JP3115639B2 - Method of manufacturing ink jet recording head - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a manufacturing method of the ink jet recording f <br/> head. Above all, a piezo-type drop-on-demand type ink jet using piezoelectric elements arranged at high density, or a heating element formed on a silicon wafer, glass, alumina substrate, etc., and heat is applied to the ink by energizing this heating element causing a state change by a process for the fabrication of ink jet recording heads of a so-called thermal method of ejecting a droplet of ink from the ink discharge ports.

[0002]

2. Description of the Related Art The non-impact recording method has recently attracted attention in that noise generation during recording is extremely small to a negligible level. Among them, the so-called ink jet recording method, which can perform high-speed recording and can perform recording on so-called plain paper without requiring a special fixing process, is an extremely powerful recording method. A method has been proposed or has already been commercialized and put to practical use.

In such an ink jet recording method, recording is performed by flying small droplets of a recording liquid called so-called ink and attaching the droplets to a recording medium. The control method for controlling the flight direction of the recording liquid droplet is roughly classified into several types.

[0004] The first method is disclosed, for example, in US Patent No. 3060.
No. 429. this is,
This is called the Teletype method, in which the generation of the recording liquid droplet is performed electrostatically, the electric field of the generated recording liquid droplet is controlled according to the recording signal, and the recording liquid droplet is selectively placed on the recording medium. The recording is performed by attaching the recording medium.

More specifically, an electric field is applied between the nozzle and the accelerating electrode to discharge uniformly charged recording liquid droplets from the nozzles, and the discharged recording liquid droplets can be electrically controlled in accordance with a recording signal. By flying between the xy deflection electrodes configured as described above, recording is performed by selectively adhering a recording liquid droplet onto a recording medium by a change in the intensity of an electric field.

The second method is disclosed in, for example, US Pat.
No. 275, U.S. Pat. No. 3,298,030, and the like. This is called a Sweet method, in which a recording liquid droplet whose charge amount is controlled by a continuous vibration generation method is generated, and a uniform electric field is applied to the recording liquid droplet whose charge amount is controlled. The recording is performed on the recording medium by flying between the deflection electrodes.

More specifically, a charging electrode configured to apply a recording signal before an orifice (ejection port) of a nozzle, which is a part of a recording head provided with a piezoelectric vibrating element, is moved by a predetermined distance. The piezo-vibration element is mechanically vibrated by applying an electric signal of a constant frequency to the piezo-vibration element, and the recording liquid droplet is ejected from the orifice. At this time, a charge is electrostatically induced in the recording liquid droplet discharged by the charging electrode, and the recording liquid droplet is charged with a charge amount according to a recording signal. When the recording liquid droplet whose charge amount is controlled flies between the deflection electrodes to which a constant electric field is uniformly applied, the recording liquid droplet is deflected according to the added charge amount and carries a recording signal. Only the recording liquid adheres to the recording liquid.

A third method is disclosed in, for example, US Pat.
No. 153 specification. this is,
This is a method called the Hertz method, in which an electric field is applied between a nozzle and a ring-shaped charging electrode, and recording is performed by generating and atomizing recording liquid droplets by a continuous vibration generation method. That is, the intensity of the electric field applied between the nozzle and the charging electrode is modulated in accordance with the recording signal to control the atomization state of the recording liquid droplets, and recording is performed with the gradation of the recorded image.

The fourth system is disclosed in, for example, US Pat.
No. 120 is disclosed. this is,
It is called the Stemme system, and has a fundamentally different principle from the first to third systems. That is, each of the first to third methods electrically controls the recording liquid droplet ejected from the nozzle while flying, and selectively receives the recording liquid droplet carrying the recording signal. On the other hand, recording is performed by attaching the recording liquid on a recording medium, whereas in the Stemme method, recording is performed by ejecting a recording liquid droplet from an ejection port in accordance with a recording signal.

That is, in the Stemme system, an electric recording signal is applied to a piezoelectric vibrating element attached to a recording head having a discharge port for discharging a recording liquid droplet, and the electric recording signal is applied to the piezoelectric vibrating element. The recording is performed by causing the recording liquid droplets to be ejected and ejected from the ejection ports in accordance with the mechanical vibration and attached to the recording medium.

Although these four systems have their own characteristics, they also have problems to be solved at the same time.

First, in the first to third systems, the direct energy for generating a recording liquid droplet is electrical energy, and the deflection control of the recording liquid droplet is also electric field control. For this reason, the first method is simple in structure, but requires a high voltage to generate the recording liquid droplets, and it is difficult to form a multi-nozzle recording head, which is not suitable for high-speed recording.

The second method is suitable for high-speed recording because the recording head can be multi-nozzle. However, it is complicated in structure, and the electrical control of the recording liquid droplets is advanced and difficult. Satellite dots are likely to occur on the recording medium.

The third method makes it possible to perform recording with excellent gradation by atomizing recording liquid droplets, but it is difficult to control the atomization state. In addition, there are drawbacks such as fogging of a recorded image and difficulty in using a multi-nozzle recording head, which is not suitable for high-speed recording.

