミド粉末の熱安定性を比較するた
め、測定温度300℃、荷重100Kgで、フローテス
ターのシリンダー内の樹脂滞留時間を変えて溶融粘度を
測定した結果であり、Aが実施例9のものであり、Bが
比較例2のものである。FIG. 7 shows a comparison between the thermal stability of each of the polyamide powders obtained in Example 9 and Comparative Example 2 according to the present invention. The resin residence time in the cylinder of the flow tester was measured at a measurement temperature of 300 ° C. and a load of 100 kg. It is the result of measuring the melt viscosity by changing, where A is that of Example 9 and B is that of Comparative Example 2.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 山口 彰宏 神奈川県横浜市栄区笠間町1190番地 三 井東圧化学株式会社内 (56)参考文献 特開 昭62−177020(JP,A) 特開 昭62−177023(JP,A) 特開 平5−222188(JP,A) (58)調査した分野(Int.Cl.7,DB名) C08G 69/00 - 69/50 C08K 3/00 - 13/08 C08L 77/00 - 77/12 CA(STN) REGISTRY(STN)──────────────────────────────────────────────────続 き Continuation of front page (72) Inventor Akihiro Yamaguchi 1190 Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Mitsui Toatsu Chemicals Co., Ltd. (56) References JP-A-62-177020 (JP, A) JP-A-62 -1777023 (JP, A) JP-A-5-222188 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) C08G 69/00-69/50 C08K 3/00-13/08 C08L 77/00-77/12 CA (STN) REGISTRY (STN)
Claims (11)
該構造単位の末端を封止する基のみからなる芳香族ポリ
アミド。 【化1】 (式中、Xはハロゲン基、Zは縮合多環式芳香族基また
は次式 【化2】 からなる群より選ばれた少なくとも1種の基である。た
だし、Yは直接結合、次式 【化3】 Rは炭素数1〜4のアルキル基、アルコキシ基、または
ハロゲン基、フェニル基、aは0、1または2、bは0
または1〜4の整数を表す。また、nは1〜1000の
整数を表す。)で表される芳香族ポリアミド。1. A structural unit represented by the following formula (I) :
An aromatic polyamide comprising only a group that blocks a terminal of the structural unit . Embedded image (Wherein X is a halogen group, Z is a condensed polycyclic aromatic group or the following formula: At least one group selected from the group consisting of Here, Y is a direct bond, and the following formula: R represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group, or a halogen group, a phenyl group, a represents 0, 1 or 2, and b represents 0.
Or, represents an integer of 1 to 4. N represents an integer of 1 to 1000. The aromatic polyamide represented by).
−ハロゲノベンゼンおよび/または1,3−ビス(3−
アミノフェノキシ)−5−ハロゲノベンゼンと、芳香族
ジカルボン酸ジハライドとを脱ハロゲン化水素剤存在下
で、有機溶媒中で60℃以下の反応温度で重縮合させる
ことにより得られることを特徴とする、請求項1記載の
芳香族ポリアミドの製造方法。2. The following formula (II): 1,3-bis (4-aminophenoxy) -5 represented by
-Halogenobenzene and / or 1,3-bis (3-
(Aminophenoxy) -5-halogenobenzene and an aromatic dicarboxylic acid dihalide in the presence of a dehydrohalogenating agent in an organic solvent at a reaction temperature of 60 ° C. or lower, which is obtained by polycondensation. A method for producing the aromatic polyamide according to claim 1.
−ハロゲノベンゼンおよび/または1,3−ビス(3−
アミノフェノキシ)−5−ハロゲノベンゼンと、芳香族
ジカルボン酸とを縮合剤存在下で、有機溶媒中で10〜
150℃の反応温度で、重縮合させることにより得られ
ることを特徴とする、請求項1記載の芳香族ポリアミド
の製造方法。3. A compound of the formula (II) 1,3-bis (4-aminophenoxy) -5 represented by
-Halogenobenzene and / or 1,3-bis (3-
Aminophenoxy) -5-halogenobenzene and an aromatic dicarboxylic acid in an organic solvent in the presence of a condensing agent in an organic solvent.
The method for producing an aromatic polyamide according to claim 1, wherein the aromatic polyamide is obtained by polycondensation at a reaction temperature of 150 ° C.
−ハロゲノベンゼンおよび/または1,3−ビス(3−
アミノフェノキシ)−5−ハロゲノベンゼンと、芳香族
ジカルボン酸ジアルキレートおよび/または芳香族ジカ
ルボン酸ジアリレートとを、有機溶媒中で100〜30
0℃の反応温度で、重縮合させることにより得られるこ
とを特徴とする、請求項1記載の芳香族ポリアミドの製
造方法。4. A compound of the formula (II) 1,3-bis (4-aminophenoxy) -5 represented by
-Halogenobenzene and / or 1,3-bis (3-
Aminophenoxy) -5-halogenobenzene and an aromatic dicarboxylic acid dialkylate and / or an aromatic dicarboxylic acid diallylate in an organic solvent for 100 to 30.
The method for producing an aromatic polyamide according to claim 1, wherein the aromatic polyamide is obtained by polycondensation at a reaction temperature of 0 ° C.
