JP3163996U - Thermal convection heat sink plate structure - Google Patents

Abstract

Provided is a heat convection heat sink plate structure capable of driving a working fluid and transmitting heat without requiring any capillary structure. The main body includes a chamber, and the chamber includes an evaporation region, a cooling region, and a partition wall, and the evaporation region and the cooling region are located on a lower side and an upper side of the chamber, respectively. And the first communication hole set and the second communication hole set of the partition wall are in communication with each other, and the evaporation region and the cooling region have a plurality of first conductive fluids and second conductive fluids, and are arranged at intervals. Forming first and second flow paths having a wide end and a narrow end between the first and second conductive fluids, respectively. The first flow path is connected to the free region, and a low pressure end is generated in the cooling region by an appropriate pressure reduction design, so that the air in the thermothermal convection heat sink plate structure is formed. A pressure gradient necessary to drive the liquid circulation is formed. [Selection] Figure 1

Description

The present invention relates to a heat convection heat sink plate structure, and more particularly, to a heat convection heat sink plate structure that can drive a working fluid without transmitting a capillary structure and transfer heat, thereby greatly reducing manufacturing costs.

In recent years, with the rapid development of the electronic semiconductor industry and the advancement of manufacturing technology, electronic equipment is gradually moving toward light, thin and small forms under the trend of market demand. On the other hand, functions and computing power are increasing more and more. In the information industry, when notebook computers and desktop computers with the highest production values actually operate, electronic components generate a large amount of heat, of which the CPU (Central Processing Unit) generates the largest amount of heat. In some cases, the heat sink composed of a heat sink piece combined with a fan plays an important role in protecting the CPU by performing a heat dissipation function, and allows the CPU to perform a corresponding function at a normal operating temperature. It has become an important assembly.

In recent years, water cooling technology has begun to be widely used on personal computers, and water cooling technology can save a large volume of heat sink pieces. However, heat from the heat source in the system is collected in the working fluid and air and heat are collected by a heat exchanger. Since the operation of the exchange is unified and the length of the pipe can be changed by itself, the position of the heat exchanger is also relatively flexible, and the design of the heat exchanger (heat sink fin) is limited in space There is nothing. However, the water cooling system requires the working fluid to flow by the pump and further requires a water storage case, and the entire system still has problems such as the reliability of the pump, the problem of pipe dew condensation, etc. Since the heat quantity of the heat-generating members of this type is constantly increasing, the water-cooled heat dissipation technology is not perfect, but it is still the best choice for heat management and control in the current market. However, this is a case where the volume of the personal computer is relatively large and there is no relatively limited space on the outside. Today's notebook computers are becoming increasingly lighter and smaller and cannot use water-cooled heat dissipation technology, so today, they still use heat pipes to perform heat transfer, and then use heat sink fins to dissipate heat. It is also effective to reduce the power consumption of the CPU. In view of this, it is necessary for the industry to actively pursue a heat radiation technology with a higher heat transfer rate and meet the increasing heat radiation demand.

The conventional technology uses heat radiating members such as heat pipes and soaking plates as heat conducting members, but when manufacturing heat pipes and soaking plates, a sintered body is molded on the inner wall of the tube, and the capillaries are cut. Although applied as a structure, the main manufacturing process is to first fill the inner wall with metal (copper) granules or powder, press the copper granules or powder, and finally send it into the sintering furnace Sintered to form the copper granules or powder into a porous structure with a porous property, and the sintered body can obtain a capillary action. The sintered body has a volume of the heat pipe and a soaking plate. Therefore, the thickness cannot be reduced efficiently. The VC (Vapor Chamber) uses a sintered core or matrix or groove structure to generate a capillary phenomenon, and drives the gas-liquid circulation in the heat pipe or VC (Vapor Chamber). The manufacturing method is considerably complicated, increases the manufacturing cost, and is inappropriate.

  In addition, the selection of the refrigerant has been theoretically studied, and it is quite important to select an appropriate refrigerant, and the refrigerant will maintain sufficient coolant flow rate to overcome the effects of gravity It is necessary to keep the capillary action.

