JP3186008B2 - Wafer holding device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for holding a wafer using electrostatic force in a wafer holding apparatus of a wafer processing apparatus.

[0002]

2. Description of the Related Art A wafer holding device of a conventional wafer processing apparatus is disclosed in Japanese Patent Application Laid-Open Nos. 2-148837 and 2-267.
As shown in Japanese Patent No. 271, there is generally used a method in which the outer peripheral portion of a wafer is pressed and held by a claw-shaped member. When there is a member that comes into contact with the wafer surface, the contact portion has a problem that processing of the wafer is hindered, and the contact member also performs some processing together with the wafer.
As a result, a foreign matter source such as a reaction product may adhere to the contact member, or the contact member may be damaged, thereby generating foreign matter.

Further, in a method of holding a wafer by using an electrostatic force (hereinafter, referred to as electrostatic attraction), a wafer is made of a dielectric material as disclosed in, for example, Japanese Patent Application Laid-Open No. 2-157553. The wafer is placed on the electrostatic attraction unit, a high voltage is applied, and the wafer is held by the electrostatic attraction force. In this case, a member or the like for pressing the wafer is not particularly described on the outer peripheral portion of the wafer. Therefore, the possibility of foreign matter generation by the contact member as in the above example has been solved. However, the positional relationship between the wafer and the electrostatic attraction member is such that a step is provided on the electrostatic attraction member such that the wafer is located at the uppermost position (toward the wafer processing space) and the electrostatic attraction member is below the wafer. I have. With such a step,
It is also conceivable that the gas flow during wafer processing changes abruptly at the outer peripheral portion of the wafer, causing non-uniformity in wafer processing.

In the example described in JP-A-63-56920, a wafer is placed on a flat electrostatic attraction member. In this case, it is conceivable that the electrostatic chucking portion around the wafer may be damaged during wafer processing or a deposit may be generated, and when the next wafer is transported,
If the transfer accuracy is not sufficient, the wafer may be damaged or placed on the deposition portion, and there is a concern that a transfer error or a defect in wafer processing may occur.

[0005] Regarding the transfer and transfer of the wafer, the wafer is moved up and down with a push-up pin or the like, the wafer is placed on the wafer holding unit, and then the wafer is processed at that position. The holding device may be moved up to this point. In the former case, there is no particular problem, but in the latter case, it is necessary to make the method of transporting the holding section highly reliable. In the example described in JP-A-59-186325, a shaft directly connected to a drive shaft of a cylinder installed on the atmosphere side passes through the decompression chamber, and the atmosphere and the decompression chamber are isolated by a seal ring. Further, a wafer holding device is connected to the penetrated shaft, and the wafer is moved up and down. The seal between the atmosphere and the decompression chamber at the top and bottom of the wafer is
It relies on sliding between the seal ring and the through shaft. In such a case, it is necessary to sufficiently take care not to damage the seal ring. Damage can cause foreign objects,
Careful attention is required especially when the wafer processing is performed in a corrosive gas or plasma, because it may cause a leak. Also, in the example in which a metal block as a wafer holding device is movable, in the case of JP-A-58-32410, a bellows connected to a wafer processing device is connected to the metal block via an insulator. However, in this example showing the wafer holding of the sputtering apparatus, the bellows is directly connected to the metal block from the inner wall of the container of the wafer processing apparatus (sputtering chamber), and the transfer mechanism member required for wafer transfer is installed. Must be considered separately.

[0006]

A conventional wafer holding method is as follows.
Because some member is in contact with the processing surface of the wafer,
There is a problem that foreign matter is easily generated from the contact portion and the vicinity thereof, the yield of wafer processing is reduced, and the cleaning rate of the wafer processing apparatus needs to be frequently performed, and the operation rate of the apparatus decreases. Also, when the wafer processing and the wafer transfer position are different, it was necessary to move the wafer holding device up and down, but the elastomer seal portion slides to shut off the wafer processing chamber and the outside world at this time. As a result, there is a problem that foreign matter is easily generated. Further, when wafer processing is performed in plasma, there is a problem that the elastomer seal is easily deteriorated. Another object of the present invention is to devise a method of manufacturing the wafer holding device to prevent leakage of the coolant for adjusting the temperature of the wafer, or to abolish the use of an elastomer seal for sealing the same.

