JP3173087B2 - Chip type film capacitor and its packaging method - Google Patents
Chip type film capacitor and its packaging methodInfo
- Publication number
- JP3173087B2 JP3173087B2 JP34601591A JP34601591A JP3173087B2 JP 3173087 B2 JP3173087 B2 JP 3173087B2 JP 34601591 A JP34601591 A JP 34601591A JP 34601591 A JP34601591 A JP 34601591A JP 3173087 B2 JP3173087 B2 JP 3173087B2
- Authority
- JP
- Japan
- Prior art keywords
- film capacitor
- type film
- soldering
- chip type
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title claims description 81
- 238000000034 method Methods 0.000 title claims description 20
- 238000004806 packaging method and process Methods 0.000 title description 2
- 239000000463 material Substances 0.000 claims description 36
- 238000005476 soldering Methods 0.000 claims description 18
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 6
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 5
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 4
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 3
- 239000005022 packaging material Substances 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 3
- 239000010408 film Substances 0.000 description 47
- 239000011104 metalized film Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 238000010276 construction Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 125000001165 hydrophobic group Chemical group 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910018557 Si O Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はチップ型フィルムコンデ
ンサをプリント配線板にはんだ付けする方法に関する。 The present invention relates to a chip type film conditioner.
About the method of soldering the capacitors on the printed wiring board.
【０００２】[0002]
【従来の技術】近年、電子部品に対して、小型化，軽量
化，高性能化，低価格化が要望されており、フィルムコ
ンデンサについても小型化，高性能化のための開発が盛
んに行われている。しかしながらフィルムコンデンサは
他のコンデンサに比べて誘電体の比誘電率が低いために
静電容量に対して体積が極めて大きい。また誘電体であ
る有機フィルムの熱変形が大きいために、チップ型フィ
ルムコンデンサをプリント配線板に接着しはんだ槽に浸
漬させてはんだ付けを行う際に、外装にクラックが入る
ことが多く実用上大きな課題となっていた。2. Description of the Related Art In recent years, there has been a demand for smaller, lighter, higher performance, and lower price electronic components, and film capacitors have been actively developed for miniaturization and higher performance. Have been done. However, the film capacitor has an extremely large volume relative to the capacitance because the dielectric has a lower relative dielectric constant than other capacitors. Also, since the thermal deformation of the organic film, which is a dielectric, is large, when the chip-type film capacitor is bonded to the printed wiring board and immersed in a solder bath and soldered, cracks often occur in the exterior, which is large in practice. Had been an issue.
【０００３】従来、チップ型フィルムコンデンサの外装
は樹脂モールドで行われることが多く、この場合外装厚
みは０．５ｍｍ程度が一般的であった。樹脂モールドで
外装厚みを０．２ｍｍ程度に薄くすることは製造技術的
には可能であるが、前記はんだ付け時の外装クラックが
多発しほとんど実用的ではなかった。Conventionally, the exterior of a chip type film capacitor is often formed by a resin mold, and in this case, the exterior thickness is generally about 0.5 mm. Although it is possible in terms of manufacturing technology to reduce the thickness of the package to about 0.2 mm with a resin mold, the package is not practical due to the occurrence of package cracks during soldering.
【０００４】チップ型フィルムコンデンサの小型化の要
望に対して、発明者らは特開昭６３−１８１４０９号公
報において、積層型フィルムチップコンデンサの外部電
極となるメタリコン面とプリント配線板に装着する面を
除いた三面に薄く外装することを提案した。また特開昭
６４−７７９１１号公報において、フィルムコンデンサ
の切断面である二面に外装部材を配置すること提案し
た。また特開昭６４−７７９１３号公報、特開昭６４−
７７９１７号公報、特開昭６４−７７９２０号公報にお
いて、外装部材を特定の材料によるシート状とし、加
熱、加圧により固着する方法を提案した。また特開平２
−４３７１８号公報において前記切断面に樹脂を塗布し
て硬化する外装工法を提案した。発明者らの提案したこ
れらの構造および工法によれば、チップ型フィルムコン
デンサの外装部分の体積を極めて縮小化することができ
るようになった。In response to the demand for miniaturization of a chip type film capacitor, the inventors disclosed in Japanese Patent Application Laid-Open No. 63-181409 a metallicon surface serving as an external electrode of a multilayer film chip capacitor and a surface mounted on a printed wiring board. It was proposed to thinly package on three sides except for. In Japanese Patent Application Laid-Open No. Sho 64-77911, it has been proposed to dispose exterior members on two surfaces which are cut surfaces of a film capacitor. Also, Japanese Patent Application Laid-Open Nos.
