JP3066476B2 - Mold for resin-sealing molding of electronic parts and method of cleaning sliding part fitted thereto - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to, for example, ICs, LSs
The present invention relates to a mold for sealing and molding electronic components such as an I, a diode, and a capacitor with a resin, and an improvement in a cleaning method for a fitting sliding portion such as a pot and a plunger in the mold.

[0002]

2. Description of the Related Art Conventionally, an electronic component is resin-molded by a transfer molding method. This method is generally performed by using a resin molding die as shown in FIG. Is performed as follows.

That is, the upper mold 1 and the lower mold 2 are heated to a resin molding temperature in advance by heating means (1a, 2a) such as a heater. Next, the lead frame 3 on which the electronic component 3a is mounted
Is set at a predetermined position of the recess 4 provided on the mold surface of the lower mold 1, and the resin material R is supplied into the pot 5. Next, the lower mold 2 is moved up to clamp the upper and lower molds (1 and 2).
The electronic component 3a and its surrounding lead frame 3 are fitted and set in the upper and lower cavities (1b and 2b) opposed to the upper and lower mold surfaces (see FIG. 1). Next, the resin material R in the pot 5 was pressurized by the plunger 6, and the molten resin material heated and melted by the heating means was provided between the pot 5 and the upper and lower cavities (1b and 2b). The upper and lower cavities are injected and filled through the resin passage 7 (see FIG. 2). Therefore, the electronic component 3a and its surrounding lead frame 3
Is sealed in a resin-sealed molded body 8 formed in correspondence with the shapes of the upper and lower cavities (1b and 2b). 1) and 2), and at substantially the same time as the opening of the upper and lower molds, the resin sealing molded body 8 in the upper and lower cavities (1b and 2b), the lead frame 3 and the resin passage 7 Release the cured resin 9 from the release mechanism (1c ・ 2
It is sufficient to protrude between the upper and lower molds (1 and 2) to release the mold.

[0004]

During the resin sealing molding of the above-mentioned electronic component, one of the molten resin material is applied to a fitting sliding portion such as a gap between the pot 5 and the plunger 6 fitted thereto. In many cases, the resin penetrates and the resin residue adheres to the inner peripheral surface of the pot 5. If the resin scum penetrates and adheres to the fitting sliding portion, a large sliding resistance of the plunger 6 is caused.
As a result, there is a serious adverse effect on the resin molding such that a predetermined resin pressure cannot be obtained due to insufficient pressing force of the resin material R, and thus an appropriate resin sealing molding cannot be performed.
Further, when such a sliding defect occurs in the fitting sliding portion, there is a problem that not only the workability is impaired, but also the durability is significantly reduced.

[0005] Further, when the resin scum that has infiltrated and adhered to the fitting sliding portion is peeled off during the reciprocating sliding of the plunger 6 or the like, it falls, for example, into a plunger fitting hole of a plunger holder provided below. (See plunger holder 60 in FIG. 1) and the like, which hinders the fitting and sliding action between the plunger holder and the plunger fitted thereto, and also adversely affects other driving mechanisms. In addition, there is an adverse effect such that the resin residue peeled and scattered stains and damages the electronic component 3a on the mold surface and the lead frame. And must be reliably removed. However,
The cleaning of the fitting sliding portion has no effect at all by a normal mold surface cleaning means such as running a rotary brush on a mold surface. The fact is that artificial cleaning means such as removal and removal by work is employed, and this is one factor that significantly reduces productivity.

According to the present invention, resin scum that has intruded and adhered to a fitting sliding portion of a mold can be easily and reliably peeled off.
It is an object of the present invention to provide a resin sealing mold for an electronic component capable of efficiently discharging the resin residue to the outside and a method of cleaning a fitting sliding portion thereof.

Further, the present invention provides a resin sealing molding having high quality and high reliability by efficiently and reliably performing a sliding action of a sliding member in a fitting sliding portion of a mold. ,
An object of the present invention is to provide a mold for resin sealing molding of an electronic component capable of improving productivity and improving durability of the mold.

[0008]

According to a first aspect of the present invention, there is provided a resin molding mold for electronic parts according to the present invention, which heats and melts a resin material supplied into a mold pot.
A resin-sealing molding die for an electronic component, wherein the molten resin material is injected into a cavity and the electronic component set in the cavity is resin-sealed and molded. And a sliding member which reciprocally slides by a required reciprocating drive source is closely fitted in the communication hole, and the communication hole is provided substantially at an intermediate portion in the longitudinal direction of the sliding member. A narrow portion forming a required gap between the inner surface of the portion and a required gap of the communication hole portion and a vacuum source side through a vacuum path. Things.

Further, in the mold for resin sealing and molding of an electronic component according to the present invention, the space filled with the molten resin material is a pot for supplying a resin material, and the sliding member is a resin in the pot. It is a plunger for pressurizing a material.

