JP3166842B2 - Wafer chamfering equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer chamfering apparatus, and more particularly to a wafer chamfering apparatus for chamfering a peripheral edge of a wafer made of a brittle material such as silicon or ceramic.

[0002]

2. Description of the Related Art A wafer made of silicon or the like as a material of a semiconductor element is sliced from a state of an ingot by a cutting machine such as a slicing machine, and chamfering is performed on an outer peripheral portion thereof in order to prevent cracking or chipping of the periphery. Is applied. Incidentally, an orientation flat or a notch is often formed on the outer periphery of these wafers in order to facilitate the determination and alignment of the crystal direction. For these wafers, it is necessary to similarly chamfer the orientation flat or the notch.

[0003] In the conventional wafer chamfering apparatus, the orientation flat is chamfered by using the same grindstone (grindstone for outer circumference grinding) as the grindstone for chamfering the outer circumference (circular portion of the wafer). Chamfering was performed using a notch-specific grindstone (notch grinding grindstone) different from the whetstone for grinding. In the conventional wafer chamfering apparatus, the notch grinding wheel and the outer periphery grinding wheel are arranged on the same straight line.

That is, as shown in FIGS. 10 (a) and 10 (b), in the conventional wafer chamfering apparatus, the notch grinding wheel 1 and the outer circumference grinding wheel 2 are arranged on the same straight line L. At the time of processing, the notch grinding wheel 1 was configured to be retractable upward. Alternatively, the notch grinding wheel has been installed so as to be shifted vertically in relation to the outer circumference grinding wheel.

[0005]

However, in the conventional wafer chamfering apparatus, the wafer W moved on the processing position P (on the straight line L toward the outer peripheral grinding wheel 2) is contacted with the outer peripheral grinding wheel 2 and ground. (The position where the notch grinding wheel 1 is located immediately before the position), the notch grinding wheel 1 hinders the maintenance of the outer circumference grinding wheel 2 and the wafer table 3, which makes the work difficult. was there.

In addition, if the notch grinding wheel and the outer circumference grinding wheel are set at different positions, a mechanism for vertically moving the grinding wheel or wafer is required, and the stroke of the vertical movement must be set long. In addition, there is a disadvantage that the device is complicated and large. Similarly, when the notch grinding wheel is retracted upward or downward, a mechanism for moving the notch grinding wheel upward or downward is separately required, and there is a disadvantage that the apparatus becomes complicated and large.

Further, in general, it is necessary to perform rough polishing and fine polishing for chamfering a wafer. Conventionally, the rough polishing and fine polishing have been performed using separate wafer chamfering apparatuses. Alternatively, the grinding was performed using a composite grinding wheel in which grinding wheels for rough grinding and fine grinding were coaxially arranged. However, when the rough polishing and the fine polishing are performed using different wafer chamfering apparatuses, there is a disadvantage that two wafer chamfering apparatuses are required, and it is necessary to transfer the wafer from one apparatus to the other apparatus. Therefore, there is a disadvantage that processing efficiency is poor. In addition, there is a disadvantage that the center of the wafer is displaced in the process of transporting the wafer, thereby lowering the processing accuracy.

On the other hand, when chamfering is performed using a compound whetstone in which grinding wheels for rough polishing and fine polishing are arranged coaxially, rough polishing and fine polishing can be performed by one wafer chamfering device. However, when the notch grinding wheel is thin, a composite wheel having a long overall length has a disadvantage that rigidity is insufficient. The present invention has been made in view of such circumstances, and an object of the present invention is to provide a wafer chamfering apparatus that can perform chamfering of a wafer with high accuracy and that is easy to maintain.

[0009]

The present invention SUMMARY OF], in order to achieve the above object, closer to the rotating wafer held by the window Ehateburu toward the outer periphery grinding grindstone that rotates is mounted on the outer peripheral grinding spindles it result, the pressed against the outer periphery of the wafer to the outer periphery grinding grindstone for chamfering the outer periphery of the wafer, close the wafer held on the wafer table toward the grindstone notch grinding which rotates is mounted on the notch spindle by the notch of the wafer is chamfered by pressing a notch of wafer grinding notch grinding, before Kigaishu grinding wheels, a stack of the grinding wheel and grinding wheel for fine Labs for coarse Labs coaxially The notch spindle comprises a first notch spindle equipped with a notch grinding wheel for rough grinding and a notch grinding for fine grinding. A first notch spindle and a second notch spindle are disposed between the outer peripheral grinding spindle and the wafer table, and the center thereof is the second notch spindle. It is provided on both sides of a straight line connecting the center of the outer periphery grinding spindle and the center of the wafer table.