In JP-A-77917 and JP-A-64-77920, there has been proposed a method in which an exterior member is formed into a sheet of a specific material and fixed by heating and pressing. Japanese Patent Laid-Open No. Hei 2
No. 43718 proposes an exterior construction method in which a resin is applied to the cut surface and cured. According to these structures and construction methods proposed by the inventors, the volume of the exterior part of the chip type film capacitor can be extremely reduced.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら前記の工
法はすべてチップ型フィルムコンデンサの切断面を含む
特定の面に外装部材を配置し、かつ外部電極は外装部材
で覆われない構成とするため、どうしてもコンデンサ素
子を個別に外装する必要があった。そのため多数個の素
子全体を一度に外装樹脂に浸漬して外装する工法が採用
できないので、量産性の点で不利であるという課題があ
った。However, in all of the above methods, the exterior member is arranged on a specific surface including the cut surface of the chip type film capacitor, and the external electrodes are not covered with the exterior member. It was necessary to separately package the capacitor elements. For this reason, a method of immersing a large number of devices in the exterior resin at a time and exteriorizing the same cannot be adopted, which is disadvantageous in terms of mass productivity.
【０００６】また近年チップ型フィルムコンデンサの小
型化が非常に進歩し、チップ型セラミックコンデンサ並
みの投影面積３．２ｍｍ×１．６ｍｍという超小型のチ
ップ型フィルムコンデンサが製造されているが、このよ
うに超小型化が進むと外装の厚みが樹脂シートや液状樹
脂の塗布といえどもかなりの体積を占めるので小型化を
妨げる要因となっていた。In recent years, miniaturization of chip-type film capacitors has been greatly advanced, and ultra-compact chip-type film capacitors having a projected area of 3.2 mm × 1.6 mm, which is comparable to that of chip-type ceramic capacitors, have been manufactured. In the case of ultra-miniaturization, the thickness of the exterior occupies a considerable volume even in the application of a resin sheet or a liquid resin, which is a factor that hinders miniaturization.
【０００７】本発明は上記従来の方法にあった課題に鑑
み、多数個の素子全体を一度に外装する工法が採用で
き、量産性に優れ、かつ極めて薄い外装を施すことがで
きる外装工法を利用したチップ型フィルムコンデンサを
プリント配線板にはんだ付けする方法を提供しようとす
るものである。[0007] The present invention has been made in consideration of the problems were in the conventional method, the entire plurality of elements exterior to method can be adopted at a time, excellent in mass production, and use of the exterior construction method can be subjected to very thin exterior Chip-type film capacitor
An object of the present invention is to provide a method of soldering to a printed wiring board .
【０００８】[0008]
【課題を解決するための手段】上記課題を解決するため
に、本発明は、チップ型フィルムコンデンサに外部引き
出し電極を形成した後に、前記外部引き出し電極を含む
金属化フィルムコンデンサ全体を、少なくともシランカ
ップリング剤を含む外装材料に浸漬して、極めて薄い外
装を施したチップ型フィルムコンデンサを用いて、前記
外装材料で被覆された外部引き出し電極とプリント配線
板とをはんだ付けする、チップ型フィルムコンデンサを
プリント配線板にはんだ付けする。In order to solve the above problems SUMMARY OF THE INVENTION The present onset Ming, after forming the external lead electrode on chip-type film capacitor, the entire metallized film capacitor including the external lead electrode, at least a silane By immersing in an exterior material containing a coupling agent and using a chip-type film capacitor with an extremely thin exterior ,
External lead-out electrodes and printed wiring covered with exterior material
Chip type film capacitor to be soldered to the board
Solder to the printed wiring board .
【０００９】[0009]
【作用】本発明は外部引き出し電極を含むチップ型フィ
ルムコンデンサ全体を浸漬するので、多数個の素子を一
度に外装することができ、量産性の高い工法となる。According to the present invention, since the entire chip-type film capacitor including the external lead-out electrodes is immersed, a large number of elements can be packaged at a time, resulting in a method of high mass productivity.
【００１０】さらに、シランカップリング剤による外装
は１μｍ以下の極めて薄い膜となりほとんど無外装の状
態に近く、したがってコンデンサの小型化を阻害してい
た外装部分の占める体積を見かけ上ほとんど０にするこ
とができるため、コンデンサを極めて小型化できる。ま
た、本発明のチップ型フィルムコンデンサは外装材料が
極めて薄いために、外部電極のはんだ濡れ性も問題がな
い。Further, the sheath made of the silane coupling agent becomes an extremely thin film having a thickness of 1 μm or less, which is almost a non-sheathed state. Therefore, the volume occupied by the sheath part which has hindered the miniaturization of the capacitor is reduced to almost zero. Therefore, the size of the capacitor can be extremely reduced. Ma
In addition, the chip type film capacitor of the present invention has an exterior material
Due to the extremely thin thickness, there is no problem with the solderability of the external electrodes.
