JP3050475B2 - Processing method of ceramic green sheet - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming through holes and grooves in a ceramic green sheet used for manufacturing a multilayer electronic component such as a multilayer chip inductor.

[0002]

2. Description of the Related Art In the manufacture of multilayer electronic components such as multilayer chip inductors, multilayer transformers, LC composite components, etc., having built-in coil conductors, through holes for connecting coil conductor patterns on ceramic green sheets to one another are used in the manufacture thereof. Is required in the sheet.

Heretofore, the above-mentioned process has been performed by interposing a ceramic green sheet between an ascending and descending upper mold having a punch and a lower mold having a die hole corresponding to the punch. Is moved and stopped in a predetermined direction, and in the stopped state, the upper die is lowered to make a hole in the ceramic green sheet.

[0004]

In the above-mentioned conventional processing method, mechanical vibrations and impacts caused by elevating the upper die are easily transmitted to the ceramic green to be processed, and the upper die and the lower die are attached to the sheet during processing. Due to the contact, the fragile ceramic green sheet may be displaced or deformed due to these factors, which has a problem that the shape accuracy and the position accuracy of the through hole are adversely affected.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a processing method capable of forming through holes and the like with high accuracy in a fragile ceramic green sheet.

[0006]

According to a first aspect of the present invention, a laser light source, a mask having a predetermined light transmitting portion, and a table supporting a ceramic green sheet are provided. The light source irradiates a laser beam having a diameter larger than that of the light-transmitting portion toward the mask, irradiates the ceramic green sheet with light having passed through the light-transmitting portion in a predetermined shape, and moves the ceramic green sheet in a predetermined direction by a table. It is characterized in that the above laser beam irradiation is repeated.

According to a second aspect of the present invention, in the processing method of the first aspect, the ceramic green sheet is continuously moved in a predetermined direction, and the moving sheet is intermittently irradiated with laser light. I have.

According to a third aspect of the present invention, a laser light source, a mask having a predetermined light transmitting portion, a galvanomirror, and a table for supporting a ceramic green sheet are arranged, and light is transmitted from the laser light source toward the mask. Irradiating a laser beam having a diameter larger than that of the portion and reflecting the light passing through the light-transmitting portion with a galvanomirror and irradiating the ceramic green sheet with a predetermined shape, while changing the reflection angle of the galvanomirror in a predetermined direction. Is repeated.

According to a fourth aspect of the present invention, in the processing method of the third aspect, the reflection angle of the galvanomirror is continuously changed in a predetermined direction, and laser light is intermittently incident on the mirror. .

According to a fifth aspect of the present invention, in the processing method according to any one of the first to fourth aspects, light passing through the light-transmitting portion of the mask is condensed by a lens, and the irradiation shape is more than the light-transmitting portion shape. Irradiating the ceramic green sheet with the light at an image forming ratio in which the image density becomes smaller.

According to a sixth aspect of the present invention, in the processing method according to any one of the first to fifth aspects, a plurality of translucent portions are provided on the mask, and a laser beam is simultaneously irradiated from the laser light source to each translucent portion. Then, the same number of through holes are collectively formed in the ceramic green sheet.

According to a seventh aspect of the present invention, in the processing method according to any one of the first to sixth aspects, the laser light irradiating portion of the ceramic green sheet is covered with a suction cover allowing laser light to pass therethrough, and the laser light is irradiated when the laser light is irradiated. It is characterized in that air is supplied into the suction cover from the outside, and the air is sucked and discharged to the outside.

[0013]

According to the first aspect of the present invention, it is possible to irradiate the mask with laser light from a laser light source and irradiate the ceramic green sheet with light having passed through the light transmitting portion of the mask in a predetermined shape. By repeating the above laser beam irradiation while moving the sheet in a predetermined direction, a predetermined number of through holes, grooves, and the like can be formed in the ceramic green sheet. Since the processing is performed by laser beam irradiation, mechanical vibrations and shocks are not applied to the ceramic green sheet at the time of the processing as in the related art, and no positional displacement or deformation due to contact is caused on the ceramic green sheet.