The fourth system has many advantages over the first to third systems. First, the configuration is simple. Further, since recording is performed by discharging the recording liquid droplets from the discharge ports of the nozzles on demand, the recording liquid droplets ejected and flying as in the first to third methods are not required for image recording. It becomes unnecessary to collect the recording liquid droplets.
Further, unlike the first and second methods, there is no need to use a conductive recording liquid, and there is an advantage that the recording liquid has a high degree of freedom in terms of material. However, it is difficult to make the recording head multi-nozzle because there are problems in processing the recording head and it is extremely difficult to reduce the size of the piezoelectric vibrating element having a desired resonance frequency. In addition, since the recording liquid droplets are ejected and fly by the mechanical energy of the mechanical vibration of the piezo-vibration element, it is not suitable for high-speed recording in combination with the difficulty of the multi-nozzle described above.

As described above, the conventional liquid jet recording method has advantages and disadvantages in terms of configuration, high-speed recording, multi-nozzle recording head, generation of satellite dots, fogging of a recorded image, and the like. However, there is a restriction that the method can be applied only to applications in which the advantages are exhibited.

However, such an inconvenience can be almost completely eliminated by employing the ink jet recording system disclosed in Japanese Patent Publication No. 56-9429 proposed by the present applicant. In this method, the ink in the liquid chamber is heated to generate bubbles, thereby increasing the pressure of the ink, and the ink is ejected from a fine capillary nozzle to perform recording. Many inventions have been made using this principle.

[0018]

For example, there is one disclosed in JP-A-56-123869. The present invention provides a heating element as a source of energy for ejecting ink to a substrate obtained by forming ceramics, metal, plastics, and the like, a driving element such as a piezoelectric element, and a photosensitive composition on the substrate. After the object is provided in a layered form by a coating method, a laminating method, or the like, an ink flow channel is formed by a usual photolithographic means. Thereafter, the upper lid is joined to the substrate on which the ink flow channel has been formed to manufacture an ink jet recording head.
However, the present invention merely shows the concept of forming the ink flow channel by photolithography using a photosensitive composition, and specifically how to join the upper lid, or The description of how to form the ink ejection ports is insufficient,
It is difficult to manufacture an actual recording head as it is.

There is also an invention disclosed in Japanese Patent Application Laid-Open No. 57-43876. This invention goes one step further from the invention disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 56-123869.
It mentions that an ink ejection port is formed by cutting a dicing method after joining an upper lid. However, a specific method disclosed as a method of joining the upper lid is a method using an epoxy adhesive, or
This is a method in which the flat plate serving as the upper lid is made of an acrylic resin, an ABS resin, or a thermoplastic resin made of polyethylene, and is directly heat-sealed to the photosensitive resin having the ink flow channel formed therein. There is a problem with the wetting of the photosensitive resin and the epoxy-based adhesive or the wetting of the photosensitive resin with the resin material, and a satisfactory bonding state cannot always be obtained. One of the reasons is that it is difficult to join different materials. On the other hand, there is also a problem that the epoxy adhesive clogs the ink flow channel. Further, in the above-mentioned invention, although there is a description of cutting by a dicing method,
No mention is made of a joined body of the substrate, the photosensitive resin and the upper lid, in other words, a method of cutting the composite material with high accuracy, and cannot be said to be a sufficient invention.

Next, JP-A-57-212067, JP-A-57-212068 and JP-A-57-1
There is an invention disclosed in Japanese Patent No. 12069. In these inventions, when the photosensitive resin composition for forming the ink flow channel is provided on the substrate, the adhesive is interposed between the substrate and the photosensitive resin composition, whereby the photosensitive resin composition is formed. To improve the adhesion between the substrate and the substrate.
Although there is a statement that removal of the adhesive in the ink flow path groove eliminates the problem that the ink flow path groove is blocked by the adhesive, the photosensitive resin composition in which the ink flow path groove is formed Regarding the joining method and the dicing method with the flat plate and the dicing method, there is no progress from the invention disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 57-43876.

Further, there is an invention disclosed in Japanese Patent Application Laid-Open No. 58-220756. In this invention, the residual adhesive strength in a state where the polymerization of the photosensitive resin film formed with the ink flow channel is not sufficiently performed is performed. Although a technique for joining flat plates using the method described above is disclosed, the joining strength is not sufficient.

Japanese Patent Application Laid-Open No. 58-220754 discloses an invention in which a flat plate obtained by laminating a dry film photoresist which is a photosensitive resin is attached to a dry film photoresist which is a photosensitive resin having an ink flow path formed thereon. Is disclosed. For the first time, according to the present invention, instead of joining between different materials such as a photosensitive resin and an epoxy or a photosensitive resin and a resin material as in the related art,
It can be said that the bonding between the photosensitive resins (photoresist) has been performed, and the bonding has been facilitated. However, JP-A-58-220754 also discloses that a dry film photoresist is simply laminated on a flat plate. It is not clear whether the printing will be performed, and it is difficult to actually complete the print head as it is.