No.
【００１１】[0011]
【実施例】以下本発明のチップ型フィルムコンデンサの
外装方法について実施例に基づいて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for packaging a chip type film capacitor of the present invention will be described with reference to examples.
【００１２】図２から図５は本発明の実施例のひとつで
ある積層型金属化フィルムコンデンサの外装工程を示す
工程図である。FIG. 2 to FIG. 5 are process diagrams showing an exterior process of a laminated metallized film capacitor according to one embodiment of the present invention.
【００１３】図２において、１はポリ−フェニレンサル
ファイドフィルムにアルミニウムを約５００Ａ真空蒸着
してなる金属化ポリ−フェニレンサルファイドフィルム
を積層してなるチップ型金属化フィルムコンデンサ素
子、２はシランカップリング剤であるメチルトリメトキ
シシランを含む外装材料、３は超音波振動子である。金
属化フィルムコンデンサ素子１は、図１に示すように、
金属化フィルムからなる本体部分４と、外部引き出し電
極５を有しており、図３に示すように外装材料２にコン
デンサ素子１全体を浸漬し、超音波振動子３により容器
６の中の外装材料２とコンデンサ素子１を振動させる。
超音波振動によってより効率的に外部引き出し電極５を
含む表面全体に外装材料２が行き渡り、さらにコンデン
サ素子１のフィルム層間にも外装材料２が侵入する。In FIG. 2, reference numeral 1 denotes a chip-type metallized film capacitor element obtained by laminating a metallized poly-phenylene sulfide film obtained by vacuum-depositing aluminum on a poly-phenylene sulfide film at about 500 A, and 2 denotes a silane coupling agent. The packaging material 3 containing methyltrimethoxysilane is an ultrasonic vibrator. The metallized film capacitor element 1 is, as shown in FIG.
It has a main body part 4 made of a metallized film and an external lead-out electrode 5, and the entire capacitor element 1 is immersed in an exterior material 2 as shown in FIG. The material 2 and the capacitor element 1 are vibrated.
The exterior material 2 spreads over the entire surface including the external lead-out electrode 5 more efficiently by the ultrasonic vibration, and the exterior material 2 penetrates between the film layers of the capacitor element 1.
【００１４】続いて図４に示すようにコンデンサ素子１
を外装材料２から網かご７によって引き上げて余剰の外
装材料８を分離する。外装材料２は室温における粘度が
２×１０-2Ｐａ・ｓ（０．２ポイズ）以下であるので、
網かご７によって引き上げるだけで簡単に余剰の外装材
料８を分離することができる。Subsequently, as shown in FIG.
Is pulled up from the exterior material 2 by the net basket 7 to separate the excess exterior material 8. Since the exterior material 2 has a viscosity at room temperature of 2 × 10 −2 Pa · s (0.2 poise) or less,
Excess exterior material 8 can be easily separated simply by pulling up with net cage 7.
【００１５】次に図５に示すように表面に外装材料２が
付着したコンデンサ素子１を、温風循環式の恒温槽９の
中で１５０℃、３０分の熱処理をして外装材料２を硬化
させる。前記熱処理によってシランカップリング剤の金
属や無機・有機材料に反応性のある官能基がコンデンサ
素子表面と結合し、シランカップリング剤の疎水基が外
側を向くように立体配置される。本実施例ではメチルト
リメトキシシランのトリメトキシ基がコンデンサ素子表
面と結合し、メチル基が外側を向くように立体配置され
ると考えられる。Next, as shown in FIG. 5, the capacitor element 1 having the exterior material 2 adhered to the surface is heat-treated at 150 ° C. for 30 minutes in a hot-air circulating thermostat 9 to cure the exterior material 2. Let it. By the heat treatment, the functional group reactive with the metal or the inorganic or organic material of the silane coupling agent is bonded to the surface of the capacitor element, and the silane coupling agent is three-dimensionally arranged so that the hydrophobic group faces outward. In the present embodiment, it is considered that the trimethoxy group of methyltrimethoxysilane is bonded to the surface of the capacitor element, and the methyl group is oriented three-dimensionally so as to face outward.