Prior art heat pipes or VCs (Vapor chambers) have the following disadvantages:
1.
Inconvenient for processing;
2.
Thinning is not possible;
3.
High cost;
Four.
Consumes process time.

JP 2005-259794 A

  In order to efficiently solve the above problems, the object of the present invention is to improve the structure of the heat and heat convection heat sink plate, which does not require a capillary structure, drives the working fluid to transmit the heat, and greatly reduces the manufacturing cost. Is to provide.

Another object of the present invention is to provide an improved thermal convection heat sink plate structure with high efficiency thermal conductivity.

In order to achieve the above object, a thermal convection heat sink plate structure provided by the present invention has a main body, the main body has a chamber, and an evaporation region, a cooling region, a partition wall, and the like are included in the chamber. The evaporation region is provided on one side of the chamber, has a plurality of flow guide portions, the first flow guide portion has a plurality of first guide fluids, and the first guide The fluids are spaced apart to form at least one first flow path between the first conducting fluids, the first flow path having a first narrow end and a first wide end, One wide end corresponds to the first narrow end of the other first flow path, the first flow path is connected to at least one free region, and the cooling region is opposite to the evaporation region of the chamber. Provided on the other side, and having a plurality of second diversion parts, the second diversion parts have a plurality of second diversion fluids, and the second diversion fluids are arranged at intervals, and Second diversion At least one second flow path is formed therebetween, the second flow path having a second narrow end and a second wide end, and the second wide end is a second narrow end of the other second flow path. Corresponding to the end, the partition wall is provided between the evaporation region and the cooling region in the chamber, and the partition wall has a first communication hole set and a second communication hole set, The communication holes communicate the evaporation region and the cooling region, respectively.

  In the heat convection heat sink plate structure of the present invention, in the heat convection heat sink plate, an appropriate first flow path is installed between the first fluid body and the first fluid, and the hot air generated by the first flow contacting the heat source is generated. Establish the high pressure required to drive the return circulation locally, generate the low pressure end with an appropriate decompression design before the cooling area, and drive the gas-liquid circulation in the heat convection heat sink plate structure Forms a pressure gradient, drives the working fluid without any capillary structure and transfers heat, greatly improves heat transfer efficiency and reduces manufacturing costs.

1 is an exploded view of a preferred embodiment of a heat convection heat sink plate structure of the present invention. FIG. 3 is a three-dimensional combination diagram of a preferred embodiment of the heat convection heat sink plate structure of the present invention. FIG. 5 is another exploded view of a preferred embodiment of the heat convection heat sink plate structure of the present invention. 1 is a cross-sectional view of a preferred embodiment of a heat convection heat sink plate structure of the present invention. FIG. 4 is another cross-sectional view of a preferred embodiment of the heat convection heat sink plate structure of the present invention. It is a top view of the evaporation area | region of 2nd Example of the heat convection heat sink board structure of this invention. It is a bottom view of the cooling area | region of 2nd Example of the heat convection heat sink board structure of this invention. It is a top view of the evaporation area | region of 3rd Example of the heat convection heat sink board structure of this invention. It is a bottom view of the cooling area | region of 3rd Example of the heat convection heat sink board structure of this invention. It is a top view of the evaporation area | region of the other aspect of 2nd Example of the heat convection heat sink board structure of this invention. It is a bottom view of the cooling area | region of the other aspect of 2nd Example of the heat convection heat sink board structure of this invention. It is a top view of the evaporation area | region of the other aspect of 2nd Example of the heat convection heat sink board structure of this invention. It is a bottom view of the cooling area | region of the other aspect of 2nd Example of the heat convection heat sink board structure of this invention. It is a top view of the evaporation area | region of the other aspect of 2nd Example of the heat convection heat sink board structure of this invention. It is a bottom view of the cooling area | region of the other aspect of 2nd Example of the heat convection heat sink board structure of this invention. It is a top view of the evaporation area | region of the other aspect of 2nd Example of the heat convection heat sink board structure of this invention. It is a bottom view of the cooling area | region of the other aspect of 2nd Example of the heat convection heat sink board structure of this invention.

  The above object and the characteristics of the structure and function of the present invention will be described below with reference to embodiments based on the drawings.

1, 2, 3, 4, and 5 are three-dimensional disassembly, combination, and cross-sectional views of an embodiment of a heat convection heat sink plate structure according to the present invention. As shown in FIG. The main body 1 has a chamber 11, and the chamber 11 has an evaporation region 12, a cooling region 13, and a partition wall 14.

The evaporation region 12 is provided on one side of the chamber 11 and includes a plurality of flow guide portions 121, and the first flow guide portion 121 includes a plurality of first flow guide fluids 1211, The fluids 1211 are arranged at intervals in the horizontal direction and are arranged in a continuous manner in the vertical direction to form one first flow path 1212 between the first conducting fluids 1211, and the first flow path 1212 is a first flow path 1212. The first wide end 1212b corresponds to the first narrow end 1212a of the other first flow path 1212, and the first flow path 1212 has at least one free end. Connect to region 1213.

The cooling region 13 is provided on the opposite side of the evaporation region 12 of the chamber 11 and has a plurality of second flow guide portions 131, and the second flow guide portion 131 passes a plurality of second flow guide fluids 1311. The second conducting fluid 1311 is arranged at a lateral interval, and is arranged continuously in a vertical direction, forming at least one second flow path 1312 between the second conducting fluids 1311, and the second conducting fluid 1311. The flow path 1312 has a second narrow end 1312a and a second wide end 1312b, and the second wide end 1312b corresponds to the second narrow end 1312a of the other second flow path 1312.

The partition wall 14 is provided between the evaporation region 12 and the cooling region 13 in the chamber 11, and the partition wall 14 includes a first communication hole set 141 and a second communication hole set 142. , 2 communication holes 141, 142 communicate with the evaporation region 12 and the cooling region 13, respectively, and the first and second communication hole sets 141, 142 correspond to each other and are provided on both sides of the partition wall 14.

FIGS. 6 and 7 show a second embodiment of the heat convection heat sink plate structure of the present invention. As shown in the figure, the structure of this embodiment and the relevance between the members are the same as in the previous embodiment. Therefore, it is not described here again, and the difference between the present embodiment and the above embodiment is that the first and second conducting fluids 1211 and 1311 are arranged in a discontinuous manner in the vertical direction.

8 and 9 show a third embodiment of the heat convection heat sink plate structure of the present invention. As shown in the figure, the structure and the main structure between the members of this embodiment are the same as those of the above embodiment. Therefore, it is not described here again, and in this embodiment and the different portions of the embodiment, a plurality of concave grooves 1214 and 1313 are formed between the first and second fluids 1211 and 1311, and the concave grooves 1214 and 1313 are formed. Is any one of a circle, a square, a triangle, a scale, and a geometric figure. In the present embodiment, the scale is in the form of a scale, but is not limited thereto.

The first and second conducting fluids 1211, 1311 of the preferred embodiment and the second embodiment are circular (FIGS. 10, 11), triangles (FIGS. 12, 13), trapezoids (FIGS. 14, 15), and diamonds (FIG. 16, 17) and geometric shapes.

  Referring to FIGS. 1 to 15, as shown in the drawings, the preferred embodiment and the second and third embodiments of the present invention present a gas-liquid two-phase heat convection heat sink plate structure circulation cooling technology, The method is a self-driven circulation system, and the working fluid to be used can employ a refrigerant such as pure water, methanol, acetone, R134A, etc., and the chamber 11 of the heat convection heat sink plate structure is in a vacuum suction state. As such, the working fluid filled therein is 20-30 degrees Celsius, i.e., the saturated vapor temperature of the working fluid. The evaporative bubbles 2 circulate in the evaporation region 12 and then flow in the free region 1213 to be depressurized to generate a pressure gradient necessary for driving the gas-liquid circulation. Further, the sudden decrease in volume due to gas cooling / condensation in the cooling region 13 forms a suction action by local negative pressure, and assists gas-liquid circulation from the evaporation region to the cooling region.

  The condensed liquid working fluid circulates back from the cooling region 13 to the evaporation region 12 due to the pressure gradient. Applying the high thermal convection coefficient generated during evaporation and condensation, the thermal distribution uniformity of the thermal convection heat sink plate structure is greatly improved and the thermal resistance is reduced.