Further, in the resin molding die for electronic parts according to the present invention, the filling space of the molten resin material is a cavity for resin molding, and the sliding member is a resin molding in the cavity. It is an ejector pin for releasing the stop molded product.

Further, in the resin molding die for electronic parts according to the present invention, the space filled with the molten resin material is a resin passage for pressurized transfer of the molten resin material, and the sliding member is formed of the resin material. It is an ejector pin for releasing the cured resin in the resin passage.

Further, in the resin molding die for electronic parts according to the present invention, the filling space of the molten resin material is a cavity for resin molding, and the sliding member is set in the cavity. It is a movable pin for supporting a molded article to be sealed with resin.

Further, the resin sealing mold for an electronic component according to the present invention is characterized in that the movable pin also functions as an ejector pin for releasing the resin molded body in the resin molding cavity. And

According to another aspect of the present invention, there is provided a method of cleaning a fitting and sliding portion in a resin molding mold for an electronic component, wherein a communication hole is formed at a required position in a space filled with a molten resin material. And a sliding member reciprocatingly slid by a required reciprocating drive source is closely fitted in the communication hole, and an inner surface of the communication hole is provided at a substantially intermediate portion in the longitudinal direction of the sliding member. The resin sealing molding metal for an electronic component is formed by forming a thin portion forming a required gap therebetween, and further connecting a required portion of the communication hole portion and a vacuum source side via a vacuum path. A method of cleaning a fitting sliding portion in a mold, comprising: a projecting step of a sliding member tip for projecting a tip of the sliding member toward a space filled with the molten resin material; After the projecting step, the tip of the sliding member is fitted again into the communication hole. And re-fitting step of the sliding member tip,
A sliding step of sliding the leading end of the sliding member refitted into the communicating hole with the inner surface of the communicating hole, and a step of refitting the leading end of the sliding member; And in the sliding step, a resin scrap separating step of stripping resin scraps that have infiltrated and adhered between the communication hole and the sliding member; and And a step of sucking and discharging the resin waste to be sucked and discharged to the outside.

Further, according to the method of cleaning a fitting sliding portion in a resin sealing molding die for an electronic component according to the present invention, the step of removing the resin residue may include the step of removing the resin residue penetrating and adhering to the inner surface of the communication hole. Is forcibly peeled off at a portion below the neck at the tip of the sliding member.

Further, according to the method of cleaning a fitting sliding portion in a resin mold for resin sealing of an electronic component according to the present invention, it is preferable that the step of peeling off the resin scum is performed between the communicating hole and the sliding member. The resin scum that has penetrated and adhered is separated, and the separated resin scum is accommodated in a gap between an inner surface of the communication hole and a thin portion formed substantially at an intermediate portion in a longitudinal direction of the sliding member. It is characterized by the following.

Further, according to the present invention, in the method for cleaning a fitting sliding portion in a resin sealing molding die for an electronic component, the step of sucking and discharging the resin scum may include the steps of: The present invention is characterized in that a resin scum contained in a gap with a thin portion formed at a substantially middle portion in a longitudinal direction is sucked and discharged to the outside through a vacuum path.

According to another aspect of the present invention, there is provided a method of cleaning a fitting and sliding portion in a mold for resin sealing and molding of an electronic component. And a sliding member that reciprocates and slides by a required reciprocating drive source is fitted in the communication hole. A step of retreating the distal end of the sliding member for retreating the distal end of the sliding member into a communication hole opposite to the space filled with the molten resin material; After the retreating step, the distal end of the sliding member that has retreated is advanced again toward the filling space portion of the molten resin material, and the sliding member that slides the distal end of the sliding member against the inner surface of the communication hole. Forward sliding step of the moving member tip and forward sliding of the sliding member tip In the process, in a resin scrap peeling step of peeling the resin residue that has infiltrated and adhered between the communication hole and the sliding member, and in a forward sliding step of the sliding member tip and a resin residue peeling step, Removed resin residue
A step of discharging the resin waste to the outside of the communication hole portion of the resin waste extruded to the mold surface on the side of the filling space portion of the molten resin material, and a process of discharging the resin waste discharged in the step of discharging the resin waste to the outside of the communication hole portion of the mold And performing a resin residue removal step of removing the resin residue to the outside.

[0019]

In the present invention, the leading end of the sliding member is projected toward the space filled with the molten resin material, and then the leading end of the sliding member is fitted into the communicating hole again to form the inner surface of the communicating hole. The resin scum that has intruded and adhered between the communication hole and the sliding member is peeled off, and the resin scum in the separated communication hole is efficiently and reliably sucked and discharged to the outside through a vacuum path. be able to.

