JP3134925B2 - Method and apparatus for fixing plate-like body such as circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily and satisfactorily stick a circuit board to a support plate constituting a hybrid integrated circuit. SOLUTION: An adhesive 1 is put in a semicircular recessed part 9, and also a part of a roller 4 is put therein and is rotated to form an adhesive layer 11a on an outer peripheral surface 4c of the roller 4. While circuit substrates 19 are brought into contact with the adhesive layer 11a of the roller 4, they are horizontally moved to provide an adhesive layer 11b on the back surface of the circuit board 19. The circuit substrate 19 carrying the adhesive layers 11b is stuck to a support plate 23.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for fixing a circuit board or a similar plate-like body for forming a hybrid integrated circuit with an adhesive.

[0002]

2. Description of the Related Art When constructing a hybrid integrated circuit, that is, a hybrid IC, a circuit board is fixed together with a semiconductor element on a support plate having good heat dissipation with a conductive or non-conductive adhesive. As a conventional method for fixing a circuit board to a support plate, the following three methods are used.
Two methods are known. The first method is a dispenser method, in which an adhesive is dropped on a support plate and supplied, and a circuit board is placed thereon using a vacuum suction device or the like. The second method is a stamp method, in which a stamp having an adhesive adhered to its surface is pressed against a support plate to transfer the adhesive to the support plate, and a circuit board is disposed thereon. The third method is a printing method, in which an adhesive is supplied on a support plate by screen printing, and a circuit board is disposed thereon.

[0003]

However, the above-mentioned dispenser method and stamp method have a disadvantage that the thickness of the adhesive cannot be made uniform. Further, although the printing method can make the adhesive have a relatively uniform thickness, the printing method has a disadvantage in that the printing plate needs to be arranged on the support plate and the like, which complicates the operation. Further, any of the first, second, and third methods cannot be performed in a series of steps in which the suction and placement of the circuit board and the supply of the adhesive are integrated, resulting in a disadvantage that productivity is poor.

Accordingly, an object of the present invention is to provide a method and an apparatus which can easily fix a plate-like body such as a circuit board with an adhesive.

[0005]

An object of the present invention to solve the above problems and achieve the above object is a method of fixing a plate-like body to an object to be fixed by an adhesive, wherein the roller is provided with an adhesive. arrangement comprising the steps of Ru was attached, the plate-like body as the main surface of the plate-shaped body is at a height that can be in contact with the adhesive attached to and the roller is parallel to the tangential direction of the roller and, stearyl the adhesive on the roller by rotating the roller with moving the plate-like body in a tangential direction of the roller Ru is adhered to the plate-like body
And the adhesion of the adhesive to the plate-like body
The area where the adhesive has been removed from the outer peripheral surface of the roller
And whether the adhesive was successfully stripped.
It is determined whether or not the adhesive has been stripped satisfactorily.
When it is determined that
Step a, method of fixing the plate-like member plate-like body, characterized in that it has the step of securing said plate-like body to the object to be fixed object by the adhesive adhering to the to prohibit adhesion operation of the body It is related to. Further, an invention of an apparatus for achieving the above object is an apparatus for fixing a plate-like body to an object to be fixed with an adhesive, a roller, a rotation driving device for rotating the roller, and an adhesive. An adhesive container having a concave portion for accommodating an agent, a part of the roller protruding from the concave portion, and a remaining portion of the roller formed to be inserted into the concave portion; and a main surface of the plate-like body. A holding device for detachably holding the plate-like body so that the plate-like body is parallel to a tangential direction of the roller, and a height position at which a main surface of the plate-like body can contact an adhesive attached to the roller. The plate-shaped body is positioned so as to become, and the plate-shaped body is moved in a tangential direction of the roller so that the adhesive of the roller can be attached to the main surface of the plate-shaped body. Remove the adhesive that was attached Is attached to the serial plate-like body, a plate-like member moving device for moving said plate-like body entailed the adhesive on the object to be fixed object,
The aforesaid b caused by adhesion of an adhesive to the plate-like body.
The area where the adhesive has been removed from the outer peripheral surface of the
An optical sensor for judging whether or not the delamination of the adhesive has been successfully performed, and the delamination of the adhesive is preferably performed by the optical sensor.
When it is determined that the fixation has not been performed,
The bonding operation of the plate-like body with respect to
The present invention relates to a plate-like body fixing device characterized in that: It is preferable that the recess is a recess having an arcuate surface. Further, it is desirable to dispose an adhesive adjusting member (dispenser) for removing excess adhesive attached to the roller, as described in claim 4.
As the adhesive in the present application, a paste-like solder, a conductive adhesive (joining material) such as a paste-like conductive joining material mixed with a resin, or a paste-like insulating adhesive or a joining material may be used. it can.