On the other hand, instead of laminating the dry film photoresist on the flat plate, there is a method of coating the flat plate with a liquid photoresist.
The sagging in the ink flow path becomes a problem. Japanese Patent Application Laid-open No. Sho 60/1985 relates to dripping of photosensitive resin into the ink flow path.
In Japanese Patent Application Laid-Open No. 190363, the response frequency of the ink jet recording head, the accuracy of the landing point, and the like are controlled even when such dripping occurs by setting the volume of the photosensitive resin of the flat plate to 1/10 or less of the volume of the ink channel. It has no effect on the ejection characteristics of the device. However, dripping into the ink flow path means that the size of the ink ejection port changes, and this may not have much effect on the response frequency and the accuracy of the impact point, but the flying ink mass varies. Is generated. When a flat plate is coated with a liquid photoresist, as shown in FIG. 18, at the edge of the periphery of the flat plate (flat member) 8 or at the edge of the ink inlet 13 formed in the flat member 8. Since the liquid photoresist 19 swells, the thickness of the liquid photoresist 19 cannot be made uniform over the entire plate-shaped member 8, and floating occurs when the liquid photoresist 19 is joined to the photosensitive resin having the ink flow channel formed therein. . In order to eliminate the floating, it is necessary to press the flat plate member 8 with a constant pressure. If the pressing deforms the ink flow path or the ink discharge port, or if the floating remains, the ink leaks. There is a problem that occurs.

As described above, in the ink jet recording head in which the ink flow channel is formed by the photolithography technique in the photosensitive resin provided on the substrate, various improvements have been attempted, but the ink jet recording head is still completed. It's hard to say that technology.

[0025]

According to a first aspect of the present invention, there is provided a method for manufacturing an ink jet recording head, wherein a photosensitive resin layer provided on a first substrate having an energy acting portion is formed by ink lithography using a photolithography technique. And a common liquid chamber region, and an ink inlet was formed on the photosensitive resin layer exposed by peeling off the film from one surface of a dry film type photosensitive resin layer having films adhered to both surfaces. Laminated on the second substrate, the dry film type photosensitive resin layer by applying an external force in the direction of peeling from the second substrate to the dry film type photosensitive resin layer and the other of the laminated film And removing the portion covering the ink inflow port in a state in which the ink inflow port is adhered to the film so that the portion common to the ink inflow port is removed. Forming a hole which communicates the chamber area,
The first substrate and the second substrate are laminated and the photosensitive resin layers are joined together, and after laminating the first substrate and the second substrate, the first substrate and the second substrate are laminated. An ink discharge port was formed at the tip of the ink flow channel by cutting in a direction substantially perpendicular to the ink flow channel.

According to a second aspect of the present invention, there is provided a method for manufacturing an ink jet recording head, comprising: forming an ink flow path groove and a common liquid chamber region on a photosensitive resin layer provided on a first substrate having an energy acting portion by photolithography; To form
The photosensitive resin layer is exposed by peeling off the film from one side of a dry film type photosensitive resin layer having a film attached to both surfaces, and the photosensitive resin layer exposed on the second substrate on which a concave portion in which an ink inlet is communicated is formed. Laminated on the surface on which the concave portion is formed, and applying an external force in a direction of peeling from the second substrate to the dry film type photosensitive resin layer and the other of the laminated films, in the photosensitive resin layer. By removing a portion covering the concave portion in a state of being attached to the film, a hole communicating with the concave portion and the common liquid chamber region is formed, and the first substrate and the second substrate are laminated. After joining the photosensitive resin layers together, and laminating the first substrate and the second substrate, the first substrate and the second substrate are substantially orthogonal to the ink flow channel. Thereby forming an ink discharge port at the tip of the ink flow path groove cut into that orientation.

[0027]

According to the first aspect of the present invention, since the surface of the dry film type photosensitive resin layer laminated on the second substrate has a uniform thickness without any irregularities, the photosensitive resin layer and the first substrate have a uniform thickness. When the first substrate and the second substrate are laminated with the photosensitive resin layer facing each other, the surfaces of these photosensitive resin layers are adhered to each other without gaps. Accordingly, when these photosensitive resin layers are joined to each other, heat need only be applied with little pressure, and the ink flow path grooves and ink ejection ports generated by the pressure applied when the photosensitive resin layers are joined to each other. Deformation is prevented, and the photosensitive resin layers are tightly joined to each other, so that leakage of ink from the joint is prevented.

A dry film type photosensitive resin layer having a film adhered to one side is laminated on the second substrate, and the dry film type photosensitive resin layer and the film are separated from the second substrate in the direction of peeling from the second substrate. By applying an external force, the portion of the dry film type photosensitive resin layer covering the ink inlet is removed in a state of being stuck to the film, and the removed portion communicates the ink inlet with the common liquid chamber area. Hole. Therefore, it is possible to easily form a hole in the dry film type photosensitive resin layer, and further, it is possible to prevent the ink inflow port from being blocked by the dry film type photosensitive resin layer.

According to the second aspect of the present invention, since the surface of the dry film type photosensitive resin layer laminated on the second substrate has a uniform thickness without irregularities, the photosensitive resin layer and the first substrate When the first substrate and the second substrate are laminated with the photosensitive resin layer facing each other, the surfaces of these photosensitive resin layers are adhered to each other without gaps. Accordingly, when these photosensitive resin layers are joined to each other, heat need only be applied with little pressure, and the ink flow path grooves and ink ejection ports generated by the pressure applied when the photosensitive resin layers are joined to each other. Deformation is prevented, and the photosensitive resin layers are tightly joined to each other, so that leakage of ink from the joint is prevented.

