JP3063458U - Thin uniform light source for image processing using LED - Google Patents

Abstract

(57) [Problem] In a thin uniform light illumination light source for image processing composed of a plurality of LEDs, a uniform shape light emission is efficiently generated in a thin shape by a mold without using a diffusion plate. Let it. SOLUTION: After mounting an LED chip (1) capable of irradiating the upper surface in all directions on a printed wiring board (2), a powder (3) having a diffusion effect or a reflection effect is mixed with a resin, and the LED is formed. A resin mold (4) is applied to the entire chip mounting surface.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to an LED lighting device having a reflection / diffusion function in a mold.

[0002]

[Prior art]

 In a lighting device configured by using a plurality of LEDs, since each LED chip emits light like a point light source, the illuminance in the conventional technology changes from a linear emission state due to the point emission. In order to easily cause unevenness and uniformity, a diffusion plate or the like was installed in front of the LED, and a distance between the LED and the diffusion plate was required until the light of the adjacent LED overlapped. In order to make the light more uniform, the thickness of the diffusion plate must be increased or the transparency of the diffusion plate must be increased, and the amount of light must be attenuated.In order to compensate for the amount of attenuation, the amount of light from the LED must be further increased. Is required. As the amount of light increases, power consumption and heat generation also increase, raising the temperature of lighting fixtures and the surroundings. In addition, there is a problem that the luminous efficiency per power is reduced.

[0003]

[Problems to be solved by the invention]

 The purpose of the present invention is to efficiently generate uniform surface emission in a thin shape without using a diffusion plate in a thin uniform light source for image processing composed of a plurality of LEDs without using a diffusion plate. .

[0004]

[Means for Solving the Problems]

 In order to achieve the above object, after mounting an LED chip (1) capable of irradiating the upper surface in all directions on a printed wiring board (2), a powder (3) having a diffusion effect or a reflection effect is mixed with resin. Then, a resin mold (4) is applied to the entire LED chip mounting surface. Attached components such as the chip resistor (6) used for limiting the current, if mounted on the same surface, generate shadows and cause uneven brightness. Further, the inner surface of the case (5) surrounding the mold portion other than the irradiation surface and the LED mounting surface are processed to have a reflection effect (7). As the LED chip (1) used in this state, use a bare chip-shaped element that can irradiate in all directions or a chip-type LED without a reflector and a condenser lens.

[0005]

[Embodiment of the invention]

 The linear light emitted from each point of the LED chip is diffused and diffusely reflected in the mold by the powder that has a diffusion effect or reflection effect mixed in the resin mold. It is assumed that the entire light is emitted.

In addition, light emitted to a portion other than the irradiation surface enters the mold again by reflection processing on the LED chip mounting surface and the inner surface of the case, thereby compensating for light amount attenuation from the end.

The LED chip has a heat radiation effect by directly mounting it on a printed wiring board, and furthermore, by applying heat radiation processing to a printed wiring board / case, it is possible to improve the light emission efficiency per power.

[0008]

[Effect of the invention]

 The present invention is configured as described above and has the effects described below. A more uniform illuminance distribution than before can be realized on an irradiation surface of a lighting device using a plurality of LEDs as point light sources.

The powder mixed in the resin mold obtains a diffuse / diffuse reflection effect, so that the conventionally required diffusion plate and the LED element / diffusion plate (due to the spread of the irradiation angle of each LED). (A distance until the irradiation light of the adjacent LED overlaps) is omitted, and the device can be formed thin.

Since no diffuser plate is used, the attenuation of the light amount due to the uniformization is small, and the illumination efficiency is improved. In addition, since it does not require more power than necessary, it enables low power and low heat generation lighting.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a thin uniform light illumination light source lamp for image processing in which a plurality of LEDs are used and an entire surface is molded.

FIG. 2 is a vertical sectional view of a thin uniform light illumination light source lamp for image processing in which a plurality of LEDs are used and an entire surface is molded.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 LED chip 2 Printed wiring board 3 Diffusing / reflective material 4 Resin mold 5 Case 6 Resistance etc. 7 Reflection processed surface

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[Procedure amendment]

[Submission date] April 7, 1999

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims for utility model registration

[Correction method] Change

[Correction contents]

[Utility model registration claims]

Claims (1)

[Utility model registration claims] 1. A plurality of LED chips are directly mounted on a printed wiring board, and a resin mold is applied to the entire printed wiring board. The resin used as the mold material is mixed with a powder having a reflection effect or a diffusion effect, and the light emitted from the LED is diffusely reflected and diffused by the mixed powder. In spite of this, an LED that enables uniform surface light emission from the entire mold irradiation surface, and a thin uniform light illumination light source that creates a new function combining the mold and powder.