JP3123165B2 - Integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is applied to a transmitting portion of a portable radio telephone or the like, and a conductive heat radiating portion (hereinafter referred to as an external heat radiating plate).
The present invention relates to an integrated circuit device that dissipates heat and grounds.

[0002]

2. Description of the Related Art FIGS. 4A and 4B show the structure of a conventional integrated circuit device. 4A and 4B, reference numeral 1 denotes an integrated circuit unit, and reference numeral 2 denotes a metal radiator plate to which the integrated circuit unit 1 is bonded. Reference numerals 3a, 3b, 3c, and 3d denote wiring pins that are connected to the internal elements of the integrated circuit unit 1 and that supply or output a power supply and various signals.

Next, the function of this configuration will be described.
The integrated circuit unit 1 is grounded through a heat sink 2. In this case, the heat radiating plate 2 is fixed to a metal portion, for example, an external heat radiating plate with screws using the through holes 2a and 2b.

As described above, even in the conventional integrated circuit device, the integrated circuit section 1 is grounded through the heat sink 2.

[0005]

However, in the conventional integrated circuit device, the heat sink 2 is fixed to the external heat sink , and the wiring pins 3a to 3d are wired to the circuit board (printed board). In this case, the conduction path between the grounds is greatly separated, and a potential difference is generated. In addition, the heat radiation plate 2 is externally released.
In order to enhance the heat dissipation effect when fixing to the heat plate , the heat sink 2 and the outside
A compound with low high-frequency conductivity is applied to the joint surface of the heat sink . Therefore, there is a drawback that it is difficult to obtain good high-frequency grounding.

An object of the present invention is to solve such a conventional problem, and an object of the present invention is to provide an excellent integrated circuit device capable of obtaining a good ground at a high frequency.

[0007]

In order to achieve this object, an integrated circuit device according to the present invention is connected to an integrated circuit unit for performing signal processing and an internal element of the integrated circuit unit to supply or output a signal. And a radiating plate that is joined to the integrated circuit portion and has a ground connection portion for projecting in the projecting direction of the wiring pin and grounding.

[0008]

Therefore, according to the integrated circuit device of the present invention,
The ground connection part provided on the heat sink and the wiring pins are connected on the same circuit board. In this case, a short conduction path is provided between the ground parts, and the potential difference becomes extremely low. Can be

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the integrated circuit device according to the present invention will be described below with reference to the drawings.

FIGS. 1A and 1B show the configuration of an embodiment. In FIGS. 1A and 1B, reference numeral 11 denotes an integrated circuit unit used for a high-frequency transmitting unit of a portable radio telephone or the like, and reference numeral 12 denotes a metal radiator plate to which the integrated circuit unit 11 is joined. Reference numerals 13a, 13b, 13c, and 13d denote wiring pins that are connected to the internal elements of the integrated circuit unit 11 and supply or output signals and signals. 14a,
14b, 14c, 14d and 14e are the wiring pins 13a to 1
3d and a ground connection portion that is parallel, protrudes from the heat sink 12, and is grounded. This ground connection part 14a
14e are formed by processing the heat sink 12 or joining other processed members.

Next, the function of this configuration will be described.
The integrated circuit portion 11 is connected to the ground connection portions 14a to 14 of the heat sink 12.
e is grounded. FIG. 2 shows a state where the integrated circuit device having this configuration is mounted on a circuit board (printed board) 15. In FIG. 2, reference numeral 15 denotes a circuit board. When the integrated circuit device shown in FIG. 1 is mounted on the circuit board 15, the ground connection portions 14a to 14e are bent into an L-shaped ground portion (ground pattern) of the circuit board 15 and soldered.

As a result, a short conduction path is established between the ground connection portions 14a to 14e of the heat sink 12 to which the ground portion of the integrated circuit portion 11 is joined and the ground portion of the circuit board 15 to which the wiring pins 13a to 13d are connected. , The potential difference between them becomes extremely low. Further, the ground connection portion 14 is connected to the ground portion of the circuit board 15.
Since a to 14e are directly connected, it is not necessary to apply a conductive compound as described above, good grounding is obtained in high frequency, and operation when performing high-frequency signal processing is stable. I do.

FIG. 3 shows a state in which the ground connection portions 14a to 14e of the circuit board of the integrated circuit device having the structure shown in FIG. . In this example, the same operation and effect as those of the configuration shown in FIG. 2 can be obtained.

[0014]

As is clear from the above description, in the integrated circuit device of the present invention, the ground connection portion provided on the conductive heat radiating portion and the wiring pin are connected on the same circuit board. Since a short conduction path is provided between the grounding portions and the potential difference can be extremely reduced, there is an effect that good grounding in high frequency is obtained.

[Brief description of the drawings]

FIG. 1A is a front view showing a configuration in an embodiment of an integrated circuit device of the present invention. FIG. 1B is a side view showing a configuration in an embodiment of the integrated circuit device of the present invention.

FIG. 2 is a side view showing a state where the configuration of FIG. 1 is mounted on a circuit board;

FIG. 3 is a side view showing another example in which the configuration of FIG. 1 is mounted on a circuit board.

FIG. 4A is a front view showing a configuration of a conventional integrated circuit device. FIG. 4B is a side view showing a configuration of a conventional integrated circuit device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Integrated circuit part 12 Heat sink 13a, 13b, 13c, 13d Wiring pin 14a, 14b, 14c, 14d, 14e Ground connection part 15 Circuit board

Claims (1)

(57) [Claims] An integrated circuit unit for performing signal processing; a wiring pin for supplying a signal grounded to an internal element of the integrated circuit unit; and a conductive heat radiation bonded to one surface of the integrated circuit unit.
Part and the conductive heat radiation part in the direction in which the wiring pins protrude.
A ground connection portion protrudingly provided, wherein the ground connection
The portion is alternately projected and grounded for each of the wiring pins.
Integrated circuit device characterized by the following: