JP3051319B2 - Film carrier type semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film carrier type semiconductor device manufactured by mounting a semiconductor element on a tape-like carrier film and molding the semiconductor element with a sealing resin. if,
The present invention relates to a film carrier type semiconductor device in which a semiconductor element efficiently radiates heat.

[0002]

2. Description of the Related Art A film carrier type semiconductor device is manufactured by mounting a semiconductor element on a tape-shaped carrier film and molding the semiconductor element with a sealing resin. Such a film carrier type semiconductor device is usually manufactured as follows. As shown in FIG. 11, when a large number of semiconductor elements 51 are manufactured by a wafer or the like, bumps 56 projecting upward are provided on electrode portions 51 a provided near each corner on the upper surface of each semiconductor element 51. . The semiconductor elements 51 provided with the bumps 56 on the respective electrode portions 51a are separated from each other.

On the other hand, as shown in FIGS. 12 (a) and 12 (b), a tape-shaped carrier film 54 made of polyimide or the like is prepared, and a central opening 54a is formed at the center in the width direction. At the same time, a side opening 54b is formed on each side of each central opening 54a. The semiconductor elements 51 are arranged so that the bumps 56 of the separated semiconductor element 51 are located in the respective central openings 54a.
6, one end of a finger 57 as a lead wire is connected to each. Each finger 57 extends to the side of the semiconductor element 51, and is placed on the carrier film 54 so as to pass over each side opening 54b provided on each side of the carrier film 54. . Thus, the semiconductor element 51 is in a state of being supported by the carrier tape 54 by each finger 57.

In such a state, as shown by a two-dot chain line in FIGS.
It is molded with the sealing resin 58 together with the carrier film 54. Then, by cutting the carrier film 54 for each semiconductor element 51, FIG.
And (b), the planar semiconductor element 51
However, the film carrier type semiconductor device 50 molded with the sealing resin 58 together with the fingers 57 is obtained.

[0005] As shown in FIG. 13 (c), a film carrier type semiconductor device 50 having such a structure is provided with a sealing resin 5.
8 are connected to the pattern 61 on the printed circuit board 60, and the carrier film 54 is separated by the fingers 57 into the printed circuit board 60.
Is mounted on the printed circuit board 60 while being held down.

[0006]

In such a film carrier type semiconductor device 50, the junction portion of the semiconductor element 51 rises in temperature due to an increase in power consumption. However, the semiconductor element 51 is covered with a sealing resin 58. Therefore, there is a problem that the semiconductor element 51 is not sufficiently dissipated and the temperature rise cannot be sufficiently suppressed. In particular, a film carrier type semiconductor device manufactured using a tape-shaped carrier film has many advantages that it is easy to manufacture, can easily cope with the increase in the number of terminals, and is economical. Therefore, it has been an issue to suppress the temperature rise of the semiconductor element of the obtained semiconductor device.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a film carrier type semiconductor device capable of effectively dissipating heat from a semiconductor element and suppressing a temperature rise of the semiconductor element. Is to provide.

[0008]

According to the present invention, there is provided a film carrier type semiconductor device comprising: a semiconductor element die-bonded in a radiator having an opening on an upper surface; and one end connected to each electrode provided on the upper surface of the semiconductor element. Parts are connected to each other, the other end of each of the fingers as a lead wire extending to the side of the semiconductor element, an opening is provided so as to match the opening of the radiator, A carrier film in which a heat radiator is adhered to the surface so that each finger passes through the aligned opening, and an end of each finger that has passed through the opening of the carrier film extends to the outside. And a sealing resin for molding each finger together with the semiconductor element in the heat radiating body, thereby achieving the above object.

A second semiconductor element molded with the sealing resin may be mounted on a surface of the carrier film opposite to a surface to which the heat radiator is adhered. Another heat radiator may be further attached.

[0010]

According to the film carrier type semiconductor device of the present invention,
When the semiconductor element is die-bonded into the radiator, the radiator is bonded to the surface of the carrier film. At this time, the semiconductor element is exposed from the opening of the heat radiator and the opening of the carrier film. Then, one end of each finger as a lead wire is connected to the electrode portion of the semiconductor element exposed from the opening of the carrier film, and the end of each finger is supported on the carrier film. In such a state, the semiconductor element in the radiator is molded with the sealing resin. The fingers on the carrier film are molded with the sealing resin together with the semiconductor element so that each end extends outside the sealing resin. In such a film carrier type semiconductor device, heat is efficiently radiated by the radiator.