[0006]

According to the invention of each claim, the adhesive is applied to the roller, and the plate is moved in the tangential direction of the roller so that the adhesive of the roller is attached to the plate. The adhesive can be easily and sequentially adhered to the plate-like body of the above, and productivity can be improved. Further, the plate-like body to which the adhesive has been adhered can be adhered to an object to be fixed such as a support plate in a series of steps, and the workability of the adhesion of the plate-like body can be improved. Also,
Roller caused by adhesion of adhesive to plate
Detects the area where the adhesive has been removed from the outer peripheral surface.
Provide an optical sensor to determine whether or not it was performed well,
Adhesive is not removed properly by optical sensor
Is determined, the adhesive movement of the plate
Operation is prohibited.
Good quality can be prevented. According to the third and fourth aspects of the present invention, it is possible to satisfactorily adhere the adhesive to the roller.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A method and an apparatus for fixing a circuit board according to an embodiment of the present invention will be described below. As shown in FIGS. 1 and 2, the circuit board fixing device of this embodiment is roughly divided into an adhesive supply device 1 and a circuit board transport device 2.

[0008] The adhesive supply device 1 comprises an adhesive container 3 in the form of a pot, a roller 4 and an adhesive adjusting member (squeegee) 5.
And a position adjusting device 6 having a micrometer configuration or a lead screw configuration, an adhesive supply source 7 which can also be called a dispenser, and a roller driving device 8.
The adhesive container 3 has a concave portion 9 having a semicircular (fan) cross section on the upper surface. The recess 9 is formed by a pair of side surfaces 4 of the roller 4.
a, 4b and a pair of side wall surfaces 9a, 9b parallel to the roller surface 4 and an arc surface 9c facing the circumferential surface 4c of the roller 4.
1 and 2, a hole 10 is provided from the left side surface of the container 3 to the recess 9, and the adhesive supply source 7 is coupled to the hole 10. The adhesive (for example, paste-like solder) adjusted into a paste by the adhesive supply source 7 is supplied little by little to the recess 9 through the hole 10. Thereby, the recess 9
, An appropriate amount of paste adhesive 11 is disposed.

The roller 4 is disk-shaped, has a radius smaller than the radius of the arc surface 9c of the recess 9, and
Is formed thinner than the distance between the pair of side wall surfaces 9a and 9b. Further, the roller 4 is arranged so that a part thereof projects upward from the concave portion 9 and the remaining portion is accommodated in the concave portion 9. Further, the roller 4 is eccentrically arranged such that its center is shifted from the center of the arc surface 9c of the concave portion 9. As a result, the distance between the outer peripheral surface 4c of the roller 4 and the arc surface 9c of the concave portion 9 gradually decreases from the left end (one end) of the concave portion 9 to the right end (the other end) in FIG. A shaft 12 is connected to the roller 4, and the shaft 12 is rotatably supported by a pair of bearings 13.
Is joined to. A mesh-shaped groove 4e is provided on the outer peripheral surface 4c of the roller 4 in order to make the adhesive 11 adhere well. The roller 4 is rotated in a counterclockwise direction indicated by an arrow 13 in FIG. This rotation direction is roller 4
The distance between the outer peripheral surface 4c and the arc surface 9c of the concave portion 9 coincides with the direction in which the distance gradually decreases.

As shown in FIG. 2, the adhesive adjusting member 5 has a notch recess 5 slightly wider than the thickness of the roller 4.
a, and the roller 4 enters into the concave portion 5a. The distance between the outer peripheral surface 4c of the roller 4 and the adhesive adjustment member 5 is determined by the adhesive 11 attached to the outer peripheral surface 4c of the roller 4.
The thickness is set to be the same as the thickness of “a”. In order to enable the adjustment of the distance, the adhesive adjusting member 5 is provided with a pair of guides 14.
2 and a position adjusting device 6 is provided.

The position adjusting device 6 includes a nut 6a fixed to the adhesive adjusting member 5, a lead screw (screw rod) 6b screwed to the nut, and a knob 6c. It is rotatably supported. Therefore, the rotation of the lead screw 6b is converted into a linear motion, and the adhesive adjusting member 5 moves forward or backward.

The circuit board transfer device 2 includes a plurality of suction devices 1.
6 and a moving device 17. The suction device 16 as a circuit board holding means is a collet 1 for vacuum suction.
8 to hold the circuit board 19 by suction. The circuit board 19 sucked by the collet 18 is released from the collet 18 by releasing the vacuum suction.
Break away from

The moving device 17 moves the suction device 16 and the circuit board 19 sucked by the suction device 16 in a horizontal direction (x-axis direction) indicated by an arrow 20 and a vertical direction (y-axis direction) indicated by an arrow 21 in FIG.
It is configured to be able to move in both directions. The moving device 17 is configured so that the plurality of suction devices 16 can be moved independently in the vertical direction indicated by the arrow 21. In addition, the mobile device 1
7 arranges the main surface of the circuit board 19 parallel to the tangential direction at the uppermost part of the roller 4 and moves the circuit board 19 along the tangential direction so that the adhesive layer 11a on the roller 4
The lower main surface of the circuit board 19 can be brought into contact with the main body.