該構造単位の末端を封止する基のみからなり、該構造単
位の末端が、一価のカルボン酸、該カルボン酸誘導体ま
たは一価のアミンにより封止された芳香族ポリアミド。 【化103】 (式中、Xはハロゲン基、Zは縮合多環式芳香族基また
は次式 【化104】 からなる群より選ばれた少なくとも1種の基である。た
だし、Yは直接結合、次式 【化105】 Rは炭素数1〜4のアルキル基、アルコキシ基、または
ハロゲン基、フェニル基、aは0、1または2、bは0
または1〜4の整数を表す。また、nは1〜1000の
整数を表す。)で表される芳香族ポリアミド。5. A structural unit represented by the following formula (I) :
It consists only of a group that blocks the end of the structural unit,
Is terminated with a monovalent carboxylic acid, the carboxylic acid derivative or the like.
Or an aromatic polyamide sealed with a monovalent amine . Embedded image (Wherein X is a halogen group, Z is a condensed polycyclic aromatic group or the following formula: At least one group selected from the group consisting of Here, Y is a direct bond, and the following formula: R represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group, or a halogen group, a phenyl group, a represents 0, 1 or 2, and b represents 0.
Or, represents an integer of 1 to 4. N represents an integer of 1 to 1000. The aromatic polyamide represented by).
する方法であって、重縮合反応が一価のカルボン酸また
はカルボン酸誘導体の共存下で行われ、芳香族ジカルボ
ン酸または芳香族ジカルボン酸誘導体の量が芳香族ジア
ミン1モル当り、0.7〜1.0モルの割合であり、か
つ一価のカルボン酸またはカルボン酸誘導体の量が芳香
族ジアミン1モルに対し0.001〜1.0モルの割合
で反応させることを特徴とする芳香族ポリアミドの製造
方法。6. The method for producing an aromatic polyamide according to claim 5, wherein the polycondensation reaction is carried out in the coexistence of a monovalent carboxylic acid or a carboxylic acid derivative, and the aromatic dicarboxylic acid or the aromatic dicarboxylic acid is used. The amount of the derivative is 0.7 to 1.0 mol per mol of the aromatic diamine, and the amount of the monovalent carboxylic acid or the carboxylic acid derivative is 0.001 to 1 mol per mol of the aromatic diamine. A method for producing an aromatic polyamide, wherein the reaction is carried out at a ratio of 0 mol.
する方法であって、重縮合反応が一価のアミンの共存下
で行われ、芳香族ジアミンの量が芳香族ジカルボン酸ま
たは芳香族ジカルボン酸誘導体1モル当り、0.7〜
1.0モルの割合であり、かつ一価のアミンの量が芳香
族ジカルボン酸または芳香族ジカルボン酸誘導体1モル
に対し0.001〜1.0モルの割合で反応させること
を特徴とする芳香族ポリアミドの製造方法。7. The method for producing an aromatic polyamide according to claim 5, wherein the polycondensation reaction is carried out in the presence of a monovalent amine, and the amount of the aromatic diamine is aromatic dicarboxylic acid or aromatic dicarboxylic acid. 0.7-per mole of acid derivative
Aroma, characterized in that the reaction is carried out at a ratio of 0.001 to 1.0 mol with respect to 1 mol of the aromatic dicarboxylic acid or the aromatic dicarboxylic acid derivative. For producing aromatic polyamides.
ミド100重量部と、繊維状補強材5〜100重量部
と、よりなる芳香族ポリアミド樹脂組成物。8. An aromatic polyamide resin composition comprising 100 parts by weight of the aromatic polyamide according to claim 1 or 5 and 5 to 100 parts by weight of a fibrous reinforcing material.
チタン酸カリウム繊維および芳香族ポリアミド繊維より
なる群より選ばれたものである請求項8記載の芳香族ポ
リアミド樹脂組成物。9. The fibrous reinforcing material is glass fiber, carbon fiber,
9. The aromatic polyamide resin composition according to claim 8, which is selected from the group consisting of potassium titanate fibers and aromatic polyamide fibers.
(1)、式(2)および式(3)で表わされる繰り返し
構造単位を有するものよりなる群より選ばれた少なくと
も1種である、請求項9記載の芳香族ポリアミド樹脂組
成物。 【化5】 【化6】 【化7】 10. The aromatic polyamide fiber is at least one selected from the group consisting of those having a repeating structural unit represented by the following formulas (1), (2) and (3). Item 10. An aromatic polyamide resin composition according to item 9. Embedded image Embedded image Embedded image
香族ポリアミド樹脂組成物からなる成形品。11. A molded article comprising the aromatic polyamide resin composition according to claim 8.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP02920892A JP3187504B2 (en) | 1991-03-29 | 1992-02-17 | Polyamide resin and its resin composition |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3-66056 | 1991-03-29 | ||
JP6605691 | 1991-03-29 | ||
JP02920892A JP3187504B2 (en) | 1991-03-29 | 1992-02-17 | Polyamide resin and its resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0578476A JPH0578476A (en) | 1993-03-30 |
JP3187504B2 true JP3187504B2 (en) | 2001-07-11 |
Family
ID=26367375
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JP02920892A Expired - Fee Related JP3187504B2 (en) | 1991-03-29 | 1992-02-17 | Polyamide resin and its resin composition |
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JP4743687B2 (en) * | 2005-03-18 | 2011-08-10 | 大阪府 | Method for producing functional polyamide fine particles |
JP5408957B2 (en) * | 2008-10-22 | 2014-02-05 | 日本化薬株式会社 | Highly transparent phenolic hydroxyl group-containing aromatic polyamide resin and composition containing the same |
CN114573805B (en) * | 2022-01-19 | 2024-03-08 | 浙江恒逸石化研究院有限公司 | Preparation method of high-barrier transparent flame-retardant copolymerized nylon |
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- 1992-02-17 JP JP02920892A patent/JP3187504B2/en not_active Expired - Fee Related
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