Further, in the present invention, the tip of the sliding member is moved backward into the communication hole opposite to the space filled with the molten resin material, and then the tip of the sliding member which has moved backward is moved. Again, the resin resin was slid forward toward the filling space portion side of the molten resin material to peel off the resin scum adhering and adhering between the communication hole portion and the sliding member and discharging the resin scum to the mold surface. The resin residue can be removed to the outside of the mold.

[0021]

1 and 2 schematically show a main part of a mold in a resin sealing and molding apparatus for electronic parts employing a multi-pot plunger type, and FIG.
FIG. 2 shows a state before pressurizing the resin material 30 (resin tablet) at the time of the mold clamping of the lower mold 20 and the lower mold 20, and FIG. Respectively are shown.

A plurality of required pots 40 for supplying the resin material 30 are provided on the lower mold 20 side, and each of the pots 40 has a plunger 50 for pressing the resin material 30.
Are always fitted in the fitted state. In addition, a part actually required for supplying and housing the resin material 30 is an upper end part of the pot 40 and an upper end part of a plunger fitted therein.
51 is an upper space portion composed of the upper space 51 and the upper space 51 (see FIG. 1).

The plunger 50 is mounted on a plunger holder 60 disposed below, and the plunger holder 60 is driven by a fluid pressure such as oil or an appropriate drive mechanism such as an electric motor (not shown). So as to reciprocate up and down. Also, the lower end of each plunger
Numerals 52 are respectively fitted to and supported by the plunger holder 60, and they are fitted so that they can be freely slid in the thrust direction (vertical axis direction). Due to the elasticity of the compression spring 61, elastic pressing forces are applied to the outside, that is, in the direction of being pressed into the upper pot 40, respectively.

In addition, a sliding portion 53 is provided at an intermediate portion of the plunger 50 so that the plunger 50 is always closely fitted to a lower portion of the pot 40.
Further, a small-diameter portion (thin portion) is provided between the sliding portion 53 and the upper end portion 51 of the plunger. Accordingly, a required space 70 (a required gap) is formed between the inner peripheral surface of the pot 40 and the outer peripheral surface of the small diameter portion 54.

The inside of the pot 40 (that is, the space 70) and the side of a vacuum source (not shown) such as a vacuum pump within a range in which the small diameter portion 54 of the plunger reciprocates up and down are connected to an intake hole or the like. They are connected to each other via an appropriate vacuum path 71 such as an intake pipe. Therefore, when the vacuum source is operated, the air in the pot 40 (the space 70) within the range in which the small diameter portion 54 of the plunger reciprocates up and down moves through the vacuum path.
It is provided so as to be forcibly sucked and discharged to the outside of the mold through 71.

Further, a cull portion 80 for distributing molten resin is provided on the mold surface of the upper mold 10 corresponding to the position of each pot 40, and resin molds for resin molding are provided on both upper and lower mold surfaces. Cavities 90 are provided opposite to each other, and the cavities 90 and the cull portion 80 are communicated via a short resin passage 100. Therefore, heating means 110 such as a heater is provided in each pot 40 part.
When the resin material 30 to be heated by the pressure is pressed by the plunger 50, the heat-melted resin material is
In addition, the pressure is transferred through the resin passage 100, and the upper and lower cavities 90 are respectively injected and filled.

Reference numeral 11 in the drawing denotes an air vent for communicating the upper mold cavity formed on the mold surface of the upper mold 10 with the outside of the mold. The same reference numeral 21 denotes the lower mold 20.
3 shows a fitting set recess of the lead frame 120 provided on the mold surface. The same reference numeral 121 indicates the lead frame 12.
The electronic component mounted at 0 is shown.

The same reference numeral 130 denotes the upper and lower types (10 · 2
0) shows an ejector pin for releasing a resin-encapsulated molded body, which is provided in a cavity 90 part of FIG. In addition, the same reference numeral 131 is
The tip of the ejector pin 130 is shown. The same reference numeral 132 indicates the base end of the ejector pin 130. The same reference numeral 133 indicates a sliding portion of the ejector pin 130, and the sliding portion is tightly fitted to a fitting hole portion (12, 22) of the ejector pin formed in the upper and lower molds (10, 20). Is always fitted. The same reference numeral 134 denotes a small-diameter portion provided between the sliding portion 133 and the ejector pin tip 131, the inner peripheral surface of the fitting hole (12, 22) and the outer peripheral surface of the small-diameter portion 134. A required space 70 is formed between the plane and the surface. Reference numeral 135 denotes an ejector plate for supporting the ejector pin base end 132. The ejector plate is provided so as to be vertically reciprocated by an appropriate driving mechanism (not shown). I have.