By forming the concave portion in the second substrate, when the first substrate and the second substrate are laminated, the volume for storing the ink formed by facing the common liquid chamber region and the concave portion is increased. It becomes larger by the amount of the recess.

A dry film type photosensitive resin layer having a film adhered to one side is laminated on a second substrate, and the dry film type photosensitive resin layer and the film are peeled off from the second substrate. By applying an external force, the portion covering the concave portion of the dry film type photosensitive resin layer is removed in a state of being stuck to the film, and the removed portion has a hole communicating with the concave portion and the common liquid chamber region. Become. Therefore, it is possible to easily form a hole in the dry film type photosensitive resin layer, and further, it is possible to prevent the concave portion from being closed by the dry film type photosensitive resin layer.

[0032]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIGS. First, FIG. 2 to FIG. 9 are schematic views for explaining a procedure for manufacturing the ink jet recording head of this embodiment. In the process shown in FIG. 2, a predetermined number of ink discharge pressure generating elements 2 which are energy acting parts such as heating elements and piezo elements are arranged on a first substrate 1 made of a material such as silicon, glass, ceramics, and the like. In order to impart ink resistance and electrical insulation as required, SiO ₂ , Ta ₂
The thin film layer 3 of O ₅ , glass or the like is covered. A signal input electrode (not shown) is connected to the ink ejection pressure generating element 2.

In the step shown in FIG. 3, the surface of the thin film layer 3 obtained through the step of FIG. 1 is cleaned and dried, and then overlaid on the thin film layer 3 to form a dry film as a photosensitive resin layer. Type photoresist layer 4 (thickness, about 25
μm to 100 μm) to about 80 to 105 ° C., at a rate of 0.5 to 4 f / min, 1 to 3 kg / cm 2
Under the pressure condition of At this time, the photoresist layer 4 is fused to the thin film layer 3. Subsequently, a photomask 5 having a predetermined pattern is overlaid on the photoresist layer 4 and exposure is performed from above the photomask 5. At this time, alignment between the installation position of the ink ejection pressure generating element 2 and the pattern of the photomask 5 is performed by a known method.

FIG. 4 is an explanatory view showing a process in which an unexposed portion of the exposed photoresist layer 4 is dissolved and removed with a developing solution comprising a predetermined organic solvent such as trichloroethane. By this step, only the exposed portion of the photoresist layer 4 remains, and the unexposed portion is dissolved and removed, so that the photoresist layer 4 has the same ink channel groove 6 as that shown in FIGS. A liquid chamber region 7 is formed. Next, in order to improve the ink resistance of the remaining portion of the photoresist layer 4, a thermosetting treatment (for example, 15
Heating is performed at 0 to 250 ° C. for 30 minutes to 6 hours), or ultraviolet irradiation (for example, ultraviolet intensity of 50 to 200 mW / cm 2 or more) is performed to sufficiently advance the heavy curing reaction. In addition, it is also effective to perform both the above-mentioned heat curing treatment and the curing treatment by ultraviolet rays.

In the above description, an example in which the ink flow channel 6 and the common liquid chamber region 7 are formed in the dry film type photoresist layer 4 has been described.
When fabricating a high-density, high-definition ink jet recording head arranged at a density higher than the number of lines / mm, it is desirable to form the ink flow channel by a photolithography technique for a liquid photoresist. When using a liquid photoresist, the coating method is,
Spin coating, roll coating, dip coating, screen spray, printing and the like are used. In addition, the viscosity is 500 to 2000 cp depending on the coating thickness.

FIG. 5 shows a photosensitive resin layer of a dry film type on one surface of a flat plate member 8 which is a second substrate constituting a cover of the ink flow channel 6 and the common liquid chamber region 7. This shows a step of laminating a dry film photoresist layer 9. The flat member 8 is
It is formed of a material that transmits electromagnetic waves (for example, a transparent ultraviolet light material).

FIG. 6 shows a process of laminating the first substrate 1 and the plate-shaped member 8 and joining the opposed photoresist layer 4 and dry film photoresist layer 9 together. In addition, at the time of this joining, the laminated first substrate 1 and the plate-shaped member 8 are placed on a hot plate for 100 to 100 hours.
It is carried out by heating to 120 ° C. and applying a pressure of 0.03 kg / cm ² for 2 seconds. After the bonding is completed, the dry film photoresist layer 9 laminated on the plate member 8 made of a transparent ultraviolet light material is irradiated with ultraviolet light in a non-oxygen atmosphere (for example, an ultraviolet light intensity of 50 to 200 mW / cm ² or more). ) To sufficiently cure the dry film photoresist layer 9. Further, it is also effective to perform a heat curing treatment (for example, at 130 to 250 ° C. for 30 minutes to 6 hours).

FIG. 7 shows the appearance of the ink jet recording head after the step shown in FIG. 6 is completed. The ink flow path 10 is formed by covering the ink flow path groove 6 with a flat plate member 8. The common liquid chamber 11 is formed by covering the common liquid chamber area 7 with the flat member 8.