According to the present invention, the notch grinding spindle is provided at a position offset with respect to a straight line connecting the center of the outer periphery grinding spindle and the center of the wafer table.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a wafer chamfering apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. 1 and 2 are a side view and a plan view, respectively, showing the configuration of a wafer chamfering apparatus 10 according to the present invention. FIGS. 3 and 4 are sectional views taken along the line AA of FIG.
It is B sectional drawing.

As shown in FIGS. 1 and 2, the wafer chamfering apparatus 10 according to the present embodiment mainly includes a wafer feed unit 42, an outer peripheral grinding unit 44, and a notch grinding unit 46. First, the configuration of the wafer feeding unit 42 will be described. As shown in FIGS. 1, 2, and 3, a pair of Y-axis guide rails 52 are laid at predetermined intervals on a base plate 50 disposed horizontally. This pair of Y-axis guide rails 5
A Y-axis table 56 is slidably supported on 2, 52 via Y-axis linear guides 54, 54,.

The nut member 5 is provided on the lower surface of the Y-axis table 56.
The nut member 58 is fixed to the pair of Y members.
It is screwed to a Y-axis ball screw 60 disposed between the axis guide rails 52, 52. Both ends of the Y-axis ball screw 60 are rotatably supported by bearing members 62, 62 disposed on the base plate 50, and one end of the Y-axis ball screw 60 is provided on one of the bearing members 62. Motor 64
Output shafts are connected. The Y-axis ball screw 60 is rotated by driving the Y-axis motor 64. As a result, the Y-axis table 56
Slide horizontally along 2. Hereinafter, the direction in which the Y-axis table 56 slides is referred to as the Y-axis direction.

FIG. 1 and FIG.
And the pair of Y-axis guide rails 5 as shown in FIG.
A pair of X-axis guide rails 6 orthogonal to 2 and 52
6, 66 are laid. An X-axis table 70 is slidably supported on the pair of X-axis guide rails 66 via X-axis linear guides 68, 68,.

On the lower surface of the X-axis table 70, a nut member 7 is provided.
The nut member 72 is fixed to the pair of Xs.
It is screwed into an X-axis ball screw 74 provided between the axis guide rails 66,66. Both ends of the X-axis ball screw 74 are rotatably supported by bearing members 76, 76 disposed on the X-axis table 70, and one end thereof is provided on one bearing member 76. The output shaft of the X-axis motor 78 is connected. The X-axis ball screw 74 is rotated by driving the X-axis motor 78. As a result, the X-axis table 70 is moved to the X-axis guide rails 66,6.
Slide horizontally along 6. Hereinafter, the direction in which the X-axis table 70 slides is referred to as the X-axis direction.

As shown in FIGS. 1 and 2, a Z-axis base 80 is vertically provided on the X-axis table 70, and a pair of Z-axis guide rails 8 are provided on the Z-axis base 80.
2, 82 are laid at predetermined intervals. A Z-axis table 86 is slidably supported on the pair of Z-axis guide rails 82 via Z-axis linear guides 84, 84.

The nut member 8 is provided on the side surface of the Z-axis table 86.
The nut member 88 is fixed to the pair of Zs.
It is screwed into a Z-axis ball screw 90 provided between the axis guide rails 82,82. The Z-axis ball screw 90 has a bearing member 9 whose both ends are disposed on the Z-axis base 80.
2, 92, the lower end of which is connected to the output shaft of a Z-axis motor 94 provided on the lower bearing member 92. The Z-axis ball screw 90 is rotated by driving the Z-axis motor 94. As a result, the Z-axis table 86 slides vertically along the Z-axis guide rails 82. Hereinafter, the direction in which the Z-axis table 86 slides is referred to as a Z-axis direction.

On the Z-axis table 86, a θ-axis motor 9
6 are installed vertically. The output shaft of the θ-axis motor 96 is connected to a θ-axis shaft 98, and a wafer table 100 is horizontally fixed to the upper end of the θ-axis shaft 98. The wafer W to be chamfered is positioned and mounted on the wafer table 100, and is held by vacuum suction. Then, the held wafer W is rotated around the θ axis by driving the θ axis motor 96.