【００１６】前記余剰の外装材料を除去する工程で除去
できなかった外装材料は素子間に表面張力等で残ってい
るが、前記熱処理の工程中に、コンデンサ素子表面と結
合できないものはほとんど揮発する。外装材料２はコン
デンサ素子１の外部引き出し電極５を含む表面全体や網
かご７の表面にほぼ単分子層に近い状態で極めて薄く付
着しており、硬化中に互いに接着して固まることがない
ので、硬化後に網かご７から取り出すだけで個別の素子
に簡単に分離することができる。The exterior material that could not be removed in the step of removing the excess exterior material remains due to surface tension or the like between the elements. However, during the heat treatment step, most of the exterior material that cannot be bonded to the capacitor element surface volatilizes. . The exterior material 2 is extremely thinly adhered to the entire surface including the external lead-out electrode 5 of the capacitor element 1 and the surface of the net basket 7 in a state close to a monolayer, and does not adhere to each other during curing and harden. After the curing, the individual elements can be easily separated simply by taking them out of the net basket 7.
【００１７】以上のようにして本発明のチップ型フィル
ムコンデンサを得た。本発明のチップ型フィルムコンデ
ンサは図１に示すように、コンデンサ素子１の外部引き
出し電極５を含む表面全体にメチルトリメトキシシラン
を含む外装材料２がほぼ単分子層に近い状態で極めて薄
く外装されている。またコンデンサ素子１が積層型であ
るので超音波振動により、効率良くフィルム層間にまで
外装材料２が侵入してフィルムを極めて薄く被覆してい
る。As described above, the chip type film capacitor of the present invention was obtained. As shown in FIG. 1, the chip-type film capacitor of the present invention is provided with an exterior material 2 containing methyltrimethoxysilane, which is extremely thin in a state close to a monolayer, over the entire surface including the external lead-out electrode 5 of the capacitor element 1. ing. In addition, since the capacitor element 1 is a laminated type, the exterior material 2 efficiently penetrates between the film layers by the ultrasonic vibration to cover the film extremely thinly.
【００１８】比較例１として特開平２−４３７１８号公
報により、金属化フィルムコンデンサ素子１の切断面の
みを紫外線硬化樹脂で塗工したチップ型フィルムコンデ
ンサを作成した。比較例２として無外装のチップ型金属
化フィルムコンデンサ素子１を作成した。As Comparative Example 1, a chip-type film capacitor in which only the cut surface of the metallized film capacitor element 1 was coated with an ultraviolet curable resin was prepared according to JP-A-2-43718. As Comparative Example 2, a non-exterior chip-type metallized film capacitor element 1 was produced.
【００１９】このようにして得られた本発明のチップ型
金属化フィルムコンデンサと、比較例１および２のコン
デンサを耐湿負荷寿命試験に供した結果を図６に示す。
試験条件は６０℃、９５％Ｒｈ、定格電圧負荷とした。FIG. 6 shows the results of subjecting the chip-type metallized film capacitor of the present invention thus obtained and the capacitors of Comparative Examples 1 and 2 to a moisture resistance load life test.
The test conditions were 60 ° C., 95% Rh, and rated voltage load.
【００２０】図６に示すように本発明のコンデンサは良
好な耐湿負荷寿命を有し、比較例１および２より良好な
結果を得た。比較例２では無外装のため金属化フィルム
の蒸着電極を腐食する水分が試験中に自由にフィルム層
間に侵入でき、静電容量の低下が最も早い。比較例１で
は図７に示すように、切断面が紫外線硬化樹脂で塗工さ
れているので水分の侵入が抑えられているために初期は
静電容量の低下が遅いが、水分の侵入が完全に抑えられ
るわけではないので、ある時間経過すると紫外線硬化樹
脂と切断面の間隙に水分が滞留し、この滞留した水分１
２が金属化フィルムの蒸着電極を腐食していく。As shown in FIG. 6, the capacitor of the present invention has a good humidity load life, and has better results than Comparative Examples 1 and 2. In Comparative Example 2, since there is no exterior, moisture that corrodes the metallized film deposition electrode can freely enter between the film layers during the test, and the capacitance decreases fastest. In Comparative Example 1, as shown in FIG. 7, since the cut surface is coated with an ultraviolet curable resin, the infiltration of moisture is suppressed, so that the capacitance decreases slowly at the initial stage, but the infiltration of moisture is complete. After a certain period of time, moisture stays in the gap between the ultraviolet curable resin and the cut surface, and the accumulated moisture 1
2 corrodes the metallized film deposition electrodes.
