JP2991527B2 - Conductor paste for ceramic capacitor electrodes - Google Patents
Conductor paste for ceramic capacitor electrodesInfo
- Publication number
- JP2991527B2 JP2991527B2 JP3117288A JP11728891A JP2991527B2 JP 2991527 B2 JP2991527 B2 JP 2991527B2 JP 3117288 A JP3117288 A JP 3117288A JP 11728891 A JP11728891 A JP 11728891A JP 2991527 B2 JP2991527 B2 JP 2991527B2
- Authority
- JP
- Japan
- Prior art keywords
- sintering
- electrode
- dielectric
- tungsten
- ceramic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims description 8
- 239000004020 conductor Substances 0.000 title description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 26
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims 1
- 238000005245 sintering Methods 0.000 description 23
- 229910052721 tungsten Inorganic materials 0.000 description 13
- 239000010937 tungsten Substances 0.000 description 13
- 238000006467 substitution reaction Methods 0.000 description 11
- 239000000919 ceramic Substances 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- 238000010304 firing Methods 0.000 description 8
- 238000007747 plating Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 239000007772 electrode material Substances 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229940116411 terpineol Drugs 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- -1 diester compounds Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Conductive Materials (AREA)
- Paints Or Removers (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はセラミックコンデンサー
電極用導体ペーストに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paste for a ceramic capacitor electrode.
【０００２】[0002]
【従来の技術および発明が解決しようとする課題】積層
セラミックコンデンサーとしては、図１に示すような構
成のものが公知である。図において、１は内部電極、２
は外部電極、３はセラミック（誘電体）、4a、4bはメッ
キ層である。そして、内部電極１としてはパラジウム、
白金あるいは銀−パラジウム等の貴金属が用いられ、外
部電極２にも銀あるいは銀−パラジウム等の貴金属が用
いられ、メッキ層4a、4bとしては各々ニッケルメッキ、
半田メッキが施されていた。2. Description of the Related Art As a multilayer ceramic capacitor, one having a configuration as shown in FIG. 1 is known. In the figure, 1 is an internal electrode, 2
Is an external electrode, 3 is a ceramic (dielectric), and 4a and 4b are plating layers. And, as the internal electrode 1, palladium,
A noble metal such as platinum or silver-palladium is used, and a noble metal such as silver or silver-palladium is also used for the external electrode 2. Nickel plating is used for the plating layers 4a and 4b, respectively.
Solder plating had been applied.
【０００３】しかし、内部電極および外部電極には高価
な貴金属が用いられていたので、近年、コストダウンを
目的として、内部電極を卑金属であるニッケルに置換し
ようとする試みが成されている。ところで、誘電体材料
として、チタン酸バリウムを主体としたペロブスカイト
型構造のセラミックを用いた場合、その焼成は１０００
℃以上、例えば１３００℃前後の高温で行われることが
多い。この場合、内部電極材料としてニッケルを用いた
場合、昇温過程の７００℃付近でニッケルの焼結が始ま
り、より高い温度で誘電体であるセラミックが焼結を開
始する。このセラミックの焼結に伴う収縮によりセラミ
ックと既に焼結したニッケル膜との間に歪が生じ、ニッ
ケル膜の厚みが薄い場合にしばしばニッケル膜が破損
し、静電容量を初めとするコンデンサーとしての諸特性
を劣下させる。However, since expensive noble metals have been used for the internal electrodes and the external electrodes, attempts have recently been made to replace the internal electrodes with nickel, which is a base metal, for the purpose of cost reduction. By the way, when a ceramic having a perovskite structure mainly composed of barium titanate is used as a dielectric material, the firing is performed for 1000 times.
In many cases, the heat treatment is performed at a high temperature of not less than 1 ° C., for example, about 1300 ° C. In this case, when nickel is used as the internal electrode material, sintering of nickel starts around 700 ° C. in the temperature rising process, and sintering of the ceramic as a dielectric starts at a higher temperature. Due to the shrinkage accompanying sintering of the ceramic, distortion occurs between the ceramic and the already sintered nickel film, and when the thickness of the nickel film is thin, the nickel film is often damaged, and the capacitance and other characteristics of the capacitor are reduced. Degrades various characteristics.
