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JP2986621B2 - Transmission type optical coupling device and method of manufacturing the same - Google Patents

Transmission type optical coupling device and method of manufacturing the same

Info

Publication number
JP2986621B2
JP2986621B2 JP22843092A JP22843092A JP2986621B2 JP 2986621 B2 JP2986621 B2 JP 2986621B2 JP 22843092 A JP22843092 A JP 22843092A JP 22843092 A JP22843092 A JP 22843092A JP 2986621 B2 JP2986621 B2 JP 2986621B2
Authority
JP
Japan
Prior art keywords
light
emitting
receiving
receiving element
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP22843092A
Other languages
Japanese (ja)
Other versions
JPH0677519A (en
Inventor
匡彦 木本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Consejo Superior de Investigaciones Cientificas CSIC
Original Assignee
Consejo Superior de Investigaciones Cientificas CSIC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Consejo Superior de Investigaciones Cientificas CSIC filed Critical Consejo Superior de Investigaciones Cientificas CSIC
Priority to JP22843092A priority Critical patent/JP2986621B2/en
Publication of JPH0677519A publication Critical patent/JPH0677519A/en
Application granted granted Critical
Publication of JP2986621B2 publication Critical patent/JP2986621B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、リードフレームレス構
造を有する高感度の表面実装タイプの透過型光結合装置
の構造および製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure and a manufacturing method of a high-sensitivity, surface-mounted transmission optical coupling device having a lead frameless structure.

【0002】[0002]

【従来の技術】図7(A)〜(C)に、従来のリードフ
レームレス構造の透過型光結合装置(フォトインタラプ
タ)の構造図を示す。従来の透過型光結合装置は、次の
ように製造される。
2. Description of the Related Art FIGS. 7A to 7C show structural diagrams of a conventional transmission type optical coupling device (photo interrupter) having a lead frameless structure. A conventional transmission type optical coupling device is manufactured as follows.

【0003】まず、遮光性のメッキ可能な高耐熱性樹脂
を用いて、射出形成等によりパッケージ(樹脂基板)1
を作製する。この際、パッケージ(樹脂基板)1の上面
にH形状の凹部2を形成しておく。
[0003] First, a package (resin substrate) 1 is formed by injection molding or the like using a light-shielding and plating heat-resistant resin.
Is prepared. At this time, an H-shaped concave portion 2 is formed on the upper surface of the package (resin substrate) 1.

【0004】この樹脂基板1の表面に、例えば、無電解
メッキ、電解メッキ等によりCu−Ni−Au,Ni−
Au等の金属層を形成し、その後、部分的なエッチング
等により、三次元立体配線3a,素子配線用パッド3b
および電極パッド3cを形成する。これらの配線3a,
3b,3cは、スルーホールを通して基板裏面の半田つ
け用パッド3dにつながっている。ここで、基板表面に
金属層を形成する方法として、メッキ以外に、真空蒸
着、あるいはスパッター等でも可能である。
On the surface of the resin substrate 1, for example, Cu-Ni-Au, Ni-
A metal layer of Au or the like is formed, and thereafter, the three-dimensional wiring 3a and the element wiring pads 3b are formed by partial etching or the like.
And an electrode pad 3c. These wirings 3a,
3b and 3c are connected to soldering pads 3d on the back surface of the substrate through through holes. Here, as a method of forming a metal layer on the substrate surface, vacuum plating, sputtering, or the like can be used instead of plating.

【0005】次に、凹部2の各室2a,2bの各素子配
線用パッド部3bに、発光素子4および受光素子5を銀
ペースト等の導電性ペーストでダイボンドする。
Next, the light emitting element 4 and the light receiving element 5 are die-bonded to the element wiring pads 3b of the chambers 2a and 2b of the recess 2 with a conductive paste such as a silver paste.

【0006】これら素子4,5のそれぞれの電極と、樹
脂基板1の電極パッド3cとを金線6等によりワイヤー
ボンドした後に、各素子4,5の保護や外部量子効率向
上等の目的で、光学的に透過率の高いエポキシ樹脂7を
注入し熱硬化して封止する。
After the electrodes of the elements 4 and 5 and the electrode pads 3c of the resin substrate 1 are wire-bonded with a gold wire 6 or the like, for the purpose of protecting the elements 4 and 5 and improving the external quantum efficiency, An epoxy resin 7 having high optical transmittance is injected, thermally cured, and sealed.

【0007】そして、樹脂封止後に樹脂基板1および封
止樹脂7の上面に遮光層8を形成する。この遮光層8
は、遮光性インクの印刷、あるいは遮光性フィルムや薄
板の張り合わせにより実現する。
After the resin sealing, a light shielding layer 8 is formed on the upper surfaces of the resin substrate 1 and the sealing resin 7. This light shielding layer 8
Is realized by printing a light-shielding ink or laminating a light-shielding film or a thin plate.

【0008】さらに、樹脂基板1の中央部、すなわち発
光素子4、受光素子5の間をハーフダイシングして溝9
を形成し、これを被検出物体の検出空間とする。
Further, the central portion of the resin substrate 1, that is, between the light emitting element 4 and the light receiving element 5, is half-diced to form a groove 9
Is defined as the detection space of the detected object.

【0009】最後に、ダイシング等で分割し、透過型光
結合装置を完成させる。
Finally, the light is divided by dicing or the like to complete a transmission type optical coupling device.