According to the second aspect of the present invention, the ceramic green sheet is continuously moved in a predetermined direction, and the moving sheet is intermittently irradiated with laser light. You don't have to.

According to the third aspect of the present invention, it is possible to irradiate the laser beam from the laser light source onto the mask and reflect the light passing through the light transmitting portion of the mask with a galvanomirror to irradiate the ceramic green sheet in a predetermined shape. By repeating the above laser beam irradiation while changing the reflection angle of the galvanometer mirror in a predetermined direction, a predetermined number of through holes, grooves, and the like can be formed in the ceramic green sheet.
In the same manner as in the first aspect of the present invention, since the processing is performed by laser beam irradiation, no mechanical vibration and impact are applied to the ceramic green sheet during the processing as in the related art, and positional displacement or deformation due to contact is caused. Does not occur on the sheet.

According to the fourth aspect of the invention, since the reflection angle of the galvanometer mirror is continuously changed in a predetermined direction, and the laser beam is intermittently incident on the mirror, it is necessary to stop the galvanometer mirror each time processing is performed. There is no.

According to the fifth aspect of the present invention, since the laser beam is applied to the ceramic green sheet at an image forming ratio at which the irradiation shape is smaller than the shape of the light transmitting portion of the mask, the irradiation energy density can be increased.

According to the sixth aspect of the present invention, a plurality of through holes and the like can be collectively formed in the ceramic green sheet by simultaneously irradiating the laser light from the laser light source to each light-transmitting portion of the mask. Can be shortened.

According to the invention of claim 7, air is supplied from the outside into the suction cover at the time of laser beam irradiation, and the air is sucked and discharged to the outside, so that a molten residue or a floating material of the sheet material generated at the time of processing is removed. The air can be exhausted from inside the suction cover together with the air.

[0020]

1 to 6 show a first embodiment of the present invention. FIG. 1 is a schematic structural view of a processing apparatus, FIG. 2 is a view showing a laser oscillation mode, and FIG. 3 is a laser beam passing through a mask. FIG. 4 is a diagram showing an operation, FIG. 4 is a diagram showing a hole forming operation by a laser beam, FIG. 5 is a diagram showing a through-hole forming path, and FIG. 6 is a flowchart of processing control.

First, the processing apparatus will be described with reference to FIGS. In FIG. 1, 1 is a laser light source, R is a laser beam, 2 is a mirror, 3 is a mask, 4 is an imaging lens, 5 is an XY table, GS is a ceramic green sheet (hereinafter simply referred to as a sheet in the examples). ) And 6 are a laser drive circuit, 7 is a table drive circuit, and 8 is a control circuit of a microcomputer configuration incorporating a processing control program.

The laser light source 1 is composed of a pulsed YAG laser, generates a normal pulse oscillation as shown in FIG. 2 by a drive signal from a drive circuit 6, and outputs a laser beam R having an output peak value W1 with the oscillation. . The pulse width τ1 of the laser light R is selected in the order of μs or ms according to the thickness and material of the target sheet GS.

The mask 3 is made of a vitreous plate material.
As shown in FIG. 7, the light-transmitting portion 3a corresponding to the through-hole, for example, has a transparent or translucent portion or a hole that allows light to pass therethrough. As shown by a dashed line in FIG. 2, the laser light R from the laser light source 1 has a larger diameter than the light transmitting portion 3a of the mask 3, and only the light passing through the light transmitting portion 3a enters the lens 4. . Although the shape of the light transmitting portion 3a is basically similar to the shape of the through hole to be formed, the shape of the light transmitting portion 3a may be determined based on the actual irradiation shape of the sheet GS.

