JP3099051B2 - Semiconductor mounting equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC mounting technology and a technology particularly effective when applied to a semiconductor mounting insulating substrate having a plug terminal row. The present invention relates to a technology that is effective when used in a mounted socket mounted type memory module.

[0002]

2. Description of the Related Art In recent years, memory modules in which a plurality of memory ICs are mounted at a high density on an insulating substrate having an array of plug terminals on one side have been developed for small electronic devices such as notebook personal computers. The plug terminal rows in the conventional memory module are formed by applying copper plating to the front and back surfaces of the mounting insulating substrate 10 and etching the plug terminals 11a, 11b having the same shape along one side of the substrate as shown in FIG. ... and 11a ', 11b' ... are formed on the front and back of the board, respectively, and drilled to penetrate the base end of each connector terminal 11 and the board to form a through hole 15,
By applying copper plating from the surface of each plug terminal 11 to the inner surface of the through hole 15, the corresponding plug terminal 11 on the front and back of the substrate is electrically connected.

[0003]

However, it has been clarified by the present inventors that the above-described technology has the following problems. That is, in the conventional socket mounting type memory module, the pitch of the plug terminals provided on the mounting insulating substrate is 2.54 mm or 1.
Since it was standardized at 27 mm, there was a limit on the number of plug terminals that can be provided on a board of a certain size. Also, when trying to secure the required number of plug-in terminals, the external dimensions of the board are limited by the number of plug-in terminals. Further, the conventional memory module has a small outline J-bend (SOJ) package in which the lead terminals of the mounted memory are bent inward, so that the height of the memory when mounted on a substrate is high. Become. Therefore, there is a problem that it is difficult to reduce the size of the memory module.

[0004] An object of the present invention is to provide a module using a substrate having a structure such that twice as many plug terminals can be provided on an insulating substrate having the same size as the conventional one without changing the pitch. Another object of the present invention is to provide a substrate structure that can reduce the size of the insulating substrate by about half when the number of the plug terminals is the same, and a module using the substrate having such a structure. Another object of the present invention is to provide a mounting substrate capable of reducing the height of an IC mounted on an insulating substrate to reduce the size of the module or a module using a substrate having such a structure. Is to do. The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0005]

The outline of a typical invention among the inventions disclosed in the present application is as follows. That is, the plug terminals provided on the front and back of the insulating substrate are formed so as to be separate plug terminals electrically insulated from each other. In addition, a material having a low coefficient of thermal expansion is used as a material of the insulating substrate, and an IC having a TSOP (thin small outline package) structure is mounted.

[0006]

According to the above-mentioned means, it is possible to provide twice as many plug terminals without changing the pitch on an insulating substrate having the same size as the conventional one, or if the number of plug terminals is the same. The size of the insulating substrate can be reduced to about half. In addition, since a material having a low coefficient of thermal expansion is used as a material of the insulating substrate, an IC having a TSOP (thin small outline package) structure in which lead terminals are bent so as to extend outward without reducing solder connection reliability. This allows the IC to be mounted, whereby the height of the IC mounted on the substrate can be reduced, and the size of the module can be reduced.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. 1 to 3 show one embodiment of a memory module to which the present invention is applied. In the memory module of this embodiment, eight memory ICs 20 and one driver IC 30 are mounted on the front surface and the back surface of the insulating substrate 10, respectively. Plug terminals 11a, 11b, 11c ...
Are formed at an equal pitch P, respectively. Plug terminals 11a, 11b, 11c on the front side of insulating substrate 10 ...
And the plug terminals 11a ', 11b', 11c 'on the back side.
Are electrically insulated from each other. In addition, in this embodiment, although not particularly limited, the plug terminals 11a, 11b, 11c... On the front side of the insulating substrate 10 and the plug terminals 11a ′, 11b ′, 11c ′. As shown in FIG. 2, they are formed so that their positions are shifted from each other by a half pitch P / 2.