[0011]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1A is a plan view showing an example of a film carrier type semiconductor device of the present invention, and FIG.
It is sectional drawing in the -A line. The film carrier type semiconductor device 10 has a heat dissipating body 12 in the shape of a hollow rectangular parallelepiped in which a semiconductor element 11 is accommodated. This radiator 12
A wall portion 12b is provided on the periphery of the rectangular bottom surface 12a, and an opening is formed on the upper surface.
It is composed of a metal plate such as aluminum or iron.
On the bottom surface 12 a of the heat radiator 12, the flat semiconductor element 1
1 is die-bonded by solder 13.

The semiconductor element 11 may be die-bonded to the radiator 12 with a brazing material such as a conductive paste such as a silver paste or a high discharge insulating paste using silica or the like as a filler.

The radiator 12 is adhered to a carrier film 14 made of polyimide or the like with an adhesive 15. The carrier film 14 is used for the heat radiator 12.
A central opening 14a matching the opening of the radiator 1 is provided at the center, and the radiator 1 is provided around the central opening 14a.
The upper surface of the second wall portion 12b is adhered by the adhesive 15.

Semiconductor element 11 provided in heat radiator 12
Each pair of electrodes 11a is provided on the upper surface of the pair near each side edge extending along the width direction.
The bonding bumps 16 protruding upward are provided on 1a, respectively. One end of a finger 17 formed of a thin metal piece is bonded to each pump 16. Each finger 17 is a lead wire also serving as an electrode, and a pair of fingers 17 provided on each side edge of the semiconductor element 11 each extend outward from each side edge of the semiconductor element 11.

Semiconductor element 11 housed in heat radiator 12
Is molded with a sealing resin 18. The sealing resin 18 is filled in the radiator 12 and the central opening 14a of the carrier film 14 to seal the semiconductor element 11, and the carrier film 14 is also molded except for its peripheral edge. Each of the fingers 17 is molded with a sealing resin 18 except for each of the tips that extend outward, and the tips of the fingers 17 extend from the sealing resin 18.

The film carrier type semiconductor device 10 having such a configuration is used by being mounted on a printed circuit board 20, as shown in FIG. In this case, the film carrier type semiconductor device 10 has the bottom surface 12 a of the heat radiator 12 connected to the pattern 22 on the printed circuit board 20,
The end of each finger 17 extending from the sealing resin 18 is
The carrier film 14 is connected to the pattern 21 on the printed board 20 and is pressed against the printed board 20.

Since the film carrier type semiconductor device 10 on the printed board 20 is efficiently radiated from the radiator 12 through the pattern 22 of the printed board 20, the temperature of the junction of the semiconductor elements 11 due to the increase in power consumption is increased. The rise is suppressed.

Such a film carrier type semiconductor device 10 is manufactured as follows. As shown in FIG. 3, when the carrier film 14 in the form of a tape made of polyimide wound in a reel shape is pulled out, the center portion in the width direction of the tape-shaped carrier film 14 is fixed at a predetermined interval in a rectangular shape. The central openings 14a are sequentially formed. At the same time, each side of the central opening 14a is punched out sequentially in a rectangular shape extending along the longitudinal direction of the carrier film 14, and each side opening 14b is sequentially formed.

On the other hand, as shown in FIGS. 4A and 4B, a flat semiconductor element 11 is die-bonded with a solder 13 on the bottom surface 12a of a hollow rectangular parallelepiped heat radiator 12 having an open top surface. You. Thereafter, bumps 16 protruding upward are provided on each pair of electrodes 11 a provided on the upper surface of each side edge of the semiconductor element 11.

In such a state, the semiconductor element 11
The heat dissipating body 12 to which is bonded is bonded to a tape-shaped carrier film 14 with an adhesive 15. The radiator 12 has an upper surface of the wall portion 12b in which the central opening 1 is formed.
The semiconductor element 11 is bonded to the peripheral edge of the carrier film 4a so as to be exposed from the central opening 14a of the carrier film 14.

Thereafter, as shown in FIGS. 5A and 5B, the central opening 1 of the tape-shaped carrier film 14 is formed.
Each bump 16 on the upper surface of the semiconductor element 11 exposed from 4a
Is connected to one end of each finger 17. Each finger 17 is located in the central opening 1 of the carrier film 14.
4a is extended to each side of the carrier film 1a.
4 is supported while passing over the respective side openings 14b.

Next, the sealing resin 18 is filled into the radiator 12 through the central opening 14a of the carrier film 14, and the sealing resin 18 is filled on the semiconductor element 11 and the carrier film 14, thereby forming the semiconductor element. Each finger 17 is molded together with 11 while leaving the tip part, and the carrier film 14 is molded leaving its peripheral part. After that, the carrier film 14 is cut for each molded sealing resin 18, whereby
The film carrier type semiconductor device 10 shown in (a) and (b) is obtained.

FIG. 6A is a partially broken plan view showing another embodiment of the film carrier type semiconductor device of the present invention.
(B) is a sectional view taken along line DD. The film carrier semiconductor device 30 of this embodiment includes a radiator 32 on which a power semiconductor element 31 is mounted, and a semiconductor integrated circuit element 39 mounted on a carrier film 34 for controlling the power semiconductor element 31. have.