In this processing apparatus, a laser beam R from a laser light source 1 is reflected by a mirror 2 to irradiate a mask 3 as shown by a dashed line in FIG. The transmitted light can be condensed by the lens 4 and irradiated on the sheet GS at a predetermined image forming ratio, and the image forming ratio (the size of the irradiation shape) can be appropriately adjusted depending on the lens position. Incidentally, the mirror 2 shown in the figure can be eliminated by disposing the laser light source 1 downward.

As shown in FIG. 4, the shape of the laser beam R applied to the sheet GS is smaller than the shape of the light transmitting portion 3a of the mask 3 in order to increase the energy density. The portion is melted and vaporized to form an intended through hole H. FIG. 4 shows a sheet GS supported by a base film BF such as PET.
By appropriately adjusting the output of the laser beam R, it is possible to process only the sheet GS without damaging the lower film BF.

The XY table 5 supports the sheet GS on a plane orthogonal to the optical axis of the irradiation light, and can move the sheet GS in the XY directions by a drive signal from the drive circuit 7. The XY table 5 includes motors and position detectors corresponding to the X and Y directions, and the table movement position is closed-loop controlled by the drive circuit 7.

Next, the processing procedure will be described with reference to FIGS. At the time of processing, a rectangular sheet GS located at another position is conveyed using a suction head or the like, and is placed on the XY table 5 in a predetermined direction (direction in which the XY axes of the XY table 5 and two sides of the sheet GS are parallel). Place on.

After the sheet GS is placed, the XY table 5 is appropriately moved to determine the work start position (step S1 in FIG. 6). This positioning is for sheet G
This is performed by sensing the side or corner of S and moving the XY table 5 so that a predetermined portion of the sheet GS is positioned below the optical axis of the irradiation light. May use an XYθ table capable of displacement in the same direction.

After the positioning, the sheet GS is moved at a constant speed in the + X direction in FIG. 5 (step S2 in FIG. 6), and when the movement amount in the same direction reaches the first punching position, the sheet GS is moved. A single pulse of normal pulse laser light R is directed toward the sheet GS to pierce the sheet GS.
Is formed (steps S3 and S4 in FIG. 6). After this, the laser beam R is intermittently irradiated for one shot at every predetermined movement amount to form N (five in FIG. 5) through holes H in the X direction of the sheet GS (step in FIG. 6). S5, S
6).

After the N through holes H are formed in the X direction, the sheet GS is moved from the same position by a predetermined distance in the + Y direction in FIG. 5 (step S8 in FIG. 6), and is then fixed in the -X direction. Laser light R is emitted intermittently while moving at a speed to form N through-holes H in the same direction, and the above procedure is repeated to obtain a predetermined number of paths (shown in FIG. 5 by a two-dot chain line). (20) through holes H are formed in the sheet GS. Of course, the movement path of the sheet GS (= the formation path of the through-hole H) is not limited to the meandering path in the illustrated example, and may be another path.

After all the through holes H have been formed in the sheet GS on the XY table 5, the table movement is stopped and a series of processing is completed (steps S7 and S9 in FIG. 6).

According to the above-described processing method, the mechanical vibration and the impact are not applied to the sheet GS at the time of processing as in the prior art, and the sheet GS is not displaced or deformed due to the contact. Therefore, a decrease in accuracy due to these factors can be prevented beforehand, and the desired through hole H can be formed with extremely high shape accuracy and position accuracy.

Further, if a mask having a different shape of the light-transmitting portion or a mask having a plurality of light-transmitting portions is facilitated, through-holes of various shapes can be formed by one apparatus, and the versatility is extremely high.

Further, since the irradiation of the laser beam and the formation of the through holes are performed instantaneously, it is not always necessary to stop the sheet GS each time the processing is performed, and a predetermined number of through holes H are sequentially formed while continuously moving the sheet GS. Since it can be formed, the processing efficiency can be improved and the time can be significantly reduced.