【０００４】本発明はこのような従来の技術の有する問
題点に鑑みてなされたものであって、その目的は、誘電
体であるセラミックと内部電極との焼結温度の相違によ
る内部電極膜の破損を防止し、コンデンサー機能を劣下
させることのないセラミックコンデンサー電極用導体ペ
ーストを提供することにある。The present invention has been made in view of the above-mentioned problems of the prior art, and an object of the present invention is to provide a method for forming an internal electrode film due to a difference in sintering temperature between a ceramic which is a dielectric and an internal electrode. An object of the present invention is to provide a conductor paste for a ceramic capacitor electrode which prevents breakage and does not deteriorate the capacitor function.
【０００５】[0005]
【課題を解決するための手段】内部電極材料の焼結温度
をセラミック（誘電体）のその値と同程度にするため
に、本発明の要旨は、６５〜９９重量％のニッケル粉末
と１〜３５重量％のタングステン粉末とを合計で１００
重量％有し、これに適量の有機ビヒクルを加えたセラミ
ックコンデンサー電極用導体ペーストにある。SUMMARY OF THE INVENTION In order to make the sintering temperature of the internal electrode material approximately the same as that of the ceramic (dielectric), the gist of the present invention is to provide 65 to 99% by weight of nickel powder and 35% by weight of tungsten powder for a total of 100
% By weight, and an appropriate amount of an organic vehicle is added to the conductor paste for a ceramic capacitor electrode.
【０００６】ニッケル粉末の粒径は５μ以下が好まし
く、電極の薄層化のためには、１μ以下とするのがより
好ましい。The particle size of the nickel powder is preferably 5 μm or less, and more preferably 1 μm or less for thinning the electrode.
【０００７】タングステン粉末はニッケル粉末と効率的
に反応させるため、その粒径はニッケル粉末と同程度以
下とするのが好ましい。しかし、タングステン粉末の粒
径が極端に小さくなると製造工程中にタングステン粉が
酸化するという問題が発生するので、粒径下限は0.５μ
とするのが好ましい。[0007] In order for tungsten powder to react efficiently with nickel powder, it is preferable that the particle size be equal to or smaller than that of nickel powder. However, if the particle size of the tungsten powder becomes extremely small, there is a problem that the tungsten powder is oxidized during the manufacturing process, so the lower limit of the particle size is 0.5 μm.
It is preferred that
【０００８】タングステンの比率はニッケル相の固溶限
度内に留めるのが好ましく、タングステンの比率が３５
重量％を超えると、焼成後のシート抵抗が極端に増大す
る。It is preferable that the proportion of tungsten is kept within the solid solution limit of the nickel phase.
If the content is more than 10% by weight, the sheet resistance after firing increases extremely.
【０００９】一方、タングステンの比率が１重量％未満
であると、内部電極膜の焼結温度の上昇が充分でなく、
本発明の目的を達成することができない。On the other hand, if the proportion of tungsten is less than 1% by weight, the sintering temperature of the internal electrode film does not rise sufficiently,
The object of the present invention cannot be achieved.
【００１０】有機ビヒクルとしては、一般的に導電性ペ
ーストとして常用されているすべてのものが使用可能で
あるが、例えば、有機ビヒクル中の樹脂成分としては、
エチルセルロースやレジン類等が使用できる。また、樹
脂成分を溶解するための溶媒としては、高沸点のターピ
ネオール、ブチルカルビトール、ブチルカルビトールア
セテート、ジブチルフタレート、または１，１，３−ト
リメチルペンタンジオールのモノエステルおよびジエス
テル化合物が挙げられる。As the organic vehicle, any one generally used as a conductive paste can be used. For example, as the resin component in the organic vehicle,
Ethyl cellulose and resins can be used. Examples of the solvent for dissolving the resin component include monoester and diester compounds of high boiling terpineol, butyl carbitol, butyl carbitol acetate, dibutyl phthalate, and 1,1,3-trimethylpentanediol.
【００１１】[0011]
【作用】ニッケル粉末に適量のタングステン粉末を加え
た内部電極を用いることによって焼結温度の上昇を図
り、セラミック（誘電体）の焼結温度と略等しくするこ
とができるので、焼成時に内部電極が破損することはな
い。The sintering temperature can be increased by using an internal electrode obtained by adding an appropriate amount of tungsten powder to nickel powder, and the sintering temperature of the ceramic (dielectric) can be made substantially equal. No damage.