The insulating substrate 10 has a multilayer structure in which a plurality of (for example, six) insulating substrates each having a wiring pattern formed of a conductive layer formed on the surface thereof are stacked. In this embodiment, a high TG material (glass having a high softening temperature) having a thermal expansion coefficient of about 10 ppm called FR-5 is used as a material of the insulating substrate 10.
Thus, the memory IC 20 having a TSOP (thin small outline package) structure can be mounted. That is, in the case of a substrate made of glass epoxy or the like generally called FR-4, which has been generally used in the past, since the coefficient of thermal expansion is about 16 ppm, the TSOP (solder joint) has a coefficient of thermal expansion of about 5 ppm. Thin small
When a memory IC having an outline / package structure is used, the solder joint may be peeled off due to a thermal cycle or the like.
A memory IC having an SOJ structure of about pm has to be mounted.

However, in the present embodiment, since a high TG material having a thermal expansion coefficient of about 10 ppm is used as a material of the substrate 10, the thermal expansion coefficient of the lead terminal bent so as to spread outward is about 5 ppm. TSOP (Thin Small
A memory IC having an outline package structure can be used. As a result, the height of the IC mounted on the substrate is reduced, and the module can be reduced in size.

Further, in this embodiment, memory ICs 20 whose lead terminals are bent in opposite directions are soldered to predetermined positions of the insulating substrate 10. That is, the memory IC 20 mounted on the front side of the insulating substrate 10 corresponds to FIG.
As shown in FIG. 7, the lead terminal 21 is bent toward the antinode of the IC, and the memory IC 20 ′ mounted on the back side of the insulating substrate 10 has the lead terminal 21 ′ bent toward the back of the IC. ing. As a result, the signal terminals of the front IC and the rear IC come to be at the same position,
The wiring pattern to be formed on the surface of the substrate 10 can be shared, and the shortest distance wiring can be easily formed.
This facilitates the design of the wiring pattern,
The number of intersections between the wirings can be reduced, the wirings are simplified, and the characteristics and quality of the module are improved.

As shown in FIG. 1, the side of the insulating substrate 10 where the plug terminal 11 is formed and two sides orthogonal thereto are provided as shown in FIG.
Notches 12a, 12b and 13a, 13b are formed respectively. Of these, notches 12a and 12b on the side where the plug terminal is formed are notches (recesses) for mechanical key-in for preventing erroneous insertion, and 13a, 1
3b is a notch for retaining. That is, the insulating substrate 10 of this embodiment has a structure suitable for being mounted on the socket 40 as shown in FIG.

Next, an embodiment of the socket 40 will be described. The socket 40 on which the insulating substrate 10 is mounted is connected to the plug terminals 11a, 11b, 11c,.
a, 11b, 11c ... and 11a ', 11b', 11
terminal pins 41a, 41b, 4 corresponding to the number of c '...
1c on the outside and the notches 12a,
Protrusions 42a and 42b engageable with the notches are provided at positions corresponding to 12b.

The terminal pins 41a, 41b, 4
1c, as shown in FIG.
1 are formed integrally with each other, and are formed integrally with each other.
4 are held at a pitch P / 2, which is half the pitch P of the plug terminals. The leads 43 are separated from each other, and the leads 43 alternate between a slightly downward lead as shown by a solid line A and a slightly upward lead as shown by a two-dot chain line B in FIG. , An engagement portion facing each other at a slightly smaller interval than the thickness of the substrate 10 is formed. The insulating substrate 10 is mounted by inserting the plug terminal portion into the engaging portion formed by the lead 43 from the direction of arrow C and rotating it in the direction of arrow D.

As shown in FIG. 4, a pair of holding arms 45a and 45b having projections 47a and 47b at the ends thereof are rotatably mounted on both ends of the socket 40 with pins 46a and 46b as fulcrums. Lead 4 above
After the insulating substrate 10 is mounted on the substrate 3, the holding arms 45a and 45b are rotated inward, and the projections 47a and 47b are engaged with the notches 13a and 13b on the side surfaces of the substrate 10, thereby preventing the substrate from coming off. I can do it.
Further, operating pieces 48a, 48b are formed on the holding arms 45a, 45b inwardly.
a and 46b are pivoted outward with respect to the fulcrum, respectively.
It is configured so that 0 is pushed out to be separated. As a result, the connection between the substrate 10 and the socket 40, which has become difficult to remove due to an increase in terminal density, is performed by the holding arms 45a, 4
By the operation of 5b, the lever can be easily removed by the principle of leverage.