Further, reference numeral 140 denotes an ejector pin for releasing the cured resin, which is provided in the cull portion 80 (and / or the resin passage 100). The same reference numeral 141 is
The tip of the ejector pin 140 is shown. The same reference numeral 142 indicates the base end of the ejector pin 140. The same reference numeral 143 indicates a sliding portion of the ejector pin 140, and the sliding portion is always tightly fitted in the fitting hole 12 of the ejector pin formed in the upper die 10. The same reference numeral 144 denotes a small-diameter portion provided between the sliding portion 143 and the ejector pin tip portion 141,
Required space between the inner peripheral surface of the
70 are configured. Reference numeral 145 denotes an ejector plate for supporting the ejector pin base end portion 142. The ejector plate is provided so as to be vertically reciprocated by an appropriate driving mechanism (not shown). I have.

Hereinafter, a case in which the electronic component 121 (resin-sealed molded body) mounted on the lead frame 120 is molded by resin sealing using the above-described resin sealing molding apparatus will be described.

First, open the upper and lower molds (10 and 20) (Fig.
14), the lead frame 120 is fitted into the recess 21 provided on the mold surface of the lower mold 20, and the electronic component 121 is placed in the upper and lower cavities.
At the same time, the resin material 30 is supplied into the lower mold pot 40 and the upper and lower molds (10, 20) are clamped (see FIG. 1).

Next, when the resin material 30 in the pot 40 is pressurized by the plunger 50, the resin material 30 in the pot 40 is heated and melted by the heating means 110, and the molten resin material is melted by the plunger 50. Pressurized and transferred through the cull portion 80 and the short resin passage 100 by the pressing force, and injected and filled into the upper and lower cavities 90. Accordingly, the electronic component 121 on the lead frame fitted and set in the upper and lower cavities 90 is sealed and molded by the injected and filled resin material.

Next, after the required curing time, the upper and lower molds (10 and 20) are opened again, and at substantially the same time as the opening of the molds, the resin-sealed moldings in the upper and lower cavities 90 are removed. The upper and lower ejector pins 130 also
In addition, the cured resin in the resin passage 100 may be simultaneously ejected by the ejector pins 140 and released from the upper and lower molds.

Hereinafter, a method of cleaning the fitting sliding portion between the pot 40 and the plunger 50 will be described.

First, after the above-described resin sealing molding step of the electronic component is completed, the upper and lower dies (10, 20) are opened, and as shown in FIG.
A projecting process of the plunger upper end portion 51 for projecting the upper end (that is, the tip portion) upward (ie, toward the cull portion 80 serving as the filling space portion of the molten resin material) is performed, and then, as shown in FIG. A re-fitting step of the plunger upper end 51 for re-fitting the plunger upper end 51 into the pot 40 is performed, and then the plunger upper end 51 is slid on the inner surface of the pot 40 as shown in FIG. A sliding process of the plunger upper end 51 to be performed is performed, and in the re-fitting process and the sliding process of the plunger upper end 51, the resin residue that has penetrated and adhered to the inner surface of the pot 40 is formed.
31 (resin burr) is forcibly peeled off by the upper end portion 51 of the plunger, and is housed in the space 70 (required gap) between the inner peripheral surface of the pot 40 and the outer peripheral surface of the small diameter portion 54. A resin residue is removed, and the air in the pot 40 (that is, the space 70) within the range in which the plunger small diameter portion 54 reciprocates up and down by operating the vacuum source is moved to the vacuum path 71.
The resin waste 31 in the pot 40 (space 70) peeled in the resin waste peeling process is forcibly sucked and discharged to the outside of the mold through the vacuum path 71. A suction and discharge process of the resin residue 31 to be performed may be performed. It should be noted that at least each of the above-described step of projecting the plunger upper end portion 51, the step of re-fitting, and other steps may be performed once, but may be performed a plurality of times as necessary.

FIGS. 3 to 5 illustrate a method of cleaning a sliding portion for fitting a resin material supply pot 40 and a plunger 50 for pressing the resin material 30 in the pot 40. FIG. I have. That is, a communication hole (that is, the pot 40) is provided in the space filled with the molten resin material, and the communication hole is provided.
A sliding member (i.e., plunger 50) that reciprocates and slides by a required reciprocating drive source is closely fitted in (40), and the sliding member (50) has the above-mentioned sliding member (50) substantially at an intermediate portion in the longitudinal direction. The required gap between the inner surface of the communication hole (40) (ie, the space 70)
Forming a thin portion (ie, a small diameter portion 54) for constituting
Further, a case is described in which the required gap (70) of the communication hole (40) and the vacuum source side are communicated via a vacuum path (71). The composition of the cavity
Ejector pin 130 for both upper and lower mold release and its fitting hole
(12 ・ 22), or between the ejector pin 140 for releasing the pressurized resin passage (the cull portion 80 and / or the resin passage 100) of the molten resin material and the fitting hole portion 12 thereof. A fitting configuration, or a fitting configuration of a movable pin (130a) for supporting a resin-encapsulated molded body to be described later provided in the resin molding cavity 90 and its fitting hole (12a / 22a). Are substantially the same as in the case of (1) and (2), and therefore can be similarly implemented in these fitting sliding portions.