【００１２】[0012]
【実施例】本発明の実施例について以下に説明する。Embodiments of the present invention will be described below.
【００１３】（実施例１）平均粒径0.５μのニッケル粉
および平均粒径0.６μのタングステン粉を以下の表１に
示す通りの比率で合計で１００重量％とし、これに有機
ビヒクルを等量添加して３本ロールミルにより混合し、
表１のNo１〜９に示すペースト（内部電極材となるも
の）を得た。なお、有機ビヒクルとしては、ターピネオ
ールにエチルセルロースを溶解したものを用いた。(Example 1) Nickel powder having an average particle diameter of 0.5 µm and tungsten powder having an average particle diameter of 0.6 µm were made up to a total of 100% by weight in a ratio as shown in Table 1 below, and an organic vehicle was added thereto. Equal amounts are added and mixed by a three-roll mill,
The pastes (No. 1 to No. 9) in Table 1 (which serve as internal electrode materials) were obtained. In addition, what dissolved ethyl cellulose in terpineol was used as an organic vehicle.
【００１４】そして、４００メッシュのスクリーンを用
いて、粒径0.１μのチタン酸バリウム粉末（誘電体とな
るもの）に適量のアクリル系樹脂（バインダー）を添加
したものから得たグリーンシート上に上記各ペーストを
印刷し、バッチ式炉で１２０℃×５分間乾燥後、空気雰
囲気中で徐々に加熱し、４００℃で２時間保定すること
により脱脂を行った。さらに、これを窒素雰囲気（Ｏ2
１ppm 以下）のベルト式炉で、最高温度１２５０℃で２
時間保定することにより焼結を行った。Then, using a 400-mesh screen, a green sheet obtained by adding an appropriate amount of an acrylic resin (binder) to barium titanate powder having a particle size of 0.1 μm (a material serving as a dielectric material) is applied. Each paste was printed, dried in a batch furnace at 120 ° C. for 5 minutes, gradually heated in an air atmosphere, and kept at 400 ° C. for 2 hours to perform degreasing. Further, this is set in a nitrogen atmosphere (O 2
(1 ppm or less) in a belt furnace with a maximum temperature of 1250 ° C and 2
Sintering was performed by holding the time.
【００１５】次いで、得られた焼結体の電極面上の中心
線平均粗さ（Ｒa ) およびシート抵抗（２μ厚換算）を
測定した。その結果を表１に示す。なお、以下の表１〜
表３中の（Ｗ／（Ｎｉ＋Ｗ））×１００（重量％）を本
願明細書ではタングステン置換量という。Next, the center line average roughness (R a ) on the electrode surface of the obtained sintered body and the sheet resistance (2 μ thickness conversion) were measured. Table 1 shows the results. Table 1 below
(W / (Ni + W)) × 100 (% by weight) in Table 3 is referred to as a tungsten substitution amount in the present specification.
【００１６】[0016]
【表１】 [Table 1]
【００１７】表１から明らかなように、中心線平均粗さ
（Ｒa ) およびシート抵抗はタングステン置換量が２０
％で最小となる。この結果は、次のように考えることが
できる。すなわち、タングステン置換量が２０％より小
さい場合、電極膜の焼結が誘電体の焼結より低い温度で
始まり、その後に誘電体の焼結が行われるため、誘電体
の焼結に伴う収縮によって先に焼結がほぼ完了している
電極面に襞状の凹凸が形成され、中心線平均粗さ
（Ｒa ) が増大する。また、電極膜が局部的に破断し、
その結果シート抵抗の増大が起こる。As is apparent from Table 1, the center line average roughness (R a ) and the sheet resistance are as follows.
% Is minimum. This result can be considered as follows. That is, when the tungsten substitution amount is less than 20%, the sintering of the electrode film starts at a lower temperature than the sintering of the dielectric, and then the sintering of the dielectric is performed. Fold-like irregularities are formed on the electrode surface where sintering is almost completed first, and the center line average roughness (R a ) increases. Also, the electrode film is locally broken,
As a result, the sheet resistance increases.
【００１８】一方、タングステン置換量が２０％より大
きい場合、電極膜の焼結温度が上がり過ぎ、１２５０℃
の焼成温度では電極膜が焼結不足となり、その結果、電
極膜表面の中心線平均粗さ（Ｒa ) およびシート抵抗の
増大が起こる。On the other hand, when the tungsten substitution amount is more than 20%, the sintering temperature of the electrode film is too high,
At the firing temperature of, the electrode film becomes insufficiently sintered, and as a result, the center line average roughness (R a ) of the electrode film surface and the sheet resistance increase.