Even if the shape of the through hole H extends in the sheet moving direction due to the pulse width τ1 of the laser beam R and the sheet moving speed, the dimension of the light transmitting portion 3a along the sheet moving direction is corrected. In other words, the problem can be easily solved by narrowing the irradiation shape of the laser beam in the sheet moving direction by the above-described extension.

Further, the laser beam R is applied to the sheet G at an imaging ratio at which the irradiation shape is smaller than the shape of the light transmitting portion 3a of the mask 3.
Since S is irradiated, the processing can be performed efficiently by increasing the density of irradiation energy.

Furthermore, if the pulse interval τ2 shown in FIG. 2 is predetermined in accordance with the moving time of the sheet GS, the required number of laser oscillations can be performed only by moving the sheet GS in a predetermined direction at a constant speed. It is also possible to form the through hole H, and the load of position detection and drive control on the table side can be reduced and control can be facilitated.

7 and 8 show a second embodiment of the present invention. FIG. 7 is a schematic configuration diagram of a processing apparatus, and FIG. 8 is a flowchart of processing control.

First, the processing apparatus will be described with reference to FIG. In the figure, 11 is a laser light source, R is a laser beam, 12 is a mirror, 13 is a mask, 14 is an imaging lens, 15 is a mirror, 16 is a galvanometer mirror, 17 is a fixed table, GS is a sheet, and 18 is a laser. Drive circuit, 19
Is a mirror drive circuit, and 20 is a control circuit of a microcomputer configuration incorporating a processing control program. Laser light source 11, mask 13, laser drive circuit 1 of the present embodiment
8 is the same as in the first embodiment.

In this processing apparatus, the light R from the laser light source 11 is reflected by the mirror 12 to irradiate the mask 13 as shown by the one-dot chain line in FIG. The light is condensed by the lens 14 and reflected by the mirror 15,
Furthermore, it is possible to irradiate the sheet GS with a predetermined image formation ratio by reflecting the light from the galvanometer mirror 16, and the image formation ratio (the size of the irradiation shape) can be appropriately adjusted depending on the lens position. As in the first embodiment, the shape of the laser beam R applied to the sheet GS is made smaller than the shape of the light transmitting portion of the mask 13 in order to increase the energy density. Incidentally, the mirrors 12 and 15 shown in the figure can be eliminated by being arranged to the left of the laser light source 11, and the lens 14 may be arranged between the galvanometer mirror 14 and the sheet GS. .

The galvanomirror 16 has two degrees of freedom, and its reflection angle can be changed by a drive signal from the drive circuit 19 to change the laser beam irradiation position on the sheet GS appropriately. This galvanometer mirror 16 includes motors and position detectors corresponding to two orthogonal directions,
The reflection angle is closed-loop controlled by the drive circuit 19.

Next, the processing procedure will be described with reference to FIG. 8 and FIG. 5 of the first embodiment. At the time of processing, a rectangular sheet GS at another position is conveyed by using a suction head or the like, and is placed on the fixed table 17 in a predetermined direction (a direction corresponding to the direction in which the galvanometer mirror 16 fluctuates).

After the sheet GS is placed, the galvanomirror 16 is appropriately moved to initialize the reflection angle for determining the work start position (step S1 in FIG. 8). This initial setting is performed based on the data input in advance.
Alternatively, a method of oscillating a weak output laser beam, irradiating the laser beam vertically, and sensing on the table side can be adopted.

After the initial setting, the reflection angle of the galvanomirror 16 is displaced at a constant speed so that the laser beam irradiation position changes in the -X direction in FIG. 5 (step S2 in FIG. 8). When the first punching position is reached, the laser beam R of the normal pulse is applied to the sheet GS by one shot to form a through hole H in the sheet GS (steps S3 and S4 in FIG. 8). Thereafter, the laser beam R is intermittently irradiated for one shot for each predetermined displacement amount to form N through holes H in the X direction of the sheet GS (steps S5 and S6 in FIG. 8).

