JP3081701B2 - Connection structure of electronic parts, mounting plate of electronic parts, circuit board, and assembled finished product using these - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connection structure for electronic parts,
The present invention relates to a mounting plate for an electronic component, a circuit board, and an electronic component or an assembled product using the same, particularly to a connection structure of an electronic component that enables connection of an electronic component without soldering, thereby achieving labor saving and cost reduction, and an electronic component. The present invention relates to a component mounting plate, a circuit board, and an electronic component or an assembled product using the same.

[0002]

2. Description of the Related Art Conventionally, many types of connection structures for electronic parts have been considered and implemented. These methods are broadly classified into a connector contact method based on search and a method mainly based on connection. FIG. 7A shows an example of the former connector contact method.

[0003] As the latter, soldering, welding, wire wrapping, crimping, pressure welding,
A press-fit method is a typical example.

FIG. 7 (2) shows a sectional structural view of the soldering method. FIG. 3C is a sectional view of a welding method used for connecting bare chips.

The wire wrapping method (wire wrap is Gardne
R-Denver Corp. (registered trademark) is a method in which a single wire is wound around a rectangular post and electrically connected (see FIG. 8A), and is used for internal mounting wiring of the device.

In the crimping method, a connector and an electric wire conductor are electrically connected by applying high mechanical pressure (see FIG. 8 (2)).
It is divided into open barrel crimping and closed barrel crimping according to the crimping shape, and is often used as a method for connecting cables. The pressure welding method (see FIG. 9 (1)) has also been developed as a cable connection method.

Further, the press-fit method has been developed as a method of solderless connection between a connector terminal and a printed circuit board, and there are various types as shown in FIG. 9 (2).

Conventionally, assembling of an electronic circuit is performed as shown in FIG.
As shown in (a) and (b), circuit electronic components 111 and 11 are provided on a printed circuit board 103 on which a circuit pattern is formed.
3, the external connection parts 109, etc. are mounted, and these are electrically connected by soldering. Also, a circuit electronic component 111 such as a light emitting diode (LED)
And 113, it is necessary to position the mounting height and the like depending on the application. Therefore, as shown in FIGS. 10 (2)-(a) and (b), they are used by combining mechanical parts such as the spacer 107. Often.

As described above, each of the conventional methods of connecting structures for electronic components has been developed for the purpose of labor saving and cost reduction with respect to the soldering method which is the most basic connection method. It is a thing. However, most of the current circuit components employ the connector contact method for the external connection portion, but no progress has been made in the connection method of electronic components having the largest number of connection points.

[0010]

As described above, in the circuit wiring assembly, after a printed wiring board has been developed in the past, the method of assembling the circuit includes increasing the density of the printed wiring board itself, assembling machines, and peripheral components. However, the method of soldering an electronic component on a printed wiring board has not progressed in recent decades. In other words, the assembled circuit is
There is still a problem that the electronic parts are still attached to the electronic parts by soldering, and they do not function sufficiently for the purpose of labor saving and cost reduction.

The present invention solves the above problems,
Its purpose is to enable connection of electronic components without soldering, to realize a connection structure of electronic components that realizes labor saving and cost reduction, a mounting board for electronic components, a circuit board, and an electronic component or an assembled product using these components. To provide.

[0012]

In order to solve the above-mentioned problems, a first feature of a connection structure for electronic parts according to the present invention is shown in FIG.
As shown in (1) and (2), the thin conductive plate 3 is subjected to at least two cut-and-raising processes 1 or 1 ′ that are line-facing or point-facing from the opposing central portion. The connection conductor is inserted from the cut-and-raised dent side to electrically connect.

A second feature of the electronic component connection structure of the present invention is that, in the electronic component connection structure according to the first aspect, as shown in FIG. That is, the cut-and-raise processing 1 is performed at a predetermined position of the thin conductive plate 3.