【００１９】しかし、タングステン置換量が２０％前後
のとき、上記焼成温度で誘電体と電極膜両者の焼結がほ
ぼ同時に起こり、平滑緻密な電極膜が形成されるものと
思われる。However, when the tungsten substitution amount is about 20%, it is considered that sintering of both the dielectric and the electrode film occurs almost simultaneously at the above firing temperature, and a smooth and dense electrode film is formed.
【００２０】（実施例２）チタン酸バリウム粉末の粒径
を0.５μのものを用い、焼成温度を１３００℃とした以
外は実施例１と同様の試験を行った。その結果を以下の
表２に示す。Example 2 The same test as in Example 1 was conducted except that barium titanate powder having a particle size of 0.5 μm was used and the firing temperature was set to 1300 ° C. The results are shown in Table 2 below.
【００２１】[0021]
【表２】 [Table 2]
【００２２】表２において、中心線平均粗さ（Ｒa ) が
最小を示すタングステン置換量は２０〜２５％であり、
シート抵抗が最小を示すタングステン置換量は２５％で
あって、これらの物性値が最小を示すタングステン置換
量は実施例１の場合よりやや多くなっている。この理由
は、次のように考えることができる。本実施例の焼成温
度（１３００℃）は実施例１の焼成温度（１２５０℃）
よりやや高いので、その焼成温度で焼結を行う電極のタ
ングステン置換量が実施例１よりやや多くなり、実施例
１より高温でその電極膜と誘電体の焼結がほぼ同時に起
こったものと思われる。In Table 2, the tungsten substitution amount at which the center line average roughness (R a ) shows the minimum is 20 to 25%,
The tungsten substitution amount at which the sheet resistance shows the minimum is 25%, and the tungsten substitution amount at which these physical properties show the minimum values is slightly larger than in the case of the first embodiment. The reason can be considered as follows. The firing temperature (1300 ° C.) of the present embodiment is the firing temperature (1250 ° C.) of the first embodiment.
Since it is slightly higher, the tungsten substitution amount of the electrode sintering at the sintering temperature was slightly larger than in Example 1, and it seems that sintering of the electrode film and the dielectric material occurred almost simultaneously at a higher temperature than in Example 1. It is.
【００２３】（実施例３）誘電体粉末として、粒径が0.
５μのＰｂ（Ｚｒ0.52＋Ｔｉ0.48）Ｏ3 ＋0.005Ｎｂ2
Ｏ5 を用い、焼成温度を１０５０℃とした以外は、実施
例１と同様の試験を行った。その結果を以下の表３に示
す。(Example 3) As a dielectric powder, a particle diameter of the dielectric powder was set to 0.
5 μm of Pb (Zr 0.52 + Ti 0.48 ) O 3 + 0.005Nb 2
The same test as in Example 1 was performed except that the sintering temperature was 1050 ° C. using O 5 . The results are shown in Table 3 below.
【００２４】[0024]
【表３】 [Table 3]
【００２５】中心線平均粗さ（Ｒa ) およびシート抵抗
はタングステン置換量が５％で最小となっている。この
理由は、誘電体の焼成温度が実施例１、２のその値より
低いので、よりタングステン置換量の少ない（焼結温度
の低い）電極膜のものでその電極膜と誘電体の焼結が略
同時に起こったものと思われる。The center line average roughness (R a ) and the sheet resistance are minimum when the tungsten substitution amount is 5%. The reason for this is that the firing temperature of the dielectric is lower than that of Examples 1 and 2, so that the electrode film having a smaller tungsten substitution amount (lower sintering temperature) can be used to sinter the electrode film and the dielectric. It seems that they happened almost simultaneously.