The carrier film 34 has a rectangular central opening 34a on one side, and a thin rectangular solid semiconductor integrated circuit element 39 on the other side surface.
Is installed. On the surface opposite to the surface on which the semiconductor integrated circuit element 39 is mounted, a flat radiator 32 is adhered by an adhesive 35. The radiator 32 is made of copper,
It is composed of metal plates such as aluminum and iron,
A recess 32c is provided to face the central opening 34a of the carrier film 34. The bottom surface 32 of the recess 32c
a, a power semiconductor element 31 is die-bonded with solder 33, and a wall 32b surrounding the recess 32c.
Is adhered to the periphery of the central opening 34a of the carrier film 34 with an adhesive 35. Heat radiator 32
The side opposite to the side where the concave portion 32c is formed,
Semiconductor integrated circuit device 39 with carrier film 34 interposed
, And its side is adhered to the carrier film 34 by an adhesive 35.

On the power semiconductor element 31 housed in the concave portion 32c of the heat radiator 32, electrode portions 31a are provided in the vicinity of each corner, respectively. Are provided respectively. The electrode portions 39a are also provided near the corners of the upper surface of the semiconductor integrated circuit element 39 mounted on the carrier film 34.
Are provided, and bonding bumps 36 projecting upward are provided on the respective electrode portions 39a.

Each pair of bumps 36 provided on the mutually adjacent side of the power semiconductor element 31 and the semiconductor integrated circuit element 39 has a pair of bumps 36 adjacent to each other.
They are connected by fingers 37 formed by thin metal strips. The other end of each of the pair of bumps 36 on the power semiconductor element 31 and the semiconductor integrated circuit element 39 has one end of a finger 37 extending to the side of each element 31 and 39 so as to be separated from each other. Are connected respectively.

The semiconductor element 31 housed in the recess 32 c of the heat radiator 32 and the semiconductor integrated circuit element 39 mounted on the carrier film 34 are sealed with a sealing resin 38. The sealing resin 38 is filled in the recess 32 c of the heat radiator 32 and the opening 34 a of the carrier film 34, so that the central opening 34 of the carrier film 34 is filled.
a, and covers the semiconductor integrated circuit element 39 on the carrier film 34 to form a rectangular parallelepiped. The peripheral edge of the carrier film 34 extends from the sealing resin 38 over the entire circumference, and a pair of fingers 37 extending to each side of the power semiconductor element 31 and the semiconductor integrated circuit element 39 also has The tip portions extend from the sealing resin 38, respectively.

The film carrier type semiconductor device 30 of this embodiment is manufactured as follows. As shown in FIG. 7, when the carrier film 34 in the form of a tape made of polyimide wound in a reel shape is pulled out, the carrier film 34 is placed on each side in the width direction of the tape-shaped carrier film 34. The rectangular side openings 34b extending along the longitudinal direction are punched out in order,
The rectangular central openings 14a are punched out at regular intervals in the central portion close to one side opening 34a.

On the other hand, as shown in FIG. 8, a plurality of flat radiators 12 having a hollow rectangular parallelepiped concave portion 32c having an open upper surface on one side are prepared.
A thin flat power semiconductor element 31 is die-bonded with a solder 33 on the bottom surface 32a of the concave portion 32c.
Thereafter, bumps 36 projecting upward are provided on the four electrodes 31a provided near the corners of the upper surface of the semiconductor element 31, respectively.

In such a state, each of the heat radiators 32 to which the power semiconductor element 31 is die-bonded is attached to the tape-shaped carrier film 34 by the upper surface of the wall portion 32b surrounding the concave portion 32c. Central opening 34a
Is bonded to the peripheral portion of the carrier film 34 with the adhesive 35, and the side portion where the concave portion 32c is not formed is bonded to the surface of the carrier film 34 with the adhesive 35. As a result, the power semiconductor element 31 provided in the concave portion 32 c of each heat radiator 32 is connected to the central opening 1 of the carrier film 34.
The state is exposed through 4a.

Thereafter, as shown in FIG. 9, a semiconductor integrated circuit element 39 is mounted on the surface of the carrier film 34 opposite to the surface to which the heat radiator 32 is adhered, using an adhesive 35. Then, the bumps 36 adjacent to each other in the power semiconductor element 31 and the semiconductor integrated circuit element 39 are connected by each finger 37, and
One end of each finger 37 extending to the side of each element 31 and 39 is bonded to another bump 36 of the power semiconductor element 31 and the semiconductor integrated circuit element 39.