FIGS. 6 and 7 show the resin molding cavity 90.
The method for cleaning the sliding portion fitted with the release ejector pin 130 is described. In this case, similarly, first, FIG.
As shown in the figure, the tip 1 of the release ejector pin 130
A projecting process of the ejector pin tip 131 for projecting the mold ejector 31 toward the cavity 90 serving as a filling space portion of the molten resin material is performed. Next, as shown in FIG. A re-fitting process of the ejector pin tip 131 for re-fitting into the fitting hole portion 22 (12) is performed, and then the releasing ejector pin tip 131 is fitted to the fitting hole portion. A sliding step of the ejector pin tip 131 that slides on the inner surface of the mold 22 (12) is performed, and a re-fitting step of the ejector pin tip 131 and the release ejector pin tip 131 are performed. In the sliding step, the fitting hole 22 (1
The resin residue 31 that has infiltrated and adhered to the inner surface of (2) is forcibly peeled off by the release ejector pin tip 131, and the inner peripheral surface of the fitting hole 22 (12) and the outer peripheral surface of the small diameter portion 134 are removed. Perform a process of peeling the resin residue housed in the configuration space 70 between,
The fitting hole 22 (12) within a range where the vacuum ejector pin small-diameter portion 134 reciprocates up and down by operating the vacuum source.
The resin gas 31 in the fitting hole 22 (12) peeled in the resin gas peeling step is discharged through the vacuum channel 71 by forcibly sucking and discharging the air inside the device through the vacuum channel 71 to the outside. What is necessary is just to perform the suction / discharge step of the resin residue 31 that is forcibly discharged and discharged to the outside of the mold. (Note that the resin passage for pressurized transfer of the molten resin material, that is, the fitting structure in which the fitting hole portion 12 provided in the cull portion 80 and / or the resin passage 100 and the ejector pin 140 for release are also used. Since they are understood in exactly the same way, their illustration is omitted.)

FIGS. 8 to 10 show the resin molding cavity 90.
The upper and lower movable pins 130a and the fitting holes (12a
-Describes how to clean the sliding part fitted with 22a).
By the way, when the resin-sealed molded body 120a set in the cavity 90a is a relatively heavy material such as a heat sink in a lead frame, the molded body 120a is supported horizontally in the cavity 90a. Therefore, as shown in FIG. 8, the upper and lower surfaces of the resin-sealed molded body 120a are supported by the movable pins 130a, respectively, so that the proper set state in the cavity 90a is maintained. However, in this case, the movable pin 130a
The cleaning of the sliding portion fitted to the fitting holes (12a and 22a) may be performed in the same manner as described above. That is, first, as shown in FIG. 9, a step of projecting the movable pin 130a to project the tip portion 131a of the movable pin 130a toward the cavity 90a serving as a space for filling the molten resin material is performed. As shown, a re-fitting step of the movable pin tip 131a for re-fitting the movable pin tip 131a into the fitting hole 22a (12a) is performed.
Next, a sliding step of the movable pin tip 131a for sliding the movable pin tip 131a on the inner surface of the fitting hole 22a (12a) is performed,
Further, in the re-fitting step of the movable pin tip 131a and the sliding step of the movable pin tip 131a, the fitting holes 22a (12
The resin residue 31 that has infiltrated and adhered to the inner surface of
Performing a peeling process of the resin residue housed in the configuration space portion 70 between the inner peripheral surface of the fitting hole portion 22a (12a) and the outer peripheral surface of the small diameter portion 134a by forcibly peeling off by 131a, By operating the vacuum source, the air in the fitting hole portion 22a (12a) within the range in which the release ejector pin small diameter portion 134a reciprocates up and down is forcibly sucked and discharged to the outside through the vacuum path 71. Thus, the suction and discharge process of the resin waste 31 for forcibly suctioning and discharging the resin waste 31 in the fitting hole portion 22a (12a) separated in the resin waste separation process to the outside of the mold through the vacuum path 71 is performed. Just do it. It should be noted that reference numeral 133a in each drawing
Indicates a sliding portion of the movable pin, and the sliding portion is always tightly fitted in the fitting hole portion 22a (12a).