Further, the insulating substrate 10 of this embodiment includes:
PD terminals 17a, 17b, 17c, 17d for board identification
And jumper chip connection terminals 18a, 18b, 18
c, 18d and ground terminal (or Vcc terminal) 1
A wiring pattern 50 for connecting 9a, 19b, 19c, and 19d to the substrate surface and connecting the PD terminals 17a, 17b, 17c, and 17d to jumper chip connection terminals 18a, 18b, 18c, and 18d are shown by broken lines in FIG. As shown, the PD terminal 17 is provided on the internal wiring layer.
Jumper chips 50a, 50c,... having a conductor (0Ω resistance) for short-circuiting between a, 17b, 17c, 17d and ground terminals (or Vcc terminals) 19a, 19b, 19c, 19d are selected. The connection is made. Jumper chip 50
a, 50c... are used to generate codes for identifying modules having different specifications.

That is, as shown in FIG. 6, the PD terminals 17a, 1 to which the jumper chips 50a, 50c are connected.
7c is fixed to the ground potential (or Vcc potential), and the PD terminals 17b, to which no jumper chip is connected,
Since 17d is an NC terminal (NO connection terminal), the microprocessor reads the state of these PD terminals 17a to 17d to determine the specification of the module, that is, the storage capacity and electrical characteristics of the module. For example, it can be known by referring to a table (memory) owned by the user. 1 if there are 4 PD terminals
If there are 6 types and n units, 2 n types of modules can be identified.

FIG. 7 shows an example of a block configuration of the memory module. The module of this embodiment includes 16 dynamic RAMs D0 to D15 (memory IC 20).
And drivers B0 to B26. The drivers B0 to B26 are each formed on a single semiconductor chip by half, formed into an IC, and mounted on the substrate 10 (IC30 in FIG. 1). The above drivers B0 to B2
6 is a signal common to a plurality of dynamic RAMs (OE,
WE, CAS, etc.) to each chip.

As described above, since the driver is provided on the module side, the driver on the CPU side for driving the module becomes unnecessary, and the user does not need to design a driver for each type of module. That is, if there is no driver on the module side, if the module to be used changes, the driving force required to drive the module also changes, so it is necessary to redesign the optimum driver each time. Since it is provided on the module side, a driver on the CPU side is not required.

As described above, in the above embodiment, the plug terminals provided on the front and back of the insulating substrate are formed to be separate plug terminals electrically insulated from each other. Twice the number of plug terminals can be provided on an insulating substrate of the same size without changing the pitch. Alternatively, if the number of plug terminals is the same, the size of the insulating substrate can be reduced to about half. Further, since a material having a low coefficient of thermal expansion is used as a material of the insulating substrate, and the IC is mounted as an IC having a TSOP (thin small outline package) structure, it is mounted on an insulating substrate as compared with an IC having an SOJ structure. There is an effect that the height of the IC in the state is reduced and the module is downsized.

A row of plug terminals on the front side of the insulating substrate;
Since the plug terminal rows on the back side are formed so as to be shifted from each other by a half pitch, there is an effect that a socket having a lead (connector) in contact with each plug terminal row can be easily produced. Further, a notch is provided on the end face of the insulating substrate on the side of the connector terminal row, and a projection which can be engaged with the notch is provided at a corresponding position of the socket, so that the system is inserted into an incorrect substrate (module). Can be prevented from malfunctioning and the IC in the module can be prevented from being damaged. A plurality of board identification terminals (PD terminals) are provided in a part of the connector terminal row of the insulating board, and a connection capable of mounting a jumper chip for selectively short-circuiting between these terminals and the power supply terminal. Since the terminals are provided, it is possible to standardize the substrate for a plurality of types of modules having different specifications, thereby reducing the total cost.