【００２１】これに対して本発明のコンデンサでは図８
に示すように、シランカップリング剤の疎水基が外側を
向いて被覆されているので水分の侵入が抑えられてい
る。さらにシランカップリング剤は分子骨格にＳｉ−Ｏ
結合を有しており、Ｓｉ−Ｏ結合は原子間距離が水分子
より大きいために水分子が透過できる。このために侵入
した水分が外部へ抜けやすく、外装材料と切断面の間隙
に水分が滞留しにくい。したがって金属化フィルムの蒸
着電極の腐食が進みにくいと考えられる。On the other hand, in the capacitor of the present invention, FIG.
As shown in (1), since the hydrophobic group of the silane coupling agent is coated so as to face outward, invasion of moisture is suppressed. Further, the silane coupling agent has a Si--O
It has a bond, and since the interatomic distance of the Si—O bond is larger than that of a water molecule, the water molecule can penetrate. For this reason, the infiltrated water easily escapes to the outside, and the water hardly stays in the gap between the exterior material and the cut surface. Therefore, it is considered that the corrosion of the deposition electrode of the metallized film hardly proceeds.
【００２２】次に本発明の金属化フィルムコンデンサ
と、比較例１および２のコンデンサのはんだ付け性を試
験した。試験条件はクリームはんだを用いて熱風式リフ
ロー炉によるリフローはんだ付けで、リフロー温度は最
高２３０℃、サンプル数は各５０００個とした。Next, the metallized film capacitors of the present invention and the capacitors of Comparative Examples 1 and 2 were tested for solderability. The test conditions were reflow soldering with a hot-air reflow oven using cream solder. The reflow temperature was 230 ° C. at maximum and the number of samples was 5000.
【００２３】この結果、外部電極のはんだ濡れ性につい
ては（表１）に示すようにいずれの場合も良好で全く問
題がなかった。しかし外装クラックについては比較例２
と本発明については無外装、もしくは見かけ上無外装な
のでクラック発生が認められないが、比較例１では若干
クラックが発生するという差があった。As a result, the solder wettability of the external electrodes was good in each case as shown in Table 1, and there was no problem at all. However, as for the exterior crack, Comparative Example 2
In the present invention, no cracks were observed because of no exterior or apparently no exterior, but in Comparative Example 1, there was a difference that some cracks occurred.
【００２４】[0024]
【表１】 なお本実施例ではシランカップリング剤としてメチルト
リメトキシシランを用いたが、本発明はこれに限るもの
ではなく、例えばビニルトリメトキシシラン、メチルト
リエトキシシランなども用いることができる。また外装
樹脂中にシリコーン樹脂を添加しても本発明の目的から
はずれるものではない。[Table 1] In this example, methyltrimethoxysilane was used as the silane coupling agent. However, the present invention is not limited to this, and for example, vinyltrimethoxysilane, methyltriethoxysilane, and the like can be used. The addition of a silicone resin to the exterior resin does not depart from the object of the present invention.
【００２５】また本実施例ではフィルムコンデンサの構
成として積層型の場合を示したが本発明はこれに限るも
のではなく、巻回型など通常フィルムコンデンサ用とし
て用いられる構成であれば本発明の効果を得ることがで
きる。In this embodiment, the case of a laminated type is shown as the structure of the film capacitor. However, the present invention is not limited to this. Can be obtained.
【００２６】また本実施例ではフィルムとしてポリ−フ
ェニレンサルファイドフィルムを用いたが、フィルムは
これに限るものではなく、通常フィルムコンデンサ用と
して用いられる、例えばポリ−エチレンテレフタレー
ト、ポリ−エチレンテレナフタレート、ポリ−プロピレ
ンなどの有機材料からなるフィルムを用いることができ
る。またフィルムの厚みも特に限るものではない。In this embodiment, a poly-phenylene sulfide film is used as a film, but the film is not limited to this. For example, poly-ethylene terephthalate, poly-ethylene terephthalate, -A film made of an organic material such as propylene can be used. The thickness of the film is not particularly limited.
【００２７】また電極材料もアルミニウムに限るもので
なく、通常フィルムコンデンサ用として用いられる亜鉛
なども用いることができ、電極形成方法も真空蒸着だけ
でなく、通常フィルムコンデンサ用として用いられるス
パッタリング、イオンプレーティングなどの工法で形成
することができる。The electrode material is not limited to aluminum, and zinc or the like usually used for film capacitors can be used. The electrode can be formed not only by vacuum deposition but also by sputtering or ion plating generally used for film capacitors. It can be formed by a method such as singing.