  That is, the above system introduces waste heat generated by a heat generating member (not shown) into the surface of the evaporation region 12 of the main body 1 and transmits it to the first flow path 1212 of the evaporation region 12 to evaporate the refrigerant. A part of the refrigerant liquid is vaporized, and the vaporized light gas moves the fluid to the cooling region 13 to dissipate heat, and the condensed working fluid returns to the evaporation region 12 by gravity, and a heating member (not shown) The heat is absorbed from the evaporation region 12 in contact with the water and recirculated.

  In recent years, a cooling device having a large heat dissipation capacity generates a circulating power by a driven water circulation means, that is, a pump, in various water cooling technologies, but this method easily causes problems of reliability and life of a pump valve. On the other hand, the advantage of the circulation cooling technology by the gas-liquid two-phase heat convection heat sink plate structure proposed by the present invention is that there is no power member in the system, so that problems such as wear and life of parts are relatively reduced. It does not have to have a separate pump and capillary structure, and the overall structure is simple and low-cost, not only is energy saving, but also can solve the problem of noise.

DESCRIPTION OF SYMBOLS 1 Main body 11 Chamber 12 Evaporation area | region 121 1st flow part 1211 1st flow part 1212 1st flow path 1212a 1st narrow end 1212b 1st wide end 1213 Free area | region end 1214 Groove 13 Cooling area 131 2nd flow part 1311 Second fluid 1312 Second flow path 1312a Second narrow end 1312b Second wide end 1313 Concave groove 14 Partition wall 141 First communication hole set 142 Second communication hole set

Claims (10)

It has a body,
The main body forms a chamber for circulating a refrigerant divided into an evaporation region and a cooling region vertically by a partition wall;
The evaporation region and the cooling region form a first conduction part and a second conduction part for allowing the refrigerant to flow along the surface of the chamber, respectively, and the first conduction part of the evaporation region includes a plurality of refrigerant fluids. Having a first conducting fluid, the first conducting fluids being arranged in parallel at intervals to form a first flow path between the rows, the first flow path being narrow in their spacing. The first narrow end and the widest first wide end are formed, the first wide end with respect to the first narrow end and the first wide end with respect to the first wide end between the flow paths in each row. The first flow path is connected to a free region in which the flow path is enlarged at least on one end side thereof,
The second flow guide portion of the cooling region has a plurality of second conductive fluids for guiding the refrigerant fluid, and forms a second narrow end with a narrow interval between them and a second wide end with a wide interval, and each row The second wide end with respect to the second narrow end, and the second narrow end with respect to the second wide end,
The evaporating area and the cooling area were circulated through the partition wall by a first communicating hole set and a second communicating hole set respectively communicating at both ends thereof.
Thermal convection heat sink plate structure.   2. The heat convection heat sink plate structure according to claim 1, wherein the first and second communication hole sets are respectively provided opposite to both sides of the partition wall.   The heat convection heat sink plate structure according to claim 1, wherein the first conducting fluid is continuously arranged in a vertical direction.   The heat convection heat sink plate structure according to claim 1, wherein the first conductive fluid is arranged in a non-continuous manner in a vertical direction.   The heat convection heat sink plate structure improvement according to claim 1, wherein the second conductive fluid is continuously arranged in a vertical direction.   The heat convection heat sink plate structure according to claim 1, wherein the second fluid is arranged in a non-continuous manner in a vertical direction.   The heat convection heat sink plate structure according to claim 1, wherein a plurality of concave grooves are provided between the first and second conducting fluids.   The thermal convection heat sink plate structure according to claim 7, wherein the groove is any one of a circle, a square, a triangle, a scale, and a geometric shape.   2. The heat convection heat sink plate structure according to claim 1, wherein the first fluid is one of a circle, a triangle, a trapezoid, a rhombus, and a geometric shape. 2. The heat convection heat sink plate structure according to claim 1, wherein the second conductive fluid is one of a circle, a triangle, a trapezoid, a rhombus, and a geometric shape.

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