【0010】[0010]

【発明が解決しようとする課題】従来の透過型光結合装
置は、封止樹脂7の上面に遮光性インクの印刷あるいは
遮光性フィルムの張り合わせて遮光層8を形成してい
る。この構造では、封止樹脂7の上面の形状はフラット
に近く、発光素子4より放射した光を受光素子5に集光
する機能が無いので、発光素子4のサイド方向に放射し
て直接受光素子5に到達する光以外は効率良く受光素子
5に到達しない。特に、受光素子5として、単結晶Si
を使用した場合、その受光面は素子5の上面にあるた
め、受光素子5の側面を照射するサイド光に対しては感
度を有しておらず、発光素子4から直接受光素子5に到
達するサイド光が受光できず、光の利用効率が非常に悪
い。
In a conventional transmission type optical coupling device, a light-shielding layer 8 is formed by printing light-shielding ink or pasting a light-shielding film on the upper surface of a sealing resin 7. In this structure, the shape of the upper surface of the sealing resin 7 is almost flat, and there is no function of condensing the light emitted from the light emitting element 4 to the light receiving element 5. Light other than light reaching the light-receiving element 5 does not efficiently reach the light-receiving element 5. In particular, as the light receiving element 5, single crystal Si
Is used, since the light receiving surface is on the upper surface of the element 5, the light receiving surface has no sensitivity to the side light illuminating the side surface of the light receiving element 5, and reaches the light receiving element 5 directly from the light emitting element 4. The side light cannot be received, and the light use efficiency is very poor.

【0011】本発明は、上記課題に鑑み、光の利用効率
を向上し得る透過型光結合装置の提供を目的とする。
SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a transmission type optical coupling device capable of improving light use efficiency.

【0012】[0012]

【課題を解決するための手段】本発明による課題解決手
段は、図1(A)〜(C)ないし図2の如く、パッケー
ジ11の上面に、発光素子12を収納する発光側凹部1
3と、受光素子14を収納する受光側凹部15と、これ
らを結ぶ連結凹部16とからなるH型の凹部17が形成
され、前記発光側凹部13に、前記発光素子12を搭載
する薄膜状の発光側搭載配線部22と、発光素子12に
ボンデイングワイヤ23を介して結線される薄膜状の発
光側結線配線部24とが形成され、前記発光側搭載配線
部22に発光素子12が搭載され、該発光素子12と発
光側結線配線部24とがボンデイングワイヤ23にて結
線され、前記受光側凹部15に、前記受光素子14を搭
載する薄膜状の受光側搭載配線部25と、受光素子14
にボンデイングワイヤ23を介して結線される薄膜状の
受光側結線配線部26とが形成され、前記受光側搭載配
線部25に受光素子14が搭載され、該受光素子14と
受光側結線配線部26とがボンデイングワイヤ23にて
結線され、前記各配線部22,24,25,26は、パ
ッケージ11の裏面の外部接続用裏面端子31,32,
33,34にまで引き回して接続され、前記各凹部1
3,15が透光性封止樹脂18にて樹脂封止され、該透
光性封止樹脂18およびパッケージ11の上面に遮光体
19が形成され、前記発光素子12と受光素子14の間
がハーフダイシングされて被検出物体の検出空間用の透
過溝21が形成された透過型光結合装置において、前記
遮光体19の発光素子12に面した下面は、発光素子1
2より放射した光に透過溝21側への横方向の指向性を
有せしめるよう、発光素子12の位置が焦点となる放物
面とされ、前記遮光体19の受光素子14に面した下面
は、透過溝21からの横方向の光が受光素子14に集光
されるよう、受光素子14の位置が焦点となる放物面と
されたものである。
As shown in FIGS. 1 (A) to 1 (C) and FIG. 2, a light emitting side recess 1 for accommodating a light emitting element 12 is provided on an upper surface of a package 11 as shown in FIGS.
3, an H-shaped recess 17 including a light receiving side recess 15 for housing the light receiving element 14 and a connecting recess 16 connecting the light receiving side and the light receiving side recess 13, and the light emitting side recess 13 is provided with a thin film-shaped mounting part for mounting the light emitting element 12. A light emitting side mounting wiring section 22 and a thin film light emitting side connecting wiring section 24 connected to the light emitting element 12 via a bonding wire 23 are formed, and the light emitting element 12 is mounted on the light emitting side mounting wiring section 22. The light emitting element 12 and the light emitting side connection wiring section 24 are connected by a bonding wire 23, and a thin film light receiving side mounting wiring section 25 for mounting the light receiving element 14,
A light receiving side connection wiring portion 26 in the form of a thin film is formed on the light receiving side mounting wiring portion 25, and the light receiving element 14 is mounted on the light receiving side mounting wiring portion 25. Are connected by a bonding wire 23, and the wiring portions 22, 24, 25, and 26 are connected to external connection back terminals 31, 32, and 32 on the back surface of the package 11.
33, 34, and are connected to each other.
3 and 15 are resin-sealed with a light-transmitting sealing resin 18, a light-shielding body 19 is formed on the light-transmitting sealing resin 18 and the upper surface of the package 11, and the space between the light emitting element 12 and the light receiving element 14 is formed. In the transmission type optical coupling device in which the transmission groove 21 for the detection space of the detected object is formed by half dicing, the lower surface of the light shield 19 facing the light emitting element 12 is the light emitting element 1.
The position of the light-emitting element 12 is a paraboloid which is a focal point so that the light emitted from 2 has a lateral directivity toward the transmission groove 21, and the lower surface of the light shield 19 facing the light-receiving element 14 is The position of the light receiving element 14 is a paraboloid whose focal point is such that the light in the horizontal direction from the transmission groove 21 is focused on the light receiving element 14.

【0013】請求項2では、図4の如く、請求項1記載
の遮光体19の放物面と、透光性封止樹脂18との境界
部に、高反射率層41が形成されたものである。
According to a second aspect, as shown in FIG. 4, a high reflectance layer 41 is formed at a boundary between the parabolic surface of the light shielding body 19 according to the first aspect and the translucent sealing resin 18. It is.