【００２６】[0026]
【発明の効果】本発明によるセラミックコンデンサー電
極用導体ペーストでは、電極膜と誘電体の焼結を略同時
に行うことが可能なので、これらの焼結温度の違いによ
る電極膜の破損を回避することができ、コンデンサーの
特性が劣下することはない。また、ニッケル電極膜のタ
ングステン置換量を変えることにより、広範囲に渡り電
極膜の焼結温度を誘電体のそれに合わせることが可能で
あり、誘電体の実用上の様々な仕様変化に適応した内部
電極を提供することができる。According to the conductor paste for an electrode of a ceramic capacitor of the present invention, sintering of the electrode film and the dielectric can be performed substantially simultaneously, so that damage to the electrode film due to the difference in the sintering temperature can be avoided. It is possible, and the characteristics of the capacitor do not deteriorate. In addition, by changing the tungsten substitution amount of the nickel electrode film, it is possible to adjust the sintering temperature of the electrode film to that of the dielectric over a wide range, and the internal electrode adapted to various specifications changes in practical use of the dielectric Can be provided.
【図１】積層セラミックコンデンサーの断面図である。FIG. 1 is a cross-sectional view of a multilayer ceramic capacitor.
１…内部電極 ２…外部電極 ３…セラミック 4a，4b…メッキ層 1: Internal electrode 2: External electrode 3: Ceramic 4a, 4b: Plating layer
フロントページの続き (72)発明者 愛知後 将 京都府京都市西京区樫原江ノ本町11 (72)発明者 佐伯 周二 滋賀県大津市陽明町８−７ (56)参考文献 特開 昭60−8372（ＪＰ，Ａ) 特開 平３−67403（ＪＰ，Ａ) 特開 昭59−114703（ＪＰ，Ａ) 特開 昭59−199778（ＪＰ，Ａ) 特開 平４−46974（ＪＰ，Ａ) 特開 平４−236269（ＪＰ，Ａ) 特開 平４−236270（ＪＰ，Ａ) 特開 平４−77578（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) C09D 5/24 Continuation of the front page (72) Inventor, Masakazu Aichi 11 Kashihara-Enohonmachi, Nishikyo-ku, Kyoto, Kyoto (72) Inventor, Shuji Saeki 8-7, Yomeicho, Otsu-shi, Shiga (56) References JP-A-60-8372 (JP) JP-A-3-67403 (JP, A) JP-A-59-114703 (JP, A) JP-A-59-199778 (JP, A) JP-A-4-46974 (JP, A) 4-236269 (JP, A) JP-A-4-236270 (JP, A) JP-A-4-77578 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) C09D 5/24
Claims (1)
３５重量％のタングステン粉末とを合計で１００重量％
有し、これに適量の有機ビヒクルを加えたセラミックコ
ンデンサー電極用導体ペースト1. A composition comprising 65 to 99% by weight of nickel powder and
35% by weight of tungsten powder and 100% by weight in total
Conductive paste for ceramic capacitor electrodes with a suitable amount of organic vehicle
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3117288A JP2991527B2 (en) | 1991-05-22 | 1991-05-22 | Conductor paste for ceramic capacitor electrodes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3117288A JP2991527B2 (en) | 1991-05-22 | 1991-05-22 | Conductor paste for ceramic capacitor electrodes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04345670A JPH04345670A (en) | 1992-12-01 |
| JP2991527B2 true JP2991527B2 (en) | 1999-12-20 |
Family
ID=14708038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3117288A Expired - Fee Related JP2991527B2 (en) | 1991-05-22 | 1991-05-22 | Conductor paste for ceramic capacitor electrodes |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2991527B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1636253B (en) * | 2001-04-26 | 2013-02-13 | 埃普科斯股份有限公司 | Electrical several-layer element and manufacturing method thereof |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1319086C (en) * | 2001-05-08 | 2007-05-30 | 埃普科斯股份有限公司 | Ceramic multi-layer element and a method for the production thereof |
| JP4337501B2 (en) * | 2003-10-27 | 2009-09-30 | 株式会社村田製作所 | Conductive paste and multilayer ceramic electronic components |
| JP4513981B2 (en) * | 2005-03-31 | 2010-07-28 | Ｔｄｋ株式会社 | Multilayer ceramic electronic component and manufacturing method thereof |
| JP2014201683A (en) * | 2013-04-05 | 2014-10-27 | ｎ−ｔｅｃｈ株式会社 | Snow-melting paint and construction method using the same, and snow-melting system |
-
1991
- 1991-05-22 JP JP3117288A patent/JP2991527B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1636253B (en) * | 2001-04-26 | 2013-02-13 | 埃普科斯股份有限公司 | Electrical several-layer element and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04345670A (en) | 1992-12-01 |
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