After the N through holes H are formed in the X direction, the reflection angle of the galvanomirror 16 in the Y direction is changed from the same position so that the laser beam irradiation position changes a predetermined distance in the −Y direction of FIG. The laser beam R is intermittently irradiated while displacing the reflection angle of the galvanometer mirror 16 at a constant speed so that the laser beam irradiation position changes in the + X direction in FIG. 5 (step S8 in FIG. 8). N through holes H are formed in the same direction, and the above procedure is repeated to form a predetermined number of through holes H along a path shown by a two-dot chain line in FIG. Of course, the displacement direction of the galvanometer mirror 16 (= through hole H)
Is not limited to a path in which the laser beam irradiation position changes in a meandering manner, and may be another path.

After all the through holes H are formed in the sheet GS on the fixed table 17, the mirror displacement is stopped and a series of processing is completed (steps S7 and S9 in FIG. 8).

Also in the above-described processing method, the intended through-hole H can be formed with extremely high shape accuracy and position accuracy as in the first embodiment.

Further, as in the first embodiment, if a mask having a different shape of the light transmitting portion or a mask having a plurality of light transmitting portions is facilitated, through holes of various shapes can be formed by one apparatus. Extremely versatile.

Further, since the laser beam irradiation and the formation of the through holes are performed instantaneously, it is not always necessary to stop the galvanomirror 16 each time the processing is performed. The holes H can be sequentially formed, so that the processing efficiency can be improved and the time can be significantly reduced.

As in the first embodiment, even if the shape of the through-hole H extends in the sheet moving direction due to the relationship between the pulse width τ1 of the laser beam R and the sheet moving speed,
This problem can be easily solved by correcting the size of the light transmitting portion along the sheet moving direction.

Further, as in the first embodiment, the mask 13
Since the sheet GS is irradiated with the laser beam R at an image forming ratio at which the irradiation shape becomes smaller than the light transmission portion shape, the processing can be efficiently performed by increasing the irradiation energy density.

Furthermore, if the pulse interval τ2 shown in FIG. 2 is predetermined in accordance with the displacement time of the galvanomirror 16, laser oscillation is performed while changing the reflection angle of the galvanomirror 16 at a constant speed in a predetermined direction. It is also possible to form the required number of through-holes H by itself, and it is possible to reduce the burden of position detection and drive control on the mirror side and to facilitate control.

FIG. 9 is a schematic configuration diagram of a processing apparatus showing a third embodiment of the present invention. In the figure, 21 is a laser light source, R is a laser beam, 22 is a mirror, 23 is a mask, 24 is an imaging lens, 25 is a mirror, 26 is a galvano mirror, 27 is an XY table, GS is a sheet, and 28 is a laser. A drive circuit, 29 is a mirror drive circuit, 30 is a table drive circuit, and 31 is a control circuit of a microcomputer configuration incorporating a processing control program. This processing apparatus combines the components of the first embodiment and the second embodiment, and can selectively perform the same processing as in each embodiment.

In each of the above embodiments, the mask is provided with a single light-transmitting portion. However, a plurality of light-transmitting portions are provided, and a plurality of laser light sources simultaneously transmit laser light to each light-transmitting portion. By irradiating, it is possible to form the same number of through-holes in a ceramic green sheet at one time, and the processing time can be greatly reduced as compared with the case where one through-hole is formed individually. This is extremely advantageous when forming through holes in a sheet that needs to be cut or when forming a plurality of through holes in a long sheet.

Further, at the time of processing by laser beam irradiation, a molten residue or a floating substance of the sheet material generated at the time of processing adheres to the sheet and the through hole, the laser light is scattered by the floating substance, and a clean room or the like is generated by the floating substance. There is a problem that the atmosphere in the above is polluted. In such a case, as shown in FIG.
The sheet GS includes a suction cover K composed of an inner cover Ka having an upper surface and an air inlet Ka2 on a side surface and an outer cover Kb having a laser light passage hole Kb1 on an upper surface and an air inlet Kb2 on a side surface. It is preferable to supply air into the inner cover Ka at the time of laser light irradiation, and to suck and discharge the air to the outside through the outer cover Kb. An air compressor for air supply is connected to the air inlet Ka2 via a tube, and an air compressor for exhaust is connected to the air inlet Kb2 via a tube. According to the relationship of Qβ, the above-mentioned molten residue and suspended matter generated during processing can be discharged to the outside of the working chamber together with air.