The above-mentioned upper and lower movable pins 130a are used to form the resin-sealed molding 12
The two sides of the cavity 90a are supported horizontally by locking them.The molten resin material injected and filled in the cavity 90a is provided so as to retreat to the bottom surface position of the cavity 90a before being hardened. Have been. Therefore, both surfaces of the resin-sealed molded body 120a are sealed by a resin-sealed molded body formed corresponding to the shape of the upper and lower cavities 90a, and the upper and lower surfaces of the resin-sealed molded body are sealed on both surfaces. Movable pin 13
It is considered that a hole corresponding to the shape of 0a is not formed. Therefore, if the upper and lower movable pins 130a are advanced again after the resin encapsulation molding, the resin encapsulant will protrude from the upper and lower cavities 90a, respectively. If this is the case, the upper and lower movable pins 130a can be used as ejector pins for releasing the resin-sealed molded product.

According to the above-described cleaning method for each fitting sliding portion, the sliding member is protruded from the communication hole provided in the space filled with the molten resin material, and then the sliding member is fitted again into the communication hole. A description has been given of the case where the resin scum adhered by sliding the inner surface of the communication hole portion is forcibly peeled off, but in short, by sliding the sliding member into the communication hole portion, What is necessary is just to remove the resin residue attached to the inner surface.

Accordingly, even if the following cleaning method is adopted, substantially the same operation and effect can be obtained. First, after the resin sealing molding step of the electronic component is completed, with the upper and lower molds (10, 20) opened, as shown in FIG. 11, the upper end portion 51 of the plunger is moved to a lower position.
That is, the plunger upper end portion 51 is moved down to a position below the surface where the resin residue 31 that has entered and adhered to the inner surface of the pot 40 is retracted. Next, as shown in FIG. The plunger upper end 51 is moved upward again to slide on the inner surface of the pot 40.
Of the plunger upper end 51
In the forward sliding step, the pot is peeled in the resin scrap peeling step of peeling the resin residue that has infiltrated and adhered to the inner surface of the pot 40, and in the forward sliding step of the plunger upper end 51 and the resin scrap peeling step. The resin waste in 40 is pushed out to the mold surface.
Next, the resin residue discharged in the step of discharging the resin residue outside the pot, for example, using a mold cleaning device or the like equipped with a normal rotating brush and vacuum mechanism,
A resin residue removal step of forcibly removing the resin outside the mold may be performed. In the resin residue removal step, the resin residue discharged in the resin residue discharge step is pushed out to the mold surface, so that the normal mold surface cleaning means as described above can be effectively used.

FIG. 13 shows a method of cleaning the pot portion using another plunger in which a groove ring is formed at the tip of the plunger. That is, the plunger 51 shown in FIG.
This is a so-called plunger with a groove ring, and a groove ring 51a having a required depth is formed on the peripheral surface of the plunger tip. Therefore, when such a plunger 51 is used, the resin scum 31 that has been exfoliated by sliding the tip of the plunger into the pot 50 can be accommodated in the groove ring 51a. There are advantages that the waste 31 can be efficiently prevented from re-adhering to the inner surface of the pot 50 and the like, and the stored resin waste 31 can be reliably pushed out to the mold surface.

The cleaning of the inside of the groove ring in the plunger with the groove ring is performed by, for example, as shown in FIG. 13, with the groove ring 51a protruding from the mold surface as described above. The cleaning can be performed easily and reliably. Other steps using the plunger with the groove ring are substantially the same as those in the above-described embodiments, so that the illustration thereof is omitted.

Further, in the method of cleaning the pot portion using the plunger with a groove ring described above, the ejector pin for releasing is performed by using an ejector pin with a groove ring having a similar groove ring formed at the tip. Although the present invention can be applied as a cleaning method for the sliding portion, it is also substantially the same as the above-described cleaning method, and therefore, the description thereof is omitted.

The method of cleaning the communication hole of the pot 50 and the like described with reference to FIGS. 11 to 13 is based on the fitting structure of the fitting holes 12 and 22 and the ejector pins 130 and 140 for releasing. And the case of the fitting configuration of the movable pin 130a and the fitting holes 12a and 22a can be understood in the same manner.
The illustration is omitted.

In each of the above-described embodiments, a method of mainly removing and removing the resin burr 31 adhered to the inner peripheral surface of the communication hole of the pot 50 or the like by the sliding member such as the plunger 50 will be described. However, resin burrs adhering to the outer peripheral surface of the sliding member such as the plunger tip 51 fitted into the pot 50 are similarly peeled and removed based on the relative sliding action between the two. It is apparent that the resin burr that has entered the gap between the communication hole and the sliding member can be easily and reliably removed and removed.

The present invention is not limited to the above embodiments, but may be made within the scope of the present invention.
It can be arbitrarily and appropriately changed / selected and adopted as needed.

[0048]

According to the present invention, an electronic component capable of easily and surely peeling off a resin residue that has intruded and adhered to a fitting sliding portion of a mold and efficiently discharging the resin residue to the outside. The present invention provides an excellent practical effect of being able to provide a method for cleaning a resin sealing molding die and a fitting sliding portion thereof.