Further, in order to provide a wafer holding apparatus capable of reliably and uniformly performing a wafer processing which is an original object of the wafer processing apparatus, the present invention also aims to make the gas flow for the wafer processing uniform. And one of them. Furthermore, in order to more reliably hold the wafer by the electrostatic force, even if the wafer slides in the lateral direction, it is necessary to forcibly use the outer peripheral member.

[0008] By providing a wafer holding apparatus with reduced foreign matter as described above and enabling uniform wafer processing, it is possible to improve the yield of wafer processing and improve the operation rate of the wafer processing apparatus. This is a problem to be solved by the present invention.

[0009]

SUMMARY OF THE INVENTION A feature of the present invention is that a wafer is provided.
Metal part provided with a flow path for circulating a refrigerant that regulates the temperature of
To hold the wafer with electrostatic force on one surface of the material
Form a dielectric thin film and contact the other surface of the metal member
Place an electrically insulating member and ground it to a certain reference potential.
A reference potential member made of a good electrical conductor
Kinds of members are metal members with dielectric thin film, electrical insulation material
Material and a reference potential member are stacked and fixed in this order, and the reference potential member is
Supply of the refrigerant penetrating into the refrigerant passage of the metal member from the side.
Refrigerant flow with side surfaces composed of electrically insulating members for discharge and discharge
Path, and at least penetrate the three types of members.
Three or more side walls are provided with through holes made of electrically insulating material
Insert a movable member connected to the wafer transfer mechanism
And a pipe-shaped member made of a good electrical conductor
Fixed to the position member to support the three types of members,
It is made of a good electrical conductor through an electrically insulating material inside the member
Insert the small-diameter pipe-shaped member, and
A metal member penetrating through the semi-potential member and the electrically insulating material member;
To the wafer holder through the small-diameter pipe member.
Potential for generating electrostatic force and RF power required for processing the wafer
Pressure so that the hole inside the small diameter pipe is
Gas can be supplied between the backside of the wafer and the surface of the dielectric thin film.
The metal member and the dielectric thin film have side walls electrically disconnected so that
In a wafer holding device provided with a through hole made of an edge material.
According to the present invention , foreign substances can be reduced by eliminating a member that comes into contact with the wafer processing surface. For this purpose, a wafer holding device utilizing electrostatic force is employed. In addition, a structure of a wafer holding device capable of restricting use of an elastomer seal, which is a source of foreign matter, as much as possible is employed. Next, in order to prevent the case where by generating a bias potential by applying RF power to the upper blade performs wafer processing, the occurrence of abnormal discharge, RF
Both parts were cut off with an electrically insulating material so that the power application part and the reference potential part did not directly oppose each other. After such treatment, pins for transferring the wafer are provided, and the pins can be electrically connected. By pins and the wafer are in contact, the electrostatic attractive force due to residual charges the charge accumulated on the wafer is removed at the time of wafer transfer since disappear instantaneously, never wafer is pushed up by the excessive force.

In order to make the gas flow on the wafer surface uniform, a gas flow equalizing member (referred to as a susceptor) is provided on the outer peripheral portion of the wafer. The susceptor is located above or above the wafer surface, and the susceptor surface is separated from the wafer surface so that the gas flow does not change suddenly on the outer peripheral surface of the wafer.
It is slightly higher . In addition, the surface facing the outer peripheral portion of the wafer is made substantially perpendicular to the wafer surface, and the lateral movement and side slip of the wafer are forced. Further, reaction products and plasma generated during wafer processing may flow between the cover member facing the wafer back surface and the wafer back surface in the outer peripheral portion of the wafer, and foreign matter may adhere to the wafer back surface. This was prevented by reducing the distance between the cover member and the cover member.

[0011]

As described above, foreign matter adhering to the wafer eliminates the source of the foreign matter as much as possible, thereby reducing the foreign matter. Further, the gas flow is made uniform, and the in-plane uniformity of the wafer processing can be improved. In addition, by devising the structure and manufacturing method of the wafer holding device, the wafer temperature measurement and the wafer presence / absence detector can be easily installed, and the reliability of the device and the usability can be improved.