The feature of the electronic component mounting plate of the present invention is that, as shown in FIG. 2A, at least two or more line-facing or point-facing cut-and-raise processes 1 are provided at predetermined positions of a circuit pattern. And a connection conductor or a lead of a mounting part is inserted from the concave side of the cut-and-raised portion 1 to be electrically connected.

A first feature of the circuit board of the present invention is that, as shown in FIG. 2 (2), the thin conductive plate 3 or the mounting plate 3 for electronic parts according to claim 1, 2 or 3 is used. That is, they are integrated by insert molding.

A second feature of the circuit board of the present invention is shown in FIG.
As shown in (3), the thin conductive plate 3 or the mounting plate 3 for electronic components according to claim 1, 2 or 3 is insert-molded, and the mounting structure 7 and / or the connection structure 9 for electronic components.
Is added and integrated.

Further, a feature of the electronic component or the completed assembled product of the present invention is that predetermined electronic components 11 and 13 are mounted on the circuit board according to claim 4 or 5 as shown in FIG.

[0018]

According to the electronic component connection structure and the electronic component mounting plate of the first and second features of the present invention, as shown in FIGS. 1 (1) and (2) and FIG. The thin conductive plate 3 or the mounting plate 3 of the electronic component on which the circuit pattern is formed by applying
The cut-and-raised process 1 or 1 ′ is performed from the opposing central portion, and a connection conductor or a lead of a mounting component is inserted vertically from the cut-and-raised dent side of the thin conductive plate 3, for electrical connection.

That is, the connection structure of the electronic component and the mounting plate of the electronic component according to the first and second features are, as major features, a connection conductor or a mounting component to be fitted into the plate surface of the processed thin plate. The insertion direction of the lead is vertical, and the connection conductor or the lead of the mounting part is press-fitted from the concave side of the cut-and-raised part 1 or 1 ', so that it can be easily mounted and connected, and the electronic component As a solder connection method, it is possible to realize a connection structure for an electronic component and a mounting plate for the electronic component, which are simple and have an optimum space structure.

In the circuit board according to the first aspect of the present invention,
As shown in FIG. 2 (2), the connection structure of the electronic component of the first and second features and the mounting plate of the electronic component are integrally formed by insert molding, and in the circuit board of the second feature, As shown in FIG. 2 (3), insert molding is performed, and further, an electronic component mounting structure 7 and / or a connection structure 9 are added to form an integral structure.

Further, in the electronic component or the assembled product according to the present invention, predetermined electronic components 11 and 13 are attached to the circuit boards having the first and second characteristics.

[0022]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 (1) and 1 (2) are structural views of cut and raised portions of a connection structure for an electronic component according to an embodiment of the present invention.

As shown in FIG. 1, the connection structure of the electronic component of the present embodiment has a thin conductive plate 3 having a thickness of 0.1 to 0.4 mm.
At a predetermined position, at least two or more cut-and-raising processes 1 or 1 ′ line-facing (see FIG. 1 (1)) or point-facing (see FIG. 1 (2)) are performed from the opposing central portion,
A connection conductor is inserted from the cut-and-raised dent side of the thin conductive plate 3, held by the spring elastic pressure of the cut-and-raised portion 1 or 1 ′, and electrically connected.

FIG. 2A shows a circuit pattern formed by punching the thin conductive plate 3 to form the above-mentioned connection structure 1 or 1 'at a predetermined position. In addition, FIG.
Is a circuit board formed by solder-free soldering with the thin conductive plate 3 of FIG. Further, FIG. 2 (3) shows a structure in which the spacer 7 for positioning and height of the electronic component to be mounted, the connector 9 and other connection structures are integrated.

