JP3043787B2 - Apparatus for measuring glue adhesion rate in warp sizing machine - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an apparatus for measuring the glue adhesion rate of a warp in a warp sizing machine.

<Prior art> First conventional example When measuring the glue adhesion rate of a warp in a warp sizing machine,
Every time the consumption of the size liquid attached to and removed from the warp from the sizing device where the warp passes through the size liquid and is squeezed is measured, the length that the warp traveled during that time is measured, The average glue adhesion rate of the warp in that area is calculated based on the measured value of the running length of the yarn and the consumption of the size liquid. That is, the glue adhesion rate of the warp is intermittently calculated as an average value in a specific area of the warp.

When the calculated glue adhesion rate is different from the measured glue adhesion rate, the glue squeezing pressure of the gluing device is adjusted to set the glue adhesion rate to the set glue adhesion rate.

Second Conventional Example An apparatus for continuously measuring the glue adhesion rate of a warp in a warp sizing machine was invented.

As disclosed in Japanese Patent Publication No. 48-1473, this apparatus focuses on the point that the glue adhesion rate of a warp is proportional to the water content of a warp and is proportional to the dielectric constant of a warp. The moisture content of the warp traveling horizontally from the sizing device to the drying device is determined by measuring the dielectric constant between the two electrodes by arranging a pair of electrodes facing each other at the upper and lower positions of the warp. The glue adhesion rate of the warp during passage is measured.

When the measured glue adhesion rate is different from the set glue adhesion rate, the glue squeezing pressure of the gluing device is adjusted in order to make the glue adhesion rate the set glue adhesion rate.

<Problem to be Solved by the Invention> However, in the first conventional example, the glue adhesion rate of the warp is intermittently calculated as an average value of a specific area of the warp.
The adjustment of the squeezing pressure of the sizing device becomes stepwise, and the control of the sizing ratio of the warp is not high quality.

In the second conventional example, since the glue adhesion rate of the warp is continuously measured, the above-mentioned problem of the first conventional example does not exist.

However, since the electrodes for permittivity measurement are arranged at the upper and lower positions of the warp that travels horizontally, foreign matter such as fluff, fiber fragments, glue residue, dust, etc., is located between the upper and lower electrodes. It easily penetrates and deposits on the lower electrode.

If a foreign substance is present between the two electrodes, the measurement of the dielectric constant between the two electrodes, that is, the measurement of the glue adhesion rate of the warp, will cause an error.

In addition, since the warp immediately after passing through the gluing device has steam attached thereto with a high-temperature size liquid, steam passes between the upper and lower electrodes, so that the steam is applied to the lower surface of the upper electrode or It cools by contacting the upper surface of the lower electrode, and dew condensation easily occurs on the lower surface of the upper electrode or the upper surface of the lower electrode.

If dew condensation occurs between the two electrodes, the measurement of the dielectric constant between the two electrodes, and hence the measurement of the glue adhesion rate of the warp, will cause an error.

After all, in the conventional example, it is difficult to continuously and accurately measure the glue adhesion rate of the warp.

An object of the present invention is to solve the conventional problems as described above.

<Means for Solving the Problems> The present invention relates to a warp sizing machine in which a warp travels from a sizing apparatus to a drying apparatus.
A detection head containing a pair of electrodes is arranged with its detection surface facing downward, and the warp runs in the electric field of both electrodes generated from the detection surface of the detection head, and air flows around the detection surface of the detection head. The air outlet is provided downward, and air is blown downward from the air outlet to form an air curtain around the detection surface of the detection head, and the warp is formed around the detection surface of the detection head. After passing through the gluing device side portion of the detection head, pass through the lower side of the detection surface of the detection head, measure the dielectric constant between both electrodes of the detection head, and measure the warp passing through the electric field of both electrodes A glue adhesion rate measuring device characterized in that the glue adhesion rate is measured.

<Operation> In the glue adhesion rate measuring device of the present invention, a detection head containing a pair of electrodes is disposed at an upper position of a running warp.
Since the detection surface is arranged downward, compared with the conventional example in which the pair of electrodes are arranged at the upper and lower positions of the warp, the fluff, the fiber pieces, and the scum are generated in the electric field of both electrodes. Foreign matter such as dust is hardly present.

In addition, since an air curtain is formed around the detection surface of the detection head where the electric field of both electrodes is generated, foreign substances are less likely to enter the electric field of both electrodes as compared with the conventional example in which no air curtain is formed.

Further, since the warp passes through the air curtain and then passes below the detection surface of the detection head, steam generated from the size liquid attached to the warp is removed by the air curtain.
The detection surface of the detection head is hardly in contact with the detection surface, and the detection surface of the detection head is not easily dewed.

<Effects of the Invention> In the glue adhesion rate measuring apparatus of the present invention, foreign matter is hard to penetrate into the electric field of both electrodes and is hardly present. It is unlikely that a measurement error will occur.

Further, since dew condensation hardly occurs on the detection surface of the detection head, a measurement error due to dew condensation hardly occurs as compared with a conventional example in which dew condensation easily occurs.

As a result, it is easy to continuously and accurately measure the glue adhesion rate of the warp.

<Example> A warp sizing machine equipped with a device for measuring a glue adhesion rate according to the present example is provided with a beam stand, a sizing device, a drying device and a winding device in order, and unwinds from a warping beam set on the beam stand. The sheet-like warp passes through the sizing liquid of the sizing device, passes through the squeezing roller of the sizing device, passes through each heating cylinder of the drying device, and is wound on the loom beam set on the winding device. Configuration.