【0014】請求項3では、図5の如く、請求項1記載
の遮光体19の放物面と、透光性封止樹脂18との境界
部に、空気層42が形成されたものである。
In a third aspect, as shown in FIG. 5, an air layer 42 is formed at the boundary between the parabolic surface of the light shielding body 19 according to the first aspect and the translucent sealing resin 18. .

【0015】請求項4では、パッケージ11の上面に、
発光素子12を収納する発光側凹部13と、受光素子1
4を収納する受光側凹部15と、これらを結ぶ連結凹部
16とからなるH型の凹部17を形成し、前記発光側凹
部13に、前記発光素子12を搭載する薄膜状の発光側
搭載配線部22と、発光素子12にボンデイングワイヤ
23を介して結線される薄膜状の発光側結線配線部24
とを形成し、前記受光側凹部15に、前記受光素子14
を搭載する薄膜状の受光側搭載配線部25と、受光素子
14にボンデイングワイヤ23を介して結線される薄膜
状の受光側結線配線部26とを形成し、前記各配線部2
2,24,25,26を、パッケージ11の裏面の外部
接続用裏面端子31,32,33,34にまで引き回し
て接続し、前記発光側搭載配線部22に発光素子12を
搭載し、該発光素子12と発光側結線配線部24とをボ
ンデイングワイヤ23にて結線し、前記受光側搭載配線
部25に受光素子14を搭載し、該受光素子14と受光
側結線配線部26とをボンデイングワイヤ23にて結線
し、前記各凹部13,15に透光性封止樹脂18を注入
し、中央部分に空気抜き用の貫通孔35が設けられ、か
つ発光素子12より放射した光に透過溝21側への横方
向の指向性を有せしめるよう、発光素子12に面した下
面が発光素子12の位置を焦点とする放物面とされると
ともに、透過溝21からの横方向の光が受光素子14に
集光されるよう、受光素子14に面した下面が受光素子
14の位置を焦点とする放物面とされた遮光体19を前
透光性封止樹脂18およびパッケージ11の上面に配
置し、該透光性封止樹脂18を硬化し、遮光体19の貫
通孔35を透過溝21として取り去るように、発光素子
12と受光素子14の間をハーフダイシングして被検出
物体の検出空間用の透過溝21を形成するものである。
According to a fourth aspect, on the upper surface of the package 11,
A light-emitting side recess 13 for housing a light-emitting element 12;
H-shaped recess 17 comprising a light receiving side recess 15 for accommodating the light emitting element 4 and a connecting recess 16 connecting the light receiving side recesses 4, and a thin film light emitting side mounting wiring portion for mounting the light emitting element 12 in the light emitting side recess 13. 22, a light emitting side connection wiring portion 24 in the form of a thin film connected to the light emitting element 12 via a bonding wire 23
Are formed, and the light receiving element 14 is
And a thin-film light-receiving-side connecting wiring portion 26 connected to the light-receiving element 14 via a bonding wire 23.
2, 24, 25, and 26 are routed to and connected to the external connection back surface terminals 31, 32, 33, and 34 on the back surface of the package 11, and the light emitting element 12 is mounted on the light emitting side mounting wiring portion 22; The element 12 and the light-emitting side connection wiring section 24 are connected by a bonding wire 23, the light receiving element 14 is mounted on the light receiving side mounting wiring section 25, and the light receiving element 14 and the light receiving side connection wiring section 26 are connected to the bonding wire 23. The transparent sealing resin 18 is injected into each of the recesses 13 and 15, and a through hole 35 for venting air is provided in the center portion.
Light emitted from the light emitting element 12 to the transmission groove 21 side
Downward facing the light emitting element 12 so as to have
If the surface is a paraboloid whose focus is on the position of the light emitting element 12,
In both cases, the lateral light from the transmission groove 21 is transmitted to the light receiving element 14.
The lower surface facing the light receiving element 14 is
In front of the light shield 19, which is a paraboloid focusing on the position 14
Coordinated <br/> location on the upper surface of serial translucent sealing resin 18 and the package 11, curing the light-transmissive sealing resin 18, transmural light shield 19
As remove the hole 35 as a transmission groove 21, and half-dicing between the light emitting element 12 and the light receiving element 14 is to produce a transmission grooves 21 for the detection space of the detected object.

【0016】[0016]

【作用】上記請求項1,4による課題解決手段におい
て、発光素子12は、遮光体19の放物面の焦点に位置
しているため、発光素子12より放射した光が放物面に
当たると、すべて横方向の平行光となって物体の検出空
間を通過し受光側の放物面に当たる。放物面は平行光を
その焦点に集光する機能を有するため、その焦点位置に
受光素子14の受光面を配置することで、効率よく光が
利用できる。
According to the first and fourth aspects of the present invention, since the light emitting element 12 is located at the focal point of the paraboloid of the light shield 19, when light emitted from the light emitting element 12 hits the paraboloid, All the light becomes parallel light in the horizontal direction, passes through the object detection space, and hits the paraboloid on the light receiving side. Since the paraboloid has a function of condensing parallel light at its focal point, light can be used efficiently by arranging the light receiving surface of the light receiving element 14 at the focal position.

【0017】請求項2では、遮光体19の放物面に高反
射率層41を形成すると、反射の際に、光の減衰が少な
くなる。
According to the second aspect, when the high reflectivity layer 41 is formed on the paraboloid of the light shielding body 19, attenuation of light at the time of reflection is reduced.