In the wafer feeding unit 42 configured as described above, the wafer table 100 holding the wafer W is driven
The X-axis motor 78 slides horizontally along the axial direction.
Is driven to slide horizontally along the X-axis direction. Then, by driving the Z-axis motor 94, it slides vertically along the Z-axis direction, and rotates around the θ-axis by driving the θ-axis motor 96.

Next, the configuration of the outer peripheral grinding unit 44 will be described. As shown in FIGS. 1, 2 and 5, a gantry 102 is installed vertically on the base plate 50. An outer peripheral motor 104 is installed vertically on the gantry 102, and an outer peripheral spindle 106 is connected to an output shaft of the outer peripheral motor 104. An outer peripheral grinding wheel 108 for chamfering the outer periphery of the wafer W is mounted on the outer peripheral spindle 106.

The outer peripheral grinding wheel 108 is composed of a grindstone 108A for rough grinding and a grindstone 108B for fine grinding stacked coaxially (composite grindstone), and roughing and finishing with one grindstone. It is configured so that processing can be performed at once. The grinding wheel 108A for rough grinding and the grinding wheel 1 for fine grinding were used.
A groove 108a, 108b having the same shape as the chamfered shape required for the wafer W is formed on the outer periphery of the wafer 08B (form grindstone). By pressing the outer periphery of the wafer W against the grooves 108a, 108b, The outer periphery of the wafer W is chamfered.

Hereinafter, the grindstone 108A for rough grinding will be referred to as a grindstone 108A for rough grinding, and the grindstone 108B for fine grinding will be referred to as a grindstone 108B for fine grinding as necessary. A straight line passing through the rotation center O of the outer peripheral grinding wheel 108 and being parallel to the Y-axis guide rails 52, 52 is referred to as a “Y-axis”,
A straight line that passes through the rotation center O of the outer peripheral grinding wheel 108 and is parallel to the X-axis guide rails 66 is referred to as an “X-axis”.
The rotation axis of the outer peripheral grinding wheel 108 is referred to as “Z axis”.

Next, the configuration of the notch grinding unit 46 will be described. As shown in FIG. 1, FIG. 2 and FIG. 5, a pair of columns 110A and 110B are vertically arranged on both sides of the gantry 102 along the rotation axis of the outer peripheral grinding wheel 108. The lower ends of the pair of columns 110A and 110B are supported by the gantry 102. Horizontal beams 111A and 111B are integrally formed on upper ends of the pair of columns 110A and 110B, respectively. A pair of bearing members 112A and 112B are provided at the ends of the beam portions 111A and 111B, respectively.
Arms 116A and 116B are swingably supported by 12A and 112B via pins 114A and 114B.
The arms 116A and 116B are locked in a horizontal position (a position indicated by a solid line in FIG. 5) and a vertical position (a position indicated by a two-dot broken line in FIG. 4) by lock means (not shown). Hereinafter, the pair of arms 116A and 116B will be referred to as a first arm 116A and a second arm 116B, respectively.

The first arm 116A and the second arm 11
A first notch motor 118A and a second notch motor 118B are supported at the tips of 6B, respectively. This first
A first notch spindle 120A and a second notch spindle 120B are connected to output shafts of the notch motor 118A and the second notch motor 118B, respectively. The first notch spindle 120A has a notch rough grinding wheel 1
22A is mounted, and the notch rough grinding grindstone 122
A performs rough polishing of the notch. on the other hand,
The second notch spindle 120B is provided with a notch grinding wheel 122B, and the notch finishing grinding chamfering is performed by the notch grinding wheel 122B.

As shown in FIGS. 2 and 5, the first notch spindle 120A and the second notch spindle 120B are connected to the first arm 116A and the second arm 1A.
When 16B is held horizontally, it is arranged at a symmetrical position with respect to the Y axis. Further, it is arranged at a position at the same height as the outer peripheral grinding wheel 108. Although not shown in detail, a groove having the same shape as the chamfering shape required for the wafer W is also provided on the outer periphery of the notch rough grinding grindstone 122A and the notch fine grinding grindstone 122B similarly to the outer periphery grinding grindstone 108. Are formed.

Next, the operation of the embodiment of the wafer chamfering apparatus 10 according to the present invention configured as described above will be described. In the initial state, the wafer table 100
Is located at a position a predetermined distance away from the outer peripheral grinding wheel 108 while its rotation axis θ is located on the Y axis. In addition, it is located at a position at a predetermined height with respect to the outer peripheral grinding wheel 108. Hereinafter, this wafer table 100
Is the “origin position”.