Although the invention made by the inventor has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention. Needless to say. For example, in the above embodiment, a plurality of memory ICs are mounted on the front surface and the back surface of the insulating substrate, respectively, but a plurality of ICs may be mounted on only one of the front surface and the back surface of the insulating substrate. In the above description, the case where the invention made by the inventor is mainly applied to the memory module which is the field of application as the background has been described. However, the present invention is not limited to this case, and a memory card or another insulating sheet may be used. It can be widely used for a semiconductor mounting substrate in which a plurality of ICs are mounted on a substrate.

[0022]

The effects obtained by typical ones of the inventions disclosed in the present application will be briefly described as follows. That is, twice the number of plug terminals can be provided on the insulating substrate on which the IC is mounted without changing the pitch, or if the number of plug terminals is the same, the size of the insulating substrate can be reduced. Can be halved.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of a memory module to which the present invention is applied.

FIG. 2 is an enlarged explanatory view of a plug terminal portion of the memory module of FIG. 1;

FIG. 3 is an enlarged explanatory view showing an IC mounted state of the memory module of FIG. 1;

FIG. 4 is a side view showing one embodiment of a socket in which the memory module of FIG. 1 is mounted.

FIG. 5 is an enlarged sectional view showing the structure of the socket of FIG. 3;

FIG. 6 is an equalization circuit diagram showing a relationship between a PD terminal and a jumper chip.

FIG. 7 is a block diagram illustrating a configuration example of a memory module of FIG. 1;

FIG. 8 is an enlarged explanatory view of a plug terminal portion of a conventional memory module.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Insulating board 11a, 11b, 11c Connection terminal 12a, 12b Notch for mechanical key-in 13a, 13b Notch for retaining 17a-17d PD terminal 20 Memory IC 30 Driver IC 40 Socket 50a, 50c Jumper chip

Continuation of the front page (56) References JP-A-58-142774 (JP, A) JP-A-2-174185 (JP, A) JP-A-6-120399 (JP, A) JP-A-2-45671 (JP) , U) Japanese Utility Model Showa 50-67356 (JP, U) Japanese Utility Model Showa 62-26882 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 1/11 H01L 25/10 H01L 25/18 H05K 13/04

Claims (24)