【0018】請求項3では、遮光体19の放物面に空気
層42を形成すると、放物面に当たった光は全反射を起
こし、反射の際に減衰せずに受光素子14まで到達す
る。
According to the third aspect, when the air layer is formed on the paraboloid of the light-shielding body, the light hitting the paraboloid undergoes total reflection, and reaches the light receiving element without being attenuated at the time of reflection. .

【0019】[0019]

【実施例】(第一実施例)本発明の第一実施例の透過型
光結合装置(フォトインタラプタ)は、図1(A)〜
(C)ないし図2の如く、パッケージとしての樹脂基板
11の上面に、発光素子12を収納する発光側凹部13
と、受光素子14を収納する受光側凹部15と、これら
を結ぶ連結凹部16とからなるH型の凹部17が形成さ
れ、前記発光側凹部13に発光素子12が収納され、前
記受光側凹部15に受光素子14が収納され、発光素子
12および受光素子14の保護と外部量子効率の向上を
目的として、各凹部13,15が透光性封止樹脂18に
て樹脂封止され、該透光性封止樹脂18およびパッケー
ジ11の上面に遮光体19が形成され、前記発光素子1
2と受光素子14の間がハーフダイシングされて被検出
物体の検出空間用の透過溝21が形成されたものであ
る。
(First Embodiment) A transmission type optical coupling device (photo interrupter) according to a first embodiment of the present invention is shown in FIGS.
(C) As shown in FIG. 2 or FIG. 2, on the upper surface of the resin substrate 11 as a package, the light emitting side recess 13 for housing the light emitting element 12 is provided.
And an H-shaped recess 17 including a light receiving side recess 15 for accommodating the light receiving element 14 and a connecting recess 16 connecting the light receiving side 14 and the light emitting element 12 is housed in the light emitting side recess 13. The recesses 13 and 15 are resin-sealed with a light-transmitting sealing resin 18 for the purpose of protecting the light-emitting element 12 and the light-receiving element 14 and improving external quantum efficiency. A light-shielding body 19 is formed on the upper surface of the sealing resin 18 and the package 11, and
Half-dicing is performed between the light receiving element 2 and the light receiving element 14 to form a transmission groove 21 for a detection space of an object to be detected.

【0020】前記樹脂基板11は、図1〜3の如く、液
晶ポリマー等のように、良好なメッキ加工性、半田耐熱
性等を有する高耐熱性の機能性高分子材料に、遮光性を
もたせるため、例えばカーボン等の光を吸収する粉体物
質が混入されたものが使用される。該樹脂基板11は、
図3(A)(B)の如く、射出成形等により多数個取り
形状の基板上に一括形成し、発光素子12や受光素子1
4の搭載および封止後、スクライブ手法やダイシング手
法を用いて個々のデバイス単位に分割される。なお、該
樹脂基板11の上側表面には、透光性封止樹脂18の樹
脂漏れを防ぐインクレジスト18aがコーティングされ
る。
As shown in FIGS. 1 to 3, the resin substrate 11 is made of a high heat-resistant functional polymer material having good plating workability, solder heat resistance and the like, such as a liquid crystal polymer, to have light-shielding properties. Therefore, a material mixed with a powdery substance that absorbs light, such as carbon, is used. The resin substrate 11
As shown in FIGS. 3A and 3B, the light emitting element 12 and the light receiving element 1 are collectively formed on a multi-cavity substrate by injection molding or the like.
After mounting and sealing 4, the semiconductor device is divided into individual device units using a scribe method or a dicing method. In addition, the upper surface of the resin substrate 11 is coated with an ink resist 18a for preventing resin leakage of the translucent sealing resin 18.

【0021】前記発光側凹部13には、図1(A)〜
(C)の如く、前記発光素子12を搭載する薄膜状の発
光側搭載配線部22と、発光素子12にボンデイングワ
イヤ23を介して結線される薄膜状の発光側結線配線部
24とが、Cu,Ni,Au等を用いて無電解メッキ、
電解メッキ、エッチング等で三次元的に立体形成され
る。また、前記受光側凹部15には、前記受光素子14
を搭載する薄膜状の受光側搭載配線部25と、受光素子
14にボンデイングワイヤ23を介して結線される薄膜
状の受光側結線配線部26とが三次元的に立体メッキ形
成される。
The light-emitting side recess 13 has a structure shown in FIGS.
As shown in (C), the thin-film-shaped light-emitting-side mounting wiring section 22 on which the light-emitting element 12 is mounted, and the thin-film-shaped light-emitting-side connecting wiring section 24 connected to the light-emitting element 12 via a bonding wire 23 are made of Cu. , Ni, Au, etc., electroless plating,
It is formed three-dimensionally by electrolytic plating, etching and the like. The light receiving side recess 15 is provided with the light receiving element 14.
And a thin-film light-receiving-side connection wiring portion 26 connected to the light-receiving element 14 via a bonding wire 23 are three-dimensionally formed by three-dimensional plating.

【0022】前記各配線部22,24,25,26は、
図1(C)および図2の如く、パッケージ11のスルー
ホール27を介して、裏面の外部接続用裏面端子(半田
付け用パッド)31,32,33,34にまで引き回し
て接続されている。
Each of the wiring sections 22, 24, 25, 26
As shown in FIGS. 1C and 2, the wiring is routed to the external connection back surface terminals (solder pads) 31, 32, 33, 34 via the through holes 27 of the package 11.