FIG. 3A shows how the connector terminals 21 are mounted on the circuit board 23 after the insert molding of another shape.
FIG. 3B shows a state where the single wire 31 and the potential components with leads such as the resistor 35 and the light emitting diode 33 are mounted on the circuit board 37. FIG. 4A is a cross-sectional view in which a connection conductor is inserted into a connection structure 1 cut and raised against a line, and FIG. 4B is a cross-sectional view in which a connection conductor is inserted into a connection structure 1 ′ cut and raised against a point. It is sectional drawing which fitted. In addition, when a mechanical and electrical reliability test was performed on this embodiment, a result equivalent to that of a conventional connection structure by soldering was obtained.

The connection structure of the electronic component according to the present embodiment is as follows.
Since the structure itself is simple, the thin conductive plate 3 for forming a circuit pattern can be formed on a chain by ordinary press working or the like (see FIG. 5A), or assembly processing such as molding can be easily performed by continuous molding. (See FIG. 5 (2)).

FIG. 6 is a view showing the state shown in FIGS. 2 (3) and 5 (2).
FIG. 3 is a cross-sectional view of a case where a light emitting element 11 and a light receiving element 13 are mounted on a circuit board of FIG. As described above, in the electronic component connection structure of the present embodiment, the thin conductive plate is sealed with the plastic resin 5 and insert-molded into a predetermined shape, and the height of the mounted electronic component and the spacer 7 for positioning are set. And a structure integrated with the connector terminal 9 and other connection structures can be easily realized.

[0029]

As described above, according to the electronic component connection structure and the electronic component mounting plate of the present invention, the wire is formed on the thin conductive plate or the electronic component mounting plate on which the circuit pattern is formed by punching. At least two opposing or point-facing cut-and-raising processes are performed from the opposing central part, and the connection conductors or the leads of the mounting parts are vertically inserted from the cut-and-raised dent side of the thin conductive plate and electrically connected. Press-fit connection conductors or mounting component leads from the recessed side of the cut-and-raised part for easy mounting and connection. Simple and small space structure as a solderless connection method for electronic components The most suitable electronic component connection structure and electronic component mounting plate can be provided.

Further, according to the present invention, since the connection structure is simple and has a small space structure, the connection structure of the electronic component and the mounting plate of the electronic component are integrally formed by insert molding, or the insert molding is performed. In addition, it is possible to add an electronic component mounting structure and / or a connection structure to form an integrated structure.

Therefore, according to the present invention, as compared with the conventional circuit wiring assembling work by soldering, reliable connection can be achieved with a very simple structure and a small space structure, and the assembling work by a simple component mounting work. It is possible to provide a connection structure of an electronic component, a mounting plate for an electronic component, a circuit board, and an electronic component or an assembled product using the same, which can realize more labor saving and lower cost. it can.

[Brief description of the drawings]

FIG. 1 is a structural view of a cut and raised portion of a connection structure for an electronic component according to an embodiment of the present invention. FIG. 1 (1) is a connection structure cut and raised against a line, and FIG. 1 (2). Is a connection structure cut and raised against a point.

FIG. 2A is an external view of a thin conductive plate on which a circuit pattern is formed, FIG. 2B is an external view after insert molding,
FIG. 2C is an external view of a structure integrated with a connection structure such as a spacer and a connector terminal.

FIG. 3A is an external view illustrating a state in which a connector terminal is mounted on a circuit board after insert molding, and FIG.
FIG. 4 is an external view illustrating a state in which a single wire and a potential component with a lead are attached to a circuit board.

FIG. 4 (1) is a cross-sectional view in which a connection conductor is fitted into a connection structure cut and raised against a line, and FIG. 4 (2) is a connection conductor fitted into a connection structure cut and raised against a point. FIG.

FIG. 5A shows a thin conductive plate 3 formed on a chain.
FIG. 5 (2) is an external view of a circuit board after continuous molding.

FIG. 6 is a cross-sectional view of the circuit board of FIG. 5 (2).

7A and 7B are explanatory views of a connection structure of a conventional electronic component. FIG. 7A is an external view of a connector contact system, FIG. 7B is a cross-sectional structure diagram of a soldering system, and FIG. It is sectional drawing of a welding system.