As shown in FIG. 1, the glue adhesion rate measuring device of this example is as follows.
At the upper position of the warp y traveling horizontally or almost horizontally from the glue squeezing roller r of the sizing device of the warp sizing machine to the first heating cylinder c of the drying device, the detection head 1 having a substantially octagonal disk shape is mounted on the lower surface thereof. The detection surface 2 at the center is arranged downward.

As shown in FIG. 1, the detection head 1 pivotally supports the rear end of the heating cylinder c on the machine frame (not shown) of the warp sizing machine using the round shaft 3 and the front end of the glue squeezing roller r on the air side. It is connected via a cylinder device 4 to a machine frame (not shown) of a warp sizing machine.

When the detection head 1 is not used, for example, when a warp is set on a warp sizing machine, the detection head 1 is turned upward and retracted by the operation of the air cylinder device 4 as shown by a chain line in FIG. It has a configuration.

The detection head 1 has a small-diameter disc-shaped electrode 5 and a large-diameter disc-shaped electrode 6 on the detection surface 2 concentrically inside and outside, as schematically shown in cross sections in FIGS. The warp y runs in the electric field of both electrodes 5 and 6 generated from the detection surface 2 as shown in FIG.

The two electrodes 5 and 6 housed in the detection head 1 are
Is connected to a dielectric constant measuring device (not shown), that is, a glue adhesion measuring device (not shown) via an upper connector 7, so as to measure the glue adhesion ratio of the warp y passing through the electric field of both electrodes 5, 6.

In addition, the glue adhesion ratio measuring device is connected to the control device, and when the measured glue adhesion ratio is different from the set glue adhesion ratio, the glue squeezing roller r of the gluing device is used to reduce the glue adhesion ratio to the set glue adhesion ratio. The pressure is adjusted.

At the outer circumference position of the circular plate-shaped electrode 6 of the detection head 1,
As shown in FIGS. 2 and 3, an annular air passage 8 is provided, and an annular air ejection port 9 is provided at a position around the detection surface 2 of the detection head 1 so as to communicate with the air passage 8. Exit 9
The air is blown downward from above to form an air curtain around the detection surface 2 of the detection head 1.

Further, the warp y passes through the front part of the air curtain formed around the detection surface 2 of the detection head 1 and then passes through the electric field of the two electrodes 5 and 6 generated from the detection surface 2 of the detection head 1. It has a configuration.

The air passage 8 of the detection head 1 is connected to a high-pressure air source (not shown) via a connection portion 10 on the side of the detection head 1.

In the glue adhesion rate measuring device of this example, the warp y is glued by the gluing device, and then passes through the front portion of the air curtain formed around the detection surface 2 of the detection head 1, and the detection head Both electrodes generated from the detection surface 2 of 1
After passing through an electric field of 5 or 6, the glue adhesion rate is measured, and then the adhesive is dried by a drying device.

The glue adhering rate of the warp y is continuously measured, and when the measured glue adhering rate of the warp y is different from the set glue adhering rate, the glue squeezing pressure of the gluing device is adjusted to set the glue adhering rate of the warp y. It is controlled to the glue adhesion rate.

In the glue adhesion rate measuring device of this example, a detection head 1 containing a pair of electrodes 5 and 6 is disposed at an upper position of a warp y traveling horizontally or almost horizontally with its detection surface 2 facing downward. Therefore, in the electric field of the two electrodes 5 and 6 generated from the detection surface 2, foreign substances such as fiber fragments and glue residue that cause measurement errors are unlikely to be present.

Further, since the detection surface 2 of the detection head forms an air curtain around it, foreign matter that causes a measurement error is unlikely to enter the electric field between the electrodes 5 and 6 generated from the detection surface 2 of the detection head 1. .

Further, the warp y passes through the air curtain and then passes below the detection surface 2 of the detection head 1, so that steam generated from the size liquid attached to the warp y is removed by the air curtain, and the warp y is detected. The detection surface 2 of the head 1 is hardly in contact with the detection surface 2, and the detection surface 2 of the detection head 1 is less likely to cause dew condensation which causes a measurement error.

[Brief description of the drawings]

FIG. 1 is a partial side view of a warp sizing machine provided with an apparatus for measuring a glue adhesion rate according to an embodiment of the present invention. FIG. 2 is an enlarged vertical sectional side view of a detection head portion of the glue adhesion rate measuring device of the same example. FIG. 3 is a sectional view taken along line AA of FIG. 1: Detection head, 2: Detection surface 5: Electrode, 6: Electrode 9: Air spout, y: Warp

Claims (1)

(57) [Claims] 1. A warp sizing machine in which a warp travels from a sizing apparatus to a drying apparatus, wherein a detection head containing a pair of electrodes is provided at a position above a warp traveling from the sizing apparatus to the drying apparatus. With the warp running in the electric field between the two electrodes generated from the detection surface of the detection head, and an air ejection port is provided downward around the detection surface of the detection head, and downward from the air ejection port. The air is blown out to form an air curtain around the detection surface of the detection head, and the warp passes through the glue device side portion of the air curtain formed around the detection surface of the detection head. The structure passes through the lower side of the detection surface of the detection head, measures the dielectric constant between both electrodes of the detection head, and measures the glue adhesion rate of the warp passing through the electric field of both electrodes. Measuring device for glue adhesion rate.