【0023】そして、発光側搭載配線部22には、図1
(B)の如く、発光素子12がAgペースト等により固
着搭載され、該発光素子12と発光側結線配線部24と
がボンデイングワイヤ23にて結線される。また、受光
側搭載配線部25には、受光素子14がAgペースト等
により固着搭載され、該受光素子14と受光側結線配線
部26とがボンデイングワイヤ23にて結線される。
The light emitting side mounting wiring section 22 has a structure shown in FIG.
As shown in (B), the light emitting element 12 is fixedly mounted with an Ag paste or the like, and the light emitting element 12 and the light emitting side connection wiring portion 24 are connected by a bonding wire 23. Further, the light receiving element 14 is fixedly mounted on the light receiving side mounting wiring section 25 by using an Ag paste or the like, and the light receiving element 14 and the light receiving side connection wiring section 26 are connected by the bonding wire 23.

【0024】前記透光性封止樹脂18としては、光学的
に透過率の高い、例えば透明エポキシ樹脂が使用され
る。
As the translucent sealing resin 18, for example, a transparent epoxy resin having high optical transmittance is used.

【0025】前記遮光体19は、前記樹脂基板11と同
様の液晶ポリマー等が用いられ、前記透光性封止樹脂1
8の一次モールド体に対して二次モールド(二色成形)
される。該遮光体19の発光素子12に面した下面は、
図1(B)の如く、発光素子12より放射した光に透過
溝21側への横方向の指向性を有せしめるよう、発光素
子12の位置が焦点となる放物面とされ、前記遮光体1
9の受光素子14に面した下面は、透過溝21からの横
方向の光が受光素子14に集光されるよう、受光素子1
4の位置が焦点となる放物面とされている。
The light-shielding body 19 is made of the same liquid crystal polymer as that of the resin substrate 11 and the light-transmitting sealing resin 1 is used.
Secondary mold for two primary molds (two-color molding)
Is done. The lower surface of the light shield 19 facing the light emitting element 12 is:
As shown in FIG. 1 (B), the position of the light emitting element 12 is a parabolic surface where the light is emitted from the light emitting element 12 so that the light emitting element 12 has a directivity in the lateral direction toward the transmission groove 21. 1
9 faces the light receiving element 14 so that light in the lateral direction from the transmission groove 21 is condensed on the light receiving element 14.
The position 4 is a parabolic surface that is the focus.

【0026】また、該遮光体19の透過溝21として取
り去られる中央部分には、図4(B)の如く、空気抜き
用の貫通孔35が設けられる。
Further, as shown in FIG. 4B, a through hole 35 for venting air is provided in a central portion of the light shielding body 19 which is removed as the transmission groove 21.

【0027】上記構成の透過型光結合装置は、次のよう
に製造される。
The transmission type optical coupling device having the above configuration is manufactured as follows.

【0028】始めに、樹脂基板11を、多数個取り形状
の基板上に一括形成する。
First, the resin substrate 11 is collectively formed on a multi-cavity substrate.

【0029】この際、その上面に、発光側凹部13、受
光側凹部15および連結凹部16からなるH型の凹部1
7を形成しておくこの凹部17を含む樹脂基板11の
表面に、無電解メッキ、電解メッキ等の手法を用いて各
配線部22,24,25,26および裏面端子31,3
2,33,34を形成しておく。さらに、樹脂基板11
の上側表面に、インクレジスト18aをコーティングす
る。
At this time, an H-shaped concave portion 1 including a light-emitting side concave portion 13, a light-receiving side concave portion 15, and a connecting concave portion 16 is provided on the upper surface thereof.
7 is formed in advance . The wiring portions 22, 24, 25, 26 and the back terminals 31, 3 are formed on the surface of the resin substrate 11 including the recesses 17 by using a technique such as electroless plating or electrolytic plating.
2, 33 and 34 are formed in advance. Further, the resin substrate 11
Is coated with an ink resist 18a.

【0030】次に、各搭載配線部22,25に、各素子
12,14をダイボンドし、ワイヤボンデング後に、各
素子12,14の保護や外部量子効率向上等の目的で、
図4(A)のように透光性封止樹脂18を注入する。
Next, the elements 12 and 14 are die-bonded to the mounting wiring portions 22 and 25, and after wire bonding, for the purpose of protecting the elements 12 and 14 and improving external quantum efficiency.
As shown in FIG. 4A, the translucent sealing resin 18 is injected.

【0031】そして、図4(B)の如く、放物面を有し
た遮光体19を重ねる。このとき、遮光体19の中央部
に設けた貫通孔35より透光性封止樹脂18をオーバー
フローさせて空気を抜く。このあと、透光性封止樹脂1
8をオーブンで熱硬化する。
Then, as shown in FIG. 4B, a light shielding body 19 having a paraboloid is overlaid. At this time, the light-transmitting sealing resin 18 overflows through the through-hole 35 provided at the center of the light-shielding body 19 to remove air. Then, the translucent sealing resin 1
8 is heat cured in an oven.

【0032】その後、樹脂基板11は、図4(C)の如
く、発光素子12と受光素子14の間をハーフダイシン
グして透過溝21を形成し、これを被検出物体の検出空
間とする。
Thereafter, as shown in FIG. 4 (C), the resin substrate 11 forms a transmission groove 21 by half-dicing between the light emitting element 12 and the light receiving element 14, which is used as a detection space of the object to be detected.

【0033】最後に、樹脂基板11を、スクライブ手法
やダイシング手法を用いて個々の単位に分割し、透過型
光結合装置は完成する。
Finally, the resin substrate 11 is divided into individual units by using a scribing technique or a dicing technique, and the transmission type optical coupling device is completed.

【0034】以上の工程にて作成した透過型光結合装置
は、リードレス構造の透過型光結合装置を製造する上
で、硬化前の液状の封止樹脂の上に遮光体をかぶせる
際、遮光体の中央部分の貫通孔より、空気を抜くことが
できるため、真空脱泡等の工程が不要である。
In the transmission type optical coupling device manufactured in the above process, when a light shielding body is put on a liquid sealing resin before curing in manufacturing a transmission type optical coupling device of a leadless structure, Since air can be evacuated from the through hole in the center of the body, a step such as vacuum defoaming is not required.