In FIG. 1, a mounting table 22 is disposed on the left side of the adhesive supply device 1, and a metal support plate 23 having heat radiation is disposed thereon. The support plate 23 on the mounting table 22 is an object to which the circuit board 19 is fixed, and is arranged such that its main surface is parallel to the main surface of the circuit board 19. The transfer device 2 is configured to be able to move the circuit board 19 above the support plate 23.

This circuit board fixing device is an optical sensor 24 arranged near the outer peripheral surface 4c of the roller 4 in FIG.
Having. The sensor 24 optically detects whether or not the transfer of the adhesive layer 11a on the outer peripheral surface 4c of the roller 4 to the circuit board 19 has been reliably achieved, and includes a light emitting element (not shown) and a light receiving element. (Not shown). The sensor 24 projects light onto the outer peripheral surface 4c of the roller 4 and detects the reflected light to thereby detect the outer peripheral surface 4c.
Whether or not a part or all of the adhesive layer 11a remains on c is detected in synchronization with the horizontal movement of the circuit board 19.

[0016]

[Fixing Method of Circuit Board] When the circuit board 19 is fixed to the support plate 23, the paste (liquid) adhesive 11 is supplied from the adhesive supply source 7 to the recess 9 and the roller 4 is rotated. Thereby, the adhesive 11 is applied to the outer peripheral surface 4c of the roller 4.
Is adhered, and the amount of adhesion is adjusted by the adhesive adjusting member 5, so that the adhesive layer 11 a having a desired thickness is formed on the outer peripheral surface 4 c of the roller 4. Next, while rotating the roller 4, the circuit board 19 is moved by the transport device 2 so as to contact the adhesive layer 11 a at the top of the roller 4 as shown in FIG. 1. At this time, the main surface of the circuit board 19 is arranged parallel to the tangential direction at the top of the roller 4 as described above. Preferably, the horizontal moving speed of the circuit board 19 is substantially equal to the peripheral speed of the outer peripheral surface 4c of the roller 4. Thereby, the adhesive layer 11a of the roller 4
Is partially transferred to the lower surface of the circuit board 19, and the circuit board 19
The adhesive layer 11b adheres to the lower surface of the roller 4, and a stripped area 25 of the adhesive layer 11a is formed on the outer peripheral surface 4c of the roller 4. Since the plurality of circuit boards 19 move at predetermined intervals,
A stripped area 25 is intermittently formed in the adhesive layer 11a on the outer peripheral surface 4c of the roller 4. The sensor 24 determines whether the delamination of the adhesive layer 11a has been successfully performed by detecting the deprived area 25. When it is determined that the delamination has not been performed properly, the sensor 24 notifies the suction device 16 of the result. , Circuit board 1
9 is removed from the suction device 16 or the moving device 17
And the bonding operation of the circuit board 19 to the support plate 23 is prohibited. When the stripped area 25 of the adhesive layer 11a on the outer peripheral surface 4c of the roller 4 comes into contact with the adhesive 11 in the concave portion 9, the adhesive layer 11a is formed again here.

The circuit board 19 to which the adhesive layer 11b is attached
Is moved above the support plate 23 by the moving device 17 and then moved downward. Thereby, as shown in FIG. 3, the circuit board 19 is fixed to the support plate 23 by the adhesive layer 11b on the lower surface.

As apparent from the above, the present embodiment has the following effects. (A) Since the adhesive 11 is adhered to the roller 4 and the adhesive layer 11a of the roller 4 is adhered to the circuit board 19, the adhesive layer 11b can be efficiently formed on the circuit board 19. (B) The roller 4 has an adhesive layer 11a having a substantially constant thickness.
Is transferred to the circuit board 19, so that the circuit board 19
The thickness of the adhesive layer 11b can be made substantially constant. (C) The circuit board 19 is moved in the horizontal direction and the adhesive layer 1 is moved.
1b is attached, and then the circuit board 19 is moved onto the support plate 23 and the circuit board 19 is fixed to the support plate 23, so that the supply of the adhesive 11 and the fixation of the circuit board 19 are achieved in a series of steps. The fixing of the circuit board 19 to the support plate 23 can be achieved with high productivity. (D) Since the roller 4 is eccentrically arranged with respect to the arc surface 9c of the concave portion 9, the distance between the two gradually changes. Therefore,
The adhesive 11 can be satisfactorily adhered to the outer peripheral surface 4c of the roller 4. (E) Since the adhesive adjusting member (squeegee) 5 is provided and the position adjusting device 6 for this is further provided, the adhesive layer 11a having a desired thickness can be easily obtained. (F) Since the sensor 24 is provided, it is possible to easily determine whether or not the adhesive layer 11b is adhered to the circuit board 19 or to determine whether or not the adhesive layer 11b is adhered, thereby preventing poor adhesion of the circuit board 19 to the support plate 23. (G) Since the groove 4e is formed on the outer peripheral surface 4c of the roller 4, the adhesive 11 can be satisfactorily adhered.