As described above, after the lamination of the first substrate 1 and the plate-like member 8 and the joining of the photoresist layer 4 and the dry film photoresist layer 9 are completed, FIGS. The cutting is performed along the line aa orthogonal to the ink flow path 10 as described above, and the ink discharge port 12 is formed on the cut surface and at the tip of the ink flow path 10. The reason why such cutting is performed is to optimize the interval between the ink discharge pressure generating element 2 and the ink discharge port 12 in the ink flow path 10, and the region to be cut is appropriately determined.
This cutting is performed by a dicing method generally employed in the semiconductor industry, and the dicing method is performed under the following conditions. As a dicing saw, DAD-2H / 5 (trade name, manufactured by Disco Corporation) was used, and as a blade, NBC-Z600 (trade name, 52 mm ×
(0.27mm thick x 40mm inner diameter) and 30 blades
Rotate at 000 rpm and feed at a speed of 0.5 mm / s, and use pure water filtered through a 0.2 μm filter as cooling water.

FIG. 8 is a sectional view taken along the line bb in FIG. 7. Next, the cut surface along the line aa is polished and smoothed, and the ink formed on the plate member 8 is formed. By attaching an ink supply pipe 14 to the inflow port 13, FIG.
Is completed.

The photosensitive resin that can be used in the present invention is not limited to an ultraviolet-curable resin, but may be any resin that is sensitive to electromagnetic waves such as visible light, x-rays, electron beams, and lasers. It may be.

The dry film photoresist layer that can be used in the present invention is, for example, a permanent photopolymer coating RIST manufactured by DuPont.
ON, Solder mask 730S, 740S, 730
FR, 740FR, SM1, Hitachi Chemical Co., Ltd. Photec SR-1000, SR-2000, SR
-3000, Odile SE- manufactured by Tokyo Ohka Kogyo Co., Ltd.
250, SE-238, SE-225, SP-7
50, SP-740, SP-725, SX-35
0 and SY-325. In addition, examples of the photosensitive resin used in the present invention include many photosensitive resin compositions used in the field of ordinary photolithography. These photosensitive resin compositions include, for example, diazoresin, p-diazoquinone, and further, for example, a photopolymerizable photopolymer using a vinyl monomer and a polymerization initiator, polyvinyl cinnamate, and a sensitizer. Quantitative photopolymer, mixture of orisonaphthoquinodiazide and novolak type phenolic resin, mixture of polyvinyl alcohol and diazo resin, polyether type photopolymer obtained by co-signing 4-glycidylethylene oxide with benzophenone or glycidylchalcone ,
Copolymers of N-dimethylmethacrylamide with, for example, acrylamide benzophenone, unsaturated polyester-based photosensitive resins [eg, APR (manufactured by Asahi Kasei), Tevista (manufactured by Teijin), Sonne (manufactured by Kansai Paint), etc.], unsaturated urethane oligomers Photosensitive resin, photosensitive resin composition obtained by mixing a photopolymerization initiator with a bifunctional acrylic monomer, dichromic acid-based photoresist, non-chromium-based water-soluble photoresist,
Polyvinyl cinnamate-based photoresist, oxidized rubber-azide-based photoresist, and the like can be given.

When the photosensitive resin layer on the first substrate 1 is formed by a liquid photoresist, a solution obtained by dissolving a dry film photoresist used in the present invention in a solvent may be used. Liquid photoresist products include BMRS10 manufactured by Tokyo Ohka Kogyo Co., Ltd.
00 etc. are known.

FIG. 9 is a perspective view showing a flat member 8 used in this embodiment. The flat member 8 is made of Pyrex glass which is one of the transparent ultraviolet light members as described above. Is formed. An ink inlet 13 for attaching the ink supply pipe 14 is formed in the flat member 8.
Are formed by means such as ultrasonic processing or etching.

FIG. 10 shows, as an example of the dry film photoresist layer 9 used in the present invention, Odile SY-325 commercially available from Tokyo Ohka Kogyo Co., Ltd.
It shows a film structure of (trade name). In addition,
In this Audil SY-325, a release film 15 as a film is attached to one surface of the dry film photoresist layer 9, and a protective film 16 as a film is attached to the other surface.

Hereinafter, a method of laminating the dry film photoresist layer 9 on the flat member 8 in this embodiment will be described. First, the release film 15 is peeled off, and the exposed dry film photoresist layer 9 is removed from the flat member 8.
, And laminate. FIG. 11 shows a process of laminating, and FIG. 12 shows a state in which lamination is completed. In this case, a commercially available laminator that performs lamination while applying heat and pressure is used. The conditions for laminating using this laminator are the same as those described with reference to FIG.

On the other hand, when a commercially available laminator is not used, for example, lamination can be performed as follows. First, the flat member 8 is heated to 90 to 110 ° C. by a heating means such as a hot plate. Next, the film 1 cut slightly larger than the flat member 8
A dry film photoresist layer 9 with 5 and 16 is prepared, the release film 15 is peeled off to expose the dry film photoresist layer 9, and the exposed dry film photoresist layer 9 is brought into contact with the heated flat plate member 8. Let it. At this time, there is no need to apply pressure as in the case of using the above-described hot laminator, and the dry film photoresist layer 9 is uniformly attached to the surface of the flat member 8 by the weight and heat of the dry film photoresist layer 9 and laminated.