【0035】また、ダイシングで物体の検出用の溝を形
成する際、ブレードの厚さを変更するだけで、検出空間
の幅を種々に変えることが可能である。
In forming a groove for detecting an object by dicing, the width of the detection space can be variously changed only by changing the thickness of the blade.

【0036】使用時には、遮光体19に放物面を持たせ
ることにより、発光素子12から受光素子14に光を効
率良く集光できる。さらに、放物面で反射して物体の検
出空間に出た光は平行光束として通過(コリメート)さ
れており、検出精度の向上にもつながる。
In use, the light from the light-emitting element 12 to the light-receiving element 14 can be efficiently condensed by providing the light-shielding body 19 with a paraboloid. Further, the light reflected on the paraboloid and emitted to the detection space of the object is passed (collimated) as a parallel light beam, which leads to improvement in detection accuracy.

【0037】(第二実施例)図5は、本発明の第二実施
例の透過型光結合装置を示す断面図である。本実施例の
透過型光結合装置は、遮光体19の放物面部分に高反射
率の高反射率層41が予め形成されたものである。該高
反射率層41は、金属蒸着や、反射率の高い光沢性イン
クの塗布等により実現できる。
(Second Embodiment) FIG. 5 is a sectional view showing a transmission type optical coupling device according to a second embodiment of the present invention. In the transmission type optical coupling device of this embodiment, a high reflectance layer 41 having a high reflectance is formed in advance on the parabolic surface portion of the light shield 19. The high reflectivity layer 41 can be realized by metal deposition, application of glossy ink having high reflectivity, or the like.

【0038】使用時には、遮光体19に放物面の反射機
能を持たせることにより、発光素子12から受光素子1
4に光を効率良く集光できる。
In use, the light-shielding member 19 is provided with a function of reflecting a paraboloid, so that the light-emitting element 12
4, light can be efficiently collected.

【0039】(第三実施例)図6は、本発明の第三実施
例の透過型光結合装置を示す断面図である。本実施例の
透過型光結合装置は、遮光体19の放物面と、透光性封
止樹脂18との境界部に、空気層42が形成されたもの
である。該空気層42は、遮光体19の放物面部分にあ
らかじめ離型材を塗布しておき、透光性封止樹脂18を
熱硬化したときに、放物面と剥離させることで形成でき
る。
(Third Embodiment) FIG. 6 is a sectional view showing a transmission type optical coupling device according to a third embodiment of the present invention. In the transmission type optical coupling device of the present embodiment, an air layer 42 is formed at the boundary between the parabolic surface of the light shielding body 19 and the translucent sealing resin 18. The air layer 42 can be formed by applying a release material in advance to the parabolic surface of the light-shielding body 19 and peeling off the parabolic surface when the translucent sealing resin 18 is thermally cured.

【0040】上記構成では、使用時に、透光性封止樹脂
18と空気層42の境界面で、光が全反射するため、第
二実施例と同様に、発光素子12から受光素子14に光
を効率良く集光できる。
In the above configuration, the light is totally reflected at the boundary surface between the translucent sealing resin 18 and the air layer 42 during use, so that the light is transmitted from the light emitting element 12 to the light receiving element 14 as in the second embodiment. Can be efficiently collected.

【0041】なお、本発明は、上記各実施例に限定され
るものではなく、本発明の範囲内で上記実施例に多くの
修正および変更を加え得ることは勿論である。
It should be noted that the present invention is not limited to the above-described embodiments, and it goes without saying that many modifications and changes can be made to the above-described embodiments within the scope of the present invention.

【0042】例えば、上記実施例では、各配線部22,
24,25,26や裏面端子31,32,33,34を
金属メッキにて形成したが、これに代えて、真空蒸着あ
るいはスパッター等でも可能である。
For example, in the above embodiment, each of the wiring portions 22,
Although 24, 25, and 26 and back terminals 31, 32, 33, and 34 are formed by metal plating, vacuum deposition or sputtering may be used instead.

【0043】[0043]

【発明の効果】以上の説明から明らかな通り、本発明請
求項1,4によると、遮光体に放物面を持たせることに
より、発光素子から受光素子に光を効率良く集光でき
る。
As is apparent from the above description, according to the first and fourth aspects of the present invention, light is efficiently condensed from the light emitting element to the light receiving element by providing the light shield with a parabolic surface.

【0044】さらに、ダイシングで物体の検出用の溝を
形成する際、ブレードの厚さを変更するだけで、検出空
間の幅を種々に変えることが可能である。
Furthermore, when forming a groove for detecting an object by dicing, the width of the detection space can be variously changed only by changing the thickness of the blade.

【0045】請求項2において、遮光体に放物面の高反
射率層を持たせて光を反射させ、また請求項3において
遮光体の放物面に空気層を設けて光を全反射させること
により、効率良く発光素子から受光素子に光を集光でき
るといった優れた効果がある。
According to a second aspect of the present invention, the light shield is provided with a parabolic high reflectivity layer to reflect light, and in the third aspect, an air layer is provided on the parabolic surface of the light shield to totally reflect light. Thereby, there is an excellent effect that light can be efficiently collected from the light emitting element to the light receiving element.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第一実施例にかかる透過型光結合装置
の図であって、(A)は平面図、(B)は(A)のA−
A断面図、(C)は(A)のB−B断面図
FIGS. 1A and 1B are diagrams of a transmission type optical coupling device according to a first embodiment of the present invention, wherein FIG.
A sectional view, (C) is BB sectional view of (A)

【図2】本発明の第一実施例にかかる透過型光結合装置
の斜視図
FIG. 2 is a perspective view of a transmission type optical coupling device according to a first embodiment of the present invention.