[0019]

[Modifications] The present invention is not limited to the above-described embodiment, and for example, the following modifications are possible. (1) The present invention can be applied to a case where an adhesive is attached to a plate-shaped electronic component such as a semiconductor element instead of the circuit board 19 and the adhesive is fixed to a support plate. (2) The suction device 16 can be replaced with a holding device or a mechanical holding device using magnet action. (3) When fixing the circuit board 19 to the support plate 23, the support plate 23 can be moved upward toward the circuit board 19 instead of moving the circuit board 19 downward. (4) The pattern of the groove 4e on the outer peripheral surface 4c of the roller 4 can be variously modified, and may be a groove extending parallel to the side surfaces 4a and 4b, a groove extending perpendicular to the side surfaces 4a and 4b, or a combination thereof. be able to. Further, the groove 4e can be omitted depending on the type of the adhesive 11.

[Brief description of the drawings]

FIG. 1 is a front view showing a device for fixing a circuit board to a support plate according to an embodiment of the present invention in a state where a part of a line AA in FIG. 2 is cut.

FIG. 2 is a plan view showing a part of the fixing device of FIG. 1;

FIG. 3 is an enlarged sectional view showing a state in which a circuit board is fixed to a support plate.

[Explanation of symbols]

 3 Adhesive container 4 Roller 11 Adhesive 19 Circuit board 23 Support plate

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ identification code FI H05K 3/00 H05K 3/00 B (58) Field surveyed (Int.Cl. ⁷ , DB name) B05C 1/02 102 B05C 1 / 08-1/12 B05D 1 / 28,7 / 00 B05D 7/24 301 C09J 5/00 H01L 21/52 H05K 3 / 00,3 / 28

Claims (4)

(57) [Claims] 1. A method for fixing the plate-like body to be fixed object by an adhesive, comprising the steps of Ru to adhere the adhesive to the roller, the main surface of the plate-like body with respect to the tangential direction of the roller Arranging the plate-shaped body so as to be parallel and at a height position capable of contacting the adhesive attached to the roller, and moving the plate-shaped body in a tangential direction of the roller and rotating the roller. a step of Ru depositing the adhesive on the roller to the plate-like body, the b caused by the attachment of the adhesive to the plate-like body
The area where the adhesive has been removed from the outer surface of the roller
Detection to determine whether or not the adhesive has been successfully removed.
Determined that the adhesive was not stripped properly.
Bonding of the plate to the object to be fixed
Step a, plate-like body fixing method which is characterized in that it has the step of securing said plate-like body to the object to be fixed object by an adhesive that has adhered to the plate-like member to prohibit the operation. 2. A device for fixing a plate-like body to an object to be fixed with an adhesive, comprising: a roller; a rotation drive device for rotating the roller; and a recess for containing the adhesive. An adhesive container formed so that a part of the roller protrudes from the concave portion, and a remaining portion of the roller is inserted into the concave portion, and a main surface of the plate-like body is tangential to the roller. A holding device for detachably holding the plate-like body so as to be parallel; and a plate-like body such that a main surface of the plate-like body is at a height position where it can contact an adhesive attached to the roller. Positioning, moving the plate-like body in the tangential direction of the roller so that the adhesive of the roller can be attached to the main surface of the plate-like body; Attached to the body Agent and plate-like body moving device for the plate-like body entailed moved over the object to be fixed object, said caused by the attachment of the adhesive to the plate-like member B
The area where the adhesive has been removed from the outer peripheral surface of the
An optical sensor for determining whether or not the stripping of the adhesive has been successfully performed, and the stripping of the adhesive is preferably performed by the optical sensor.
When it is determined that the fixation has not been performed,
The bonding operation of the plate-like body with respect to
A plate-like body anchoring device characterized in that is. 3. The concave portion is a concave portion having an arc surface having a radius larger than the radius of the roller, and the interval between the roller and the arc surface is gradually narrowed from one end of the arc surface to the other end. The plate according to claim 2, wherein the roller is eccentrically arranged with respect to the arc surface, and a rotation direction of the roller is determined so as to coincide with a direction in which the interval gradually decreases. Body fixing device. 4. The plate according to claim 2, wherein an adhesive adjusting member for removing excess adhesive attached to the roller is disposed at the other end of the arc surface. Body fixing device.