First, the wafer W is positioned and placed on the wafer table 100 by a transfer device (not shown). At this time, the wafer W is the center O _W is placed so as to coincide with the rotational axis θ of the wafer table 100, also the notch NO is placed so as to be positioned on the Y axis. When the wafer W is placed on the wafer table 100, the wafer W is suction-held on the wafer table 100. When the wafer W is held by suction on the wafer table 100, chamfering of the wafer W is started. The chamfering of the wafer W is first performed from a peripheral portion C of the wafer W (a circular portion of the wafer W).

FIGS. 6A to 6D show the wafer W
The processing procedure in the case of chamfering the outer periphery C of FIG. First, the Z-axis motor 94 is driven, and the wafer table 100 moves a predetermined amount along the Z-axis direction. As a result, the wafer W held on the wafer table 100 is positioned at the same height as the groove 108a of the outer peripheral grinding wheel 108. This position of the wafer W is referred to as an “outer periphery rough polishing position”.

Next, the outer peripheral motor 104 and the θ-axis motor 96
Is driven, and both the outer peripheral grinding wheel 108 and the wafer table 100 rotate at high speed in the same direction. Next, the Y-axis motor 64 is driven, and the wafer W is sent on the Y-axis toward the outer peripheral grinding wheel 108. At this time, the wafer W is sent at a relatively high speed until just before it comes into contact with the outer peripheral grinding wheel 108, and then is sent at a reduced speed and at a slow speed.

As shown in FIG. 6B, the wafer W sent to the outer peripheral grinding wheel 108 has its outer periphery in contact with the groove 108a of the outer peripheral rough grinding wheel 108A. Even after this contact, the wafer W is sent at a slow speed toward the outer peripheral grinding grindstone 108, and as a result, the outer periphery C of the wafer W is ground by a minute amount on the outer peripheral rough grinding grindstone 108A and roughened. .

As shown in FIG. 6 (c), the wafer W is fed by an outer peripheral grinding wheel 108 and a wafer table 100.
Center distance between the given reaches a predetermined distance L _1.
Then, the center distance is driven in the Y-axis motor 64 reaches a predetermined distance L ₁ is stopped. After stopping, the Y-axis motor 64
Is driven in the opposite direction, whereby the wafer W moves on the Y-axis in a direction away from the outer peripheral grinding wheel 108. Then, as shown in FIG. 6D, when the wafer W returns to the outer peripheral rough polishing position, the driving of the Y-axis motor 64 is stopped.

With the above, the rough chamfering of the outer periphery C of the wafer W is completed. Next, finish chamfering of the outer periphery of the wafer W is performed. When the wafer W returns to the outer circumferential roughing processing position, the Z-axis motor 94 is driven, and the wafer table 100 moves by a predetermined amount along the Z-axis direction. As a result, the wafer W is placed in the groove 108b of the outer peripheral grinding wheel 108B.
And located at the same height. The position of the wafer W is referred to as “peripheral fine polishing position”.

Next, the Y-axis motor 64 is driven, and the wafer W is sent on the Y-axis to the outer peripheral grinding wheel 108. At this time, the wafer W is sent at a relatively high speed until just before the wafer W comes into contact with the outer peripheral grinding wheel 108, and then sent at a reduced speed. The outer periphery C of the wafer W sent toward the outer peripheral grinding wheel 108 has a groove 108 of the outer peripheral polishing wheel 108B.
b. Even after this contact, the wafer W is sent at a slow speed toward the outer peripheral grinding wheel 108, and as a result, the outer periphery C of the wafer W is moved to the outer peripheral grinding wheel 108B.
, And are ground and chamfered.

The wafer W is fed by an outer peripheral grinding wheel 10.
8 and the wafer table 100 have a predetermined distance L
Given until ₂ is reached. Then, the center distance is driven in the Y-axis motor 64 reaches a predetermined distance L ₂ is stopped. After the stop, the Y-axis motor 64 is driven in the reverse direction, whereby the wafer W moves on the Y-axis in a direction away from the outer peripheral grinding wheel 108. Then, when the wafer W returns to the outer periphery fine polishing position, the driving of the Y-axis motor 64 is stopped.