【図3】本発明の第一実施例にかかる透過型光結合装置
の樹脂基板を示す図であって、(A)は平面図、(B)
は底面図
FIGS. 3A and 3B are diagrams showing a resin substrate of the transmission type optical coupling device according to the first embodiment of the present invention, wherein FIG. 3A is a plan view and FIG.
Is the bottom view

【図4】本発明の第一実施例にかかる透過型光結合装置
の樹脂基板を示す図であって、(A)封止樹脂注入後の
断面図、(B)は樹脂硬化後の断面図、(C)は樹脂基
板分割後の断面図
FIGS. 4A and 4B are views showing a resin substrate of the transmission type optical coupling device according to the first embodiment of the present invention, wherein FIG. 4A is a sectional view after sealing resin is injected, and FIG. And (C) are cross-sectional views after dividing the resin substrate.

【図5】本発明の第二実施例にかかる透過型光結合装置
の断面図
FIG. 5 is a cross-sectional view of a transmission type optical coupling device according to a second embodiment of the present invention.

【図6】本発明の第三実施例にかかる透過型光結合装置
の断面図
FIG. 6 is a sectional view of a transmission type optical coupling device according to a third embodiment of the present invention.

【図7】従来の透過型光結合装置の図であって、(A)
は平面図、(B)は(A)のC−C断面図、(C)は
(A)のD−D断面図
FIG. 7 is a diagram of a conventional transmission type optical coupling device, wherein FIG.
Is a plan view, (B) is a CC sectional view of (A), and (C) is a DD sectional view of (A).

【符号の説明】[Explanation of symbols]

11 パッケージ 12 発光素子 13 発光側凹部 14 受光素子 15 受光側凹部 16 連結凹部 17 H型凹部 18 透光性封止樹脂 19 遮光体 21 透過溝 22 発光側搭載配線部 23 ボンデイングワイヤ 24 発光側結線配線部 25 受光側搭載配線部 26 受光側結線配線部 31〜34 裏面端子 35 貫通孔 41 高反射率層 42 空気層 DESCRIPTION OF SYMBOLS 11 Package 12 Light emitting element 13 Light emitting side recess 14 Light receiving element 15 Light receiving side recess 16 Connecting recess 17 H-shaped recess 18 Translucent sealing resin 19 Shield 21 Transmission groove 22 Light emitting side mounting wiring part 23 Bonding wire 24 Light emitting side connection wiring Part 25 Light-receiving-side mounting wiring part 26 Light-receiving-side connection wiring part 31 to 34 Back terminal 35 Through hole 41 High-reflectance layer 42 Air layer