【００２８】以上のように本発明のチップ型フィルムコ
ンデンサは耐湿試験において良好な結果を示し、かつは
んだ付け時のクラックが発生しないという特徴を有す
る。As described above, the chip-type film capacitor of the present invention is characterized in that it shows good results in a moisture resistance test and that cracks do not occur during soldering.
【００２９】また本発明のチップ型フィルムコンデンサ
は外装材料が極めて薄いために、外部電極のはんだ濡れ
性も問題がないという特徴を有する。Further, the chip type film capacitor of the present invention is characterized in that since the exterior material is extremely thin, there is no problem with the solder wettability of the external electrodes.
【００３０】さらに本発明は、外装材料がコンデンサ素
子や網かごの表面に極めて薄く付着しているだけなの
で、硬化中に互いに接着して固まることがなく、硬化後
に個別の素子に簡単に分離することができるので、多数
個の素子全体を一度に外装樹脂に浸漬して外装する工法
が採用でき、量産性が極めて高いという特徴がある。Further, according to the present invention, since the exterior material is only very thinly attached to the surface of the capacitor element or the net basket, it does not adhere to each other during curing and hardens, and is easily separated into individual elements after curing. Therefore, it is possible to adopt a construction method in which a large number of devices as a whole are immersed in an exterior resin at a time, and the exterior is employed.
【００３１】[0031]
【発明の効果】以上のように本発明は、多数個の素子全
体を一度に外装する工法が採用でき、量産性に優れ、か
つ極めて薄い外装を施すことができる外装工法を利用し
たチップ型フィルムコンデンサをプリント配線板にはん
だ付けする方法を提供することができ、耐湿特性に優れ
た小型のチップ型フィルムコンデンサを量産性良く生産
することができ、工業的に極めて効果の高いものであ
る。本発明のチップ型フィルムコンデンサは外装材料が
極めて薄いために、外部電極のはんだ濡れ性も問題がな
い。 As described above, the present invention utilizes the exterior construction method which can employ a construction method in which a large number of elements are entirely packaged at once, is excellent in mass productivity, and can provide a very thin package.
Chip-type film capacitors on printed wiring boards
A method for soldering can be provided, and a small chip type film capacitor excellent in moisture resistance can be produced with good mass productivity, which is extremely effective industrially. The chip type film capacitor of the present invention has an exterior material
Due to the extremely thin thickness, there is no problem with the solderability of the external electrodes.
No.
【図１】本発明のチップ型フィルムコンデンサの外観図FIG. 1 is an external view of a chip type film capacitor of the present invention.
【図２】本発明の実施例におけるコンデンサ素子と外装
材料と容器を示す外観図FIG. 2 is an external view showing a capacitor element, an exterior material, and a container according to an embodiment of the present invention.
【図３】本発明の実施例における外装材料に浸漬する工
程を示す外観図FIG. 3 is an external view showing a step of dipping in an exterior material according to an embodiment of the present invention.
【図４】本発明の実施例における余剰の外装材料を除去
する工程を示す外観図FIG. 4 is an external view showing a step of removing an excessive exterior material according to the embodiment of the present invention.
【図５】本発明の実施例における熱処理によって外装材
料を硬化する工程を示す外観図FIG. 5 is an external view showing a step of curing an exterior material by heat treatment in an example of the present invention.
【図６】本発明と比較例１および２のフィルムコンデン
サを耐湿負荷寿命試験に供した結果を示す特性図FIG. 6 is a characteristic diagram showing the results of subjecting the film capacitors of the present invention and Comparative Examples 1 and 2 to a moisture resistance load life test.
【図７】比較例１のフィルムコンデンサの耐湿性の概念
を説明するための断面図FIG. 7 is a sectional view for explaining the concept of moisture resistance of the film capacitor of Comparative Example 1.
【図８】本発明のフィルムコンデンサの耐湿性の概念を
説明するための断面図FIG. 8 is a cross-sectional view for explaining the concept of moisture resistance of the film capacitor of the present invention.