Further, according to the present invention, since the sliding action of the sliding member can be obtained efficiently and reliably, it is possible to perform resin sealing molding of an electronic component having high quality and high reliability. And an excellent practical effect that the productivity and the durability of the mold can be improved.

[Brief description of the drawings]

FIG. 1 is a partially cutaway vertical cross-sectional view showing a main part of a resin sealing mold for an electronic component, showing a clamped state of both upper and lower dies.

FIG. 2 is a partially cutaway vertical sectional view of a main part of a mold corresponding to FIG. 1, and is an explanatory view of a resin sealing molding operation of an electronic component.

FIG. 3 is a partially cutaway longitudinal sectional view of a main part of a mold corresponding to FIG. 1, and is an explanatory view of a step of projecting a tip end of a sliding member in a method of cleaning a pot portion.

FIG. 4 is a partially cutaway longitudinal sectional view of a main part of the mold corresponding to FIG. 1 and is an explanatory view of a step of refitting a tip end portion of a sliding member in a method of cleaning a pot portion.

FIG. 5 is a partially cutaway longitudinal sectional view of a main part of the mold corresponding to FIG. 1, and illustrates a sliding step of a leading end of a sliding member, a resin scrap removing step, and a suction / discharge step in a method of cleaning a pot part. FIG.

FIG. 6 is a partially cutaway longitudinal sectional view of a main part of the mold corresponding to FIG. 1 and is an explanatory view of a step of projecting a tip end portion of a sliding member in a method of cleaning an ejector pin portion.

FIG. 7 is a partially cutaway longitudinal sectional view of a main part of the mold corresponding to FIG. 1, showing a refitting step and a sliding step of a leading end of a sliding member in a method of cleaning an ejector pin part, and a step of removing resin residue. FIG. 4 is an explanatory view of a suction and discharge step.

FIG. 8 is a partially cutaway vertical cross-sectional view showing a main part of another resin-sealing molding die, showing a state in which both upper and lower dies are clamped.

9 is a partially cutaway longitudinal sectional view of a main part of the mold corresponding to FIG. 8, and is an explanatory view of a step of projecting a tip end portion of a sliding member in a method of cleaning a movable pin portion.

FIG. 10 is a partially cutaway longitudinal sectional view of a main part of the mold corresponding to FIG. 8, showing a step of refitting and sliding a tip of a sliding member in a method of cleaning a movable pin part, and a step of peeling a resin residue. FIG. 4 is an explanatory view of a suction and discharge step.

11 is a partially cutaway longitudinal sectional view of a main part of the mold corresponding to FIG. 1 and is an explanatory view of a step of retreating a tip end of a sliding member in another cleaning method of the pot portion.

12 is a partially cutaway longitudinal sectional view of a main part of the mold corresponding to FIG. 11, and illustrates a forward sliding step of a leading end portion of a sliding member, a resin scrap removing step and a discharging step in another cleaning method of a pot portion. And FIG.

13 is a partially cutaway longitudinal sectional view of a main part of the mold corresponding to FIG. 12, and forward sliding of the leading end of the sliding member in the pot cleaning method using the leading end of the sliding member having another shape. Process and
It is explanatory drawing of the peeling process of resin scum, the discharge process, and the removal process.

FIG. 14 is a partially cutaway vertical cross-sectional view of a main part of a conventional resin sealing molding die, showing the upper and lower molds in an open state.

[Explanation of symbols]

 10 Upper mold 11 Air vent 12 Fitting hole 12a Fitting hole 20 Lower mold 21 Set recess 22 Fitting hole 22a Fitting hole 30 Resin material 31 Resin residue 40 Pot 50 Plunger 51 Upper end 51a Groove ring 52 Lower end part 53 Sliding part 54 Small diameter part 60 Plunger holder 61 Spring 70 Space part 71 Vacuum path 80 Cull part 90 Cavity 90a Cavity 100 Resin passage 110 Heating means 120 Lead frame 120a Resin-sealed molded body 121 Electronic component 130 Ejector pin 130a Movable pin 131 Tip 131a Tip 132 Base end 133 Sliding part 134 Small diameter part 134a Small diameter part 140 Ejector pin 141 Tip 142 Base end 143 Sliding part 144 Small diameter part 145 Ejector plate

Claims (11)