As described above, after the lamination of the dry film photoresist layer 9 on which the protective film 16 is adhered to the flat member 8 is completed, the process waits until the temperature of the flat member 8 decreases to room temperature. Grasping the portion A shown in FIG. 12, an external force (direction of arrow c) is applied to the two layers of the protective film 16 and the dry film photoresist layer 9 so as to be peeled from the flat plate member 8.

As a result, as shown in FIG. 13, the protective film 16 is peeled off from the dry film photoresist layer 9 and the portion of the dry film photoresist layer 9 corresponding to the area of the ink inlet 13 is protected. Is removed while adhering to the ink inlet 13
Only the dry film photoresist layer 9 laminated in the other area remains in a laminated state. Therefore, the ink inlet 13 is not blocked by the dry film photoresist layer 9, and
The dry film photoresist layer 9 remaining in the laminated state has a uniform thickness with no irregularities on the surface. Then, in this manner, the dry film photoresist layer 9 is formed.
The ink-jet recording head is formed by laminating the plate-like member 8 on which is laminated the first substrate 1 as described in FIG.

Next, a second embodiment of the present invention will be described with reference to FIGS. 1 to 13 are denoted by the same reference numerals, and description thereof will be omitted. First, the ink jet recording head described with reference to FIGS. 1 to 13 is a type of ink jet recording head which uses a relatively small amount of ink (the number of nozzles is 24).
小 256 small array heads).
On the other hand, in an ink jet recording head using a large amount of ink (medium to large array head having more than 256 nozzles), it is necessary to increase the volume of the common liquid chamber 17 in order to supply ink sufficiently. It is. Therefore, in order to increase the volume of the common liquid chamber 17, in the present embodiment, the recessed portion 1 is formed in a region of the flat member 8 which faces the first substrate 1 and includes the ink inlet 13.
When the plate member 8 and the first substrate 1 are laminated, the portion surrounded by the recess 18 and the common liquid chamber region 7 is used as the large common liquid chamber 17.

FIG. 14 is a cross-sectional view showing an ink jet recording head having such a large capacity common liquid chamber 17, and FIG. 15 is a perspective view showing a flat plate member 8 having a concave portion 18. Note that, like the case of the first embodiment, such a concave portion 18 and the ink inlet 13 can be formed by using ultrasonic processing, etching or the like singly or in combination.

Next, FIG. 16 shows that the release film 15 is peeled off from one surface and the protective film 1 is placed on the other surface.
Dry film photoresist layer 9 with 6 attached
Is a state in which after the lamination is completed, the part A is grasped and the protective film 16 and the dry film photoresist layer 9 are peeled off from the flat member 8 with respect to the two layers. An external force (in the direction of arrow c) is applied. Then, as shown in FIG. 17, the protective film 16 is peeled off from the dry film photoresist layer 9, and a portion corresponding to the region of the concave portion 18 in the dry film photoresist layer 9 is removed while adhering to the protective film 16. , Dry film photoresist layer 9 laminated in a region other than recess 18
Only remain laminated. Therefore, the concave portion 18 and the ink inlet 13 are not closed by the dry film photoresist layer 9, and
The dry film photoresist layer 9 remaining in the laminated state has a uniform thickness with no irregularities on the surface. Then, in this manner, the dry film photoresist layer 9 is formed.
By laminating the plate-like member 8 on which is laminated the first substrate 1 as shown in FIG. 14, an ink jet recording head having a large volume common liquid chamber 17 is formed.

Here, FIG. 19 shows a state in which a liquid photoresist 19 is coated on the flat member 8 having the concave portion 18 in place of the dry film photoresist layer 9. Also in this case, similarly to the case described with reference to FIG.
The liquid photoresist 19 swells at the edge of the plate member 8 or the edge of the plate-shaped member 8, and the liquid photoresist 19 and the photoresist layer 4 of the first substrate 1 can be bonded with high accuracy when laminated with the first substrate 1. Absent.

Next, FIGS. 20 and 21 show that when laminating the dry film photoresist layer 9,
It shows an example in which the lamination method used in the present invention is not used. Specifically, with respect to the dry film photoresist layer 9 with the release film 15 and the protective film 16 adhered thereto, the ink inlet 13 is provided at a position corresponding to the ink inlet 13 or the concave portion 18 of the flat member 8. And recess 18
A hollow portion 20 is formed according to the shape of the above, then the release film 15 is peeled off and laminated, and then
In this method, the protective film 16 is peeled off. But,
Such a method has two drawbacks. One is that it is difficult to align the hollow portion 20 with the ink inlet 13 and the concave portion 18 and laminate them.
The other one is that when the hollow portion 20 is formed, the dry film photoresist layer 9 near the hollow portion 20 is deformed, and when the flat member 8 is laminated on the first substrate 8, The point is that the bonding between the photoresist layer 4 of the substrate 1 and the dry film photoresist layer 9 cannot be performed accurately.