[0012]

Embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows an example of an embodiment of the present invention. FIG.
1, a wafer 1 is held on a dielectric thin film 3 formed on a metal member 2. Further, below the metal member 2, the insulating member 4 and the base 5 continue, and are supported by the support 6. In the metal member 2, a coolant channel 7 through which a coolant for adjusting the temperature of the wafer 1 flows is formed. In order to supply the coolant to the coolant channel 7, a through hole is formed through the base 5 through the insulating member 4. The cooling medium supply unit 8 is provided. Also,
Wafer transfer pins 9 are inserted into through holes to the metal member 2, the insulating member 4, and the base 5, and the side walls of the through holes are formed by an insulating tube 10 made of an electrically insulating material . The wafer transfer pin 9 is guided by a guide 11 provided around the support 6, and is moved in the axial direction of the support 6 by a vertical mechanism (not shown) to transfer the wafer 1. An RF supply shaft 13 is installed inside the support 6 via an insulating material 12.
Reference numeral 3 denotes a pipe, and the inside thereof is a wafer cooling gas supply hole 14. The insulating member 12 penetrates the base 5 and reaches the insulating member 4. The RF supply shaft 13 penetrates through the insulating member 4 and reaches the metal member 2, and the other end (the lower side in the figure) of the RF supply shaft 13, although not shown, attaches the wafer 1 to the dielectric thin film 3. It is connected to each power supply for applying a high voltage for holding and a high frequency bias to the wafer 1. In FIG. 1, a wafer detector 15 for checking the presence or absence of a wafer is provided. At this position, a wafer temperature detector can also be installed. Then, the susceptor 16 in the outer peripheral portion of the wafer 1 (<br/> cover of Yuden thin film 3 and the metal member 2) is installed, to equalize the gas flow for wafer processing. The inner peripheral surface of the susceptor 16 is
Is opposed to the back surface. The susceptor 16 is made of an electrically insulating material such as alumina, and covers the outer peripheral portions of the metal member 2, the insulating member 4, and the base 5.

The wafer holding device shown in FIG. 1 is used, for example, in a plasma atmosphere as shown in FIG. FIG. 2 is a schematic diagram of a microwave plasma etching apparatus.
Hereinafter, a case where the wafer holding apparatus of the present invention is applied to an etching apparatus will be described as an example.

A vacuum container 17 is provided with a wafer holding device 18, a vacuum pump 19, and an etching gas supply unit 20. Further, microwaves are introduced into the wafer processing chamber 21 through a quartz window 22. Microwaves are generated in a magnetron 23 and passed through a waveguide 24 to a wafer processing chamber 21.
It is led to. Further, a DC power supply 25 for electrostatic attraction and an RF power supply 26 for applying a bias voltage required for etching to the wafer 1 are connected to the wafer holding device 18. The RF supply shaft 13 has a hollow structure,
Gas (helium, etc.) for temperature control is supplied to gas supply hole 2
Introduced from 7. Plasma 28 is placed in wafer processing chamber 21.
Is generated, thereby performing wafer processing.

Although not shown in FIG. 2, the vacuum vessel 17 is connected via a valve to another vacuum chamber for introducing or carrying out the wafer 1 from the atmosphere. The wafer 1 transferred to the vacuum chamber 17 using this wafer transfer mechanism is transferred at a transfer position indicated by a two-dot chain line in FIG. Therefore, the wafer holding device 18 is lowered to the transfer position. By raising and lowering the wafer transfer pins 9 at this position, the wafer 1 is transferred and placed on the dielectric thin film surface 3. Note that the coolant for adjusting the temperature of the wafer 1 is as follows.
It is introduced from a coolant supply 8 through a separately provided coolant temperature controller and circulates through a coolant channel 7, and the temperatures of the metal member 2 and the dielectric thin film 3 have already been adjusted to predetermined temperatures. Wafer 1
Is mounted on the wafer holding device 18, the wafer detector 1
The laser beam introduced from 5 is reflected on the back side of the wafer,
The reflected light is detected as a signal, and the placement of the wafer 1 is confirmed. The wafer presence / absence detector is
Even if it is configured to perform with the signal of the detector that measures the temperature of c
good. Also, although not shown in FIG.
The wafer temperature is started to be detected by a wafer temperature detector (fluorescence thermometer) provided in the same manner as in 5. When an etching gas is supplied and microwaves are introduced, discharge starts. In this state, a DC voltage for electrostatic attraction is supplied from the DC power supply 25, an electric circuit for electrostatic attraction is formed via the plasma 28, and the wafer 1 is attracted to the dielectric thin film 3. . Next, when helium gas is supplied from the gas supply holes 27, wafer temperature control via the helium gas proceeds. In this state, the preparation for etching is completed.
Etching is performed by applying a voltage. When the etching process is completed, the application of the RF voltage is stopped. At this time, the plasma 28 is still present. That is, the wafer 1 remains electrostatically attracted. The supply of the etching gas is stopped, and in some cases, a non-etching gas such as argon is introduced instead of the etching gas in order to remove electric charges accumulated during the electrostatic adsorption, and the charge is removed. During this time, the supply of the helium gas is stopped, and the force for pushing up the wafer 1 from the back surface of the wafer 1 is removed. When the static elimination is completed, the supply of the argon gas is stopped, and the application of the DC voltage for electrostatic adsorption is also stopped. When the etching gas and the charge removing gas are exhausted and a high vacuum is reached, the downward movement of the wafer holding device 18 and the step of unloading the wafer 1 are started. The unloading step is performed in the reverse order of the introducing step, and a new wafer is introduced for the next etching. Thus, etching is performed.