Further, when irradiating the laser beam from the laser light source toward the mask, a part of the non-passing light may be reflected from the mask toward the laser light source side to cause problems such as a temperature rise and light interference. is there. In such a case, as shown in FIG. 11, the laser light source 1 (11, 21) and the mask 3 (13, 2) are used.
It is preferable to arrange a light-shielding plate 41 that allows only the laser light R to pass between 3) and 3) to block the reflected light Ra.

Furthermore, when irradiating a laser beam from a laser light source toward a mask, the laser beam may be absorbed by the mask and its temperature may rise, resulting in distortion or hole deformation. In such a case, as shown in FIG.
A reflection layer HS made of a metal plate or a metal film may be formed on the irradiation side of (13, 23) so as to positively reflect non-passing light. In this case, the light shielding plate 41 is used in combination. To prevent the influence of the reflected light. Needless to say, the mask itself may be directly cooled by a blowing means or a water circulating means to prevent the temperature rise without providing the reflection layer, and providing the mask with a radiating means such as fins is also effective.

Further, a part of the laser light that has passed through the mask is diffused to the passing side, and the diffused light is irradiated and absorbed by the galvanomirror, causing a rise in the temperature of the drive source, and the irradiation position due to a change in gain. May be out of order. In such a case, as shown in FIG. 12, a light-shielding plate 42 that allows only the laser light R to pass may be disposed in front of the galvanometer mirror 16 (26) to block the diffusion hole Rb. Alternatively, a gain change caused by a rise in temperature may be measured in advance, and the gain may be corrected according to the actual detected temperature.

Further, in each of the embodiments, an example in which the present invention is applied to the formation of a through-hole is shown. However, the present invention can be applied to processing other than the through-hole, for example, when forming a conductor pattern accommodating groove or the like in a ceramic green sheet. The effect of can be obtained.

[0060]

As described above in detail, according to the first and third aspects of the present invention, the mechanical vibration and the impact are not applied to the ceramic green sheet at the time of processing, and the contact is caused by the contact. Since the sheet is not displaced or deformed, it is possible to prevent a decrease in accuracy due to the displacement and to form desired through holes, grooves and the like with extremely high shape accuracy and position accuracy. Further, if a mask having a different shape of the light-transmitting portion or a mask having a plurality of light-transmitting portions can be easily formed, through-holes, grooves, and the like having various shapes can be formed by a single device, and the versatility is extremely high.

According to the second and fourth aspects of the present invention, there is no need to stop the sheet or stop the galvanomirror each time processing is performed, and the sheet is continuously moved or the reflection angle of the galvanomirror is continuously adjusted. A predetermined number of through holes, grooves, and the like are sequentially formed while changing the number of holes, so that the processing efficiency can be improved and the time can be significantly reduced.

According to the fifth aspect of the present invention, since the sheet is irradiated with the laser beam at an image forming ratio in which the irradiation shape is smaller than the shape of the light transmitting portion of the mask, the irradiation energy density can be improved. Processing can be performed efficiently.

According to the sixth aspect of the present invention, a plurality of through holes, grooves and the like can be collectively formed in the ceramic green sheet, so that the processing time can be greatly reduced as compared with the case of forming one by one. This is extremely advantageous when processing a sheet that requires a large number of parts, or when processing a plurality of long sheets.

According to the seventh aspect of the present invention, the molten residue and the suspended matter of the sheet material can be discharged to the outside from the inside of the suction cover together with the air at the time of processing. Problems such as scattering of the laser beam and contamination of the atmosphere in a clean room or the like by floating substances can be reliably eliminated.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a processing apparatus showing a first embodiment of the present invention.