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 パッケージの上面に、発光素子を収納す
る発光側凹部と、受光素子を収納する受光側凹部と、こ
れらを結ぶ連結凹部とからなるH型の凹部が形成され、 前記発光側凹部に、前記発光素子を搭載する薄膜状の発
光側搭載配線部と、発光素子にボンデイングワイヤを介
して結線される薄膜状の発光側結線配線部とが形成さ
れ、 前記発光側搭載配線部に発光素子が搭載され、 該発光素子と発光側結線配線部とがボンデイングワイヤ
にて結線され、 前記受光側凹部に、前記受光素子を搭載する薄膜状の受
光側搭載配線部と、受光素子にボンデイングワイヤを介
して結線される薄膜状の受光側結線配線部とが形成さ
れ、 前記受光側搭載配線部に受光素子が搭載され、 該受光素子と受光側結線配線部とがボンデイングワイヤ
にて結線され、 前記各配線部は、パッケージの裏面の外部接続用裏面端
子にまで引き回して接続され、 前記各凹部が透光性封止樹脂にて樹脂封止され、 該透光性封止樹脂およびパッケージの上面に遮光体が形
成され、 前記発光素子と受光素子の間がハーフダイシングされて
被検出物体の検出空間用の透過溝が形成された透過型光
結合装置において、 前記遮光体の発光素子に面した下面は、発光素子より放
射した光に透過溝側への横方向の指向性を有せしめるよ
う、発光素子の位置が焦点となる放物面とされ、 前記遮光体の受光素子に面した下面は、透過溝からの横
方向の光が受光素子に集光されるよう、受光素子の位置
が焦点となる放物面とされたことを特徴とする透過型光
結合装置。
An H-shaped recess formed on a top surface of the package, the recess including a light-emitting side housing a light-emitting element, a light-receiving side recess housing a light-receiving element, and a connecting recess connecting the light-emitting side recess and the light-emitting side recess; A thin-film-shaped light-emitting-side mounting wiring portion on which the light-emitting element is mounted, and a thin-film-shaped light-emitting-side connection wiring portion connected to the light-emitting device via a bonding wire; A light-emitting element and a light-emitting side connection wiring section are connected by a bonding wire; a thin-film light-receiving side mounting wiring section for mounting the light-receiving element in the light-receiving side recess; and a bonding wire to the light-receiving element. A light-receiving side connection wiring portion in the form of a thin film, which is connected via the light-receiving side, a light-receiving element is mounted on the light-receiving side mounting wiring portion, and the light-receiving element and the light-receiving side connection wiring portion are connected by a bonding wire. The wiring portions are connected to the external connection back surface terminal on the back surface of the package by being drawn around, and the recesses are resin-sealed with a light-transmitting sealing resin; In a transmission type optical coupling device in which a light shield is formed on an upper surface, and a halfway dicing is performed between the light emitting element and the light receiving element to form a transmission groove for a detection space of an object to be detected, The lower surface is a paraboloid where the position of the light emitting element is a focal point so that the light emitted from the light emitting element has lateral directivity toward the transmission groove side, and the lower surface of the light shield facing the light receiving element Is a parabolic surface where the position of the light receiving element is a focal point so that light in the lateral direction from the transmission groove is focused on the light receiving element.
【請求項2】 請求項1記載の遮光体の放物面と、透光
性封止樹脂との境界部に、高反射率層が形成されたこと
を特徴とする透過型光結合装置。
2. A transmission type optical coupling device, wherein a high reflectivity layer is formed at a boundary between the parabolic surface of the light shielding body according to claim 1 and a translucent sealing resin.
【請求項3】 請求項1記載の遮光体の放物面と、透光
性封止樹脂との境界部に、空気層が形成されたことを特
徴とする透過型光結合装置。
3. A transmissive optical coupling device, wherein an air layer is formed at a boundary between the parabolic surface of the light-shielding body according to claim 1 and a translucent sealing resin.
【請求項4】 パッケージの上面に、発光素子を収納す
る発光側凹部と、受光素子を収納する受光側凹部と、こ
れらを結ぶ連結凹部とからなるH型の凹部を形成し、 前記発光側凹部に、前記発光素子を搭載する薄膜状の発
光側搭載配線部と、発光素子にボンデイングワイヤを介
して結線される薄膜状の発光側結線配線部とを形成し、 前記受光側凹部に、前記受光素子を搭載する薄膜状の受
光側搭載配線部と、受光素子にボンデイングワイヤを介
して結線される薄膜状の受光側結線配線部とを形成し、 前記各配線部を、パッケージの裏面の外部接続用裏面端
子にまで引き回して接続し、 前記発光側搭載配線部に発光素子を搭載し、 該発光素子と発光側結線配線部とをボンデイングワイヤ
にて結線し、 前記受光側搭載配線部に受光素子を搭載し、 該受光素子と受光側結線配線部とをボンデイングワイヤ
にて結線し、 前記各凹部に透光性封止樹脂を注入し、中央部分に空気抜き用の貫通孔が設けられ、かつ発光素
子より放射した光に透過溝側への横方向の指向性を有せ
しめるよう、発光素子に面した下面が発光素子の位置を
焦点とする放物面とされるとともに、透過溝からの横方
向の光が受光素子に集光されるよう、受光素子に面した
下面が受光素子の位置を焦点とする放物面とされた遮光
体を前記 透光性封止樹脂およびパッケージの上面に配
し、 該透光性封止樹脂を硬化し、遮光体の貫通孔を透過溝として取り去るように、 発光素
子と受光素子の間をハーフダイシングして被検出物体の
検出空間用の透過溝を形成することを特徴とする透過型
光結合装置の製造方法。
4. An H-shaped recess including a light-emitting side recess for housing a light-emitting element, a light-receiving side recess for housing a light-receiving element, and a connecting recess for connecting the light-emitting side recess and the light-emitting side recess on the upper surface of the package. A thin-film light-emitting side mounting wiring portion for mounting the light-emitting element, and a thin-film light-emitting side connection wiring portion connected to the light-emitting element via a bonding wire; Forming a thin-film light-receiving-side mounting wiring portion for mounting the element, and a thin-film light-receiving-side connection wiring portion connected to the light-receiving element via a bonding wire; A light emitting element is mounted on the light emitting side mounting wiring portion, and the light emitting element and the light emitting side connection wiring portion are connected by a bonding wire, and the light receiving element is mounted on the light receiving side mounting wiring portion. Equipped with Connecting the light-receiving element and the light-receiving-side connection wiring section with a bonding wire, injecting a light- transmitting sealing resin into each of the concave portions, providing a through hole for venting air at a central portion, and
The light emitted from the element has a lateral directivity to the transmission groove side.
So that the lower surface facing the light emitting element
It is a paraboloid that is the focal point, and the side from the transmission groove
Facing the light receiving element so that the light in the direction
Shielding with a paraboloidal bottom surface focusing on the position of the light receiving element
Body was placed on the upper surface of the translucent sealing resin and the package, curing the light-transmissive sealing resin, so as remove the through-hole of the light shielding member as a transmission groove, between the light emitting element and the light receiving element A method for manufacturing a transmission-type optical coupling device, comprising forming a transmission groove for a detection space of an object to be detected by half dicing.
JP22843092A 1992-08-27 1992-08-27 Transmission type optical coupling device and method of manufacturing the same Expired - Fee Related JP2986621B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22843092A JP2986621B2 (en) 1992-08-27 1992-08-27 Transmission type optical coupling device and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22843092A JP2986621B2 (en) 1992-08-27 1992-08-27 Transmission type optical coupling device and method of manufacturing the same

Publications (2)

Publication Number Publication Date
JPH0677519A JPH0677519A (en) 1994-03-18
JP2986621B2 true JP2986621B2 (en) 1999-12-06

Family

ID=16876366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22843092A Expired - Fee Related JP2986621B2 (en) 1992-08-27 1992-08-27 Transmission type optical coupling device and method of manufacturing the same

Country Status (1)

Country Link
JP (1) JP2986621B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303122A (en) * 2005-04-19 2006-11-02 Citizen Electronics Co Ltd Chip type led
JP2007059658A (en) * 2005-08-25 2007-03-08 Citizen Electronics Co Ltd Photo interrupter
JP2007059657A (en) * 2005-08-25 2007-03-08 Citizen Electronics Co Ltd Photo interrupter

Also Published As

Publication number Publication date
JPH0677519A (en) 1994-03-18

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