Hereinafter, the effects of the present invention will be described in order. The etching gas on the wafer surface and the reaction product (gas) generated by the etching are distributed at a substantially uniform concentration on the surface of the wafer 1, but at the outer peripheral portion of the wafer, the reaction product is generated outside the wafer. There is a possibility that the etching characteristics at the peripheral portion are different from those at the central portion due to the sudden change of the flow channel boundary for the gas flow. Therefore, in the present invention, the susceptor 16 is arranged above the wafer 1 to prevent a sudden change in gas flow above the surface of the wafer 1 (or on the same plane). Because of the surface of the susceptor 16, the flow of the etching gas and the reaction product is directed slightly upward at the outer peripheral portion of the wafer, and a stagnation effect of the etching gas and the reaction product appears. Such a phenomenon will be shown. Therefore, the etching is performed uniformly even in the outer peripheral portion of the wafer.

Further, in addition to the above, since the outer peripheral surface of the wafer 1 is housed in the susceptor 16, the electrostatic attraction disappears due to some abnormal situation, and the helium supplied to the back surface of the wafer 1 Even if the gas is moved by the pressure of the gas, the wafer 1 can be prevented from being largely shifted on the side wall of the susceptor 16, so that it is possible to prevent a situation in which the wafer cannot be delivered and the etching chamber needs to be opened to the atmosphere. is there. At this time, since the surface of the susceptor 16 facing the outer peripheral surface of the wafer is almost vertical, even if the wafer 1 slides, the surface of the susceptor 16 is tapered.
Unlike the case where the wafer 1 is in the shape of a circle, the wafer 1 does not run on the horizontal surface of the susceptor 16.

Next, the gap between the back surface of the outer peripheral portion of the wafer 1 and the susceptor 16 will be described. FIG. 3 shows an enlarged view of the outer peripheral portion of the wafer. On the wafer processing surface side, plasma 28 is generated, and etching gas and reaction products are flying around. Therefore, the inter-gap of the back and the susceptor 16 the wafer 1 is large, they are intrusions City gap, it is deposited, such as the upper teeth back surface. This is not preferable because it becomes foreign matter on the back surface of the wafer, which may lower the yield.
Therefore, if the gap between the two is made as small as possible, entry of the etching gas and reaction products can be reduced, and foreign matter on the back surface of the wafer can be reduced. According to the results of another test, when the gap was set to 0.3 mm or less, the above effect was remarkable.

The above-described etching process is performed by applying an RF voltage to the wafer 1. At this time, R
An abnormal discharge may occur between the metal member 2 to which the F voltage is applied and the base 5. When this abnormal discharge occurs, the RF voltage is not normally applied to the wafer 1, and the etching itself becomes abnormal. This can be generally applied to a wafer processing apparatus that generates plasma using an RF voltage, not limited to etching. In order to prevent this, in the wafer holding device of the present invention, the insulating tube 10 is inserted so that the base 5 at a different potential from the RF application unit can be spatially cut off. Thereby, abnormal discharge can be prevented.