Next, the sealing resin 38 is filled and molded into the recess 32c of the heat radiator 32 from the central opening 34a of the carrier film 34, and the power is applied to the periphery of the central opening 34a of the carrier film 34. The semiconductor element 31 for semiconductor use and the semiconductor integrated circuit element 39
Molded. Thereafter, the carrier film 34 is cut for each molded sealing resin 38, whereby the film carrier type semiconductor device 30 shown in FIGS. 6A and 6B is obtained.

In the film carrier type semiconductor device of this embodiment, even when the surface of the power semiconductor element 31 to which the heat radiator 32 is adhered becomes high potential and becomes high heat, the heat radiator 32 causes the power semiconductor element to be heated. 31 is efficiently dissipated. Further, since the semiconductor integrated circuit element 39 that controls the power semiconductor element 31 is configured separately from the power semiconductor element 31, there is almost no possibility that the semiconductor integrated circuit element 39 is affected by the heat of the power semiconductor element 31.

In the film carrier type semiconductor devices 10 and 30 of the above embodiments, as shown in FIG. 10A, screw holes 12e and 32e are formed at diagonal positions on the back surfaces of the heat radiators 12 and 32. Each one,
As shown in FIG. 10B, the radiators 12 and 32 have
The heat dissipating tool 40 formed separately having a large number of heat dissipating fins 41 may be screwed. In this case,
Each of the semiconductor devices 10 and 30 is mounted on the printed circuit board 2 so that each of the heat radiation fins 41 of the heat radiator 40 is effectively in contact with air.
When mounted on the zero pattern, the heat radiation effect is further enhanced.

[0036]

As described above, in the film carrier type semiconductor device of the present invention, since the semiconductor element is efficiently radiated by the heat radiator, the temperature rise of the semiconductor element is suppressed.

[Brief description of the drawings]

FIG. 1A is a plan view showing an example of a film carrier type semiconductor device of the present invention, and FIG. 1B is a cross-sectional view taken along line AA.

FIG. 2 is a side view showing a use state of the film carrier type semiconductor device.

FIG. 3 is a perspective view of a film used for manufacturing the film carrier type semiconductor device.

FIG. 4A is a plan view of a heat radiator accommodating a semiconductor element used for manufacturing the film carrier type semiconductor device, and FIG. 4B is a cross-sectional view taken along a line BB.

FIG. 5A is a plan view showing a state in which the heat radiator is mounted on a film, and FIG. 5B is a cross-sectional view taken along the line CC.

6A is a partially cutaway plan view showing another embodiment of the film carrier type semiconductor device of the present invention, and FIG.
It is sectional drawing in the -D line.

FIG. 7 is a perspective view of a film used for manufacturing the film carrier type semiconductor device.

FIG. 8 is a plan view of a heat radiator accommodating a semiconductor element used for manufacturing the film carrier type semiconductor device.

FIG. 9 is a plan view showing a state where the heat radiator is mounted on a film.

FIG. 10 (a) is a rear view showing still another embodiment of the film carrier type semiconductor device of the present invention, and FIG. 10 (b) is a side view showing an example of a use state of the film carrier type semiconductor device.

FIG. 11 is a plan view of a semiconductor element used for manufacturing a conventional film carrier type semiconductor device.

12A is a plan view showing a state in which the semiconductor element is divided and mounted on a carrier film, and FIG.
It is sectional drawing in the -F line.

FIG. 13A is a partially cutaway plan view showing another embodiment of the conventional film carrier type semiconductor device, and FIG.
FIG. 3C is a cross-sectional view taken along line G, and FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Film carrier type semiconductor device 11 Semiconductor element 12 Heat radiator 13 Solder 14 Film 15 Adhesive 16 Pump 17 Finger 18 Sealing resin 30 Film carrier type semiconductor device 31 Power semiconductor element 32 Heat radiator 33 Solder 34 Film 35 Adhesive 36 Pump 37 Finger 38 Sealing Resin 39 Semiconductor Integrated Circuit Element 40 Heat Dissipation Tool 41 Heat Dissipation Fin

Claims (3)

(57) [Claims] 1. A semiconductor device die-bonded in a heat radiator having an opening on an upper surface, and one end is connected to each electrode provided on the upper surface of the semiconductor device, and the other end is connected to each other. And a finger as a lead wire extending to the side of the semiconductor element, and an opening are provided so as to match the opening of the heat radiator, and each finger passes through the opening in a matched state. And a mold in which each finger is molded together with the semiconductor element in the radiator so that the end of each finger that has passed through the opening of the carrier film extends outside. A film carrier type semiconductor device comprising: a resin. 2. The film carrier according to claim 1, wherein a second semiconductor element molded with the sealing resin is mounted on a surface of the carrier film opposite to a surface to which a heat radiator is adhered. Type semiconductor device. 3. The film carrier type semiconductor device according to claim 1, wherein another radiator is further attached to the radiator.