(57) [Claims] 1. A rectangular insulating substrate, a plurality of plug terminals formed in a state of being electrically insulated from each other along one side of a front surface of the insulating substrate, and a back surface side of the insulating substrate. Along the same side as the side on which the plug terminal on the front side is provided, the plug terminal is formed in a state of being electrically insulated from each other and also electrically insulated from the plug terminal on the front side. A plurality of plug terminals, a plurality of semiconductor devices joined to the front surface of the insulating substrate, and a plurality of semiconductor devices joined to the back surface of the insulating substrate, which are joined to the front surface of the insulating substrate. The corresponding external terminals of the semiconductor device and the semiconductor device joined to the back surface of the insulating substrate are connected via a common wiring pattern formed on the insulating substrate to the plug terminal on the front side or the back side of the insulating substrate. To one of the plug terminals Semiconductor mounting apparatus characterized by comprising connected to. 2. A plurality of plug terminals formed along one side of the front surface of the insulating substrate and a plurality of plug terminals formed along one side of the back surface of the insulating substrate have the same pitch. The plug terminal on the front side and the plug terminal on the back side are disposed so as to be shifted from each other by 1/2 pitch, and the plug terminal on the front side and the plug terminal on the back side overlap each other. The semiconductor mounting device according to claim 1, wherein the semiconductor mounting device is arranged to face each other. 3. The semiconductor mounting device according to claim 1, wherein said semiconductor device is a semiconductor memory. 4. A state in which a plurality of plug terminals are respectively provided on a front side and a back side along one side of a rectangular insulating substrate, and terminals on each surface and terminals on another surface are electrically insulated from each other. In addition, a plurality of semiconductor devices are joined to the front and back surfaces of the insulating substrate, respectively, and a wiring pattern for connecting between external terminals of these semiconductor devices and the plug terminals is Corresponding external terminals of the semiconductor device formed on the front and back surfaces of the insulating substrate or inside the substrate and bonded to the front surface of the insulating substrate and the semiconductor device bonded to the back surface of the insulating substrate are connected to the insulating substrate. Electrically connected to one of the plug terminals on the front side or the back side of the insulating substrate via the formed common wiring pattern, and further connected to the plug terminal of the insulating substrate; Semiconductor mounting apparatus characterized by mechanical key-in notch for preventing erroneous insertion on the end face of the provided the side is formed. 5. The insulating substrate is made of a material having a low coefficient of thermal expansion, and has a T
5. The semiconductor mounting device according to claim 4, wherein the semiconductor devices having an SOP (thin small outline package) structure are respectively soldered. 6. The semiconductor mounting device according to claim 4, wherein a notch for retaining is formed on an end face of a side intersecting with a side provided with the plug terminal on the insulating substrate. 7. A rectangular insulating substrate having first and third sides facing each other, and second and fourth sides facing each other, and a surface of the insulating substrate along the first side. A plurality of plug terminals formed in a state in which they are electrically insulated from each other; a back surface of the insulating substrate along the first side; A plurality of plug terminals formed in a state where the plug terminals are also electrically insulated; a plurality of semiconductor devices provided on the front surface of the insulating substrate; and a plurality of semiconductor devices provided on the back surface of the insulating substrate. And, provided on the insulating substrate, the corresponding external terminals of the semiconductor device joined to the surface of the insulating substrate and the semiconductor device joined to the back surface of the insulating substrate, the front side or the back side of the insulating substrate Electrical connection to any one of the , A mechanical key-in notch provided on the first side for preventing erroneous insertion, and a notch for retaining provided on the second and third sides, respectively. A semiconductor mounting device characterized by the above-mentioned. 8. The semiconductor mounting device according to claim 7, wherein said semiconductor device is a semiconductor memory. 9. The semiconductor mounting apparatus according to claim 7, wherein the plurality of plug terminals provided on the front surface side and the back surface side of the insulating substrate are arranged to face each other. 10. The terminal according to claim 7, wherein the plurality of plug terminals provided on the front side and the back side of the insulating substrate are arranged so as to be shifted from each other by ピ ッ チ pitch. Semiconductor mounting equipment. 11. A rectangular insulating substrate, a plurality of plug terminals formed so as to be electrically insulated from each other along one side of a front surface side of the insulating substrate, and a back surface side of the insulating substrate. Along the same side as the side on which the plug terminal on the front side is provided, the plug terminal is formed in a state of being electrically insulated from each other and also electrically insulated from the plug terminal on the front side. A plurality of plug terminals, a plurality of semiconductor devices joined to the front surface of the insulating substrate, and a plurality of semiconductor devices joined to the back surface of the insulating substrate, joined to the front surface of the insulating substrate The corresponding external terminals of the semiconductor device and the semiconductor device joined to the back surface of the insulating substrate are connected via a common wiring pattern formed on the insulating substrate to the plug terminal on the front side or the back side of the insulating substrate. Electrical connection to any one of the And the front-side plug terminal and the rear-side plug terminal are arranged so as to be shifted from each other by 1/2 pitch, and are brought into contact with the front-surface plug terminal of the insulating substrate. A first terminal group including a plurality of lead terminals; and a second terminal group including a plurality of lead terminals to be brought into contact with the plug terminals on the back side of the insulating substrate. And a socket in which each lead terminal of the second terminal group is electrically separated from each other. 12. The semiconductor mounting device according to claim 11, wherein said semiconductor device is a semiconductor memory. 13. A rectangular insulating substrate and a surface side of the insulating substrate along a long side of the insulating substrate,