The delivery of the wafer 1 will be described. While the wafer 1 is electrostatically attracted, electric charges are accumulated on the wafer 1 at this time. This electric charge has a capability of adsorbing the wafer 1 to the dielectric thin film 3, and the wafer 1 is electrostatically adsorbed even when the switch of the DC power supply 25 for electrostatic adsorption is turned off. Therefore, the wafer 1 must be transported until the accumulated charges disappear. In addition, there is a problem that the presence or absence of disappearance must be determined. Therefore, as shown in FIG. 4, the wafer transfer pins 9 are made of a slightly conductive material such as silicon carbide. By doing so, the accumulated charges flow to the ground line through the wafer transfer pins 9 and are quickly eliminated. As a result, a highly reliable wafer transfer can be performed without a wafer transfer accident. Note that the ground circuit through the wafer transfer pin 9 can be cut during plasma generation, and the ground line and the RF application unit are close to each other.
It may be adopted when abnormal discharge occurs.

The transfer of the wafer 1 is performed by raising and lowering the wafer transfer pins 9, but if the wafer 1 is transferred while being vibrated, an abnormality may occur. No.
In the present invention, a guide 11 is provided on the support 6 to ensure the guide. As a result, the wafer transfer pins 9 do not become abnormally long due to the up-down mechanism, and a highly reliable wafer transfer becomes possible.

As described above, the elements of the highly reliable wafer holding device have been clarified. Next, the transfer position of the wafer 1 and the wafer processing position (corresponding to the wafer position shown in FIG. 2) are described. The problem solving method for different cases will be described.

FIG. 5 shows the overall structure of the wafer holding device. The upper part is almost the same as FIG. 1 in that the insulating member 4 covers the outer peripheral side surface of the metal member 2 to which RF is applied. By doing so, the creepage distance between the RF applying unit and the grounding unit is increased, and the effect of preventing abnormal discharge is further improved.

In order to raise and lower the space between the wafer transfer position and the wafer processing apparatus, the present invention uses the support 6 of the wafer holding apparatus.
And a bellows 30 between the flange 29. The bellows 30 also serves as a vacuum seal for the atmosphere and the wafer processing chamber, and the bellows 30 expands and contracts by a guide and a vertical mechanism of the column 6 provided on the atmosphere side, not shown in FIG. In the present invention, the bellows 30 is provided between the column 6 and the flange 29 so that the diameter of the bellows 30 is minimized. If the diameter of the bellows 30 is small, the force applied to the wafer transfer mechanism can be small.
The simplification and high accuracy of the vertical mechanism can be easily achieved. Needless to say, as compared with the case where a sliding portion using an elastomer seal is provided, foreign matter generated due to wear of the sliding portion is eliminated, and the reliability of the vacuum seal is improved.

In this manner, the wafer holding device is moved up and down. However, the bellows 30, the other columns 6, the wafer transfer pins 9, and the like are not exposed to the plasma.
It is not preferable in terms of the problem that the etching product adheres to form foreign matter and the plasma resistance of these materials. Therefore,
In the present invention, the cylindrical covers 3 that intersect each other
1, 32 were provided on the base 5 and the flange 29. Cover 3
The cover 1 and the cover 32 overlap each other, and have such dimensions that the overlap does not disappear even when the wafer holding device is moved up and down. Both the covers 31 and 32 are maintained at the ground potential, and the members inside the covers are always isolated from the plasma and protected from contamination.

As described above, according to the present invention, it is possible to achieve a wafer holding device and a holding method that perform uniform wafer processing with little foreign matter.

The application of the present invention is not limited to an etching apparatus, but is widely applied to a wafer processing apparatus and a processing method which need to hold a wafer (object to be processed) by electrostatic attraction. Of course, you can.

However, when looking at FIGS. 1 and 5 from the viewpoint of manufacturing the above-described wafer holding device, it can be seen that the manufacturing of the metal member 2 is difficult due to the presence of the coolant channel 7.
Of course, by manufacturing the metal member 2 by dividing it into two members and sealing the refrigerant with an elastomer seal, it is possible to configure a member that can obtain the same effect. However, in this method, since a seal portion is required, an extra fastening portion or volume is required, or when a hole is formed through the metal member 2 as shown in FIG. Problems such as the complexity and complexity of the necessity and the deterioration of the reliability arise. Therefore, in the present invention, a method is adopted in which the metal member 2 is integrated into a single piece at the stage of manufacturing. Examples thereof are shown in FIGS. FIG.
FIG. As shown in FIG.
The flow path is continuous from the refrigerant supply hole 33 to the refrigerant discharge hole 34. It is possible to manufacture the coolant channel 7 by machining if it is open as shown in FIG. If two members as shown in FIG. 8 are manufactured, the two members are overlapped, and the outer peripheral portion is joined by welding, the same appearance as the metal member 2 in FIG. 1 can be manufactured. However, it is necessary to provide a through hole (for example, a hole into which the insulating tube 10 of FIG. 1 is inserted) in the seal surface 35 shown in FIG. Therefore, if only the outer peripheral portion of the metal member 2 is joined, the present member cannot be completed.