FIG. 8 (1) is an external view of a wire wrapping method, FIG. 8 (2) is an external view of a crimping method, and FIG.
(A) is an external view of closed barrel crimping, FIG. 8 (2)-
(B) is an external view of the open barrel crimping, FIG. 8 (2)-
(C) is a cross-sectional view of the open barrel crimping, FIG. 8 (2).
-(D) is a cross-sectional view of the closed barrel crimping.

FIG. 9 (1) is an external view of a press contact type, and FIG. 9 (2) is an external view of a press fit type.

FIG. 10 is an explanatory view of a conventional electronic circuit assembly.
(1)-(a) is an external view, FIGS. 10 (1)-(b) are cross-sectional views, and FIGS. 10 (2)-(a) are external views when mechanical parts such as spacers are combined. 2)-(b) are cross-sectional views thereof.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Connection structure cut and raised against line 1 'Connection structure cut and raised against point 3 Thin conductive plate 5 Plastic resin 7 Spacer (mechanical part) 9 Connector (mechanical part) 11 Light emitting element (electronic part) 13 Light receiving element (electronic component) 21 Connector terminal 23, 37 Circuit board 31 Single wire 33 Light emitting diode 35 Resistance 101 Solder part 103 Printed circuit board 107 Mechanical component (spacer) 109 External connection component (connector) 111, 113 Circuit electronic component

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hiroyuki Kitahara 1-25-3 Minami Kamata, Ota-ku, Tokyo Tokai Tsushin Kogyo Co., Ltd. (56) References Real Opening 2-2859 (JP, U) 53-122661 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 1/18 H01R 4/02 H01R 4/24 H01R 12/32

Claims (9)

(57) [Claims] To 1. A predetermined thickness thin conductive plate having spring elasticity, the cause of at least two or more positions of the cut processing and a line counter or points opposite the pair countercurrent to the cut and raised a predetermined size openings of the center of An electronic component, wherein a connection conductor is vertically fitted to and electrically connected to the thin-plate conductive plate through the opening from the cut-and-raised concave side of the thin-plate conductive plate. Connection structure. 2. The thin conductive plate has a thickness of 0.1 mm to 0.1 mm.
The connection structure for an electronic component according to claim 1, wherein the connection structure is 0.4 mm. Wherein the thin conductive plate can have a circuit pattern subjected to punching, according to claim 2, characterized in that the cut-and-raised into a predetermined position of the thin conductive plate is subjected Connection structure for electronic components. 4. The connection structure for an electronic component according to claim 1, wherein the connection conductor is a part of an electronic component with a lead. 5. A mounting plate for an electronic component formed of a material having spring elasticity, wherein a circuit pattern is formed on the mounting plate, and at least a line facing or a point facing a predetermined position of the circuit pattern. the cut and raised processing two or more places, subjected to have openings of a predetermined size in the center of the cutting and bending countercurrent said pair, from the recess side of the cutting and raising of the thin conductive plate, through the opening, connecting the conductor Alternatively, a mounting plate for an electronic component, wherein a lead of the mounting component is vertically fitted into the mounting plate and electrically connected thereto. 6. The thickness of the mounting plate is 0.1 mm to
The mounting plate for an electronic component according to claim 5, wherein the mounting plate is 0.4 mm. 7. A predetermined circuit pattern and at least two cut-and-raised portions facing a line or a point.
A processing part , provided at the center of the facing cut-and-raised part,
Predetermined size openings for receiving vertical conductors
A thin conductive plate of a spring elastic material of a predetermined thickness comprising
Sealed with plastic resin and integrally formed into a predetermined shape
Circuit board . 8. An electronic component is positioned on the thin conductive plate.
Spacers and connector terminals for
8. The circuit according to claim 7, wherein the circuit is formed integrally.
Board . 9. The circuit board according to claim 8, wherein
The electronic components are mounted at the position determined by the
Make sure that the leads of the mounted electronic components are
Assembled finished product fitted .