A plurality of plug terminals formed in a state in which they are electrically insulated from each other, and the plug terminals on the front surface side, which are electrically insulated from each other, are also electrically connected to the back side of the insulating substrate along the long sides. A plurality of connection terminals formed in a state of being electrically insulated; a plurality of semiconductor devices provided on a surface of the insulating substrate; a plurality of semiconductor devices provided on a back surface of the insulating substrate; And the corresponding external terminals of the semiconductor device joined to the front surface of the insulating substrate and the semiconductor device joined to the back surface of the insulating substrate are connected to one of the plug terminals on the front surface side or the back surface side of the insulating substrate. A wiring electrically connected to one of the plug terminals, a mechanical key-in notch provided on the long side for preventing erroneous insertion, and a stopper provided on each of two short sides of the insulating substrate Notch for A socket having a plurality of pins connected to the plurality of plug terminals, a projection engaged with the notch for mechanical key-in, and a projection respectively engaged with the notch for retaining is provided. Characteristic semiconductor mounting device. 14. The semiconductor mounting apparatus according to claim 13, wherein said plug terminal includes a terminal for board identification. 15. An insulating substrate, a plurality of plug-in terminals formed on a surface side of the insulating substrate along a first side of the insulating substrate and electrically insulated from each other; A plurality of plug terminals formed on the back side of the insulating substrate along the sides of the insulating substrate while being electrically insulated from each other and also electrically insulated from the plug terminals on the front surface side; A plurality of semiconductor devices provided on the surface of the insulating substrate; a plurality of semiconductor devices provided on the back surface of the insulating substrate; and a semiconductor device provided on the insulating substrate and joined to the surface of the insulating substrate. A wiring for electrically connecting corresponding external terminals of the semiconductor device bonded to the back surface to any one of the front-side or back-side plug terminals of the insulating substrate; and Mis-insertion provided on the end face of the provided side Semiconductor mounting device comprising a notch mechanical key-in, an insulating substrate recognition terminal, a jumper chip connection terminal and a ground terminal, further comprising a for prevention. 16. The semiconductor mounting device according to claim 15, wherein said insulating substrate has wiring for connecting said jumper chip connection terminal and said substrate identification terminal, respectively. 17. The apparatus according to claim 15, wherein the jumper chip mounted on the insulating substrate generates a code for identifying modules having different specifications.
Or a semiconductor mounting device according to 16. 18. The semiconductor mounting device according to claim 15, wherein a plurality of said insulating substrate identification terminals are provided. 19. The semiconductor mounting device according to claim 18, wherein said jumper chip connection terminal and said ground terminal are selectively short-circuited. 20. An insulating substrate, a plurality of plug-in terminals formed on a surface side of the insulating substrate along a first side of the insulating substrate and electrically insulated from each other; A plurality of plug terminals formed on the back side of the insulating substrate along the sides of the insulating substrate while being electrically insulated from each other and also electrically insulated from the plug terminals on the front surface side; A plurality of semiconductor devices provided on the surface of the insulating substrate; a plurality of semiconductor devices provided on the back surface of the insulating substrate; and a semiconductor device provided on the insulating substrate and joined to the surface of the insulating substrate. A wiring for electrically connecting corresponding external terminals of the semiconductor device bonded to the back surface to any one of the front-side or back-side plug terminals of the insulating substrate; and Mis-insertion provided on the end face of the provided side A notch for preventing mechanical key-in, a notch for retaining provided on an end face of a side intersecting the side provided with the plug terminal, a terminal for insulating substrate identification, a jumper chip connection terminal and a ground terminal, A semiconductor mounting device comprising: 21. The semiconductor mounting device according to claim 20, wherein the insulating substrate has a wiring for connecting the jumper chip connection terminal and the substrate identification terminal, respectively. 22. The jumper chip mounted on the insulating substrate generates a code for identifying modules having different specifications.
Or the semiconductor mounting device according to 21. 23. The semiconductor mounting device according to claim 20, wherein a plurality of said insulating substrate identification terminals are provided. 24. The semiconductor mounting device according to claim 23, wherein the jumper chip connection terminal and the ground terminal are selectively short-circuited.