In the present invention, in order to solve this problem, one is to use a lost wax method. This example is shown in FIG. First, a member having substantially the same shape as the coolant channel 7 is manufactured using wax. Next, a mold having the same shape as the outer shape of the metal member 2 on the outside is prepared, and a mold for a flow path made of wax is placed inside and cast. Next, remove the wax,
The metal member 2 is completed.

Another embodiment of the present invention is shown in FIG. This is because a metal member 38 (temporarily described as (upper)) and a metal member 39 (this is referred to as (lower))
Are overlapped with the bonding material 40 being narrowed therebetween.
If the metal member 2 is aluminum or an aluminum alloy, the joining member 40 is made of an aluminum alloy having a low melting point (such as a silicon-containing aluminum alloy). When the pressure is increased while maintaining the pressure in vacuum, and the temperature is increased to about 600 ° C., the joining member 40 having a low melting point melts and reacts with the metal members (upper) 38 and (lower) 39, and Joined. If such a diffusion bonding method is used, the sealing surface 35 shown in FIG. 8 is also securely bonded, so that the through-hole 37 can be processed without any special consideration. Diffusion bonding is not limited to one set, and many can be bonded at the same time. Therefore, if the metal members 38 and 39 are manufactured in advance and bonded in large quantities, there is no particular problem in terms of cost.

[0031]

As described above, according to the present invention, the holding of the wafer by the electrostatic attraction is performed by using a member such as a weight on the surface of the wafer in order to prevent the side slip when the wafer is delivered and to prevent the back surface of the wafer from being lifted by the gas. Therefore, it is possible to reduce the generation of foreign matter in the wafer processing and to improve the yield of the wafer processing. In addition, since the period during which the wafer processing apparatus can be operated before the wafer processing apparatus must be cleaned in order to reduce foreign substances is lengthened, the operation rate of the apparatus is improved. Furthermore, since the outer peripheral portion of the wafer is made substantially flush with the wafer surface in order to make the gas flow on the wafer surface uniform, there is also an effect that wafer processing with excellent in-plane uniformity is performed. In addition, since an elastomer seal required for a refrigerant seal is not required in manufacturing the wafer holding device, there is an effect that the manufacturing of the wafer holding device is facilitated.

[Brief description of the drawings]

FIG. 1 is an explanatory view of a wafer holding device according to one embodiment of the present invention.

FIG. 2 is an explanatory diagram of a wafer processing apparatus using the wafer holding device of the present invention.

FIG. 3 is an enlarged view of a wafer outer peripheral portion of the wafer holding device.

FIG. 4 is an explanatory diagram showing a method of removing accumulated charges at the time of transferring a wafer.

FIG. 5 is an explanatory view of another embodiment of the wafer holding device of the present invention.

FIG. 6 is an explanatory diagram of an embodiment of a method for forming a coolant channel of the wafer holding device.

FIG. 7 is an explanatory diagram of another embodiment of the present invention.

FIG. 8 is an explanatory diagram of a refrigerant flow path.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Wafer, 2 ... Metal member, 3 ... Dielectric thin film, 4 ... Insulating member, 5 ... Base, 6 pillars ..., 7 ... Refrigerant flow path, 8 ... Refrigerant supply part, 9 ... Wafer delivery pin, 10 ... Insulating tube , 11
... Guide, 12 ... Insulation material, 13 ... RF supply shaft, 14 ... Gas supply hole, 15 Wafer detector ..., 16 ... Susceptor, 17
... wafer holding device, 19 ... vacuum pump, 20 ... etching gas supply unit, 21 ... wafer processing chamber, 22 ... quartz window, 2
3 magnetron, 24 waveguide, 25 DC power supply, 2
6 RF power supply, 27 gas supply hole, 28 plasma, 2
9 ... flange, 30 ... bellows, 31 ... cover, 32 ...
Cover, 33: refrigerant supply hole, 34: refrigerant discharge hole, 35:
Seal surface, 36: lost wax, 37: through hole, 38
... metal members (upper), 39 ... metal members (lower), 40 ... joining members.

