JP3037323B1 - Computer cooling system - Google Patents

Abstract

The present invention provides a computer cooling device and a computer cooling method that reduce mounting space and noise. SOLUTION: In a computer 1 having a power supply fan that blows heat inside a housing 6 from a power supply blow-out unit 9 to the outside, heat of a heat-generating component such as a central processing unit 2 is transferred downstream of the power supply fan. The heat is transmitted to the provided heat sink by the heat pipe 5 and released, and the wind is emitted from the power supply fan to the outside of the computer 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a computer cooling device for cooling a central processing unit or peripheral devices.

[0002]

2. Description of the Related Art A conventional computer cooling device includes a power supply fan for blowing heat so as to release heat of a power supply to the outside of the computer.

On the other hand, heat-generating components driven by a power source such as a central processing unit (hereinafter referred to as a CPU) and peripheral devices thereof are conventionally air-cooled by dedicated fans provided respectively. JP-A-9-218724
And Japanese Utility Model Registration No. 3050939).

[0004] In particular, utility model registration No. 3050939
In the computer cooling device disclosed in Japanese Patent Application Laid-Open Publication No. H10-209, heat generated from the CPU is released to the outside of the computer.

[0005]

As described above, in the conventional example, a dedicated fan and a heat radiating component are provided for each of the heat generating components such as the power supply, the central processing unit and the peripheral devices.

For this reason, the mounting space is reduced. In addition, since the number of fans is large, noise increases.

An object of the present invention is to provide a computer cooling device that reduces mounting space and noise.

[0008]

In order to achieve this object, according to the present invention, heat of a heat-generating component such as a central processing unit or a peripheral device is transmitted to a heat sink provided downstream of a power supply fan by a heat pipe. The air is blown out of the computer by the wind from the power supply fan.

[0009]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 and 2 show a computer 1 having an embodiment of a cooling device according to the present invention.

Inside the housing 6 of the computer 1,
A power supply 4 for driving the computer 1, a heat-generating component such as the CPU 2, and a heat pipe 5 for transmitting heat from the first heat-absorbing section 10 provided in contact with the CPU 2 to the heat transfer section 11 are housed therein.

The power supply 4 is provided with a power supply fan 7 for releasing heat generated inside the housing 6 to the outside of the computer 1, and is provided downstream of the power supply fan 7, and emits heat by wind from the power supply fan 7. And a heat sink 3 having heat dissipating fins 8. The housing 6 has a power supply fan 7
There is provided a power supply blowing section 9 for blowing wind from outside to the outside of the computer 1.

The heat pipe is a volatile liquid (working fluid)
Is enclosed in a tube, and heat is transported by utilizing absorption and release of latent heat due to evaporation and condensation of the working fluid.

The heat pipe 5 has one end connected to the first heat absorbing section 10 and the other end connected to the heat transfer section 11. One or a plurality of heat pipes 5 are provided in parallel to increase the amount of heat to be transmitted, for example, two as shown.

The heat transfer section 11 is provided outside the power supply 4. On the other hand, a second heat absorbing section 12 that absorbs heat from the heat transfer section 11 is provided inside the power supply 4. Heat transfer part 1
The first and second heat absorbing sections 12 are detachably fixed.

A power supply heat pipe 13 is connected to the second heat absorbing section 12. This power supply heat pipe 13
The heat radiating fins 8 are provided so as to penetrate them, so that heat transfer to the heat radiating fins 8 is enhanced.

In the cooling device for the computer 1 configured as described above, the computer 1 is cooled as follows.

When the computer 1 operates, heat is generated from the CPU 2. This heat is supplied from the CPU 2 to the first heat absorbing section 10, the heat pipe 5, the heat transfer section 11, and the second heat absorbing section 1.
2. Power is transmitted to the radiating fins 8 via the heat pipe 13.

By the wind from the power supply fan 7, the heat of the radiating fins 8 is released from the power supply blowout section 9 to the outside of the computer 1 as shown by an arrow A. That is, the power supply fan 7 emits heat inside the housing 6 and
To release heat directly from the outside. Thereby, the CPU 2
Is prevented from staying in the housing 6.

In the above-described embodiment, the CPU 2 is used as a heat-generating component for transferring heat to the heat sink 3 and dissipating heat.
However, not only the CPU 2 but also, for example, as shown in FIG. 3, in addition to the CPU 2, heat-generating components such as the peripheral device 14 and the chip 15 and the heat transfer section 11
May be connected. In this modified example, heat generated by the peripheral device 14 and the chip 15 in addition to the CPU 2 is also radiated from the power supply blowing section 9 to the outside of the computer 1.

[0021]

As described above, according to the present invention, it is not necessary to provide a fan for each heat-generating component to cool a heat-generating component such as a CPU or a peripheral device. Fan noise can be reduced.

Further, since the heat generated from the heat-generating components is not discharged into the housing but is cooled by the heat sink via the heat pipe, the rise in temperature in the housing can be reduced.

[Brief description of the drawings]

FIG. 1 is a partially broken perspective view of a computer provided with a cooling device according to an embodiment of the present invention.

FIG. 2 is an enlarged view showing the inside of a power supply of the computer shown in FIG. 1;

FIG. 3 is a partially broken perspective view of a computer provided with a modification of the cooling device of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 computer 2 CPU (heat generating component) 3 heat sink 4 power supply 5 heat pipe 6 housing 7 power supply fan 8 radiating fin 9 power supply blowout section 10 first heat absorption section 11 heat transfer section 12 second heat absorption section 13 power supply heat pipe 14 Peripheral device (heating component) 15 Chip (heating component)

Claims (4)

(57) [Claims] 1. A computer cooling device having a power supply fan for blowing heat of a power supply for driving a heat-generating component such as a central processing unit or a peripheral device to the outside of the computer, wherein the heat of the heat-generating component is absorbed. A first heat absorbing portion, a heat transfer portion disposed outside a power supply, and a first heat transfer portion for transferring heat from the first heat absorbing portion to the heat transfer portion.
A heat pipe disposed inside a power supply and receiving heat from the heat transfer section; a heat sink having a radiating fin provided downstream of the power supply fan; and a second heat absorption section A second heat pipe for transmitting heat from the heat sink to the heat sink, wherein the heat transfer unit and the heat absorption unit are removable. 2. The computer cooling device according to claim 1, wherein said second heat pipe is provided on said heat-dissipating fins so that heat can be dissipated. 3. The computer cooling device according to claim 2, wherein the second heat pipe is provided so as to penetrate the heat radiation fins. 4. The apparatus according to claim 1, wherein a plurality of said first and second heat pipes are provided in parallel.
The cooling device for a computer according to any one of claims 1 to 3.