When the driving of the Y-axis motor 64 is stopped,
The driving of the outer peripheral motor 104 and the θ-axis motor 96 is also stopped, whereby the rotation of the outer peripheral grinding wheel 108 and the wafer W is stopped. Thus, finish chamfering of the outer periphery C of the wafer W is completed. Next, chamfering of the notch NO of the wafer W is performed.

As shown in FIG. 7A, the notch NO of the wafer W that has returned to the outer peripheral fine polishing position is located on the Y axis. From this state, first, the X-axis motor 7
8, the wafer W is moved by a predetermined amount in the X-axis direction. As a result, as shown in FIG. 7B, the notch corner NR on one side of the notch NO formed on the wafer W
Are located on a straight line that passes through the notch rough grinding wheel 122A and is parallel to the Y axis. Next, the Z-axis motor 94 is driven, and the wafer W moves by a predetermined amount along the Z-axis direction. As a result,
The wafer W is located at the same height as the groove of the notch rough grinding wheel 122A. The position of the wafer W is referred to as a “notch rough polishing processing position”.

When the wafer W is located at the notch rough grinding position, the first notch motor 118A is driven, and the notch rough grinding wheel 122A rotates at a high speed. At the same time, the Y-axis motor 64 is driven, and the wafer W moves toward the notch rough grinding grindstone 122A. When the wafer W moves by a predetermined distance, the driving of the Y-axis motor 64 is stopped. As a result, as shown in FIG. 7C, the notch corner NR on one side of the wafer W hits the groove of the notch rough grinding grindstone 122A. Touch Then, simultaneously with this contact, the X-axis motor 78 and the Y-axis motor 64 are simultaneously driven, so that the wafer W is fed in the X-axis direction and the Y-axis direction. This feed is given along the shape of the notch corner NR. As a result, the notch corner NR always comes into contact with the notch rough grinding grindstone 122A, and the notch corner NR is rough-chamfered.

When the rough chamfering of the notch corner NR is completed, the wafer W is continuously fed in the X-axis direction and the Y-axis direction, and the notch NO of the wafer W is chamfered. That is, as shown in FIG. 7 (d), the wafer W is fed along the shape of the notch NO such that the notch NO always contacts the notch rough grinding grindstone 122A.
In this case, the notch NO is formed in a V-shape, so that the wafer W is fed so as to draw a V-shape along the shape of the V-shaped notch NO. As a result, the notch NO formed in the V shape is rough chamfered.

When the roughing of the notch NO is completed,
As shown in FIG. 7E, the contact point between the notch rough grinding grindstone 122A and the wafer W reaches the notch corner NR on the other side. When the contact point reaches the notch corner NR on the other side, the notch corner NR is chamfered continuously. That is, feed in the X-axis direction and feed in the Y-axis direction are given to the wafer W, so that the notch corner NR always contacts the notch rough grinding grindstone 122A.
(A feed along the shape of the notch corner NR is provided). As a result, the notch corner NR on the other side of the wafer W is rough-chamfered.

When the chamfering of the notch corner NR on the other side is completed, the feeding of the wafer W is temporarily stopped. Then, from this state, the wafer W is fed by the reverse operation to the above, and as shown in FIGS. 7F and 7G, the notch corner NR, the notch NO and the other side Notch corners NR are sequentially rough-chamfered.

By repeating the above operation a plurality of times,
Rough chamfering of the notch NO and the notch corner NR is performed. When the rough chamfering of the notch NO and the notch corner NR is completed, as shown in FIG. 7G, the wafer W first stops at a position where the wafer W comes into contact with the notch rough grinding wheel 122A. Then, after the stop, the notch grinding wheel 12
7A, moving a predetermined amount in a direction away from 2A.
It returns to the notch roughing processing position shown in (h).

On the other hand, when the wafer W returns to the notch rough polishing processing position, the driving of the first notch motor 118A is stopped, and the rotation of the notch rough polishing grindstone 122A is stopped. Thus, the rough chamfering of the notch NO of the wafer W is completed. Next, finish chamfering of the notch NO of the wafer W is performed. When the wafer W returns to the notch rough polishing position, the X-axis motor 78 is driven, and the wafer W
Move a predetermined amount in the axial direction. As a result, as shown in FIG. 8A, the notch corner NR on one side of the notch NO formed on the wafer W is positioned on a straight line passing through the fine grinding wheel 122B and parallel to the Y axis. Next, the Z-axis motor 94 is driven, and the wafer W moves by a predetermined amount along the Z-axis direction. As a result, the wafer W becomes a notch fine grinding whetstone 122B.
Is located at the same height as the groove. Hereinafter, the position of the wafer W is referred to as a “notch fine polishing processing position”.