Continued on the front page (72) Inventor Yoshifumi Ogawa 794, Higashi-Toyoi, Kazamatsu, Kamamatsu, Yamaguchi Prefecture Inside the Kasado Plant, Hitachi, Ltd. Inside the plant (72) Inventor Tsunehiko Tsune 794 Kazato, Higashitoyoi, Kudamatsu City, Yamaguchi Prefecture Inside the Kasado Plant, Hitachi, Ltd. (56) References JP-A-5-217951 (JP, A) JP-A-5-267435 (JP) JP-A-5-226292 (JP, A) JP-A-62-227021 (JP, A) JP-A-2-69956 (JP, A) JP-A-5-67672 (JP, A) 4-3927 (JP, A) JP-A-6-69159 (JP, A) JP-A-2-211650 (JP, A) JP-A-5-114583 (JP, A) U) (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/68

Claims (9)

(57) [Claims] 1. A thin metal film for holding a wafer by electrostatic force is formed on one surface of a metal member provided with a flow path for circulating a coolant for adjusting the temperature of the wafer, and the other of the metal member is provided with a dielectric thin film. An electric insulating member is disposed in contact with the surface, and a reference potential member made of an electric good conductor grounded to a certain reference potential is disposed, and the three types of members are a metal member with a dielectric thin film, an electric insulating material member, A reference potential member is overlapped and fixed in this order, and a coolant flow path having a side surface formed by an electrical insulating member for supplying and discharging a coolant penetrating from the reference potential member side to the coolant flow path of the metal member is provided. At least three or more side walls penetrating the three types of members are provided with through holes made of an electrically insulating material, a movable member connected to the wafer transfer mechanism is inserted, and a pipe-shaped member made of an electric conductor is inserted. The group The three types of members are supported by being fixed to a potential member, and a small-diameter pipe-shaped member made of a good electric conductor is inserted into the inside of the pipe-shaped member via an electrically insulating material, and the small-diameter pipe-shaped member is set to the reference potential member Connected to the metal member through the electrically insulating material member, and configured to apply an electrostatic force generating potential for holding the wafer and an RF voltage required for the wafer processing through the small diameter pipe member, The metal member and the dielectric thin film are provided with through-holes made of an electrically insulating material so that gas can be supplied between the back surface of the wafer and the surface of the dielectric thin film from a hole inside the small-diameter pipe. Characteristic wafer holding device. 2. The wafer holding device according to claim 1, wherein the movable member connected to the wafer transfer mechanism is made of an electrically conductive material. 3. The wafer holding device according to claim 1, wherein a guide for moving a movable member inserted into the through hole for transferring the wafer is provided outside the pipe-shaped member. A wafer holding device, comprising: 4. The wafer holding apparatus according to claim 1, wherein a method for fixing the wafer holding apparatus to a flange for installing the wafer holding apparatus in the wafer processing apparatus is provided between the pipe-shaped member and the flange. Telescopic bellows and
A wafer holding device wherein the movement of the wafer holding device for disposing a wafer at a position suitable for wafer processing is performed by expansion and contraction of the bellows. 5. A wafer holding apparatus according to claim 1, wherein a substantially cylindrical cover is provided on an outer peripheral portion of said reference potential member, and further, a substantially cylindrical member having a diameter different from that of said cover is provided. A wafer holding device fixed to the flange, wherein the inside of the cylindrical member is worn by the overlapping of the cylindrical members during the vertical movement of the wafer holding device. 6. A wafer holding apparatus according to claim 1, wherein said three kinds of members are provided with through holes whose side walls are made of an electrically insulating material, and said three kinds of members are held by said dielectric thin film. A detector for measuring the temperature of the wafer is provided in the through-hole. In the wafer holding apparatus according to any one of claims 7] claims 1 to 5, a through hole side wall to the three types of members are cracking footwear with an electrically insulating material is provided, which is held in the dielectric thin film wafer A detector for detecting the presence or absence of the wafer is provided in the through hole. 8. The wafer holding device according to claim 7, wherein the presence / absence detector of the wafer is configured to be operated by a signal of a detector for measuring the temperature of the wafer installed in the through hole. Wafer holding device. 9. The wafer holding device according to claim 5, wherein a gap between a portion where the dielectric thin film, a cover member wearing the metal member and an outer peripheral back surface of the wafer face each other is 0.3 mm.
mm or less.