FIG. 2 is a diagram showing a laser oscillation mode.

FIG. 3 is a diagram showing an operation of a laser beam passing through a mask.

FIG. 4 is a diagram showing a drilling action by a laser beam;

FIG. 5 is a view showing a through-hole forming path;

FIG. 6 is a flowchart of machining control.

FIG. 7 is a schematic configuration diagram of a processing apparatus showing a second embodiment of the present invention.

FIG. 8 is a flowchart of machining control.

FIG. 9 is a schematic configuration diagram of a processing apparatus showing a third embodiment of the present invention.

FIG. 10 shows a suction cover.

FIG. 11 is a view showing a light shielding plate;

FIG. 12 is a view showing a light shielding plate;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Laser light source, 2 ... Mirror, 3 ... Mask, 3a ... Transparent part, 4 ... Lens, 5 ... XY table, 6 ... Laser drive circuit, 7 ... Table drive circuit, 8 ... Control circuit, 11 ... Laser light source, 12 mirror, 13 mask, 14 lens
15: mirror, 16: galvanometer mirror, 17: fixed table, 18: laser drive circuit, 19: mirror drive circuit,
Reference numeral 20: control circuit, 21: laser light source, 22: mirror, 2
3 mask, 24 lens, 25 mirror, 26 galvano mirror, 27 XY table, 28 laser drive circuit, 29 mirror drive circuit, 30 table drive circuit
31: control circuit, R: laser beam, GS: ceramic green sheet, H: through hole, K: suction cover, 41
... Light shielding plate, HS: reflection layer, 42: light shielding plate.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI H01F 17/00 H01F 17/00 D H05K 3/00 H05K 3/00 N 3/46 3/46 H N (56) References Special features Japanese Unexamined Patent Publication No. Hei 5-221398 (JP, A) Japanese Unexamined Patent Publication No. 5-277765 (JP, A) Japanese Unexamined Patent Publication No. 5-318160 (JP, A) Japanese Unexamined Patent Publication No. Sho 56-39190 (JP, A) Japanese Unexamined Patent Publication No. Sho 59-78793 (Japanese) JP, A) JP-B-58-57277 (JP, B2)

Claims (4)

(57) [Claims] 1. A processing method for forming a predetermined number of through holes in a ceramic green sheet for a laminated electronic component, comprising: a laser light source, a mask having a light transmitting portion, and a support for supporting the ceramic green sheet. The ceramic green sheet is oriented in a predetermined direction by the support
While moving, the laser with a larger diameter than the translucent part toward the mask
Irradiating laser light, and moving the laser light
In the process of repeatedly irradiating ceramic green sheets
In addition, as the mask , the ceramic is irradiated with the irradiated laser light.
Through holes formed in the black green sheet
Moving the ceramic green sheet so that
With the dimensions of the translucent part corrected in the direction corresponding to the direction
Processing method of the ceramic green sheet, characterized in that that 2. The method according to claim 1, wherein the light that has passed through the light-transmitting portion of the mask is condensed by a lens, and the light is applied to the ceramic green sheet at an image forming ratio that makes the irradiation shape smaller than the light-transmitting portion shape. A method for processing a ceramic green sheet according to claim 1. 3. The method according to claim 1, wherein a plurality of light-transmitting portions are provided on the mask, and the same number of through-holes are collectively formed in the ceramic green sheet by simultaneously irradiating each light-transmitting portion with laser light. Or the method for processing a ceramic green sheet according to any one of the above items 2 and 3. 4. A laser light irradiating portion of a ceramic green sheet is covered with a suction cover that allows laser light to pass therethrough, and air is supplied from the outside into the suction cover during laser light irradiation to suck and discharge the air to the outside. Claim 1 characterized by the following:
The method for processing a ceramic green sheet according to any one of claims 1 to 3.