When the wafer W is located at the notch fine polishing position, the second notch motor 118B is driven, and the notch fine grinding wheel 122B rotates at a high speed. At the same time, the Y-axis motor 64 is driven, and the wafer W moves toward the notch grinding wheel 122B. When the wafer W moves by a predetermined distance, the driving of the Y-axis motor 64 is stopped. As a result, as shown in FIG. 8B, the notch corner NR on one side of the wafer W hits the groove of the notch grinding wheel 122B. Touch Then, simultaneously with this contact, the X-axis motor 78 and the Y-axis motor 64 are simultaneously driven, so that the wafer W is fed in the X-axis direction and the Y-axis direction. This feed is given along the shape of the notch corner NR. As a result, the notch corner NR always comes into contact with the notch grinding wheel 122B, and the notch corner NR is subjected to finish chamfering.

After finishing the chamfering of the notch corner NR, the wafer W is continuously fed in the X-axis direction and the Y-axis direction, and the notch NO of the wafer W is chamfered. That is, as shown in FIG.
So that O always contacts the notch grinding wheel 122B,
Feed is applied to the wafer W along the shape of the notch NO. In the case shown in the figure, since the notch NO is formed in a V-shape, the wafer W is fed so as to draw a V-shape along the shape of the V-shaped notch NO. As a result, V
The notch NO formed in a letter shape is finish chamfered.

When the chamfering of the notch NO is completed, FIG.
As shown in (d), the contact point between the notch fine grinding grindstone 122B and the wafer W reaches the notch corner NR on the other side. And this contact point is the notch corner NR on the other side.
Is reached, the notch corner NR is chamfered continuously. That is, the feed in the X-axis direction and the feed in the Y-axis direction are given to the wafer W, and the feed is given to the wafer W so that the notch corner NR always comes into contact with the notch grinding wheel 122B (to the shape of the notch corner NR). Feed along.). As a result, the notch corner NR on the other side of the wafer W is finish-chamfered.

When the chamfering of the notch corner NR on the other side is completed, the feeding of the wafer W is temporarily stopped. Then, from this state, the wafer W is fed by the reverse operation to the above, and as shown in FIGS. 8E and 8F, the notch corner NR, the notch NO and the other side Notch corners NR are sequentially finished and chamfered.

By repeating the above operation a plurality of times,
Finish chamfering of the notch NO and the notch corner NR is performed. When the finish chamfering of the notch NO and the notch corner NR is completed, as shown in FIG.
The wafer W first stops at a position where the wafer W comes into contact with the notch grinding wheel 122B. And after the stop, it moves by a predetermined amount in the direction away from the notch grinding wheel 122B,
It returns to the notch fine polishing position shown in FIG.

On the other hand, when the wafer W returns to the notch fine polishing position, the driving of the second notch motor 118B is stopped, and the rotation of the notch fine grinding wheel 122B is stopped. When the wafer W returns to the notch polishing position, the wafer table 100 moves by a predetermined amount in the X-axis direction and the Z-axis direction and returns to the origin position, as shown in FIG.

Through the above series of steps, the rough chamfering and the finishing chamfering of the outer periphery C of the wafer W and the notch NO are completed. When the wafer table 100 returns to the home position,
The suction of the wafer W is released, and the wafer W is picked up from the wafer table 100 by a transfer device (not shown). Then, it is transported to the next step as it is.

As described above, the wafer chamfering apparatus 10 of the present embodiment includes the notch rough grinding grindstone 122A and the notch fine grinding grindstone 122B. Grinding can be performed simultaneously.
Therefore, it is not necessary to perform fine polishing by another device after the rough polishing as in the conventional case, and the processing efficiency is improved. In addition, since rough polishing and fine polishing can be performed while the wafers are placed on the same wafer table 100, misalignment due to replacement can be prevented, and high-precision chamfering can be performed. .

Further, the notch rough grinding grindstone 122A and the notch fine grinding grindstone 122B are provided with separate notch spindles 120B.
Since it is mounted on A, 120B, there is no need to use a composite whetstone, and it can be manufactured in a short length. For this reason, the rigidity of the grindstone can be sufficiently ensured. Further, the notch rough grinding wheel 122A and the notch fine grinding wheel 12A are used.
Since 2B is installed offset from the center position (Y axis), maintenance of the outer peripheral grinding wheel 108 and the wafer table 100 is facilitated.