However, with respect to such a point, the use of the laminating method of the present invention eliminates the necessity of forming the hollow portion 20 in the dry film photoresist layer 9 in advance, and further reduces the ink inlet 13 and the concave portion 18. The dry film photoresist layer 9 does not remain in the area corresponding to the above and does not block the ink inlet 13 and the concave portion 18 and has a uniform thickness without unevenness on the surface after lamination. Layer 9 is obtained. Therefore, as shown in FIG.
When bonding with the photoresist layer 4 of the first substrate 1 on which is formed, the photoresist layer 4 and the dry film photoresist layer 9 can be formed by applying heat with almost no pressure (0.1 kg / cm ² or less). And the occurrence of deformation and collapse of the ink flow path 10 and the ink discharge port 12 is prevented, and furthermore, the leakage of ink from the joint between the photoresist layer 4 and the dry film photoresist layer 9 is reliably prevented. You.

Next, by forming the photoresist layer 4 using a liquid photoresist, the ink flow path 10 is formed.
In the case of manufacturing a high-definition ink jet recording head having a high density arrangement of 16 lines / mm or more, by laminating the dry film photoresist layer 9 by the method used in the present invention, the manufacturing can be performed extremely advantageously. . This is because, as the number of the ink flow paths 10 increases, the sizes of the ink flow paths 10 and the ink discharge ports 12 decrease, and slight deformation of the ink flow paths 10 and the ink discharge ports 12 significantly reduces the ink discharge performance. While lowering
Dry film photoresist layer 9 according to the method of the present invention.
Is laminated, the dry film photoresist layer 9 has a uniform thickness with no irregularities on the surface, and the photoresist layer 4 and the dry film photoresist layer 9 can be joined with almost no pressure. This is because the flow path 10 and the ink discharge ports 12 hardly deform.

Hereinafter, an example of a method for manufacturing an ink jet recording head when the photoresist layer 4 is formed using a liquid photoresist will be described. Note that the reference numerals used in the description are the same as those used in the description of FIGS. 1 to 17. First, the above-mentioned product name B
MRS1000 liquid photoresist with viscosity of 1
000 cp and spin coating (750r
pm) on the first substrate 1 to form a photoresist layer 4 by coating to a thickness of 20 μm, and ink channel grooves 6 are formed in the photoresist layer 4 at a density of 600 dpi (corresponding to 24 lines / mm). . Pyrex glass is used for the flat plate member 8 and the concave portion 1 as shown in FIG.
8 is formed by etching and the ink inlet 1
3 is formed by ultrasonic processing. The lamination of the dry film photoresist layer 9 on the flat member 8 is performed as follows.
The above-mentioned trade name SY-325 (thickness 25 μm) is
And lamination by the method shown in FIG. Then, the laminate of the first substrate 1 and the plate-like member 8 is heated on a hot plate to 100 to 120 ° C., and is heated to 0.03 kg / cm ^2.
BMRS1000 and S
And Y-325. After the joining, the SY-325 is left in an atmosphere of 150 ° C. for 120 minutes.
Is performed. Further, the ink discharge ports 12 are formed under the same conditions as those of the dicing method described in the first embodiment.

[0058]

According to the first aspect of the present invention, the surface of the dry film type photosensitive resin layer laminated on the second substrate has a uniform thickness without any irregularities. When the first substrate and the second substrate are laminated with the photosensitive resin layer of the first substrate opposed to each other, the surfaces of these photosensitive resin layers can be brought into close contact with each other without forming a gap, and therefore, When these photosensitive resin layers are joined together, it is only necessary to apply heat with little pressure, and the deformation of the ink flow channel and the ink ejection port caused by the pressure applied when the photosensitive resin layers are joined together. Can be prevented.
In addition, since the photosensitive resin layers are closely bonded to each other, it is possible to prevent ink from leaking from the bonded portions. In addition, a dry film type photosensitive resin layer having a film adhered to one side is laminated on the second substrate, and an external force is applied to the dry film type photosensitive resin layer and the film in a direction of peeling from the second substrate. As a result, the portion of the dry film type photosensitive resin layer covering the ink inlet is removed in a state where the ink is attached to the film, and the removed portion is a hole communicating with the ink inlet and the common liquid chamber region. Therefore, it is possible to easily form a hole in the dry film type photosensitive resin layer, and to prevent the ink inflow port from being blocked by the dry film type photosensitive resin layer.

[0059] According to the second aspect of the present invention, since the surface of the photosensitive resin layer of dry film type is laminated on the second substrate is a no uniform thickness unevenness, the photosensitive resin layer and the first When the first substrate and the second substrate are laminated with the photosensitive resin layer of the substrate facing the surface, the surfaces of these photosensitive resin layers can be brought into close contact with each other without forming a gap, and therefore, these When joining the photosensitive resin layers, it is only necessary to apply heat with almost no pressure,
It is possible to prevent deformation of the ink flow channel and the ink discharge port caused by pressurization when the photosensitive resin layers are joined to each other. In addition, since the photosensitive resin layers are closely bonded to each other, it is possible to prevent ink from leaking from the bonded portions. Then, by forming the concave portion in the second substrate, the common liquid chamber region and the concave portion are opposed to each other when the first substrate and the second substrate are stacked. Can be increased by the amount of In addition, a dry film type photosensitive resin layer having a film adhered to one side is laminated on the second substrate, and an external force is applied to the dry film type photosensitive resin layer and the film in a direction of peeling from the second substrate. By doing so, the portion covering the concave portion of the dry film type photosensitive resin layer is removed in a state where it is attached to the film, and the removed portion becomes a hole communicating the concave portion and the common liquid chamber region, It is possible to easily form a hole in the dry film type photosensitive resin layer, and to prevent the concave portion from being closed by the dry film type photosensitive resin layer.