(57) [Claims] 1. A resin for an electronic component, which heats and melts a resin material supplied into a mold pot, injects the molten resin material into a cavity, and resin-molds an electronic component set in the cavity. A sealing molding die, wherein a communication hole is provided at a required position in the space filled with the molten resin material, and a sliding member which reciprocates and slides by a required reciprocating drive source is closely fitted in the communication hole. And a thin portion forming a required gap between the sliding member and an inner surface of the communication hole is formed at a substantially intermediate portion in the longitudinal direction of the sliding member, and further, a required gap of the communication hole is formed. And a vacuum source side connected to the vacuum source via a vacuum path. 2. The method according to claim 1, wherein the space filled with the molten resin material is a pot for supplying the resin material, and the sliding member is a plunger for pressing the resin material in the pot. Mold for resin sealing molding of electronic parts. 3. The method according to claim 1, wherein the space filled with the molten resin material is a cavity for resin molding, and the sliding member is an ejector pin in the cavity for releasing the molded resin body. 2. The mold for resin sealing molding of the electronic component according to 1. 4. The method according to claim 1, wherein the filling space of the molten resin material is a resin passage for pressurizing and transferring the molten resin material, and the sliding member is an ejector pin for releasing the cured resin in the resin passage. The mold for resin-sealing molding of an electronic component according to claim 1. 5. The method according to claim 1, wherein the space filled with the molten resin material is a cavity for resin molding, and the sliding member is a movable pin for supporting the resin-sealed molded body set in the cavity. A mold for resin sealing molding of an electronic component according to claim 1. 6. The mold for resin sealing molding of an electronic component according to claim 5, wherein the movable pin also functions as an ejector pin for releasing the resin molding in the resin molding cavity. . 7. A communication hole is provided at a required position in a space filled with a molten resin material, and a sliding member reciprocatingly slid by a required reciprocating drive source is closely fitted in the communication hole, and A thin portion that forms a required gap between the sliding member and the inner surface of the communication hole is formed at a substantially middle portion in the longitudinal direction, and a required portion of the communication hole and the vacuum source side are further formed. A method for cleaning a fitting sliding portion in a resin-sealing molding die for an electronic component configured to communicate with each other via a vacuum path, wherein a tip portion of the sliding member faces a filling space portion of the molten resin material. A step of projecting the distal end of the sliding member, and a step of refitting the distal end of the sliding member after the step of projecting the distal end of the sliding member, so that the distal end of the sliding member is refitted into the communication hole. And a tip of the sliding member refitted into the communication hole on the inner surface of the communication hole. In the sliding step of the leading end of the sliding member to be slid, and in the re-fitting step and the sliding step of the leading end of the sliding member, the resin residue that has penetrated and adhered between the communication hole and the sliding member is removed. The step of separating the resin residue to be separated, and the resin residue separated in the step of separating the resin residue,
Performing a step of sucking and discharging a resin residue sucked and discharged to the outside through the vacuum path. 8. The resin scrap removing step for forcibly removing the resin scrap that has intruded and adhered to the inner surface of the communication hole at a position below the neck at the tip of the sliding member. Item 8. A method for cleaning a fitting sliding portion in a mold for resin sealing molding of an electronic component according to Item 7. 9. The resin residue removing step removes resin residue that has penetrated and adhered between the communication hole and the sliding member.
The peeled resin residue is accommodated in a gap between an inner surface of the communication hole and a thin portion formed at a substantially middle portion in a longitudinal direction of the sliding member. Item 9. A method for cleaning a fitting sliding portion in a mold for resin sealing molding of an electronic component according to Item 8. 10. The step of sucking and discharging the resin scum, the resin scum contained in the gap between the inner surface of the communication hole and the thin portion formed substantially in the middle of the sliding member in the longitudinal direction is passed through a vacuum path. 8. The method according to claim 7, wherein suction and discharge are performed to the outside. 11. An electronic device comprising: a communication hole provided at a required position in a space filled with a molten resin material; and a sliding member reciprocally slidable by a required reciprocating drive source is fitted into the communication hole. What is claimed is: 1. A method of cleaning a fitting sliding portion in a resin-sealing molding die of a part, wherein a tip end of the sliding member is moved backward into a communication hole opposite to a space filled with the molten resin material. After the step of retreating the tip of the sliding member to be moved, and the step of retreating the tip of the sliding member, the tip of the sliding member that has retreated is advanced again to the filling space side of the molten resin material, In the forward sliding step of the distal end of the sliding member that slides the distal end of the sliding member on the inner surface of the communication hole, and in the forward sliding step of the distal end of the sliding member, the communication hole and the slide are moved. Resin residue removal process for removing resin residue that has entered and adhered to the moving member In the forward sliding step of the tip of the sliding member and the step of removing the resin residue, the separated resin residue is pushed out to the mold surface on the side of the filling space portion of the molten resin material. A resin sealing molding of an electronic component, comprising: performing a discharging step and a resin residue removing step of removing the resin residue discharged in the discharging step of the resin residue to the outside of the communication hole outside the mold. A method of cleaning a fitting sliding portion in a mold.