１ フィルムコンデンサ素子 ２ 外装材料 ３ 超音波振動子 ４ コンデンサ素子本体部分 ５ 外部引き出し電極 ６ 容器 DESCRIPTION OF SYMBOLS 1 Film capacitor element 2 Exterior material 3 Ultrasonic transducer 4 Capacitor element main part 5 External lead-out electrode 6 Container
───────────────────────────────────────────────────── フロントページの続き (72)発明者 菊地 稔 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 山田 健治 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 岩岡 和男 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 昭61−84014（ＪＰ，Ａ) 特開 昭60−3118（ＪＰ，Ａ) 特開 昭53−106450（ＪＰ，Ａ) 特開 平２−222131（ＪＰ，Ａ) 特開 昭51−85455（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01G 4/00 - 4/40 H01G 13/00 - 13/06 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Minoru Kikuchi 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Inventor Kazuo Iwaoka 1006 Kazuma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-61-84014 (JP, A) JP-A-60-3118 (JP, A) JP-A-53-106450 (JP, A) JP-A-2-222131 (JP, A) JP-A-51-85455 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) H01G 4/00-4/40 H01G 13/00-13/06
Claims (11)
を形成した後に、前記外部引き出し電極を含むフィルム
コンデンサ全体を、少なくともシランカップリング剤を
含む厚み１μｍ以下の外装材料で被覆したチップ型フィ
ルムコンデンサを用いて、前記外装材料で被覆された外
部引き出し電極とプリント配線板とをはんだ付けする、
チップ型フィルムコンデンサをプリント配線板にはんだ
付けする方法。1. After forming an external lead electrode on a film capacitor, using a chip type film capacitor in which the entire film capacitor including the external lead electrode is covered with an exterior material having a thickness of 1 μm or less containing at least a silane coupling agent. Outside covered with the exterior material
Soldering the lead electrode and the printed wiring board,
Solder chip type film capacitor to printed wiring board
How to attach .
を形成した後に、前記外部引き出し電極を含むフィルム
コンデンサ全体を、少なくともシランカップリング剤を
含む外装材料に浸漬することにより厚み１μｍ以下の外
装材料で被覆されたチップ型フィルムコンデンサを用い
て、前記外装材料で被覆された外部引き出し電極とプリ
ント配線板とをはんだ付けする、チップ型フィルムコン
デンサをプリント配線板にはんだ付けする方法。2. After an external lead electrode is formed on a film capacitor, the entire film capacitor including the external lead electrode is immersed in a packaging material containing at least a silane coupling agent to form an external lead having a thickness of 1 μm or less. using a chip type film capacitor coated with instrumentation material
And an external lead electrode covered with the exterior material
Chip-type film components for soldering
A method of soldering a densa to a printed wiring board .
×１０-2Ｐａ・ｓ（０．２ポイズ）以下であることを特
徴とする請求項２に記載のチップ型フィルムコンデンサ
をプリント配線板にはんだ付けする方法。 3. The exterior material having a viscosity at 25 ° C. of 2
3. The chip type film capacitor according to claim 2, wherein the pressure is not more than × 10 -2 Pa · s (0.2 poise).
Method of soldering to a printed wiring board.
メトキシシランを主成分とすることを特徴とする請求項
１に記載のチップ型フィルムコンデンサをプリント配線
板にはんだ付けする方法。 4. The chip-type film capacitor according to claim 1, wherein the silane coupling agent is mainly composed of methyltrimethoxysilane.
A method of soldering to a board.
メトキシシランを主成分とすることを特徴とする請求項
１に記載のチップ型フィルムコンデンサをプリント配線
板にはんだ付けする方法。 5. The printed wiring of a chip type film capacitor according to claim 1, wherein the silane coupling agent is mainly composed of vinyltrimethoxysilane.
A method of soldering to a board.
エトキシシランを主成分とすることを特徴とする請求項
１に記載のチップ型フィルムコンデンサをプリント配線
板にはんだ付けする方法。 6. The printed wiring of a chip type film capacitor according to claim 1, wherein the silane coupling agent contains methyltriethoxysilane as a main component.
A method of soldering to a board.
エトキシシランを主成分とすることを特徴とする請求項
２または３に記載のチップ型フィルムコンデンサをプリ
ント配線板にはんだ付けする方法。 7. The chip type film capacitor according to claim 2, wherein the silane coupling agent contains methyltriethoxysilane as a main component.
Soldering to printed wiring boards.
メトキシシランを主成分とすることを特徴とする請求項
２または３に記載のチップ型フィルムコンデンサをプリ
ント配線板にはんだ付けする方法。 8. The chip type film capacitor according to claim 2, wherein the silane coupling agent contains vinyltrimethoxysilane as a main component.
Soldering to printed wiring boards.
エトキシシランを主成分とすることを特徴とする請求項
２または３に記載のチップ型フィルムコンデンサをプリ
ント配線板にはんだ付けする方法。 9. The chip type film capacitor according to claim 2, wherein the silane coupling agent contains methyltriethoxysilane as a main component.
Soldering to printed wiring boards.