[0060]

[Brief description of the drawings]

FIG. 1 is a vertical sectional side view showing an ink jet recording head according to a first embodiment of the present invention.

FIG. 2 is a front view showing a state where an ink discharge pressure generating element is provided on a first substrate and a thin film layer is covered.

FIG. 3 is a front view showing a state where an ink flow channel and a common liquid chamber region are formed by a photolithography technique.

FIG. 4 is a front view showing a state in which an ink flow channel and a common liquid chamber region are formed by a photolithography technique.

FIG. 5 is a front view showing a state in which a dry film photoresist layer is laminated on a flat member.

FIG. 6 is a front view showing a state where a first substrate and a plate-like member are stacked.

FIG. 7 is a perspective view showing a state where a first substrate and a flat member are stacked.

8 is a sectional view taken along line bb in FIG. 7;

FIG. 9 is a perspective view showing a flat member.

FIG. 10 is a side view showing a film structure of a dry film photoresist layer having films adhered to both sides.

FIG. 11 is a side view showing a state in which a dry film photoresist layer in a state where a protective film is stuck on one side is laminated on a flat member.

FIG. 12 is a side view showing a state where a dry film photoresist layer in a state where a protective film is stuck on one side is laminated on a flat member.

FIG. 13 is a side view showing a state in which lamination of a dry film photoresist layer on a flat member is completed by peeling off a protective film.

FIG. 14 is a longitudinal sectional side view showing an ink jet recording head according to a second embodiment of the present invention.

FIG. 15 is a perspective view showing a flat member having a recess formed therein.

FIG. 16 is a side view showing a state where a dry film photoresist layer in a state where a protective film is stuck on one side is laminated on a plate-like member.

FIG. 17 is a side view showing a state in which lamination of a dry film photoresist layer on a flat member is completed by peeling off a protective film.

FIG. 18 is a side view illustrating the swelling of the liquid photoresist when the liquid photoresist is laminated on the flat member.

FIG. 19 is a side view for explaining the swelling of the liquid photoresist when the liquid photoresist is laminated on the flat member having the concave portion formed thereon.

FIG. 20 is a plan view illustrating a laminating method performed by forming a hollow portion before laminating to a dry film photoresist layer.

FIG. 21 is a plan view illustrating a laminating method performed by forming a hollow portion before laminating to a dry film photoresist layer.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 1st board | substrate 2 Energy acting part 4 Photosensitive resin layer 6 Ink channel groove 7 Common liquid chamber area 8 Second board 9 Dry film type photosensitive resin layer 12 Ink ejection port 13 Ink inlet 15, 16 Film 17 Depression

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) B41J 2/16 B41J 2/05 G03F 7/004 G03F 7/16

Claims (2)

(57) [Claims] 1. A dry film in which an ink flow channel and a common liquid chamber region are formed by a photolithography technique on a photosensitive resin layer provided on a first substrate having an energy acting portion, and films are attached to both surfaces. The photosensitive resin layer exposed by peeling the film from one surface of the photosensitive resin layer of the type is laminated on a second substrate having an ink inlet formed thereon, and the laminated photosensitive resin layer of the dry film type is laminated. Applying an external force in the direction of peeling from the second substrate to the other film and removing the portion covering the ink inflow port in the dry film type photosensitive resin layer in a state where it is attached to the film. By forming a hole that communicates the ink inlet and the common liquid chamber region by doing, laminating the first substrate and the second substrate Both the photosensitive resin layers are joined together, and the first substrate and the second substrate are cut in a direction substantially orthogonal to the ink flow channel after laminating the first substrate and the second substrate. An ink jet recording head manufacturing method, wherein an ink discharge port is formed at a tip of the ink flow channel. 2. A dry film in which an ink flow channel and a common liquid chamber region are formed by a photolithography technique on a photosensitive resin layer provided on a first substrate having an energy acting portion, and films are attached to both surfaces. The photosensitive resin layer, which was exposed by peeling the film from one surface of the photosensitive resin layer of the type, was laminated on the surface of the second substrate in which the concave portion in which the ink inflow port was formed was formed, on the surface where the concave portion was formed. Applying an external force in the direction of peeling from the second substrate to the laminated dry film type photosensitive resin layer and the other film, the portion covering the concave portion in the photosensitive resin layer, A hole communicating with the concave portion and the common liquid chamber region is formed by removing the film while being attached to a film, and the first substrate and the second substrate are stacked. And bonding the photosensitive resin layers to each other, laminating the first substrate and the second substrate, and then cutting the first substrate and the second substrate in a direction substantially orthogonal to the ink flow channel. Forming an ink discharge port at the tip of the ink flow channel groove.