The notch rough grinding grindstone 122A and the notch fine grinding grindstone 122B can be arranged at the same height as the outer periphery grinding grindstone 108 by being installed offset from the center position. Thereby, the stroke when the wafer table 100 is moved up and down can be set short, and the apparatus can be made compact.

In the wafer chamfering apparatus 10 of the present embodiment, the wafer W
The chamfering of the wafer W may be performed by fixing the wafer side and moving the grindstone side. Further, in the wafer chamfering apparatus 10 of the present embodiment, the notch spindles 120A, 120A
Although two B's are installed, the number is not limited to this. Only one notch spindle may be provided, and in this case, the notch spindle is installed offset from the center position (Y axis).

Further, in the wafer chamfering apparatus 10 according to the present embodiment, although a full-shaped whetstone is used as a whetstone for chamfering a wafer, the present invention is not limited to this. As shown in FIG. May be used. When this grindstone is used, the taper surface 1 of the groove 130A
The upper edge or the lower edge of the wafer W is pressed against 30a, thereby chamfering the wafer W one edge at a time.

[0055]

As described above, according to the present invention,
Notch grinding spindles are installed on both sides ,
The structure is easy to maintain. Further, by installing a plurality of notch grinding spindles, it becomes possible to perform rough polishing and fine polishing of the notch with one apparatus. Furthermore, since there is no need to use a composite whetstone,
The length of the grindstone can be shortened, and the rigidity of the grindstone can be sufficiently secured.

[Brief description of the drawings]

FIG. 1 is a side view showing a configuration of a wafer chamfering apparatus.

FIG. 2 is a plan view showing a configuration of a wafer chamfering apparatus.

FIG. 3 is a sectional view taken along line AA of FIG. 1;

FIG. 4 is a sectional view taken along line BB of FIG. 1;

FIG. 5 is a front view showing a configuration of an outer peripheral grinding unit and a notch grinding unit.

FIG. 6 is an explanatory view of a method of chamfering the outer periphery of a notched wafer.

FIG. 7 is an explanatory view of a method of rough-chamfering a notch of a notched wafer.

FIG. 8 is an explanatory diagram of a method of finishing and chamfering a notch of a notched wafer.

FIG. 9 is a side view showing the configuration of another embodiment of the grinding wheel.

FIG. 10 is an explanatory diagram of a configuration of a conventional wafer chamfering apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Wafer chamfering apparatus 42 ... Wafer feed unit 44 ... Perimeter grinding unit 46 ... Notch grinding unit 56 ... Y-axis table 70 ... X-axis table 86 ... Z-axis table 100 ... Wafer table 104 ... Perimeter motor 108 ... Peripheral grinding grindstone 118A ... 1st notch motor 118B ... 2nd notch motor 120A ... 1st notch spindle 120B ... 2nd notch spindle 122A ... grindstone for notch rough grinding 122B ... grindstone for notch fine grinding W ... wafer C ... circular part NO ... notch NR ... notch corner

Continuation of the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) B24B 9/00 601 H01L 21/304 621

Claims (2)

(57) [Claims] The method according to claim 1] bringing the wafer to rotate is held by being mounted on the outer peripheral grinding spindles toward the outer periphery grinding grindstone that rotates c Ehateburu, said pressed against the outer periphery of the wafer to the outer periphery grinding grindstone the outer periphery of the wafer while chamfering, by bringing the wafer held on the wafer table toward the grindstone notch grinding which rotates is mounted on the notch spindle,
The notch of the wafer is chamfered by pressing a wafer notch grinding wheel for notch grinding, before Kigaishu grinding wheels, the grinding wheel and grinding wheel for fine Labs for coarse Labs is constructed by stacking coaxially The notch spindle includes a first notch spindle equipped with a notch grinding wheel for rough grinding and a second notch spindle equipped with a notch grinding wheel for fine grinding. And the second
The notch spindle is disposed between the outer peripheral grinding spindle and the wafer table, and the center thereof is provided on both sides of a straight line connecting the center of the outer peripheral grinding spindle and the center of the wafer table. A wafer chamfering apparatus. 2. The wafer chamfering apparatus according to claim 1, wherein the notch grinding wheel and the outer circumference grinding wheel are installed at the same height.