と、シリコーン樹脂を含むことを特徴とする請求項１ま
たは４乃至６のいずれかに記載のチップ型フィルムコン
デンサをプリント配線板にはんだ付けする方法。 10. The chip type film capacitor according to claim 1, wherein the exterior material contains a silane coupling agent and a silicone resin.
A method of soldering a densa to a printed wiring board.
と、シリコーン樹脂を含むことを特徴とする請求項２，
３，７乃至９のいずれかに記載のチップ型フィルムコン
デンサをプリント配線板にはんだ付けする方法。 11. The packaging material according to claim 2, wherein the exterior material includes a silane coupling agent and a silicone resin.
The chip type film capacitor according to any one of 3, 7 to 9,
A method of soldering a densa to a printed wiring board.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34601591A JP3173087B2 (en) | 1991-12-27 | 1991-12-27 | Chip type film capacitor and its packaging method |
| KR1019920025371A KR970004121B1 (en) | 1991-12-27 | 1992-12-24 | Film Capacitor and Manufacturing Method |
| DE69226757T DE69226757T2 (en) | 1991-12-27 | 1992-12-28 | Film capacitor and manufacturing method |
| US07/997,476 US5331504A (en) | 1991-12-27 | 1992-12-28 | Film capacitor and method for manufacturing the same |
| EP92122072A EP0548996B1 (en) | 1991-12-27 | 1992-12-28 | A film capacitor and method for manufacturing the same |
| CA002086395A CA2086395C (en) | 1991-12-27 | 1992-12-29 | Film capacitor and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34601591A JP3173087B2 (en) | 1991-12-27 | 1991-12-27 | Chip type film capacitor and its packaging method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05182862A JPH05182862A (en) | 1993-07-23 |
| JP3173087B2 true JP3173087B2 (en) | 2001-06-04 |
Family
ID=18380559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34601591A Expired - Fee Related JP3173087B2 (en) | 1991-12-27 | 1991-12-27 | Chip type film capacitor and its packaging method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3173087B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6876537B2 (en) | 1999-10-07 | 2005-04-05 | Matsushita Electric Industrial Co., Ltd. | Ceramic electronic component and method for manufacturing the same |
| JP4753470B2 (en) * | 2000-12-27 | 2011-08-24 | イビデン株式会社 | Capacitor, multilayer printed wiring board, and method for manufacturing multilayer printed wiring board |
| JPWO2002082480A1 (en) | 2001-04-05 | 2004-07-29 | 松下電器産業株式会社 | Ceramic electronic component and its manufacturing method |
| JP7442143B2 (en) * | 2018-12-26 | 2024-03-04 | パナソニックＩｐマネジメント株式会社 | capacitor |
-
1991
- 1991-12-27 JP JP34601591A patent/JP3173087B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05182862A (en) | 1993-07-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4000143B2 (en) | Printed circuit board having a high dielectric constant capacitor and manufacturing method thereof | |
| JP3267067B2 (en) | Ceramic electronic components | |
| JP2002203737A (en) | Laminated ceramic electronic parts and its manufacturing method | |
| JP3173087B2 (en) | Chip type film capacitor and its packaging method | |
| JPH08107039A (en) | Ceramic electronic component | |
| JPH08339942A (en) | Electronic component | |
| JPH04259205A (en) | Chip type ceramic capacitor | |
| JP2000138131A (en) | Chip type electronic components | |
| JP3064556B2 (en) | Chip type electronic components | |
| JP3183065B2 (en) | Manufacturing method of piezoelectric parts | |
| JPS59197120A (en) | Ultrafine film condenser | |
| JPS59127828A (en) | Chip film capacitor | |
| JPH08204491A (en) | Piezoelectric component | |
| JPS61102021A (en) | Capacitor | |
| JPS62213231A (en) | Laminated film capacitor | |
| JPH02106912A (en) | Laminated film capacitor | |
| JP2571795Y2 (en) | Resin-sealed electronic components | |
| JPS62226612A (en) | Capacitor | |
| JPH04105310A (en) | Multilayered ceramic capacitor | |
| JPH10241908A (en) | Composite element and its manufacturing method | |
| JPH08107037A (en) | Ceramic electronic component | |
| JPH05226198A (en) | Solid-state chip electrolytic capacitor | |
| JPH04188656A (en) | Structure for sealing hybrid integrated circuit | |
| JPH0442592A (en) | Metallic-core circuit board | |
| JPH03241804A (en) | Chip type metallized film capacitor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080330 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090330 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100330 Year of fee payment: 9 |
|
| LAPS | Cancellation because of no payment of annual fees |